EP3953954A1 - Induktives Bauelement und Verfahren zur Herstellung eines induktiven Bauelements - Google Patents
Induktives Bauelement und Verfahren zur Herstellung eines induktiven BauelementsInfo
- Publication number
- EP3953954A1 EP3953954A1 EP20711123.8A EP20711123A EP3953954A1 EP 3953954 A1 EP3953954 A1 EP 3953954A1 EP 20711123 A EP20711123 A EP 20711123A EP 3953954 A1 EP3953954 A1 EP 3953954A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- filler
- inductive component
- total mass
- component according
- copper wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001939 inductive effect Effects 0.000 title claims abstract description 63
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000945 filler Substances 0.000 claims abstract description 60
- 238000004804 winding Methods 0.000 claims abstract description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000011159 matrix material Substances 0.000 claims abstract description 33
- 239000006247 magnetic powder Substances 0.000 claims abstract description 20
- 239000004568 cement Substances 0.000 claims abstract description 18
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 9
- 239000010452 phosphate Substances 0.000 claims abstract description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims abstract description 9
- 150000001875 compounds Chemical class 0.000 claims description 40
- 229910000859 α-Fe Inorganic materials 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 239000011398 Portland cement Substances 0.000 claims description 7
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 238000005496 tempering Methods 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 2
- 238000000137 annealing Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 4
- 229910004298 SiO 2 Inorganic materials 0.000 abstract 1
- 230000035699 permeability Effects 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- -1 S1O 2 Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 125000005396 acrylic acid ester group Chemical group 0.000 description 2
- XFWJKVMFIVXPKK-UHFFFAOYSA-N calcium;oxido(oxo)alumane Chemical compound [Ca+2].[O-][Al]=O.[O-][Al]=O XFWJKVMFIVXPKK-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229920005646 polycarboxylate Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/022—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
- H01F17/062—Toroidal core with turns of coil around it
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
Definitions
- the present invention relates to an inductive component with high
- Windings e.g. Copper wire windings
- the electrical conductors are surrounded with an encapsulation compound that creates a connection between the magnetic core surrounded by the windings and a housing. Power losses that occur in the magnetic core or in the windings are dissipated to the housing during operation of the transformer via the enveloping compound. The power density of a conventional transformer is thus reduced.
- the inductive component comprises a copper wire winding and a sheathing compound surrounding the copper wire winding. According to the invention, two or more copper wire windings or one
- Copper wire winding and at least one wider winding of an electrically conductive material can be used.
- the number of windings depends on the use of the inductive component.
- Copper wire winding can e.g. in the form of free-form copper wire winding and is essentially not restricted in terms of shape and shape.
- a particularly suitable form is the toroidal winding.
- the coating compound comprises a matrix and at least one first filler.
- first filler alone or a mixture of a first filler with one or more further fillers can be present.
- the first filler and possibly further fillers are distributed in the matrix, with the resulting composite maintaining a certain mechanical stability and the matrix establishing a connection between the
- Copper wire winding and e.g. provides a surrounding component.
- the matrix comprises at least one selected from: high alumina cement,
- the inductance can be provided by the first filler contained in the matrix, which comprises at least one soft magnetic powder.
- the first filler can comprise a soft magnetic powder alone or a mixture of two or more soft magnetic powders.
- the inductive component In addition to very good magnetic properties, the inductive component also has high heat-conducting properties and the loss factor
- Permittivity is low.
- the thermal conductivity of the encasing compound used according to the invention is 5 to 8 W / m K, which is due in particular to the use of calcium aluminate cement, phosphate cement, S1O 2 , MgO or reactive alumina.
- the inductive component can also be designed without a conventional magnetic core, which saves material costs and costs for the production of the component.
- the subclaims show preferred developments of the invention.
- the soft magnetic powder is advantageously selected from carbonyl iron powder and ferrite powder. This means that carbonyl iron powder and ferrite powder can each be used alone or in the form of a mixture.
- the coating compound comprises at least one polymer.
- one or more polymers e.g. the thermal behavior of the encapsulation compound, e.g. a shrinkage or the thermal conductivity and the like, can be advantageously influenced.
