EP4041522A1 - Procédé et dispositif de production d'un composant en matière plastique, et composant en matière plastique - Google Patents

Procédé et dispositif de production d'un composant en matière plastique, et composant en matière plastique

Info

Publication number
EP4041522A1
EP4041522A1 EP20789909.7A EP20789909A EP4041522A1 EP 4041522 A1 EP4041522 A1 EP 4041522A1 EP 20789909 A EP20789909 A EP 20789909A EP 4041522 A1 EP4041522 A1 EP 4041522A1
Authority
EP
European Patent Office
Prior art keywords
film
station
injection molding
mold half
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20789909.7A
Other languages
German (de)
English (en)
Inventor
Wolfgang Clemens
Martin Hahn
Andreas Ullmann
Matthias Heinrich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leonhard Kurz Stiftung and Co KG
PolyIC GmbH and Co KG
Original Assignee
Leonhard Kurz Stiftung and Co KG
PolyIC GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leonhard Kurz Stiftung and Co KG, PolyIC GmbH and Co KG filed Critical Leonhard Kurz Stiftung and Co KG
Publication of EP4041522A1 publication Critical patent/EP4041522A1/fr
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B29C45/14344—Moulding in or through a hole in the article, e.g. outsert moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811—Multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/14—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles in several steps
    • B29C43/146—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles in several steps for making multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B29C45/14221—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure by tools, e.g. cutting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14688—Coating articles provided with a decoration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/12—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor of articles having inserts or reinforcements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B29C69/001—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2793/00—Shaping techniques involving a cutting or machining operation
    • B29C2793/0009—Cutting out
    • B29C2793/0018—Cutting out for making a hole
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3443—Switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3475—Displays, monitors, TV-sets, computer screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3493—Moulded interconnect devices, i.e. moulded articles provided with integrated circuit traces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • B32B2038/042—Punching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1866—Handling of layers or the laminate conforming the layers or laminate to a convex or concave profile

Definitions

  • the invention relates to a method for producing a plastic component and a device for producing a plastic component as well as a plastic component.
  • PET carriers are very desirable as production carriers, since they have, for example, slight expansion under the influence of temperature and are therefore very stable during processing, in particular during the application of layers to the PET carrier.
  • it can be used to create, for example, the finest conductor tracks and conductor tracks and other conductive structures on a PET carrier with very low tolerances. Are accordingly Touch sensors produced in this way can also be backlit very well, since the conductor tracks can be made correspondingly thin and / or narrow.
  • PET carriers for example also in connection with a decorative film, are insufficient. In this case, only small deformation depths and only very large radii of the resulting products can be achieved.
  • the object is achieved by a method for producing at least one plastic component, the following steps being carried out in the method, preferably in the following sequence, preferably cyclically in the following sequence: a) providing at least one film and at least one sensor film, the at least a film (2) and / or the at least one sensor film (3) has at least one thermoplastic material or at least one thermoplastic, b) applying the at least one sensor film to at least a first area of a surface of the at least one film, c) reshaping the at least a film comprising the at least one sensor film, wherein one or more reshaped film bodies are formed, d) punching out one or more film elements formed from at least a second region of the one or more reshaped film bodies.
  • a device for producing at least one plastic component in particular for carrying out the above method, wherein the device has at least one feed station which is designed such that the at least one feed station provides at least one film and provides at least one sensor film, the at least one film and / or the at least one sensor film having at least one thermoplastic material or at least one thermoplastic , wherein the device has at least one application station, which is designed such that the at least one application station applies the at least one sensor film to at least a first area of a surface of the at least one film, that the device has at least one forming station, which is designed such that the at least one reshaping station reshapes the at least one film comprising the at least one sensor film to form at least one reshaped film body, the device having at least one punching station which is designed in such a way that the to at least one punching station punches out at least one film element from at least one second region of the at least one reshaped film body.
  • a plastic component in particular produced according to the above method, preferably produced by the above device, wherein the plastic component comprises a stamped and back-molded film element comprising at least one formed film and at least one formed sensor film, wherein the at least one formed film and / or the at least one reshaped sensor film has at least one thermoplastic material or at least one thermoplastic, and wherein the radius of curvature of the plastic component is at least partially less than 1000 mm, in particular less than 200 mm, more preferably less than 100 mm, and / or where the Expansion of the plastic component is greater than or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, particularly preferably greater than or equal to 300%.
  • Such a method and such a device are characterized in that it is possible, for example, to be able to deform, for example, a finely structured, in particular directly translucent, touch sensor better than before, preferably three-dimensionally, during manufacture.
  • a PET film has a high tensile strength.
  • the plastic deformability or deformability of such a PET film alone is low, which causes the disadvantages of deforming described above. Due to the low plastic deformability, a PET film has a low flexibility during forming.
  • the advantages of a PET film described above namely, for example, the high strength and high temperature stability with very little expansion in the event of temperature fluctuations, cannot be used for three-dimensional products that require a higher degree of deformation during their manufacture.
  • connection of a PET film with another film which has a lower tensile strength but a higher plastic formability or flexibility than PET, surprisingly leads to the fact that the composite of the two films can be formed much better and at the same time almost the same after the forming process has the same desired mechanical properties as a PET film alone.
  • PC has proven to be particularly suitable as a material for the further film, which is connected to the PET film in the direction of the thickness.
  • PC has a significantly lower tensile strength and significantly better plastic formability than PET.
  • the film or another film that is connected to the sensor film made of PET is joined, but is not limited to the material PC.
  • Thermoplastics which have a lower tensile strength and a higher plastic deformability than PET, are generally considered as materials for the film or further film. Suitable thermoplastic materials based for the film are therefore also, for example, TPU, ABS, ABS-PC or PMMA.
  • the flexible film and the sensor film with higher tensile strength are firmly connected to one another before forming.
  • the sensor film and the film are arranged on top of one another.
  • a suitable method for the connection between the foil and the sensor foil is industrial embossing, as this enables a particularly strong connection that is also retained during the forming process. Of course, other connection methods are also suitable for connecting the film to the sensor film.
  • a flexible PC film can, for example, simultaneously serve as a bonding layer for an injection molding material. As a result, it is achieved that this enters into good flapping with the material to be injection-molded.
  • the flexible PC film in combination with a PET film serves as a deformation aid and greatly increases the deformability of the PET film. What is thereby achieved is that, for example, the resulting touch sensor can be deformed to a significantly greater extent than previously known despite the presence of the PET film in combination with the flexible PC film.
  • the plastic deformability is greatly increased compared to a PET film alone.
  • the tensile strength and temperature stability of such a composite are significantly better than with a PC film alone.
  • a curvature is understood to mean, in particular, a local deviation of a curve from a straight line.
  • the curvature of a curve is preferably understood to mean a change in direction per traversed length and / or route of a sufficiently short curve section or curve course.
  • the curvature of a straight line is preferably zero everywhere.
  • a circle with a radius r in particular has the same curvature everywhere, namely 1 / r.
  • the curvature preferably changes from curve point to curve point, in particular the curvature changes continuously from curve point to curve point, so that the curves preferably have no kinks and / or points of discontinuity.
  • the curvature of a curve at a point P thus indicates in particular how much the curve deviates from a straight line in the immediate vicinity of the point P.
  • the amount of curvature is referred to in particular as the radius of curvature and this preferably corresponds to the reciprocal value or the absolute value of the amount of a local radius vector.
  • the radius of curvature is preferably the radius of the circle which represents the best approximation in a local vicinity of the point of contact and / or tangential point P of a curve.
  • An expansion is understood to mean, in particular, a ratio between an expanded length to an unstretched length.
  • the expansion of a component and / or a film and / or a sensor film is 75%, preferably if the unstretched length of the component and / or the film and / or the sensor film is 40m and the expanded length of the component and / or the film and / or the sensor film is 70m.
  • the at least one film and / or the at least one sensor film in step a) preferably has polycarbonate (PC) as at least one thermoplastic material or as at least one thermoplastic.
  • PC polycarbonate
  • the at least one sensor film and / or the at least one film in step a) further preferably has polyethylene terephthalate (PET) as at least one thermoplastic material or as at least one thermoplastic.
  • PET polyethylene terephthalate
  • the at least one film in step a) it is possible for the at least one film in step a) to have a thickness of 50 ⁇ m to 3000 ⁇ m, in particular 300 ⁇ m to 2000 ⁇ m.
  • the at least one film has, in particular, a thickness of 375 ⁇ m.
  • the at least one film in step a) prefferably has a tensile strength between 20 MPa and 100 MPa, in particular between 20 MPa and 80 MPa.
  • tensile strength is preferably understood to mean a characteristic strength value from a possible number of characteristic strength values of a material, in particular the maximum mechanical tensile stress that the material can withstand.
  • the tensile strength is preferably calculated from the results of a tensile test, preferably in accordance with the ISO 527 standard, in particular as the maximum tensile force achieved based on the original cross section of the standardized tensile specimen.
  • so-called ductile materials such as steel expand even further after the tensile strength has been exceeded, but the cross-section is particularly reduced.
  • Brittle materials such as cast iron, on the other hand, break especially when the tensile strength is exceeded.
  • the tensile strength is preferably expressed in the dimension “force per Area ”, in particular where frequently used units of measurement are N / mm 2 or MPa (Megapascal).
  • force per Area in particular where frequently used units of measurement are N / mm 2 or MPa (Megapascal).
  • MPa Megapascal
  • the at least one film is preferably flexible in step a) at least in some areas or over the entire area.
  • the at least one film is provided in step a) as a film composite which is flexible at least in some areas or over the entire area and / or which comprises one or more films, in particular comprises one or more films which are flexible at least in regions or over the entire area.
  • Punching is preferably understood to mean trimming or cutting or trimming the outer edges or outer dimensions of the film body, in particular by means of methods selected from the group of mechanical cutting, laser processing, water jet processing, milling, mechanical punching.
  • the film can have one or more decorative layers and / or one or more functional layers.
  • decorative and / or functional layers can be applied over the entire area and / or partially to one or both surfaces of the film using one or more methods individually or in combination selected from the group of gravure printing, flexographic printing, screen printing, inkjet printing, pad printing, hot stamping, Cold stamping, vapor deposition.
  • Such decorative and / or functional layers can in particular be selected individually or in combination from the group of protective layers, colored lacquer layers, metal layers, reflective layers, replication lacquer layers, transparent layers, carrier layers and / or layers generating an optically variable effect.
  • the one or more decorative and / or functional layers preferably have, for example, a printed layer, in particular made of an opaque and / or colored ink, which forms a frame around the functional area.
  • the one or more decorative and / or functional layers can cover the sensor film and in particular the functional area over the whole area or partially and / or be applied in a grid.
  • the one or more decorative and / or functional layers can represent a uniform surface and / or an endless pattern and / or a single image motif.
  • the one or more decorative and / or functional layers can be completely or partially opaque and / or semitransparent and / or transparent, in particular colored transparently.
  • one or more decorative layers are applied to both sides of the film, these layers can together form an overall decoration.
  • the film can serve as an optical spacer for optical depth effects.
  • two overlapping one or more decorative layers can thus complement one another to form an overall design and / or produce moiré effects and / or one decorative layer serves as a background for the other decorative layer in each case.
  • the two decorative layers can be applied in register with one another.
  • the at least one sensor film in step a) can have a thickness of 25 ⁇ m to 500 ⁇ m, in particular 50 ⁇ m to 125 ⁇ m.
  • the at least one sensor film comprises a carrier film, preferably having a thickness of 50 ⁇ m to 75 ⁇ m, a layer package, preferably comprising several layers, and a cover film, in particular comprising PET and / or having a layer thickness of 12 ⁇ m to 20 ⁇ m.
  • the at least one sensor film in step a) preferably has a tensile strength between 150 MPa and 500 MPa, in particular between 200 MPa and 500 MPa.
  • the tensile strength of the at least one film in step a) and / or b) is at most the tensile strength of the at least one sensor film in step a) and / or b) multiplied by a factor 2/3.
  • the thickness of the at least one film in step a) and / or b) is preferably at least the thickness of the at least one sensor film in step a) and / or b) multiplied by a factor 1/2.
  • the thickness of the film is at least half the thickness of the sensor film.
  • the thickness of the film can, however, also be thicker, for example the same size as the thickness of the sensor film. It is particularly advantageous if the thickness of the flexible film is greater than the thickness of the sensor film. In this case the sensor foil is thinner than the foil. Such an embodiment can be seen, for example, in FIGS. 2, 3, 4 and 5, which are described in detail below.
  • the thickness of the film can be selected, for example, in a range between 300 ⁇ m and 2000 ⁇ m, and the thickness of the sensor film can advantageously be selected in a range between 50 ⁇ m and 125 ⁇ m.
  • the film can be made, for example, a factor of 2.3, 4 or 5 thicker than the sensor film.
  • another factor than those mentioned above can also be selected between the thicknesses of the film and the sensor film.
  • a composite between a thicker film, for example made of PC, and a thinner sensor film, in particular made of PET, enables a significant increase in the flexibility of the composite or the plastic deformability of the composite to be achieved.
  • the at least one film in step a) is at least partially or fully transparent, translucent or opaque and / or that the at least one sensor film in step b) is at least partially transparent, translucent or opaque.
  • “Opaque” is preferably understood to mean a transparency, in particular in the wavelength range visible to humans, of less than 25%, in particular of less than 15%, preferably of less than 5%.
  • Translucent is preferably understood to mean a transparency, in particular in the wavelength range visible to humans, of 25% to 75%, in particular from 15% to 85%, preferably from 5% to 95%.
  • Transparent is preferably understood to mean a transparency, in particular in the wavelength range visible to humans, of at least 75%, in particular more than 85%, preferably more than 95%.
  • the at least one sensor film is applied to the at least one film in step b) by means of hot lamination and / or by means of hot embossing and / or cold lamination and / or gluing, in particular cold gluing.
  • step b) comprises one or more steps of the following further steps, in particular for producing the at least one sensor film and / or for applying the at least one sensor film to the at least one film, preferably with the following further steps being carried out in the following sequence, further preferably, the following further steps being carried out in a cyclical sequence: b1) providing at least one carrier substrate; b2) applying at least one electrically conductive layer to the
  • the at least one electrically conductive layer forming an electrical functional structure in at least one functional area, the at least one electrically conductive layer forming at least one contacting structure for contacting the electrical functional structure in at least one contacting area; b3) Applying at least one bonding layer for applying the at least one sensor film to the at least one film in such a way that the bonding layer, when viewed perpendicular to a plane spanned by the at least one carrier substrate, does not cover the at least one contact area at least in some areas, or the at least one bonding layer when viewed is applied over the full area perpendicular to a plane spanned by the at least one carrier substrate.
  • the at least one electrically conductive layer is arranged between the carrier substrate and the at least one adhesion promoting layer. It is thus possible for the adhesion promoting layer to be arranged on the side of the at least one electrically conductive layer facing away from the carrier substrate. It is thus possible for the adhesion promoting layer to be applied in step b3) in such a way that the at least one electrically conductive layer is arranged between the carrier substrate and the adhesion promoting layer. Since the bonding layer is arranged on the surface of the sensor film, the sensor film can be applied directly to a film, further ensuring that the electrical functional structure can be reliably contacted.
  • the adhesion promoting layer prefferably be arranged on the side of the carrier substrate facing away from the at least one electrically conductive layer. It is thus possible that in step b3) the adhesion promoting layer is arranged on the side of the carrier substrate facing away from the at least one electrically conductive layer.
  • the adhesion promoting layer is preferably applied over the full area when viewed perpendicular to a plane spanned by the carrier substrate.
  • the adhesion-promoting layer is thus advantageously arranged in the functional area and the contact-making area. It is also possible for the adhesion promoting layer to be applied over the entire area to the carrier substrate in such a way that no further layers are arranged between the carrier substrate and the adhesion promoting layer.
  • the adhesion promoting layer covers the functional area at least in certain areas. It is thus possible for the adhesion promoting layer to be applied in step b3) in such a way that the adhesion promoting layer covers the functional area at least in certain areas. This can ensure that the functional area adheres to the film.
  • Adhesion is understood here to mean adhesion of the sensor film to the film in such a way that a predefined minimum adhesive force is achieved, which enables the sensor film to adhere reliably to the film.
  • the adhesive force is at least so strong that the sensor film cannot be separated from the intermediate or end product having the applied sensor film and the film when it is used as intended.
  • the adhesive force is not necessarily so strong that the sensor film cannot be separated from the film with great expenditure of force, such as when it is torn off, for example. It is thus possible for the adhesive force to be such that the sensor film can be mechanically separated from the film without damaging the film or the sensor film.
  • the adhesive force is preferably specified as a tensile force in Newtons per cm, in particular where the unit cm indicates the width of the film and / or sensor film.
  • the adhesive force is preferably more than 3 N / cm, in particular more than 10 N / cm, preferably more than 30 N / cm.
  • tearing off the at least one sensor film shows that the adhesive force is in particular greater than the strength of the at least one film.
  • the adhesion promoting layer advantageously covers the functional area by at least 30%, preferably at least 50%, more preferably at least 70%. It is also possible for the adhesion promoting layer not to cover the entire area of the at least one contacting area. It is thus possible for the adhesion-promoting layer not to cover the entire at least one contacting area when viewed perpendicular to the plane spanned by the carrier substrate. This enables secure and robust contacting of an electrical functional structure which, for example, provides the touch panel functionality.
  • the adhesion promoting layer when viewed perpendicular to a plane spanned by the carrier substrate, does not cover an area adjoining the at least one contacting area.
  • the area adjoining the at least one contacting area has a width of at least 0.2 mm, preferably of at least 0.5 mm, more preferably of at least 1 mm, even more preferably of at least 2 mm.
  • width is in particular the distance between the interface formed by the at least one contacting area and the one area adjoining the at least one contacting area, and the interface formed by the adhesion promoting layer and the one area adjoining the at least one contacting area , Roger that.
  • a contact area formed in this way is also referred to as a tail. It is thus possible that the area adjoining the at least one contacting area is movable such that the at least one contacting area can be raised.
  • the entire non-adhesive length of the contacting area or tail is usually at least 10 mm long, in particular several cm long.
  • the adhesion promoting layer is a layer comprising polymers and / or copolymers, in particular polymethyl (meth) acrylate (PMMA), polyester, polyurethane (PU) or polyvinyl chloride (PVC).
  • PMMA polymethyl (meth) acrylate
  • PU polyurethane
  • PVC polyvinyl chloride
  • the bonding layer comprises natural resins, preferably rosin, phenolic resins, isocyanate (NCO) -crosslinked binders, for example melamine-formaldehyde condensation resins (MF), melamine-phenol-formaldehyde resins (MPF), melamine-polyester, melamine-urea-formaldehyde - Resins (UMF), poly (organo) siloxanes or radiation-curing binders.
  • natural resins preferably rosin, phenolic resins, isocyanate (NCO) -crosslinked binders, for example melamine-formaldehyde condensation resins (MF), melamine-phenol-formaldehyde resins (MPF), melamine-polyester, melamine-urea-formaldehyde - Resins (UMF), poly (organo) siloxanes or radiation-curing binders.
