EP3938761A1 - Régulation thermique d'un dispositif de détection - Google Patents
Régulation thermique d'un dispositif de détectionInfo
- Publication number
- EP3938761A1 EP3938761A1 EP20706637.4A EP20706637A EP3938761A1 EP 3938761 A1 EP3938761 A1 EP 3938761A1 EP 20706637 A EP20706637 A EP 20706637A EP 3938761 A1 EP3938761 A1 EP 3938761A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- sensor
- temperature
- detector
- control device
- radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000033228 biological regulation Effects 0.000 title description 3
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000001816 cooling Methods 0.000 claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 230000001419 dependent effect Effects 0.000 claims abstract description 11
- 238000004590 computer program Methods 0.000 claims abstract description 8
- 238000011156 evaluation Methods 0.000 claims abstract description 6
- 230000005855 radiation Effects 0.000 claims description 68
- 238000007620 mathematical function Methods 0.000 claims description 4
- 238000004088 simulation Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000004422 calculation algorithm Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 101000657580 Homo sapiens Small nuclear ribonucleoprotein-associated protein N Proteins 0.000 description 1
- 102100034803 Small nuclear ribonucleoprotein-associated protein N Human genes 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/4738—Diffuse reflection, e.g. also for testing fluids, fibrous materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60T—VEHICLE BRAKE CONTROL SYSTEMS OR PARTS THEREOF; BRAKE CONTROL SYSTEMS OR PARTS THEREOF, IN GENERAL; ARRANGEMENT OF BRAKING ELEMENTS ON VEHICLES IN GENERAL; PORTABLE DEVICES FOR PREVENTING UNWANTED MOVEMENT OF VEHICLES; VEHICLE MODIFICATIONS TO FACILITATE COOLING OF BRAKES
- B60T8/00—Arrangements for adjusting wheel-braking force to meet varying vehicular or ground-surface conditions, e.g. limiting or varying distribution of braking force
- B60T8/32—Arrangements for adjusting wheel-braking force to meet varying vehicular or ground-surface conditions, e.g. limiting or varying distribution of braking force responsive to a speed condition, e.g. acceleration or deceleration
- B60T8/321—Arrangements for adjusting wheel-braking force to meet varying vehicular or ground-surface conditions, e.g. limiting or varying distribution of braking force responsive to a speed condition, e.g. acceleration or deceleration deceleration
- B60T8/329—Systems characterised by their speed sensor arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60W—CONJOINT CONTROL OF VEHICLE SUB-UNITS OF DIFFERENT TYPE OR DIFFERENT FUNCTION; CONTROL SYSTEMS SPECIALLY ADAPTED FOR HYBRID VEHICLES; ROAD VEHICLE DRIVE CONTROL SYSTEMS FOR PURPOSES NOT RELATED TO THE CONTROL OF A PARTICULAR SUB-UNIT
- B60W40/00—Estimation or calculation of non-directly measurable driving parameters for road vehicle drive control systems not related to the control of a particular sub unit, e.g. by using mathematical models
- B60W40/02—Estimation or calculation of non-directly measurable driving parameters for road vehicle drive control systems not related to the control of a particular sub unit, e.g. by using mathematical models related to ambient conditions
- B60W40/06—Road conditions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/0252—Constructional arrangements for compensating for fluctuations caused by, e.g. temperature, or using cooling or temperature stabilization of parts of the device; Controlling the atmosphere inside a photometer; Purge systems, cleaning devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60W—CONJOINT CONTROL OF VEHICLE SUB-UNITS OF DIFFERENT TYPE OR DIFFERENT FUNCTION; CONTROL SYSTEMS SPECIALLY ADAPTED FOR HYBRID VEHICLES; ROAD VEHICLE DRIVE CONTROL SYSTEMS FOR PURPOSES NOT RELATED TO THE CONTROL OF A PARTICULAR SUB-UNIT
- B60W2420/00—Indexing codes relating to the type of sensors based on the principle of their operation
- B60W2420/40—Photo, light or radio wave sensitive means, e.g. infrared sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/062—LED's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/12—Circuits of general importance; Signal processing
- G01N2201/121—Correction signals
- G01N2201/1211—Correction signals for temperature
Definitions
- the invention relates to a method for operating a sensor device for determining a road condition, in which rays are generated by at least one radiation source and emitted into a scanning area, beams scattered back or reflected from the scanning area are determined by at least one detector and for determining the road condition by the Detector-coupled control device are evaluated, a control device and a computer program.
