EP3836308A1 - Connecteur pour transmission à grande vitesse et procédé de fixation de soudure à la partie fourche du connecteur pour transmission à grande vitesse - Google Patents

Connecteur pour transmission à grande vitesse et procédé de fixation de soudure à la partie fourche du connecteur pour transmission à grande vitesse Download PDF

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Publication number
EP3836308A1
EP3836308A1 EP20213124.9A EP20213124A EP3836308A1 EP 3836308 A1 EP3836308 A1 EP 3836308A1 EP 20213124 A EP20213124 A EP 20213124A EP 3836308 A1 EP3836308 A1 EP 3836308A1
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EP
European Patent Office
Prior art keywords
contact
fork
speed transmission
portions
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20213124.9A
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German (de)
English (en)
Inventor
Toshiyasu Ito
Yosuke Takai
Taichi Enjoji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaichi Electronics Co Ltd
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Yamaichi Electronics Co Ltd
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Filing date
Publication date
Application filed by Yamaichi Electronics Co Ltd filed Critical Yamaichi Electronics Co Ltd
Publication of EP3836308A1 publication Critical patent/EP3836308A1/fr
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/707—Soldering or welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/06—Riveted connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
    • H01R4/4809—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar
    • H01R4/48185—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar adapted for axial insertion of a wire end
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/04—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool
    • H01R43/048—Crimping apparatus or processes

Definitions

  • the present invention relates to a connector for high-speed transmission mounted on a circuit board.
  • Patent Document 1 Japanese Patent Application Publication No. 2018-156936
  • the connector described in Patent Document 1 has a signal terminal receiving groove which is an opening portion penetrating the bottom wall of the housing from the upper portion to the lower portions of the bottom wall. Ground terminals and signal terminals are alternately inserted in the signal terminal receiving groove. The tale portion of the lower end of the signal terminal is soldered to the mounting surface of the circuit board with a solder ball, and the terminal of a counterpart connector is held by the elastic contact portion thereof.
  • soldering of this type of connector to a substrate is performed by a so-called reflow method in which a solder paste is applied to the substrate, the connector is placed on the paste-applied portion, and then the substrate and the connector are heated and cooled.
  • a first independent aspect for solving this task relates to a contact for high speed transmission including a housing and a plurality of terminals.
  • the plurality of terminals have contact portions in contact with a counterpart connector and soldering terminal portions soldered to a mounting target substrate in which the contact portions and the soldering terminal portions are arranged in the housing so as to face each other.
  • the soldering terminal portion is a fork portion, and a cut piece of a wire solder is sandwiched and crimped in the fork portion.
  • the soldering terminal portion has a base end portion and two sandwiching portions bifurcated and extending from the base end portion, and a width between inner edges of the two sandwiching portions on a tip end side is narrower than a width between inner edges on a base end portion side with respect to the tip end.
  • solder may spread up to a surface on an outer side of the fork portion, and a part of an outer surface of the fork portion may be covered by the solder.
  • the solder fixed to the fork portion may face upward, the contact portion may face downward, and the solder fixed to the fork portion may be exposed on an upper side of an upper surface of the housing.
  • the terminal may have: a first linear portion and a second linear portion extending along a fitting direction with the counterpart contact, a first curved portion curved from an end portion of the first linear portion opposite to the fork portion toward the second linear portion side and connected to one end of the second linear portion; a second curved portion curved from other end of the second linear portion to a side opposite to the first linear portion; an inclined portion extending slightly inclined from an end portion of the second curved portion toward a side away from the second linear portion; and a contact portion bending and extending from an tip end of the inclined portion.
  • the contact portion may be further inclined and extend from the base end connected to the inclined portion toward a side opposite to the second linear portion, and then bend and extend in a dogleg shape.
  • the tip end of the contact portion may face the first curved portion.
  • a width of the contact portion in a direction orthogonal to the fitting direction may be narrowed at the base end of the contact portion.