  • MF melamine-formaldehyde condensation resin
  • binders are understood to mean substances by means of which solids, in particular with a fine degree of division, can be connected to one another or to a base. It is thus possible for the binders to be added to the solids to be bound in liquid form.
  • the adhesion promoting layer advantageously has a layer thickness between 0.1 ⁇ m and 50 ⁇ m, preferably between 0.25 ⁇ m and 25 ⁇ m, more preferably between 0.5 ⁇ m and 7 ⁇ m.
  • the adhesion promoting layer comprises one or more layers. It is thus possible for the adhesion promoting layer to comprise two layers, in particular a first adhesion promoting layer and a second adhesion promoting layer. This makes it possible to optimize the adhesion of the sensor film to the film.
  • the second adhesion promoting layer which is in particular between the first adhesion promoting layer and the film is arranged, for example, matched to the material of the film, the first adhesion promoting layer being matched to the material of the layer of the sensor film adjoining the first adhesion promoting layer, for example a protective lacquer layer.
  • the adhesion of the sensor film to the film can thus be optimized by a suitable choice of the first and the second adhesion promoting layer.
  • the bonding layer consists of a material that is highly transparent after the sensor film has been applied to the film, in particular that the bonding layer consists of a material that allows light to be transmitted in the wavelength range between 380 nm after the sensor film has been applied to the film to 780 nm of more than 85%, preferably more than 90%.
  • the bonding layer consists of a material that allows light to be transmitted in the wavelength range between 380 nm after the sensor film has been applied to the film to 780 nm of more than 85%, preferably more than 90%.
  • Optical information from the film can also be clearly identified through the sensor film applied to the film. In this way it can be achieved, for example, that the resolution and color rendering of a display or display to which the sensor film is applied are not changed for a human observer.
  • the adhesion-promoting layer can in particular have a cloudy visual appearance and thus not (yet) be highly transparent.
  • the cloudy appearance can arise, for example, from differences in the refractive index of the adhesion promoting layer and the surrounding air and / or surface roughness of the adhesion promoting layer, in particular on the side of the adhesion promoting layer facing away from the at least one electrically conductive layer.
  • the surface roughness can in particular scatter incident light and thereby create a cloudy impression.
  • Such surface roughness can arise in particular when applying the adhesion promoting layer due to the application methods used.
  • the Surface roughness can be formed by a printing pattern of a gravure anilox roller or a screen printing tool.
  • the bonding layer is highly transparent, since the bonding layer is then melted, in particular by means of hot lamination, and / or leveled by means of pressure in such a way that the surface roughness of the bonding layer is no longer disruptive.
  • the refractive index of the material of the film and the refractive index of the material of the adhesion promoter layer are in particular less than 0.1 different from one another, the optical interface between the adhesion promoter layer and the film is no longer visible.
  • transparent is understood to mean the property of matter to allow light from the wavelength range visible to the human eye, in particular from the wavelength range between 380 nm to 780 nm, to pass through.
  • the term “highly transparent” therefore describes the property of matter to hardly attenuate light from the wavelength range visible to the human eye, in particular from the wavelength range between 380 nm to 780 nm, and to allow it to pass through essentially unhindered.
  • a highly transparent layer therefore has essentially no recognizable absorption of light for a human observer, so that the light intensity is hardly noticeably reduced when the light passes through the layer for a human observer.
  • cloudy is understood to mean the property of matter that light from the wavelength range visible to the human eye, in particular from the wavelength range between 380 nm to 780 nm, cannot pass through the matter unhindered.
  • a cloudy layer for example, uses scattering properties to prevent light from passing through it unhindered. Light can also be absorbed and / or reflected in a cloudy layer.
  • a cloudy layer can produce a milky optical impression for a human observer, for example, so that further layers arranged under a cloudy layer are perceived, for example, as smeared and / or veiled.
  • the adhesion-promoting layer consists of a material that is optically clear after the sensor film has been applied to the film, in particular that the adhesion-promoting layer consists of a material that emits light in the wavelength range between 380 nm and 780 after the sensor film has been applied to the film nm by less than 8%, preferably by less than 4%, by scattering.
  • the adhesion-promoting layer can in particular have light-scattering properties due to the surface roughness of the adhesion-promoting layer and thus a cloudy visual appearance.
  • the bonding layer becomes clear in particular when the sensor film is applied to the film and the bonding layer is melted and / or leveled, for example by means of heat and / or pressure supplied by hot lamination, so that the surface roughness of the bonding layer is no longer disruptive. That is, through physical and / or chemical changes in the adhesion promoting layer during or after the application of the sensor film to the film, the adhesion promoting layer becomes highly transparent and / or optically clear. It is possible for the adhesion promoting layer to be formed from a hot melt adhesive, a cold adhesive or a radiation-curable adhesive, in particular an adhesive curable by means of electromagnetic radiation and / or electron beams.
  • the adhesion promoting layer prefferably be designed in the form of a pattern, in particular in the form of a rectangle, rounded rectangle or motif. It is thus possible for the pattern of the adhesive layer, which is configured in pattern, to be adapted to the structures of the film.
  • the adhesion promoting layer prefferably be applied according to a grid, in particular a one-dimensional or two-dimensional grid. It is thus possible for the adhesion-promoting layer to be applied in accordance with a dot or line grid.
  • the grid formed by the adhesion promoting layer is smoothed so that the transparency of the sensor film is not negatively influenced by the adhesion promoting layer applied in accordance with the grid.
  • the sensor film advantageously has a transmission of light in the wavelength range between 380 nm to 780 nm of more than 75%, preferably more than 80%, more preferably more than 85%, at least in the one functional area of the at least one electrically conductive layer. , even more preferably more than 90%.
  • the transmission describes the permeability of the sensor film for light from the wavelength range between 380 nm to 780 nm.
  • Light incident on the sensor film is partially reflected at the air / sensor film interface and at the interfaces between the layers of the sensor film. Furthermore, the light incident on the sensor film is partially absorbed when passing through the sensor film. The remaining portion of the light is transmitted through the sensor film and exits again on the opposite side of the sensor film.
  • To determine the Transmittance t is the quotient of the light intensity behind the sensor film I and the light intensity in front of the sensor film.
  • the transmittance t is a measure of the “let through” intensity and takes values between 0 and 1.
  • the transmission is typically dependent on the wavelength of the incident light. Therefore the wavelength range is given next to the transmission values.
  • the adhesion-promoting layer can have a cloudy visual appearance, for example due to surface roughness.
  • this surface roughness is leveled out so that the adhesion promoting layer is highly transparent and / or clear after application to the film, so that the cloudy visual impression of the adhesion promoting layer disappears and the sensor film as a whole has at least one functional area of the at least one electrically conductive layer Transmission of light in the wavelength range between 380 nm to 780 nm of more than 75%, preferably more than 80%, more preferably more than 85%, even more preferably more than 90%.
  • the sensor film comprises a release layer, the release layer at least partially covering the at least one contacting area when viewed perpendicular to a plane spanned by the carrier substrate.
  • the method further comprise the following steps: b6) applying a release layer in such a way that the release layer covers the at least one contact area at least in regions when viewed perpendicular to a plane spanned by the carrier substrate. It is thus possible for the release layer to prevent the at least one contact area from sticking.
  • the carrier substrate and / or the at least one electrically conductive layer and / or the release layer and / or the protective lacquer layer is / are transparent.
  • release layer it is also possible for the release layer to completely cover the at least one contact area.
  • release layer it is also possible for the release layer to cover the area adjoining the at least one contacting area.
  • the release layer can further ensure that the sensor film does not adhere to the film in areas that have the release layer.
  • the release layer can thus prevent the at least one contact area from adhering to the foil, in particular the at least one contact area from adhering to the foil as a result of the careful lamination of the sensor foil to the target substart.
  • the release layer preferably consists of waxes, polyethylene (PE), polypropylene (PP), cellulose derivatives or poly (organo) siloxanes.
  • the aforementioned waxes can be natural waxes, synthetic waxes or combinations thereof.
  • the aforementioned waxes are, for example, carnauba waxes.
  • the aforementioned cellulose derivatives are, for example, cellulose acetate (CA), cellulose nitrate (CN), cellulose acetate butyrate (CAB) or mixtures thereof.
  • the aforementioned poly (organo) siloxanes are, for example, silicone binders, polysiloxane binders or mixtures thereof.
  • the release layer comprises natural resins, preferably rosin, phenolic resins, halogen-containing flomopolymers, for example polyvinyl chloride (PVC), polyvinyl fluoride (PVF), polytetrafluoroethane (PTFE), polyvinylidene fluoride (PVDF) or polyvinylidene chloride (PVDC), polyester, for example polybutylene terephthalate (PBT), polycyclohexylene dimethylene terephthalate (PCT), polyethylene terephthalate (PET), polytrimethylene terephthalate (PTT), polyethylene naphthalate (PEN),
  • PVC polyvinyl chloride
  • PVF polyvinyl fluoride
  • PTFE polytetrafluoroethane
  • PVDF polyvinylidene fluoride
  • PVDC polyvinylidene chloride
  • polyester for example polybutylene terephthalate (PBT), polycyclohexylene dimethylene
  • PC Polycarbonate
  • PEC polyester carbonate
  • PAC polyacrylates
  • UP unsaturated polyester resin
  • polymeric carboxylic acid esters for example polymethyl (meth) acrylate (PMMA), isocyanate (NCO) crosslinked binders, for example melamine-formaldehyde condensation resins (MF ), Melamine-phenol-formaldehyde resin (MPF), melamine-polyester, melamine-urea-formaldehyde resin (UMF), polyolefins that are not PP or PE, for example polymethylpentene (PMP), polyisobutylene (PIB) or polybutylene ( PB), copolymers consisting of PVC, PMMA, PU, poly (organo) siloxanes and polyolefins that are not PP or PE.
  • PMP polymethylpentene
  • PIB polyisobutylene
  • PB polybutylene
  • the release layer also has radiation-curing binders.
  • ZIF Zero Insertion Force
  • the release layer is locally penetrated during electrical contacting, in particular by the adapter elements and / or connecting elements and / or contact elements, so that the release layer no longer has any local effect that hinders electrical contacting, in particular electrically insulating. It is advantageous here if the electrically insulating release layer is destroyed by means of mechanical-physical forces during contacting, in particular by the adapter elements and / or connecting elements and / or contact elements, in such a way that electrical conductivity, in particular between the at least one contacting area and the adapter elements and / or connecting elements and / or contact elements. This is achieved, for example, by contact springs or by crimping.
  • a ZIF contact is also mechanically “cutting”, so that this also enables electrical contact to be made to the at least one contact area covered by the release layer.
  • metal pigments in the adhesive layer can penetrate the release layer when the sensor film is pressed / stamped, so that electrical contacting is also possible using ACF bonding.
  • electrical contact does not necessarily have to be made by a galvanic connection between the at least one contact area and the adapter elements and / or connection elements and / or contact elements and / or the contact layer, in particular the film. It is also possible that an electrical contact is achieved via a capacitive coupling of two contact areas, such as between the at least one contacting area and a target contacting area, in particular a contact layer of the film, preferably with at least one insulating layer arranged in between, or that in particular an electrical contact is achieved via an inductive coupling of two contact areas, such as between the at least one contacting area and a target contacting area, in particular a contact layer of the film.
  • the sensor film preferably comprises a protective lacquer layer.
  • the protective lacquer layer When viewed perpendicular to a plane spanned by the carrier substrate, the protective lacquer layer advantageously covers the at least one electrically conductive layer at least in regions. It is also advantageous that the following step is carried out between step b2) and step b3): Application of a protective lacquer layer, in particular such that the protective lacquer layer when viewed perpendicular to a plane spanned by the carrier substrate which at least partially covers at least one electrically conductive layer. It is thus possible for the protective lacquer layer to protect the at least one electrically conductive layer from mechanical, physical and / or chemical environmental influences.
  • the protective lacquer layer completely covers the at least one electrically conductive layer when viewed perpendicular to a plane spanned by the carrier substrate in the functional area.
  • the sensor film prefferably includes one or more protective lacquer layers.
  • protective lacquer layers which represent the outermost layer of the sensor film or an intermediate or end product, in particular an electrical functional element to which the sensor film has been applied, protect the other layers of the sensor film from mechanical, physical and / or chemical environmental influences or the influences of further process steps .
  • the protective lacquer layer has a layer thickness between 0.1 ⁇ m and 50 ⁇ m, preferably between 0.25 ⁇ m and 25 ⁇ m, more preferably between 0.5 ⁇ m and 15 ⁇ m.
  • the protective lacquer layer is preferably a transparent protective lacquer layer, in particular made of PMMA, polyester, PU or PVC.
  • the protective lacquer layer has natural resins, preferably rosin, phenolic resins, isocyanate (NCO) -crosslinked binders, for example MF, MPF, melamine polyester, UMF, polyolefins that are not PP or PE, for example PMP, PIB or PB. It is also advantageous that the protective lacquer layer is arranged between the at least one electrically conductive layer and the adhesion promoting layer.
  • natural resins preferably rosin, phenolic resins, isocyanate (NCO) -crosslinked binders, for example MF, MPF, melamine polyester, UMF, polyolefins that are not PP or PE, for example PMP, PIB or PB.
  • the protective lacquer layer it is also possible for the protective lacquer layer to be applied in such a way that the protective lacquer layer is arranged between the at least one electrically conductive layer and the adhesion-promoting layer. It is thus possible for the protective lacquer layer to be arranged on the side of the at least one electrically conductive layer facing away from the carrier substrate.
  • the sensor film prefferably has a structure in the following order:
  • the protective lacquer layer is arranged between the at least one electrically conductive layer and the carrier substrate.
  • the electrically conductive layer is embedded and protected between the protective lacquer layer and the adhesion promoting layer.
  • the protective lacquer layer and the adhesion-promoting layer preferably consist of lacquers with similar physical properties, in particular with regard to mechanical deformability and extensibility. This makes it possible for the embedded electrically conductive layer not to be damaged, for example torn, in the event of severe deformation of the sensor film, whereby its electrical functionality is retained.
  • the previously described embedding of the electrically conductive layer also prevents delamination of these layers.
  • the sensor film prefferably has a primer lacquer layer, in particular a primer lacquer layer that can be vaporized for metallization, includes.
  • the primer lacquer layer is advantageously arranged between the protective lacquer layer and the at least one electrically conductive layer.
  • the primer lacquer layer is advantageously a layer of polymers and / or copolymers, in particular comprising polymethyl (meth) acrylate (PMMA), polyester, polyurethane (PU) or polyvinyl chloride (PVC).
  • PMMA polymethyl (meth) acrylate
  • PU polyurethane
  • PVC polyvinyl chloride
  • the primer lacquer layer comprises natural resins, preferably rosin, phenolic resins, isocyanate (NCO) -crosslinked binders, for example melamine-formaldehyde condensation resins (MF), melamine-phenol-formaldehyde resins (MPF), melamine-polyester, melamine-flarnea-formaldehyde -Flarze (UMF), poly (organo) siloxanes or radiation-curing binders.
  • natural resins preferably rosin, phenolic resins, isocyanate (NCO) -crosslinked binders, for example melamine-formaldehyde condensation resins (MF), melamine-phenol-formaldehyde resins (MPF), melamine-polyester, melamine-flarnea-formaldehyde -Flarze (UMF), poly (organo) siloxanes or radiation-curing binders.
  • MF
  • the primer lacquer layer preferably has a layer thickness between 0.1 ⁇ m and 5 ⁇ m, preferably between 0.1 ⁇ m and 2 ⁇ m.
  • the sensor film prefferably has a structure in the following order:
  • the sensor film is a transfer film.
  • a transfer film advantageously has a carrier layer, in particular the carrier substrate, and a transfer layer that can be detached from the carrier layer, in particular the carrier substrate.
  • a separating layer which enables the transfer layer to be detached from the carrier layer, in particular the carrier substrate, is advantageously arranged between the carrier layer, in particular the carrier substrate, and the transfer layer.
  • the carrier layer, in particular the carrier substrate is not detached after application to the film, so that the carrier layer, in particular the carrier substrate, also remains on the film.
  • the separating layer is a single or multilayer separating layer.
  • the separating layer is preferably arranged between the carrier substrate and the protective lacquer layer. In this way it can be achieved, for example, that the carrier substrate can be detached after the sensor film has been applied to the film. This makes it possible to achieve an even better deformability and / or expandability of the applied sensor film, since the comparatively thick and less deformable and / or expandable carrier substrate has been removed.
  • the protective lacquer layer takes over the protective function of the sensor film.
  • the separating layer is preferably a wax layer and / or a polymer layer made of, for example, acrylates and / or melamine-formaldehyde resin-crosslinked lacquers.
  • the separating layer preferably has a layer thickness of less than 1 ⁇ m.
  • the adhesive force between the carrier substrate and the protective lacquer layer is 20% to 80%, preferably 30% to 70%, less than the adhesive force between the protective lacquer layer and due to the separating layer arranged between the carrier substrate and the protective lacquer layer the primer lacquer layer and / or the at least one electrically conductive layer and / or the adhesion promoting layer.
  • the adhesive force between the carrier substrate and the protective lacquer layer is 20% to 80%, preferably 30% to 70%, less than the adhesive force between the layers of the transfer layer due to the separating layer arranged between the carrier substrate and the protective lacquer layer, in particular selected from the group consisting of protective lacquer layer, primer lacquer layer, at least one electrically conductive layer, one or more decorative layers, adhesion promoting layer, intermediate adhesion layer, dielectric layer, darkening layer and contact reinforcement layer.
  • the adhesive forces were determined using the Zwick Z005 tensile test machine from Zwick GmbH & Co. KG, Ulm, Germany. For this purpose, the transfer film was glued flat onto the lower bracket. The layer to be peeled off was then peeled off at a right angle by the tensile test. The detachment forces were determined using the load cell.
  • the sensor film to have a structure in the following order:
  • the bonding layer does not cover the at least one contacting area, contact can be made with the electrical functional structure after the sensor film has been applied to the film, so that, for example, an electrical connection can be established using the above-mentioned contacting types.
  • the optional separating layer also makes it possible for the carrier substrate to at least can be partially detached, which further improves the possibility of subsequent contacting, since the sensor film in this embodiment variant does not stick to the edge of the carrier substrate.
  • the film has a contact layer, in particular for making electrical contact with the at least one contact area of the sensor film.
  • the contact layer is preferably applied directly to the film.
  • the contact layer prefferably has at least one connecting element.
  • the contact layer may have at least one adapter element and / or contact element.
  • the film itself preferably already has at least one connecting element and / or adapter element and / or contact element, in particular for making electrical contact with the at least one contacting area of the sensor film.
  • the contact layer is advantageously arranged in at least one target contacting area of the film.
  • the at least one target contact area of the film preferably forms the counterpart to the at least one contact area of the sensor film. It is therefore advantageous that the at least one target contact area of the film and the at least one contact area of the sensor film, preferably after application of the sensor film to the film, are congruent, in particular that the at least one The target contact area of the film and the at least one contact area of the sensor film after application of the sensor film overlap at least in some areas.
  • the film comprises at least one third electrically conductive layer.
  • the at least one third electrically conductive layer preferably has a multiplicity of conductor tracks. It is thus possible for the at least one third electrically conductive layer to have electrically conductive structures, in particular conductor tracks, which are preferably arranged in accordance with a grid. This grid can be regular or irregular.