- the road's coefficient of friction is influenced in particular by intermediate media between the vehicle tires and the road.
- Such intermediate media can be, for example, water, ice, snow or dirt on the roadway.
- the detection of these media can be done by optical sensors, the rays, for example in the infrared
- Wavelength range, and the backscattered or reflected rays are received by a detector.
- the measurement data received by the detector can then be evaluated to obtain a road condition.
- detectors and other components of the sensor also have
- Temperature dependencies which affect the accuracy of the sensor can affect.
- the radiation output of semiconductor light sources can decrease with increasing temperature.
- the temperature of the semiconductor light sources also influences the emitted wavelength range.
- the noise behavior can be adversely affected by increasing temperature or the sensitivity can decrease with increasing temperature.
- the object on which the invention is based can be seen in proposing a method and a control device for technically simple compensation of thermal influences of a sensor device.
- a method for operating a sensor device for determining a road condition is provided.
- the sensor device has at least one radiation source for generating rays which are emitted into a scanning area. From the
- Beams scattered back or reflected in the scanning area are determined by at least one detector and evaluated by a control device coupled to the detector to determine the road condition.
- Sensor devices are determined by at least one sensor, the temperature-dependent influences on the components of the sensor device being compensated for by a heating device and / or a cooling device and / or during the evaluation by the control device.
- a control device is provided, the control device being set up to carry out the method.
- a computer program is provided which comprises instructions that are used when executing the
- Computer program causing a control device to execute the method.
- the control unit can preferably be on the vehicle or on the vehicle
- control device can be device-side control unit.
- control device can be designed as a modular component of the sensor device.
- the sensor device can preferably be used in vehicles or in
- the method allows the sensor device to be operated in a wide temperature range with constant accuracy.
- a temperature range can be between -40 ° C and + 85 ° C, for example.
- the method can be used for vehicles which, according to the BASt definition, can be operated, partially automated, highly automated and / or fully automated or driverless.
- the heating device can be, for example, a Peltier element, an electrical resistance heater and the like.
- a passive heat sink, a heat sink actively cooled by a fan, can be used as the cooling device
- Liquid cooling or water cooling, an absorption cooler, a Peltier element and the like can be used.
- a Peltier element can be used here as a combined cooling or heating device, which is connected to the control device and can be set to a cooling mode or a heating mode by the control device.
- the compensation of the thermal influences can also take place at an evaluation level.
- the compensation can be carried out on a software level.
- the temperature-related fluctuations and deviations in the components of the sensor device are taken into account or compensated.
- the component of the sensor device is arranged on at least one thermally highly conductive circuit board, the circuit board and / or the component arranged on the circuit board being thermally adjusted by the heating device and / or cooling device.
- a circuit board can be used to dissipate thermal energy.
- the circuit board can, for example, be a metallic circuit board. The thermal setting of the components arranged on the circuit board can thus be carried out via the circuit board. For example, such
- Temperature stabilization takes place by one or more Peltier elements which are arranged as close as possible to the components to be thermally stabilized.
- the heating elements and / or cooling elements with the components of the sensor device can be arranged on a common surface of the circuit board or separately on a second surface of the circuit board.
- a temperature of the at least one radiation source and / or the circuit board and / or the detector is measured by at least one temperature sensor and received by the control unit.
