EP3850116B1 - Use of a copper alloy - Google Patents

Use of a copper alloy Download PDF

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Publication number
EP3850116B1
EP3850116B1 EP19773350.4A EP19773350A EP3850116B1 EP 3850116 B1 EP3850116 B1 EP 3850116B1 EP 19773350 A EP19773350 A EP 19773350A EP 3850116 B1 EP3850116 B1 EP 3850116B1
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Prior art keywords
casting
copper alloy
copper
alloy
mould
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German (de)
French (fr)
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EP3850116A1 (en
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Peter Böhlke
Hans-Günter Wobker
Hark Schulze
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KME Special Products and Solutions GmbH
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KME Special Products and Solutions GmbH
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
    • B22D11/04—Continuous casting of metals, i.e. casting in indefinite lengths into open-ended moulds
    • B22D11/059—Mould materials or platings
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper

Definitions

  • the invention relates to the use of a copper alloy having the features of patent claim 1.
  • Copper is a material with very high thermal and electrical conductivity, excellent corrosion resistance, moderate strength and good formability. By adding alloying elements, the properties of copper alloys are adjusted to suit the specific application.
  • copper alloys made of high-strength copper-chromium-zirconium or ductile copper-silver are generally used to manufacture casting molds for continuous casting.
  • the demands on the materials used are constantly increasing, since the performance of the casting systems is constantly increasing. This applies in particular to high-performance casting machines with very high casting speeds, e.g. B. thin slab casters.
  • Copper alloys and their use for casting molds are in WO 2004/074526 A2 or the U.S. 2015/0376755 A1 disclosed.
  • the copper alloys disclosed there have chromium contents of up to 0.40% by weight or 0.6% by weight.
  • the invention is based on the object of demonstrating a copper alloy which, when used for a casting mold or a casting mold component, achieves high performance and improved service life.
  • the copper alloy consists of 0.020 - 0.50 silver (Ag), 0.050 - 0.50 zirconium (Zr), maximum 0.060 phosphorus (P), maximum 0.005 chromium (Cr) with the remainder copper (Cu) and other alloying elements including unavoidable impurities, the proportion of other alloying elements being less than or equal to ( ⁇ ) 0.50.
  • the copper material proposed according to the invention is a copper alloy with high thermal conductivity, sufficiently high strength and delayed crack initiation and growth.
  • the electrical conductivity is between 50 and 54 MS/m.
  • a particularly advantageous version of the copper alloy consists of 0.080 - 0.120 silver (Ag), 0.070 - 0.200 zirconium (Zr), 0.0015 - 0.025 phosphorus (P), a maximum of 0.005 chromium (Cr) in weight percentages (mass proportions of the melting analysis in %). the remainder copper (Cu) and other alloying elements including unavoidable impurities, with the proportion of other alloying elements being less than or equal to 0.10.
  • the chromium content is less than or equal to ( ⁇ ) 0.005% by weight.
  • the chromium content in the copper alloy according to the invention is kept less than 0.005% by weight since chromium is precipitated in the copper alloy system as secondary phases which are brittle and can negatively affect the fatigue strength of the copper alloy.
  • the low-alloy copper-zirconium-silver (CuZrAg) material provided according to the invention shows very advantageous properties for casting molds or components of casting molds, in particular mold plates.
  • the silver content increases the creep strength of the casting molds or casting mold components made of the copper alloy.
  • the zirconium content in the system combines high conductivity with strength values that are unusual for copper materials with a low alloy content.
  • the increase in strength is achieved through a combination of the mechanisms of solid solution strengthening (through Ag), cold working of 10 to 50% and in particular in a range of 10 to 40% and precipitation hardening (through Zr in the form of CuZr and/or ZrP precipitates). .
  • Zirconium in particular is very effective here.
  • the alloying of zirconium to the extent of the invention causes a slight reduction in ductility and thermal and electrical conductivity, but this achieves an appropriate increase in strength, thermal stability and tribological resistance.
  • the copper material according to the invention has a high softening temperature of 530° C., measured according to DIN ISO 5182.
  • An advantageous copper alloy has a zirconium (Zr) content of 0.130% by weight, a silver (Ag) content of 0.1% by weight and a phosphorus (P) content of 0.0045% by weight.
  • Zr zirconium
  • Ag silver
  • P phosphorus
  • the low-alloy copper material with a silver and zirconium content of up to 0.50% by weight shows properties in a special way that are suitable for use in casting molds or casting mold components. These include improved strength and high thermal softening resistance with almost the same thermal conductivity.
  • the copper material also shows improved fatigue resistance compared to copper-chromium-zirconium alloys (CuCrZr).
  • the material of a casting mold or a casting mold component is subjected to very high thermal loads on the casting side during use. With softer materials such as CuAg, the resulting stresses often lead to plastic flow of the material in this area (bulging). Due to the higher strength of the copper alloy according to the invention compared to CuAg, this deformation does not take place or takes place to a significantly lesser extent than is the case with CuAg.
  • the thermal conductivity, which is improved compared to a CuCrZr alloy, also results in a reduced temperature level on the casting side, which in turn reduces the stresses present there. A crack initiation by stress peaks as in the case of CuCrZr only takes place with a delay.
  • the strength and the softening resistance can be specifically adjusted through the alloy composition, cold forming and appropriate hardening parameters. This makes it possible to produce casting molds or casting mold components, for example mold plates, which on the one hand Allow a certain amount of recrystallization on the hot side, where they come into contact with the molten metal, and thus achieve favorable fatigue properties, and on the other hand, on the cold side, where they come into contact with the cooling medium, they do not show any plastic deformation due to the increased strength.
  • a copper alloy in the medium hardness range is considered to be advantageous because delayed crack initiation and delayed crack growth are to be expected here.
  • Hardness values in the range of 110 HBW are achieved. These values are therefore between the typical values of copper alloys for casting molds and for casting mold components.
  • the conductivity of the copper alloy according to the invention is up to 95% IACS above CuCrZr and almost in the range of CuAg materials. However, the resistance to softening at > 500°C is surprisingly in the range of CuCrZr materials.
  • Such a combination is very positive for the use of the copper alloy according to the invention as a material for casting molds or casting mold components, in particular for permanent molds.
  • the copper alloy may be hot worked and/or cold worked after casting. To set a small grain size, quenching from the forming heat is recommended. A separate solution anneal leads to a coarser microstructure, possibly to secondary recrystallization. To achieve medium strength, cold forming must be carried out before and, if necessary, after hardening. Hardening takes place at 350 to 500 °C.
  • the conductivity of the copper material is adjusted by heat treatment, with conductivities of up to 370 W/m ⁇ K or 50 to 54 MS/m being adjusted here.
  • the copper alloy proposed within the scope of the invention is particularly well suited as a material for the production of casting molds or casting mold components.
  • a mold component is, for example, a mold plate.
  • Casting molds according to the invention can be used for the continuous casting of ingots, billets, slabs, in particular thin slabs. Furthermore, from this Material other casting molds or casting mold components such as casting wheels, rollers and rolls or even crucibles can be produced.
  • a use for components of welding technology such as welding electrodes, caps, rollers or nozzles is also conceivable due to the advantageous properties of the material.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Continuous Casting (AREA)
  • Conductive Materials (AREA)

