EP3789652A1 - Universallichtquelle für einen scheinwerfer sowie scheinwerfer - Google Patents

Universallichtquelle für einen scheinwerfer sowie scheinwerfer Download PDF

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Publication number
EP3789652A1
EP3789652A1 EP19195841.2A EP19195841A EP3789652A1 EP 3789652 A1 EP3789652 A1 EP 3789652A1 EP 19195841 A EP19195841 A EP 19195841A EP 3789652 A1 EP3789652 A1 EP 3789652A1
Authority
EP
European Patent Office
Prior art keywords
leds
carrier
light source
optics
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19195841.2A
Other languages
German (de)
English (en)
French (fr)
Inventor
Erwin Melzner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arnold and Richter Cine Technik GmbH and Co KG
Original Assignee
Arnold and Richter Cine Technik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arnold and Richter Cine Technik GmbH and Co KG filed Critical Arnold and Richter Cine Technik GmbH and Co KG
Priority to EP19195841.2A priority Critical patent/EP3789652A1/de
Priority to PCT/EP2020/072506 priority patent/WO2021043543A1/de
Priority to US17/640,783 priority patent/US11898742B2/en
Priority to CN202080074134.1A priority patent/CN114585855B/zh
Publication of EP3789652A1 publication Critical patent/EP3789652A1/de
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/62—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using mixing chambers, e.g. housings with reflective walls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/041—Optical design with conical or pyramidal surface
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/40—Lighting for industrial, commercial, recreational or military use
    • F21W2131/406—Lighting for industrial, commercial, recreational or military use for theatres, stages or film studios
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to embodiments of a light source (so-called light engine) for a headlight for illuminating a film, studio, stage, event and / or theater environment as well as embodiments of a headlight with such a light source.
  • a light source so-called light engine
  • Headlights are usually used to illuminate a film, studio, stage, event and / or theater environment. Sometimes it is desirable that a headlight comprising a light-generating assembly provides a sufficient luminous flux and satisfies further requirements such as are usual for a film, studio, stage, event and / or theater environment. Such requirements include, for example, continuous operation over several hours, a wide adjustment range of a beam angle, a homogeneous and / or a soft light field. These functions must also be made more difficult Environmental conditions and with heavy use of the headlight are reliably provided.
  • LEDs can be arranged on a carrier, and the light produced by these LEDs can be optically processed in order to provide a headlight with certain properties.
  • the high temperatures possibly associated with the power loss can require the use of substrates with good thermal conductivity, which, however, can lead to restrictions with regard to the design and laying of the power lines.
  • lens arrays Another disadvantage of lens arrays is that the bundled light emitted by them cannot be used without further measures, e.g. to generate a homogeneously colored light field several meters away using a stepped lens or projection optics. Rather, it is necessary that the light emerging from the lens array is first mixed in color by a further optical assembly, e.g. a solid or hollow light guide, before it is further bundled, widened or otherwise shaped in a stepped lens or projection optics.
  • a further optical assembly e.g. a solid or hollow light guide
  • the object of the present invention is therefore to propose a universally applicable light source (light engine).
  • a light source for a headlight for illuminating a film, studio, stage, event and / or theater environment comprises: a carrier which is at least partially designed as a single-layer printed circuit board, a plurality of LEDs with N> 2 different color types and a power line system with a plurality of lines with N line types for supplying the LEDs being arranged on the carrier.
  • the light source further comprises lensless collecting optics (for example coupled to the carrier) which collects and mixes the light emanating from the LEDs.
  • the light source further comprises output optics (for example a diffuser) which terminate the light source and which transmit light from the collecting optics and (for example with defined scattering characteristics) outputs it into the environment.
  • the light source comprises at least one component of a control device for controlling the plurality of LEDs.
  • the headlight comprises a light source according to the first aspect for illuminating the film, studio, stage, event and / or theater environment.
  • Figure 1 illustrates schematically and by way of example a headlight 100 for illuminating a film, studio, stage, event and / or theater environment.
  • the headlight 100 emits light in the direction L into the surroundings.
  • the headlight For generating the light 100 comprises a light source which has a carrier 10, collecting optics 20 and output optics 30.