- the temperature sensor can be, for example, a thermocouple, pyrometer or a resistance sensor.
- the temperature sensor can be, for example, a thermocouple, pyrometer or a resistance sensor.
- Temperature sensor measure the temperature of the respective component and / or the circuit board in the area of the component.
- the measurement data determined by the temperature sensor can be received by the control device and used to evaluate data to determine the road condition.
- the temperature is in a
- a temperature-radiation power characteristic of the light sources or radiation sources used in the sensor device can be stored in a table, which can be accessed, for example, by means of interpolation. By measuring the temperature of the respective radiation sources, the temperature-induced deviation of the radiation power of the radiation sources compared to a calibrated value at a known temperature can be determined. As an alternative or in addition to the table, the radiation power of the radiation sources can be calculated based on the temperature. This can be done by algorithms, simulation models and the like. In this way, the thermal influence on the components can be taken into account when determining the road condition on the basis of the temperature measurement by the control unit.
- the measured temperature is used to take into account a temperature-dependent wavelength shift of the radiation source and / or to take into account thermal influences on the detector.
- Detectors can also typically
- the measured temperature of the at least one detector can correct the measured values determined by the detector and thus increase the accuracy of the measurements.
- the wavelength shift or the so-called wavelength shift of the central wavelength over the temperature when the rays are emitted by the radiation sources can be taken into account in the software-based algorithm by the control device and / or hardware-based by setting the temperature of the radiation sources through the heating device and / or cooling device
- temperature compensation by the heating device and / or cooling device may be necessary if the
- the radiation power of the generated beams is measured by an intensity sensor and received by the control unit.
- Radiation power by measuring the temperature of the radiation sources the radiation power can be determined directly by the at least one intensity sensor.
- the intensity sensor can be, for example, a photodiode, a CMOS sensor, a CCD sensor and the like.
- Radiated power can be measured by the intensity sensor directly before or without the radiation being sent to the ground.
- the temperature compensation of the intensity is only necessary if the
- Deviations due to changes in intensity can no longer be sufficiently taken into account by the computer program. This can take place, for example, when the signal-to-noise ratio of the signal falls below a lower threshold value. Furthermore, the
- Temperature compensation may be necessary if the requirements are met
- the accuracy of the data entering the computer program is higher than the accuracy achieved without temperature compensation.
- the temperature stabilization of the computer program is higher than the accuracy achieved without temperature compensation.
- Sensor device can be used to comply with safety regulations with regard to eye safety.
- the emitted power of the beams can be determined with a monitor photodiode of this type, which measures the optical power of the light source, and forwarded to the control unit as a reference signal.
- the radiation power of the generated rays is measured by the intensity sensor directly at the radiation source, indirectly via a radiation-conducting connection and / or at scattered radiation from the radiation source.
- the intensity sensor can be positioned directly next to the radiation source and use part of the emitted rays and / or the scattered light of the radiation sources to determine the radiation power. Furthermore, a radiation-guiding connection of the at least one Radiation source are produced to the intensity sensor. This can be positioned directly next to the radiation source and use part of the emitted rays and / or the scattered light of the radiation sources to determine the radiation power. Furthermore, a radiation-guiding connection of the at least one Radiation source are produced to the intensity sensor. This can
- a temperature dependency of the intensity sensor is determined by a mathematical function and / or a
- Compensated comparison table In this way, temperature-dependent influences of the photodiode parameters on the signal can be compensated. For example, such consideration can take place by means of a wavelength-dependent temperature sensitivity characteristic. Such consideration can be advantageous in particular for wavelength ranges that are not at the edge of the sensitivity range of the detector.
- a sensor device having a control device for
- the sensor device has a circuit board with at least one radiation source for generating beams and for emitting the beams into a scanning area and with at least one detector for receiving beams reflected or scattered in the scanning area.