- the use of polymers can also improve the adhesion of the encapsulation compound to surrounding components, such as a housing, for example.
- Particularly suitable polymers are thermoplastic polymers.
- Preferred polymers are copolymers of acrylic acid esters, ethylene and vinyl esters, copolymers of acrylic acid esters, methacrylic acid esters and styrene, copolymers of ethylene and vinyl acetate and methyl silicone resins.
- the coating compound advantageously contains at least one second filler.
- This second filler can add further functionalities to the coating compound.
- a second filler can be used alone or a mixture of two or more second fillers. Because of the very good heat-conducting properties, the second filler preferably contains Al 2 O 3 .
- Total mass of the matrix based on the total mass of the enveloping compound, 5 to 25% by mass.
- Alumina cement, phosphate cement, S1O2, MgO or reactive alumina form a very fine microstructural structure with particle sizes of a maximum of 200 ⁇ m, which leads to the high and very good stability of the matrix
- the Total mass of the first and second filler based on the total mass of the enveloping compound, in particular 75 to 95% by mass.
- the total mass of the first filler is advantageously 75 to 95% by mass. This means that, in addition to the first filler, only a small proportion of the second filler is contained in the matrix and thus also in the enveloping compound. The proportion of soft magnetic powder is therefore very high. This achieves very good magnetic permeabilities.
- the copper wire winding thus surrounds the magnetic core at least partially or at least in sections.
- the magnetic core can e.g. be a ferrite core or a magnetic powder core with a polymer matrix or a sintered magnetic powder core and is designed in particular as a ferrite core.
- the total mass of soft magnetic powder based on the total mass of first and second filler, is 1 to 50% by mass.
- a high magnetic permeability can nevertheless be provided in the inductive component. Stray inductances can be increased while the dielectric constant remains the same and resonance inductances can be integrated.
- the inductive component and in particular the encapsulation compound is
- the total mass of Portland cement is therefore essentially 0% by mass, based on the total mass of the encasing compound and thus also of the inductive component.
- Portland cement has opposite the
- the matrix according to the invention has the disadvantage that it contains a lot of impurities which, although they can be tolerated for load-bearing components, for electronic applications, and in particular for inductive components, entail significant losses in properties.
- Portland cement is significantly less thermally conductive than alumina cement, phosphate cement, S1O2, MgO or reactive alumina, which is probably due to the chemical structure of the individual
- the first filler and the second filler are also advantageously unsintered. This not only has advantages in terms of energy-saving production, but also in terms of high magnetic permeabilities and high heat-conducting properties.
- the inductive component can, for example, be designed as a coil and for this purpose comprises in particular a copper wire winding. Due to the very good inductive and thermally conductive properties, the inductive component according to the invention is designed in particular as a transformer and for this purpose comprises a copper wire winding and at least one further electrically conductive winding, which can also be designed as a copper wire winding.
- a method for producing an inductive component comprises a step of blending a matrix material with at least one first filler,
- a flow agent within the meaning of the invention can, for example, be modified
- Be polycarboxylate ether and can be used, for example, at 0.1 to 2% by mass, based on the total mass of slip.
- the matrix material contains at least one selected from:
- the first filler comprises at least one soft magnetic powder.
- the mixing can for example by stirring with a
- the slip obtained is then arranged around a copper wire winding, so that the slip surrounds the copper wire winding as far as possible on all sides, but at least on the outer circumference of the copper wire winding.
- the slip is then solidified by at least partial setting of the matrix material by the water at a temperature in a range from 50 to 150 ° C. This setting step can for example be carried out in an oven. Sintering at temperatures of more than 200 ° C is not carried out. As a result of the setting, the previously used superplasticizers are largely removed and can then essentially no longer be detected.
- the result is a coating compound in the sense of the present invention, as has already been described above according to the invention.
- the degree of setting of the matrix material can be adjusted by the amount of added water. Suitable amounts of water can be found out by simple experiments.
- the component produced according to the invention is also distinguished by high thermal conductivity, so that the inductive component is highly efficient and has an excellent power density.
- the method can also include a step of tempering following the setting of the matrix material include.
- the tempering is preferably carried out at a temperature in a range from 100 to 150.degree.