  • the grid can in particular be constructed from grid elements, such as lines and / or surface elements.
  • the at least one third electrically conductive layer prefferably has further electrical components.
  • Further electrical components can in particular be passive electrical components, preferably resistors or capacitors, and / or active components, preferably transistors, diodes, light-emitting diodes, integrated circuits, processors and / or connection components, more preferably conductor tracks, cables, plugs, sockets.
  • the at least one third electrically conductive layer of the film is advantageously electrically connected to the at least one contact layer.
  • the film it is possible for the film to be equipped with conductor tracks and / or further electrical components. These conductor tracks can then advantageously be electrically connected to further electrical components in a known manner by means of plug contacts or other known contacting methods. This can preferably be done by means of laser direct structuring (LDS) or also by means of printed contacts, in particular by means of Screen printing of printed contacts, or by means of a contact layer, which is applied, for example, by means of lamination and / or hot stamping or cold stamping.
  • LDS laser direct structuring
  • the film it is possible for the film to be a type of printed circuit board.
  • the at least one third electrically conductive layer of the foil is electrically connected to the functional area of the electrically conductive layer of the sensor foil via the contact area of the sensor foil by means of the contact layer.
  • the contact layer on the film thus forms the counter-contact to the contacting area of the sensor film.
  • the contact layer in particular the at least one connecting element and / or adapter element and / or contact element, and / or the at least one third electrically conductive layer by means of laser direct structuring (LDS) and / or by means of printing, in particular by means of screen printing and / or inkjet printing, generated and / or applied.
  • LDS laser direct structuring
  • the contact layer in particular the at least one connecting element and / or adapter element and / or contact element, is applied by means of lamination and / or hot stamping or cold stamping.
  • the contact layer in particular the at least one connecting element and / or adapter element and / or contact element, is formed on the film from an electrically conductive paste, in particular carbon paste, which contains silver (Ag), gold (Au), aluminum ( AI), copper (Cu), chromium (Cr) and / or other conductive metals.
  • electrically conductive paste, in particular carbon paste comprises binders, in particular comprising rosins and / or phenolic resins, polymers and copolymers.
  • Binders of the electrically conductive paste, especially carbon paste are natural resins, preferably rosin, phenolic resins, polymers and copolymers consisting of PVC, PMMA, PU, polyester, isocyanate (NCO) crosslinked binders, for example MF, MPF, melamine-polyester, UMF. Binders of the electrically conductive paste comprising poly (organo) siloxanes and their copolymers and / or radiation-curing binders are less preferred.
  • the sensor film in the at least one contact area can be completely or partially printed in a pattern, for example in a grid, with flaft varnish. It is thus possible for the sensor film to have flake lacquer in the at least one contacting area.
  • the sensor film does not have the flake lacquer in the at least one contacting area or the flaft lacquer is completely left out locally in the area of the contacts.
  • an electrical (press) contact (by means of swift and pressure) is thus created between the sensor film and the film, in particular in the at least one contacting area and / or target contacting area. It is possible here for the electrical (press) contact to have a permanent effect due to the gluing, in particular due to the flaft paint.
  • an ACF bonding tape to be introduced between the at least one contact area of the sensor film and the at least one target contact area of the film.
  • the electrical connection in the contacting area can be further improved. It is advantageous here if the application process (streak and pressure) largely corresponds to the usual ACF bonding process.
  • the contact layer of the film is designed in such a way that two or more sensor films can be applied to the film. So it is possible that the contact layer of the film connecting elements and / or Has adapter elements and / or contact elements for making electrical contact with at least two sensor foils.
  • the film it is thus also possible for the film to have the contact layer for contacting a first sensor film in a first target contact area and to have the contact layer for contacting a second sensor film in a second target contact area.
  • the film to which at least two sensor films are to be applied already has a contact layer which is designed such that a two-layer sensor consisting of a sensor film for the x-position and a sensor film for the y-position can be applied .
  • the film to which the at least two sensor films are to be applied to already have electrical contacts and contact leads for a two-layer sensor consisting of an x-position and a y-position, as described above .
  • the x and y positions are preferably each formed from a sensor film.
  • the first sensor layer for example the x-layer, is preferably applied to the foil by means of the sensor foil and the electrical contact is established.
  • the first sensor layer is advantageously applied to the foil for electrical contacting, in particular the first sensor layer, in register with the contact layer, in particular the at least one connecting element and / or adapter element and / or contact element.
  • a first sensor film is then applied to the film in such a way that the at least one contact area of the first sensor film overlaps at least in some areas with the target contact area of the contact layer for contacting the first sensor film.
  • the second sensor layer for example the y-layer, is then preferably applied in a separate step by means of the at least one sensor film in register with the first sensor layer or in register with the contact layer, in particular the at least one connecting element and / or adapter element and / or Contact element, the film for electrical contacting, in particular the second sensor layer, on the film.
  • adhesive bonding for example by means of OCA, between the sensor layers can be dispensed with.
  • the register accuracy that is to say the positional accuracy of the second sensor layer relative to the first sensor layer, is preferably ⁇ 350 pm, more preferably ⁇ 150 pm, in the x and y directions in order to achieve the desired functionality of the sensor.
  • a second sensor film is applied to the film in such a way that the at least one contact area of the second sensor film overlaps at least in some areas with the target contact area of the contact layer for contacting the second sensor film.
  • the at least one contact structure for contacting the electrical functional structure is preferably an electrical connection, in particular a plug.
  • the at least one electrically conductive layer advantageously has a contact reinforcement layer.
  • the at least one electrically conductive layer has the contact reinforcement layer in the at least one contact area at least in some areas, the contact reinforcement layer protecting the at least one contact area from mechanical, physical and / or chemical environmental influences. It is thus possible for the following step to be carried out between step b2) and step b3):
  • a contact reinforcement layer in such a way that the at least one electrically conductive layer has a contact reinforcement layer, in particular that the at least one electrically conductive layer has the contact reinforcement layer in the at least one contact area at least in some areas.
  • the contact reinforcement layer improves the resistance / durability of the at least one contact area, since the contact reinforcement layer protects the contact area from corrosion or scratching, for example. Furthermore, the mechanical stability of the contacting area, in particular the flexural stability and / or kink stability, can also be improved.
  • the contact reinforcement layer prefferably covers the at least one contact area over the entire area.
  • the at least one contacting area may have one or more separate contacting areas.
  • separated is understood to mean that the contacting areas are spaced apart from one another, in particular that the contacting areas are at a distance of at least 0.1 mm, preferably at least 0.2 mm, more preferably at least 0.5 mm, from one another,
  • the contact reinforcement layer has a layer thickness between 0.1 ⁇ m and 100 ⁇ m, preferably between 0.25 ⁇ m and 25 ⁇ m, more preferably between 0.5 ⁇ m and 10 ⁇ m. It is possible for the contact reinforcement layer to be formed from an electrically conductive paste, in particular carbon paste, which contains silver (Ag), gold (Au), aluminum (Al), copper (Cu), chromium (Cr) and / or other conductive metals includes. It is also possible that the electrically conductive paste, in particular carbon paste, comprises binders, in particular comprising rosins and / or phenolic resins, polymers and copolymers.
  • Binders of the electrically conductive paste, in particular carbon paste are natural resins, preferably colophony, phenolic resins, polymers and copolymers consisting of PVC, PMMA, PU, polyester, isocyanate (NCO) crosslinked binders, for example MF, MPF, melamine polyester, UMF. Binders of the electrically conductive paste comprising poly (organo) siloxanes and their copolymers and / or radiation-curing binders are less preferred.
  • the flaft layer, the protective lacquer layer, the release layer and / or the contact reinforcement layer is / are applied by means of gravure printing, screen printing, floch printing or casting techniques.
  • the electrical functional structure preferably forms a touch sensor field, in particular a capacitive sensor field, which provides a touch field functionality. It is also possible for the electrical functional structure to form a resistive or inductive sensor field.
  • a touch sensor field is understood here to be a touch-sensitive sensor which enables an electrical functional element, for example a PDA, to be controlled.
  • a touch sensor field is also understood to mean a multi-touch sensor field that has multiple simultaneous touches can process, for example, to enlarge and rotate images that are displayed on a display arranged in particular under the touch sensor field.
  • the sensor film comprises at least two electrically conductive layers, in particular a first electrically conductive layer and a second electrically conductive layer.
  • the at least two electrically conductive layers are advantageously arranged so as to overlap at least in regions when viewed perpendicular to a plane spanned by the carrier substrate.
  • the second electrically conductive layer can be provided on a second carrier film, which is applied, in particular glued, to the first conductive layer in particular by means of the adhesion promoting layer and / or an intermediate adhesive layer and / or with the aid of primer layers and / or adhesive layers.
  • These primer layers and / or adhesive layer can be formed from a hot melt adhesive, a cold adhesive or a radiation-curable adhesive, in particular an adhesive curable by means of electromagnetic radiation and / or electron beams.
  • the relative positioning of the two electrically conductive layers takes place in register with one another, in particular with a tolerance of less than 0.25 mm, preferably with a tolerance of less than 0.1 mm to provide undisturbed touch functionality. It is thus possible for the at least two electrically conductive layers to be arranged precisely in register with one another, in particular for the at least two electrically conductive layers Layers with a tolerance of less than 0.25 mm, preferably less than 0.1 mm, are arranged to one another.
  • the electrically conductive layers have in particular electrically conductive structures, in particular conductor tracks, which are preferably arranged according to a grid. This grid can be regular or irregular.
  • the grid can in particular be constructed from grid elements, such as lines and / or surface elements. The grid elements can form so-called sensor cells.
  • Register or register or register accuracy or register accuracy or register accuracy or position accuracy is to be understood in particular as a positional accuracy of two or more elements and / or layers relative to one another.
  • the register accuracy should preferably be within a predetermined tolerance and should preferably be as high as possible.
  • the register accuracy of several elements and / or layers with respect to one another is particularly an important feature in order to increase process reliability.
  • the positionally accurate positioning takes place in particular by means of sensory, preferably optically detectable, registration marks or the position markings. In particular, these registration marks or position markings either represent special separate elements or areas or layers or are themselves part of the elements or areas or layers to be positioned.
  • the at least one electrically conductive layer and / or the two electrically conductive layers has a multiplicity of conductor tracks.
  • Conductor tracks here are preferably understood to mean structured electrically conductive layers and conductive regions of the at least one electrically conductive layer and / or of the two electrically conductive layers.
  • the conductor tracks are applied in such a way that sufficient transparency is retained for the human eye, that is to say the conductor tracks are designed in such a way that they are not perceived by a human observer because the conductor tracks are below the resolution of the human eye.
  • sufficient electrical conductivity is achieved, which is particularly comparable to layers made of indium tin oxide (ITO).
  • ITO indium tin oxide
  • ITO Indium tin oxide
  • PEDOT poly-3,4-ethylenedioxythiophene
  • PEDOT In contrast to indium tin oxide (ITO), which is vapor-deposited, PEDOT can be applied in particular by means of a printing process and, in this case, can be applied in a simple structure or over part of the area.
  • the occupancy of the carrier substrate with the at least one electrically conductive layer, in particular the conductor tracks, is preferably less than 30%, preferably less than 20%, more preferably less than 10%, even more preferably less than 5%.
  • the conductor tracks are advantageously spaced apart from one another, in particular the conductor tracks have a width between 0.2 ⁇ m and 20 ⁇ m, preferably between 4 ⁇ m and 15 ⁇ m, and a distance greater than 10 ⁇ m, preferably greater than 20 ⁇ m, from one another, so that the conductor tracks are below the resolution of the human eye.
  • the conductor tracks of the first electrically conductive layer and the second electrically conductive layer are each arranged in accordance with a line grid, in particular the line grid being rotated by 90 ° with respect to one another.
  • the first and second electrically conductive layers each have a grid of lines made up of conductor tracks that are spaced apart from one another.
  • the first and second electrically conductive layers are preferably arranged one above the other in such a way that the two line grids are arranged at right angles, that is to say rotated 90 ° to one another.
  • Electrical supply lines and / or contacting elements are preferably provided in the edge regions of both line grids.
  • edge areas are preferably with a tolerance of less than 0.25 mm, preferably less than 0.1 mm, in register relative to one another, in particular in the direction of the Coordinate axes x and y, arranged, the coordinate axes x and y spanning a plane which lies parallel to a plane spanned by the carrier substrate.
  • the conductor tracks of the first electrically conductive layer and the second electrically conductive layer are structured, in particular structured in such a way that the conductor tracks of the first electrically conductive layer and the second electrically conductive layer form a plurality of surface elements, preferably rom bus-shaped or diamond-shaped surface elements .
  • the first and second electrically conductive layers to each have a so-called diamond structure. This diamond structure is formed by a large number of, in particular, rhombus-shaped surface elements along line-shaped conductor tracks.
  • the first and second electrically conductive layers each have a large number of spaced apart diamond structures.
  • the first and second electrically conductive layers are arranged one above the other in such a way that the two diamond structures are arranged at right angles, that is to say rotated 90 ° to one another.
  • the surface elements of the first electrically conductive layer are arranged “on gaps” in the free spaces between the surface elements of the second electrically conductive layer.
  • the line-shaped conductor tracks of the electrically conductive layers intersect in the spaces between the surface elements.
  • an exact position of the surface elements relative to one another is particularly important and the surface elements are advantageously in register with one another with a tolerance of less than 0.25 mm, preferably less than 0.1 mm, in particular in the direction of the x and y coordinates, arranged.
  • the conductor tracks in the area of the surface elements can be shaped according to the shape of the surface elements, so that the material from which the electrically conductive layer is formed fills the surface elements over the entire surface. It is also possible that the conductor tracks along the surface elements run so that the conductor tracks frame the surface elements at least in some areas.
  • the surface elements can be formed from a full-area conductive layer or from an electrically conductive layer, in particular rasterized, which is present only in certain areas and consists of conductive raster elements and in particular transparent non-conductive surface areas between the raster elements.
  • the grid forming the grid elements can be regular or irregular.
  • regular and irregular grid areas can also be arranged adjacent to one another or otherwise jointly form an overall grid.
  • the surface elements can be semitransparent due to the raster and have an area coverage with raster elements of less than 50%.
  • the electrically conductive structures of the first and second conductive layers formed by the structured electrically conductive layers and / or the conductive regions of the electrically conductive layers each also have different geometries and / or sizes.
  • the contacting areas, in particular the contacting structures, of the at least two electrically conductive layers are advantageously brought together in a common contacting area. This makes it possible to make contact from the outside easier.
  • the common contact area is electrically contacted by means of an adapter element. It is thus possible, for example, for a particularly flexible adapter element to be attached to the common contacting area, which adapter element makes electrical contact with the contact points in the common contacting area and connects on the outside in an electrically conductive manner to a further contact element.
  • ACF anisotropy conductive film
  • the conductive adhesive is a Represents connecting element.
  • the conductor tracks made of metal in particular made of silver (Ag), gold (Au), aluminum (Al), copper (Cu) or chromium (Cr) in a layer thickness between 1 nm and 100 nm, preferably between 2 , 5 nm and 75 nm, more preferably between 5 nm and 50 nm.
  • the conductor tracks it is also possible for the conductor tracks to have a layer thickness between 100 nm and 5 ⁇ m.
  • the conductor tracks are formed from an electrically conductive paste comprising silver (Ag), in particular conductive silver paste, gold (Au), copper (Cu) and / or carbon and, in particular, a binder.
  • the ITO and / or PEDOT and / or AZO layers are preferably applied over the entire surface by means of magnetron atomization, sputtering or (vacuum) vapor deposition and less preferably by means of CVD and PVD processes and preferably have a layer thickness of 1 nm to 100 ⁇ m, more preferably from 10 nm to 10 pm.
  • the ITO and / or PEDOT and / or AZO layers are preferably arranged directly adjacent to electrically conductive layers made of metallic materials.
  • the at least one electrically conductive layer in step b2) and / or b3) preferably comprises at least one metal layer and / or a layer made of ITO and / or AZO and / or PEDOT and / or conductive lacquers, in particular where step b) a or comprises several steps of the following further steps, in particular wherein the following further steps are in the following sequence are carried out, preferably the following further steps being carried out in a cyclical sequence: b4a) applying the at least one electrically conductive layer in one or more sub-steps; b4b) structuring the at least one electrically conductive layer by removing the at least one electrically conductive layer at least in regions in one or more sub-steps; and / or b5) applying the at least one electrically conductive layer in structured form in one or more sub-steps.
  • the carrier substrate is preferably provided with an electrically conductive layer over the entire surface, for example by vapor deposition or sputtering of a metal layer and then by positive or negative etching or by means of a washing process, the electrically conductive layer corresponding to the formation of the electrical functional structure and contacting structure removed again in areas.
  • the at least one electrically conductive layer is already applied to the carrier substrate in the shape according to the functional structure and / or contacting structure by means of vapor deposition masks, by printing electrically conductive material and / or by galvanic reinforcement of a printed structure.
  • the sensor film preferably comprises a dielectric layer and / or a semiconducting layer which is arranged between a first electrically conductive layer of the at least one electrically conductive layer and a second electrically conductive layer of the at least one electrically conductive layer.
  • the at least one electrically conductive layer can have force sensors, in particular for measuring the compressive force.
  • the contact intensity can be determined in the form of the z coordinate (z coordinate is perpendicular to x and y coordinates).
  • z coordinate is perpendicular to x and y coordinates.
  • the z information can be used, for example, to control an electrical functional element, to which the sensor film is applied, as a function of whether a predefined threshold value of the z information is exceeded.
  • Force sensors in particular for measuring the compressive force, piezoelectric thin films are preferred. It is also possible for force sensors to be piezoresistive pressure sensors and / or piezoelectric pressure sensors. It is also possible for force sensors to be actuators, in particular buttons, each of the actuators having at least two electrical states as a function of the force acting on the actuators.
  • the at least one electrically conductive layer has at least regionally surface relief structures, in particular matt structures. This makes it possible to deflect light incident on the at least one electrically conductive layer by diffraction, scattering and / or reflection so that the impression is avoided that the electrically conductive layer reflects light, in particular in a direct mirror reflex. For example, a display on which the sensor film is applied appears homogeneously black when it is switched off.
  • one or more optically effective layers in particular dark layers and / or layers with light-scattering properties, to cover the at least one electrically conductive layer at least in regions when viewed perpendicular to a plane spanned by the carrier substrate.
  • a darkening layer absorbs incident light, as a result of which the proportion of the light reflected by the at least one electrically conductive layer is reduced or the Reflection is avoided entirely.
  • Layers with light-scattering properties likewise reduce the proportion of the light reflected by the at least one electrically conductive layer.
  • Layers with light-scattering properties are, for example, layers which have matt structures with stochastically selected relief parameters.
  • the carrier substrate has a layer thickness between 2 ⁇ m and 250 ⁇ m, preferably between 23 ⁇ m and 125 ⁇ m. However, it is also possible for the carrier substrate to have a layer thickness of less than 2 ⁇ m.
  • the sensor film advantageously has a total thickness of at most 150 ⁇ m, preferably 100 ⁇ m, more preferably 75 ⁇ m, perpendicular to the plane spanned by the underside of the carrier substrate.