  • the light source equipped in this way can also be referred to as a light engine. In the following, however, the light source is mostly referred to.
  • the headlight 100 can also comprise some other components typical for headlights for illuminating a film, studio, stage, event and / or theater environment, such as a housing 40, a wing gate 50, a user interface, a controller, various control and power inputs etc. and also other components for further processing of the light provided by the light source on the basis of the carrier 10, the collecting optics 20 and the output optics 30.
  • these optional additional components will not be discussed further here.
  • the light source which can essentially be composed of the components carrier 10, collecting optics 20 and output optics 30 and can represent a universally usable light engine for a large number of different headlights.
  • the light source has at least one component of a control device 70 for controlling a plurality of LEDs arranged on the carrier 10.
  • the components carrier 10, collecting optics 20 and output optics 30 are assembled essentially without further light-generating or light-processing components and thus form the LED-based light engine.
  • the control device 70 is provided as part of this light engine for controlling the LEDs.
  • the carrier 10 is at least partially designed as a single-layer printed circuit board.
  • the term “single-layer carrier” is understood to mean an embodiment of the carrier 10, according to which at least partially no crossing areas of lines are formed in the carrier substrate, that is to say within the carrier.
  • the carrier 10 is designed in one layer, there is only a first piece of conductor track in the carrier or on the carrier, but no further piece of conductor track which (vertically offset from the first piece) forms an intersection area with the first piece.
  • the entire carrier 10 is designed as a single-layer carrier. Crossing areas are at most with other components, such as Wire bridges or zero ohm resistors, formed outside the carrier, for example, above and / or below the carrier 10, but not in the carrier 10.
  • the carrier can thus be inexpensive and enable advantageous heat dissipation.
  • the carrier 10 is arranged on a support 90 of the light source.
  • the support 90 can also form part of the housing 40 of the headlight 100.
  • a coupling layer 80 cut out in accordance with the LEDs 12 (described in more detail below), for example a pressure plate, can be used.
  • the coupling layer 80 has a (for example lensless) recess 83 through which the light emanating from the LEDs 12 passes.
  • the coupling layer 80 is formed in one piece, for example, as in FIG Figures 9A-B illustrated, or in two parts, as in Figure 9C illustrated.
  • the mounting of the carrier 10 on the support 90 takes place, for example, by means of screws 81 which, for example by means of springs 82, engage in corresponding receptacles 91 of the support 90 (see FIG. Figures 9A-B ).
  • an elastic intermediate layer 89 (for example an O-ring) can be provided between the front side 101 of the carrier 10 and the rear side of the one-part or multi-part coupling layer 80, which is also cut out, corresponding to the envelope 129, which all Surrounds LEDs 12.
  • the intermediate layer 89 engages, for example, a non-populated area of the carrier front side 101, for example adjacent to the envelope 129 (see FIG. Figure 9A ) at.
  • a rear side of the carrier 10 opposite the front side 101 rests on the support 90.
  • the support 90 forms a cooling body.
  • a plurality of LEDs 12 with N> 2 different color types are located on the carrier 10, for example on its front side 101.
  • a power line system 14 with a plurality of lines with N conduction types is arranged on the carrier 10 (this wording also includes it is to be understood that lines can be at least partially integrated in the carrier and / or lines are applied to the carrier, for example its front side 101).
  • a control device 70 for example one which controls the LEDs as a function of a user input.
  • the user input relates, for example, to at least one of the following setting options: a brightness setting, a color temperature, a color, the selection and / or parameterization of a light effect, a setting with regard to a master-slave configuration, etc.
  • the user input can be wired and / or wireless from the Control device are received.
  • the control device 70 has, for example, its own user interface (for example, comprising a display and input and selection means).
  • the control device 70 can be coupled to the control of the headlight 100 and can receive the user input via this.
  • At least one component, e.g., at least one of the aforementioned components, of the control device 70 forms part of the light source. That at least one component of the control device 70 is arranged on the carrier 10, for example.
  • the control device 70 can thus consist of a system of spatial distributed components and subcomponents.
  • an LED driver board is provided, for example, which is arranged in the vicinity of the carrier 10 and is coupled to the LEDs 12 in terms of control and performance via corresponding lines.
