EP4041487A1 - Dispositif d'ajustement pour un système optique d'usinage par faisceau de bessel et procédé correspondant - Google Patents

Dispositif d'ajustement pour un système optique d'usinage par faisceau de bessel et procédé correspondant

Info

Publication number
EP4041487A1
EP4041487A1 EP20793572.7A EP20793572A EP4041487A1 EP 4041487 A1 EP4041487 A1 EP 4041487A1 EP 20793572 A EP20793572 A EP 20793572A EP 4041487 A1 EP4041487 A1 EP 4041487A1
Authority
EP
European Patent Office
Prior art keywords
workpiece
axis
imitation
focus zone
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20793572.7A
Other languages
German (de)
English (en)
Inventor
Daniel FLAMM
Jonas Kleiner
Julian Hellstern
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trumpf Laser und Systemtechnik Se
Original Assignee
Trumpf Laser und Systemtechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trumpf Laser und Systemtechnik GmbH filed Critical Trumpf Laser und Systemtechnik GmbH
Publication of EP4041487A1 publication Critical patent/EP4041487A1/fr
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0025—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration
    • G02B27/0068—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration having means for controlling the degree of correction, e.g. using phase modulators, movable elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0075—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means for altering, e.g. increasing, the depth of field or depth of focus
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/62—Optical apparatus specially adapted for adjusting optical elements during the assembly of optical systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks

Definitions

  • the present invention relates to a device for adjusting the processing optics of a laser processing machine, which in particular forms a Bessel beam focus zone in a workpiece to be processed.
  • the invention also relates to a system for adjusting processing optics and a method for adjusting processing optics in a laser processing machine.
  • Exemplary optical systems for beam shaping with regard to the formation of Bessel beams are, for. B. in WO 1216/079062 A1 disclosed.
  • Underlying optical concepts can carry out phase imprinting on an incident laser beam in so-called processing optics for beam shaping.
  • This phase imprint can take into account a correction of aberrations, as they are z. B. caused by a workpiece to be machined.
  • inclined or cylindrical glass workpieces lead to phase contributions that must be taken into account in the phase imprint, since otherwise the Bessel beam in the workpiece will not be formed in the intended way.
  • One aspect of this disclosure is based on the object of simplifying the adjustment of processing optics in a laser processing machine.
  • a further task is to be able to obtain information about a Bessel beam focus zone formed in particular in the material, such as its length.
  • a device for adjusting processing optics according to claim 1 comprises the processing optics being designed to shape a laser beam in the laser processing machine and to focus it along an incident beam axis in such a way that a processing laser beam has a preset Bessel beam focus zone can train machining workpiece.
  • the device comprises: an entry area for receiving the processing laser beam, a focus zone formation area which is provided to enable a measurement focus zone to be formed by the received processing laser beam along a target axis, and an imaging unit which has a lens and a detector surface , wherein the lens images measurement laser radiation, which leaves the focus zone formation area after the formation of the measurement focus zone, along an imaging axis predetermined by the target axis onto the detector surface.
  • the disclosure comprises a system for adjusting processing optics in a laser processing machine, the processing optics being designed to generate a preset Bessel beam focus zone in an essentially transparent workpiece by impressing a phase profile on a laser beam.
  • the system comprises the laser processing machine, which has a laser beam source for generating the laser beam and the processing optics, and a device as described above, which comprises an imaging unit and optionally an imitation workpiece.
  • the processing optics have a beam-shaping optics unit and a focusing lens unit, the beam-shaping optics unit for machining the workpiece, which has a workpiece surface, the geometry of which corresponds to the geometry of an entry surface of the imitation workpiece, and wherein the beam-shaping optics unit is formed together with the Focussing lens unit is set up for beam shaping of the laser beam into a processing laser beam which propagates along an incident beam axis and which can lead to the formation of the preset Bessel beam focus zone in the workpiece to be processed along a target axis.
  • the preset Bessel beam focus zone extends from a point of impact on the, in particular inclined or curved, workpiece surface into the workpiece to be machined along a target axis.
  • the laser processing machine further comprises a first holder in which the steel-forming optical unit is held so that it can be positioned laterally with respect to the laser beam.
  • the device is positioned and set up with respect to the processing optics in such a way that the processing laser beam which enters the device along an incident beam axis, as Messlaserstrah treatment in the far field impinges on a detector surface of the imaging unit.
  • the disclosure comprises a method for adjusting a processing optics in a laser processing machine, the processing optics having a beam-shaping optics unit and a focusing lens unit, the optics unit being positioned in the beam path of a laser beam of the laser processing machine with a first holder and for phase imprinting a lateral beam profile of the laser beam is formed, so that when the processing optics are correctly adjusted with the focusing lens unit, a Bessel beam focus zone is generated in the workpiece for a processing laser beam impinging at a predetermined point of incidence at a predetermined angle of incidence.
  • the procedure consists of the following steps:
  • the device described herein which comprises an imaging unit and optionally an imitation workpiece, can optionally be set in order to image the far field of the measuring laser radiation on the analysis plane.
  • the disclosure comprises a method for measuring a Bes sel beam focus zone, in particular a length of a Bessel beam focus zone, which is to be generated in a workpiece with a laser processing machine, the laser processing machine having processing optics with a beam-shaping optics unit and a focus sierlinsenech, wherein the optical unit for a phase imprint on a lateral Beam profile of a laser beam is designed so that a pre-set Bessel beam focus zone is generated along a target direction for a machining laser beam emerging from the focusing lens unit and impinging at a predetermined point of incidence at a predetermined angle of incidence in the workpiece.
  • the procedure consists of the following steps:
  • the device described herein which comprises an imaging unit and optionally an imitation workpiece, can optionally be set to focus the measuring laser radiation on the analysis plane.
  • the lens and the detector surface can be arranged along the imaging axis and the detector surface can be part of a camera.
  • the lens can be assigned a lens axis which runs parallel to the imaging axis and / or the detector surface extends in a plane to which the imaging axis runs perpendicular.
  • the imaging unit can furthermore have a stop for mounting an imitation workpiece, the stop defining a stop surface in a predetermined orientation to the imaging axis.
  • the stop surface can in particular be provided for an orthogonal alignment of a planar exit upper surface of the imitation workpiece to the target axis.
  • the imaging unit may comprise:
  • a translation unit for the common displacement of the lens and the detector surface along the imaging axis can be set up to set a distance between the respective component and the focus zone formation area, in particular to a stop for mounting an imitation workpiece.
  • the device can furthermore have a rotation unit which is designed for the rotatable mounting of the imaging unit in order to provide a rotation of the imaging axis with respect to the incident beam axis.
  • the device can furthermore have an imitation workpiece as an adjustment element, which has an entry surface and a planar exit surface and is arranged in the focus zone formation area in such a way that
  • the entry surface at a point of impact at which the machining laser beam strikes the imitation workpiece along the axis of incidence is arranged in relation to the axis of incidence in such a way that the target axis running through the imitation workpiece runs in a predetermined direction, in particular through the preset Bessel beam focus zone is given.
  • the imaging unit can also have a stop for mounting the imitation workpiece, the stop defining a stop surface for mounting the imitation workpiece in a position in which the exit surface is oriented perpendicular to the imaging axis.
  • the alignment of the nominal axis to the axis of the incident beam can be given by a refractive index of refraction of the imitation workpiece and in particular can be defined with respect to a point of impact of the laser beam along the axis of the incident beam.
  • the entry surface can form a cylinder jacket shape in sections.
  • the planar exit surface can run perpendicular to the incident ray axis.
  • the nominal axis can run orthogonally or non-orthogonally to a tangential plane at the point of impact of the entry surface.
  • the incident beam can lenachse optionally extend at an angle in the range from 0 ° to 50 °, in particular in the range from 20 ° to 40 °, to a normal vector of the tangential plane.
  • the imaging unit in a first operating setting can be set up to capture a transverse beam profile of the measuring laser radiation in the far field, and in a second operating setting it can be set up, by positioning the lens and the camera, to start or end a, in particular in the imitation workpiece, formed measuring focus zone to be mapped onto the detector surface.
  • the imitation workpiece of the device can be positioned and aligned with respect to the processing optics in such a way that the machining laser beam that falls on the imitation workpiece along the axis of incidence emerges as the measuring laser radiation from the imitation workpiece.
  • the laser processing machine can furthermore comprise a second holder in which the focusing lens unit is held in a positionable manner laterally with respect to the optics unit and optionally along an optical axis of the focusing lens unit.
  • a camera of the imaging unit can be designed to output an image recording of a beam profile in the far field of the measurement laser radiation emerging from the imitation workpiece.
  • the beam-shaping optical unit can comprise a flat diffractive optical element which is designed to impress a two-dimensional Bessel beam-shaping phase distribution on the laser beam.
  • the first holder, the beam-shaping optical unit in the adjusted state of the processing optics, can be positioned in such a way and the second holder, the focusing lens unit, can be positioned such that the beam profile of the far field on the detector surface is essentially rotationally symmetrical to the imaging axis.