  • the carrier substrate is preferably a transparent carrier substrate, in particular made of PET, PMMA, PC, acrylonitrile-butadiene-styrene (ABS), PU or glass.
  • a transparent carrier substrate in particular made of PET, PMMA, PC, acrylonitrile-butadiene-styrene (ABS), PU or glass.
  • the carrier substrate prefferably be formed from a hybrid material which comprises layers of plastic and layers of fiber material.
  • the carrier substrate consists of woven or knitted fabrics, for example woven or non-woven textile fabrics.
  • the textile fabrics can in particular contain or consist of fibers made of natural fibers and / or plastic and / or carbon fibers.
  • the film is also possible for the film to be a single-layer or multi-layer sensor film.
  • the sensor film by applying the sensor film to the film in the form of the single-layer or multi-layer additional sensor film, an intermediate product for further processing is preferably produced.
  • the sensor film comprises at least one intermediate adhesive layer.
  • the at least one electrically conductive layer is preferably arranged between the carrier substrate and the at least one intermediate adhesive layer.
  • the at least one intermediate adhesive layer may be arranged on the side of the carrier substrate facing away from the at least one electrically conductive layer. It is possible that the method further comprises the following steps: f) applying an intermediate adhesive layer, in particular such that the at least one electrically conductive layer is arranged between the carrier substrate and the at least one intermediate adhesive layer and / or that the at least one intermediate adhesive layer when viewed perpendicular to a plane spanned by the carrier substrate does not cover the at least one contact area at least in some areas.
  • the at least one intermediate adhesive layer when viewed perpendicular to a plane spanned by the carrier substrate, does not cover the at least one contacting area, at least in some areas.
  • the fact that the intermediate adhesive layer does not cover the at least one contacting area at least in some areas ensures that the electrical functional structure can be contacted reliably and robustly after the sensor film has been applied to the film.
  • the intermediate adhesive layer does not completely cover the at least one contact area.
  • the intermediate adhesive layer covers the functional area at least in some areas. It is also possible that the at least one intermediate adhesive layer, when viewed perpendicular to a plane spanned by the carrier substrate, is arranged essentially in the same area as the adhesion promoting layer, in particular that the at least one intermediate adhesive layer, when viewed perpendicular to a plane spanned by the carrier substrate, is essentially congruent is arranged with the adhesion promoting layer.
  • the intermediate adhesive layer advantageously has a layer thickness between 0.1 ⁇ m and 50 ⁇ m, preferably between 0.25 ⁇ m and 25 ⁇ m, more preferably between 0.5 ⁇ m and 7 ⁇ m.
  • the intermediate adhesive layer is preferably a primer layer and / or an adhesive layer composed of a hot melt adhesive, a cold adhesive or a radiation-curable adhesive, in particular an adhesive curable by means of electromagnetic radiation and / or electron beams.
  • the intermediate adhesive layer is preferably applied by means of gravure printing, screen printing, letterpress printing or casting techniques.
  • the at least one sensor film and / or the at least one film may include one or more decorative layers.
  • the one or more decorative layers on the sensor film form an overall decoration with the one or more decorative layers and / or functional layers on the film and / or complement one another to form an overall decoration and / or these layers overlap.
  • An overall decoration can in particular be formed by mutually adjacent decorative areas on the sensor film and / or on the film, which are preferably arranged directly adjacent or preferably spaced apart from one another.
  • the decors can in particular each be endless patterns or individual images.
  • the overall decoration can in particular again be an endless pattern or an individual image or a combination thereof.
  • the one or more decorative layers are preferably arranged on the side of the carrier substrate facing away from the at least one electrically conductive layer.
  • the sensor film can in particular have an intermediate adhesive layer in order to improve the adhesion of the one or more decorative layers.
  • an intermediate adhesive layer can be applied to the carrier substrate and / or the at least one electrically conductive layer, by means of which the one or more decorative layers are applied to the carrier substrate.
  • the decorative layers can then be applied to the intermediate adhesive layer or directly to the carrier substrate by means of various methods. It is particularly advantageous if the decorative layers on the side of the carrier substrate facing away from the at least one electrically conductive layer have a protective layer as the final layer, which protects the decorative layers in particular from the strong pressure and heat effects that occur, for example, in injection molding and / or lamination processes.
  • the protective layer protects against mechanical damage that can occur during the manufacturing process, such as scratches, etc.
  • This protective layer can also contain polymeric and in particular self-supporting films, preferably made of PET, PC or PMMA, or made of glass or fabric, which are attached to the Decor remain and form part of the intermediate or end product.
  • the one or more decorative layers are advantageously arranged essentially in the same area as the adhesion promoting layer and / or the intermediate adhesive layer, in particular the one or more decorative layers, when viewed perpendicular to a plane spanned by the carrier substrate, are essentially congruent with the adhesion promoting layer and / or the intermediate adhesive layer arranged.
  • the one or more decorative layers can be partially applied to the side of the carrier substrate facing away from the at least one electrically conductive layer in such a way that they essentially cover the same area as the adhesion promoter layer on the other side of the carrier substrate.
  • the one or more decorative layers can be arranged on the side of the adhesion promoting layer and / or the intermediate adhesive layer facing away from the carrier substrate.
  • the one or more decorative layers can be arranged on the side of the at least one electrically conductive layer facing away from the carrier substrate.
  • the one or more decorative layers are preferably applied essentially congruently with the adhesion promoting layer and in particular also leave the at least one contacting area uncovered.
  • the decorative layers on the side of the at least one electrically conductive layer and / or the intermediate adhesive layer facing away from the carrier substrate have a protective layer as the final layer, which the decorative layers are particularly strong against, for example, the injection molding and / or lamination processes Protect pressure and heat effects.
  • the protective layer protects against mechanical damage that can occur during the manufacturing process, such as against scratches, etc.
  • This protective layer can also contain polymeric and in particular self-supporting films, preferably made of PET, PC or PMMA, or also made of glass or fabric, which contain Remain with the decor and form part of the end product.
  • the at least one intermediate adhesive layer is advantageously arranged between the carrier substrate and the one or more decorative layers.
  • the one or more decorative layers preferably comprise at least one of the layers selected from the group consisting of protective layers, colored lacquer layers, metal layers, reflective layers, replication lacquer layers, transparent layers, carrier layers and / or layers generating an optically variable effect.
  • the one or more decorative layers preferably have, for example, a printed layer, in particular made of an opaque and / or colored ink, which forms a frame around the functional area.
  • the decorative layers can also cover the sensor film and in particular also the functional area over the full area or partially and / or be applied in a grid.
  • the decorative layers can represent a uniform surface and / or an endless pattern and / or an individual image motif.
  • the decorative layers can be colored over the entire surface or partially opaque and / or semitransparent and / or transparent, in particular transparently.
  • the one or more decorative layers can be applied, in particular embossed and / or printed, to the flaft communication layer and / or to the intermediate adhesive layer.
  • the one or more decorative layers can be applied, for example, by means of industrial embossing and / or by means of cold embossing and / or by means of thermal transfer processes and / or by means of different lamination processes and / or other known processes to the side of the flaft layer and / or the intermediate adhesive layer facing away from the carrier substrate.
  • This also makes it possible, for example, to provide the sensor film with a decorative layer or a decoration, so that the sensor film also has a decoration in addition to a function provided by the electrical functional structure in the form of a touch sensor field.
  • the one or more decorative layers can be further layers, such as protective lacquer layers and / or colored layers and / or metal layers and / or transparent reflective layers and / or replication lacquer layers and / or different types of layer structures generating an optically variable effect.
  • the one or more decorative layers may include at least two decorative layers, in particular to include a first decorative layer and a second decorative layer.
  • the one or more decorative layers can be arranged on the side of the carrier substrate facing away from the at least one electrically conductive layer and also on the side of the at least one electrically conductive layer facing away from the carrier substrate.
  • a first decorative layer is arranged on a first side of the carrier substrate and a second decorative layer is arranged on a side of the carrier substrate opposite the first side, so that the one or more decorative layers are arranged on both sides of the carrier substrate.
  • the first decorative layer facing the viewer can represent a color filter layer for the second decorative layer facing away from the viewer, that is to say lying underneath in the viewing direction, which is, for example, a colored layer.
  • Overlay effects or combination effects by means of two patterns which complement each other to form a moiré pattern or which also result in other complementary combination patterns when superimposed are also possible.
  • optically variable combination effects are possible, which only arise when the at least two decorative layers are superimposed.
  • the decorative layers can be advantageous here for the decorative layers to be spaced apart from one another, for example because between the decorative layers, in particular, the carrier substrate and the electrically conductive layer and, if appropriate, further layers, in particular transparent layers, are arranged. Such a distance can be advantageous, in particular, for generating depth effects and / or optically variable effects.
  • a depth effect can be produced, for example, by inserting optically transparent layers in front of the decorative layers and / or behind the decorative layers and / or as part of the decorative layers in the viewing direction.
  • the optically transparent layers preferably have the same layer thickness as the respective decorative layers or a layer thickness that is many times thicker than the respective decorative layers, in particular the layer thickness of the optically transparent layers is between 0.5 ⁇ m and 500 ⁇ m, preferably between 10 ⁇ m and 100 ⁇ m .
  • the optically transparent layers preferably consist of optically transparent lacquers and / or optically transparent films made preferably of PET, PMMA or PC.
  • optically variable effect is possible, for example, in that the aforementioned optically transparent layer is arranged as a spacer layer between a reflective layer and a semitransparent reflective layer and interference effects occur within this layer structure that can be recognized by a viewing angle-dependent and / or illumination-angle-dependent color change effect.
  • Such interference layer structures are already known as Fabry-Perot thin-film structures.
  • At least one of the one or more decorative layers has a surface relief structure, in particular a surface relief structure that can be detected haptically and / or tactilely, at least in some areas.
  • the structuring of the optically transparent layers and / or the protective layers and / or the one or more decorative layers can produce surface morphologies, in particular surface relief structures, which in particular enable haptic or tactile effects.
  • the surface relief structures can produce diffractive and / or refractive optical effects.
  • These surface relief structures can by additional partially printed lacquers or mechanical structuring or optical structuring of the layer surface can be generated.
  • a mechanical structuring can be a replication with a correspondingly shaped embossing tool.
  • Optical structuring can be laser ablation.
  • photolithographic processes can also be used to produce these structures.
  • the structure depths for such haptic effects are in particular 1 pm to 2000 pm, preferably 50 pm to 2000 pm.
  • the structure depths for diffractive or refractive effects are in particular 0.1 pm to 20 pm, preferably 0.1 pm to 5 pm.
  • the cover layer preferably has a refractive index that differs by at least 0.2 from the layer underneath, which has the haptic structure, in order to thereby create an optical interface, whereby the visibility of the haptic structure is increased.
  • the cover layer can contain nanoscale particles for modulating the refractive index consisting of one or more components selected from T1O2, S1O2, Sn or metal chalcogenides (oxides, sulfides), as well as metals Au, Ag, Cu.
  • the tactilely palpable and / or the merely optically simulated haptic surface relief structure can correspond to the functional touch sensor fields, that is, highlight or identify their functional area, so that “blind” feeling of the touch function is made possible. But it is the same possible that the tactile perceptible and / or the merely optically simulated haptic structure is provided over the entire surface in order to achieve a certain surface characteristic of the film, in particular to match its other optical appearance. Both possibilities can also be combined. For example, it is possible to combine a wood decor with a haptic wood grain that is modified in the area of the touch function, especially in the functional area, in the structural depth and / or another structural parameter so that the touch sensor field can be felt by a user within the grain is.
  • the sensor film prefferably has a structure in the following order:
  • the sensor film prefferably has an adhesive layer on the side of the carrier substrate facing away from the at least one electrically conductive layer.
  • the sensor film can thus have the adhesion promoting layer on one side of the carrier substrate and the adhesive layer on the other side of the carrier substrate, so that the sensor film can be applied to a further substrate by means of the adhesive layer.
  • the application of the sensor film to the further substrate can take place, for example, by means of hot lamination or by means of back injection molding.
  • the at least an electrically conductive layer and / or the one or more decorative layers are protected by the carrier substrate from the injected injection molding compound and in particular from the harsh process conditions with high pressure and high temperature during the injection molding process.
  • the sensor film has at least one register mark for determining the relative position or position of the sensor film, in particular the functional area and / or the at least one contacting area of the at least one electrically conductive layer.
  • Register or register accuracy is preferably to be understood here as the precise arrangement of layers lying one above the other or adjacent to one another, while maintaining a desired positional tolerance.
  • a register mark can be used to ensure that the sensor film can be applied to a film with precise positioning while maintaining a desired position tolerance.
  • the register mark is preferably formed from a printing material and / or from a magnetic or conductive material.
  • the marks can thus be, for example, optically readable register marks which differ from the background in terms of their color value, their opacity or their reflective properties.
  • the register marks can also be register marks that can be detected by means of a magnetic sensor or a sensor that detects the electrical conductivity.
  • the register marks are recorded, for example, by means of an optical sensor, in particular a camera, a magnetic sensor or a mechanical sensor, a capacitive sensor, or a sensor that detects the conductivity, and the application of the sensor film can then be controlled by means of the register marks.
  • the register marks enable the sensor film to be precisely positioned on the film. In this way, an identical manufacturing quality of, for example, touchscreens can be improved and, at the same time, the exclusion due to incorrect placement of the sensor film on the film can be further reduced.
  • the sensor film is preferably a hot lamination film.
  • step b2) the sensor film from a roll by means of hot lamination onto the film, in particular in the case of a
  • Sensor film web speed between 1.5 m / min and 3.5 m / min is applied. It is possible here for the roll to include a sensor film web with a plurality or a multiplicity of sensor films as panels. This makes it possible, in particular, to further improve industrial mass production. For example, it is possible to apply the sensor film over its entire surface to a film using a hot lamination machine, so that the time, personnel and logistical effort can be further reduced and, at the same time, identical manufacturing quality can be ensured.
  • step b2) the sensor film is applied to the film from a sheet or sheet by means of hot lamination.
  • the sheet it is possible here for the sheet to comprise several or a large number of sensor foils as panels. This makes it possible, in particular, to further improve industrial mass production. For example, it is possible to apply the sensor film over its entire surface to a film using a hot lamination machine, so that the time, personnel and logistical effort can be further reduced and, at the same time, identical manufacturing quality can be ensured.
  • the sheet or sheet includes only one sensor film as a panel.
  • Several such sheets, each with a sensor film can be present as a stack in a magazine and a hot lamination machine, which can work, for example, in the lifting or rolling process, and / or an injection molding machine for application to the film be fed individually accordingly.
  • the precisely positioned application to the film then takes place via the register marks on the sensor film, as described above.
  • an intermediate substrate which can be present as a roll or as a sheet, before application to the foil.
  • the intermediate substrate can be, for example, a silicone-coated paper or a sensor film web provided with a release layer.
  • one or more sensor foils can then be transferred jointly or separately from the intermediate substrate to the foil by means of applied heat and / or pressure.
  • the intermediate substrate can then be peeled off, in particular, from the sensor film firmly adhering to the film.
  • the industrial lamination takes place at a temperature in the range between 80 ° C. and 300 ° C., preferably between 200 ° C. and 290 ° C., more preferably between 240 ° C. and 270 ° C., and / or with an embossing pressure in the range between 10 bar and 2000 bar, preferably between 500 bar and 1500 bar.
  • step b2 the sensor film to be applied to the film by injecting an injection molding compound, the injection molding compound in particular forming the film. It is thus possible for the sensor film to be firmly connected to the injection molding compound through the flaft communication layer.
  • the senor film prefferably connected to a further substrate by injecting an injection molding compound.
  • step b2) the sensor film is applied to the film by means of industrial embossing is applied. It is possible here for the sensor film to be applied to the film from a roll or from a sheet or sheet by means of hot stamping.
  • the roll comprises a sensor film web with several or a plurality of sensor foils as panels, and / or that the sheet comprises several or a plurality of sensor foils as panels.
  • This makes it possible, in particular, to further improve industrial mass production.
  • the embossing temperature is in a range from 80 ° C. to 250 ° C., preferably in a range from 100 ° C. to 200 ° C.
  • the embossing pressure is in a range from 0.5 kN / cm 2 to of 10 kN / cm 2 , lies / lie.
  • the embossing time is in a range from 1 ms to 20,000 ms, preferably in a range from 100 ms to 10,000 ms.
  • embossing is carried out by means of a lifting process, in particular the embossing time being from 2 s to 5 s.
  • the further substrate and / or the film is flat and / or has a one-dimensionally curved and / or a two-dimensionally curved and / or a three-dimensionally curved shape.
  • the sensor film and / or the electrical functional element in particular the electrical functional element formed from the film and the sensor film, to be reshaped, in particular three-dimensionally reshaped.
  • the deformation advantageously takes place by means of deformation processes, preferably by means of deep drawing, thermoforming, high pressure forming and / or by means of an injection molding process.
  • the film and / or the intermediate substrate preferably has a layer thickness of at most 1 mm, preferably 500 ⁇ m so that the electrical functional element formed from the sensor film and the film can be deformed.
  • the sensor film and / or the electrical functional element is preferably reshaped by means of deep drawing.
  • the deformation of the sensor film and / or the electrical functional element is advantageously carried out by means of a vacuum, in particular with a negative pressure of a maximum of 1 bar, and / or by means of positive pressure support, in particular with an overpressure between 1 bar and 20 bar, preferably with an overpressure between 1 bar and 10 bar, in a forming tool corresponding to the desired forming geometry.
  • the forming process of the sensor film and / or the electrical functional element or the process parameters of the forming process corresponds to the deep-drawing process, the forming with additional temperature support, in particular at a temperature between 120 ° C and 300 ° C, preferably between 190 ° C and 250 ° C, for example when using ABS material. It is possible here for either the carrier substrate and / or the film to have ABS material.
  • the sensor film and / or the electrical functional element can be reshaped by means of high pressure forming.
  • the reshaping of the sensor film and / or the electrical functional element takes place here by means of overpressure support, in particular at an overpressure between 1 bar and 300 bar, preferably between 10 bar and 150 bar, in one of the desired Forming geometry corresponding forming tool or forming station.
  • additional temperature support preferably at temperatures in the range of the glass transition temperature of the sensor film used.
  • the temperature is advantageously between 80 ° C. and 300 ° C., preferably between 140 ° C. and 250 ° C., for example when using PC material.
  • the sensor foils and / or electrical functional elements that are formed or pre-formed by means of the above-mentioned forming processes to be pre-injected and / or back-injected in a subsequent injection molding process.
  • the sensor foils and / or electrical functional elements that are reshaped or pre-shaped by means of the above-mentioned reshaping processes can, in particular, be used directly, i.e. without further injection molding processes.
  • the sensor film and / or the electrical functional element can be reshaped and / or deformed by means of an injection molding process.
  • the sensor film and / or the electrical functional element is introduced into the injection molding tool in the flat state via a roll or sheet or sheet or via individual labels and deformed by means of the injection molding process, in particular the shaping takes place by closing the tool and also by injecting the molding compound .
  • the injection pressure is dependent on the component geometry and / or the component size.
