EP3788297B1 - Dmd-lichtmodul mit einem klemmend gehaltenen dmd-chip - Google Patents

Dmd-lichtmodul mit einem klemmend gehaltenen dmd-chip Download PDF

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Publication number
EP3788297B1
EP3788297B1 EP19723707.6A EP19723707A EP3788297B1 EP 3788297 B1 EP3788297 B1 EP 3788297B1 EP 19723707 A EP19723707 A EP 19723707A EP 3788297 B1 EP3788297 B1 EP 3788297B1
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EP
European Patent Office
Prior art keywords
circuit board
support element
dmd chip
light module
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP19723707.6A
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German (de)
English (en)
French (fr)
Other versions
EP3788297A1 (de
Inventor
Anton Jost
Ralf Chor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Automotive Lighting Reutlingen Germany GmbH
Original Assignee
Marelli Automotive Lighting Reutlingen Germany GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of EP3788297A1 publication Critical patent/EP3788297A1/de
Application granted granted Critical
Publication of EP3788297B1 publication Critical patent/EP3788297B1/de
Active legal-status Critical Current
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/39—Attachment thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/49—Attachment of the cooling means

Definitions

  • Light modules are from DE 198 22 142 C2 , WO2017143372 A1 or WO2017147632 A1 known.
  • the light module emits a light beam having a main radiation direction.
  • the radiation occurs in an area of space in front of the motor vehicle headlight in the direction of travel, so that it is illuminated.
  • a front side is mentioned in the present application, this refers to a side that faces this area of space.
  • a back is a side facing away from this room area.
  • the known light module has a circuit board which has a front and a back and which carries a DMD chip (DMD: Digital Mirror Device) on its front.
  • the DMD chip has a front side carrying micromirrors and a back side opposite its front side.
  • the known light module also has a central support element that has a front and a back.
  • each individual micromirror is only 8 times 8 micrometers in size.
  • One position of each individual micromirror can be switched between two positions. In one position it reflects light incident from a light source via primary optics onto a secondary optics of the light module, and in the other position it reflects the light onto an absorber, for example.
  • the secondary optics images the arrangement of the micromirrors in the front of the light module, which is located on the road in a motor vehicle headlight, for example.
  • Micromirrors that reflect light onto the secondary optics appear as bright pixels in the light distribution resulting from the imaging, while the micromirrors that reflect light onto the absorber appear as dark pixels in the light distribution.
  • the shape of the light distribution can be controlled with a fineness determined by the number of pixels and thus by the number of micromirrors, which enables, for example, camera-controlled light distributions in which areas that would dazzle other road users can be specifically darkened and other areas , for example traffic signs or pedestrians, are specifically illuminated so that they can be recognized by the driver.
  • the object of the present invention is to provide an improved DMD light module of the type mentioned at the beginning.
  • the light module has a cooling element assembly, that the central carrier element has a carrier element window, that the circuit board is arranged with its front facing the back of the central carrier element so that the front of the DMD chip covers the carrier element window, the Micromirrors are arranged in the opening of the carrier element window Circuit board has a circuit board window, the opening of which is completely or partially covered by a back of the DMD chip, that the cooling element assembly has a cooling stamp which is supported through the circuit board window on the back of the DMD chip, that the cooling element assembly is otherwise on the Rear side of the circuit board is arranged, and that the light module has an elastically deformed elastic connecting element, wherein the elastic connecting element is a leaf spring which has at least one end on the cooling element assembly side and at least one end on the carrier element side and is rigid with its end on the cooling element assembly side the end of the cooling element assembly facing the back of the circuit board is connected and its end on the carrier element side is rigidly connected to the
  • the clamping contact pressure lies in a contact pressure range defined by the deformation of the elastic element. This allows the effects of positional tolerances of the DMD chip on the contact pressure acting on it to be compensated for.
  • the deformation changes within the range of usual tolerances elastic element and therefore the contact force it generates is only small.
  • the contact force acts transversely to the PCB plane.