Description

Die Erfindung betrifft eine Verwendung einer Kupferlegierung mit den Merkmalen des Patentanspruchs 1.The invention relates to the use of a copper alloy having the features of patent claim 1.

Kupfer ist ein Werkstoff mit sehr hoher Leitfähigkeit für Wärme und Elektrizität, ausgezeichneter Korrosionsbeständigkeit, mittlerer Festigkeit und guter Umformbarkeit. Durch den Zusatz von Legierungselementen werden die Eigenschaften von Kupferlegierungen anwendungsspezifisch eingestellt.Copper is a material with very high thermal and electrical conductivity, excellent corrosion resistance, moderate strength and good formability. By adding alloying elements, the properties of copper alloys are adjusted to suit the specific application.

Zur Herstellung von Gießformen für den Strangguss werden heute in der Regel je nach spezifischem Einsatzfall Kupferlegierungen aus hochfestem Kupfer-Chrom-Zirkon oder duktilem Kupfer-Silber eingesetzt. Die Anforderungen an die verwendeten Werkstoffe werden stetig höher, da die Leistungen der Gießanlagen immer weiter erhöht werden. Dies gilt insbesondere für Hochleistungsgießanlagen mit sehr hohen Gießgeschwindigkeiten, wie z. B. Dünnbrammengießanlagen.Depending on the specific application, copper alloys made of high-strength copper-chromium-zirconium or ductile copper-silver are generally used to manufacture casting molds for continuous casting. The demands on the materials used are constantly increasing, since the performance of the casting systems is constantly increasing. This applies in particular to high-performance casting machines with very high casting speeds, e.g. B. thin slab casters.

