EP3725137A2 - Composant led et son procédé de fabrication - Google Patents

Composant led et son procédé de fabrication

Info

Publication number
EP3725137A2
EP3725137A2 EP18829788.1A EP18829788A EP3725137A2 EP 3725137 A2 EP3725137 A2 EP 3725137A2 EP 18829788 A EP18829788 A EP 18829788A EP 3725137 A2 EP3725137 A2 EP 3725137A2
Authority
EP
European Patent Office
Prior art keywords
led
carrier
circuit board
conductor tracks
tracks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP18829788.1A
Other languages
German (de)
English (en)
Inventor
Kilian Wimmer
Bernhard Wuppinger
Markus Lechner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siteco GmbH
Original Assignee
Siteco GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siteco GmbH filed Critical Siteco GmbH
Publication of EP3725137A2 publication Critical patent/EP3725137A2/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0262—Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to an LED component, which has a plurality of light-emitting diodes (LED), which are placed on a printed circuit board and are electrically connected to contact surfaces on the circuit board.
  • LED components are used in particular as components of LED modules that are used in lights, especially lights for outdoor and êtbe lighting.
  • Circuit boards are commonly used to assemble electronic components, particularly LEDs, into an electrical circuit. Different electrical circuits be necessary different track guides, the so-called layout.
  • Printed circuit boards are mainly produced by a photolithographic process in which the conductor tracks are etched out of a conductive layer which is applied to a substrate. With this method, larger series of printed circuit boards can be produced inexpensively.
  • a disadvantage of this method is that the layout is fixed and the photo lithographic process has to be re-set when the layout changes. This technique is therefore not optimal for small series or for applications where flexibility of layout is required.
  • German patent application 10 2016 124 559.3 has been proposed for producing an LED module conductor surfaces, which are to form the contacts for the light-emitting diodes, with a self-adhesive layer and on a support member by a placement machines for surface-mounted components ( Surface Mounted Devices (SMD)).
  • SMD Surface Mounted Devices
  • this idea raises the problem that SMD placement machines can only have components of a certain length hand and the attachment of electrical operating components, such as ballasts, sensors, controllers and the same, manufacturing technology is complex.
  • an LED component with a printed circuit board whose layout on the one hand have longer traces and on the other hand using a SMD placement machines, as proposed in German Patent Application 10 2016 124 559.3, realized and can be produced inexpensively, and a to provide appropriate manufacturing process
  • an LED component which has a plurality of LED, which are mounted on a circuit board and interconnected, wherein the circuit board has a first carrier and applied to the carrier conductive contact surfaces for electrical connection to the terminals of the LED, said the printed circuit board has at least two terbahnen and are in the area between two Lei terbahnen contact surfaces, so that these devisflä surfaces can be set by individual electrical connection to one of the two tracks to different potentials.
  • the interconnects are not provided by an etching process ago.
  • the conductor tracks can be connected to the carrier by gluing, melting or vapor deposition.
  • circuit board is to be understood in this context. In particular, it is not limited to the usual standard circuit boards; in variousariesfor men, the circuit boards used in the invention are different from egg ner standard printed circuit board.
  • a printed circuit board also need not necessarily be a separa tes component, but may also be integrally formed as part of a larger component.
  • a housing portion of a lamp can be used on which, directly or with the interposition of a plastic film, said contact surfaces for connec to the terminals of the LED and the printed conductors are introduced.
  • the circuit board forms a integral part of the lamp housing and is integrally formed therewith.
  • the said printed conductors can be connected directly or indirectly, ie via an intermediate element, such as an insulating film, to the carrier of the printed circuit board.
  • an intermediate element such as an insulating film
  • the conductor tracks can be glued directly to the carrier, be attached by melting or vapor-deposited.
  • they can also be applied to an intermediate element, for example an insulating film, such as a polyimide film, which in turn is glued to the carrier or fused thereto.
  • the interconnects can be realized in particular by connecting band-shaped conductive elements, such as copper bands, flat wires or conductive films, to be connected to the carrier intermediate element or with the carrier of the circuit board or by conductive structures individually by a coating method, in particular a Beschich tion method in which the material to be applied is solid or gaseous in the initial state, have been applied to the carrier or an associated with the carrier or to be joined intermediate element.
