EP3806172A4 - Boîtier de dispositif électroluminescent et son procédé de fabrication - Google Patents

Boîtier de dispositif électroluminescent et son procédé de fabrication Download PDF

Info

Publication number
EP3806172A4
EP3806172A4 EP19815307.4A EP19815307A EP3806172A4 EP 3806172 A4 EP3806172 A4 EP 3806172A4 EP 19815307 A EP19815307 A EP 19815307A EP 3806172 A4 EP3806172 A4 EP 3806172A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
light
emitting device
device package
method therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19815307.4A
Other languages
German (de)
English (en)
Other versions
EP3806172A1 (fr
Inventor
Yuriy Bilenko
Ki Yon Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seoul Viosys Co Ltd
Original Assignee
Seoul Viosys Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seoul Viosys Co Ltd filed Critical Seoul Viosys Co Ltd
Publication of EP3806172A1 publication Critical patent/EP3806172A1/fr
Publication of EP3806172A4 publication Critical patent/EP3806172A4/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
    • H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
EP19815307.4A 2018-06-08 2019-06-10 Boîtier de dispositif électroluminescent et son procédé de fabrication Pending EP3806172A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180065751A KR102624113B1 (ko) 2018-06-08 2018-06-08 발광 소자 패키지 및 이의 제조 방법
PCT/KR2019/006930 WO2019235900A1 (fr) 2018-06-08 2019-06-10 Boîtier de dispositif électroluminescent et son procédé de fabrication

Publications (2)

Publication Number Publication Date
EP3806172A1 EP3806172A1 (fr) 2021-04-14
EP3806172A4 true EP3806172A4 (fr) 2022-03-09

Family

ID=68769385

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19815307.4A Pending EP3806172A4 (fr) 2018-06-08 2019-06-10 Boîtier de dispositif électroluminescent et son procédé de fabrication

Country Status (6)

Country Link
US (1) US20210091278A1 (fr)
EP (1) EP3806172A4 (fr)
JP (1) JP2021527324A (fr)
KR (1) KR102624113B1 (fr)
CN (3) CN110832649B (fr)
WO (1) WO2019235900A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102624113B1 (ko) * 2018-06-08 2024-01-12 서울바이오시스 주식회사 발광 소자 패키지 및 이의 제조 방법
CN113394320B (zh) * 2020-03-11 2023-04-07 隆达电子股份有限公司 发光二极管封装结构
CN114038983A (zh) * 2021-11-17 2022-02-11 厦门瑶光半导体科技有限公司 深紫外led光源封装结构

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060102917A1 (en) * 2002-06-19 2006-05-18 Toshihiko Oyama Semiconductor light emitting device, method for producing the same and reflector for semiconductor light emitting device
WO2007074983A1 (fr) * 2005-12-29 2007-07-05 Seoul Semiconductor Co., Ltd. Diode electroluminescente
US9664342B2 (en) * 2012-09-27 2017-05-30 Osram Opto Semiconductors Gmbh Optoelectronic component device, method of producing an optoelectronic component device, and method of operating an optoelectronic component device, method of operating an optoelectronic device having improved emission characteristics
KR20180009720A (ko) * 2016-07-19 2018-01-29 파나소닉 아이피 매니지먼트 가부시키가이샤 광반사체용 성형 재료 및 그 제조 방법, 광반사체, 베이스체 및 그 제조 방법, 및 발광 장치

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Publication number Priority date Publication date Assignee Title
KR101201307B1 (ko) * 2005-06-30 2012-11-14 엘지디스플레이 주식회사 백라이트유닛
JPS6063970A (ja) * 1983-09-17 1985-04-12 Fanuc Ltd 平行光線を放射する発光ダイオ−ド
JP4572891B2 (ja) * 2002-06-19 2010-11-04 サンケン電気株式会社 半導体発光装置
TW200532324A (en) * 2004-03-23 2005-10-01 Ace T Corp Light source device
JP2006049624A (ja) * 2004-08-05 2006-02-16 Sharp Corp 発光素子
JP2007086367A (ja) * 2005-09-21 2007-04-05 Ibiden Co Ltd 光ピン、光ピンコネクタ及び光路変換用モジュール
KR100643919B1 (ko) * 2005-11-24 2006-11-10 삼성전기주식회사 렌즈를 구비한 발광 다이오드 패키지
JP4828248B2 (ja) * 2006-02-16 2011-11-30 新光電気工業株式会社 発光装置及びその製造方法
JP2007227480A (ja) * 2006-02-21 2007-09-06 Toshiba Corp 半導体発光装置
KR20070094247A (ko) * 2006-03-17 2007-09-20 서울반도체 주식회사 반사기를 구비하는 측면 발광 다이오드 패키지
JP2008288394A (ja) * 2007-05-17 2008-11-27 Sharp Corp 金属反射壁の製造方法
EP2073280A1 (fr) * 2007-12-20 2009-06-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Optique secondaire réflective et module semi-conducteur ainsi que son procédé de fabrication
US20100181582A1 (en) * 2009-01-22 2010-07-22 Intematix Corporation Light emitting devices with phosphor wavelength conversion and methods of manufacture thereof
KR20140134202A (ko) * 2013-05-13 2014-11-21 서울반도체 주식회사 소형 발광소자 패키지 및 그 제조 방법
KR101505654B1 (ko) * 2013-12-24 2015-03-24 동부라이텍 주식회사 조명장치 및 이에 사용되는 리플렉터
CN105849922A (zh) * 2014-01-06 2016-08-10 皇家飞利浦有限公司 用于相机的薄的led闪光灯
US20160163935A1 (en) * 2014-12-03 2016-06-09 Avago Technologies General Ip (Singapore) Pte. Ltd. Semiconductor device that accommodates thermal expansion of an encapsulant
KR101969985B1 (ko) * 2015-01-16 2019-04-17 이우필 리플렉터, 리플렉터가 결합된 엘이디패키지 및 그 제조방법
CN110890353B (zh) * 2015-09-08 2023-12-26 首尔伟傲世有限公司 发光二极管封装件
KR102624113B1 (ko) * 2018-06-08 2024-01-12 서울바이오시스 주식회사 발광 소자 패키지 및 이의 제조 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060102917A1 (en) * 2002-06-19 2006-05-18 Toshihiko Oyama Semiconductor light emitting device, method for producing the same and reflector for semiconductor light emitting device
WO2007074983A1 (fr) * 2005-12-29 2007-07-05 Seoul Semiconductor Co., Ltd. Diode electroluminescente
US9664342B2 (en) * 2012-09-27 2017-05-30 Osram Opto Semiconductors Gmbh Optoelectronic component device, method of producing an optoelectronic component device, and method of operating an optoelectronic component device, method of operating an optoelectronic device having improved emission characteristics
KR20180009720A (ko) * 2016-07-19 2018-01-29 파나소닉 아이피 매니지먼트 가부시키가이샤 광반사체용 성형 재료 및 그 제조 방법, 광반사체, 베이스체 및 그 제조 방법, 및 발광 장치

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2019235900A1 *

Also Published As

Publication number Publication date
KR102624113B1 (ko) 2024-01-12
US20210091278A1 (en) 2021-03-25
CN110832649A (zh) 2020-02-21
KR20190139371A (ko) 2019-12-18
CN111092143B (zh) 2024-05-07
CN110832649B (zh) 2024-04-19
CN111092143A (zh) 2020-05-01
WO2019235900A1 (fr) 2019-12-12
JP2021527324A (ja) 2021-10-11
CN209896099U (zh) 2020-01-03
EP3806172A1 (fr) 2021-04-14

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