  • the injection pressure to be 500 bar and the injection temperature to be between 180 ° C. and 380 ° C., with the injection pressure and injection temperature depend on the injection molding material.
  • the sensor film introduced into the injection molding tool and / or the electrical functional element prior to the closing process of the injection molding tool by means of heating the sensor film and / or the electrical functional element, for example at temperatures between 30 ° C and 300 ° C, preferably between 80 ° C and 150 ° C. It is also possible for the sensor film and / or the electrical functional element to be fitted or fixed in the cavity by means of a clamping frame and / or vacuum and / or overpressure.
  • the sensor film and / or the electrical functional element are advantageously “coated” by controlling a vacuum suction of the sensor film and / or the electrical functional element onto the already three-dimensionally preformed component with simultaneous overpressure in one process.
  • the already three-dimensionally preformed component to be coated is preferably subjected to temperature beforehand. It is useful here if the overpressure is between 1 bar and 50 bar, preferably between 3 bar and 15 bar, and / or the temperature is between 30 ° C and 300 ° C, preferably between 100 ° C and 180 ° C.
  • the sensor film and / or the electrical functional element preferably has an expandability of greater than 20%.
  • Such high extensibility cannot be achieved, for example, by means of the above-mentioned forming and / or deformation processes with conventional functional films, in particular since the carrier film made of, for example, PET is not deformable enough and / or the conductive structures after only slight deformation, in particular when stretching greater than 20%, break. It has been shown here that the expansion is improved by the sensor film.
  • the multi-layer structure of the sensor film in particular the one between several layers of lacquer Embedded at least one electrically conductive layer according to a sandwich system, as described above, ensures that the mechanical expansion and / or deformation can be influenced in a targeted manner by making certain areas of the sensor film more flexible or less flexible, for example by adapting the layer thicknesses and / or the paint formulations can.
  • the desired expandability of greater than 20% is thus preferably achieved here.
  • the electrical functional structure of the sensor film and / or the electrical functional element can be electrically, in particular galvanically contacted from the outside, for which purpose the electrical contacts must be accessible for contacting.
  • inductive and / or capacitive coupling in particular coupling via an antenna, can be implemented.
  • the sensor film enables robust and secure contacting of the electrical functional structure.
  • LEDs Light-Emitting Diode
  • the adhesion promoting layer may consist of a material whose optical appearance changes from cloudy to highly transparent and / or clear during and / or after step b2). So it is possible that during the application of the sensor film to the film, the adhesion promoting layer is melted due to the applied heat and / or the adhesion promoting layer is leveled by means of pressure, so that the surface roughness of the adhesion promoting layer present in the non-applied state of the sensor film during and / or after leveled after application. This changes the visual appearance of the adhesion promoting layer from cloudy to highly transparent and / or clear. After the sensor film has been applied to a film, the sensor film and the film form, in particular, an electrical functional element.
  • the flaft mediation layer of the sensor film is highly transparent, in particular the flaft mediation layer of the sensor film has a transmission of light in the wavelength range between 380 nm to 780 nm of more than 85%, preferably more than 90%, and / or the Flaft mediation layer of the sensor film is a clear adhesion mediation layer, in particular light in the wavelength range between 380 nm to 780 nm is deflected by less than 8%, preferably less than 4%, by scattering from the adhesion mediation layer of the sensor film.
  • the sensor film prefferably has a transmission of light in the wavelength range between 380 nm to 780 nm of more than 75%, preferably more than 80%, more preferably more than 85%, at least in the one functional area of the at least one electrically conductive layer, even more preferably more than 90%. In this way, for example, a brilliant and true-to-original viewing of an image generated by a display to which the sensor film is applied can be achieved.
  • the electrical functional element is a functional element for information processing, in particular a mobile phone, such as a smartphone or a PDA, a tablet computer, an ATM, a ticket machine, a game machine, a game console, a control unit of a household appliance or a motor vehicle is or is, for example, a touchscreen. It is also possible for the electrical functional element to be an input device, in particular a touch panel. However, it is also possible that the electrical functional element is an intermediate product which is built into or into an end product in further processing steps.
  • the sensor film can be applied to a glass layer and the electrical functional element formed from the glass layer and the sensor film can be installed in a ticket machine, for example.
  • At least one sensor film of the at least one sensor film in step b) preferably has one or more sensors and / or electrical components, in particular LEDs, in particular one or more touch sensors and / or one or more displays.
  • At least one sensor film of the at least one sensor film to have one or more contact areas in step b), in particular with one or more contact areas of the one or more contact areas not being covered at least in some areas by any foil or layer, preferably with one or more contact areas the one or more contact areas are arranged on a surface of the at least one sensor film of the at least one sensor film facing away from the at least one film.
  • a transfer film is preferably applied to an in particular flat, flat substrate.
  • the carrier film is then peeled off, the applied transfer layers preferably absorbing the tensile forces of the deformation during the subsequent deep-drawing or forming of the substrate coated with the transfer layers between two tool halves of a deep-drawing or forming tool.
  • cracks etc. can often occur in tight radii.
  • the at least one film in step a) and / or the at least one sensor film in step b) and / or the at least one film and / or the at least one sensor film in a further step at least in some areas, at least one decoration and / or have at least one decorative film.
  • the reshaping of the at least one film comprising the at least one sensor film is carried out in step c) by means of one or more reshaping processes, in particular selected from the following reshaping processes: deep drawing, thermoforming, high pressure forming, injection molding processes.
  • the radius of curvature of the at least one film and / or the at least one sensor film after step c) is at least regionally less than 1000 mm, in particular less than 200 mm, more preferably less than 100 mm and / or where the expansion of the at least one film and / or the at least one sensor film is greater than or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, particularly preferably greater than or equal to 300%.
  • the method comprises the following further step: e) injection molding of the one or more punched-out film elements.
  • one or more holes or punchings are made in the one or more film elements in step d), in particular with one or more holes of the one or more holes having the function of an injection channel for a plastic compound during injection molding in step e).
  • step e) comprises one or more steps of the following further steps, in particular wherein the following further steps are carried out in the following sequence, preferably wherein the following further steps are carried out in a cyclical sequence: e1) providing at least one Decorative film, which in particular has at least partially at least one opaque coating; e2) introducing at least one decorative element of at least one decoration into the at least one decorative film by processing in at least one processing station; e3) inserting the one or more punched-out film elements and the at least one decorative film into an injection molding station, the injection molding station comprising a first tool mold half and a second tool mold half, the first tool mold half and the second mold half, in particular in a closed state, forms an injection molding cavity for molding at least one plastic body, the at least one punched-out film element being attached to a first wall of the injection molding cavity and / or the at least one decorative film being attached to a second wall of the injection molding cavity, in particular where the the second wall is arranged opposite the first wall; e4) Injection molding
  • step e) comprises one or more steps of the following further steps, in particular wherein the following further steps are carried out in the following sequence, preferably wherein the following further steps are carried out in a cyclical sequence: e7) inserting a first punched out film element of the one or more punched out film elements and / or a second punched out film element of the one or more punched out film elements in an injection molding station, wherein the injection molding station comprises a first tool mold half and a second tool mold half, wherein the first tool mold half and the second tool mold half, in particular in a closed state, at least one injection molding cavity for molding form a plastic body, wherein the first punched out film element is attached to a first wall of the injection molding cavity and / or the second punched out film element is attached to a second wall of the injection molding cavity, in particular wherein the second wall is arranged opposite the first wall; e8) Injection molding of the first punched-out film element and / or the second punched-out film element with a plastic compound
  • a plastic component which comprises at least one decorative film, which at least partially has an opaque coating in which a decoration is introduced, and which has one or more punched out Comprises film elements, wherein the at least one decorative film forms a first surface and the one or more film elements preferably at least a second surface of the plastic component opposite the first surface.
  • step e2) and / or e7) it is possible for the at least one decorative element of a decoration to be introduced into the at least one decorative film, in particular by laser radiation and / or by milling and / or punching.
  • the processing tool is therefore preferably a laser and / or a milling tool and / or a punching tool.
  • the at least one decorative film and the one or more film elements preferably form a protection for the first and the at least one second surface of the plastic component, so that it is particularly resistant.
  • the at least one decoration and / or the at least one decoration element is preferably introduced into the at least one decoration film after the injection molding by laser irradiation and / or by milling and / or by punching. This makes it possible to place or position the decor and / or the at least one decor element particularly precisely because important work steps that interfere with or negatively influence the placement and / or positioning of the decor and / or the at least one decor element (in particular the positioning the decorative foils in the injection mold and the back injection) have already taken place.
  • the at least one decoration and / or the at least one decoration element is introduced into the at least one decoration film by laser irradiation, milling or punching before injection molding, in particular before the at least one decoration film is inserted into the injection molding station.
  • the at least one decoration and / or the at least one decoration element is introduced into the at least one decoration film by laser irradiation, water jet cutting, milling or punching, the at least opaque coating in the area processed with the processing tool is at least partially removed and / or the opacity of the at least one opaque coating in the processed with the processing tool area at least partially reduced.
  • the at least one opaque coating By means of laser irradiation, water jet cutting, milling or punching, it is possible to structure the at least one opaque coating precisely, in particular to ablate it, in order to create symbols or symbols that can preferably be backlit to bring in further decorative elements.
  • the material of the opaque coating is heated and evaporated, in particular where it is hit by the laser beam, and is thereby removed.
  • the material of the opaque coating is preferably removed mechanically.
  • the area processed with the processing tool and the area not processed with the processing tool preferably have such a difference in transparency that it is preferred by a human observer can be recorded in transmitted light viewing without aids.
  • the difference in transparency is in particular at least 5%, preferably at least 10% to 75%. This preferably ensures that there is sufficient contrast in the at least one decoration, so that in particular at least one sharp and easily recognizable decoration is created.
  • the at least one opaque coating is preferably applied by printing, in particular screen printing or gravure printing. It is possible for the printing to take place over the entire surface or partially. It is also possible to carry out several printing processes in a sequence, in particular to achieve the desired degree of coverage or the desired opacity. It is also possible that further layers, such as colored transparent or translucent layers, protective lacquers or the like, are also printed on over the entire surface or in parts.
  • the at least one opaque coating can be applied by means of at least one transfer film.
  • a transfer film usually comprises at least one carrier layer, at least one optional release layer and, as at least one transfer layer, one or more decorative layers, which in particular have different degrees of coverage, and / or at least one Adhesive layer.
  • the at least one carrier layer is peeled off after the application of the at least one transfer film, the at least one transfer layer with the further layers remaining on the at least one decorative film.
  • the at least one opaque coating is then formed by at least one decorative layer of the at least one decorative layer.
  • the at least one opaque coating preferably has a thickness of less than 100 ⁇ m, in particular a thickness between 5 ⁇ m and 50 ⁇ m.
  • a thickness between 5 ⁇ m and 50 ⁇ m.
  • the at least one decorative film has at least one further at least partial coating, in particular a transparent or translucent colored coating, a protective lacquer coating and / or an adhesive coating.
  • a transparent or translucent colored coating for example, preferably applied by printing or by means of a transfer film. Combinations of these techniques are also possible. In this way, additional visual effects are preferably implemented or additional functions are integrated into the decorative film.
  • the at least one decoration and / or the at least one decoration element is preferably or comprises a logo, a symbol and / or at least one alphanumeric character. In particular, these elements are also combined with abstract graphic design elements as decorative elements.
  • the at least one decoration preferably has a purely decorative function. It is also possible that the at least one decoration is preferably also or exclusively functional and, for example, fulfills the function of a display and / or control element of a device and / or is designed as a display and / or control element, such as status displays, control surfaces or the like is.
  • At least one further decorative element is preferably introduced into the at least one decorative film by punching. This makes it possible to provide large-area recesses for display elements, for backlighting or the like, in particular without the need for a lengthy laser or milling treatment of these areas.
  • the at least one decorative film and / or the one or more film elements is reshaped before being placed in the injection mold. This makes it possible to produce so-called inserts which, before injection molding, in particular, can be deformed three-dimensionally to the extent that it is often not possible during injection molding.
  • the at least one decorative film is provided as sheet goods and inserted into a forming tool which has the desired final contour.
  • the application of heat preferably at a temperature of 80 ° C. to 200 ° C., brings the at least one decorative film into a deformable state.
  • the film, in particular the at least one decorative film and / or the one or more film elements by applying a vacuum and / or by applying a forming stamp and / or excess air pressure to the shape of the first and / or second tool halves in the Forming station can be adapted and in particular brought into the desired final contour.
  • the material of the at least one decorative film and / or the one or more film elements hardens again, so that it retains the final contour.
  • the at least one decorative film here preferably has a thickness of 50 ⁇ m to 2000 ⁇ m, in particular with good mechanical stability being ensured on the one hand and problem-free reshaping being made possible on the other hand.
  • the at least one decorative film preferably has at least one layer made of a colorless or colored transparent or translucent thermoplastic material, in particular made of ABS, ABS / PC, PC / ABS, PC, PP or PMMA. This serves as a carrier for the opaque coating and any other layers that may be present, in particular with this itself being backlit. Due to the thermoplastic nature of the materials mentioned, reshaping is possible without problems.
  • the at least one decorative film and / or the one or more film elements are preferably inserted into the injection molding station at a distance of 0.5 mm to 10 mm, preferably 0.8 mm to 5 mm, in particular, this distance determining the wall thickness of the finished plastic component determined.
  • the at least one core is preferably introduced into the space between the at least one decorative film and / or the one or more film elements through at least one punching in the at least one decorative film and / or the one or more film elements.
  • the plastic compound is preferably transparent or translucent, in particular with a transparency of 5% to 98%, and preferably comprises one of the following materials: ABS (acrylonitrile-butadiene-styrene copolymer), PC (polycarbonate), ABS / PC, PC / ABS , PMMA (polymethyl methacrylate), PP (polypropylene), PA (Polyamide), TPU (thermoplastic polyurethane).
  • ABS acrylonitrile-butadiene-styrene copolymer
  • PC polycarbonate
  • ABS / PC PC / ABS
  • PMMA polymethyl methacrylate
  • PP polypropylene
  • PA Polyamide
  • TPU thermoplastic polyurethane
  • steps d) and / or e) are carried out using an injection molding station, the injection molding station having a first tool mold half comprising a first mold recess and a second tool mold half, the first tool mold half and / or the second tool mold half has at least one injection channel, the first mold half and the second mold half, in particular in a closed state, form an injection molding cavity for molding at least one plastic body, steps d) and / or e) comprising one or more steps of the following further steps , in particular with the following further steps being carried out in the following sequence, preferably with the following further steps being carried out in a cyclical sequence: e11) providing the one or more punched-out film elements and / or at least one section of at least one decorative film the first mold half and / or on the second mold half in such a way that when the first mold half and second mold half are closed, the one or more punched-out film elements and / or the at least one decorative film on an end face of the raised mold that delimits the
  • Steps e11) to e15) are preferably characterized in that the tool wear of an injection molding tool integrated in the injection molding station for cutting through the at least decorative film by squeezing is significantly reduced and at the same time the time required to position a plastic component is reduced as a result.
  • the one or more film elements and / or the at least one decorative film is compressed to less than 50% of its thickness, preferably to 20% to 10% of its thickness.
  • tearing of the one or more film elements and / or the at least one decorative film and, in particular, partial severing here, preferably with the The degree of severing depends on the material.
  • step e12 the decorative film is at least partially severed by squeezing and / or severing when the raised edge area of the first mold recess of the first mold half interacts with the corresponding end face of the second mold half.
  • the raised edge area of the first tool mold half prefferably be designed as a punched edge, at least in some areas.
  • the at least one decorative film and / or the one or more film elements adheres in step e13) to the plastic body and / or plastic component produced by injection molding, preferably being completely severed in step e13) if, in particular, the edge has not yet been completely severed. It is possible here to describe the complete severing of the at least one decorative film and / or the one or more film elements in step e13) essentially as a tearing process.
  • the at least one decorative film and / or the one or more film elements are arranged in step e11) such that the at least one decoration of the at least one decorative film faces away from the plastic compound injected in step e13).
  • the at least one decoration is formed in particular from materials which react with the plastic compound in step e13), for example themselves loosen or loosen.
  • the comparatively thick material layer of the at least one decorative film protects the decor during the injection molding of the plastic compound in step e13).
  • the at least one decorative film prefferably be designed as a single-layer or multi-layer laminating film.
  • the single or multi-layer laminating film is a plastic film, preferably a PET film or a film made of polystyrene, ABS or PMMA.
  • the plastic film is preferably designed as a smooth or as a structured film, in particular comprising structures. It is possible, for example, for the plastic film to simulate a leather surface with the typical leather grains that can be perceived haptically or tactilely. Furthermore, it is possible that such structures are also present in orders of magnitude (microscopic, submicroscopic) which cannot be perceived by touch, e.g. optical diffractive or refractive structures.
  • the single-layer or multi-layer laminating film may be made from other materials, in particular from natural materials such as leather, parchment or wood veneer.
  • the single or multi-layer laminating film preferably has an extensibility in a range from 12% to 20%, in particular in a range from 15% to 20%, preferably the extensibility required for good processability being determined by the surface geometry of the plastic component.
  • the single-layer or multi-layer laminating film has a thickness in the range from 20 ⁇ m to 500 ⁇ m.
  • the distance lies between the end face of the raised edge area of the first molded tool part and the corresponding one End face of the second molded tool part in a range of 20% to 10% of the thickness of the at least one decorative film and / or the one or more film elements.
  • the plastic compound injected in step e13) preferably has polystyrene. It is also possible to use other thermoplastics, such as ABS, ABS-PC, PMMA, PET, PET-PC, for example.
  • step e) is carried out using an injection molding station, the injection molding station having a first mold half comprising a first mold recess and a second mold half comprising a second mold recess, the first mold half being movable and the second mold half being movable are not designed to be movable, wherein step e) comprises one or more steps of the following additional steps, in particular wherein the following additional steps are carried out in the following sequence, preferably wherein the following further steps are carried out in a cyclical sequence: e16) inserting the one or more punched-out film elements and / or at least one decorative film in the first mold recess of the first mold half and fixing the one or more punched-out film elements and / or the at least one decorative film; e17) inserting an in-mold labeling molding or IML molding into the second mold recess of the second mold half and fixing the IML molding, the IML molding comprising a decorative insert and a backing film; e18) Closing the following additional steps, in particular where
  • move for example a mold half, is preferably a change in a position and / or an orientation of at least one element, preferably along at least one direction in space, in particular relative to a predetermined reference system, and / or relative to a position and / or alignment of at least one further element, preferably along at least one further direction and / or the at least one direction, in particular wherein the at least one element and / or the at least one further element are selected and / or combined from: upper tool carrier, lower tool carrier , upper tool module, lower tool module.
  • the element or elements can be shifted translationally and / or rotated, in particular about a point and / or axes or several points and / or axes in space.
  • Steps e16) to e21) are distinguished in particular by the fact that they combine the advantages of decorating using in-mold decorative films or IMD decorative films or decorative films and / or one or more punched-out film elements with the advantages of decorating using in-mold - Combine labeling molded parts or IML molded parts and thereby preferably open up new design options.
  • IMD In Mold Decoration
  • a transfer film is preferably placed in an injection molding tool and back-injected.
