Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
  • C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
  • C23C28/046—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material with at least one amorphous inorganic material layer, e.g. DLC, a-C:H, a-C:Me, the layer being doped or not
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/02—Pretreatment of the material to be coated
  • C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/02—Pretreatment of the material to be coated
  • C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
  • C23C16/029—Graded interfaces
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
  • C23C16/26—Deposition of carbon only
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
  • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
  • C23C16/32—Carbides
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
  • C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
  • C23C28/048—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material with layers graded in composition or physical properties
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
  • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
  • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
  • F16J—PISTONS; CYLINDERS; SEALINGS
  • F16J9/00—Piston-rings, e.g. non-metallic piston-rings, seats therefor; Ring sealings of similar construction
  • F16J9/26—Piston-rings, e.g. non-metallic piston-rings, seats therefor; Ring sealings of similar construction characterised by the use of particular materials

Definitions

• the present invention relates to a coated part comprising a metal substrate coated with a sublayer and a coating of hydrogenated amorphous carbon, which is deposited on the sublayer comprising chromium, carbon and silicon.
• the parts, comprising a coating, considered here, are for example friction members for the automotive, aeronautical or space sectors.
• distribution parts such as latches, pushers, or even cams to reduce the friction between these parts.
• They can also be piston pins, to reduce wear and protect the surfaces from seizing.
• a coating as described here can also be applied to components such as segments, piston skirts, liners.
• amorphous carbon coatings hydrogenated or not, have multiple applications that are not limited to components for the automotive, aeronautical or space industries.
• Guide or sliding elements such as for example on molds for the plastics industry, can also be coated with such a coating to minimize wear and friction without lubrication.
• Amorphous carbon coatings are often called “DLC” (for "Diamond Like Carbon”). They designate carbonaceous materials generally obtained in the form of a thin layer and by vacuum deposition technologies.
• a-C: H coatings for “hydrogenated amorphous carbon”. These coatings are generally produced by chemical vapor deposition assisted by plasma with a gaseous carbon precursor (which is for example acetylene (C2H2)).
• a gaseous carbon precursor which is for example acetylene (C2H2)
• DLC coatings which have a strong industrial interest are:
• the coatings "a-C” (for “amorphous carbon"), which are generally produced by magnetron cathode sputtering of a graphite target.
• the “ta-C” coatings (for “tetrahedral amorphous carbon”), which are generally produced by arc evaporation of a graphite target.
• the document FR 2 995 493 describes a more efficient device allowing, inter alia, a better adapted transfer from the plasma to the parts, so that the DLC deposition rate is doubled.
• the deposition device comprises a plasma source, the use of which is very well suited for producing DLC coatings such as those described in the document FR 2 975 404 (and also certain variants of this coating including in addition beforehand a layer of Cr chromium, or a layer of chromium and a layer of chromium nitride CrN).
• the coatings comprising a layer of Cr followed by a layer of CrN then a transition layer of hydrogenated DLC doped with silicon (aC: H: Si) and finally a coating of hydrogenated DLC (aC: H) as described in the document FR 3 011 305, fail to be deposited with correct characteristics using the device described in the document FR 2 995 493.
• a coating produced with such a source often exhibits poor quality behavior when the coating is indented by the Rockwell method under 150 kg (kilograms) to assess adhesion according to standard VDI3198.
• the indentation is noted HF3 according to this standard VDI3198 (which is considered rather bad; a good result is noted HF1 and the worst is noted HF6).
• VDI3198 which is considered rather bad; a good result is noted HF1 and the worst is noted HF6.
• the observation of the indentation a few hours after it was performed shows a spontaneous deterioration in the notation of the indentation towards HF6.
• the process parameters have been adjusted, in particular to reduce the stresses on the transition layer of hydrogenated DLC doped with silicon (aC: H: Si), in particular by lowering the ion flux that the plasma source sends to the rooms via the reduction of the power applied to the plasma source and by lowering the energy of the ions via the bias voltage.