- Thermal influences on the sensor device can be determined by at least one sensor. In particular, the thermal influences on the components of the sensor device can be determined.
- Components of the sensor device can, for example, be radiation sources such as LEDs or semiconductor lasers, detectors, resistors, photodiodes and the like.
- the sensor device can preferably supply measurement data for carrying out a road condition determination by the control device.
- the at least one sensor can be a temperature sensor and / or an intensity sensor.
- the temperature and / or the influence of the temperature on the radiation sources can be determined by the at least one sensor of the sensor device. Knowledge of the thermal influences on the components can be used to compensate for these influences.
- the at least one sensor is a
- Temperature sensor and / or designed as an intensity sensor Through this direct or indirect influences of a changing operating temperature of the components can be determined.
- the at least one radiation source can have a central wavelength that is independent of temperature.
- only the radiation power of the at least one radiation source can depend on the temperature, so that only a compensation of the radiation power is necessary.
- Radiation source can be designed as a DFB laser, for example. This eliminates the need to compensate for the wavelength shift.
- At least one scattered light protection is arranged in the region of the at least one detector.
- the scattered light protection can preferably protect the detector from the incidence of scattered light on the edge or side.
- the detector can be arranged adjacent to the radiation sources, so that the sensor device can have a particularly compact design.
- Scanning area reflected or backscattered rays at least one
- the at least one band pass filter can be in
- the beam path can be arranged in front of the detector or behind the at least one radiation source.
- a bandpass filter which transmits a plurality of narrow, desired wavelength ranges, can preferably be arranged in front of the detector.
- a multi-wavelength band-pass filter By using such a multi-wavelength band-pass filter, the number of components used can be reduced in this embodiment.
- the use of several detectors, each with a filter, or the temporal variation of the filter, such as by a Fabry-Perot filter, can be dispensed with.
- the at least one bandpass filter is arranged on the scattered light protection of the detector, the bandpass filter, the scattered light protection and the detector being connected to one another.
- the stray light protection can be used as be designed a housing which is open at least on one side. The open side of the stray light protection can be covered by at least one bandpass filter.
- the at least one detector can be positioned in the scattered light protection.
- relatively broadband light sources such as LEDs can be used as radiation sources. These can be combined with narrow-band bandpass filters which, as a sufficient approximation, transmit a temperature-independent wavelength range. Thus, although the resulting radiation power can still change, the one transmitted through the bandpass filter to the detector can no longer change
- FIG. 1 shows a schematic plan view of a sensor device according to an embodiment
- FIG. 2 shows a schematic sectional illustration of the sensor device from FIG. 1.
- FIG. 1 shows a schematic plan view of a sensor device 1 according to one embodiment.
- the sensor device 1 has a printed circuit board 2.
- the circuit board 2 is, for example, square shaped and is made of a material with good thermal conductivity, such as metal. This allows the thermal conductivity of the printed circuit board 2 to be increased.
- a detector 4 is centrally located on the circuit board 2 of the sensor device 1
- the detector 4 can be designed, for example, as a CCD sensor, a CMOS sensor or as a photodiode, such as a PIN photodiode.
- a stray light protection 6 is arranged around the circumference of the detector 4. If the detector 4 has a cylindrical shape, that is Scattered light protection 6 is tubular and receives the detector 4 on the inside in a form-fitting manner.
- the scattered light protection 6 can be different depending on the design of the detector 4. For example, the scattered light protection 6 can have a square or rectangular shape in the case of a detector 4 in an SM D design. Alternatively or additionally, the scattered light protection 6 can already be integrated in the detector 4.
- the scattered light protection 6 delimits the detector 4 radially R or along a lateral surface M of the detector 4.
- the detector 4 can have its own receiving optics or an integrated receiving optics, such as a lens.
- the scattered light protection 6 can project beyond the detector 4.
- a bandpass filter 8 is arranged on the end of the scattered light protection 6.
- the sensor device 1 also has four radiation sources 10 arranged in a row on the circuit board 2.
