EP3951861A4 - Verbundleiterplatte und herstellungsverfahren dafür - Google Patents

Verbundleiterplatte und herstellungsverfahren dafür Download PDF

Info

Publication number
EP3951861A4
EP3951861A4 EP20783161.1A EP20783161A EP3951861A4 EP 3951861 A4 EP3951861 A4 EP 3951861A4 EP 20783161 A EP20783161 A EP 20783161A EP 3951861 A4 EP3951861 A4 EP 3951861A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
same
wiring board
printed wiring
composite printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP20783161.1A
Other languages
English (en)
French (fr)
Other versions
EP3951861A1 (de
EP3951861B1 (de
Inventor
Takamichi KONO
Hitoshi Arai
Tatsuya Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=72667744&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP3951861(A4) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of EP3951861A1 publication Critical patent/EP3951861A1/de
Publication of EP3951861A4 publication Critical patent/EP3951861A4/de
Application granted granted Critical
Publication of EP3951861B1 publication Critical patent/EP3951861B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP20783161.1A 2019-04-02 2020-03-26 Verbundleiterplatte und herstellungsverfahren dafür Active EP3951861B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019070716 2019-04-02
PCT/JP2020/013737 WO2020203665A1 (ja) 2019-04-02 2020-03-26 複合プリント配線板およびその製造方法

Publications (3)

Publication Number Publication Date
EP3951861A1 EP3951861A1 (de) 2022-02-09
EP3951861A4 true EP3951861A4 (de) 2022-06-01
EP3951861B1 EP3951861B1 (de) 2024-01-10

Family

ID=72667744

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20783161.1A Active EP3951861B1 (de) 2019-04-02 2020-03-26 Verbundleiterplatte und herstellungsverfahren dafür

Country Status (4)

Country Link
US (1) US11785718B2 (de)
EP (1) EP3951861B1 (de)
JP (1) JP6932289B2 (de)
WO (1) WO2020203665A1 (de)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4012100A1 (de) * 1990-04-14 1991-10-17 Standard Elektrik Lorenz Ag Leiterplatte mit einer kuehlvorrichtung und verfahren zur herstellung derselben
US5677514A (en) * 1993-10-07 1997-10-14 Mtu Motoren- Und Turbinen-Union Muenchen Gmbh Metal-core PC board for insertion into the housing of an electronic device
US20120195017A1 (en) * 2011-01-28 2012-08-02 Hsiang-Chao Lee Circuit board assembly
US20140092569A1 (en) * 2012-09-28 2014-04-03 Kyocera Slc Technologies Corporation Wiring board
US20180063940A1 (en) * 2016-08-31 2018-03-01 Qorvo Us, Inc. Air-cavity package with two heat dissipation interfaces

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275774A (ja) 1993-03-19 1994-09-30 Fujitsu Ltd 回路ユニットの接続装置および該接続装置を用いた回路モジュール
JP2001111232A (ja) 1999-10-06 2001-04-20 Sony Corp 電子部品実装多層基板及びその製造方法
JP2001156222A (ja) 1999-11-30 2001-06-08 Xanavi Informatics Corp 基板接続構造、基板接続用プリント配線基板および基板接続方法
JP3879347B2 (ja) 1999-12-20 2007-02-14 富士電機システムズ株式会社 モジュール基板接合方法
JP2001210954A (ja) 2000-01-24 2001-08-03 Ibiden Co Ltd 多層基板
JP2004022973A (ja) * 2002-06-19 2004-01-22 Kyocera Corp セラミック回路基板および半導体モジュール
JP2004297053A (ja) 2003-03-10 2004-10-21 Sumitomo Bakelite Co Ltd 層間接合部及びそれを有する多層配線板
JP2005136339A (ja) 2003-10-31 2005-05-26 Fujikura Ltd 基板接合方法およびその接合構造
JP2008041910A (ja) * 2006-08-04 2008-02-21 Ngk Spark Plug Co Ltd 配線基板および多数個取り配線基板
JP5058766B2 (ja) 2007-12-07 2012-10-24 山陽特殊製鋼株式会社 鉛フリー接合用材料を用いてはんだ付けしてなる電子機器
JP5491991B2 (ja) 2009-07-06 2014-05-14 株式会社フジクラ 積層配線基板及びその製造方法
JP2012074497A (ja) * 2010-09-28 2012-04-12 Denso Corp 回路基板
JP5757163B2 (ja) * 2011-06-02 2015-07-29 ソニー株式会社 多層配線基板およびその製造方法、並びに半導体装置
JP5836863B2 (ja) 2012-03-27 2015-12-24 新電元工業株式会社 表面実装型モジュールと該表面実装型モジュールの端子、及び表面実装型モジュールの端子の製造方法、並びに表面実装型モジュール搭載基板
JP6176253B2 (ja) * 2012-09-07 2017-08-09 旭硝子株式会社 インターポーザ用の中間品を製造する方法およびインターポーザ用の中間品
US10667410B2 (en) * 2013-07-11 2020-05-26 Hsio Technologies, Llc Method of making a fusion bonded circuit structure
JP6392583B2 (ja) * 2014-08-25 2018-09-19 京セラ株式会社 回路基板、および電子装置
JP2016063065A (ja) * 2014-09-18 2016-04-25 日本電気株式会社 プリント基板及びその製造方法
JP2016066699A (ja) 2014-09-25 2016-04-28 京セラサーキットソリューションズ株式会社 複合配線基板およびその実装構造体
JP6729331B2 (ja) 2016-11-30 2020-07-22 富士通株式会社 電子装置及び電子装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4012100A1 (de) * 1990-04-14 1991-10-17 Standard Elektrik Lorenz Ag Leiterplatte mit einer kuehlvorrichtung und verfahren zur herstellung derselben
US5677514A (en) * 1993-10-07 1997-10-14 Mtu Motoren- Und Turbinen-Union Muenchen Gmbh Metal-core PC board for insertion into the housing of an electronic device
US20120195017A1 (en) * 2011-01-28 2012-08-02 Hsiang-Chao Lee Circuit board assembly
US20140092569A1 (en) * 2012-09-28 2014-04-03 Kyocera Slc Technologies Corporation Wiring board
US20180063940A1 (en) * 2016-08-31 2018-03-01 Qorvo Us, Inc. Air-cavity package with two heat dissipation interfaces

Also Published As

Publication number Publication date
JPWO2020203665A1 (ja) 2021-09-13
US11785718B2 (en) 2023-10-10
JP6932289B2 (ja) 2021-09-08
EP3951861A1 (de) 2022-02-09
EP3951861B1 (de) 2024-01-10
US20220151072A1 (en) 2022-05-12
WO2020203665A1 (ja) 2020-10-08

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