EP3847691A1 - Porte-plaquettes - Google Patents

Porte-plaquettes

Info

Publication number
EP3847691A1
EP3847691A1 EP19766194.5A EP19766194A EP3847691A1 EP 3847691 A1 EP3847691 A1 EP 3847691A1 EP 19766194 A EP19766194 A EP 19766194A EP 3847691 A1 EP3847691 A1 EP 3847691A1
Authority
EP
European Patent Office
Prior art keywords
elements
wafer boat
receiving
support
boat according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19766194.5A
Other languages
German (de)
English (en)
Inventor
Andreas Reichart
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centrotherm International AG
Original Assignee
Centrotherm International AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centrotherm International AG filed Critical Centrotherm International AG
Publication of EP3847691A1 publication Critical patent/EP3847691A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H01L21/67316—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like

Definitions

  • the present invention relates to a wafer boat for holding wafers, in particular semiconductor wafers, the term wafer as used here encompassing generally disk-shaped substrates of any circumferential shape.
  • Wafer boats often serve to hold a large number of wafers within a process system, such as, for example, a diffusion system for semiconductor wafers, in which the semiconductor wafers are exposed to thermal processes.
  • the wafer boats have to withstand mechanical loads in particular by holding and loading and unloading the wafers.
  • they are also exposed to the respective process atmospheres to which the wafers are exposed, so that the process should not impair the wafer boats in the long term if possible.
  • a quartz wafer boat is described in DE 10 2014 002 280 A.
  • a quartz wafer boat consists of two end plates between which several elongated rod-shaped receiving elements are attached.
  • the receiving elements each have a multiplicity of parallel receiving slots transversely to the longitudinal extent. The wafers are loaded into the receiving slots, so that each wafer is held at several points by receiving elements.
  • quartz wafer boats were used, which on the one hand are insensitive to most processes and on the other hand do not contaminate the semiconductor process bring in.
  • quartz wafer boats were used, which on the one hand are insensitive to most processes and on the other hand do not contaminate the semiconductor process bring in.
  • a greater throughput of wafers / process runs is to be achieved. This can be achieved, for example, by lengthening the boats and / or reducing the slot spacing, so that the number of wafers picked up per boat increases.
  • the mass of the loaded wafers increases overall, the mass of the wafer boat not increasing to the same extent if possible.
  • a fully loaded wafer boat should be able to hold a multiple of the mass of wafers compared to the mass of the wafer boat.
  • a reduced mass of the wafer boat enables energy savings in thermal processing and also enables faster heating and cooling cycles.
  • the wafer boat should also be as filigree as possible in order to ensure a low level of shading of the wafers and thus a homogeneous processing.
  • the quartz material which is considered to be a brittle material, can no longer easily withstand the mechanical loads. This applies in particular since any mechanical processing, for example to form receiving slots, represents an injury to the material, which can lead to microcracks (notch effect).
  • the quartz material increasingly deforms under load at temperatures, in particular from 1000 ° C. Such deformation is irreversible and can render the wafer boat unusable over time.
  • SiC silicon carbide
  • Si-SiC silicon-infiltrated silicon carbide
  • a wafer boat for holding wafers, in particular semiconductor wafers, is described.
  • the wafer boat has at least two elongate receiving elements.
  • Each receiving element consists of quartz and each has a multiplicity of parallel receiving slots which extend transversely to the longitudinal extent.
  • the wafer boat has elongated support elements, with at least one support element being assigned to each receiving element.
  • the support elements consist of a second material which is different from quartz.
  • the support elements are at least partially in the direction of gravity below the respective receiving element when the wafer boat is aligned.
  • the wafer boat also has two end plates, between which the receiving elements are arranged and fastened in such a way that the receiving slots of the receiving elements are aligned with one another.
  • quartz is only an exemplary material and can be replaced by any other material that meets the necessary thermal and mechanical stress and the additional purity requirements of the receiving elements.
  • SiC and Si-SiC can be used as the second material, but also any other material which, due to its higher strength, dimensional stability and / or temperature resistance than the material of the receiving elements, is suitable for supporting the receiving elements.
  • the requirement for the material of the support elements not to contaminate the wafers is easier to meet, since the wafers are not in direct contact with the support elements.
  • FIG. 1 shows a schematic perspective view of a wafer boat according to the invention