  • the control device 70 is at least partially arranged on the carrier 10.
  • a data memory 71 is located on the carrier 10 (see Fig. Figure 9A ) for storing setting data specific to the LEDs 12, such as parameters and / or LED-specific calibration data.
  • the data memory 71 on the carrier 10 is, for example, an EEPROM (Electrically Erasable Programmable Read-Only Memory).
  • one or more temperature sensors are arranged on the carrier 10 in order to determine the current temperature of one or more of the LEDs 12. These temperature sensors can be designed as NTC resistors, for example, the voltage of which is recorded by the LED driver board (or a corresponding component on the driver board) as a measure of the respective temperature.
  • a lensless collecting optics 20 collects and mixes the light emanating from the LEDs 12.
  • the collecting optics 20 can surround all LEDs 12 and collect and mix the light emanating from each of the LEDs 12, as will be explained in more detail below.
  • the collecting optics 20 are located where they can collect the light from the LEDs 12.
  • the collecting optics 20 can be fastened either to the carrier 10, for example by screwing or gluing to or onto the carrier 10, or at any other location, such as for example to the housing 40 of the headlight 100.
  • the collecting optics 20 is attached to the carrier 10 coupled.
  • Output optics 30 close off the light source; it terminates the light source.
  • the output optics 30 transmit light from the collecting optics 20 and emit it into the environment, e.g. with defined scattering characteristics.
  • the output optics 30 can be a cover plate, for example in the form of a light-shaping or light-scattering element.
  • the headlight 100 when configured with the light source of the output optics 30, downstream (optical) components, for example a follow-up optics, can be provided that further shape, bundle and / or direct the light output by the output optics 30 or in some other way process, such as the wing gate 50, before the light enters the further, ultimately to be illuminated surroundings.
  • downstream (optical) components for example a follow-up optics
  • a follow-up optics can be provided that further shape, bundle and / or direct the light output by the output optics 30 or in some other way process, such as the wing gate 50, before the light enters the further, ultimately to be illuminated surroundings.
  • a light and / or color sensor is provided on the carrier 10 or on the collecting optics 20, on the output optics 30, on the subsequent optics or at another point where the light and / or color sensor emits the light emitted by the light source Can receive light directly or by means of a light guide.
  • Corresponding output data of the light and / or color sensor are then supplied, for example, to the control device 70, for example a memory of the control device 70, so that these output data can be called up by the logic / controller control device 70 and taken into account in the control of the LEDs 12.
  • the carrier 10 is, for example, a ceramic carrier such as a ceramic circuit board.
  • the carrier 10 then consists predominantly of a ceramic, for example. If the carrier 10 is designed as a printed circuit board, the lines are designed as conductor tracks that supply the LEDs with power. These conductor tracks can be applied to the carrier 10 (e.g. laminated, glued on, and / or deposited on the carrier 10 by means of a physical or chemical process) and / or integrated in the carrier 10.
  • the carrier 10 can also be designed as an IMS (integrated metal substrate) circuit board.
  • the circuit board is, for example, a metal sheet, on the top and / or bottom of which a very thin dielectric is attached, for example a plastic film or a ceramic layer.
  • the material combination is e.g. aluminum with aluminum oxide.
  • the conductor tracks are vapor-deposited or otherwise attached to the thin dielectric.
  • a ceramic layer envelops a metallic core, for example made of aluminum.
  • IMS circuit boards have an advantageous thermal conductivity.
  • the carrier 10 is designed as an at least partially, preferably completely single-layer ceramic circuit board (with or without a metallic core), in which the lines of the power line system 14 are implemented as conductor tracks laminated onto the carrier 10, and in the intersection areas at most outside (e.g. above- and / or below) the carrier 10, but not in the interior of the carrier 10 or in a layer on the carrier 10.
  • the carrier 10 can be formed from an epoxy resin fabric, for example the carrier 10 can be a conventional FR-4 printed circuit board.
  • the plurality of LEDs 12 are arranged on the carrier 10, for example on its front side 101.
  • One or more components of the control device 70 may be provided, for example those that provide the current to supply the LEDs 12 or is / are involved in the provision of the current.
