EP3761345A4 - Composition dans laquelle l'endommagement d'une alumine est inhibiteur et procede de fabrication de substrat semi-conducteur mettant en oeuvre celle-ci - Google Patents
Composition dans laquelle l'endommagement d'une alumine est inhibiteur et procede de fabrication de substrat semi-conducteur mettant en oeuvre celle-ci Download PDFInfo
- Publication number
- EP3761345A4 EP3761345A4 EP19761160.1A EP19761160A EP3761345A4 EP 3761345 A4 EP3761345 A4 EP 3761345A4 EP 19761160 A EP19761160 A EP 19761160A EP 3761345 A4 EP3761345 A4 EP 3761345A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- alumina
- suppressed
- damage
- composition
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/10—Salts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/08—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/10—Salts
- C11D7/105—Nitrates; Nitrites
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02178—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing aluminium, e.g. Al2O3
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018037143 | 2018-03-02 | ||
PCT/JP2019/007408 WO2019167970A1 (fr) | 2018-03-02 | 2019-02-27 | Composition dans laquelle l'endommagement d'une alumine est inhibé, et procédé de fabrication de substrat semi-conducteur mettant en œuvre celle-ci. |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3761345A1 EP3761345A1 (fr) | 2021-01-06 |
EP3761345A4 true EP3761345A4 (fr) | 2021-04-28 |
Family
ID=67806237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19761160.1A Pending EP3761345A4 (fr) | 2018-03-02 | 2019-02-27 | Composition dans laquelle l'endommagement d'une alumine est inhibiteur et procede de fabrication de substrat semi-conducteur mettant en oeuvre celle-ci |
Country Status (8)
Country | Link |
---|---|
US (1) | US11479744B2 (fr) |
EP (1) | EP3761345A4 (fr) |
JP (1) | JP7294315B2 (fr) |
KR (1) | KR20200127151A (fr) |
CN (1) | CN111742392A (fr) |
IL (1) | IL277045B1 (fr) |
TW (1) | TW201938767A (fr) |
WO (1) | WO2019167970A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI762681B (zh) * | 2017-07-31 | 2022-05-01 | 日商三菱瓦斯化學股份有限公司 | 抑制鈷、氧化鋁、層間絕緣膜與氮化矽之損傷的組成液及利用此組成液的清洗方法 |
US11352593B2 (en) * | 2018-04-27 | 2022-06-07 | Mitsubishi Gas Chemical Company, Inc. | Aqueous composition and cleaning method using same |
US11158518B2 (en) * | 2019-09-25 | 2021-10-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Methods of etching metals in semiconductor devices |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1808480A1 (fr) * | 2006-01-12 | 2007-07-18 | Air Products and Chemicals, Inc. | Composition aqueuse de nettoyage à pH tamponné et procédé pour l'élimination de résidus de photorésine |
EP3193359A1 (fr) * | 2014-11-13 | 2017-07-19 | Mitsubishi Gas Chemical Company, Inc. | Liquide de nettoyage pour élément semi-conducteur inhibant les dommages sur des matériaux contenant du tantale, et procédé de nettoyage mettant en uvre celui-ci |
EP3220408A1 (fr) * | 2014-11-13 | 2017-09-20 | Mitsubishi Gas Chemical Company, Inc. | Liquide de nettoyage contenant un métal alcalino-terreux destiné à nettoyer un élément semi-conducteur, et procédé de nettoyage d'élément semi-conducteur mettant en uvre celui-ci |
EP3220409A1 (fr) * | 2014-11-13 | 2017-09-20 | Mitsubishi Gas Chemical Company, Inc. | Liquide de nettoyage pour élément semi-conducteur inhibant les dommages sur du cobalt, et procédé de nettoyage d'élément semi-conducteur mettant en oeuvre celui-ci |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3891768B2 (ja) | 1999-12-28 | 2007-03-14 | 株式会社トクヤマ | 残さ洗浄液 |
TW594444B (en) | 2000-09-01 | 2004-06-21 | Tokuyama Corp | Residue cleaning solution |