- the radiation sources 10 can be arranged in any number and in any form on the circuit board 2. For example, only one radiation source 10 can be provided. Alternatively or additionally, several radiation sources 10 can be positioned in a circle around the scattered light protection 8. According to the embodiment, the
- Radiation sources 10 designed as infrared LEDs.
- the radiation sources 10 can be activated and deactivated successively or in a sequence one after the other.
- a temperature sensor 12 and an intensity sensor 14 are arranged on the circuit board adjacent to the radiation sources 10.
- the temperature sensor 12 is designed, for example, as a resistance temperature sensor which is coupled to the printed circuit board 2 in a thermally conductive manner. Since the temperature sensor 12 is positioned directly on the radiation sources 10, the temperature of the radiation sources 10 can be monitored by means of the temperature sensor 12.
- the intensity sensor 14 is designed as a monitor photodiode and can measure the scattered light emitted by the radiation sources 10 and can thus be used to monitor the radiation power of the radiation sources 10.
- the sensor device 1 from FIG. 1 is laterally in one
- the radiation sources 10 generate rays 16 which are emitted into a scanning area 18.
- the generated beams 16 can be shaped by one or more optics prior to emitting.
- the beams 16 generated can strike obstacles 20, such as objects or a roadway.
- the beams 16 generated can be reflected or scattered back to the sensor device 1 at the obstacle 20. Those reflected or scattered back to the sensor device 1
- Beams 22 can then be blocked by the bandpass filter 8 or transmitted to the detector 4 through the bandpass filter.
- the circuit board 2 is designed to be temperature-stabilized.
- a Peltier element 24 is arranged on a rear side of the printed circuit board 2.
- the Peltier element 24 serves as a cooling element and as a heating element for setting a temperature of the circuit board 2 and the components 4, 6, 10, 12, 14 arranged on the circuit board 2.
- the beams 22 transmitted to the detector 4 can be converted into electrical signals and received by a control device 26.
- Control device 26 is connected to conductor tracks 3 of circuit board 2 and can read out or control components 4, 6, 10, 12, 14, 24. In this way, the control device 26 can receive and evaluate the measured values from the sensors or detectors 4, 12, 14. In parallel, the control unit 26 can
- the control device 26 has a machine-readable storage medium 28 which has a program for operating the sensor device 1.
- control device 26 can in particular a
- the measured values of the temperature sensor 12 and the Intensity sensors 14 can be used by control device 26 to compensate for the thermal influences on detector 4 and radiation sources 10.
- the thermal influences can be taken into account in the evaluation by the control unit 26 or by setting the temperature by the
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Transportation (AREA)
- Biochemistry (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Automation & Control Theory (AREA)
- Mathematical Physics (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102019203318.0A DE102019203318A1 (de) | 2019-03-12 | 2019-03-12 | Thermische Regelung einer Sensorvorrichtung |