  • Fig. 2 is a perspective, schematic partial view of the wafer boat in
  • Fig. 3 is a schematic sectional view through the wafer boat according to one
  • Fig. 5 is a schematic sectional view through the wafer boat according to one
  • Fig. 6 is a schematic sectional view through the wafer boat according to one
  • Fig. 7 is a schematic sectional view through the wafer boat according to one
  • Fig. 8 is a schematic sectional view through the wafer boat according to one
  • Fig. 9 is a schematic sectional view through the wafer boat according to one
  • the wafer boat 1 is essentially formed by end plates 3, receiving elements 5.6 and support elements 7.8. As can be seen in the plan view according to FIG. 1, the wafer boat 1 has an elongated configuration, ie it has a much greater length in the longitudinal direction than in the other dimensions. At the ends of the wafer boat 1 there is an end plate 3, which is preferably made of quartz. However, it can also be constructed from another suitable material. Both the receiving elements 5, 6 and the supporting elements 7, 8, which are each mounted on the end plates 3, extend between the end plates 3, as will be explained in more detail below.
  • Carrier elements 9 are also attached to the outward-facing sides of the end plates 3 and, as is known in the art, are provided for automatic handling of the wafer boats.
  • the end plates 3 have an adapted shape with different recesses and openings. As shown, lower recesses 10 are provided, which, for example, enable proper placement.
  • positioning holes and / or other identifiers can also be provided on the end plates 3, which, for example, signal the type, the orientation and / or other properties.
  • the holding elements 5, 6 consist of upper holding elements 5 and lower holding elements 6. While the upper holding elements 5 hold the wafers, the lower holding elements 6 assume a guiding function without bearing the weight of the wafers.
  • the receiving elements 5, 6 extend between the end plates 3 and are fastened to them, in particular by welding or bonding, as will be explained in more detail below.
  • the receiving elements 5,6 consist of quartz and each have an elongated rod shape.
  • the receiving elements 5, 6 each have a central receiving area and fastening areas at the opposite ends.
  • the upper receiving elements 5 essentially have a rectangular cross section, “essentially” in particular also comprising rectangles with rounded corners.
  • the lower receiving elements 6 have zen an essentially round cross-section. In principle, however, it would also be possible for a receiving element 5, 6 to have other shapes, as will be explained in more detail below.
  • a plurality of upper receiving slots 13 and lower receiving slots 14 are formed in a narrow side of the upper receiving elements 5 and in the lower receiving elements 6, which extend transversely to the longitudinal extent of the respective receiving element 5, 6, preferably in a 90 ° Angle to the longitudinal extent.
  • Receiving slots 13, 14 are each provided with a uniform spacing from one another and they have a predetermined (constant) depth for receiving an edge region of a respective wafer to be received. The depth will preferably be approximately equal to or smaller than an edge reject area of the wafers.
  • the rod-shaped upper receptacle elements 5 are preferably attached to the end plates 3 via the attachment lugs 12 and the rod-shaped lower receptacle elements without additional attachment lugs such that the bottoms of the receptacle slots 13, 14 are inclined at 45 ° to the vertical.
  • the upper receiving slots 13 point towards one another, so that the upper receiving slots 13 essentially form an angle of 90 ° to one another.
  • the lower receiving slots 14 point towards one another, so that the lower receiving slots 14 essentially form an angle of 90 °.
  • the receiving slots 13, 14 are provided essentially over the entire length of the receiving elements 5, 6. In the end regions, adjacent to the fastening regions of the receiving elements 5, 6, respective relaxation slots 15 are provided, which have no receiving function for wafers.
  • the relaxation slots 15 have a smaller depth than the respective receiving slots 13, 14, which leads to a reduction in the mechanical tension. Although two of these relaxation slots 15 are shown, a larger or smaller number of the relaxation slots 15 can also be provided, or it is possible to dispense entirely with relaxation slots 15.
  • the slot depth of the relaxation slots 15 can decrease from the last receiving slot in the direction of the fastening area. Stresses that occur are thus gradually dismantled.
  • the relaxation slot 15 with a smaller depth enables a reduced mechanical tension in the first slot in use.
  • the attachment lugs 12 each essentially have a plate shape and generally also consist of quartz.
  • the attachment lugs 12 are formed in one piece with the end plates 3 and are formed, for example, by milling out from a plate material forming the end plates.
  • the upper receiving elements 5 are then welded or bonded to the fastening lugs 12 in order to achieve a connection with the end plates 3.
  • the attachment lugs 12 are formed in one piece with the upper receiving elements 5 and the attachment lugs 12 are then welded or bonded to the end plates 3.