  • the carrier film absorbs tensile forces that can occur when the transfer film is deformed when it is applied to the contour of the tool surface, particularly at high speed due to the high pressures and temperatures that occur during injection molding, and preferably protects the transfer layers, which are designed as lacquer layers, from deformation Cracks and other damage.
  • the surface quality of the transferred layers is also defined by this carrier film.
  • the carrier film here preferably serves as a deformation aid for the transfer layers.
  • in-mold labeling molded part or IML molded part prefferably be a plurality of in-mold labeling molded parts or IML molded parts.
  • the at least one decorative film in steps e16) to e21) is preferably at least one IMD decorative film.
  • the at least one decorative film and / or the one or more punched-out film elements is positioned over the entire surface of the mold recess of the first tool half in method step e16).
  • the at least one decorative film and / or the one or more punched-out film elements preferably in the form of a web or strip, is guided through the injection molding station, for example, by means of a film feed device, in particular wherein the film feed device is a supply roll for the at least one decorative film and / or the one or more punched-out film elements , a take-up roll for the remaining film, a transport device for the step-by-step transport of the at least one decorative film and / or the one or more punched-out film elements as well as a fixing device for fixing the supplied, at least one decorative film and / or which comprises one or more punched-out film elements on the first tool half.
  • the film feed device is a supply roll for the at least one decorative film and / or the one or more punched-out film elements , a take
  • the at least one decorative film and / or the one or more punched-out film elements may have register marks, preferably on their outer edge, which are detected in particular by at least one, preferably optical, position sensor at the injection molding station, in particular the position sensor thereby controls the film feed device in such a way that the at least one decorative film and / or the one or more punched-out film elements are preferably positioned in the exact position, ie in register, relative to the injection molding station.
  • the positional accuracy has a tolerance of approximately 0 mm to 1 mm, preferably 0.25 mm to 0.75 mm, in particular in the feed direction, in particular where it is possible to use the at least one decorative film and / or the one or more punched-out film elements with at least an individual image decoration, which is to be applied in particular in a precisely positional manner to a molded part, preferably in a correspondingly positionally precise position by means of the register marks in the injection molding device.
  • the at least one decorative film and / or the one or more punched-out film elements may have at least one continuous decoration, such as a continuous pattern and / or wood grain and / or a single color, in particular where for such an endless -Decor accurate positioning of the at least one decorative film and / or the one or more punched-out film elements is not or essentially not necessary.
  • the IML molded part is trimmed at the edges before method step e17) and / or thermally deformed or reshaped before or after trimming. It is possible that the IML molded part is fixed in process step e17) by positioning pins arranged in the mold recess of the second tool half, in particular the positioning pins being designed in such a way that they are arranged on the back of the IML molded part, preferably in the backing film Engage recesses and fix the IML molding, in particular in such a way against lateral displacement.
  • the IML molded part is preferably lifted from the positioning pins and preferably in by the compressive force of the plastic compound against the at least one decorative film and / or the one or more punched-out film elements pressed the mold recess of the first tool half.
  • disturbing lateral movements of the IML molded part play no significant role, preferably because this displacement of the IML molded part occurs very quickly through the inflowing plastic compound without being guided by the positioning pins.
  • the IML molded part prefferably fixed in the mold recess of the second tool half in method step e17) by electrostatic force and / or by vacuum force.
  • ABS acrylonitrile-butadiene-styrene copolymer
  • PC polycarbonate
  • the backing film is an acrylonitrile-butadiene-styrene copolymer
  • the plastic compound and / or the backing film preferably comprises a polycarbonate, in particular polypropylene (PP) and / or polymethyl methacrylate (PMMA).
  • PP polypropylene
  • PMMA polymethyl methacrylate
  • further combinations are particularly possible, preferably if the backing film is liquefied at least in the surface area during the injection molding process and thereby preferably forms a material bond with the liquid plastic compound, which is preferably stable after cooling.
  • the decorative insert layer of the IML molding is radiation-hardened, in particular UV light-hardened.
  • the hardening preferably ensures that the decorative insert layer does not enter into any connection with the at least one decorative layer of the at least one decorative film, in particular no connection with an adhesive layer of the at least one decorative layer of the at least one decorative film.
  • a decorative insert may consist of an isocyanate-crosslinking acrylic protective varnish.
  • the IML molded part has a protective lacquer coating as the outer layer of the insert decorative layer, which is in particular designed such that it is not on the at least one decorative layer of the at least one decorative film, in particular not on the adhesive layer of the at least one, in method step e19) Decorative layer of the at least one decorative film adheres.
  • a protective lacquer coating can consist of polyurethane (PU), polyvinylidene fluoride (PVDF), polyamide or polyester or have it as a component.
  • the at least one decorative film and / or the one or more punched-out film elements are provided in the injection molding station, preferably with the at least one decorative film and / or the one or more punched out film elements has an at least regionally provided adhesive layer which is cut out in particular in the surface regions in which the at least one decorative film and / or the one or several punched-out film elements overlapped with the IML molding.
  • the at least one decorative film and / or the one or more punched-out film elements are provided in the injection molding station in such a way that the at least one decorative film and / or the one or more punched out Foil elements has a full-surface adhesive layer which is deactivated in particular in the surface areas in which the at least one decorative foil and / or the one or more punched-out foil elements overlaps, in particular with the IML molded part.
  • a partial coating can be provided, this coating preferably being designed in such a way that it preferably does not or only slightly adheres to the surface of the IML molded part during the injection molding process.
  • the coating can be, for example, a radiation-curing lacquer, a lacquer with a high pigment content or a powder coating.
  • the coating can be applied in liquid or solid form by means of hot stamping.
  • the coating can be applied, for example, by means of an inkjet printer which is arranged in particular in the area of the film feed to the injection molding station and, preferably in conjunction with the above-described positionally precise positioning of the at least one decorative film and / or the one or more punched-out film elements, preferably relative to the The injection molding station applies the coating to the at least one decorative film and / or the one or more punched-out film elements in a correspondingly precise manner.
  • the coating can further be, for example, a self-adhesive label or label, in particular with the possibility of an undesired adhesive connection between the at least a decorative film and / or the one or more punched-out film elements, in particular the adhesive layer of the at least one decorative film and / or the one or more punched-out film elements, and the surface of the IML molded part can be further reduced.
  • a self-adhesive label or label in particular with the possibility of an undesired adhesive connection between the at least a decorative film and / or the one or more punched-out film elements, in particular the adhesive layer of the at least one decorative film and / or the one or more punched-out film elements, and the surface of the IML molded part can be further reduced.
  • Contact and / or non-contact cleaning is preferably provided in method step e22), for example brush cleaning in conjunction with ionization. It is also possible that in method step e22) a combination of cleaning by ionization, blowing with turbulent compressed air and optional suction is provided.
  • the injection molding station has in particular more than one injection channel, in particular, this being advantageous in order to preferably press an IML molded part which has large dimensions evenly onto the at least one decorative film and / or the one or more punched-out film elements on the first mold half.
  • the decoration-side molding surface has a molding element for forming a design groove surrounding the IML molding, in particular wherein the design groove positional and / or shape inaccuracies of the IML molding relative to the decoration layer of the at least one decoration film and / or the one or more several punched-out film elements optically hidden.
  • the design groove is between 0 mm and 2 mm, preferably between 0.5 mm and 1.5 mm wide.
  • the radius of curvature of the plastic component after step e) is at least partially less than 1000 mm, in particular less than 200 mm, more preferably less than 100 mm and / or where the expansion of the plastic component is greater than or equal to 1%, in particular greater than or equal to 20% , preferably greater than or equal to 50%, particularly preferably greater than or equal to 300%.
  • a transfer film such as the at least one film comprising the at least one sensor film
  • a transfer film is preferably placed on an already deformed part, in particular a 3D or 2.5D deformed part, and hot stamped.
  • the transfer film is applied and adapted to the contour of the deformed part even before the hot stamping, in particular with the aid of vacuum suction and preheating, and then hot stamped with a correspondingly shaped and heated stamping die.
  • the carrier film absorbs tensile forces and can preferably protect the lacquer layers to be transferred from cracks and other damage during deformation.
  • a transfer film such as the at least one film comprising the at least one sensor film
  • a transfer film is preferably applied to a particularly flat, flat substrate, in particular with the carrier film then being peeled off.
  • the applied transfer layers preferably absorb the tensile forces of the deformation.
  • the at least one film and / or the at least one sensor film or the at least one film comprising the at least one sensor film in steps a), b) c), d) and / or e) at least one carrier film and / or has at least one transfer layer, in particular wherein at least one deep-drawing membrane, preferably in steps b), c) and / or e), is arranged between the at least one carrier film and the at least one transfer layer, and in particular wherein the at least one deep-drawing membrane is preferred is produced or applied by means of casting processes and / or by means of application with a slot nozzle and / or by means of screen printing, gravure printing, flexographic printing or inkjet printing or inkjet printing.
  • the at least one deep-drawn membrane is preferably designed to absorb tensile forces and thereby act as a deformation aid for the transfer layer, in particular the deep-drawn membrane protecting the transfer layer from cracks and other damage during the deformation.
  • a three-dimensional component is understood here to mean in particular a component that is deformed in three dimensions, that is to say in a length, width and height, for example a housing of a device.
  • the deep-drawn membrane is designed as a lacquer layer with a layer thickness in the range from 10 ⁇ m to 200 ⁇ m, preferably in the range from 20 ⁇ m to 100 ⁇ m, more preferably in the range from 25 ⁇ m to 75 ⁇ m.
  • the deep-drawing membrane is also preferably made of polyurethane, in particular where the polyurethane is solvent-based or an aqueous dispersion and / or is sufficiently deformable and / or is composed of various polymers, in particular selected from the following materials: Polyurethanes, for example polyester polyols, polyether polyols, polycarbonate polyols, Polyacrylate polyols, polyester polyols, and combinations of these polymers.
  • Polyurethanes for example polyester polyols, polyether polyols, polycarbonate polyols, Polyacrylate polyols, polyester polyols, and combinations of these polymers.
  • the deep-drawn membrane is transparent, translucent or opaque and is preferably colorless or colored.
  • an at least partial opacity and / or color makes it easier to detect the presence of the deep-drawn membrane on the decorated substrate or component.
  • the deep-drawn membrane prefferably has a decoration, for example a pattern or a motif, for example a logo or lettering.
  • the lettering can for example, include manufacturer information or instructions for use for the deep-drawn membrane and / or for the substrate or component.
  • the decoration or motif it is possible for the decoration or motif to be or is printed on the deep-drawn membrane.
  • the decoration or the motif preferably consists of the same material as the deep-drawn membrane or also of other materials, for example PVC or a different polyurethane than the deep-drawn membrane.
  • the deep-drawn membrane can be provided over the entire surface, in particular over the entire surface of the transfer film, or, alternatively, to be provided in certain areas.
  • the deep-drawn membrane can also have a handling aid on its edge for easier removal, for example at least one tab or the like.
  • the deep-drawing membrane prefferably be designed to be expandable by 200%, preferably by 500% to over 1500%, at a deep-drawing temperature in the range from 130 ° C. to 160 ° C. These values were determined in particular in standardized tensile tests (DIN 53504, ISO 37) using the Zwick Z005 tester from Zwick GmbH & Co. KG, Ulm. It is also possible for a first release layer to be arranged between the carrier film and the deep-drawing membrane and for a second release layer to be arranged between the deep-drawing membrane and the transfer layer.
  • PTFE polytetrafluoroethylene
  • surface-active substances such as silicones are particularly suitable as a release layer.
  • Thin layers of melamine-formaldehyde resin-crosslinked lacquers can also serve as a release layer.
  • first and / or the second release layer prefferably have a layer thickness of less than 1 ⁇ m, in particular less than 0.1 ⁇ m.
  • the detachment force of the carrier film from the deep-drawn membrane due to the first release layer arranged between the carrier film and the deep-drawn membrane is less than the force of the deep-drawn membrane from the transfer layer by a factor of 5 to 10, in particular due to the second release layer arranged between the deep-drawn membrane and the transfer layer .
  • the peel values were determined in particular with the aid of a tensile test machine (Zwick Z005 from Zwick GmbH & Co. KG, Ulm), preferably with the transfer film glued flat to the lower holder and the layer to be peeled then peeled off at a right angle by the tensile test.
  • the detachment forces were preferably determined using the load cell.
  • the transfer layer prefferably designed as a multilayer body formed from a plurality of transfer layers.
  • the detachment force of the deep-drawn membrane from the transfer layer is due to the difference between the deep-drawn membrane and the transfer layer arranged second release layer is 30% to 70% smaller than the adhesive force of the adjacent transfer layers to one another.
  • the transfer layer comprises a first transfer layer facing the deep-drawing membrane, a second transfer layer and a third transfer layer, in particular wherein the first and / or third transfer layer can be dispensed with.
  • the first transfer layer is designed as a protective layer.
  • the protective layer is further preferably designed as a protective lacquer made from a PMMA-based lacquer, which preferably has a layer thickness in the range from 2 ⁇ m to 5 ⁇ m. It is also possible that the protective lacquer consists of a radiation-curing dual cure lacquer, in particular this dual cure lacquer being thermally pre-crosslinked in a first step during and / or after application in liquid form and in a second step after processing the transfer film, in particular via high-energy radiation, preferably UV radiation, is postcrosslinked radically.
  • Dual cure lacquers of this type have, in particular, different polymers or oligomers which preferably comprise unsaturated acrylate or methacrylate groups, in particular with these functional groups being able to be crosslinked with one another by free radicals in the above-mentioned second step.
  • these polymers or oligomers also comprise at least two or more alcohol groups.
  • the alcohol groups can more preferably be crosslinked with multifunctional isocyanates or melamine-formaldehyde resins.
  • Various UV raw materials such as epoxy acrylates, polyether acrylates, polyester acrylates and, in particular, acrylate acrylates are particularly suitable as unsaturated oligomers or polymers.
  • TDI toluene-2,4-diisocyanate
  • HDI hexamethylene diisocyanate
  • IPDI-based isophorone diisocyanate
  • the melamine crosslinkers can in particular be fully etherified versions and / or imino types and / or Represent benzoguanamine representatives. Without a deep-drawing membrane, many of these protective lacquers would in particular not be sufficiently deformable and thus in particular not be sufficiently deep-drawable.
  • PMMA polymethyl methacrylate
  • PVDF polyvinylidene fluoride
  • the second transfer layer is designed as a single-layer or multi-layer decorative layer, in particular such a decorative layer preferably comprising one or more layers.
  • the decorative layer preferably has one or more colored layers, in particular colored lacquer layers. It is also possible for these colored layers to be colored differently, to be transparent and / or opaque and / or also to be separated from one another by one or more further layers, in particular transparent layers.
  • the colored layers can consist of a binder and colorants and / or pigments, in particular also optically variable pigments and / or metallic pigments.
  • the decorative layer can also comprise one or more reflective layers, which are preferably opaque, translucent and / or partially formed.
  • HRI high refractive index
  • aluminum, chromium or copper or alloys thereof come into consideration as metals.
  • ZnS or SiO2, for example, can be used as HRI layers.
  • the decorative layer can also have one or more optically active relief structures, in particular diffractive structures and / or holograms and / or have refractive structures and / or matt structures. In this case, at least one reflective layer is arranged directly on the relief structure, at least in regions.
  • the transfer film is produced in that the deep-drawing membrane is produced in several successive passes or from several layers.
  • a sufficient layer thickness can in particular be achieved.
  • the individual layers of the deep-drawing membrane can preferably be produced in the casting process, for example by means of application with a slot nozzle, or also by means of screen printing, gravure printing, flexographic printing or inkjet printing or inkjet printing.
  • the layer applied first to produce the deep-drawn membrane in particular a lacquer layer
  • the layer is dried in such a way that the layer is at least surface dry.
  • the layer can also dry out thoroughly.
  • a subsequent layer is then preferably applied.
  • the following layer is preferably applied in such a way that it dissolves the previously applied layer, preferably at least on the surface. It is advantageous if the two layers together form a homogeneous overall layer as a result of the partial dissolution.
  • a layer in particular a lacquer layer with a layer thickness in the range from about 0.1 ⁇ m to 50 ⁇ m, preferably in the range from 0.1 ⁇ m to 35 ⁇ m, more preferably in the range from 1 ⁇ m to 25 ⁇ m, is preferably applied in one pass.
  • a lacquer layer with a layer thickness in the range from about 0.1 ⁇ m to 50 ⁇ m, preferably in the range from 0.1 ⁇ m to 35 ⁇ m, more preferably in the range from 1 ⁇ m to 25 ⁇ m, is preferably applied in one pass.
  • the method is designed as an IMD method, wherein the at least one film and / or the at least one sensor film and / or the one or more film elements are inserted into an injection molding station and the at least one film is flinted or injection molded and / or the at least one sensor film and / or the one or more film elements are made with a plastic compound.
  • the carrier film comprised in the at least one film and / or in the at least one sensor film and / or in the one or more film elements is preferably separated from the carrier film in the at least one film and / or in the at least one sensor film and / or or peeled off transfer film comprised in the one or more film elements.
  • the deep-drawn membrane contained in the at least one film and / or in the at least one sensor film and / or in the one or more film elements can also be pulled off together with the transfer film. However, it is advantageous if the deep-drawn membrane remains on the transfer layer at least once.
  • the deep-drawn membrane serves in particular as a protective layer for the transfer layer. In particular, the transfer layer does not have to have its own protective layer.
  • the deep-drawn membrane is removed shortly before the coated component is used or only when the component is used. Among other things, this prevents the component from experiencing any damage at an early stage, even before it is used. It is advantageous here if the transfer layer has its own protective layer which protects the transfer layer from external influences when the component is used.
  • the method comprises lamination of a substrate, deep-drawing or reshaping of the laminated substrate and back-molding or injection molding of the deep-drawn or reshaped substrate with a thermoplastic material, the The carrier film of the transfer film is peeled off from the substrate after the substrate has been laminated, and wherein the deep-drawing membrane is peeled off from the back-molded or injection-molded substrate after the back-molding or injection molding.
  • the at least one film and / or the at least one sensor film preferably has polycarbonate (PC) as at least one thermoplastic material or as at least one thermoplastic.
  • PC polycarbonate
  • the at least one sensor film and / or the at least one film preferably has polyethylene terephthalate (PET) as at least one thermoplastic material or as at least one thermoplastic.
  • PET polyethylene terephthalate
  • the at least one film prefferably has a thickness of 250 ⁇ m to 3000 ⁇ m, in particular 300 ⁇ m to 2000 ⁇ m.
  • the at least one film prefferably has a tensile strength between 20 MPa and 100 MPa, in particular between 20 MPa and 80 MPa.
  • the at least one film is flexible at least in some areas or over the entire area.
  • the at least one film is preferably provided as a film composite which is flexible at least in some areas or over the entire area and / or which comprises one or more foils, in particular comprises one or more foils which are flexible at least in regions or over the entire area.
  • the at least one sensor film prefferably has a thickness of 25 gm to 150 gm, in particular 25 gm to 125 gm.
  • the at least one sensor film prefferably has a tensile strength between 150 MPa and 500 MPa, in particular between 200 MPa and 500 MPa.