  • the contact pressure is limited by the elastic element to its restoring forces, which reliably prevents damage caused by excessive contact pressure, as can occur with other fastenings, for example with less elastic screw connections.
  • the contact pressure is preferably between 40 N and 110 N.
  • the circuit board is freed from holding forces occurring in the direction of action of the contact pressure. This effectively suppresses any vibration of the circuit board during operation of the light module in a motor vehicle that is exposed to vibrations.
  • a preferred embodiment is characterized in that the DMD chip is arranged and held in a base of the circuit board.
  • the circuit board only holds the DMD chip in the direction of the circuit board level. In these directions, the circuit board has great rigidity, unlike in a direction transverse to it. This holds the DMD chip securely and firmly at the circuit board level.
  • the DMD chip is held mechanically in the base via the narrow sides of the DMD chip. This means that the front and back of the DMD chip are available for other tasks, namely for absorbing forces acting transversely to these sides, as a contact surface for a seal and as an interface for dissipating heat from the DMD chip.
  • circuit board is connected to receptacles of the central support element by adhesive connections.
  • Adhesive connections have the advantage that there are smaller gaps between the Fill the objects to be glued together and thereby allow an alignment of the relative position of the objects to be glued to one another, the bonding then taking place in the aligned state without tension, ie without mechanical tension on the circuit board. This allows component tolerances to be effectively minimized.
  • the elastic connecting element is a leaf spring.
  • a leaf spring is easy to handle and has the advantage over spiral springs of ensuring lateral guidance even perpendicular to the direction of the spring force. This means that there is no need for further mounting of the cooling element assembly in the light module in a form-fitting manner, for example with sliding bearing surfaces.
  • the leaf spring has an end on the support element side, which is rigidly connected to the central support element.
  • the central support element has screw domes which protrude from the back of the central support element and which have receptacles for the ends of the leaf spring on the support element side on their ends facing away from the back.
  • the leaf spring is connected with its end on the cooling element assembly side in a force-fitting and/or form-fitting manner to a part of the cooling element assembly located on the back of the circuit board.
  • connection is made by form-fitting elements of the remaining part of the cooling element assembly, which attach the cooling element assembly-side end of the leaf spring to it prevent it from moving to the circuit board.
  • a path of the light emanating from a light source of the light module from the light source to its exit from the secondary optics through the secondary optics lies completely in a dust-tight sealed interior of the light module.
  • the size of the micromirrors (e.g. 8 x 8 micrometers) is in a size range that also includes the sizes of dust particles.
  • the dust particles can therefore completely or partially cover micromirrors, which could adversely affect the light distribution generated by the light module.
  • the interior is sealed and delimited in a dust-tight manner by a front part of the housing, the central support element, the DMD chip, a circuit board, the secondary optics and a dust-tight pressure compensation membrane.
  • FIG. 1 shows in detail a sectional view of a motor vehicle headlight 10 with a housing 12, the light exit opening of which is covered by a transparent cover plate 14.
  • the cutting plane lies parallel to a plane that is formed by a longitudinal axis and a vertical axis of the motor vehicle is clamped.
  • the light module 16 has, among other things, a light source 18, a primary optics 20, a DMD chip 22, a secondary optics 24 and an absorber 25.
  • the light module 16 also has a circuit board 26, a central support element 28, a cooling element assembly 30 and an elastic connecting element 32.
  • the circuit board 26 has a front side 260, a back side 262 and a circuit board window 264 and carries the DMD chip 22 on its front side 260.
  • the DMD chip 22 has a front side 224 carrying a micromirror 222 and a back side 226 opposite its front side 224, which faces the circuit board 26.
  • the central support element 28 has a front 282, a back 284 and a support element window 286.
  • the circuit board 26 is arranged with its front side 260 facing the back side 284 of the central carrier element 28 so that the front side 224 of the DMD chip 22 covers the carrier element window 286, with the micromirrors 222 being arranged visibly through an opening in the carrier element window 286.
  • An opening of the circuit board window 264 is completely or partially covered by the back 226 of the DMD chip 22.