  • the attachment lugs 12 are formed as separate elements and they are welded or bonded to both the end plates 3 and the upper receiving elements 5.
  • the end plates 3 are connected to the upper receiving elements 5 via respective fastening lugs 12.
  • the receiving elements 5 can also be connected to the end plates 3 via differently designed fastening lugs.
  • the support elements 7, 8 likewise extend between the end plates 3 and are mounted thereon, an upper support element 7 being assigned to each upper receiving element 5 and a lower support element 8 being assigned to each lower receiving element 6.
  • the support elements 7, 8 are made of a suitable material which, due to its higher strength, dimensional stability and / or temperature resistance than the material of the receiving elements, is suitable for supporting the receiving elements, such as silicon Umcarbide (SiC) or silicon infiltrated silicon carbide (Si-SiC).
  • the support elements 7, 8 each have an elongated rod shape. However, they can also be made from another suitable material.
  • the support elements 7, 8 are located at least partially below the respective receiving element 5, 6.
  • upper support elements 7 with an essentially rectangular cross section are located in a sufficient proximity under the upper receiving elements 5 for support.
  • the upper receiving elements 5 are passed through on the side facing away from the upper receiving slots 13 supported upper support elements 7.
  • lower support elements 8 with an essentially round cross section are located vertically below the lower receiving elements 6 at a greater distance than the distance between the upper receiving elements 5 and the upper supporting elements 7.
  • the lower receiving elements 6 can be arranged via a plurality of supports 16 in Gravity direction are supported, which bridge the distance between the lower receiving elements 6 and the lower support elements 8 for support sufficient.
  • the supports 16 can be designed as part of the lower support elements 8, as part of the lower receiving elements 6 or as separate parts.
  • the support function is ensured by sufficient proximity to the support.
  • the respective receiving elements 5 and support elements 7 can be in contact or be closely spaced. Closely spaced means a distance of less than one millimeter.
  • the distance is chosen to be at least so large that the respective receiving elements 5 are not impaired by the support elements 7 due to different thermal expansion coefficients when subjected to thermal stress.
  • the distance is selected to be at least small enough to prevent the support elements 7 from significantly deforming the receiving elements 5.
  • the distance can also be chosen to be larger if the support function is provided via supports 16 is guaranteed.
  • the supports 16 are in contact with both the respective receiving element 6 and the support element 8 or they are closely spaced from one of these two elements. For this distance between the supports 16 and the respective receiving element 6 and supporting element 8, the same conditions apply analogously as for the distance between the respective receiving element 5 and supporting element 7.
  • the surfaces of the contact surfaces are designed to be as smooth as possible, so that the contact partners can slide well onto one another.
  • FIG. 4 shows a preferred embodiment in which the support elements 7, 8 are loosely mounted on the end plates 3, so that they can expand horizontally in the longitudinal direction of the wafer boat under the influence of temperature without stressing the wafer boat by mechanical stresses.
  • the dashed lines show areas that are hidden by other elements in the side view of the wafer boat.
  • the support elements 7, 8 are fixed.
  • the support elements 7, 8 are inserted through corresponding holes in the end plates 3 and secured with caps 17 against slipping out.
  • Other suitable methods can also be used for loose storage.
  • a fixed mounting of the support elements analogous to the receiving elements is possible at least on one end plate 3. In the area of the attachment lugs 12, the support surface for the support elements 7, 8 is extended, which can be advantageous for the storage.
  • FIG. 5 shows a play 11 as part of the loose mounting of the support elements 7, 8 on the end plates 3.
  • This play 11 arises from the fact that the holes in the end plates 3 are chosen to be larger than the cross section of the respective support elements 7, 8.
  • the play is there dimensioned so that the support elements 7, 8 can expand in all directions under the influence of temperature without jamming in the holes on the end plates 3.
  • FIGS. 5 and 6 show embodiments in which the support elements 7, 8 have an essentially rectangular cross section.
  • the receiving elements 5, 6 likewise have a substantially rectangular cross section, the receiving elements 5, 6, however, preferably additionally having a cutout diagonally with respect to an aerofoil.
  • the support elements 7, 8 are in respective recesses of the receiving elements 5, 6, so that the respective receiving elements 5, 6 can be supported in a plurality of directions of force action, in particular vertically and horizontally.
  • FIGS. 6 to 10 show alternative embodiments of the support elements 7, 8 in combination with the receiving elements 5, 6.