JP4758187B2 (ja) * | 2005-09-26 | 2011-08-24 | 関東化学株式会社 | フォトレジスト残渣及びポリマー残渣除去液 |
US8563431B2 (en) * | 2006-08-25 | 2013-10-22 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
US7927991B2 (en) * | 2006-08-25 | 2011-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
US7988057B2 (en) * | 2006-11-28 | 2011-08-02 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and semiconductor device |
TW200908148A (en) | 2007-03-31 | 2009-02-16 | Advanced Tech Materials | Methods for stripping material for wafer reclamation |
JP6327746B2 (ja) * | 2014-03-31 | 2018-05-23 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
EP3093875A4 (fr) * | 2014-04-10 | 2017-03-08 | Mitsubishi Gas Chemical Company, Inc. | Composition liquide pour nettoyage d'élément à semi-conducteur et procédé de nettoyage d'élément à semi-conducteur |
EP3193358B1 (fr) * | 2014-11-13 | 2021-03-31 | Mitsubishi Gas Chemical Company, Inc. | Liquide de nettoyage pour élément semi-conducteur inhibant les dommages sur des matériaux contenant du tungstène, et procédé de nettoyage d'élément semi-conducteur mettant en uvre celui-ci |
JPWO2018061670A1 (ja) | 2016-09-29 | 2019-06-24 | 富士フイルム株式会社 | 処理液、および積層体の処理方法 |
-
2019
- 2019-02-27 US US16/976,614 patent/US11479744B2/en active Active
- 2019-02-27 KR KR1020207019597A patent/KR20200127151A/ko not_active Application Discontinuation
- 2019-02-27 TW TW108106667A patent/TW201938767A/zh unknown
- 2019-02-27 IL IL277045A patent/IL277045B1/en unknown
- 2019-02-27 WO PCT/JP2019/007408 patent/WO2019167970A1/fr active Application Filing
- 2019-02-27 EP EP19761160.1A patent/EP3761345A4/fr active Pending
- 2019-02-27 CN CN201980014145.8A patent/CN111742392A/zh active Pending
- 2019-02-27 JP JP2020503538A patent/JP7294315B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1808480A1 (fr) * | 2006-01-12 | 2007-07-18 | Air Products and Chemicals, Inc. | Composition aqueuse de nettoyage à pH tamponné et procédé pour l'élimination de résidus de photorésine |
EP3193359A1 (fr) * | 2014-11-13 | 2017-07-19 | Mitsubishi Gas Chemical Company, Inc. | Liquide de nettoyage pour élément semi-conducteur inhibant les dommages sur des matériaux contenant du tantale, et procédé de nettoyage mettant en uvre celui-ci |
EP3220408A1 (fr) * | 2014-11-13 | 2017-09-20 | Mitsubishi Gas Chemical Company, Inc. | Liquide de nettoyage contenant un métal alcalino-terreux destiné à nettoyer un élément semi-conducteur, et procédé de nettoyage d'élément semi-conducteur mettant en uvre celui-ci |
EP3220409A1 (fr) * | 2014-11-13 | 2017-09-20 | Mitsubishi Gas Chemical Company, Inc. | Liquide de nettoyage pour élément semi-conducteur inhibant les dommages sur du cobalt, et procédé de nettoyage d'élément semi-conducteur mettant en oeuvre celui-ci |
Non-Patent Citations (1)
Title |
---|
See also references of WO2019167970A1 * |
Also Published As
Publication number | Publication date |
---|---|
TW201938767A (zh) | 2019-10-01 |
US20210002591A1 (en) | 2021-01-07 |
CN111742392A (zh) | 2020-10-02 |
EP3761345A1 (fr) | 2021-01-06 |
US11479744B2 (en) | 2022-10-25 |
JP7294315B2 (ja) | 2023-06-20 |
JPWO2019167970A1 (ja) | 2021-03-04 |
IL277045B1 (en) | 2024-05-01 |
WO2019167970A1 (fr) | 2019-09-06 |
KR20200127151A (ko) | 2020-11-10 |
IL277045A (en) | 2020-10-29 |
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Ipc: H01L 21/304 20060101AFI20210325BHEP Ipc: C11D 7/08 20060101ALI20210325BHEP Ipc: C11D 7/10 20060101ALI20210325BHEP Ipc: C11D 7/18 20060101ALI20210325BHEP Ipc: C11D 7/26 20060101ALI20210325BHEP Ipc: C11D 7/32 20060101ALI20210325BHEP Ipc: H01L 21/02 20060101ALI20210325BHEP |
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