  • the cooling element assembly 30 has a cooling stamp 302, which is supported through the circuit board window 264 on the back 226 of the DMD chip 22. Incidentally, that is, with the part 304 of the cooling element assembly 30, which does not protrude through the circuit board window 264 between the circuit board 26 and the central Carrier element 28 lies, the cooling element assembly 30 is arranged on the back 262 of the circuit board 26.
  • the elastic connecting element 32 has at least one end 322 on the cooling element assembly side and at least one end 324 on the carrier element side.
  • the elastic connecting element 32 With its end 322 on the cooling element assembly side, the elastic connecting element 32 is rigidly connected to the remaining part 304 of the cooling element assembly 30 arranged on the back 262 of the circuit board 26.
  • the elastic connecting element 32 With its support element-side end 324, the elastic connecting element 32 is rigidly connected to the central support element 28.
  • the light source 18 is a semiconductor light source 182, which is arranged on a circuit board 35 and which emits light 34 in the direction of the primary optics 20.
  • the primary optics 20 directs the light 34 incident from the semiconductor light source 182 onto the micromirrors 222, which are arranged on the front side 224 of the DMD chip 22. How and with which optical elements of the primary optics 20 this happens in detail is not essential to the invention.
  • the primary optics 20 has a concave mirror reflector.
  • the reflector is preferably supplemented by an optical element arranged between the light source and the reflector, which concentrates the light from the light source and directs it onto the reflector.
  • the optical element is preferably a lens or an arrangement of several lenses.
  • a pivoting position of the micromirrors 222 is individual for each micromirror or at least for different groups (subsets) of the micromirrors 222 between one first pivot position and a second pivot position can be switched.
  • Each micromirror, which is in the first pivoting position redirects the light 34 incident on it from the primary optics 20 onto the secondary optics 24.
  • Each micromirror, which is in the second pivoting position deflects the light 34 incident on it from the primary optics 20 in such a way that this light 342 does not fall on the secondary optics 24.
  • This light 342 is, for example, directed onto the absorber 25 and absorbed there so that it cannot produce any disturbing light effects.
  • the secondary optics 24 directs the light 34 incident on it from the DMD chip 22 into the front of the light module 16. When the light module 16 is used as intended, this light 34 illuminates the road ahead of the motor vehicle.
  • the secondary optics 24 has a secondary optics lens 242 made of transparent plastic or glass.
  • the secondary optics 24 can also have several lenses, for example an arrangement of an achromat and an imaging lens.
  • the DMD chip 22 has two broad sides in the form of the front 224 and the back 226, the front 224 and the back 226 being separated from one another by narrow side sides 228 lying between them.
  • the front side 224 of the DMD chip 22 has a central chip area in which the micromirrors 222 are arranged, and it has a flange area 229 surrounding the central chip area in a closed curve, in which no micromirrors 222 are arranged.
  • the number of micromirrors is approximately 1.3 million, which are arranged in a matrix with 1152 columns and 1152 rows.
  • Figure 2 also shows that the DMD chip 22 is arranged and held in a socket 266 of the circuit board 26.
  • the mechanical mounting of the DMD chip 22 in the base 266 takes place via the lateral narrow sides 228 and possibly additionally via parts of the back 226 of the DMD chip 22, and the electrical contacting also takes place via the lateral narrow sides 228 and/or via the Back side 226 of the DMD chip 22 from the circuit board 26.
  • the circuit board 26 is firmly connected to the central support element 28.
  • the connection is preferably carried out by in the Figure 1 Adhesive connections shown 36.
  • the adhesive connections 36 lie between the circuit board 26 and receptacles 288 of the central support element 28.
  • the circuit board 26 does not exert any contact pressure acting perpendicular to the surface of the circuit board 26 and the front side 224 of the DMD chip 22. However, the circuit board 26 holds the DMD chip 22 with its base 266 in directions tangential to the front side 224 of the DMD chip 22 and the circuit board 26.
  • the said contact pressure presses the flange region 229 of the DMD chip 22 against the back of the central support element 28.
  • the contact pressure is generated by the elastic connecting element 32 as a restoring force of an elastic deformation that the elastic connecting element 32 experiences when assembling the light module 16.