  • a width of the tip end of the contact portion in the direction orthogonal to the fitting direction may be approximately half of a width of the base end of the contact portion in the direction orthogonal to the fitting direction.
  • a convex portion protruding in the direction orthogonal to the fitting direction may be formed on a side surface of the first linear portion.
  • a second independent aspect for solving above-mentioned task relates to a solder fixing method for fixing solder to a fork portion of a contact for high speed transmission.
  • the method includes: a first step of pushing a cut piece into the fork portion; and a second step of sandwiching the cut piece of a wire solder with a tool and crimping the cut piece to the fork portion.
  • the cut piece is obtained by cutting the wire solder into a piece longer than the width of the fork portion
  • the host connector CNH and the plug connector CNP are used by soldering to the pads of an electronic substrate 90 and an extension substrate 91, respectively.
  • the plug connector CNP is mounted on the extension substrate 91 while the host connector CNH is mounted on the electronic substrate 90.
  • the fitting direction of the host connector CNH and the plug connector CNP is appropriately referred to as the Z direction
  • a direction orthogonal to the Z direction is appropriately referred to as the X direction
  • the direction orthogonal to the Z direction and the X direction is appropriately referred to as the Y direction.
  • the side where the host connector CNH is located as viewed from the plug connector CNP in the Z direction may be referred to as the upper side and the side where the plug connector CNP is located as viewed from the host connector CNH may be referred to as the lower side.
  • the host connector CNH is provided with three slots 10H arranged in the X direction in the housing 1H.
  • each of the three slots 10H of the housing 1H vertically penetrates three table portions 12H rising from the bottom portion 11H of the housing 1H.
  • a plurality of reinforcing plates 13H are bridged between the adjacent table portions 12H.
  • Three depressions 111H are formed on the outside of the table portion 12H on the +X side of the bottom portion 11H of the housing 1H.
  • Two depressions 112H are formed on the outside of the table portion 12H on the -X side of the bottom portion 11H of the housing 1H.
  • a groove 19H is provided around each of the three slots 10H on the upper surface of the housing 1H.
  • the groove 19H is formed in a rectangular frame shape that is horizontally long in the Y direction. Both sides of the groove 19H in the Y direction are open to the outside as open portions 18H.
  • the conductive resin 2HA shown in Fig. 8A is embedded in the groove 19H around the central slot 10H.
  • the conductive resin 2HA has a rectangular frame shape whose dimensions make it possible to be contained in the groove 19H.
  • a plurality of projections 23HA are formed on the inner wall surface of the side wall 21HA facing the X direction in the conductive resin 2HA.
  • An extension portion 24HA protruding outward in the Y direction is formed on the side wall 22HA facing the Y direction in the conductive resin 2HA. In a state where the conductive resin 2HA is contained in the groove 19H around the central slot 10H, the extension portion 24HA is fitted into the open portion 18H of the groove 19H. Further, the upper surface of the conductive resin 2HA is flush with the upper surface of the housing 1H.
  • the conductive resin 2HB shown in Fig. 8B is embedded in the groove 19H around the slot 10H on both sides in the X direction.
  • the conductive resin 2HB has a rectangular frame shape whose dimensions make it possible to be contained in the groove 19H.
  • a plurality of projections 23HB are formed on the inner wall surface of the side wall 21HB facing the X direction in the conductive resin 2HB.
  • An extension portion 24HB protruding outward in the Y direction is formed on the side wall 22HB facing the Y direction in the conductive resin 2HB.
  • the extension portion 24HB is fitted into the open portion 18H of the groove 19H.
  • the upper surface of the conductive resin 2HB is flush with the upper surface of the housing 1H.
  • ribs 14H-k are provided on the inner wall surfaces of the housing 1H facing each other in the X direction and sandwiching the slot 10H in the table portion 12H.
  • the ribs 14H-k protrude inwardly from the inner wall surface.
  • a plate support 16H On the upper side (+Z side) of the slot 10H in the table portion 12H of the housing 1H there is located a plate support 16H extending in the Y direction.