  • Such components are, for example, power electronic converters, controllers, sensors and the like, as explained above.
  • the LEDs 12 can each be designed as a single LED, for example a lens-free (or lens-free) single LED.
  • the LEDs 12 have, for example, apart from the optical components strictly necessary for generating and emitting light, no further optical components which are only used to shape or otherwise influence the emitted light.
  • Such lens-free LEDs are comparatively simple in construction and are available on the market at low cost. They also have compact dimensions.
  • the LEDs 12 are arranged in LED clusters, it being possible for the LED clusters to be designed without or without lenses.
  • LEDs can be used, depending on which radiation characteristic of the light source is desired.
  • a respective soldering surface side or an underside (so-called "footprint side") of the LEDs 12 points in the direction of the front side 101 of the carrier 10, and the light exit side of the LEDs 12 in each case in the direction L, i.e. perpendicular to the front side 101.
  • the multiplicity of LEDs For example, 12 is greater than 20, than 50, or greater than 100.
  • the number of different color types is at least 2. However, more than two color types can also be provided, for example three color types or four color types (for example red, green, blue and white).
  • All LEDs 12 can be of the same size.
  • the packing density is, for example, greater than 25 LEDs per square centimeter.
  • One way of arranging the LEDs 12 on the carrier 10 is, for example, in FIG DE 10 2016 224341 A1 described.
  • Power line system 14 includes, for example, a line type for each color type.
  • the different line types can be isolated from one another and carry different currents or different electrical potentials.
  • the LEDs 12 of the N color types can be switched individually or in any combination by color type.
  • the light source can therefore provide light corresponding to the N color types and their combinations. In the event that a combination is switched, the light emitted by the light source is also mixed due to the collecting optics 20.
  • the lines 141 to 144 can each be designed as conductor tracks that are applied (or attached) to the carrier 10 and / or are integrated in the carrier 10.
  • bridges 146 can be provided below / above the girder 10.
  • the intersection areas can be formed in the carrier 10.
  • the power line system 14 also includes connection tracks 149, which can be connected to corresponding contact sections 128 of the LEDs in order to connect the LEDs 12 to the power line system 14.
  • the lines 141-144 eg, designed as conductor tracks
  • other parts of the power line system 14 do not cross in a vertical projection of an envelope of the LEDs 12 (i.e. the projection of the area defined by the envelope 129).
  • a vertical projection of an envelope of the LEDs 12 i.e. the projection of the area defined by the envelope 129.
  • the carrier 10 can thus be designed in one layer and have correspondingly advantageous heat dissipation properties.
  • intersection areas somewhat restricts the packing density and the possible arrangement of LEDs of different types (and thus the color mixing).
  • the power line system 14 is designed in such a way that the lines 141, 142 or other parts of the power line system 14 do not cross in any vertical projection of each of the LEDs 12.
  • This variant is, for example, in the Figures 5-8 which illustrate that there are no intersection areas that overlap with one of the vertical projections of the LEDs 12, but intersection areas are only formed in those areas (e.g. in the carrier 10 or above / below the carrier 10) that do not overlap form with vertical projections of the LEDs 12.
  • the carrier is formed there in multiple layers only in the intersection areas, but not in areas which overlap with a vertical projection of each of the LEDs 12.
  • intersection areas At any point in the carrier, below the carrier 10 and / or above the carrier 10, but this can be problematic in terms of heat dissipation if many intersection areas are formed, in particular if these lie within a projection of the envelope 129. Outside the envelope 129, the formation of intersection areas is rather unproblematic and therefore also common.
  • intersection areas 145 In the embodiments according to Figures 5 to 8 lines 141-144 (or components of the power line system 14 connected to them) of different line types intersect in intersection areas 145, only some of the intersection areas 145 being provided with a reference number. In this case, the intersection areas 145 lie in a vertical top view of the carrier front side 101 and outside the vertical projections of the LEDs 12. In other words, no intersection areas 145 are formed below and above the LEDs.
  • intersecting lines 141-144 (or components of the power line system 14 connected to them) run vertically in one direction to the carrier front 101 one above the other or one below the other. They are electrically isolated from each other.