  • FIG. 6 shows receiving elements 5 and support elements 7 which are rotated by 45 ° with respect to FIG. 5 (to the direction of gravity).
  • a wafer that is also rotated through 45 ° to the direction of gravity generates a force that acts laterally, that is perpendicular to the direction of gravity. This resulting from gravity and side force can counteract the rotated arrangement of the Aufnah meiata 5 and support elements 7 advantageous.
  • the support elements 7, 8 also have a substantially rectangular cross section.
  • the receiving elements 5, 6, on the other hand, have an essentially round cross section, the cross section of the receiving elements 5, 6 additionally having a cutout similar to the arrangement in FIGS. 5 and 6.
  • the respective support element 7, 8 is at least partially located in this cutout, so that the respective receiving elements 5, 6 can be supported in a plurality of directions of force action similar to FIG. 6.
  • the support elements 7, 8 and the receiving elements 5, 6 each have a substantially rectangular (see FIG. 8) or round (see FIG. 9) cross section.
  • the cross section of the receiving elements 5, 6 is hollow, so that the support elements 7, 8 are located inside the respective receiving elements 5, 6.
  • the recording slots 13, 14 of the receiving elements so deep that they can receive the wafers, but do not allow contact of the received wafers with the inner support elements.
  • FIG. 10 shows a further embodiment of the upper support elements 7 and upper receiving elements 5.
  • the upper receiving elements 5 have an essentially round cross section and are located on the upper support elements 7 with a bowl-shaped cross section.
  • Shell-shaped means that the upper support elements 7 at least partially encompass the respective upper receiving elements 5.
  • An empty wafer boat 1 is first brought into a loading position in the area of a loading / unloading comb, the lower recesses in the plate elements 3 serving, for example, as guide and placement recesses. Then loading / unloading combs are inserted in the vertical direction between the receiving element 5, 6. Wafers are placed on these, which are then inserted into the respective receiving slots 13, 14 of the receiving elements 5, 6 by lowering the loading / unloading combs. The wafers come to rest in the receiving slots 13, 14.
  • a wafer boat loaded in this way can then be introduced into a process chamber.
  • the wafer boat shown is intended, for example, for a process chamber of a diffusion furnace in which heat and certain process gases are applied to the wafers.
  • the wafer boat is made of quartz, it is usually insensitive to heating and the process gas atmosphere.
  • the quartz also does not introduce any impurities in the process.
  • the support elements 7, 8 prevent deformations of the receiving elements.
  • the support elements 7, 8 it is possible to use quartz in spite of the large length of the receiving elements 5. Since the support elements do not come into contact with the wafers, contamination is excluded, so that SiC or Si-SiC can be used for the support elements in the preferred embodiment.
  • the fastening of the support elements 7, 8 via the loose bearing enables a reduction in mechanical stresses in the wafer boat.
  • the cross-sectional shapes of both the receiving elements and the support elements can differ from the shape shown.
  • the shape of the mounting of the receiving elements and support elements on the end plates can also differ from the shape shown.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un porte-plaquettes pour la réception de plaquettes, en particulier de plaquettes semi-conductrices. Le porte-plaquettes comprend au moins deux éléments de réception allongés. Chaque élément de réception est composé de quartz et comprend respectivement une pluralité de fentes de réception parallèles s'étendant transversalement à la longueur. Le porte-plaquettes comprend en outre des éléments de support allongés, chaque élément de réception ayant au moins un élément de support qui lui est associé. Les éléments de support sont composés d'un deuxième matériau qui diffère du quartz. Les éléments de support se trouvent, dans une orientation de travail du porte-plaquettes, au moins partiellement en dessous de l'élément de réception respectif au sens de la pesanteur. Le porte-plaquettes comprend en outre des plaques terminales, entre lesquelles les éléments de réception sont disposés et fixés de telle façon que les fentes de réception des éléments de réception sont orientées les unes vers les autres. Pour le deuxième matériau il est possible d'utiliser, par exemple, du SiC et du Si-SiC, mais aussi tout autre matériau qui est adapté, par une résistance, une stabilité de forme et/ou une résistance à la température supérieures à celles du matériau des éléments de réception, à soutenir les éléments de réception. L'exigence sur le matériau des éléments de support de ne pas contaminer les plaquettes est en outre plus facile à satisfaire, étant donné que les plaquettes ne sont pas en contact direct avec les éléments de support.
EP19766194.5A 2018-09-06 2019-08-27 Porte-plaquettes Withdrawn EP3847691A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018215183 2018-09-06
PCT/EP2019/072885 WO2020048833A1 (fr) 2018-09-06 2019-08-27 Porte-plaquettes