  • the partition wall 15H-k rises from the end surface on the inner side of the rib 14H-k toward the side of the plate support 16H.
  • the contact 3H-j includes; a first linear portion 31H extending in the Z direction; a second linear portion 32H extending in parallel with the first linear portion 31H away from the first linear portion 31H on the -X side; a fork portion 30H bifurcated and extending from one end of the first linear portion 31H; a first curved portion 33H curved from an end portion opposite to the fork portion 30H side of the first linear portion 31H to the side of the second linear portion 32H in the X direction and connected to one end of the second linear portion 32H; a second curved portion 34H curved from the other end of the second linear portion 32H to the side opposite to the first linear portion 31H in the X direction; an inclined portion 35H extending slightly inclined from the end portion of the second curved portion 34H to a side away from the second linear portion 32H; and a contact portion 37H bending and extending in a hook-shape from the tip end of the inclined portion 35H.
  • Convex portions 39aH, 39bH, and 39cH protruding outward in the Y direction are formed on the side surface of the first linear portion 31H.
  • the contact portion 37H is further inclined and extends from the base end connected to the inclined portion 35H toward the side opposite to the second linear portion 32H, and then bends and extends in a dogleg shape.
  • the tip end of the contact portion 37H faces the first curved portion 33H.
  • the width of the contact portion 37H in the Y direction is narrowed from the vicinity of the base end of the contact portion 37H.
  • the width of tip end of the contact portion 37H in the Y direction is approximately half the width of the base end of the contact portion 37H in the Y direction.
  • the fork portion 30H of the contact 3H-j is a soldering terminal portion soldered to the pad of the electronic substrate 90 which is a mounting destination.
  • the fork portion 30H has a base end portion 330, and two sandwiching portions 331 bifurcated and extending from the base end portion 330.
  • the thickness of the inner edge portions 332 of the two sandwiching portions 331 facing inward is thinner than the thickness of the sandwiching portion 331 itself.
  • the width D1 between portions on the tip end side of the inner edge portions 332 of the two sandwiching portions 331 is thinner than the width D2 between the portions of the base end portion locating nearer the base end portion 330 than the tip ends of the inner edge portions 332.
  • the edge portion of the base end portion 330 facing the side of the two sandwiching portions 331 is curved in a semicircular shape.
  • Solder is sandwiched and crimped in the fork portion 30H of the contact 3H-j.
  • the solder is fixed to the fork portion 30H by the following procedure.
  • a cut piece 300 of a wire solder is prepared by cutting the wire solder into a piece longer than the width of the fork portion 30H in the X direction.
  • the cut piece 300 of the wire solder is pushed in between the two sandwiching portions 331 of the fork portion 30H.
  • the diameter D3 of the cut piece 300 of the wire solder is smaller than the width D1 between the inner edges of the two sandwiching portions 331 on the tip end side.
  • the cut piece 300 of the wire solder When the cut piece 300 of the wire solder is pressed in, the cut piece 300 pushes the two sandwiching portions 331 outward to be contained between them, and is sandwiched between the two sandwiching portions 331. After the cut piece 300 of the wire solder is pressed in between the sandwiching portions 331 of the fork portion 30H, both ends of the cut piece 300 of the wire solder are sandwiched by a tool and crimped to the fork portion 30H.
  • the cutting of the solder and the pushing of the solder in between the sandwiching portions 331 of the fork portion 30H may be performed collectively for a plurality of contacts 3H-j. In that case, it is advisable to pass a long wire solder through the fork portion 30H of a plurality of contacts 3H-j obtained in a state of being continuously connected by press molding, and then cut the wire solder into an appropriate length.
  • the solder fixed by the above procedure spreads up to the surface on the outer side of the fork portion 30H, a part of the outer surface on the outer side of the sandwiching surface of the fork portion 30H is then covered by the solder, thus the solder is integrated with the fork portion 30H.
  • a letter (G) is attached to the ground contact 3H-j and a letter (S) is attached to the signal contact 3H-j to distinguish between the two.