  • the crossing lines 141-144 can both be integrated in the carrier 10 in the respective crossing area 145 or applied to the carrier 10 and connected to it.
  • the carrier 10 is then made of multiple layers in the intersection areas 145.
  • the carrier 10 can be completely single-layer and one (or more) of the crossing line sections can be designed as a bridge 146 (e.g. above and below the carrier 10).
  • the carrier 10 is designed as a single-layer printed circuit board at least in the area of the envelopes 129 surrounding all the LEDs 12, and bridges 146 are used to form the intersection areas 145 (instead of multi-layer subsections in / on the carrier 10).
  • the bridges 146 used to form the intersection areas 145 can be so-called micro-wire bridges, or so-called zero ohm resistors, or can be designed as bonding bridges.
  • FIG Figure 8 Exemplary embodiments of bridges 146 are shown in FIG Figure 8 shown.
  • the bridges 146a to 146d shown in this figure can be used in any combination.
  • the lines 141-142 connect the LEDs 12 of the same type in series with one another.
  • the bridges 146a-d are provided, which connect the different LED types 12 to the respective lines 141-142.
  • the bridges 146a-b close, for example, one of the LEDs 12 in series with a first line 141 forming a main conductor path. They bridge a second line 142 forming another main conductor path.
  • With the bridge 146c bridging the first line 141 two LEDs 12 of another are connected Type connected in series.
  • Another bridge 146d also bridges the first line 141 and thus connects partial sections of the second line 142 that are offset from one another.
  • bridges 146 are provided in the form of bonding wires, it is expedient to provide the carrier 10 with a so-called ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) coating.
  • ENEPIG Electroless Nickel Electroless Palladium Immersion Gold
  • each grid path 120 comprises a multiplicity of grid parking spaces on each of which one of the LEDs 12 can be positioned.
  • the grid parking spaces are arranged individually one behind the other along a path 121 from a grid entrance to a grid exit.
  • the arrangement of the LEDs 12 in accordance with a regular grid on the front side 101 of the carrier is, however, not mandatory, and under certain circumstances also not advantageous.
  • the optional waiver of a lens array for the LEDs or the use of the lensless collecting optics 20 does not require the LEDs to be arranged according to a regular grid on the carrier front 101.
  • the LEDs 12 can also be irregular, for example optimized with regard to a high packing density and / or good color mixing, be arranged on the carrier front side 101.
  • all of the grid storage spaces provided on the front side 101 of the carrier are occupied by LEDs 12.
  • At least one LED 12 of each of the N different color types is provided in each of at least 90% of all grid lines 120.
  • the LEDs 12 of the different color types are positioned in any order.
  • N is four.
  • the value of at least 90% means that in practically all grid lines 120 at least one LED 12 of each of the N different color types is provided. Excluded from this are, for example, grid tracks 120 that run on the edge or, due to geometric restrictions, only comprise a few grid spaces.
  • the line system 14 comprises main conductive lines which are formed by the lines 141-144 and which do not overlap either with one another or with the grid lines 120.
  • the main conductor tracks run without crossing each other.
  • the main conductor tracks are, for example, conductor tracks attached to the front side 101 of the carrier, which do not cross in the area defined by the envelope surrounding all the LEDs 12.
  • each of the LEDs 12 is in a direction transverse to the running track 121 by means of two connecting tracks 149 with the color type associated main conductor path electrically connected.
  • the connection tracks 149 form part of the power line system 14.
  • connection tracks 149 are each electrically connected to a contact section 128 of the associated LED 12.
  • the contact sections 128 extend, for example, along the path 121.
  • Each of the intersection areas 145 can be formed by a connecting track 149 and a main conductor track, which are each assigned to different color types.
  • the main conductor track forming the intersection area 145 is always arranged adjacent to a main conductor track to which the connecting track 149 forming the intersection area 145 is electrically connected.
  • the spacing of the grid tracks 120 in a direction transverse to the runway 121 is concerned, according to a variant, there are at most N main tracks between two adjacent grid tracks 120, the main tracks formed by the lines 141-144 being assigned different color types.
  • the power line system 14 can comprise main conductor tracks, with a maximum of 0.5 ⁇ N main conductor tracks being present between adjacent grid tracks 120.