  • an area in which the geometry of the entry surface of the workpiece imitation corresponds to the geometry of the workpiece surface of the workpiece to be machined on which the preset Bessel beam focus zone is based can be dimensioned in such a way that formation a measurement focus zone in the imitation workpiece takes place essentially over a length of the preset Bessel beam focus zone.
  • the concepts proposed here enable the adjustment of processing optics, with the aim of ensuring an undisturbed formation of a Bessel beam focus zone in a workpiece despite aberration-causing geometry of a workpiece to be processed.
  • the concepts proposed here can be used to measure the Bessel beam focus zone as it is formed in a workpiece.
  • a possible modular structure of a device according to the invention also allows the use of different workpiece imitations with the same imaging unit.
  • FIG. 1 shows a schematic three-dimensional representation of a laser processing machine for
  • Fig. 3 is a schematic representation of a device for adjusting a Bear processing optics, by way of example using a wedge-shaped workpiece imitation for the processing geometry according to FIG. 2 (a),
  • Fig. 5 is a schematic representation of a device for the adjustment of processing optics using an imitation workpiece with a curved surface for the processing geometry according to Fig. 2 (b)
  • 6 shows a schematic representation of a device for adjusting a machining optics using an imitation workpiece with plane-parallel surfaces for the machining geometry according to FIG. 2 (c)
  • FIG. 7 is a sketch to illustrate the measurement of a length of a Bessel
  • FIG. 8 shows a flow chart to illustrate setting modes in which the device according to the invention can be used.
  • the aspects described here are based in part on the knowledge that when processing a workpiece with a laser beam, optical conditions can arise that make it necessary to compensate for aberration-causing influences of optical components and in particular of the workpiece to be processed.
  • This compensation in the phase distribution over the two-dimensional lateral beam profile can be integrated into processing optics.
  • the inventors have recognized that the phase compensation makes it more difficult to adjust the specifically adapted processing optics.
  • the adjustment can nevertheless be carried out if optical elements according to the invention, correspondingly aberrations-causing optical elements, referred to herein as workpiece imitations, are used for the adjustment and for the analysis of the beam path.
  • the imitation workpiece is positioned in the beam path in such a way that the desired Bessel beam focus zone is formed in the imitation workpiece.
  • the imitation workpiece is thus formed on the inlet side like the workpiece to be machined.
  • the inventors have now also recognized that the imitation workpiece can be designed on the exit side in such a way that the laser radiation emerging from the imitation workpiece is accessible for analysis.
  • the laser beam emerging from the exit surface is then imaged onto a detector surface with the aid of a lens.
  • the inventors have recognized that with this proposed optical concept, properties of the Bessel beam focus zone can be measured if the position of the lens is set accordingly.
  • the proposed measurement concepts can be used with aberration-causing optical configurations that require the use of an imitation workpiece, as well as with aberration-free optical configurations (e.g. also without an imitation workpiece).
  • the intensity in the Bessel beam focus zone can be scanned by scanning (moving) the lens along the nominal axis, ie along the direction of beam propagation in the workpiece with correct adjustment.
  • the length of the Bessel beam focus zone actually present in the imitation workpiece can be determined. This length is then also available in the workpiece to be machined, provided the entry side is configured accordingly, ie designed and aligned.
  • the proposed optical concept in particular the module, can be used to measure the optical thickness of a planar substrate or the aberrations occurring through the substrate by measuring the ring width at a position or the intensity along the focus zone.
  • the concept proposed herein for adjusting the processing optics of a laser processing machine can be implemented with a system that has the aberration-causing elements and optionally also aberration-correcting elements.
  • the adjustment of the processing optics can, for example, be based on image processing of beam profile recordings from a detector which is positioned downstream of the elements causing the aberration.
  • the “workpiece-like” compensation of the aberration with the imitation workpiece results in simple adjustment features such as the symmetry of a ring-shaped beam profile.
  • an imitation workpiece as an optical adjustment element which compensates for the aberration (in the following figures, for example, an inclined edge or a cylindrical lens).
  • the imitation workpiece is used to imitate the planned entrance angle and the planned entrance geometry, as it was taken into account in the aberration compensation made in the beam-shaping element.
  • the geometry and shape of the imitation workpiece also enables an orthogonal exit from a flat test surface (rear side) of the imitation workpiece, so that the Bessel beam with correct adjustment can propagate "correctly" again (without aberration corrector) and thus the symmetry of the beam profile can be assessed and used for adjustment.
  • FIG. 1 is a schematic representation of a laser processing machine 1 which is designed for material processing, for example for laser cutting of transparent material plates or for introducing material modifications into transparent materials.
  • the laser processing machine 1 comprises a laser beam source 2 for generating a primary laser beam 5 and processing optics 3.
  • the processing optics 3 are designed to shape the laser beam 5 in such a way that a desired focus zone 7 in a workpiece (see e.g. workpieces 9, 9 ', 9 ′′ in Fig. 2) is formed.
  • the processing optics 3 comprise a beam-shaping optics unit 11 and a focusing lens unit 13 (also referred to as a processing lens).
  • the beam-shaping optical unit 11 can be designed for phase imprinting of a lens 11A and an axicon 11B.
  • the beam-shaping optical unit 11 can, for. B.
  • phase plates d. H. adjustable or fixed in phase, to impress a predetermined two-dimensional phase distribution on the incident laser beam 5, in particular via its transverse beam profile.
  • SLM spatial light modulator
  • phase plates d. H. adjustable or fixed in phase, to impress a predetermined two-dimensional phase distribution on the incident laser beam 5, in particular via its transverse beam profile.
  • the beam-shaping optical unit 11 creates a real Bessel beam focus zone 7 'downstream of the beam-shaping optical unit 11.
  • the focusing lens 13 (together with the impressed phase of the lens 11 A) forms this real Bessel beam focus zone 7 'down to the Bessel beam focus zone 7, so that high intensities are generated in the Bessel beam focus zone 7, as are required for an intended material processing of a workpiece.
  • the laser beam emerging from the processing optics 3 is indicated by way of example in FIG. 3 as a focused Bessel beam 5A, which forms an annular beam profile.
  • FIG. 1 schematically shows a profile 8 of the intensity I in the Bessel beam focus zone 7. It is assumed here that the processing optics 3 are designed in such a way that at correct adjustment, the Bessel beam focus zone 7 forms along a nominal axis (in FIG. 1 in the Z direction). The Bessel beam focus zone 7 can extend over a few 100 gm and so z. B. produce elongated modification zones in the material.
  • a holder 15 for the beam-shaping optical unit 11 and a holder 17 for the focusing lens unit 13 can also be seen in FIG. 1.
  • the holders 15, 17 can provide translatory or rotational degrees of freedom for the adjustment.
  • the holder 15 can, for example, allow the beam-shaping optical unit 11 to be adjusted in the X-Y plane and possibly a rotation of the beam-shaping optical unit 11 in the X-Y plane.
  • the holder 17 can, for example, allow the position of the focusing lens unit 13 to be adjusted in the X-Y plane and possibly a translation of the focusing lens unit 13 in the Z direction.
  • the Bessel beam focus zone 7 is positioned in a workpiece and the laser beam 5 is coupled with the required power, the laser radiation in the Bessel beam focus zone 7 interacts with the material of the workpiece and causes the intended modification of the material structure over its length the Bessel beam focus zone 7.
  • a line up of modifications introduced in the workpiece can e.g. B. can be used to separate the workpiece into two parts.
  • the formation of the Bessel beam focus zone 7 in material can, however, be influenced by the course of the surface of the workpiece and the refractive index of the material of the workpiece when the laser beam 5A enters the workpiece, if the phase contributions caused upon entry are not taken into account.
  • material processing can be carried out with a besel beam focus zone which runs at an angle to an entry surface 9A of a workpiece 9.
  • FIG. 2 (a) shows a series of modifications 19 accordingly generated in the workpiece 9.
  • the modifications 19 in the workpiece 9 can be generated, for example, with a sequence of laser pulses in combination with a linear movement of the workpiece 9 relative to the Bessel beam focus zone.