Kupferlegierungen und deren Verwendung für Gießformen sind in der WO 2004/074526 A2 oder der US 2015/0376755 A1 offenbart. Die dort offenbarten Kupferlegierungen weisen Chromanteile bis zu 0,40 Gew.-% bzw. 0,6 Gew.-% auf.Copper alloys and their use for casting molds are in WO 2004/074526 A2 or the U.S. 2015/0376755 A1 disclosed. The copper alloys disclosed there have chromium contents of up to 0.40% by weight or 0.6% by weight.

Trotz ausgefeilter konstruktiver Auslegung der Gießformen erzeugen die im Einsatz herrschenden extrem hohen Wärmebelastungen und starken Temperaturwechsel eine sehr hohe Belastung der Kokillenwerkstoffe. Eine häufige Ausfallursache bei höherfesten Werkstoffen wie CuCrZr ist eine beginnende Rissbildung aufgrund der vorliegenden Kombination aus thermischen und mechanischen Ermüdungen. Dies geschieht in der Regel im Badspiegel-Bereich, in welchem die höchsten thermischen Belastungen vorliegen. Bei weicheren, duktileren Werkstoffen wie Kupfer-Silber tritt dagegen in der Regel keine Rissbildung auf, sondern eine unerwünschte bleibende plastische Verformung der Gießform, das sogenannte Bulging. Diese wird durch hohe mechanische Spannungen aufgrund unterschiedlicher thermischer Ausdehnungen innerhalb der Gießform hervorgerufen. Bleibende Verformungen treten dann auf, wenn die Materialfestigkeit, d.h. die Streckgrenze, durch diese Spannungen überschritten wird.Despite the sophisticated design of the casting molds, the extremely high thermal loads and strong temperature changes that occur during use create a very high load on the mold materials. A common cause of failure in high-strength materials such as CuCrZr is the onset of cracking due to the combination of thermal and mechanical fatigue. This usually happens in the bath mirror area, where the highest thermal loads are present. In the case of softer, more ductile materials such as copper-silver, on the other hand, no cracking usually occurs, but an undesirable permanent plastic deformation of the casting mold, known as bulging. This is caused by high mechanical stresses due to different thermal expansions within the casting mold. Permanent deformation occurs when the material strength, i.e. the yield point, is exceeded by these stresses.

Aufgrund der vorgeschilderten Effekte können häufig die Standzeitvorgaben nicht eingehalten oder die Leistung der Gießanlage nicht weiter gesteigert werden. Ähnlich nachteilige Effekte können sich bei der Verwendung von Kupferlegierungen für thermisch und mechanisch hoch belastete, stromführende Komponenten der Schweißtechnik ergeben, wie z.B. für Schweißelektroden, Schweißkappen Schweißrollen, Elektrodenhalter oder Schweißdüsen.Due to the effects described above, the service life specifications can often not be met or the performance of the casting plant cannot be increased further. Similarly disadvantageous effects can arise when using copper alloys for thermally and mechanically highly stressed, current-carrying components of welding technology, such as for welding electrodes, welding caps, welding rollers, electrode holders or welding nozzles.

Der Erfindung liegt ausgehend vom Stand der Technik die Aufgabe zugrunde, eine Kupferlegierung aufzuzeigen, die bei der Verwendung für eine Gießform oder ein Gießformbauteil eine hohe Leistungsfähigkeit und verbesserte Standzeit erreicht.Proceeding from the prior art, the invention is based on the object of demonstrating a copper alloy which, when used for a casting mold or a casting mold component, achieves high performance and improved service life.

Die Lösung dieser Aufgabe besteht in einer Kupferlegierung gemäß Patentanspruch 1.The solution to this problem consists in a copper alloy according to patent claim 1.