  • 0.5 x N is rounded up to the next higher integer.
  • connection tracks 149 run between these in all the exemplary embodiments, the connection tracks 149 being assigned to those color types that correspond to the LEDs 12 adjoining along the course 121 .
  • the lines 141-144 or other components of the power line system 14 do not intersect in a vertical projection of the envelopes of the LEDs 12 (that is to say in a vertical projection of the area defined by these envelopes). In this area of the vertical projection, intersection areas are not formed either in the carrier 10, above or below the carrier 10. In the area of the surface defined by the envelope, the carrier 10 is then designed, for example, as a single-layer printed circuit board. There are also no intersection areas 145 above or below the carrier 10 in the area corresponding to the envelope.
  • intersection areas 145 in the said area naturally has implications with regard to the possible arrangement of the different LEDs 12.
  • many conductor tracks would have to be accommodated between the LEDs 12 in order to avoid the creation of intersection areas.
  • certain challenges are posed in terms of achieving a high packing density and advantageous color mixing.
  • the document teaches DE 10 2016 224 341 A1 In this regard, some approaches to the arrangement of the LEDs 12.
  • the second option is to allow intersection areas only in those areas that do not overlap with the vertical projections of the LEDs 12. Variants for the design of this possibility are in the Figures 5-8 illustrated.
  • the intersection areas 145 can then be formed in the carrier 10, above and / or below the carrier 10.
  • the variant is expedient according to which in any case no intersection areas are formed in or on the (for example laminated intersection areas) carrier.
  • the carrier 10 can also be designed as a single-layer printed circuit board in the area of the area defined by the envelopes surrounding the LEDs 12, with integrated / laminated conductor tracks that do not intersect.
  • the intersection areas 145 are then offset from the LEDs 12, for example above the carrier 10, as explained, using corresponding bridges 146.
  • the intersection areas 145 are formed in the carrier 10.
  • the carrier 10 is, for example, partially multilayered (in areas corresponding to FIGS Crossing areas 145) and partially formed as a single layer (in areas corresponding to the vertical projections of the LEDs 12).
  • the third option does not impose any conditions on the number and location of the intersection areas.
  • the terms used here for single or multiple layers refer to the design of the carrier 10 with reference to the power line system 14 which is implemented on and / or in the carrier 10.
  • the carrier 10 is thus formed in one layer below the LEDs 12, and either in multiple layers or in one layer between the LEDs.
  • the crossing areas 145 can be formed between the LEDs, for example using the micro-wire bridges (see bridges 146), which can be set for example by bonding.
  • the carrier is provided, for example, with a so-called ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) coating, as explained at the beginning.
  • ENEPIG Electroless Nickel Electroless Palladium Immersion Gold
  • crossing regions 145 formed outside the carrier 10 can be surrounded by a casting compound, for example a resin.
  • the power line system 14 is coupled to the control device 70, for example to a plurality of power output connections of a power electronic component of the control device 70.
  • a power electronic component of the control device 70 for example, an LED driver board is provided as the power electronic component below the carrier 10, which via lines is connected to the power line system 14 of the carrier 10.
  • sensors on carrier 10 for example, can deliver their measured values (e.g. a voltage on an NTC resistor) to the LED driver board via appropriate sensor lines.
  • active cooling such as water cooling
  • the heat loss produced by the LEDs 12 is cooled solely by the ambient air.
  • a corresponding fan can be provided for this purpose.
  • the cooling takes place completely passively, without additional further active cooling components, such as fans, water cooling systems or the like.
  • Cooling components one or more of which can be provided at the light source according to an embodiment, include, for example: cooling fins, a so-called vapor chamber below the carrier 10, heat pipes which, for example, dissipate heat in a direction opposite to the light exit direction L, a fan , liquid cooling (e.g. water cooling), etc.
  • the area of the light exit side 212 is at least 80% of the area of the light entry side 214.
  • the internally mirrored reflector 21 is designed, for example, with a polygonal cross-sectional area that increases in the light exit direction L, for example in the manner of a truncated pyramid with six edges (see FIG. Fig. 2 and 9 , i.e. with an increasing hexagonal cross-sectional area ("hexagon") perpendicular to the light exit direction) or four edges (s. Fig. 3 ) or eight edges.
