Classifications

• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
  • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
  • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
  • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
  • H01L25/165—Containers
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
  • H02G5/00—Installations of bus-bars
  • H02G5/10—Cooling
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/14—Mounting supporting structure in casing or on frame or rack
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/02—Containers; Seals
  • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
  • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
  • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
  • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Definitions

• the invention generally relates to the field of power electronics. More particularly, the invention relates to a set of bus bars forming housing and heat sink for electronic power devices such as inverters and power converters, but not exclusively. The invention also relates to electronic power devices incorporating the above-mentioned busbar assembly.
• Power electronic devices such as inverters and power converters
• inverters and power converters are very present in many fields of activity such as transport, industries, lighting, heating, etc. With the desired energy transition towards renewable and less carbon-intensive energy sources, power electronics will become more widespread and will have to respond to increasing economic and technological constraints.
• the reduction of resistive, inductive and capacitive parasitic elements is essential to achieve the best possible compromise between the search for compactness and the satisfaction of the various design constraints.
• the parasitic inductances in the power bus buses oppose higher switching frequencies. Higher switching frequencies are favorable for compactness but increase switching losses and the power dissipated by the components.
• the reduction of parasitic inductances is necessary to protect the circuits against potentially destructive overvoltages, to improve the control of the electromagnetic radiations, to reduce the heat generated and to increase the switching speed.
• press-pack For the improvement of reliability, especially in applications where thermal cycles are severe, the so-called "press-pack” technology is used to eliminate welds that deteriorate with the mechanical stresses due to thermal cycling.
• electrical contacts are provided by mechanical pressure or clamping means that hold the components in place and in contact.
• the "press-pack” technology also has the advantage of facilitating the dismantling of the devices and therefore their repair.
• the invention relates to a set of bus bars forming housing and heat sink of an electronic power device, comprising a plurality of bar bus sectors arranged contiguously and in electrical contact, around a central axis and high and low closure plates perpendicular to the central axis, the busbar sectors each comprising an outer busbar section and at least one inner busbar section which delimit a plurality of internal volumes, the high and low closure plates being respectively in contact with the upper and lower faces of the busbar sections and the busbar sections comprising a plurality of electrical contact faces of the so-called "press pack" type.
• the outer busbar sections of the plurality of busbar sectors comprise cooling fins on an external face.
• the bar bus sections of the plurality of busbar sectors are made of copper and / or aluminum and are manufactured by molding and / or machining and / or cutting a profiled bar.
• the busbar assembly comprises seals located in junction faces between adjacent external busbar sections and between the top and bottom closure plates and the bus sections. external bar.
• the high and low closure plates are of laminated type and each comprise a central dielectric layer and two electrically conductive plates on either side of the central dielectric layer, the electrically conductive plates being in electrical contact with the bar bus sections.
• the central dielectric layer comprises at least one buried electronic circuit and / or an active or passive buried electronic component.
• At least one of the high and low closure plates is of the so-called "IMS" type.
• the electrically conductive plates are made of copper and / or aluminum.
• the plurality of internal volumes comprise a first internal volume delimited between an electrical contact face of the external busbar section and an electrical contact face of a busbar. first section of internal bus bar, the first internal volume being dedicated to the type of assembly "press pack" of an electronic power circuit.
• the plurality of internal volumes comprise at least one other internal volume arranged between the first inner busbar section and the central axis.
• the plurality of internal volumes comprise a second internal volume arranged between the first internal busbar section and a second internal busbar section and a third internal volume. arranged between the second section of internal bus bar and the central axis.