Erfindungsgemäß besteht die Kupferlegierung in Gewichtsprozenten (Masseanteile der Schmelzanalyse in %) aus 0,020 - 0,50 Silber (Ag), 0,050 - 0,50 Zirkon (Zr), maximal 0,060 Phosphor (P), maximal 0,005 Chrom (Cr) mit dem Rest Kupfer (Cu) und sonstigen Legierungselementen einschließlich unvermeidbarer Verunreinigungen, wobei der Anteil sonstiger Legierungselemente kleiner gleich (≤) 0,50 ist.According to the invention, the copper alloy consists of 0.020 - 0.50 silver (Ag), 0.050 - 0.50 zirconium (Zr), maximum 0.060 phosphorus (P), maximum 0.005 chromium (Cr) with the remainder copper (Cu) and other alloying elements including unavoidable impurities, the proportion of other alloying elements being less than or equal to (≤) 0.50.

Bei dem erfindungsgemäß vorgeschlagenen Kupferwerkstoff handelt es sich um eine Kupferlegierung mit hoher Wärmeleitfähigkeit, ausreichend hoher Festigkeit und verzögerter Rissinitiierung und -wachstum. Die elektrische Leitfähigkeit liegt zwischen 50 und 54 MS/m.The copper material proposed according to the invention is a copper alloy with high thermal conductivity, sufficiently high strength and delayed crack initiation and growth. The electrical conductivity is between 50 and 54 MS/m.

Eine besonders vorteilhafte Ausführung der Kupferlegierung besteht in Gewichtsprozenten (Masseanteile der Schmelzanalyse in %) aus 0,080 - 0,120 Silber (Ag), 0,070 - 0,200 Zirkon (Zr), 0,0015 - 0,025 Phosphor (P), maximal 0,005 Chrom (Cr) mit dem Rest Kupfer (Cu) und sonstigen Legierungselementen einschließlich unvermeidbarer Verunreinigungen, wobei der Anteil sonstiger Legierungselemente kleiner gleich 0,10 ist.A particularly advantageous version of the copper alloy consists of 0.080 - 0.120 silver (Ag), 0.070 - 0.200 zirconium (Zr), 0.0015 - 0.025 phosphorus (P), a maximum of 0.005 chromium (Cr) in weight percentages (mass proportions of the melting analysis in %). the remainder copper (Cu) and other alloying elements including unavoidable impurities, with the proportion of other alloying elements being less than or equal to 0.10.

Ein Aspekt der Erfindung sieht vor, dass der Chromgehalt kleiner gleich (≤) 0,005 Gew.-% ist. Der Chromgehalt in der erfindungsgemäßen Kupferlegierung wird kleiner als 0,005 Gew.-% gehalten, da Chrom in dem Kupferlegierungssystem als Sekundärphasen ausgeschieden wird, die sprödbrüchig sind und die Wechsel-/ Festigkeit der Kupferlegierung negativ beeinflussen können. Überraschenderweise zeigt der erfindungsgemäß vorgesehene niedriglegierte Kupfer-Zirkon-Silber (CuZrAg)-Werkstoff sehr vorteilhafte Eigenschaften für Gießformen bzw. Bauteile von Gießformen, insbesondere Kokillenplatten. Der Silberanteil erhöht die Zeitstandfestigkeit der Gießformen bzw. Gießformbauteile aus der Kupferlegierung. Der Zirkonanteil verbindet im System eine hohe Leitfähigkeit mit Festigkeitswerten, die für Kupferwerkstoffe mit niedrigem Legierungsgehalt unüblich sind. Die Festigungssteigerung wird durch eine Kombination der Mechanismen von Mischkristallverfestigung (durch Ag), eine Kaltumformung von 10 bis 50 % und insbesondere in einem Bereich von 10 bis 40 % und Ausscheidungshärtung (durch Zr in Form von CuZr- und/oder ZrP-Ausscheidungen) erreicht. Hierbei ist insbesondere das Zirkon sehr effektiv. Zwar bewirkt die Zulegierung von Zirkon im erfindungsgemäßen Maße eine geringe Verminderung der Duktilität sowie der thermischen und auch elektrischen Leitfähigkeit, jedoch wird dadurch eine zweckentsprechende Steigerung der Festigkeit, der thermischen Stabilität und der tribologischen Beständigkeit erreicht.One aspect of the invention provides that the chromium content is less than or equal to (≦) 0.005% by weight. The chromium content in the copper alloy according to the invention is kept less than 0.005% by weight since chromium is precipitated in the copper alloy system as secondary phases which are brittle and can negatively affect the fatigue strength of the copper alloy. Surprisingly, the low-alloy copper-zirconium-silver (CuZrAg) material provided according to the invention shows very advantageous properties for casting molds or components of casting molds, in particular mold plates. The silver content increases the creep strength of the casting molds or casting mold components made of the copper alloy. The zirconium content in the system combines high conductivity with strength values that are unusual for copper materials with a low alloy content. The increase in strength is achieved through a combination of the mechanisms of solid solution strengthening (through Ag), cold working of 10 to 50% and in particular in a range of 10 to 40% and precipitation hardening (through Zr in the form of CuZr and/or ZrP precipitates). . Zirconium in particular is very effective here. Although the alloying of zirconium to the extent of the invention causes a slight reduction in ductility and thermal and electrical conductivity, but this achieves an appropriate increase in strength, thermal stability and tribological resistance.