  • An oblique incidence on the entrance surface 9A leads to an astigmatic disturbance of the laser beam propagating in the workpiece 9, which also influences the interference behavior of the laser radiation.
  • the astigmatic disturbance can be pre-compensated by adjusting the phase imprint with an aberration correction.
  • This precompensation can be carried out in the arrangement of FIG. 1 by the beam-shaping optical unit 11 and, for example, can be included in the two-dimensional phase imprint.
  • Figure 2 (b) shows a further example of an astigmatism-generating workpiece geometry of a workpiece 9 '.
  • the workpiece 9 ‘has a curved entry surface 9A‘ in one direction.
  • modifications 19 clutch are to be introduced into the workpiece 9 ‘orthogonal to a tangential plane T on the curved entry surface 9A‘ (i.e. parallel to a normal vector N of the tangential plane T).
  • an aberration correction with the beam-shaping optical unit 11 is to be carried out in such a way that the laser radiation forms the Bessel beam focus zone in the workpiece 9 without aberrations and forms the modifications 19‘ as desired.
  • FIG. 2 (c) shows a workpiece 9 ′′ with a planar entry surface 9A ′′ and an exit surface 9B ′′ parallel thereto.
  • the workpiece 9 ′′ which is thus plane-parallel, is to be provided, for example, with modifications 11 ′′ running orthogonally to the entry surface 9A ′′, a predetermined length of the modifications 11 ′′ in the material being intended and this, for example, to be verified.
  • a central, beam-shaping element of processing optics is equally effective for imprinting an axicon-like phase, for performing (pre-) correction of aberrations and, optionally, for completing a telescope arrangement by applying a “lens” phase contribution.
  • the laser beam passes through the beam-shaping element and is focused on / into an essentially transparent optical workpiece for material processing with focusing optics (e.g. a microscope objective).
  • FIG. 3 now explains, by way of example, a device 101 for adjusting the beam-shaping processing optics 3 for the processing geometry according to FIG. 2 (a).
  • a wedge-shaped imitation workpiece 103 is used to reproduce the optical constellation of FIG. 2 (a) on the entry side.
  • the components explained below, including the workpiece imitation 103, can be arranged in a housing 102.
  • the housing 102 has an entry region 104 through which the laser beam 5A exiting from the machining optics 3 is coupled into the device 101.
  • the entry area 104 is formed, for example, by an opening in the housing 102.
  • the device 101 also provided a focus zone formation area 106 in which the laser beam 5A forms a Bessel beam focus zone for adjustment purposes or for measurement.
  • the imitation workpiece 103 is located in the focal zone formation area 106 of the exemplary device 101 in FIG , in particular in the range from 13 ° to 26 °) to a planar exit surface 103B.
  • the laser beam 5A strikes the entrance surface 103A at an angle ⁇ that was selected for the material processing according to FIG. 2 (a) such that, with the processing optics 3 correctly adjusted, the desired Bessel beam focus zone is in the desired direction (referred to herein as target axis 110).
  • the phase imprint carried out in the processing optics 3 must, however, take into account the angle ⁇ and the resulting astigmatic disturbance.
  • the desired Bessel beam focus zone extends along the target axis 110 in the workpiece or in the workpiece imitation 103.
  • the focus zone in the workpiece imitation 103 is hereinafter referred to as the measurement focus zone 107 designated.
  • the imitation workpiece 103 is shaped with regard to its exit surface 103B in such a way that the exit surface 103B runs perpendicular to the nominal axis 110. If this is the case and there is a correct adjustment and a necessary precompensation, the laser radiation emerges from the imitation workpiece 103 in the manner of a Bessel beam and undisturbed.
  • the laser radiation emerging from the imitation workpiece 103 is referred to herein as measuring laser radiation 105, which is detected with an imaging unit 111 and used to adjust the processing unit 3 and / or to measure the focus zone formed.
  • the beam path of the measuring laser radiation 105 shown in FIG. 3 is based on a correct adjustment of the processing optics 3. After exiting the imitation workpiece 103, an intensity ring widening along the nominal axis 110 is known in FIG.
  • the aberration correction of the beam-shaping element (the beam-forming optics unit 11) and the aberrations when entering the imitation workpiece 103 cancel each other out, so that it is trailing (after exiting from the imitation workpiece, assuming a correct adjustment) comes to the usual propagation of a Bessel beam and to the formation of a symmetrical and homogeneous far field (intensity) ring.
  • the far-field ring can be collimated by a further objective (for example a microscope objective) - shown by way of example in FIG. 3 as a lens 113 - and recorded with a camera 115 as a detector.
  • Lens 113 is, for example, a lens like the processing lens 13, which is used for processing.
  • the objective has, for example, an NA that is greater than or equal to the NA of the processing objective.
  • the objective has, for example, a working distance that is greater than the effective area to be measured.
  • the setting of the imaging unit 111 for the detection of the measuring laser radiation in the far field corresponds to a first setting for adjustment based on a recorded transverse beam profile.
  • the optical elements of the processing optics 3 can now be adjusted, the symmetry and homogeneity of the far field ring of the measuring laser radiation 105 being used as a criterion.
  • the device 101 has an imaging unit 111.
  • the imaging unit 111 comprises a lens 113 and a camera 115.
  • the camera 115 is designed, for example, as an area detector, in particular as a CCD camera, and enables the recording of a lateral beam profile (in particular a repeated recording of an image of the beam profile) in the far field.
  • the image is recorded with a De detector that z.
  • B. Intensity distributions of the incident measurement laser radiation 105 are recorded in an analysis plane / area (given by the detector surface 105).
  • the imaging unit 111 and in particular the lens 113 is assigned an imaging axis 117 which should (largely) coincide with the target axis 110 of the respective imitation workpiece for the analysis of the measuring laser radiation 105.
  • the imaging axis 117 runs through the center of the lens 113, orthogonally to a lens plane of the lens 113 and orthogonally to the exit surface 103B.
  • a stop 121 can be provided, for example, which defines a plane perpendicular to the imaging axis 117.
  • the imitation workpieces can now be installed using the stop 121 in such a way that their exit surfaces 103B each run perpendicular to the imaging axis 117.
  • the imitation workpiece (if necessary) can be built into the device 101 purely by means of mechanical tolerancing.
  • the imitation workpiece 103 and the imaging unit 111 can now be aligned together in such a way that the laser beam 5 A enters the imitation workpiece 103 at the angle ⁇ at the point of impact 109.
  • the entire device can also be aligned with the processing optics via mechanical stops.
  • To align the entire device for example, the raw beam position which was previously aligned perpendicular to the device can also be used. de, a center of gravity determination by means of the camera built into the device Runaway leads.
  • the detector (the camera 115) is arranged downstream of the lens 113, so that it covers the far field (or slightly offset from a possible focus 123 in the far field, since the focus 123 itself can be too sharp / intense) as a ring with a uniform / homogeneous intensity.
  • the lens 113 collimates / focuses the measuring laser radiation 105 emerging divergently from the imitation workpiece 103, so that it can be recorded with the camera 115.
  • a distance d between a detector surface 115A of the camera 115 and the lens 113 is selected such that the measuring laser radiation 105 hits the detector surface 115A outside the intermediate focus 123.
  • the prerequisites for the adjustment of the processing optics 3 with the aid of the device 101 are that the imaging unit 111 is correctly positioned with respect to the nominal axis 110 and that, in the event that an imitation workpiece is used, the entry surface of the imitation workpiece with respect to the processing optics 3, assuming a correct adjustment, accordingly aligned with the workpiece to be machined.
  • the last res means that, with a correct adjustment of the processing optics, the Bessel beam focus zone in the imitation workpiece corresponds in its direction of propagation and shape to the intended Bessel beam focus zone.
  • the imaging unit 111 can comprise one or more translation units.
  • a translation unit 125A (z. B. axial displacement table) for displacing the lens 113
  • a translation unit 125B for displacing the detector surface 115A or the camera 115
  • a translation unit 125C for the common displacement of lens 113 and detector surface 115A or camera 115 are indicated in FIG.
  • the translation units 173A to 125C are preferably aligned in such a way that the displacement takes place along the imaging axis 117 and in particular with respect to the stop 121.
  • the translation is exemplified by a translation arrow 125 ‘.
  • the translation unit 125A can be designed to adjust a distance between the lens 113 and the focus zone formation area 106 along the imaging axis 117.