- the method can also advantageously include a step of surrounding a magnetic core, which is in particular designed as a ferrite core, with the
- Copper wire winding is therefore not presented as a free-form copper wire winding, but surrounds a magnetic core.
- the enveloping compound is thus arranged around the copper wire winding surrounding the magnetic core and, in particular, not inside the copper wire winding.
- Figure 1 is a sectional view of an inductive component according to a first embodiment
- Figure 2 is a sectional view of an inductive component according to a second embodiment.
- Figure 1 shows an inductive component 1 according to a first embodiment in section.
- the inductive component 1 comprises a housing 2 in which a magnetic core 4 is arranged, which is surrounded on all sides by a copper wire winding 3.
- the copper wire winding 3 is wound directly around the magnetic core 4.
- the magnetic core 4 is designed, for example, as a ferrite core or as a magnetic powder core with a polymer matrix or as a sintered one
- the magnetic powder core the design as a ferrite core is preferred.
- the magnetic core 4 and the copper wire winding 3 surrounding the magnetic core 4 are arranged in the housing 2. Between the housing 2 and the
- an encapsulation compound 8 is arranged which provides a connection between the copper wire winding 3 and the housing 2.
- the coating compound 8 comprises a matrix 5 and a first filler 6 as well as a second filler 7, the first filler 6 being a soft magnetic powder, such as e.g. Carbonyl iron or ferrite powder, and wherein the second filler 7 is Al2O3.
- the first filler 6 and the second filler 7 are distributed in the matrix 5 and are in non-sintered form.
- the matrix 5 comprises at least one selected from: alumina cement, phosphate cement, S1O2, MgO and reactive alumina. These compounds or mixtures of these compounds are at least partially set with water at 50 to 150 ° C. and are not sintered.
- the matrix 5 thus forms a microcrystalline network of particles with a
- the enveloping compound 8 and thus also the inductive component 1 are free of Portland cement.
- the total mass of the matrix 5, based on the total mass of the enveloping compound 8, is 5 to 25% by weight.
- the total mass of the first and second filler 6, 7 is, based on the total mass of the wrapping compound 8, 75 to 95% by mass, the proportion of the first filler 6, i.e. soft magnetic powder, advantageously 1 to 50% by mass, based on the total mass on the first filler 6 and the second filler 7 is. Due to the high proportion of second filler 7, this results in a particularly high proportion with good magnetic properties
- the inductive component 1 is characterized by a high power density and high efficiency due to the use of the encapsulating compound 8. This means that the inductive component 1 is at high magnetic
- the encapsulating compound 8 has a high thermal conductivity, which further increases the power density of the inductive component 1.
- Figure 2 shows an inductive component 10 according to a second
- the inductive component 10 differs from the inductive component 1 from Figure 1 in that there is no
- the copper wire winding 3 is thus in the form of a free-form copper wire winding that was produced in advance on a carrier, for example.
- the total mass of matrix 5 based on the total mass of the encasing compound 8 is 5 to 25 mass% here as well.
- the total mass of the first filler 6 and the second filler 7, based on the total mass of the enveloping compound 8, is 75 to 95% by mass, the proportion of the first filler 6, i.e. of soft magnetic powder, being higher than in the matrix of the inductive component 1 from Figure 1 and in particular 75 to 95% by mass, based on the total mass of first filler 6 and second filler 7.
- the proportion of second filler 7, that is to say in particular of Al 2 O 3 is therefore lower.
- the higher proportion of soft magnetic powder is advantageous in light of the magnetic properties of the inductive component 10.
- the inductive component 10 is also distinguished by a high power density and high efficiency due to the use of the encapsulating compound 8.
- a high magnetic permeability (P R 2 to 4 or 10 to 500) and also a high leakage inductance and resonance inductance are obtained.