Weiterhin weist der erfindungsgemäße Kupferwerkstoff eine hohe Entfestigungstemperatur von 530 °C, gemessen nach DIN ISO 5182, auf.Furthermore, the copper material according to the invention has a high softening temperature of 530° C., measured according to DIN ISO 5182.

Eine vorteilhafte Kupferlegierung weist einen Zirkonanteil (Zr) von 0,130 Gew.-%, einen Silberanteil (Ag) von 0,1 Gew.-% sowie einen Phosphoranteil (P) von 0,0045 Gew.-% auf. Bei einer solchen Kupferlegierung wurde eine Härte von 97 HBW 2,5/62,5 und eine elektrische Leitfähigkeit von 53,7 MS/m gemessen.An advantageous copper alloy has a zirconium (Zr) content of 0.130% by weight, a silver (Ag) content of 0.1% by weight and a phosphorus (P) content of 0.0045% by weight. A hardness of 97 HBW 2.5/62.5 and an electrical conductivity of 53.7 MS/m were measured for such a copper alloy.

Der niedrig legierte Kupferwerkstoff mit Gehalten an Silber und Zirkon bis 0,50 Gew.-% zeigt in besonderer Weise Eigenschaften, die für eine Verwendung in Gießformen oder Gießformbauteilen geeignet sind. Hierzu zählen eine verbesserte Festigkeit und eine hohe thermische Erweichungsbeständigkeit bei annähernd gleichbleibender Wärmeleitfähigkeit. Auch zeigt der Kupferwerkstoff eine verbesserte Ermüdungsbeständigkeit gegenüber Kupfer-Chrom-Zirkon-Legierungen (CuCrZr).The low-alloy copper material with a silver and zirconium content of up to 0.50% by weight shows properties in a special way that are suitable for use in casting molds or casting mold components. These include improved strength and high thermal softening resistance with almost the same thermal conductivity. The copper material also shows improved fatigue resistance compared to copper-chromium-zirconium alloys (CuCrZr).

Der Werkstoff einer Gießform oder eines Gießformbauteils wird im Einsatz auf der Gießseite thermisch sehr hoch belastet. Die entstehenden Spannungen führen bei weicheren Werkstoffen wie CuAg häufig zu einem plastischen Fließen des Werkstoffs in diesem Bereich (Bulging). Aufgrund der höheren Festigkeit der erfindungsgemäßen Kupferlegierung im Vergleich zu CuAg findet diese Verformung nicht bzw. in deutlich geringerem Maße statt wie es bei CuAg der Fall ist. Die gegenüber einer CuCrZr-Legierung verbesserte thermische Leitfähigkeit bewirkt auch ein reduziertes Temperaturniveau auf der Gießseite, was wiederum die dort vorliegenden Spannungen reduziert. Eine Rissinitiierung durch Spannungsspitzen wie beim CuCrZr findet erst verzögert statt.The material of a casting mold or a casting mold component is subjected to very high thermal loads on the casting side during use. With softer materials such as CuAg, the resulting stresses often lead to plastic flow of the material in this area (bulging). Due to the higher strength of the copper alloy according to the invention compared to CuAg, this deformation does not take place or takes place to a significantly lesser extent than is the case with CuAg. The thermal conductivity, which is improved compared to a CuCrZr alloy, also results in a reduced temperature level on the casting side, which in turn reduces the stresses present there. A crack initiation by stress peaks as in the case of CuCrZr only takes place with a delay.