PCT/EP2020/053406 WO2020182388A1 (fr) | 2019-03-12 | 2020-02-11 | Régulation thermique d'un dispositif de détection |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3938761A1 true EP3938761A1 (fr) | 2022-01-19 |
Family
ID=69650551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20706637.4A Withdrawn EP3938761A1 (fr) | 2019-03-12 | 2020-02-11 | Régulation thermique d'un dispositif de détection |
Country Status (7)
Country | Link |
---|---|
US (1) | US20220057324A1 (fr) |
EP (1) | EP3938761A1 (fr) |
JP (1) | JP2022524603A (fr) |
KR (1) | KR20210135574A (fr) |
CN (1) | CN113574364A (fr) |
DE (1) | DE102019203318A1 (fr) |
WO (1) | WO2020182388A1 (fr) |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3331132C1 (de) * | 1983-08-30 | 1985-02-07 | Hewlett-Packard GmbH, 7030 Böblingen | Schutzschaltung fuer einen Halbleiterlaser |
JPH08222746A (ja) * | 1995-02-15 | 1996-08-30 | Fujitsu Ltd | 赤外線検知素子 |
DE19824625A1 (de) * | 1997-09-30 | 1999-04-01 | Univ Ilmenau Tech | Vorrichtung zur Detektion des Zustandes von Oberflächen |
DE19816004A1 (de) * | 1998-04-09 | 1999-10-14 | Daimler Chrysler Ag | Anordnung zur Fahrbahnzustandserkennung |
US20050279949A1 (en) * | 1999-05-17 | 2005-12-22 | Applera Corporation | Temperature control for light-emitting diode stabilization |
JP2001281473A (ja) * | 2000-03-28 | 2001-10-10 | Toshiba Corp | フォトニクス結晶及びその製造方法、光モジュール並びに光システム |
JP2004219322A (ja) * | 2003-01-16 | 2004-08-05 | Astem:Kk | 非破壊分光測定器 |
US7422988B2 (en) * | 2004-11-12 | 2008-09-09 | Applied Materials, Inc. | Rapid detection of imminent failure in laser thermal processing of a substrate |
JP4688632B2 (ja) * | 2005-10-27 | 2011-05-25 | 京セラ株式会社 | サブキャリアおよび半導体装置 |
ATE524205T1 (de) * | 2009-02-11 | 2011-09-15 | Braun B Avitum Ag | Vorrichtung zur extrakorporalen blutbehandlung |
KR20150097764A (ko) * | 2012-12-21 | 2015-08-26 | 마이크로닉스 인코포레이티드. | 휴대형 형광 검출 시스템 및 미량분석 카트리지 |
US9187099B2 (en) * | 2013-10-17 | 2015-11-17 | Richard M. Powers | Systems and methods for predicting weather performance for a vehicle |
BR112016009206B1 (pt) * | 2013-10-24 | 2022-03-29 | The Regents Of The University Of Michigan | Sistema de detecção de gelo e água |
WO2015104885A1 (fr) * | 2014-01-09 | 2015-07-16 | シャープ株式会社 | Dispositif de détection d'intensité de lumière et procédé de détection |
JP2014197005A (ja) * | 2014-04-25 | 2014-10-16 | 株式会社ヴィーネックス | 光学ラインセンサ装置及び有価紙面の鑑別方法 |
JP6660582B2 (ja) * | 2015-09-29 | 2020-03-11 | パナソニックIpマネジメント株式会社 | 物質検出装置及び物質検出システム |
EP3411660A4 (fr) * | 2015-11-30 | 2019-11-27 | Luminar Technologies, Inc. | Système lidar avec laser distribué et plusieurs têtes de détection et laser pulsé pour système lidar |
US10761195B2 (en) * | 2016-04-22 | 2020-09-01 | OPSYS Tech Ltd. | Multi-wavelength LIDAR system |
-
2019
- 2019-03-12 DE DE102019203318.0A patent/DE102019203318A1/de active Pending
-
2020
- 2020-02-11 EP EP20706637.4A patent/EP3938761A1/fr not_active Withdrawn
- 2020-02-11 JP JP2021554609A patent/JP2022524603A/ja active Pending
- 2020-02-11 US US17/420,375 patent/US20220057324A1/en not_active Abandoned
- 2020-02-11 WO PCT/EP2020/053406 patent/WO2020182388A1/fr unknown
- 2020-02-11 CN CN202080020253.9A patent/CN113574364A/zh active Pending
- 2020-02-11 KR KR1020217032227A patent/KR20210135574A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2022524603A (ja) | 2022-05-09 |
KR20210135574A (ko) | 2021-11-15 |
CN113574364A (zh) | 2021-10-29 |
DE102019203318A1 (de) | 2020-09-17 |
US20220057324A1 (en) | 2022-02-24 |
WO2020182388A1 (fr) | 2020-09-17 |
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