• the improvements noted are not sufficient to obtain a coating which the Rockwell indentation is satisfactory.
• the plasma source is so efficient that it is not possible to soften the deposition conditions sufficiently for the "a-C: H: Si" layer.
• an object of the present invention is to at least partially resolve the aforementioned drawbacks.
• an object of the invention is to provide a part, comprising a hydrogenated DLC coating, in particular of the aC: H type, which makes it possible to accommodate the characteristics of the plasma of the source described in the document FR 2 995 493. .
• the present invention also aims to provide a part, with a hydrogenated DLC coating, in particular of the a-C: H type, which makes it possible to obtain good behavior in the adhesion test by Rockwell C indentation of the DLC coating.
• a part comprising a metallic substrate, a coating of hydrogenated amorphous carbon, of the aC: H type, coating the substrate, and an undercoat based on chromium (Cr), carbon. (C) and silicon (Si) disposed between the metal substrate and the coating of amorphous carbon and on which the coating of amorphous carbon is applied, characterized in that the undercoat has the following atomic proportions at its interface with the coating of amorphous carbon (i.e. on the surface of the undercoat):
• Such an undercoat composition has contents which are, for example, measurable by EDX analysis (Energy Dispersive X-Ray Spectrometry, or analysis by energy dispersion by X-rays) in a scanning electron microscope (SEM), or by GDOES ( Glow Discharge Optical Emission Spectroscopy).
• EDX analysis Energy Dispersive X-Ray Spectrometry, or analysis by energy dispersion by X-rays
• SEM scanning electron microscope
• GDOES Glow Discharge Optical Emission Spectroscopy
• an underlay has also been found to be particularly advantageous for a non-hydrogenated DLC coating, in particular of the ta-C or even aC type.
• Such an underlayer is then presented as a composition gradient layer based mainly on chromium (Cr), silicon (Si) and carbon (C).
• the sublayer is gradually enriched (starting from the substrate and in the direction of the DLC coating) with silicon (Si) and carbon (C), until a composition allowing the adhesion of the coating, as referred to above.
• the ratio between the silicon content and the chromium (Si / Cr) content of the sublayer in the vicinity of the interface with the DLC is between 0.38 and 0.60, or even between 0 , 40 and 0.60.
• the ratio between the carbon content and the silicon (C / Si) content of the sublayer in the vicinity of the interface with the DLC is between 2.8 and 3.2, or even between 2 , 9 and 3.1.
• the sublayer may optionally contain nitrogen (N). This is particularly advantageous if the part also comprises a layer of chromium nitride, as described below.
• the sub-layer further comprises nitrogen atoms (N), a ratio between a nitrogen content and the chromium content (N / Cr) being less than 0.70 in the vicinity of the interface with the DLC, that is to say at the interface between the sublayer and the coating of amorphous carbon.
• the ratio between the nitrogen content and the chromium content is between 0.26 and 0.70, or even between 0.29 and 0.67, even between 0.35 and 0 , 65, at the interface between the sublayer and the coating of amorphous carbon.
• the ratio between the silicon content and the chromium (Si / Cr) content is between 0.40 and 0.55, or even between 0.45 and 0.55, at the interface between the sub -layer and coating of amorphous carbon.
• the sub-layer, with or without nitrogen is a few tenths of a micrometer thick; preferably a thickness equal to or less than about 1.1 m, for example between about 0.2 mhh and 1.1 m, preferably between about 0.3 pm and 0.6 pm.
• the coating of amorphous carbon for example, has a thickness equal to or greater than approximately 0.3 ⁇ m, or even approximately 0.5 ⁇ m, or even approximately 1 ⁇ m, or even 1.5 ⁇ m.
• the coating of amorphous carbon for example, has a thickness equal to or less than about 10 ⁇ m, or even 8 ⁇ m, or even 3.5 ⁇ m.