  • the interconnects can be applied in particular special by gluing or melting, in particular by hot stamping on the carrier or an intermediate element, such as an insulating film, which is or is connected to the carrier.
  • coating methods are suitable in which, starting from a gaseous or solid coating material, the coating material accordingly the geometry of the tracks on a substrate, such as the carrier or an insulating film, is applied.
  • the invention may provide that the conductor tracks extend from one edge of the printed circuit board to another edge, in particular the opposite edge of the printed circuit board.
  • the tracks do not necessarily have to be straight, but may, for example, also be angled or curved his. In this case, for example, they may extend between two edges that are not opposite each other.
  • the invention may provide that the interconnects between tween two opposite edges of the PCB te over at least 80% of the dimensions defined by these edges, in particular over more than 90% and preferably over more than 95% extend.
  • this dimension can be the distance between these edges.
  • this dimension may also be the length of a side of the plate extending between the edges or, more generally, the length of the distance between two corresponding end points of the two edges.
  • defined by the edges dimension may be, for example, if the two opposing Rän forming the narrow side of the circuit board, the length of the circuit board or, if the opposite edges define the longitudinal sides of the circuit board, the width of the circuit board.
  • the conductor tracks may extend between the two narrow sides of the circuit board. If the conductor tracks run straight and parallel to the longitudinal sides of the Lei terplatte, their length may be at least 80% of the length of the circuit board, in particular more than 90% and preferably more than 95% of the length of the circuit board.
  • the invention may provide that the conductor tracks have a length of 5 cm to 6 m, preferably 20 cm to 6 m, in particular 20 cm to 2 m or 160 cm to 200 cm.
  • the invention can provide that the interconnects extend over a length of at least four mounting locations for LEDs.
  • the invention can provide that the conductor tracks are applied directly to the first carrier.
  • the invention can provide that the conductor tracks are applied to an insulating film which is glued to the first carrier.
  • the invention can provide that the conductor tracks consist of conductive strips, in particular copper strips, flat wires or conductive foils, which are glued to the first carrier or egg ner connected to the carrier, in particular bonded iso- lierenden foil.
  • the insulating film may be a plastic film, in particular a polyimide film, which is supplied as a tape-shaped material which is longitudinally, i. along the belt, electrical interconnects made of copper or of other conductive materials.
  • a printed circuit board is realized with a base layout having two or more tracks, said base layout thereafter by attaching contact surfaces and conductive connections between justifyflä- surfaces and / or between contact surfaces and tracks before kart by means of a mounting device for surface-mounted devices (SMD), is supplemented.
  • SMD surface-mounted devices
  • the first carrier is preferably rigid. It can also have rigid and flexible regions, wherein a rigid region has said light-emitting diodes, contact surfaces and printed conductors.
  • the invention may provide that the first carrier consists of metal, in particular steel or aluminum, wood, glass or plastic.
  • the first carrier of a conductive material
  • insulation between the contact surfaces and the conductor tracks on the one hand and the carrier is usually provided on the other hand, which is preferably realized by an associated with the first carrier insulating film, in particular a polyimide film, with the connected first carrier and preference, is glued, wherein the film over the entire surface, but if necessary, can also be applied only in the areas required for the insulation on the carrier.
  • the insulation can also be realized by an insulating coating on the corresponding surface areas of the first carrier.
  • the carrier may in one embodiment be a steel sheet or steel strip, optionally with a coated surface which is cut to the required length.
  • this cut sheet steel or strip can then be provided with an insulating plastic film on which applied according to certain embodiments, the conductor tracks who or already exist.
  • the invention may provide that the contact surfaces are mounted by ei ne SMD technology on the circuit board.
  • the contact surfaces are preferably flat conductive compo elements with a flat geometry, such as metal plates, which are applied with the SMD technology by a placement machine on the support or an intermediate element.
  • These components may, for example, have a self-adhesive layer or be provided with such a layer and then be connected via this layer to the first carrier or an intermediate element, such as an insulating film.
  • the invention can provide that one or more conductive connections between a contact surface and a conductor track, preferably all conductive connections between a contact surface and a conductor track, are formed by SMD components, in particular by means of SMD components designed as jumpers.
  • a lei tend connection between pads in the form of SMD components may be provided, which are not LED, eg for bridging an unoccupied LED space between two contact surfaces.