Die Festigkeit und die Erweichungsbeständigkeit können gezielt eingestellt werden durch die Legierungszusammensetzung, eine Kaltumformung und entsprechende Aushärteparameter. Dadurch wird die Herstellung von Gießformen oder Gießformbauteilen, beispielsweise Kokillenplatten möglich, die zum einen auf der Heißseite, in der sie in Kontakt mit der Metallschmelze gelangen, im Einsatz ein gewisses Maß an Rekristallisation zulassen und dadurch günstige Ermüdungseigenschaften erreichen und zum anderen auf der Kaltseite, wo sie in Kontakt mit Kühlmedium gelangen, aufgrund der gesteigerten Festigkeit keine plastische Verformung zeigen.The strength and the softening resistance can be specifically adjusted through the alloy composition, cold forming and appropriate hardening parameters. This makes it possible to produce casting molds or casting mold components, for example mold plates, which on the one hand Allow a certain amount of recrystallization on the hot side, where they come into contact with the molten metal, and thus achieve favorable fatigue properties, and on the other hand, on the cold side, where they come into contact with the cooling medium, they do not show any plastic deformation due to the increased strength.

Im Rahmen der Erfindung wird eine Kupferlegierung im mittleren Härtebereich als vorteilhaft angesehen, weil hier eine verzögerte Rissinitiierung und ein verzögertes Risswachstum zu erwarten ist. Härtewerte im Bereich von 110 HBW werden erreicht. Diese Werte liegen damit zwischen den typischen Werten von Kupferlegierungen für Gießformen bzw. für Gießformbauteile. Die Leitfähigkeit der erfindungsgemäßen Kupferlegierung liegt mit bis zu 95 % IACS über CuCrZr und annähernd im Bereich der CuAg-Werkstoffe. Allerdings liegt die Erweichungsbeständigkeit dagegen mit > 500°C erstaunlicherweise im Bereich der CuCrZr-Werkstoffe. Eine solche Kombination ist sehr positiv für die Verwendung der erfindungsgemäßen Kupferlegierung als Werkstoff für Gießformen bzw. Gießformbauteilen, insbesondere für Kokillen.In the context of the invention, a copper alloy in the medium hardness range is considered to be advantageous because delayed crack initiation and delayed crack growth are to be expected here. Hardness values in the range of 110 HBW are achieved. These values are therefore between the typical values of copper alloys for casting molds and for casting mold components. The conductivity of the copper alloy according to the invention is up to 95% IACS above CuCrZr and almost in the range of CuAg materials. However, the resistance to softening at > 500°C is surprisingly in the range of CuCrZr materials. Such a combination is very positive for the use of the copper alloy according to the invention as a material for casting molds or casting mold components, in particular for permanent molds.

Die Kupferlegierung kann nach dem Gießen warmumgeformt und/oder kaltumgeformt werden. Zur Einstellung einer kleinen Korngröße ist ein Abschrecken aus der Umformwärme zu empfehlen. Eine separate Lösungsglühung führt zu einem gröberen Gefüge, ggf. zu einer sekundären Rekristallisation. Zur Einstellung einer mittleren Festigkeit ist eine Kaltumformung vor und ggf. nach dem Aushärten durchzuführen. Das Aushärten erfolgt bei 350 bis 500 °C.The copper alloy may be hot worked and/or cold worked after casting. To set a small grain size, quenching from the forming heat is recommended. A separate solution anneal leads to a coarser microstructure, possibly to secondary recrystallization. To achieve medium strength, cold forming must be carried out before and, if necessary, after hardening. Hardening takes place at 350 to 500 °C.

Eine Einstellung der Leitfähigkeit des Kupferwerkstoffs erfolgt durch eine Wärmebehandlung, wobei hier Leitfähigkeiten von bis zu 370 W/m·K bzw. 50 bis 54 MS/m eingestellt werden.The conductivity of the copper material is adjusted by heat treatment, with conductivities of up to 370 W/m·K or 50 to 54 MS/m being adjusted here.

Die im Rahmen der Erfindung vorgeschlagene Kupferlegierung ist besonders gut geeignet als Werkstoff für die Herstellung von Gießformen oder Gießformbauteilen. Ein Gießformbauteil ist beispielsweise eine Kokillenplatte. Erfindungsgemäße Gießformen können für das Stranggießen von Blöcken, Knüppeln, Brammen, insbesondere von Dünnbrammen, verwendet werden. Weiterhin können aus diesem Werkstoff auch andere Gießformen bzw. Gießformbauteile wie Gießräder, -walzen und -rollen oder auch Schmelztiegel hergestellt werden.The copper alloy proposed within the scope of the invention is particularly well suited as a material for the production of casting molds or casting mold components. A mold component is, for example, a mold plate. Casting molds according to the invention can be used for the continuous casting of ingots, billets, slabs, in particular thin slabs. Furthermore, from this Material other casting molds or casting mold components such as casting wheels, rollers and rolls or even crucibles can be produced.