  • the translation unit 125A can be formed for moving a lens focus position assigned to the lens 113 with respect to the Bessel beam focus zone.
  • a translation unit 125B can be designed for setting a distance between the lens 113 and the detector surface 115A in order to position the detector surface 115A outside of the intermediate focus 123.
  • a translation unit 125C can be used to set the distance from lens 113 and detector surface 115A to the focus zone formation area 106 (with mounted workpiece imitations, the distance to exit surface 103B) while maintaining an imaging situation between lens 113 and detector surface 115A.
  • the common displacement can be used to adjust the diameter of the beam profile on the detector upper surface 115A. It also makes it possible to bring the measurement focus zone 107 into the focus of the lens 113 when a geometry of the measurement focus zone is to be measured.
  • a rotation unit 131 is indicated in Figure 3, which allows an alignment of the imaging unit 111, in particular the target axis 110 / imaging axis 117, to an incidence beam axis 21 and thus an adjustment of the angle ⁇ .
  • the rotation is exemplified by a rotation arrow 13V.
  • the optical components of the imaging unit 111 and the stop 121 for the imitation workpiece 103 are mounted on a common base plate 127.
  • the entire unit comprising the imitation workpiece and the imaging unit 111 can be adjusted along the incident beam axis 21 with a further translation unit 133 at a distance from the processing optics 3.
  • further alignment stops 135 A, 135B are indicated in FIG. 3 by way of example, which can be provided on a workpiece holder of the laser processing machine 1 in order to position the device 101 with respect to the processing optics 3.
  • the stops 135A relate to a positioning of the device 111 in the Z direction and the stops 135B to a positioning of the device 111 in the X / Y direction.
  • the positioning of the device 111 in the X / Y direction aligns the entry area with the target beam position / position of the laser beam 5A emerging from the processing optics 3.
  • one (or more) alignment stops 135 A, 135 B in the X, Y or Z direction can also be provided.
  • beam profiles recorded with the camera 115 can be used. Before given, the detector surface 115A is aligned perpendicular to the imaging axis 117. Correction information for setting the position of the optical components of the processing optics 3 can be provided by visual or automated evaluation of the recordings during a manual or automated setting of the positions of the optical elements of the processing optics 3.
  • FIG. 4 (a) shows a recording 140 with the camera 115 of a beam profile 141 impinging on the detector surface 115A, as is the case with a correct adjustment.
  • the beam profile 141 is rotationally symmetrical and represents a homogeneous intensity ring.
  • the position of the imaging axis 117 in the center of the beam profile 141 is indicated in FIG. 4 (a).
  • the beam profile 141 represents a target beam profile that is to be achieved by setting the position of the beam-shaping optical unit 11 and the focusing lens unit 13 accordingly.
  • FIGS. 4 (b) to 4 (d) show exemplary beam profiles which require readjustment of the beam-shaping optical unit and / or the focusing lens unit.
  • FIG. 4 (b) shows a deformed, but largely homogeneous intensity ring 143 A.
  • FIG. 4 (c) shows a symmetrical intensity ring 143 B, the intensity distribution varying azimuthally over the ring.
  • FIG. 4 (d) shows a beam profile in which the thickness of an annular intensity region 143C varies.
  • the processing optics 103 are adjusted with the aim of forming a beam profile 141 as shown in FIG. 4 (a) on the detector surface 115A.
  • FIG. 5 illustrates the use of an imitation workpiece 103 for the machining geometry shown in FIG. 2 (b).
  • the imitation workpiece 103 has an entry surface 103A ', which is at least in a section 151 a surface curved in one direction.
  • the entry surface 3 A ‘can for example be designed as a cylinder jacket surface.
  • the curvature can be seen in the schematic sectional illustration.
  • the annular machining laser beam 5 A will propagate differently in the direction of the curvature in the workpiece to be machined and also in the workpiece imitation 103 103 than in the direction in which there is no curvature.
  • the beam-shaping optical unit 11 in used in the processing optics 3 will make a phase imprint on the laser beam 5, which imposes a corresponding aberration correction.
  • This example again shows that, in addition to positioning the components of the beam-shaping optics unit 1 V, they also need to be correctly aligned at an angle around the optical axis in order to bring the beam-shaping optics 1 V into line with the alignment of the workpiece to be processed.
  • the measurement focus zone 107 ' is formed orthogonally to a tangential plane. Accordingly, an exit surface 103B 'of the work piece imitation 103 is parallel to this tangential plane.
  • the geometry shown in Figure 5 is an example of a machining geometry in which a nominal axis of a Bessel beam focus zone runs orthogonally to a tangential plane, where the tangential plane at an impact point of the entry surface at which the machining laser beam along the incident beam axis the imitation workpiece hits, is clamped with respect to the workpiece to be machined or the imitation workpiece.
  • phase corrections are made with the beam-shaping optical unit have to. These phase corrections can also be taken into account during the adjustment given a correspondingly orthogonal alignment of the exit surface of the imitation workpiece.
  • FIG. 6 shows that the device 101 can also be used for the adjustment of processing optics with a beam-shaping optics unit if, for example, a plane-parallel plate with a Bessel beam focus zone is to be processed.
  • the adjustment can be made with or without (plane-parallel) imitation workpiece 161 (shown in dashed lines) who.
  • FIG. 6 shows that an entry surface 161A of the workpiece imitation 161 (at least) in the entry area of the machining laser beam 5A is designed as a flat surface. With the assumed orthogonal course of the incident beam axis to the entrance surface, the exit surface runs parallel to the entrance surface.
  • FIG. 7 illustrates the use of the device 101 in the measurement of a measurement focus zone using the example of the plane-parallel workpiece imitation 161 of FIG. 6.
  • the device 101 enables the intensity profile in the measurement focus zone 107 to be scanned and thus, for example, the determination of the actual Length of the Bessel beam focus zone in the workpiece - 1 mil / workpiece by scanning the imaging unit 111 along the imaging direction 117.
  • the imaging direction 117 and the incident beam axis 21 coincide by way of example.
  • the arrangement of lens 113 and camera 115 in imaging unit 111 has a greater distance between lens 113 and the imitation workpiece 161 / the measurement focus zone 107.
  • the measuring laser radiation 105 converges on the detector surface 115A; it can be seen in FIG. 7 that the diameter of the annular intensity distribution along the imaging axis 117 between lens 113 and camera 115 decreases.
  • the detector 115 is positioned in the focus of the converging measurement laser beam.
  • the setting of the imaging unit 111 shown in FIG. 7 for measuring the measurement focus zone 107 corresponds to a second operating setting for checking the phase imprint and the resulting focus zone for a phase imprint with the beam-shaping element.
  • the translation units 125A to 125B explained in FIG. 3 can be used to position lens 113 and detector 115. Starting from an alignment of the imaging axis 117 to the incident beam axis 21 made for the adjustment of the machining head 3, usually no adjustment of the angular position for the second operational setting is to be made.
  • the translation unit 125C (see FIG. 3) can be used, for example, to move the lens 113 and detector 115 together along the imaging axis 117.
  • a beginning 171A and an end 171B of the measurement focus zone 107 can be determined in order to e.g. B. to detect or check the exact position and length of the measurement focus zone 107.
  • the imaging unit 111 can be used, for example, for measuring measurement focus zones such as those shown in FIGS. 3 and 5.
  • FIG. 8 shows an exemplary flow chart for the first operating setting explained in connection with FIG. 3 and the second operating setting of the device 101 explained in connection with FIG. 7.
  • FIG. 8 relates to the method for adjusting the processing optics, with a method for measuring a focus zone optionally being attached (or being carried out independently).
  • a first step 201 the processing optics and the device are pre-adjusted so that a laser beam from the laser beam source experiences a phase imprint and is focused by the focusing lens unit as a processing laser beam in a focus zone formation area along an incident beam axis. If an imitation workpiece is used, the focus zone formation area comprises the imitation workpiece and the focusing and formation of the measurement focus zone takes place in the imitation workpiece.
  • the imitation workpiece can be aligned in such a way that the machining laser beam is incident along an incident beam axis assigned to the device and, in particular, strikes the imitation workpiece at an angle of incidence ⁇ .
  • a far field of a measuring laser radiation is imaged on an analysis plane.
  • the measuring laser radiation corresponds to the residual radiation of the machining laser beam passed through the imitation workpiece.
  • the device disclosed herein can be used for an adjustment of machining optics of a laser processing machine in order to map the far field of the measuring laser radiation onto the analysis plane.