• FIGS. 1 and 2 are perspective views showing a particular embodiment of a set of bus bars according to the invention
• Fig.3 is a simplified top view showing a busbar sector included in the set of bus bars of Figs.1 and 2
• Fig.4 is a partial sectional view simplified of a closure plate included in the set of bus bars of Figs.1 and 2
• Figs.5A, 5B and 5C are simplified sectional partial views showing different assemblies of a closure plate and busbar sections included in the busbar assembly of Figs.1 and 2.
• FIG.1 A particular embodiment CONV of the set of bus bars according to the invention is shown in Figs.1 and 2.
• This set of bus bars is externally in the form of a cylindrical puck or slab.
• the busbar assembly CONV essentially comprises a plurality of busbar sections S1 to S6 and high and low closure plates BPu and BPD.
• the busbar sections S1 to S6 are six in this embodiment. Of course, in the present invention, the number of busbar sections is not limited to six. This number will depend on the application in which the invention is implemented.
• the busbar sections S1 to S6 have a similar architecture and are arranged contiguously in a circle about a central axis C. Each busbar section S1 to S6 here occupies an angular sector of 60 °.
• the busbar sections S1 to S6 are each formed of an outer busbar section and first and second internal busbar sections.
• the bar bus sections are formed in conductive metals such as aluminum or copper.
• the bar bus sections may be manufactured by molding and / or machining and / or cutting a profile bar.
• the outer bus bus section is marked Bi n and the first and second internal bus bus sections are respectively marked E32n and B3n.
• the outer bus bus sections Bu to Bi6 are arranged to form a wall, about the central axis C, which the outer side wall of the circular casing shaped pancake.
• the inner busbar sections B21 to B26 are arranged so as to form a first internal lateral wall, around the central axis C, situated inside the volume delimited by the external lateral wall formed by the external busbar sections. Bu to B16.
• the inner busbar sections B31 to B36 are arranged so as to form a second internal lateral wall, around the central axis C, situated inside the volume delimited by the first internal lateral wall formed by the busbar sections. internal B21 to B26.
• the bar bus sections Bin, B2n and B3n respectively forming the outer side wall and the first and second inner side walls are joined in pairs by longitudinally opposite ends which are located in junction planes P1 to P6 comprising central axis C and perpendicular to the upper and lower closure plates BPu and BPD.
• the bar bus sections of the same side wall are in electrical continuity.
• the outer side wall and the first and second inner side walls thus each form an electric busbar.
• the bus bus sections Bu to Bib comprise a plurality of cooling fins which are formed on an outer lateral face in an arc of a circle thereof.
• the outer side wall thus forms heat sink.
• the busbar section Sn comprising the bar bus sections Bi n , B2n and B3n and internal volumes E1, E2 and E3 provided between these sections are now described in detail with reference to Fig.3.
• the bar bus section Bin comprises in particular two inclined junction faces F1, substantially planar, and an inner face F3 substantially planar.
• the cooling fins marked 10 in Fig.3, extend radially outwardly from the external side face in a circular arc F2.
• the two junction faces F1 form longitudinally opposite ends of the section and are inclined at an angle with respect to a central axis of symmetry AC.
• the angle a is here 30 °.
• the substantially planar junction faces F1 of the bus section Sn are thus in contact at the corresponding junction planes (see P1 to P6 in FIG. corresponding junction faces F1 of the adjacent busbar sections S (n + 1) and S (n-1).
• the term "planes" used here to describe the F1 junction faces should not be interpreted strictly. Indeed, as will be described in more detail later, these junction faces F1 typically include arrangements such as grooves for the housing of seals. Removable mechanical connection means may also be arranged at these junction faces F1.
• the substantially plane inner face F3 is a clamping contact face with an electronic power circuit (not shown). As indicated above for the junction face F1, the term "plane" used here for qualifying the internal face F3 must not be interpreted strictly, knowing that different arrangements may be provided depending on the applications.
• the bar bus section B2n comprises in particular two junction faces F4 forming longitudinally opposite ends of the section and first and second faces F5 and F6.
• the two junction faces F4 are inclined at the angle with respect to the central axis of symmetry AC.
• the junction faces F4 correspond to junction planes (see P1 to P6 in Fig. 2) with adjacent busbar sections.
• the first face F5 is a clamping contact face with the aforementioned power electronic circuit.
• channels 1 1 are arranged in this first face F5 and are intended typically for the circulation, or filling, of a liquid having a function of heat transfer and / or fireproofing and / or electrical insulation.