  • the jumpers also referred to as short-circuit bridges in this case, create a short circuit between two conductive areas, in the present case between a contact area and a conductor track. They are preferably designed as SMD elements and can be mounted with an assembly machine for SMD elements between two conductive areas of a layout on a circuit board.
  • the invention may provide that a plurality of LEDs are connected in series GE and the first and last LED of the series circuit are electrically connected to different tracks.
  • the invention can also provide that the printed circuit board has more than two printed conductors and a plurality of strings connected in series. has switched LED and at least two of these chains are connected between different pairs of interconnects.
  • the two said different pairs of tracks may be completely different from each other or have a conductor track in common.
  • a conductor can be grounded and the other printed circuit boards set to different potentials so that each of said pairs holds the grounded trace and a second trace ent, with different pairs of this second trace being different.
  • different chains of series-connected LED are placed on different masses. In this case, said pairs do not share a trace.
  • the invention can provide that the said printed conductors and the said LEDs are arranged on a first side of the printed circuit board and, outside this first side, there are two or more electrically conductive printed conductors which are electrically connected to the printed conductors on the first side , Outside the first side befind union tracks have a connection means for electrically connecting to an electrical device, in particular a different from a LED electrical device.
  • the electrical connection device is preferably located at the edge of the first side and may extend beyond the edge of the first side or around this edge in order to make the connection with the said electrical device.
  • This embodiment of the invention allows a connection of the circuit with the LED with electrical devices that are not on the circuit board or at least not on the circuit board first page (front) without having to provide extra wiring.
  • the electrical device to which the tracks may be connected may be a functional element such as a sensor or controller, an operating device such as an electronic ballast, but also another LED module or other lamp.
  • the tracks located outside the first side Kgs can be separated mechanically and / or electrically from the conductor tracks located on the first side. However, they preferably represent a continuation of the printed conductors on the first side and / or they are located on the same component, e.g. on the same insulating foil.
  • the invention can also provide that the said strip conductors and the said LED are arranged on a first side of the printed circuit board and in the region of the back side of the printed circuit board opposite this first side there are two or more electrically conductive strip conductors which are connected to the strip conductors on the first side are electrically connected, wherein with the conductor tracks in the back of a different electrical device is connected electrically from an LED, which preferably has no optical function, in particular a control gear for a lamp.
  • the conductor tracks on the first side and the conductor tracks in the region of the rear side can be connected in particular by an electrical connec tion device, which extends beyond an edge of the first carrier, in particular around this, extends. In this way, the passage of lines through the first carrier or through the circuit board can be avoided and eliminates the need to attach corre sponding holes.
  • the invention may provide that the electrical device is an electrical ballast, a sensor or a control ler.
  • the invention may provide that the conductor tracks in the region of the rear side or one or more elements which carry these conductor tracks, for.
  • As an insulating film are mechanically connected over its entire length or over part of its length with the first carrier on the back.
  • connection with the carrier on its backside directly i.e., the tracks are applied directly to the carrier
  • connection with the carrier on its backside directly i.e., the tracks are applied directly to the carrier
  • an insulating film i.e., the tracks are applied to the film
  • the carrier on its back side Via an insulating film (i.e., the tracks are applied to the film), which in turn is connected to the carrier on its back side.
  • the conductor tracks on the rear side are completely mechanically connected to the first carrier, they are fixed relative to the latter in a stationary manner and are preferably located on this carrier, possibly via an interposed element, such as a foil. In a connection over a part of its length, however, can be seen before that they can protrude over a portion of the first carrier or moved away from it.
  • the interconnects in the back are not mechanically connected to the back of the first carrier, but only via ei ne suitable connection, such as a film hinge, with the front of the first carrier, ie said ers th page , are connected.
  • trace in the area of the backside is therefore not meant that this trace must be on a surface of the first carrier or be connected to it, but rather may extend only in the area of the space which adjoins the back of the connects to the first carrier and adjacent to this, and be spaced from the back of the first carrier over its entire length or egg nen part of its length.
  • the invention can provide that the conductor tracks are mounted in the region of the rear side of the printed circuit board on a second carrier, which is different from the first carrier.
  • the second carrier may be flexible or rigid or have flexible and rigid portions.
  • the second carrier may in particular also consist of a flexible film on which the conductor tracks are applied. This allows, in a luminaire or luminaire module, the LED component to be separated from said electrical device, e.g. an electronic ballast to install and at the same time to ensure the electrical connection of the tracks on the first side of the Trä gers with the electrical device via the traces in the back of the carrier.