Publications (1)

Publication Number Publication Date
EP3847691A1 true EP3847691A1 (fr) 2021-07-14

Family

ID=67928801

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19766194.5A Withdrawn EP3847691A1 (fr) 2018-09-06 2019-08-27 Porte-plaquettes

Country Status (4)

Country Link
EP (1) EP3847691A1 (fr)
CN (1) CN110880466A (fr)
DE (1) DE102019212796A1 (fr)
WO (1) WO2020048833A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114351256A (zh) * 2020-10-13 2022-04-15 中国科学院微电子研究所 晶舟、拆装工具以及晶圆加工设备
CN112497114B (zh) * 2020-12-17 2022-07-19 苏州博莱特石英有限公司 一种石英承载装置
CN113363190B (zh) * 2021-05-31 2022-07-08 北海惠科半导体科技有限公司 晶舟、扩散设备及半导体器件制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3907301A1 (de) * 1989-03-07 1990-09-13 Claus Und Andrea Holm Fa Dr Vorrichtung zur halterung eines kollektivs von halbleiterscheiben bei thermischen oder chemischen behandlungsschritten und ihre verwendung
JPH04304652A (ja) * 1991-04-01 1992-10-28 Hitachi Ltd 熱処理装置用ボート
JP3755836B2 (ja) * 1994-10-03 2006-03-15 東芝セラミックス株式会社 縦型ボート
KR100224659B1 (ko) * 1996-05-17 1999-10-15 윤종용 종형 기상 성장 장치용 캡
US6318389B1 (en) * 1999-10-29 2001-11-20 Memc Electronic Materials, Inc. Apparatus for cleaning semiconductor wafers
JP2002083780A (ja) * 2000-09-05 2002-03-22 Hitachi Kokusai Electric Inc 半導体製造装置
KR100496134B1 (ko) * 2002-09-12 2005-06-20 주식회사 테라세미콘 초고온용 반도체 기판 홀더와 이를 장착하는 기판 로딩용보트및 이를 포함하는 초고온 열처리 장치
TW201320222A (zh) * 2011-06-23 2013-05-16 Entegris Inc 太陽能電池製程載具
KR20160101130A (ko) * 2013-12-20 2016-08-24 센트로테에름 포토볼타익스 아게 웨이퍼 보트

Also Published As

Publication number Publication date
CN110880466A (zh) 2020-03-13
DE102019212796A1 (de) 2020-03-12
WO2020048833A1 (fr) 2020-03-12

Similar Documents

Publication Publication Date Title
WO2020048833A1 (fr) Porte-plaquettes
DE4223327C2 (de) Waferträger
DE19649508B4 (de) Halter für Halbleiterplatten
DE69731199T2 (de) Verfahren und einrichtung zur berührungslose behandlung eines scheiben förmiges halbleitersubstrats
WO2015092038A1 (fr) Nacelle porte-plaquettes
DE112007002404T5 (de) Verfahren zum Festhalten eines Siliciumwafers, Einspannvorrichtung zur Wärmebehandlung und wärmebehandelter Wafer
DE3440111C1 (de) Traegerhorde
DE102015014903A1 (de) Waferboot und Plasma-Behandlungsvorrichtung für Wafer
EP3178109B1 (fr) Support de substrat
EP3833920B1 (fr) Contenant, four et procédé de traitement thermique d'un mélange pulvérulent
WO2012136586A1 (fr) Support de substrat
DE3419866C2 (de) Trägerhorde aus Quarzglas für scheibenförmige Substrate
EP2687454A1 (fr) Dispositif d'empilage d'au moins deux plaques de support
DE102012111078A1 (de) Substratträger
EP3379189A1 (fr) Porte-pièce et procédé de fabrication
DE3620223C2 (fr)
DE112007002287B4 (de) Verfahren und Einspannvorrichtung zum Halten eines Siliciumwafers
EP3144622B1 (fr) Porte-pièce
DE4136342A1 (de) Vorrichtung zur halterung und zum transport von substraten in vakuumanlagen
WO2002095795A2 (fr) Dispositif pour recevoir des objets en forme de disques et dispositif pour manipuler des objets
EP3092090B1 (fr) Système de stockage d'outils pour outils de pliage
DE10128097A1 (de) Halter für ein zu bearbeitendes Werkstück
DE3634935C2 (fr)
EP3472859A1 (fr) Élément de support de substrat pour un plateau support
DE102014108514B4 (de) Ofengestell zur Beschickung einer Ofenanlage mit einem Warmbehandlungsgut

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: UNKNOWN

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20210303

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20230421

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20230902