  • a leaf spring 326 serving as an elastic connecting element 32 is rigidly connected to the central support element 28 with its end 324 on the support element side.
  • the central support element 28 has screw domes 289 which protrude from the back 284 of the central support element 28. On their ends facing away from the back 284, the screw domes 289 have receptacles for the ends 324 of the leaf spring 326 on the carrier element side.
  • the leaf spring 326 With its end 322 on the cooling element assembly side, the leaf spring 326 is non-positively and/or positively connected to the remaining part 304 of the cooling element assembly 30 lying on the back 262 of the circuit board 26.
  • This connection is made by positive locking elements 306 of the remaining part 304 of the cooling element assembly 30, which prevent the end 322 of the leaf spring 326 on the cooling element assembly side from moving towards the circuit board 26.
  • the cooling stamp 302 with which the cooling element assembly 30 is supported through the circuit board window 264 on the back 226 of the DMD chip 22, initially results in a distance between the leaf spring-side ends of the screw domes when assembling the light module 16 before the screw connections are made 289 and the carrier element-side ends 324 of the leaf spring 326 in a direction perpendicular to the back 262 of the circuit board 26.
  • this distance between the leaf spring-side ends of the screw domes 289 and the carrier element-side ends 324 of the leaf spring 326 disappears, with the leaf spring 326 being elastically deformed.
  • the screw connection between the leaf spring-side ends of the screw domes 289 and the support element-side ends 324 of the leaf spring 326 is preferably produced in two steps: In a first step, the screw connection is only made to the extent that the elastic connecting element 30 does not yet generate its full restoring force, but the screw connection is made to such an extent that the DMD chip 22 is already pressed onto the back 284 of the central support element 28 with a certain, although not the full, contact force. The elastic connecting element is initially deformed to a first extent in which it generates the certain contact pressure.
  • the circuit board 26 is initially floating in the receptacles 288 of the central support element 28 in the circuit board plane. In this state, the circuit board 26 is aligned with the aid of a camera and image processing-supported alignment system together with the DMD chip 22, which is firmly seated in the base 266 of the circuit board 26, so that the directions in which the micromirrors 222 are incident from the primary optics 20 Reflect light 34, corresponds to the desired target directions. After alignment has taken place, the circuit board 26 is bonded with the adhesive connections 36 to the receptacles 288 of the central support element 28 in a stress-free manner. Only then are the screw connections with which the leaf spring 326 is screwed to the screw domes 289 finally tightened. The elastic connecting element as a whole is deformed to a second extent, which is larger than the first extent. Therefore, the restoring force and thus also the contact force when the screws are fully tightened are greater than before.
  • FIG. 3 shows a preferred exemplary embodiment of a light module 160 according to the invention.
  • the path of the light 34 from the light source 18 to its exit from the secondary optics 24 through the secondary optics 24 lies completely in a dust-tight sealed interior 38.
  • This interior 38 is through a front housing part 40, the central support element 28, the DMD chip 22, the circuit board 35, the secondary optics 24 and a dust-tight pressure compensation membrane 32. Dust tightness can be achieved up to class IP6K2. Under certain circumstances, assembly under clean room conditions may be necessary.
  • the front 282 of the central support element 28 faces the interior 38.
  • the central carrier element 28 has a first subregion 281 on the light source and primary optics side and a second subregion 283 on the DMD chip side. These two partial areas 281 and 283 are spatially separated from one another, but are cohesively connected and together form the one-piece central support element 28.
  • the two partial areas 281 and 283 enclose an angle that is greater than 90° but smaller than 180°.
  • the central support element 28 is preferably made of metal and also serves as a heat sink, which absorbs the heat released in the light source 18 and releases it to the surroundings of the light module 160. The last sentence applies to all exemplary embodiments.
  • the circuit board 35 is firmly connected to the front 282 of the central support element 28 in its first portion 281.
  • the connection is, for example, a screw and/or adhesive connection.
  • a front side 352 of the circuit board 35 carries the light source 18, implemented as a semiconductor light source 182, and the primary optics 20.