  • step 207 the position of the beam-shaping optical unit and optionally the position of the focusing lens unit are adjusted (i.e. adjusted and, in particular, their positions aligned) in such a way that an essentially rotationally symmetrical beam profile of the measuring laser radiation is in the analysis plane results.
  • FIG. 8 also shows a step 209 of a method for measuring a length of a measurement focus zone in an imitation workpiece, which is to be produced in a workpiece with a laser processing machine for material processing.
  • the measurement focus zone can be created by focusing, in particular from the imitation workpiece exiting, measuring laser radiation can be scanned with a lens on an analysis plane while moving the lens along the target direction.
  • the device disclosed herein for an adjustment of processing optics of a laser processing machine can in turn also be used to focus the measuring laser radiation on the analysis plane (step 211).
  • the entrance surface (103 A) is assigned an optionally aberration-causing incident beam axis (21) for the incident processing laser beam (5A),
  • the incident beam axis (21) is assigned a target axis (110) running through the adjustment element (103) for the preset Bessel beam focus zone (7) and
  • the planar exit surface (103B) is aligned perpendicular to the nominal axis (110), and an imaging unit (111) which has a lens (113) and a camera (115) which are aligned with respect to an imaging axis (117), wherein the lens (113) for imaging a measuring laser beam (105) which emerges from the adjustment element (103) is provided along the imaging axis (117) on a detector surface (115A) of the camera (115) and the imaging axis (117) is aligned perpendicular to the planar exit surface (103B).
  • the entry surface (103 A) can be designed as a flat surface which, with the exit surface (103 B), is at an angle in the range from 0 ° to 45 °, or in the range from 0 ° to 32 °, in particular in the range of 10 ° to 30 ° or 10 ° to 26 °.
  • the nominal axis (110) can be a tangential plane (T) at an impact point (109) of the entry surface (103 A), at which the machining laser beam (5A) along the incidence beam axis (21) hits the adjustment element (103) , run orthogonally or non-orthogonally.
  • the incident beam axis (21) can optionally be at an angle in the range from 0 ° to 50 ° or from 0 ° to 45 °, in particular in the range from 10 ° to 30 ° or from 20 ° to 40 °, to a normal vector (N) of the tangential plane (T).
  • a system for adjusting processing optics (3) in a laser processing machine (1), the processing optics (3) for generating a preset Bessel beam focus zone (7) in an essentially transparent workpiece (9) by imprinting a phase curve on a Laser beam (5) comprising: the laser processing machine (1), which has a laser beam source (2) for generating the laser beam (5) and the processing optics (3), and a device (101) according to one of the preceding claims, which an adjustment element (103) and an imaging unit (111), the processing optics (103) having an optics unit (11) that forms a beam with an optional aberration correction and a focusing lens unit (13),
  • the optical unit (11) is set up together with the focusing lens unit (13) to shape the laser beam (5) into a processing laser beam (5A) which propagates along an incident beam axis (21) and which is used to form the preset Bessel beam focus zone ( 7) can lead in the workpiece (9) to be machined along a target axis (110), and
  • the laser processing machine (1) further comprises a first holder (15) in which the optical unit (11) is held laterally positionable with respect to the laser beam (5), and the adjustment element (103) of the device (101) is positioned and aligned with respect to the processing optics (103) in such a way that a processing laser beam (5A), which falls along the incident beam axis (21) on the adjustment element (103) instead of the workpiece (9) to be processed, is used as a measuring laser beam (105) emerges from the adjustment element (103) so that a far field of the measuring laser beam (105) is formed on a detector surface of the device (101).
  • the laser processing machine (1) can further comprise a second holder (17) in which the focusing lens unit (13) is held laterally positionable with respect to the optics unit (1
  • the optical unit (11) can be a flat diffractive optical element which is designed to impress a Bessel beam-shaping phase on the laser beam (5) via a beam profile of the laser beam (5).
  • a thickness of the adjustment element (103) can be determined based on a predetermined point of impact (109) of the preset Bessel beam focus zone (7) along the target axis (110) of at least a length of the preset Bessel beam focus zone (7) correspond.
  • a method for adjusting processing optics (3) in a laser processing machine (1) the processing optics (3) having a beam-shaping optical unit (11) and a focusing lens unit (13), the optical unit (11) being in the beam path of a laser beam (5)
  • Laser processing machine (1) is positioned with a first holder (11 A) and is designed for phase imprinting on a lateral beam profile of the laser beam (5), the phase imprint optionally having an aberration correction phase component that is designed to precompensate an aberration that occurs during Entry into a workpiece (9) to be machined is given at a predetermined point of incidence (109) at a predetermined angle of incidence, so that when the processing optics (3) with the focusing lens unit (13) are correctly adjusted, a predetermined point of incidence (109) is below a Processing laser beam (5A) impinging in front of the given angle of incidence and in the workpiece (9) a preset Bessel beam focus zone (7) can be generated, and wherein a device (101) according to one of claims 1 to 10, which comprises an adjustment element
  • step 201 the processing optics (3) and the device (101) so that a laser beam (5) experiences a phase imprint and is focused by the focusing lens unit (13) onto the adjustment element (103) as a processing laser beam (5A),
  • step 203 Aligning (step 203) the adjustment element (103) in such a way that the machining laser beam (5A) strikes the adjustment element (103) along an incident beam axis (21) of the device (101) in accordance with the optionally provided aberration correction phase component, Imaging (step 205) of a far field of a measuring laser beam (105) emerging from the adjustment element (103) onto an analysis plane and
  • step 207 Adjusting (step 207) the position of the optical unit (11) and optionally the focusing lens unit (13) such that a substantially rotationally symmetrical beam profile (131) of the measuring laser beam (105) results in the analysis plane.
  • the beam-shaping optical unit can be positioned in the beam path of the laser beam and designed for phase imprinting on a lateral beam profile of the laser beam, the phase imprinting having an aberration correction phase component that is designed to precompensate an aberration that the When entering the workpiece to be machined or the adjustment element at a predetermined starting position, the laser beam experiences a predetermined angle of incidence, so that with a correct adjustment of the processing optics by focusing the phase-imprinted laser beam into the material at the predetermined starting position at the predetermined angle of incidence, the desired Bessel Beam focus zone is generated and in particular an intensity ring is formed in the far field on the detector surface, which is rotationally symmetrical in shape and intensity.
  • the nominal axis can correspond to a longitudinal axis of the desired besel beam focus zone in the adjusted state.
  • an independent system of adjustment element and objective and optionally the detector is formed in a housing or on an adjustment plate.
  • the adjustment of the surface to the beginning of the Intensi ity zone can be included in the adjustment.
  • “self-healing” can take place from the surface when the Bessel beam focus zone is formed and the aberration correction can be provided for the start of the intensity zone on the surface.
  • the imitation workpiece is optically (essentially) transparent in the wavelength range of the laser beam and preferably has optical properties such as refractive index and transparency that are comparable to the workpiece to be processed.
  • the imitation workpiece consists of a material with a refractive index of refraction that is in a wavelength spectrum of the laser beam is comparable to a refractive index of refraction of the workpiece to be machined.
  • a refractive index of refraction of the material of the workpiece imitation is related to the refractive index of refraction of the workpiece to be machined, for. B. comparable if the refractive index of refraction of the material of the workpiece imitation from the refractive index of refraction of the workpiece to be machined in the wavelength spectrum of the laser light by z. B. differs less than 5% or less than 10%.
  • the entry surface of the imitation workpiece has a geometry which corresponds to a geometry of a workpiece surface of a workpiece to be machined in a region of the surface through which the machining beam enters the workpiece. Furthermore, starting from a predetermined point of impact for a Bessel beam focus zone along the target axis, a thickness of the imitation workpiece can correspond to at least one length of the preset Bessel beam focus zone.
  • a marking can be provided on the entry surface 103A to simplify the alignment of the processing laser beam 5A on the imitation workpiece.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Lenses (AREA)