  • the increasing cross-sectional area ensures that the light is bundled and not scattered.
  • the internally mirrored reflector 21 forms, for example, a collimation reflector.
  • the internally mirrored reflector 21 is formed, for example, from a mirrored sheet metal development. This corresponds to a cost-effective production method. For example, a MIRO sheet from Alanod comes into consideration. According to one embodiment, a reflector 21 cut into a strip with a certain shape and folded into a, for example, hexagonal truncated pyramid, is used.
  • the collecting optics 20 are lensless. Thus, according to one embodiment, it is provided that between the output optics 30 and the LEDs 12 neither individual lenses for the LEDs 12 nor an individual lens array are / are provided.
  • the collecting optics 20 can form primary optics of the light source and do not include any Lens arrangement with at least one lens that would span the entirety of the LEDs 26.
  • the light source is therefore free from a lens array.
  • the light source does not have a lens array.
  • a lens array for an LED arrangement comprises a large number of individual lenses (e.g. exactly one for each LED), which must be very small in the sense of a compact light source, the smallest, still producible dimensions of the lenses of such a lens array limit the size of the light source Direction of a more compact structure.
  • this is done from a technical point of view, since lenses with the desired optical properties can no longer be produced below a certain minimum size.
  • the limitation also takes place from an economic point of view, since higher production costs may be incurred for smaller lens arrays, e.g. B. by the fact that the lenses have to be reworked in a costly manner. Omitting the lens array thus opens up degrees of freedom in the design of the light source; in particular, it is made possible to design the light source or parts thereof in a particularly compact manner.
  • the collecting optics 20, for example the reflector 21, is, according to one embodiment of the light source, in a holder 25 (see FIG. Figures 9A-C ) let in. In this way, the collecting optics can be protected from external forces.
  • the holder 25 has, for example, a receptacle 250 into which the collecting optics 20, for example the reflector 21, is completely embedded. To fasten the collecting optics 20, it can be provided with an adhesive on its outside, for example, which forms the connection to the receptacle 250.
  • a front side 251 of the holder 25 forms, for example, a support surface for the output optics 30, for example a diffuser disk, as in FIG Fig. 4 (A) is illustrated schematically.
  • a rear side 252 of the holder 25 is designed, for example, in the manner of a flange, and can according to the method shown in Figures 9A-B
  • the illustrated variant can be fastened to the coupling layer 80 with screws 253 (or other fastening means).
  • the rear side 252 of the holder 25, the coupling layer 80, the support 89 and the intermediate layer 89 and the support 90 can, for example, as in FIG Figures 9A-B illustrated, be coupled together in a kind of sandwich construction.
  • FIG. 9C Another variant is in Figure 9C illustrated.
  • the coupling layer 80 is formed with two parts 801 and 802 in the manner of a two-part pressure plate, which are pushed from the left and right over the flange-like rear side 252 of the holder and hold the holder 25 down there.
  • Screws 81 held under tension with springs 82 are again inserted, as in FIG Figure 9C shown.
  • the output optics 30 closing off the light source, for example in the form of a diffuser 30, have, for example, precisely defined scattering characteristics and the highest possible transmission.
  • the diffuser 30 can be a stochastic diffuser or a holographic diffuser.
  • the diffuser 30 is designed as a volume diffuser (see variant according to FIG Fig. 4 (C) ).
  • the output optics 30, for example in the form of a stochastic or holographic diffuser comprise, for example, a substrate 31 (see FIG. Fig. 4 (B) ), on which a (thin) light-scattering layer 32 is applied or integrated into the surface, the substrate 31 covering the light exit side 212 of the lensless collecting optics 20 (see FIG. Fig. 4 (A) ) and wherein the layer 32 points in the direction of the surroundings to be illuminated.
  • the layer 32 can also be shaped differently, so that partial sections can have a surface normal that does not point directly in the direction of the surroundings to be illuminated.
  • the substrate 31 can consist of a glass or an optical plastic.
  • the layer 32 can be fused to the substrate 31, for example if the glass or plastic has been processed by laser engraving or etching of the substrate surface.
  • the output optics 30 can therefore be designed as a diffuser disk.