  • One Back 354 of the circuit board 35 faces the front 30.1 of the central support element 30.
  • the central support element 28 projects beyond the board 35 in directions transverse to the front 352 and the back 354 of the circuit board 35. These directions are also referred to below as lateral directions 37.
  • An example of a lateral direction 37 is in the Figure 3 specified. Other lateral directions are perpendicular to the drawing plane.
  • the edge of the front side 282 of the central support element 28 which projects laterally beyond the circuit board 35 forms part of an interior-side flange region of the central support element 28.
  • the carrier element window 286 is arranged in the second portion 283 of the central carrier element 28.
  • a window edge area surrounding the support element window 286 forms a window flange area on the back 284 of the central support element 28.
  • the interior flange area of the central support element 28 lies opposite the window flange area. Between the two flange areas there is a DMD chip seal 44 in the form of a flat seal, which is held by the flange areas with a contact pressure that presses these flange areas onto one another and which runs around the carrier element window 286 in a closed curve.
  • the central area of the back of the DMD chip 16 serves as an interface for dissipating heat from the DMD chip 16 and therefore has no electrical connections.
  • the circuit board 26, which carries the DMD chip 22, lies completely outside the sealed interior 38.
  • the DMD chip 22 is arranged between the back 284 of the central carrier element 28 Window flange area of the carrier element window 286 and the spring-loaded cooling stamp 302 held clamped, as with reference to Figure 1 has been explained.
  • the contact pressure generated by the elastic connecting element 32 is also exerted on the DMD chip seal 44 at the same time, which thus contributes to the dust-tight sealing of the interior 38.
  • Figure 4 shows an oblique view of the back 284 of a central carrier element 28 before assembly of the DMD chip 22.
  • the central carrier element 28 has on its back 284 an outer flange region which surrounds the carrier element window 286 in a closed curve and which is in the Figure 4 is covered by the DMD chip seal 44.
  • Figure 4 also shows screw domes 289, which are set up to receive and fasten the ends 324 of the elastic connecting element 32 on the carrier element side.
  • Figure 5 shows schematically a plan view of the front 282 of the central support element 28 with the circuit board 35, the support element window 286 and an interior-side flange region 287 of the central support element 28, which has the shape of a closed curve.
  • the curve is in the Figure 3 illustrated embodiment, in which the two partial areas 281 and 283 enclose an angle with each other that is greater than 90 ° and less than 180 °, not in one plane. Depending on the design, the curve can also run in one plane. In any case, the curve forms a curve that runs in space and is therefore spatial.
  • a flat gasket or a flange reinforcement 46 can rest on the circuit board 35, which, when assembled with the front housing part 40, surrounds a housing window 402 (see Figure 6 ) of the front housing part 40 runs around.
  • Figure 6 shows this to the central support element 28 Figure 5 complementary front housing part 40.
  • an inside of the front housing part 40 facing the interior 38 of the light module 160 with a housing flange area 404 is visible.
  • the shape of the housing flange area 404 is a negative of the shape of the outer flange area 287 of the central support element 28, so that both flange areas 404, 287 touch each other flatly along the entire length of the spatial curve of the flange areas when the front housing part 40 and the central support element 28 are joined together or touch the surface of a seal lying between them.
  • a seal 406 rests on the housing flange area 404 over its entire length.
  • the front housing part 40 has a housing window 402.
  • a seal 408 rests on the edge over the length of the edge of the housing window 402.
  • the seals 406 and 408 are preferably sealing lips made of sealing material, which is molded onto the front housing part 40, which is preferably made of plastic.
  • the sealing material is, for example, a plastically deformable plastic, for example silicone. Silicone has the advantage that it can be baked out before assembly, which avoids later impairment of optical surfaces of the light module 160 due to precipitation of evaporated sealing material.
  • the light module 160 preferably has screw connections, with which the flange areas 404 and 287 are pressed together. When assembled, the front housing part 40 and the central support element 28 surround the interior 38.