Abstract

L'invention concerne un dispositif (101) destiné à effectuer un ajustement d'un système optique d'usinage (3) d'une machine-outil d'usinage par laser (1), le système optique d'usinage (3) étant conçu de sorte à former un faisceau laser (5) dans une machine-outil d'usinage par laser (1) et à le focaliser le long d'un axe de faisceau d'incidence, de sorte qu'un faisceau laser d'usinage (5A) peut former une zone de focalisation du faisceau de Bessel (7) préréglée dans une pièce (9) à usiner. Le dispositif (101) comprend une zone d'entrée (104) destinée à recevoir le faisceau laser d'usinage (5A), une zone de formation de zones de focalisation (106), destinée à permettre une formation d'une zone de focalisation de mesure (107) par le faisceau laser d'usinage (5A) reçu, le long d'un axe de consigne (110), et une unité de reproduction (111) qui comporte un objectif (113) et une surface de détection (115A), l'objectif (113) affichant le faisceau laser de mesure (105), qui quitte la zone de formation de zones de focalisation (106) après formation de la zone de focalisation de mesure (107), le long d'un axe de reproduction prédéfini par l'axe de consigne (110) sur la surface de détection (115A).
EP20793572.7A 2019-10-11 2020-10-05 Dispositif d'ajustement pour un système optique d'usinage par faisceau de bessel et procédé correspondant Pending EP4041487A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102019127481 2019-10-11
DE102020103884.4A DE102020103884A1 (de) 2019-10-11 2020-02-14 Justage-vorrichtung für eine bessel-strahl-bearbeitungsoptik und verfahren
PCT/EP2020/077821 WO2021069362A1 (fr) 2019-10-11 2020-10-05 Dispositif d'ajustement pour un système optique d'usinage par faisceau de bessel et procédé correspondant

Publications (1)

Publication Number Publication Date
EP4041487A1 true EP4041487A1 (fr) 2022-08-17

Family

ID=75155565

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20793572.7A Pending EP4041487A1 (fr) 2019-10-11 2020-10-05 Dispositif d'ajustement pour un système optique d'usinage par faisceau de bessel et procédé correspondant

Country Status (6)