  • the ground contact 3H-1(G) is contained in the gap between the inner wall of the table portion 12H on the +Y side and the partition wall 15H-1
  • the ground contact 3H-2(G) is contained in the gap between the partition wall 15H-1 and the partition wall 15H-2.
  • the signal contact 3H-3(S) is contained in the gap between the partition wall 15H-2 and the partition wall 15H-3
  • the signal contact 3H-4(S) is contained in the gap between the partition wall 15H-3 and the partition wall 15H-4. The same applies to the -X side of the long hole 17H-1.
  • solder fixed to the fork portion 30H of the contact 3H-j faces upward, and the contact portion 37H of the contact 3H-j faces downward.
  • the solder of the contact 3H-j is supported by the upper end of the rib 14H-k and the solder is exposed above the upper surface of the housing 1H.
  • a first height of the partition walls 15H-k between the ground contacts 3H-j(G) and the signal contacts 3H-j(S) in the Z direction is lower than a second height of the partition walls 15H-k between the ground contacts 3H-j(G) in the Z direction and is lower than a third height of the partition walls 15H-k between the signal contacts 3H-j(S), in the Z direction, in which the partition walls 15H-k of the second and third heights are the other partition walls 15H-k.
  • the partition wall 15H-k between the ground contacts 3H-j (G) (in the cross section of Fig. 2 , the partition wall 15H-1 at the back in the Y direction) has a lower end at substantially the same position as the lower surface of the housing 1H, and an upper end at substantially the same position as the upper surface of the housing 1H.
  • a lower end thereof locates at substantially the same position as the lower surface of the housing 1H, and an upper end thereof locates below the upper surface of the housing 1H and around the boundary between the first linear portion 31H and the second curved portion 34H of the contact 3H-j.
  • the upper end of the partition wall 15H-k between the ground contact 3H-j (G) and the signal contact 3H-j(S) is formed in a slope shape that becomes lower as the distance from the central plate support 16H increases.
  • substantially rectangular portion of the partition wall 15H-k between the ground contact 3H-j(G) and the signal contact 3H-j(S) immediately beside the contact portion 37H of the contact 3H-j is cut out so as to form a notch portion 110H.
  • first linear portion 31H and the second linear portion 32H of the ground contact 3H-j(G) are separated from the first linear portion 31H and the second linear portion 32H of the signal contact 3H-j(S) by the partition wall 15H-k
  • first curved portion 33H, the second curved portion 34H, and the contact portion 37H of the ground contact 3H-j are not separated from the first curved portion 33H, the second curved portion 34H, and the contact portion 37H of the signal contact 3H-j(G) by the partition wall 15H-k.
  • An air layer are formed between the first curved portion 33H, the second curved portion 34H, the contact portion 37H of the ground contact 3H-j(G) and the first curved portion 33H, the second curved portion 34H, the contact portion 37H of the signal contact 3H-j(S).
  • the shield plate 5H-m includes: a main body portion 51H; four fork portions 50aH, 50bH, 50cH, 50dH bifurcated and extending from four locations, separated in the Y direction, at the upper end of the main body portion 51H; contact portions 57aH, 57bH, 57cH protruding from locations sandwiching two grooves at the lower end of the main body portion 51H. Convex portions 59aH, 59bH protruding outward in the Y direction are formed on the side surface of the main body portion 51H.
  • the fork portions 50aH, 50bH, 50cH, 50dH of the contact 3H-j are a soldering terminal portions soldered to the pads of the electronic substrate 90 which is a mounting destination. Solders are sandwiched and crimped in the fork portions 50aH, 50bH, 50cH, 50dH of the shield plate 5H-m. The procedure for fixing the solders to the fork portions 50aH, 50bH, 50cH, 50dH is the same with the procedure for fixing the solder to the fork portion 30H of the contact 3H-j.
  • the shield plate 5H-m is pressed into the long hole 17H-m of the plate support 16H in the slot 10H from the upper side.
  • the solders fixed to the fork portions 50aH, 50bH, 50cH, 50dH of the shield plate 5H-m are exposed on the upper side of the upper surface of the housing 1H.