  • the invention may provide that the second carrier is connected via a flexible mechanical connection with the first carrier.
  • the invention may provide that the electrical device is mounted in the region of the back of the circuit board to the second Trä ger.
  • the second carrier may in particular be the insulating film, via which the conductor tracks on the first side of the printed circuit board are connected to the first carrier, in particular a film on which the conductor tracks have already been introduced in advance, or a film to which printed conductors are glued or otherwise applied.
  • the film itself can produce a flexible connection with the electrical device. It can, however Also be provided that this film in the back of the circuit board on another support, such as a rigid plate, attached, in particular glued, to which the electrical device attached or to which it can be electrically connected.
  • the other carrier may again be made of metal, especially steel or aluminum, wood, glass or plastic.
  • the invention may provide that the conductor tracks are applied to an insulating film which is glued to the first carrier on the first side, wherein the insulating film extends around an edge of the printed circuit board in the region of the back side of the printed circuit board.
  • the printed conductors on the film may also extend around the edge of the printed circuit board into the region of the rear side of the printed circuit board.
  • the invention can provide that the insulating film is glued to the first carrier on the back completely or partially.
  • the invention may also provide that the insulating film is completely or partially adhesively bonded to a further, preferably rigid carrier in the region of the rear side of the first carrier, on the side of the further carrier which is remote from the first carrier.
  • the invention may provide that one or more tracks on the first side of the circuit board in one piece with Lei terbahnen in the region of the back of the circuit board are asbil det so that they extend continuously from the first side in the region of the back of the circuit board.
  • the invention may provide that one or more Porterbah NEN on the first side of the circuit board is not on the Extend edges of the first circuit board out, so are limited to the first side of the circuit boards and each element with a conductor on the back by a dacasele, which is provided on an edge of the circuit board and engages over the edge of the circuit board, are electrically connected.
  • the connecting element may be, for example, a wire or a conductor strip, which is in each case soldered to the conductor track on the front side and the conductor track on the back or otherwise conductively connected.
  • the connecting element could for example also be a terminal or a plug which cooperates terplatte with plug-in elements on the front and back of the Lei, which in turn are each conductively connected to one of the two conductor tracks.
  • a single connector can also electrically connect several tracks on the front side with the corresponding tracks on the back.
  • the invention may provide that the first carrier has one or more flexible portions and one or more rigid portions, said conductor tracks and the said LED are arranged in a first rigid portion of the first carrier and outside of this first rigid portion, preferably in a second rigid region, two or more electrically conductive tracks are electrically connected to the tracks in the first rigid area, wherein these further, located outside the first rigid area traces a connecting means for electrically connecting to an electrical device, in particular one of a LED various electrical device, have.
  • the traces extend from the first rigid region into a second rigid region where the junction device is provided.
  • the invention may provide that the first carrier has one or more flexible portions and one or more rigid portions, the said conductors and the LED being arranged in a first rigid region of the first carrier and two or more electrically in a second rigid region conductive interconnects are present, which are electrically connected to the interconnects in the first rigid region, wherein an electrical device different from an LED is electrically connected to the interconnects in the second rigid region, which preferably has no optical function, in particular an operating device for a lamp.
  • the first carrier may be bent over in a flexible region, so that the second rigid region is located in the region of the rear side of the first rigid region.
  • the printed conductors can extend continuously from the first rigid region into the second rigid region.
  • the first carrier can also be a rigid-flex plate.
  • Rigid-flex panels consist of a combi nation of flexible and rigid circuit boards, which usually include the rigid areas, the components of a circuit, while the flexible parts make the electrical connection between the rigid parts.
  • Such plates may consist of several layers, one or more of which consists of a rigid material and one or more of a flexible material. By removing or eliminating a rigid layer in a certain area, nen flexible areas are generated in which the plate ver formed, in particular can be bent.
  • the invention may provide that one or more conductor tracks on the first side of the printed circuit board do not extend beyond the edges of the first rigid region, ie are confined to the first rigid region of the printed circuit board, and each with a conductor track in the second rigid Be Rich by a connecting element, which is provided at an edge of the first th rigid area and is connected in the first rigid area with a conductor, electrically verbun is the.