• the coating of amorphous carbon has, for example, a thickness of between approximately 1.5 ⁇ m and approximately 3.5 ⁇ m, but can reach 8 ⁇ m when such a coating is applied to a segment for example.
• the metallic substrate is for example made of steel or other metallic alloys.
• the part also comprises a chromium-based layer, deposited on the substrate and on which the sub-layer is formed.
• the chromium-based layer is for example a chromium (Cr) layer and / or a chromium nitride layer, for example CrN or Cr2N, or any intermediate compound.
• the part comprises a layer of chromium (Cr), or a layer of chromium (Cr) followed by a layer of chromium nitride (for example CrN or Cr2N, or any intermediate compound).
• Cr chromium
• Cr2N chromium nitride
• the chromium-based layer has a thickness of a few tenths of a micrometer, preferably a thickness equal to or less than about 1 pm, or even 0.6 pm, for example between about 0.1 pm and 0.5 pm , or even between about 0.3 pm and 0.5 pm.
• the sub-layer could have a lesser thickness than the sub-layers of the prior art, thus making it possible to increase the thickness of the DLC for the same total thickness of the coatings (i.e. considering the thicknesses of the DLC, the undercoat and a chromium-based layer if applicable).
• a ratio between the thickness of the amorphous carbon coating and the thickness of the undercoat, or even taking into account the thickness of the chromium-based layer if appropriate can be increased.
• Such a ratio is, for example, between approximately 2.2 and approximately 12, or even between approximately 2.25 and approximately 11.5, or even between approximately 2.25 and 7.5, or even between approximately 2.27 and approximately 7.25 .
• a ratio between the thickness of the amorphous carbon coating and the total thickness of the coatings i.e. here the sum of the thicknesses of the amorphous carbon coating, the undercoat and the layer to be chromium base if applicable
• ep. DLC / (ep.DLC + ep. Sublayer + ep. Chromium-based layer)] is between approximately 0.65 and approximately 0.9, or even between approximately 0.69 and approximately 0.88.
• the total thickness of the coatings (ie the sum of the thicknesses of the amorphous carbon coating, of the sublayer and of the chromium-based layer if applicable) is between approximately 1.5 ⁇ m and approximately 4, 9 pm, preferably between about 1.8 pm and about 4.6 pm.
• the atomic proportions, measured by EDX, are those of the sublayer in the vicinity of the interface with the coating (keeping in mind that the sublayer has a composition gradient, the composition targeted is that towards which it tends at the interface with the DLC coating).
• the presence of nitrogen at the surface is not critical to the adhesion of the DLC. In fact, with similar nitrogen (N / Cr) proportions (examples 9, 12 and 13), the adhesion may or may not be considered good.
• N / Cr nitrogen
• a relatively strong presence of nitrogen can affect adhesion, as in example 11.
• the absence of nitrogen can lead to good adhesions (examples 4 to 6, 14 and 15) or not (examples 1 to 3 , 7, 8,).
• the proportion of chromium relative to silicon has proved to be a more determining factor.
• a relatively high chromium content compared to silicon does not seem to be suitable for adhesion (eg examples 1 to 3).
• a relatively low chromium content relative to the silicon also does not seem to be suitable for the adhesion of the DLC (eg examples 7 and 8).
• the vacuum deposition equipment mainly comprises an enclosure, a pumping system, a heating system, configured to pump, heat the parts (substrate) and the interior of the enclosure, in order to accelerate the desorption of gases and quickly obtain a vacuum, considered of quality, in the enclosure.
• the depositing equipment also comprises a suitable substrate holder, from the point of view of geometry, electrical polarization and kinematics, for the parts, or for the portion of the parts to be coated.
• the vacuum deposition equipment also includes an ion pickling system configured to bombard the parts (substrates) to be coated with argon (Ar) ions, in order to remove a passivation layer generally present on the metal substrates to be coated.