- the encapsulating compound 8 has good thermal conductivity, which further increases the power density of the inductive component 10.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Soft Magnetic Materials (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102019204950.8A DE102019204950A1 (de) | 2019-04-08 | 2019-04-08 | Induktives Bauelement und Verfahren zur Herstellung eines induktiven Bauelements |
PCT/EP2020/056424 WO2020207687A1 (de) | 2019-04-08 | 2020-03-11 | Induktives Bauelement und Verfahren zur Herstellung eines induktiven Bauelements |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3953954A1 true EP3953954A1 (de) | 2022-02-16 |
Family
ID=69810839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20711123.8A Pending EP3953954A1 (de) | 2019-04-08 | 2020-03-11 | Induktives Bauelement und Verfahren zur Herstellung eines induktiven Bauelements |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP3953954A1 (de) |
JP (1) | JP7478166B2 (de) |
CN (1) | CN113614862A (de) |
DE (1) | DE102019204950A1 (de) |
WO (1) | WO2020207687A1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102022125977A1 (de) | 2021-10-07 | 2023-04-13 | Axing Ag | Wickelgut für elektronische Schaltungen bzw. Baugruppen |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2065278B (en) * | 1979-12-14 | 1983-10-12 | Flogates Ltd | Composite moulded refractory articles amd their manufacture |
DE3477438D1 (en) * | 1984-03-23 | 1989-04-27 | Siemens Ag | Electronic component, in particular a chip inductance |
JPS61145707A (ja) * | 1984-12-20 | 1986-07-03 | Tdk Corp | 磁気ヘツド、磁気ヘツドの製造方法および磁気ヘツド製造用注型型 |
DE68923734T2 (de) * | 1988-05-24 | 1996-01-18 | Gte Laboratories Inc | Gasfühlelement. |
US5151203A (en) * | 1991-06-21 | 1992-09-29 | Halliburton Company | Composition and method for cementing a well |
JP3167900B2 (ja) * | 1995-09-27 | 2001-05-21 | 萩原工業株式会社 | セメント強化用ポリプロピレン繊維 |
JP4216917B2 (ja) * | 1997-11-21 | 2009-01-28 | Tdk株式会社 | チップビーズ素子およびその製造方法 |
ES2188230T3 (es) * | 1998-07-10 | 2003-06-16 | Epcos Ag | Producto magnetizable y su utilizacion, asi comoo un procedimiento para su fabricacion. |
DE29823969U1 (de) * | 1998-07-10 | 2000-03-16 | Epcos Ag | Magnetisierbares Erzeugnis |
JP2005064422A (ja) * | 2003-08-20 | 2005-03-10 | Sumitomo Osaka Cement Co Ltd | 磁芯及びその製造方法 |
DE102006038370A1 (de) * | 2006-08-11 | 2008-02-14 | E.G.O. Elektro-Gerätebau GmbH | Spulenträger für Induktoren |
DE102007007117A1 (de) * | 2007-02-13 | 2008-08-21 | Vogt Electronic Components Gmbh | Induktives Bauelement mit Umhüllung |
JP2018182203A (ja) * | 2017-04-19 | 2018-11-15 | 株式会社村田製作所 | コイル部品 |
JP2012069598A (ja) * | 2010-09-21 | 2012-04-05 | Sumitomo Electric Ind Ltd | リアクトル、およびその製造方法 |
JP5991460B2 (ja) * | 2011-03-24 | 2016-09-14 | 住友電気工業株式会社 | 複合材料、リアクトル用コア、及びリアクトル |
CN105845423B (zh) * | 2016-06-17 | 2018-01-19 | 深圳市固电电子有限公司 | 一体化电感器的制作方法及采用此方法所得一体化电感器 |
-
2019
- 2019-04-08 DE DE102019204950.8A patent/DE102019204950A1/de active Pending
-
2020
- 2020-03-11 WO PCT/EP2020/056424 patent/WO2020207687A1/de unknown
- 2020-03-11 JP JP2021559409A patent/JP7478166B2/ja active Active
- 2020-03-11 CN CN202080027147.3A patent/CN113614862A/zh active Pending
- 2020-03-11 EP EP20711123.8A patent/EP3953954A1/de active Pending
Also Published As
Publication number | Publication date |
---|---|
JP7478166B2 (ja) | 2024-05-02 |
WO2020207687A1 (de) | 2020-10-15 |
CN113614862A (zh) | 2021-11-05 |
JP2022526620A (ja) | 2022-05-25 |
DE102019204950A1 (de) | 2020-10-08 |
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