• liquid channels may also, or exclusively, be formed in the inner face F3 of the busbar segment Bin. It should be noted that the flameproofing and electrical insulation functions make it possible to avoid electrical breakdowns and fire starts, as well as any subsequent deterioration of the housing.
• the faces F3 and F5 are adapted for a type of press-pack assembly of the above-mentioned power electronic circuit between the bar bus sections Bin and B2n.
• An internal volume E1 is arranged between the faces F3 and F5 and is intended to receive the electronic power circuit.
• the busbar sections Bin and B2n are intended to be carried to negative (-) and positive (+) polarity of a DC voltage between the bus bars, the negative polarity (-) corresponding to the polarity massive.
• the power electronic circuit will typically be a power module corresponding to a branch of the switching bridge.
• the embodiment described here of the busbar assembly, with six busbar sections, will be suitable for a switching bridge having six branches, for example, to power a hexaphase electric motor.
• the second face F6 of the bus bar B2n portion is a substantially planar face oriented facing a first substantially planar face F7 of the bar bus section B3n.
• the second face F6 and the first face F7 are here substantially parallel and define a second internal volume E2.
• the bar bus section B3n comprises in particular two junction faces F8 forming longitudinally opposite ends of the section and a second face F9.
• junction faces F8 are inclined at the angle ⁇ with respect to the central axis of symmetry AC.
• the junction faces F8 correspond to junction planes (see P1 to P6 in Fig. 2) with the adjacent busbar sections. Grooves 12 are provided in the junction faces F8 for accommodating indexing and / or clamping means (not shown).
• the second face F9 is substantially flat and parallel to the first face F7 and defines a central internal volume E3 in the set of bus bars CONV.
• the internal volumes E2 and E3 of the busbar sections S1 to S6 can perform different functions, for example, the housing of the means of energy storage and / or circulation, or filling, of a liquid having a function of heat transfer and / or fireproofing and / or electrical insulation. It should be noted that the flameproofing and electrical insulation functions make it possible to avoid electrical breakdowns and fire starts, as well as any subsequent deterioration of the housing.
• the volumes E2 may be dedicated to the housing of the capacitive filtering means and the volumes E3 may be dedicated to the circulation, or filling, of the coolant and / or flame retardant and / or electrical insulation.
• Capacitive filtering means can be connected here between bus bars formed by the plurality of sections B2n and the plurality of sections B3n.
• the bus bar formed by the plurality of sections B3n may, in such an example, be electrically connected to the plurality of Bin sections for an electrical connection "press-pack" capacitive filtering means between the faces F6 and F7.
• the capacitive filtering means may for example be formed by a plurality of multilayer ceramic capacitors distributed in the plurality of volumes E2.
• the volumes E2 may for example be dedicated to the circulation, or filling, of the coolant and / or fireproof and / or electrical insulation and the volumes E3 to electrical energy storage means for example under the form of a capacitor, a supercapacitor, a lithium-ion type battery or other.
• the assembly "press-pack" of the electronic components between the bar bus sections will use known mounting techniques such as elastic fasteners ensuring the required clamping or screws mounted through insulated screw passages for avoid short circuits.
• the rounded slab form of the bus assembly CONV makes it perfectly suitable for integration into a rotating electrical machine, for example a traction motor or a reversible machine associated with a braking system. recuperative.
• the high and low closure plates BPu and BPD have a first function which is to close, at the top and bottom, the set of bus bars CONV, way to constitute the case.
• the high and low closure plates BPu and BPD are in contact against the high and low sides of the busbar sections, respectively.
• the high and low closure plates BPu and BPD are laminated plates which each comprise a central dielectric layer CC and two electrically conductive plates BP1 and BP2.
• Layer central dielectric DC is sandwiched between the two electrically conductive plates BP1 and BP2.
• IMS technology Insulated Metal Substrate
• BPu and BPD plates can be used for the manufacture of BPu and BPD plates.
• the electrically conductive plates BP1 and BP2 are typically aluminum or copper.
• the thickness of the plates BP1, BP2, will be chosen according to the current density that it will have to support.
• the conductive plates BP1 and BP2 form first and second DC buses intended to be brought to negative (-) and positive (+) polarities. In the following paragraphs, it is considered that the conductive plate BP1 is that which is located outside the box formed and that the conductive plate BP2 is that which is located inside the box formed.