• an ion pickling system configured to bombard the parts (substrates) to be coated with argon (Ar) ions, in order to remove a passivation layer generally present on the metal substrates to be coated.
• the vacuum deposition equipment also includes a magnetron cathode, equipped with a chromium target, to generate the chromium-based layers.
• the ion stripping system is configured to operate simultaneously with the magnetron cathode. This takes advantage of the end of ion stripping to pre-spray the magnetron cathode equipped with a chromium target.
• the plasma source such as that described in the document FR 2 995 493 can be used to carry out an effective ionic pickling of the parts to be coated and to coat them with a DLC coating of the aC: H type.
• the deposition step of the sublayer is for example configured to produce a sublayer having a composition as described above.
• the step of depositing the underlay is for example configured to further produce an underlay having a thickness as described above.
• the method can optionally include a step of depositing metallic chromium, for example a step of spraying chromium.
• this step of depositing metallic chromium comprises a step of introducing nitrogen simultaneously with the step of spraying chromium so as to obtain a layer of chromium nitride, for example CrN or Cr2N or any intermediate compound.
• Such a chromium-based layer is deposited with a thickness of a few tenths of a micrometer, as described above.
• TMS tetramethylsilane
• Si (CH3) 4 typically tetramethylsilane
• Si (CH3) 4 typically tetramethylsilane
• Si (CH3) 4 typically tetramethylsilane
• traces of oxygen typically traces of oxygen
• TMS is by far preferred for its relatively high chemical stability and high volatility, allowing it to be easily implemented using a mass flow meter.
• the organosilicon gas is introduced at an increasing flow rate up to a flow rate value at which a silicon content of the sublayer is at least equal to about 0.35 times its chromium content and at most about 0.60 times the chromium content in the vicinity of the interface.
• the ratio of the carbon content reduced to the silicon content is in parallel between 2.5 and 3.5 in the vicinity of the interface.
• the amount of nitrogen injected can be gradually reduced as the amount of organosilicon gas increases. The amount of nitrogen is not necessarily brought to 0 but must become significantly less than that of organosilicon gas.
• the nitrogen introduced to produce a layer of CrN can also be brought abruptly to 0 before introducing the organosilicon precursor. Nevertheless, the gradual reduction of nitrogen is a preferential mode because it allows a gradual transition of nitrogen in the sub-layer.
• N / Cr is then worth for example 1 and therefore the amount of nitrogen is possibly considered to be excessive.
• N / Cr is then worth for example 0.5 and in such a case, this ratio can be kept.
• the bias voltage of the substrate holder is generally between -50 V and -100 V (volt) .
• the partial pressure of argon during the deposition of these layers is preferably between 0.2 Pa and 0.4 Pa.
• the power supply to the magnetron cathode is cut off, the reactive gases (i.e. organosilicon gas, or organosilicon gas and nitrogen as appropriate) are arrested.
• the flow of argon, if any, is reduced to a low value or even brought to 0, and acetylene is introduced to begin the deposition of the aC: H coating using the plasma source as described in the document FR 2 995 493.
• the ion acceleration voltage on the parts is adjusted to allow the desired aC: H deposit characteristics to be obtained.
• the a-C: H deposit is all the harder the higher the voltage in absolute value, according to the rules of the art.

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• Chemical & Material Sciences (AREA)
• Metallurgy (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Mechanical Engineering (AREA)
• Organic Chemistry (AREA)
• Inorganic Chemistry (AREA)
• General Chemical & Material Sciences (AREA)
• Physical Vapour Deposition (AREA)
• Chemical Vapour Deposition (AREA)
• Laminated Bodies (AREA)
• Carbon And Carbon Compounds (AREA)
• Other Surface Treatments For Metallic Materials (AREA)

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• 2018
  • 2018-06-18 FR FR1855319A patent/FR3082526B1/fr active Active
• 2019
  • 2019-06-17 JP JP2020560146A patent/JP2021533255A/ja active Pending
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