  • the ribs 14P-k are formed in a thin rectangular shape.
  • the ribs 14P-k are aligned in the Y direction at the same interval.
  • a groove 16P is provided at a position on the bottom wall 12P of the housing 1P on the side opposite to the header 10P.
  • the upper end of the header 10P is located slightly lower than the upper edges of the side walls 11 Pon both sides of the housing 1P in the X direction.
  • the lower end of the header 10P protrudes below the lower surface of the groove 16P.
  • the width of the lower portion of the long hole 17P-m in the X direction is narrower than the width of the upper portion in the X direction.
  • the conductive resin 2PA shown in Fig. 18A is fitted into the lower end of the central header 10P in the groove 16P.
  • the lower surface of the conductive resin 2PA is flush with the lower surface of the 1P.
  • the contact 3P-j includes: a contact portion 37P extending linearly in the Z direction; a bent portion 33P bending and extending from the base end of the contact portion 37P to one side of the X direction; and a fork portion 30P bifurcated and extending from the end portion opposite to the contact portion 37P at the bent portion 33P.
  • Convex portions 39aP, 39bP protruding outward in the Y direction are formed on the side surface of the contact portion 37P.
  • a hole 38 is bored in the center of the bent portion 33P in the Y direction.
  • the fork portion 30P of the contact 3P-j is a soldering terminal portion soldered to the pad of the extension substrate 91 which is a mounting destination. Solder is sandwiched and crimped in the fork portion 30P of the contact 3P-j.
  • the procedure for fixing the solder to the fork portion 30P is the same as the procedure for fixing the solder to the fork portion 30H of the contact 3H-j shown in Figs 11A - 11C .
  • the contacts 3P-j fixed with solders pass through the long hole 18P-j of the header 10P from the lower side and are contained one by one in the gaps between the adjacent ribs 14P-k in the header 10P.
  • the bent portion 33P of the contact 3P-j is supported by the edge portion of the long hole 18P-j in the bottom wall 12P of the housing 1P, and the solder of the contact 3P-j is exposed on the lower side of the lower surface of the housing 1P.
  • the shield contact 4P-m includes: a main body portion 41P; contact portions 47aP, 47bP, 47cP, 47dP bending and extending in a dogleg shape from four locations separated in the Y direction at the lower end of the main body portion 41P; and convex portions 42aP, 42bP protruding from two locations at the upper end of the main body portion 41P on the opposite side of, and between the contact portion 47aP and the contact portion 47bP, and the opposite side of, and between the contact portion 47cP and the contact portion 47dP.
  • Convex portions 49aP, 49bP protruding outward in the Y direction are formed on the side surface of the main body portion 41P.
  • the bending orientation of two contact portions 47aP and 47dP on the outer side and the bending orientation of two contact portions 47bP and 47cP on the inner side in the Y direction which is the arrangement direction of the contact portions, are reversed.
  • the upper ends of the two contact portions 47aP and 47dP on the outer side and the upper ends of the two contact portions 47bP and 47cP on the inner side are inclined in directions away from each other and open in a Y shape when viewed from the Y direction.
  • the lower ends of the convex portions 42aP, 42bP are rounded.
  • the shield plate 5P-m includes: a main body portion 51P; convex portions 52aP, 52bP, 25cP, 52dP protruding from four locations separated in the Y direction at the lower end of the main body portion 51P; and fork portions 50aP, 50bP, 50cP, 50dP bifurcated and extending four locations separated in the Y direction at the lower end of the main body portion 51P.
  • Convex portions 59aP, 59bP, 59cP protruding outward in the Y direction are formed on the side surfaces of the main body portion 51P and the convex portions 52aP and 52dP.
  • recess portions 56aP and 56bP are formed.
  • the recess portions 56aP are gouged downward between the convex portion 52aP and the convex portion 52bP, and
  • the recess portions 56bP are gouged downward between the convex portion 52cP and the convex portion 52dP.