  • FIG. 3 shows, at least the back 354 of the circuit board 35, which faces the interior front 282 of the central support element 28, lies in the interior 38.
  • a front side 352 of the circuit board 35 which carries the light source 18 and the primary optics 20, faces the front part of the housing 40.
  • the front housing part 40 has the housing window 402 in a part of the front housing part 40 which faces the circuit board 35.
  • the housing window 402 enables an electrical connection of the electrical components arranged in the dust-tight interior 38 of the light module 160, in particular the light source 18, to a cable harness 50 brought in from the outside.
  • the edge of the housing window 402 forms on its side facing the circuit board 35 a housing window flange which contacts the circuit board 35 over its entire length or which at least over its entire length contacts a seal 408 surrounding the opening of the housing window 402, which in turn the board 35 touches the surface over its entire length.
  • the circuit board 35 thus covers the housing window 402 in a dust-tight manner.
  • the shape of the front housing part 40 is coordinated with the position of the circuit board 35 on the central support element 28 in such a way that contact between the circuit board 35 and the housing window flange, or between the circuit board 35, the seal 408 and the housing window flange, already occurs when between the Housing flange area 404 and the interior flange area 287 of the central support element 28 there is still a small distance.
  • a sealing contact pressure is produced between the housing window flange and the circuit board 35, or between the housing window flange, the seal 54 and the circuit board 35.
  • the seals 406 and 408 are therefore in relation to one another offset density levels.
  • the entire length of the narrow side of the board 35, which runs around the broad sides of the board 35, lies within the interior 38.
  • the electrical contact does not have to run in a sealing plane or through a seal, which improves the reliability of the seal.
  • the front housing part 40 has a light exit opening 401.
  • the edge of the front housing part 40 surrounding the clear width of the light exit opening 401 is designed as an inner sealing area 403 of the front housing part 40.
  • the inner sealing area 403 is also covered with sealing material.
  • the light exit opening 401 is sealed in a dust-tight manner by the secondary optics 24 and a sealing material surrounding an edge of the secondary optics 24.
  • Figure 7 shows a top view of the back 284 of a central support element 28, the back 262 of the circuit board 26 and the cooling element assembly 30 with an elastic connecting element 32, which is implemented as a leaf spring 322 running in a closed loop and two carrier element-side ends 324 and two cooling element assemblies - side ends 322.
  • the elastic element does not have to be a single leaf spring be realized.
  • it can also be implemented as a spiral spring, as an arrangement of spiral springs or leaf springs or as a block made of elastic material or as an arrangement of several such blocks.
  • the cooling element assembly 30 preferably has surface-enlarging structures such as cooling fins or cooling pins in order to improve the release of heat to the environment.
  • the light module preferably has a fan that supplies cooling air to the cooling fins and/or pins.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Projection Apparatus (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
EP19723707.6A 2018-05-03 2019-05-02 Dmd-lichtmodul mit einem klemmend gehaltenen dmd-chip Active EP3788297B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018110587.8A DE102018110587A1 (de) 2018-05-03 2018-05-03 DMD-Lichtmodul mit einem klemmend gehaltenen DMD-Chip
PCT/EP2019/061194 WO2019211356A1 (de) 2018-05-03 2019-05-02 Dmd-lichtmodul mit einem klemmend gehaltenen dmd-chip

Publications (2)

Publication Number Publication Date
EP3788297A1 EP3788297A1 (de) 2021-03-10
EP3788297B1 true EP3788297B1 (de) 2024-03-20

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EP (1) EP3788297B1 (zh)
CN (1) CN112752923B (zh)
DE (1) DE102018110587A1 (zh)
WO (1) WO2019211356A1 (zh)

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Publication number Priority date Publication date Assignee Title
EP3904756A1 (de) * 2020-04-28 2021-11-03 ZKW Group GmbH Beleuchtungsvorrichtung für einen kraftfahrzeugscheinwerfer

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DE102018110587A1 (de) 2019-11-07
CN112752923B (zh) 2022-12-02
CN112752923A (zh) 2021-05-04
EP3788297A1 (de) 2021-03-10

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