  • the output optics 30 cover the light exit side 212 of the lensless collecting optics 20 in such a way, for example, that the interior 210 of the collecting optics 20 is sealed against the environment on the light exit side 212.
  • the output optics 30 can, for example (in addition to its optical function) simultaneously form a waterproof and dustproof seal of the headlight 100 from the surroundings.
  • the output optics 30 are attached to the housing 40 of the headlight 100, for example.
  • the entire headlight 100 is thus sealed off from the environment at this point, and in this variant the output optics do not necessarily have to be connected to the collecting optics 20 in a sealing manner.
  • each surface of a plastic or glass element of an embodiment of the light source through which light passes e.g. the output optics 30
  • an anti-reflective coating Previously reflected rays are now also directed through, and this increases the efficiency and the quality of the image.
  • the so-called "interface reflection" can e.g. be reduced from 4% to 0.5% by an additional anti-reflective coating.
  • the output optics 30 are made in one piece. That is to say, the output optics 30 can be monolithic and, in this property, can be connected to the collecting optics 20, which is designed, for example, as an internally mirrored reflector.
  • the output optics 30 is constructed in several parts, e.g. in two parts.
  • a pane of glass is provided that covers the light exit side 212 of the collecting optics 20, which is embodied, for example, as an internally mirrored reflector.
  • a holographic diffuser can be attached to this glass pane.
  • Fig. 10 shows an exemplary embodiment of the output optics 30.
  • the output optics 30 is designed in two parts;
  • a glass pane 33 closes off the light exit side 212 of the collecting optics 20, which is embodied, for example, as an internally mirrored reflector.
  • the glass pane 33 thus receives the light collected and mixed by the collecting optics 20 and transmits this along its thickness in the light exit direction L.
  • a holographic diffuser 34 is provided on the glass pane 33, which receives and outputs the light transmitted by the glass pane 33.
  • the light source comprises a frame structure 35 via which the output optics 30 are coupled to the collecting optics 20.
  • the frame structure 35 frames, for example, the output optics 30.
  • a coupling structure 36 likewise framed by the frame structure 35, is provided, which is arranged between the frame structure 36 and output optics 30 and is designed to form a mechanical coupling with a subsequent optics (not shown here).
  • the coupling structure 36 comprises, for example, a flange with a bayonet lock for fastening the subsequent optics.
  • the light source can advantageously serve as a basis for the formation of a number of different types of headlights; Depending on the application, a corresponding follow-up optic can be used are selected and mechanically coupled to the light source via the coupling structure 36.
  • an interface 37 with a number of (eg five) lines 371-375 is provided for the transfer of data, control and / or power signals between the subsequent optics and the light source, the interface 37 being able to be connected to the control device 70 .
  • the control device 70 can also act on the follow-up optics in terms of control technology and / or data can be exchanged between the follow-up optics and the light source.
  • An inserted optic can be unlocked via a slide 38.
  • a machine-readable code such as a QR code.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
EP19195841.2A 2019-09-06 2019-09-06 Universallichtquelle für einen scheinwerfer sowie scheinwerfer Pending EP3789652A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP19195841.2A EP3789652A1 (de) 2019-09-06 2019-09-06 Universallichtquelle für einen scheinwerfer sowie scheinwerfer
PCT/EP2020/072506 WO2021043543A1 (de) 2019-09-06 2020-08-11 Universallichtquelle für einen scheinwerfer sowie scheinwerfer
US17/640,783 US11898742B2 (en) 2019-09-06 2020-08-11 Spotlight LED light source
CN202080074134.1A CN114585855B (zh) 2019-09-06 2020-08-11 用于聚光灯的通用光源以及聚光灯

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19195841.2A EP3789652A1 (de) 2019-09-06 2019-09-06 Universallichtquelle für einen scheinwerfer sowie scheinwerfer

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EP3789652A1 true EP3789652A1 (de) 2021-03-10

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EP (1) EP3789652A1 (zh)
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CN114585855A (zh) 2022-06-03
US11898742B2 (en) 2024-02-13
US20220333762A1 (en) 2022-10-20
WO2021043543A1 (de) 2021-03-11

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