  • the fork portions 50aP, 50bP, 50cP, 50dP of the shield plate 5P-m are soldering terminal portions soldered to the pads of the extension substrate 91 which is a mounting destination. Solders are sandwiched and crimped in the fork portions 50aP, 50bP, 50cP, 50dP of the shield plate 5P-m.
  • the procedure for fixing the solders to the fork portions 50aP, 50bP, 50cP, 50dP is the same as the procedure for fixing the solder to the fork portion 30P of the contact 3P-j.
  • the shield contact 4P-m is pressed into the long hole 17P-m of the header 10P from the upper side, and the shield plate 5P-m fixed with solders is pressed into the long hole 17P-m of the header 10P from the lower side through the long hole 27P-m of the conductive resin 2PA (or 2PB).
  • the end portion of the shield contact 4P-m and the end portion of the shield plate 5P-m abut on each other in the long hole 17P-m. More specifically, as shown in Fig.
  • a rectangular locking piece 177P-m is bridged between the inner wall surfaces of the long hole 17P-m of the header 10P facing each other in the X direction, and the shield contact 4P-m and the shield plate 5P-m are positioned by this locking piece 177P-m.
  • the end portion of the shield contact 4P-m and the end portion of the shield plate 5P-m are appropriately referred to as "the first end portion” and "the second end portion", respectively.
  • the locking piece 177P-m is fitted in a depression between the convex portion 52bP and the convex portion 52cP of the shield plate 5P-m. Further, the convex portion 42aP of the shield contact 4P-m is fitted in a depression between the convex portion 52aP and the convex portion 52bP of the shield plate 5P-m, and the convex portion 42bP of the shield contact 4P-m is fitted in a depression between the convex portion 52cP and the convex portion 52dP of the shield plate 5P-m. Further, notches are provided in the inner wall surfaces of the long hole 17P-m of the header 10P facing each other in the Y direction.
  • the convex portions 49aP and 49bP of the shield contact 4P-m and the convex portions 59aP, 59bP, 59cP of the shield plate 5P-m are engaged with the notches to prevent the shield contact 4P-m and shield plate 5P-m from coming off.
  • the long hole 17H-m of the slot 10H of the host connector CNH also has notches which play a similar role.
  • the contact portions 47aP, 47bP, 47cP, 47dP of the shield contact 4P-m of the plug connector CNP are in contact with the contact portions 57aH, 57bH, 57cH of the shield plate 5H-m of the host connector CNH, and the contact portion 37P of the contact 3P-j of the plug connector CNP is in contact with the contact portion 37H of the contact 3H-j of the host connector CNH.
  • the plug connector CNP of the present embodiment includes: a housing 1P having a long hole 17P-m extending in one direction; and a plurality of terminals arranged in the long hole 17P-m, each of which having contact portions 37P, 47aP, 47bP, 47cP, 47dP in contact with the mating connector and soldering terminal portions soldered to a mounting target substrate. Then, among these terminals, the terminals interposed between the shield plate 5H-m of the host connector CNH and the pad of the extension substrate 91 are divided into shield contacts 4P-m which are components having the contact portions 47aP, 47bP, 47cP, 47dP and shield plates 5P-m which are components having soldering terminal portions.
  • the first end portion of the shield contact 4P-m on the side opposite to the side of the contact portions 47aP, 47bP, 47cP, 47dP and the second end portion of shield plate 5P-m on the side opposite to the side of the soldering terminal portions are pressed into the long hole 17P-m from directions opposite to each other, and the first and second end portions abut on each other in the long hole 17P-m.
  • the opening portion of the long hole 17P-m of the housing 1P can be minimized, and the rigidity of the housing 1P can be ensured.
  • the host connector CNH of the present embodiment includes: a housing 1H having a plurality of slots 10H; and a plurality of contacts 3H-j including contacts 3H-j (G) which are ground terminals and contacts 3H-j(S) which are signal terminals, in which the plurality of contacts 3H-j are arranged in the slots 10H along the Y direction as a first direction orthogonal to the fitting direction of the connector.