  • the tensile strength of the at least one film is at most the tensile strength of the at least one sensor film multiplied by a factor of 2/3.
  • the thickness of the at least one film is at least the thickness of the at least one sensor film multiplied by a factor 1/2.
  • the at least one film is preferably at least partially or fully transparent, translucent or opaque and / or the at least one sensor film is at least partially transparent, translucent or opaque.
  • the thickness of the film can, however, also be thicker, for example the same size as the thickness of the sensor film. It is particularly advantageous if the thickness of the flexible film is greater than the thickness of the sensor film. In this case the sensor foil is thinner than the foil.
  • the film can, for example, be made thicker by a factor of 2, 3, 4 or 5 than the sensor film.
  • the at least one sensor film is particularly preferred by means of industrial lamination in at least one industrial lamination station and / or by means of industrial embossing and / or Cold lamination and / or gluing, in particular cold gluing, preferably in at least one hot stamping station and / or cold lamination station and / or gluing station, particularly preferably cold stamping station, to which at least one film is applied.
  • the device comprises one or more stations of the following further stations, in particular for carrying out one or more steps of steps b1) to b3):
  • Application station for applying at least one electrically conductive layer to the carrier substrate in such a way that the at least one electrically conductive layer forms an electrical functional structure in at least one functional area, the at least one electrically conductive layer forming at least one contacting structure for contacting the electrical functional structure in at least one contacting area ;
  • Application station for applying at least one bonding layer for the application of the at least one sensor film to the at least one film in such a way that the bonding layer, when viewed perpendicular to a plane spanned by the at least one carrier substrate, does not cover the at least one contact area at least in some areas or wherein the at least one bonding layer when viewed perpendicular to a plane spanned by the at least one carrier substrate is applied over the entire surface.
  • the at least one electrically conductive layer comprises at least one metal layer and / or one layer made of ITO and / or AZO and / or PEDOT and / or conductive lacquers, in particular wherein the device has one or more stations, preferably for implementation or several steps of steps b4a), b4b) and / or b5), the following further stations:
  • Application station for applying the at least one electrically conductive layer;
  • Structuring station for structuring the at least one electrically conductive layer by removing the at least one electrically conductive layer at least in certain areas;
  • Application station for applying the at least one electrically conductive layer in structured form.
  • At least one sensor film of the at least one sensor film preferably has one or more sensors and / or electrical components, in particular LEDs, in particular one or more touch sensors and / or one or more displays.
  • At least one sensor film of the at least one sensor film has one or more contact areas, in particular where one or more contact areas of the one or more contact areas are at least partially covered by no foil or layer, preferably where one or more contact areas of the one or more contact areas are on one of the at least one film facing away from the surface of the at least one sensor film of the at least one sensor film are arranged.
  • the at least one film and / or the at least one sensor film preferably has at least one decoration and / or at least one decoration film, at least in regions.
  • the forming station and / or the device for forming the at least one film comprising the at least one sensor film comprises one or more of the following forming stations, in particular selected from: deep-drawing station, thermoforming station, high-pressure forming station,
  • the at least one film and / or the at least one sensor film is preferably formed in the forming station in such a way that the radius of curvature of the at least a film and / or the at least one sensor film and / or the reshaped film body is at least partially smaller than 1000 mm, in particular smaller than 200 mm, more preferably smaller than 100 mm, and / or that the expansion of the at least one film and / or the at least one sensor film is greater than or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, particularly preferably greater than or equal to 300%.
  • the at least one punching station is preferably designed in such a way that the at least one punching station makes one or more holes or punchings in the one or more film elements, in particular where one or more holes of the one or more holes have the function of an injection channel for a plastic compound during injection molding in the have at least one injection molding station.
  • the device comprises one or more stations of the following further stations, in particular for carrying out one or more steps of steps e1) to e6):
  • - Feed station for providing at least one decorative film, which in particular has at least partially at least one opaque coating; Processing station for introducing at least one decorative element of at least one decoration into the at least one decorative film;
  • Insertion station for inserting the one or more punched-out film elements and the at least one decorative film into an injection molding station, the injection molding station comprising a first mold half and a second mold half, the first mold half and the second mold half, in particular in a closed state, a Injection molding cavity for molding at least one plastic body, wherein the at least one punched-out film element is attached to a first wall of the injection molding cavity and / or the at least one decorative film is attached to a second wall of the injection molding cavity, in particular wherein the second wall is arranged opposite the first wall; Injection molding station for injection molding the one or more punched out film elements and the at least one decorative film with a plastic compound to form a plastic component comprising the at least one plastic body in such a way that the one or more punched out film elements have a first surface of the plastic component and the at least one decorative film has a second surface of the plastic component form, in particular wherein the first surface is opposite the second surface; Demolding station for removing the plastic component.
  • the device includes the following additional station, in particular for performing step e7):
  • Processing station for inserting a first punched out film element of the one or more punched out film elements and / or a second punched out film element of the one or more punched out film elements into an injection molding station.
  • the device comprises one or more stations of the following stations, in particular for performing one or more steps of steps e8) to e10):
  • Injection molding station for injection molding the first punched-out film element and / or the second punched-out film element with a plastic compound to form a plastic component comprising the at least one plastic body in such a way that the first punched-out film element has a first surface of the plastic component and / or that the second punched-out film element has a second surface of the Plastic component
  • the injection molding station comprising a first tool mold half and a second tool mold half, wherein the first tool mold half and the second tool mold half, in particular in a closed state, form an injection molding cavity for molding at least one plastic body, the first punched-out film element on a first Wall of the injection molding cavity and / or the second punched-out film element on one second wall of the injection molding cavity is attached, in particular wherein the second wall is arranged opposite the first wall, in particular wherein the first surface is opposite the second surface; Demolding station for removing the plastic component.
  • the device prefferably have one or more stations of the following further stations, in particular to carry out one or more
  • Steps of steps e11) to e15 includes:
  • Injection molding station for injection molding a plastic compound through the injection channel into the injection molding cavity formed by the closed first and second mold halves, the at least one decorative film and / or the one or more film elements in the area enclosed by the raised edge area with the plastic compound, in particular without passage of Plastic compound is back-injected through the sealed gap, with a plastic component comprising the at least one plastic body being formed,
  • the injection molding station having a first mold half comprising a first mold recess and a second mold half, the first mold half and / or the second mold half has at least one injection channel, the first mold half and the second mold half, in particular in a closed state, forming an injection molding cavity for molding at least one plastic body;
  • the device comprises one or more stations of the following further stations, in particular for performing one or more steps of steps e16 to e21):
  • Insertion station for inserting the one or more punched out film elements and / or at least one decorative film into a first mold recess of a first mold half of an injection molding station and for fixing the one or more punched out film elements and / or the at least one decorative film;
  • Another insertion station for inserting an in-mold labeling molding or IML molding into a second mold recess of a second mold half of an injection molding station and fixing the IML molding;
  • Injection molding station which has a first tool mold half comprising a first mold recess and a second tool mold half comprising a second mold recess, the first tool mold half being designed to be movable and the second tool mold half to be non-movable;
  • Demolding station for removing the plastic component.
  • the plastic component after removal from the demolding station, has a radius of curvature and / or an expansion, the radius of curvature being at least regionally less than 1000 mm, in particular less than 200 mm, more preferably less than 100 mm, and / or where the expansion is greater or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, particularly preferably greater than or equal to 300%.
  • the device comprises one or more stations of the following further stations:
  • the Laminating station is preferably arranged after the punching station and further preferably comprises at least one heating element and one pressing element,
  • At least one lamination station in particular for connecting the reshaped and punched-out film elements to an end substrate, the lamination station preferably being arranged after the punching station and further preferably comprising at least one heating element and one pressing element.
  • the device can furthermore comprise a laminating station and / or a laminating station. These stations are intended for the connection of the formed and punched-out film elements on a final substrate.
  • the final substrate can be formed, for example, by a housing of a device to which the plastic component or the film element is to be applied.
  • the lamination station and / or lamination station enable the reshaped, punched-out film elements to be further processed by lamination or lamination.
  • the lamination station and / or lamination station thus represent alternative stations of the device to an injection molding station. However, a lamination station and / or lamination station in combination with an injection molding station can also be provided.
  • the at least one reshaped film and / or the at least one reshaped sensor film preferably has polycarbonate (PC) as at least one thermoplastic material or as at least one thermoplastic.
  • PC polycarbonate
  • the at least one reshaped sensor film and / or the at least one reshaped film preferably has polyethylene terephthalate (PET) as at least one thermoplastic material or as at least one thermoplastic.
  • PET polyethylene terephthalate
  • the at least one reshaped film has a thickness of 250 gm to 3000 gm, in particular 300 gm to 2000 gm.
  • the at least one reshaped film preferably has a tensile strength between 20 MPa and 100 MPa, in particular between 20 MPa and 80 MPa.
  • the at least one reshaped sensor film has a thickness of 25 gm to 150 gm, in particular 25 gm to 125 gm.
  • the at least one reshaped sensor film particularly preferably has a tensile strength between 150 MPa and 500 MPa, in particular between 200 MPa and 500 MPa.
  • the tensile strength of the at least one reshaped film prefferably at most the tensile strength of the at least one reshaped sensor film multiplied by a factor of 2/3.
  • the thickness of the at least one reshaped film is at least the thickness of the at least one reshaped sensor film multiplied by a factor of 1/2.
  • the thickness of the film can, however, also be thicker, for example the same size as the thickness of the sensor film. It is particularly advantageous if the thickness of the flexible film is greater than the thickness of the sensor film. In this case the sensor foil is thinner than the foil.
  • the film can, for example, be made thicker by a factor of 2, 3, 4 or 5 than the sensor film.
  • the plastic component and / or the at least one film and / or the at least one sensor film may have at least one decoration and / or at least one decoration film in certain areas.
  • the at least one decorative film and / or the one or more film elements have at least one decorative layer and / or at least one functional layer, in particular a layer with electrical functionality, in particular comprising one or more elements selected from touch sensors, antennas , Capacitor, coil, electromagnetic shielding, electrically non-conductive, metallic layers, in particular to avoid electrostatic charging, display, LED, electrical circuit, solar cell, at least one, in particular, post-curable protective layer and / or at least one barrier layer and / or at least one adhesion-promoting layer or adhesion-promoting layer .
  • At least one decorative layer of the at least one decorative layer consists of one or more or a combination of one or more decorative layers of the following decorative layers:
  • optically active surface relief in particular a diffractive and / or refractive surface relief, a holographic surface relief, a surface relief containing refractive structures, diffractive structures, in particular lens structures, microlens arrangements, microprisms, micromirrors, matt structures, in particular isotropic and / or anisotropic matt structures and / or a combination of any such structures;
  • high-index or low-index layers in particular with refractive indices which differ by more than +/- 0.2 from a refractive index of 1.5;
  • Liquid crystal layers in particular cholesteric and / or nematic liquid crystal layers
  • Thin-film layers which show an optically variable color change effect, in particular comprising an absorber layer, a dielectric spacer layer and an optional reflective layer or, alternatively, comprising a multiple sequence of alternating high-index and low-index transparent layers.
  • each individual decorative layer is designed over part of the area in the form of a pattern in order to preferably achieve a desired graphic decoration.
  • the decorative layers are preferably arranged in register relative to one another.
  • At least one functional layer of the at least one functional layer preferably consists of one or more or a combination of one or more functional layers of the functional layers listed below:
  • FIG. 1 shows a schematic representation of a method.
  • FIG. 2 shows a schematic representation of a method step as well as a film and a sensor film.
  • FIG. 3 shows a schematic representation of a method step and a film and a sensor film.
  • FIG. 4 shows a schematic representation of a method step and a film and a sensor film.
  • FIG. 5 shows a schematic representation of a method step and a station of a device as well as a film and a sensor film.
  • FIG. 6 shows a schematic representation of a method step and a station of a device as well as a film and a sensor film.
  • FIG. 7 shows a schematic representation of a plastic component.
  • 8 shows a schematic representation of a method step and a station of a device as well as a film and a sensor film.
  • FIG. 9 shows a schematic representation of a plastic component.
  • Fig. 1 shows a method for securing at least one plastic component 1, wherein the following steps a, b, c and d, preferably in the following sequence, preferably cyclically in the following sequence, are carried out in the method: a providing at least one film 2 and at least one sensor film 3, the at least one film 2 and / or the at least one sensor film 3 having at least one thermoplastic material or at least one thermoplastic, b applying the at least one sensor film 3 to at least a first area of a surface of the at least one film 2, c reshaping of the at least one film 2 comprising the at least one
  • Sensor film 3 wherein one or more reshaped film bodies 4 are formed, d punching out one or more film elements 4a formed from at least one second region of the one or more reshaped film bodies 4.
  • the at least one film 2 and / or the at least one sensor film 3 in step a has polycarbonate (PC) as at least one thermoplastic material or as at least one thermoplastic.
  • PC polycarbonate
  • the at least one sensor film 3 and / or the at least one film 2 in step a further preferably has polyethylene terephthalate (PET) as at least one thermoplastic material or as at least one thermoplastic.
  • PET polyethylene terephthalate
  • FIG. 2 shows a film 2, in particular when provided according to step a, which preferably has a thickness of 50 ⁇ m to 3000 ⁇ m, in particular from 300 gm to 2000 gm, and / or has a tensile strength between 20 MPa and 100 MPa, in particular between 20 MPa and 80 MPa.
  • the film 2 is preferably flexible at least in some areas or over the entire area.
  • the film 2 prefferably comprises one or more foils, in particular comprises one or more foils which are flexible at least in some areas or over the entire area.
  • FIG. 2 also shows a sensor film 3, in particular when provided according to step a, which preferably has a thickness of 25 gm to 150 gm, in particular 25 gm to 125 gm, and / or a tensile strength between 150 MPa and 500 MPa has, in particular between 200 MPa and 500 MPa.
  • FIG. 3 shows a film 2 and a sensor film 3, in particular after the sensor film 3 has been applied to an area of a surface of the film 2 in accordance with step b.
  • the at least one film 2 in step a preferably has a thickness of 50 gm to 3000 gm, in particular 300 gm to 2000 gm, and / or a tensile strength between 20 MPa and 100 MPa, in particular between 20 MPa and 80 MPa on.
  • the at least one film 2 is flexible at least in some areas or over the entire area.
  • the at least one film 2 is provided in step a as a film composite which is flexible at least in regions or over the entire area and / or which comprises one or more films, in particular comprises one or more films which are flexible at least in regions or over the entire surface.
  • the at least one sensor film 3 in step a has a thickness of 25 gm to 150 gm, in particular from 25 gm to 125 gm, and / or that the at least one sensor film 3 in step a has a tensile strength between 150 MPa and 500 MPa, in particular between 200 MPa and 500 MPa.
  • the tensile strength of the at least one film 2 in step a and / or b is at most the tensile strength of the at least one sensor film 3 in step a and / or b multiplied by a factor 2/3 and / or that the Thickness of the at least one film 2 in step a and / or b is at least the thickness of the at least one sensor film 3 in step a and / or b multiplied by a factor 1/2.
  • the thickness of the film 2 is greater than the thickness of the sensor film 3.
  • the thickness of the at least one film 2 in step a and / or b is at least the thickness of the at least one sensor film 3 in step a and / or b multiplied by a factor of approx. 3.
  • the at least one film 2 in step a is at least partially or fully transparent, translucent or opaque and / or that the at least one sensor film 3 in step b is at least partially transparent, translucent or opaque.
  • the at least one sensor film 3 is preferably applied to the at least one film 2 in step b by means of industrial lamination and / or by means of industrial embossing and / or cold lamination and / or gluing, in particular cold gluing.
  • step b comprises one or more steps of the following further steps, in particular for positioning the at least one sensor film 3 and / or for applying the at least one sensor film 3 to the at least one Foil 2, in particular the following further steps being carried out in the following sequence, preferably the following further steps being carried out in a cyclical sequence: b1 providing at least one carrier substrate 30; b2 applying at least one electrically conductive layer 31 to the
  • Carrier substrate 30 the at least one electrically conductive layer 31 forming an electrical functional structure in at least one functional area 32, the at least one electrically conductive layer 31 forming at least one contacting structure for contacting the electrical functional structure in at least one contacting area 34; b3 application of at least one flaft communication layer 35 for applying the at least one sensor film 3 to the at least one film 2 in such a way that the flaft communication layer 35, when viewed perpendicular to a plane spanned by the at least one carrier substrate 30, does not cover the at least one contact area 34 at least in some areas, or where the at least one flaft mediation layer 35 is applied over the full area when viewed perpendicular to a plane spanned by the at least one carrier substrate 30.
  • step b2 and / or b3 the at least one electrically conductive layer 31 at least one metal layer and / or one layer made of ITO and / or AZO and / or PEDOT and / or conductive lacquers, in particular where step b comprises one or more steps of the following further steps, in particular wherein the following further steps are carried out in the following sequence, preferably wherein the following further steps are carried out in a cyclical sequence: b4a application of the at least one electrically conductive layer in one or more sub-steps; b4b structuring of the at least one electrically conductive layer by at least regionally removing the at least one electrically conductive layer in one or more sub-steps; and / or b5 applying the at least one electrically conductive layer in structured form in one or more sub-steps.
  • the at least one sensor film of the at least one sensor film 3 in step b has one or more sensors and / or electrical components, in particular LEDs, in particular one or more touch sensors and / or one or more displays.
  • At least one sensor film of the at least one sensor film 3 preferably has one or more contact areas in step b, in particular one or more contact areas of the one or more contact areas not being covered at least in some areas by any foil or layer, preferably one or more contact areas of the one or more contact areas a plurality of contact areas are arranged on a surface of the at least one sensor film of the at least one sensor film 3 facing away from the at least one film 2.
  • the at least one film 2 in step a and / or the at least one sensor film 3 in step b and / or the at least one film 2 and / or the at least one sensor film 3 in a further step, at least in some areas, has at least one decoration and / or at least one decorative film 5.
  • the reshaping of the at least one film 2 comprising the at least one sensor film 3 in step c is preferably carried out by means of one or more reshaping processes, in particular selected from the following reshaping processes: deep drawing, thermoforming, high pressure forming, injection molding processes.
  • the radius of curvature of the at least one film 2 and / or the at least one sensor film 3 after step c is preferably less than 1000 mm, in particular less than 200 mm, more preferably less than 100 mm and / or the expansion of the at least one film 2 after step c and / or the at least one sensor film 3 after step c is greater than or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, particularly preferably greater than or equal to 300%.
  • the method and / or step d to include the following further step: e Injection molding of the one or more punched-out film elements 4a.
  • step d one or more holes or punchings are made in the one or more film elements 4a, in particular with one or more holes of the one or more holes having the function of an injection channel for a plastic compound during injection molding in step e.