• a Faraday cage is obtained by carrying the external bus bus sections Bi n and the conductive plate BP1 to the same electrical potential, typically the ground potential of negative polarity (-).
• the casing formed with the set of bus bars according to the invention therefore makes it possible to obtain electromagnetic shielding favorable to electromagnetic compatibility (EMC).
• the central dielectric layer CC is typically formed of a fiberglass-reinforced epoxy type resin, such as, for example, FR-4. Resin reinforced with organic fibers may also be used, as well as unreinforced polyimide. In some applications, active or passive electronic circuits or components, for example, control circuits, may be buried in the central dielectric layer CC using known techniques.
• FIG.5A An example of a sealed assembly between the outer bus bus sections Bi n and the high BPu closure plate, or low BPD, is shown in Fig.5A.
• Fig.5A. shows this assembly at a junction face F1 of the external bus bus sections Bi n .
• the conductive plate BP1 of the BPu closure plate, BPD is in electrical conduction with the outer bus bus section Bi n .
• the mechanical connection between the external bus bus section Bin and the conductive plate BP1 is provided for example by means of a screw (not shown) in the axis FX1.
• seals 20 and 21 are provided to ensure the seal between two adjacent external bar bus sections Bin, at their junction faces F1, and between the outer busbar sections Bin and the closure plate BPu, BPD.
• the seal 20 is housed in a groove which extends over the entire height of the junction face F1 and seals at the level thereof.
• the seal 21 is disposed in a shoulder formed in the closure plate BPu, BPD, more precisely between this shoulder and a groove formed in the face F3 of the external bus bus section Bi n.
• the seal 21 here also provides a spacing between the conductive plate BP1 and the external bus bus section Bi n for the electrical insulation therebetween.
• dismountable strapping means (see arrow CE in Fig.5A), placed between the fins 10, may be used for the mechanical assembly of the busbar assembly CONV.
• FIG. 5B A first example of an assembly between an internal busbar section B2n, or B3n, and the BPu closure plate, or BPD, is shown in FIG. 5B.
• the assembly example of FIG. 5B corresponds to the case where the conductive plate BP2 and the internal busbar section B2n, B3n, must be placed at the same electrical potential.
• the end of the internal busbar section B2n, B3n here comprises an indexing stud 12 which is housed in an anchoring groove formed in the conductive plate BP2.
• a channel 13 for the passage, or filling, of the coolant and / or fireproof and / or electrical insulation is visible here in the section of the internal busbar B2n, B3n.
• the mechanical connection between the internal bar bus section B2n, B3n, and the closure plate BPu, BPD is provided for example by means of a screw (not shown) in the FX2 axis, through an isolated screw passage.
• FIG. 5C A second example of an assembly between an inner busbar section B2n, or B3n, and the BPu closure plate, or BPD, is shown in FIG. 5C.
• the assembly example of FIG. 5C corresponds to the case where the conductive plate BP1 and the internal busbar section B2n, B3n, must be placed at the same electrical potential.
• the end of the internal bus bus section B2n, B3n is housed in a groove 15 which is arranged in the plate BPu, BPD, and which allows the mechanical indexing and the electrical contact with the conductive plate BP1.
• the material of the conductive plate BP2 and the dielectric layer CC are removed in the groove 15 and the end of the inner busbar section B2n, B3n, is in electrical contact only with the conductive plate BP1.
• An electrical insulator 14 is provided in the groove 15 for insulation with the conductive plate BP1.
• a channel 16 for the passage, or filling, of the coolant and / or flame retardant and / or electrical insulation is visible in the internal bus bar section B2n, B3n.
• the mechanical connection between the inner busbar section B2n, B3n, and the closing plate BPu, BPD, is provided for example by means of a screw (not shown) in the axis FX3.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Power Engineering (AREA)
• Thermal Sciences (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)
• Multi-Conductor Connections (AREA)
• Inverter Devices (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=62167543

Family Applications (1)

Country Status (6)

Families Citing this family (1)

Family Cites Families (19)

• 2018
  • 2018-02-27 FR FR1851689A patent/FR3078448B1/fr active Active
• 2019
  • 2019-02-22 EP EP19713530.4A patent/EP3759736A1/de not_active Withdrawn
  • 2019-02-22 CN CN201980015661.2A patent/CN111819688A/zh active Pending
  • 2019-02-22 US US16/975,079 patent/US11081970B2/en active Active
  • 2019-02-22 JP JP2020545172A patent/JP2021515399A/ja active Pending
  • 2019-02-22 WO PCT/FR2019/050412 patent/WO2019166721A1/fr unknown

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