Country Link
US (1) US20220234134A1 (fr)
EP (1) EP4041487A1 (fr)
KR (1) KR102658287B1 (fr)
CN (1) CN114555276B (fr)
DE (1) DE102020103884A1 (fr)
WO (1) WO2021069362A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11614312B2 (en) * 2020-05-18 2023-03-28 Raytheon Company Aerodynamic solid nose cone formed with an afocal axicon lens and method of imaging
DE102020121287B4 (de) 2020-08-13 2024-02-15 Trumpf Laser- Und Systemtechnik Gmbh Laserbearbeitung eines werkstücks mit einer gekrümmten oberfläche und laserbearbeitungsanlage
DE102020121283A1 (de) 2020-08-13 2022-02-17 Trumpf Laser- Und Systemtechnik Gmbh Laserbearbeitung eines werkstücks mit einer gekrümmten oberfläche
US20220341725A1 (en) * 2021-04-26 2022-10-27 Quality Vision International Inc. Non-invasive alignment method and system for imager-illuminator optical measurement machines
DE102021123801A1 (de) 2021-06-02 2022-12-08 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und Vorrichtung zur Laserbearbeitung eines Werkstücks
KR20240007769A (ko) 2021-06-02 2024-01-16 트룸프 레이저-운트 시스템테크닉 게엠베하 공작물의 레이저 가공을 위한 방법 및 장치
CN115390260B (zh) * 2022-09-20 2024-08-13 闽都创新实验室 一种激光光束的扫描加工装置、系统及方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4322609B4 (de) * 1993-07-07 2004-08-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren sowie Vorrichtung zur Prüfung von Fokussieroptiken
JP4418282B2 (ja) * 2004-03-31 2010-02-17 株式会社レーザーシステム レーザ加工方法
DE102006007750A1 (de) * 2006-02-20 2007-08-23 Wavelight Ag Verfahren und optische Anordnung zur Kontrolle der Fokustiefe eines abbildenden optischen Systems
JP5470629B2 (ja) * 2007-06-29 2014-04-16 国立大学法人 千葉大学 微小スポット形成方法および微小スポット形成装置
FR2974176B1 (fr) * 2011-04-14 2014-01-17 Centre Nat Rech Scient Analyseur spatial de faisceau laser a reglage automatique
JP2013195410A (ja) * 2012-03-23 2013-09-30 Olympus Corp 検出装置及び検出方法
DE102014116957A1 (de) * 2014-11-19 2016-05-19 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung
DE102015016240B3 (de) * 2015-12-16 2017-05-24 Primes GmbH Meßtechnik für die Produktion mit Laserstrahlung Transparente Mess-Sonde für Strahl-Abtastung
CN105458529A (zh) * 2016-01-21 2016-04-06 北京理工大学 一种高效制备高深径比微孔阵列的方法
JP6303088B2 (ja) * 2016-02-10 2018-04-04 国立研究開発法人理化学研究所 レーザービーム整形装置、除去加工装置、および輪帯位相素子
KR102078294B1 (ko) * 2016-09-30 2020-02-17 코닝 인코포레이티드 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법
CN106994564B (zh) * 2017-04-27 2019-11-26 东莞市盛雄激光先进装备股份有限公司 一种激光切割装置及其切割方法
JP2020531392A (ja) * 2017-08-25 2020-11-05 コーニング インコーポレイテッド アフォーカルビーム調整アセンブリを用いて透明被加工物をレーザ加工するための装置及び方法

Also Published As

Publication number Publication date
WO2021069362A1 (fr) 2021-04-15
CN114555276A (zh) 2022-05-27
KR20220078681A (ko) 2022-06-10
CN114555276B (zh) 2024-07-12
KR102658287B1 (ko) 2024-04-16
US20220234134A1 (en) 2022-07-28
DE102020103884A1 (de) 2021-04-15

Similar Documents

Publication Publication Date Title
EP4041487A1 (fr) Dispositif d'ajustement pour un système optique d'usinage par faisceau de bessel et procédé correspondant
EP1097022B1 (fr) Procede et dispositif pour etalonner une machine d'usinage de pieces par laser
EP3682200B1 (fr) Système de mesure de position de faisceau et procédé de détermination et de correction de la position d'un faisceau laser
EP0168351B1 (fr) Générateur laser de motifs et procédé pour son emploi
EP2621662B1 (fr) Dispositif et procédé pour le traitement d'une matière au moyen d'un rayonnement électromagnétique focalisé
EP2117761A1 (fr) Dispositif d'usinage à rayon laser comprenant des moyens pour représenter le rayonnement laser de forme annulaire réfléchi sur une unité de détection ainsi que procédé pour ajuster la position du foyer
EP3100011B1 (fr) Caméra à propagation de faisceaux et procédé d'analyse de faisceaux lumineux
WO2009036716A1 (fr) Procédé et dispositif permettant de produire un faisceau laser à section transversale linéaire
WO2009000356A1 (fr) Procédé pour détecter un point d'incidence d'un faisceau laser sur l'arête d'un corps et machine d'usinage au laser
DE102008040742A1 (de) Verfahren und Vorrichtung zur Überwachung von Mehrfachspiegelanordnungen, optische Anordnung mit einer derartigen Vorrichtung sowie mit einer zweiten Mehrfachspiegelanordnung zum Ein- und Ausschalten einer ersten Mehrfachspiegelanordnung sowie Beleuchtungsoptik für eine Projektionsbelichtungsanlage mit einer derartigen Vorrichtung
EP3313607A1 (fr) Tête d'usinage au laser et machine-outil laser la comprenant
DE102020210586A1 (de) Laserbearbeitungsvorrichtung, laserbearbeitungsverfahren undkorrekturdatenerzeugungsverfahren
DE102004053298B4 (de) Scankopf als Teil einer Laser Bohr- und Schneideinrichtung
DE4012927A1 (de) Mess-verfahren und -vorrichtung zur dreidimensionalen lageregelung des brennpunktes eines hochenergie-laserstrahls
WO2019224346A2 (fr) Procédés et dispositifs pour déterminer et corriger des défauts d'alignement de sources de faisceau
DE102017215975A1 (de) Verfahren und Vorrichtung zur Formung eines Laserstrahls durch einen programmierbaren Strahlformer
DE102012212194B4 (de) Mikrolithographische Projektionsbelichtungsanlage und Verfahren zur Veränderung einer optischen Wellenfront in einem katoptrischen Objektiv einer solchen Anlage
DE102011016058B4 (de) Verfahren und Vorrichtung zur Einstellung von Eigenschaften eines Strahlenbündels aus einem Plasma emittierter hochenergetischer Strahlung
WO2011066936A1 (fr) Filtre déphasant pour un microscope à balayage
WO2020187405A1 (fr) Procédé d'ajustement d'un faisceau laser, dispositif de fourniture d'un faisceau laser ajusté et agencement optique
DE102015200795B3 (de) Anordnung zur Bestrahlung einer Objektfläche mit mehreren Teilstrahlen ultrakurz gepulster Laserstrahlung
DE102015219330A1 (de) Verfahren und Vorrichtung zur Strahlanalyse
WO1997043078A1 (fr) Procede et dispositif d'enlevement de matiere au moyen d'un faisceau laser
DE102021111879A1 (de) Laserschweißen von Fügepartnern mit einer gekrümmten Oberfläche
DE4322609B4 (de) Verfahren sowie Vorrichtung zur Prüfung von Fokussieroptiken

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: UNKNOWN

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20220406

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: TRUMPF LASER- UND SYSTEMTECHNIK SE