  • Partition walls 15H-k are provided between the adjacent contacts 3H-j in the slots 10H, and the height of the partition walls 15H-k between the ground contacts 3H-j(G) and the signal contacts 3H-j(S) in the fitting direction is lower than the height of the other partition walls 15H-k in the fitting direction.
  • an air layer which is a layer of a space with a smaller dielectric constant than that of a resin partition wall 15H-k is formed between the signal contact 3H-j(S) and the ground contact 3H-j(G). Therefore, it is possible to provide a connector for high-speed transmission capable of reducing the crosstalk between the adjacent channels.
  • the host connector CNH of the present embodiment includes: a housing 1H; and a plurality of contacts 3H-j having a contact portion 37H in contact with the mating connector and a soldering terminal portion soldered to the mounting target substrate, in which the plurality of contacts 3H-j are arranged in the housing 1H with the contact portion 37H and the soldering terminal portion facing each other.
  • the soldering terminal portion is a fork portion 30H, and a cut piece 300 of a wire solder is sandwiched and crimped in the fork portion 30H.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
EP20213124.9A 2019-12-11 2020-12-10 Connecteur pour transmission à grande vitesse et procédé de fixation de soudure à la partie fourche du connecteur pour transmission à grande vitesse Withdrawn EP3836308A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911264646 2019-12-11

Publications (1)

Publication Number Publication Date
EP3836308A1 true EP3836308A1 (fr) 2021-06-16

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Application Number Title Priority Date Filing Date
EP20213124.9A Withdrawn EP3836308A1 (fr) 2019-12-11 2020-12-10 Connecteur pour transmission à grande vitesse et procédé de fixation de soudure à la partie fourche du connecteur pour transmission à grande vitesse

Country Status (2)

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EP (1) EP3836308A1 (fr)
CN (1) CN112952418B (fr)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040253852A1 (en) * 2003-06-13 2004-12-16 Regnier Kent E. Electrical connector solder terminal
US6969286B1 (en) * 2004-06-28 2005-11-29 Samtec, Inc. Connector having improved contacts with fusible members
US20100330844A1 (en) * 2007-09-28 2010-12-30 Toshiyasu Ito High density connector for high speed transmission
US8052436B1 (en) * 2010-10-22 2011-11-08 Lotes Co., Ltd. Electrical connector with stable retaining terminals
US8192206B1 (en) * 2011-01-24 2012-06-05 Lotes Co., Ltd. Electrical connector
US20120178298A1 (en) * 2011-01-11 2012-07-12 Lotes Co., Ltd Electrical connector and terminal thereof
JP2018156936A (ja) 2017-03-16 2018-10-04 モレックス エルエルシー 電気コネクタ及び電気コネクタアセンブリ
CN209329213U (zh) * 2018-07-30 2019-08-30 番禺得意精密电子工业有限公司 电连接器及电连接器组合

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040253852A1 (en) * 2003-06-13 2004-12-16 Regnier Kent E. Electrical connector solder terminal
US6969286B1 (en) * 2004-06-28 2005-11-29 Samtec, Inc. Connector having improved contacts with fusible members
US20100330844A1 (en) * 2007-09-28 2010-12-30 Toshiyasu Ito High density connector for high speed transmission
US8052436B1 (en) * 2010-10-22 2011-11-08 Lotes Co., Ltd. Electrical connector with stable retaining terminals
US20120178298A1 (en) * 2011-01-11 2012-07-12 Lotes Co., Ltd Electrical connector and terminal thereof
US8192206B1 (en) * 2011-01-24 2012-06-05 Lotes Co., Ltd. Electrical connector
JP2018156936A (ja) 2017-03-16 2018-10-04 モレックス エルエルシー 電気コネクタ及び電気コネクタアセンブリ
CN209329213U (zh) * 2018-07-30 2019-08-30 番禺得意精密电子工业有限公司 电连接器及电连接器组合

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CN112952418B (zh) 2023-04-11
CN112952418A (zh) 2021-06-11

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