  • step e comprises one or more steps of the following further steps, in particular wherein the following further steps are carried out in the following sequence, preferably wherein the following further steps are carried out in a cyclical sequence: e1 providing at least one decorative film 5a which in particular has at least partially at least one opaque coating 50; e2 introducing at least one decorative element of at least one decoration into the at least one decorative film 5a by processing in at least one processing station; e3 Insertion of the one or more punched-out film elements 4a and the at least one decorative film 5a in an injection molding station 15, the injection molding station 15 comprising a first mold half 15a and a second mold half 15b, the first mold half 15a and the second mold half 15b, in particular in a closed state, forms an injection molding cavity 15c for molding at least one plastic body 7a, the at least one punched-out film element 4a on a first wall 15aa of the injection molding cavity 15c and / or the at least one decorative film 5a on a second Wall 15bb of
  • step e comprises one or more steps of the following further steps, in particular wherein the following further steps are carried out in the following sequence, preferably wherein the following further steps are carried out in a cyclical sequence: e7 inserting a first punched out Foil element 4aa of the one or more punched out foil elements 4a and / or a second punched out foil element 4ab of the one or more punched out foil elements 4a in an injection molding station 16, wherein the injection molding station 16 comprises a first mold half 16a and a second mold half 16b, the first mold half 16a and the second mold half 16b, in particular in a closed state, a Form injection molding cavity 16c for molding at least one plastic body 7b, wherein the first punched out film element 4aa is attached to a first wall 16aa of the injection molding cavity 16c and / or the second punched out film element 4ab is attached to a second wall 16bb of the injection molding cavity 16c, in particular wherein the second wall 16bb of the first wall
  • steps d and / or e are carried out using an injection molding station 17, the injection molding station 17 having a first mold half 17a comprising a first mold recess 170a and a second mold half 17b, the first mold half 17a and 17a / or the second mold half 17b has at least one injection channel 17d, the first mold half 17a and the second mold half 17b, in particular in a closed state, forming an injection molding cavity 17c for molding at least one plastic body 7c, steps d and / or e comprises one or more steps of the following further steps, in particular wherein the following further steps are in the be carried out in the following sequence, preferably with the following further
  • Steps are carried out in a cyclical sequence: e11 Provision of the one or more punched-out film elements 4a and / or at least one section of at least one decorative film 5b on the first mold half 17a and / or on the second mold half 17b in such a way that when the first mold half is closed 17a and second mold half 17b, the one or more punched-out film elements 4a and / or the at least one decorative film 5b rest on an end face 17aa of the raised edge region 170b delimiting the first mold recess 170a and surrounding the first mold recess 170a; e12 closing the first mold half 17a and the second
  • Tool mold half 17b so far that in the area of the end face 17aa of the raised edge region 170b between the first tool mold half 17a and the second tool mold half 17b there is a gap between the end face 17aa of the raised edge region 170b of the first tool mold half 17a and the corresponding end face 17bb of the second tool mold half 17b is formed at least over a partial area, and the gap is sealed by the one or more punched-out foil elements 4a squeezed in the area of the gap and / or the at least one interposed decorative foil 5b squeezed in the area of the gap; e13 Injection molding of a plastic compound through the injection channel 17d into the injection molding cavity 17c formed by the closed first and second mold halves 17a, 17b, the at least one decorative film 5b and / or the one or more film elements 4a in the area enclosed by the raised edge region 170b the plastic compound is back-injected, in particular without plastic compound passing through the sealed gap, a plastic component 1 comprising the at least one plastic body 7c being formed
  • step e is carried out using an injection molding station 18, the injection molding station 18 having a first mold half 18a comprising a first mold recess 180a and a second mold half 18b including a second mold recess 180b, the first mold half 18a movable and the second mold half 18b are not movable, wherein step e comprises one or more steps of the following further steps, in particular wherein the following further steps are carried out in the following sequence, preferably with the following further steps being carried out in a cyclical sequence e16 inserting the one or more punched-out film elements 4a and / or at least one decorative film 5c into the first mold recess 180a of the first mold half 18a and fixing the one or more punched-out film elements 4a and / or the at least one decorative film 5c; e17 inserting an in-mold labeling molding 6 or IML molding 6 into the second mold recess of the second mold half 18b and fixing the IML molding 6, the IML molding 6 comprising an insert decorative layer 50
  • Tool mold half 18a away from the second tool mold half 18b, in particular after a cooling time of the at least one plastic body 7d contained in the plastic component 1; e21 Removal of the plastic component 1.
  • the radius of curvature of the plastic component 1 after step e is at least partially less than 1000 mm, in particular less than 200 mm, more preferably less than 100 mm and / or the expansion of the plastic component 1 after step e is greater than or equal to 1%, in particular greater or equal to 20%, preferably greater than or equal to 50%, particularly preferably greater than or equal to 300%.
  • a device 10 for positioning at least one plastic component 1, in particular for carrying out a method of the above methods preferably has one or more stations of the following stations:
  • Feed station 11 which is designed in such a way that the at least one feed station 11 provides at least one film 2 and at least one sensor film 3, the at least one film 2 and / or the at least one sensor film 3 at least one thermoplastic material or at least one thermoplastic having,
  • - Application station 12 which is designed such that the at least one application station 12 applies the at least one sensor film 3 to at least a first area of a surface of the at least one film 2
  • - Forming station 13 which is designed in such a way that the at least one forming station 13 forms the at least one film 2 comprising the at least one sensor film 3 to form at least one formed film body 4,
  • the at least one film 2 and / or the at least one sensor film 3 preferably has polycarbonate (PC) as at least one thermoplastic material or as at least one thermoplastic.
  • PC polycarbonate
  • the at least one sensor film 3 and / or the at least one film 2 further preferably has polyethylene terephthalate (PET) as at least one thermoplastic material or as at least one thermoplastic.
  • PET polyethylene terephthalate
  • the sensor film 3 preferably has one or more sensors, in particular one or more touch sensors and / or one or more displays or displays.
  • the sensor film 3 preferably has one or more contact areas, in particular with one or more contact areas of the one or more contact areas not being covered at least in some areas by any foil or layer, preferably with one or more contact areas of the one or more contact areas on one facing away from the foil 2 Surface of the at least one sensor film of the sensor film 3 are arranged.
  • the tensile strength of the film 2 is at most the tensile strength of the sensor film 3 multiplied by a factor 2/3 and / or that the thickness of the film 2 is at least the thickness of the sensor film 3 multiplied by a factor 1/2.
  • the film 2 is at least partially or fully transparent, translucent or opaque and / or the sensor film 3 is at least partially transparent, translucent or opaque.
  • the sensor film 3 by means of hot lamination in at least one hot lamination station and / or by means of hot lamination and / or by means of hot embossing and / or cold lamination and / or gluing, in particular cold gluing, in particular in at least one hot stamping station and / or cold lamination station and / or gluing station, is applied to the film 2.
  • the device 10 comprises one or more stations of the following further stations, in particular for forming the sensor film 3:
  • Application station for applying at least one electrically conductive layer 31 to the carrier substrate 30 in such a way that the at least one electrically conductive layer 31 forms an electrical functional structure in at least one functional area 32, the at least one electrically conductive layer 31 in at least one contacting area 34 having at least one contacting structure forms for contacting the electrical functional structure;
  • Application station for applying at least one bonding layer 35 for the application of the at least one sensor film 3 to the at least one film 2 in such a way that the bonding layer 35, when viewed perpendicular to a plane spanned by the at least one carrier substrate 30, does not cover the at least one contact area 34 at least in some areas or wherein the at least one adhesion promoting layer 35 is applied over the full area when viewed perpendicular to a plane spanned by the at least one carrier substrate 30.
  • the at least one electrically conductive layer 31 comprises at least one metal layer and / or one layer made of ITO and / or AZO and / or PEDOT and / or conductive lacquers, in particular the device 10 having one or more stations, preferably to carry out one or more steps of steps b4a, b4b and / or b5, comprising the following further stations:
  • Application station for applying the at least one electrically conductive layer
  • Structuring station for structuring the at least one electrically conductive layer by removing the at least one electrically conductive layer at least in certain areas
  • Application station for applying the at least one electrically conductive layer in structured form.
  • the film 2 and / or the sensor film 3 prefferably have at least one decoration and / or at least one decoration film 5, at least in regions.
  • the forming station 13 and / or the device 10 for forming the at least one film 2 comprising the at least one sensor film 3 preferably has one or more of the following forming stations, in particular selected from: deep-drawing station, thermoforming station, high-pressure forming station,
  • the film 2 and / or the sensor film 3 is formed in the forming station 13 in such a way that the radius of curvature of the film 2 and / or the sensor film 3 and / or the formed film body 4 is at least in some areas less than 1000 mm, in particular less than 200 mm, more preferably less than 100 mm, and / or that the expansion of the film 2 and / or the sensor film 3 is greater than or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, particularly preferred is greater than or equal to 300%.
  • FIG. 4 shows a reshaped film body 4, which has been reshaped in particular according to step c, which comprises the sheet 2 shown in FIGS. 2 and 3 as reshaped sheet 2 and the sensor sheet 3 shown in FIGS. 2 and 3 as reshaped sensor sheet 3 .
  • FIG. 5 shows the reshaped film body 4 shown in FIG. 4, from which a film element 4a is punched in particular according to step d from a second area 141 from the reshaped film body 4, in particular with a punching tool 14a of a punching station 14 being used .
  • the device 10 preferably has at least one injection molding station 15 which is designed such that the at least one injection molding station 15 back-injects the at least one punched-out film element 4a.
  • the at least one punching station 14 is preferably designed such that the at least one punching station 14 introduces one or more holes or punchings into the one or more film elements 4a, in particular with one or more holes of the one or more holes performing the function of an injection channel for a plastic compound Have injection molding in the at least one injection molding station 15.
  • FIG. 6 shows the stamped-out film body 4a shown in FIG. 5, which is located in a second tool half 15b of an injection molding station 15.
  • the injection molding station 15 further comprises a first tool half 15a.
  • a plastic body 7 In the injection molding station 15, according to step e, a plastic body 7.
  • FIG. 8 shows the stamped-out film body 4a shown in FIG. 5, which is located in a second tool half 15b of an injection molding station 15.
  • the injection molding station 15 further comprises a first tool half 15a.
  • a plastic body 7 is injection molded according to step e.
  • the device 10 comprises one or more stations of the following further stations:
  • - Feed station for providing at least one decorative film 5a, which in particular has at least partially at least one opaque coating 50; Processing station for introducing at least one decorative element of at least one decoration into the at least one decorative film 5a;
  • Insertion station for inserting the one or more punched-out film elements 4a and the at least one decorative film 5a into an injection molding station 15, the injection molding station 15 comprising a first mold half 15a and a second mold half 15b, the first mold half 15a and the second mold half 15b, in particular in a closed state, an injection molding cavity 15c forms for molding at least one plastic body 7a, the at least one punched-out film element 4a being attached to a first wall 15aa of the injection molding cavity 15c and / or the at least one decorative film 5a being attached to a second wall 15bb of the injection molding cavity 15c , in particular wherein the second wall 15bb is arranged opposite the first wall 15aa;
  • Injection molding station for injection molding the one or more punched out film elements 4a and the at least one decorative film 5a with a plastic compound for forming a plastic component 1 comprising the at least one plastic body 7a in such a way that the one or more punched out film elements 4a have a first surface of the plastic component 1 and the at least one Decorative film 5a form a second surface of the plastic component 1, in particular wherein the first surface is opposite the second surface;
  • Demolding station for removing the plastic component 1. It is also possible that the device 10 comprises the following further station: Processing station for inserting a first punched-out film element 4aa of the one or more punched-out film elements 4a and / or a second punched-out film element 4ab of the one or more punched-out film elements 4a in an injection molding station.
  • the device 10 comprises the following further station: Injection molding station 16 for injection molding the first punched-out film element 4aa and / or the second punched-out film element 4ab with a plastic compound for forming a plastic component 1 comprising the at least one plastic body 7b in such a way that the first punched out film element 4aa a first surface of the plastic component 1 and / or that the second punched out film element 4ab a second surface of the plastic component 1, wherein the injection molding station 16 comprises a first mold half 16a and a second mold half 16b, the first mold half 16a and the second Mold half 16b, in particular in a closed state, form an injection molding cavity 16c for molding at least one plastic body 7b, the first punched-out film element 4aa being punched out on a first wall 16aa of the injection molding cavity 16c and / or the second te film element 4ab is attached to a second wall 16bb of the injection molding cavity 16c, in particular wherein the second wall 16b
  • Demolding station for removing the plastic component 1.
  • the device 10 comprises one or more stations of the following further stations:
  • - Feed station for providing the one or more punched-out film elements 4a and / or at least a section of at least one decorative film 5b on the first mold half 17a and / or on the second Tool mold half 17b in such a way that when the first tool mold half 17a and the second tool mold half 17b are closed, the one or more punched-out film elements 4a and / or the at least one decorative film 5b on an end face 17aa of the raised edge area delimiting the first mold recess 170a and surrounding the first mold recess 170a 170b rest;
  • Injection molding station for injection molding a plastic compound through the injection channel 17d into the injection molding cavity 17c formed by the closed first and second mold halves 17a, 17b, the at least one decorative film 5b with the plastic compound in the area enclosed by the raised edge area 170b, in particular without the passage of plastic compound through the sealed gap, is back-injected, wherein a plastic component 1 comprising the at least one plastic body 7c is formed, wherein the injection molding station 17 has a first mold half 17a comprising a first mold recess 170a and a second mold half 17b, the first mold half 17a and / or the second mold half 17b has at least one injection channel 17d, the first mold half 17a and the second mold half 17b, in particular in a closed state, an injection molding cavity 17c for molding at least one plastic form ff body 7c;
  • Demolding station for removing the plastic component 1.
  • the device 10 comprises one or more stations of the following further stations:
  • Insertion station for inserting the one or more punched out film elements 4a and / or at least one decorative film 5c into a first mold recess 180a of a first mold half 18a of an injection molding station 18 and for fixing the one or more punched out film elements 4a and / or the at least one decorative film 5c;
  • Another insertion station for inserting an in-mold labeling molding 6 or IML molding 6 into a second mold recess of a second mold half 18b of an injection molding station 18 and fixing the IML molding 6;
  • Injection molding station 18 which has a first mold half 18a comprising a first mold recess 180a and a second mold half 18b comprising a second mold recess 180b, the first mold half 18a being movable and the second mold half 18b non-movable;
  • Demolding station for removing the plastic component 1.
  • the plastic component 1 has a radius of curvature and / or an expansion, the radius of curvature being at least regionally less than 1000 mm, in particular less than 200 mm, more preferably less than 100 mm, and / or where the expansion is greater than or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, particularly preferably greater than or equal to 300%.
  • FIG. 7 shows a plastic component 1 in cross section, in particular produced by a method of the above methods, preferably produced by a device of the above devices, the plastic component 1 being punched out (see, for example, FIG. 4) and back molded (see, for example, FIG. 8)
  • Foil element 4b comprising a reshaped sheet 2a and a reshaped sensor sheet 3a, the at least one reshaped sheet 2a and / or the at least one reshaped sensor sheet 3a having at least one thermoplastic material or at least one thermoplastic.
  • the plastic component 1 shown in FIG. 7 comprises a plastic body 7 on the surface facing away from the reshaped sensor film 3a, in particular the plastic body 7 being formed in method step e by injection molding in an injection molding station.
  • the at least one reshaped film 2a and / or the at least one reshaped sensor film 3a preferably has polycarbonate (PC) as at least one thermoplastic material or as at least one thermoplastic.
  • PC polycarbonate
  • the at least one reshaped sensor film 3a and / or the at least one reshaped film 2a further preferably has polyethylene terephthalate (PET) as at least one thermoplastic material or as at least one thermoplastic.
  • PET polyethylene terephthalate
  • the plastic body 1 shown in FIG. 7 has, in at least four areas in particular, a radius of curvature of less than 1000 mm, in particular less than 200 mm, more preferably less than 100 mm, and / or an expansion of greater than or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, particularly preferably greater than or equal to 300%.
  • the reshaped film 2a shown in FIG. 7 preferably has a thickness of 250 ⁇ m to 3000 ⁇ m, in particular 300 ⁇ m to 2000 ⁇ m, and / or a tensile strength between 20 MPa and 100 MPa, in particular between 20 MPa and 80 MPa having.
  • the reshaped sensor film 3a shown in FIG. 7 also preferably has a thickness of 25 ⁇ m to 150 ⁇ m, in particular 25 ⁇ m to 125 ⁇ m, and / or a tensile strength between 150 MPa and 500 MPa, in particular between 200 MPa and 500 MPa on.
  • the tensile strength of the reshaped film 2a shown in FIG. 7 is in particular at most the tensile strength of the reshaped sensor film 3a shown in FIG. 7 multiplied by a factor 2/3.
  • the thickness of the reshaped film 2a shown in FIG. 7 is preferably at least the thickness of the reshaped sensor film 3a shown in FIG. 7 multiplied by a factor 1/2.
  • the thickness of the film 2 is greater than the thickness of the sensor film 3.
  • the thickness of the at least one film 2 in step a and / or b is at least the thickness of the at least one sensor film 3 in step a and / or b multiplied by a factor of approx. 3.
  • FIG. 9 shows the plastic component 1 shown in FIG. 7, except that the plastic component 1 comprises a film element 4c and which has a decorative film 5 on the surface of the plastic body 7 facing away from the reshaped sensor film 3a.
  • plastic component 1 and / or the reshaped foil 2a and / or the reshaped sensor foil 3a prefferably have at least one decoration and / or at least one decoration foil 5 in some areas.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un procédé de production d'au moins un composant en matière plastique (1). Dans ledit procédé, les étapes suivantes, de préférence dans la séquence suivante, de préférence de manière cyclique dans la séquence suivante, sont réalisées : a) l'utilisation d'au moins un film (2) et d'au moins un film de capteur (3), le ou les films (2) et/ou le ou les films de capteur (3) comprenant au moins un matériau thermoplastique ou au moins un polymère thermoplastique ; b) l'application du ou des films de capteur (3) à au moins une première région d'une surface du ou des films (2) ; c) la mise en forme du ou des films (2) comprenant le ou les films de capteur (3), un ou plusieurs corps de film mis en forme (4) étant formés ; d) le découpage au poinçon d'un ou de plusieurs éléments de film (4a) formés à partir d'au moins une seconde région du ou des corps de film mis en forme (4). L'invention concerne également un dispositif (10) et un composant en matière plastique (1).
EP20789909.7A 2019-10-09 2020-10-07 Procédé et dispositif de production d'un composant en matière plastique, et composant en matière plastique Pending EP4041522A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019127108.8A DE102019127108A1 (de) 2019-10-09 2019-10-09 Verfahren und Vorrichtung zur Herstellung eines Kunststoffbauteils sowie ein Kunststoffbauteil
PCT/EP2020/078040 WO2021069466A1 (fr) 2019-10-09 2020-10-07 Procédé et dispositif de production d'un composant en matière plastique, et composant en matière plastique

Publications (1)

Publication Number Publication Date
EP4041522A1 true EP4041522A1 (fr) 2022-08-17

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DE102022117446A1 (de) 2022-07-13 2024-01-18 Bayerische Motoren Werke Aktiengesellschaft Spritzgussbauteil für ein Kraftfahrzeug, Verfahren zur Prüfung eines Spritzgussbauteils, Verfahren zum Herstellen eines Spritzgussbauteils und Kraftfahrzeug
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WO2021069466A1 (fr) 2021-04-15
KR20220079625A (ko) 2022-06-13
US20230024618A1 (en) 2023-01-26
CN114746241A (zh) 2022-07-12

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