Eine Verwendung für Bauteile der Schweißtechnik wie Schweißelektroden, -kappen, -rollen oder -düsen ist aufgrund der vorteilhaften Eigenschaften des Werkstoffs ebenfalls denkbar.A use for components of welding technology such as welding electrodes, caps, rollers or nozzles is also conceivable due to the advantageous properties of the material.

Claims (6)

  1. Use of a copper alloy which in wt.% (mass fractions of the melt analysis in %) consists of: silver (Ag) 0.020-0.50 zirconium (Zr) 0.050-0.50 phosphorus (P) maximum 0.060 chromium (Cr) maximum 0.005
    The remainder is copper (Cu) and other alloy elements including unavoidable impurities, wherein the proportion of other alloy elements is equal to or less than (≤) 0.50, as a material for casting moulds or casting mould components selected from the following group comprising: mould plates, mould tubes, casting wheels, casting rollers, casting rolls, crucibles.
  2. Use according to claim 1 with a copper alloy, consisting of: silver (Ag) 0.080-0.120 zirconium (Zr) 0.070 - 0.200 phosphorus (P) 0.0015-0.025 chromium (Cr) maximum 0.005
    The remainder is copper (Cu) and other alloy elements including unavoidable impurities, wherein the proportion of other alloy elements is equal or less than (≤) 0.10.
  3. Use according to claim 1 or 2, characterised in that the copper alloy has an electrical conductivity between 50 and 54 MS/m.
  4. Use according to any of claims 1 to 3, characterised in that the casting mould or the casting mould component softens and/or re-crystallises on a hot side, facing the casting material, during the casting operation under the thermal influence of a metal melt in the region of the hot side, wherein the casting mould or the casting mould component has a cooled cold side on which the copper alloy does not soften or recrystallise during the casting operation and has a higher strength than on the side facing the metal melt.
  5. Use of a copper alloy according to any of claims 1 to 4, characterised in that after the casting the copper alloy is hot formed at temperatures between 600 and 1000°C, subsequently quenched from the forming heat at 50-2000 K/min, subsequently cold formed by 10-50% and subsequently cured at temperatures between 350-500°C, or solution annealed at temperatures between 600 and 1000°C, cold formed by 10-50% and subsequently cured at temperatures of 350-500°C.
  6. Use according to claim 5, characterised in that the material is cold formed once more after the curing period
EP19773350.4A 2018-09-14 2019-09-13 Use of a copper alloy Active EP3850116B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018122574.1A DE102018122574B4 (en) 2018-09-14 2018-09-14 Use of a copper alloy
PCT/DE2019/100816 WO2020052714A1 (en) 2018-09-14 2019-09-13 Use of a copper alloy

Publications (2)

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EP3850116A1 EP3850116A1 (en) 2021-07-21
EP3850116B1 true EP3850116B1 (en) 2022-08-03

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US (1) US20210214828A1 (en)
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JP (2) JP2021531412A (en)
KR (1) KR20210005241A (en)
CN (1) CN112055755A (en)
DE (1) DE102018122574B4 (en)
ES (1) ES2926650T3 (en)
MX (1) MX2021002612A (en)
PL (1) PL3850116T3 (en)
RU (1) RU2760444C1 (en)
WO (1) WO2020052714A1 (en)
ZA (1) ZA202101455B (en)

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CN112210684A (en) * 2020-10-15 2021-01-12 台州学院 Semiconductor target material, equipment of copper-titanium alloy for connector and preparation method

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JP2021531412A (en) 2021-11-18
WO2020052714A1 (en) 2020-03-19
DE102018122574B4 (en) 2020-11-26
ZA202101455B (en) 2022-04-28
MX2021002612A (en) 2022-02-04
PL3850116T3 (en) 2022-11-21
ES2926650T3 (en) 2022-10-27
KR20210005241A (en) 2021-01-13
US20210214828A1 (en) 2021-07-15
DE102018122574A1 (en) 2020-03-19
EP3850116A1 (en) 2021-07-21
RU2760444C1 (en) 2021-11-25
CN112055755A (en) 2020-12-08
JP2023055774A (en) 2023-04-18

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