  • the connecting element may, for example, be a wire or a conductor strip which is soldered or otherwise conductively connected to the conductor track in the respective rigid areas, but also a terminal or a plug, as described above.
  • the invention can provide that the LED and the contact surfaces are exposed and / or the LED component has no further layer connected to the first carrier, the foil and / or the LED, through which light of the LED emerges during operation.
  • the invention may provide that parts of the contact surfaces and / or the conductor tracks are covered with a solder resist.
  • the invention also provides an arrangement of a plurality of LED components as described above, in which at least two tracks of a first LED component are electrically connected via an electrical connection device in each case with a ent-speaking trace of a second LED component.
  • each of the two said printed conductors of the first component is at the same electrical potential as the corresponding printed conductor of the second LED component. If appropriate or necessary, can be realized in this way by selecting an electrical connection element with a suitable resistancessen a certain voltage drop between a conductor of the first LED component and a corresponding conductor of the second LED component.
  • the said two Porterbah NEN of the first LED component are connected to the corresponding conductor tracks of the second LED component via a film having two electrically conductive tracks, wel che respectively a trace of the first LED component and the For this purpose, contact the corresponding conductor track of the second LED component.
  • the film can be fixed by gluing to the first and second LED component, so that the contact between the corresponding conductor tracks is ensured.
  • the first component is an LED component with tracks outside the first page, the tracks are ver with an electronic ballast connected, the second LED component powered via the first LED component with the voltage of the electronic ballast becomes.
  • the second LED component powered via the first LED component with the voltage of the electronic ballast becomes.
  • an arrangement of LED modules or LED luminaires which have an LED component according to the invention, in which only one module or one luminaire has an electronic ballast and the other modules or luminaires be powered by this first module or this first light with voltage.
  • an arrangement can be realized in this way, in which an LED module or an LED light has a signaling electrical device, such as a controller or a sensor, and the signals of this device to the other LED modules or LED lights over the respective, interconnected interconnects of the corresponding LED components are supplied.
  • the invention also provides a method of manufacturing an LED device comprising a plurality of light emitting diodes (LED) mounted and interconnected on a printed circuit board, comprising:
  • two contact surfaces connected to an LED are electrically connected to different conductor tracks.
  • the application of the conductor tracks to the first th carrier can be done in the manner described above.
  • the invention can provide that the conductor tracks and the contact surfaces are applied directly to the first carrier.
  • the invention can provide that the interconnects are or are mounted on an intermediate element, which is connected to the carrier at least on a first side of the carrier, preferably glued, which corresponds to the side of the circuit board on which said LED are mounted and which of Front side of the component corresponds.
  • the application of the conductor tracks on the first carrier or the intermediate element can in the manner described above, in particular by gluing, vapor deposition, melting, in particular hot stamping and the like, take place.
  • the geometry of the conductor tracks and their arrangement on the circuit board can correspond to the above be for the LED component be described geometries.
  • the applied conductor tracks can extend over the entire length or width of the printed circuit board or only over a partial area of at least 80% thereof.
  • the length of the conductor tracks can be in particular 5 cm to 6 m, preferably 20 cm to 2 m, in particular 120 cm to 200 cm. It can also be in a range of 150 cm to 200 cm.
  • the conductor tracks can in particular be applied to an insulating film which is adhesively bonded to the first carrier.
  • the invention may provide that a provided with one or more tracks foil is bonded to the carrier at least on the first side and then contact elements between tween the tracks are applied to the film.
  • the invention may provide that conductive tapes, insbesonde copper tapes, flat wires or conductive films are bonded to the insulating film, wherein the insulating Fo lie to the first carrier before or after gluing these conductive tapes can be glued.
  • the invention may provide that the contact surfaces are applied by a mounting device for surface mounted devices (Surface Mounted Devices).
  • the invention may provide that one or more conductive connections between a contact surface and a conductor, preferably all conductive connections between a contact surface and a conductor track, ge by SMD components are formed, in particular by trained as an SMD element jumpers.
  • the method may further provide ⁇ . electrically connecting contact surfaces with light emitting diodes such that a series connection of the light emitting diodes is gebil det, which are each connected between two adjacent contact surfaces, and electrically connecting the first and last contact surfaces of the series connection of LEDs with different conductor tracks.
  • the procedure may provide:
  • the method may provide: electrically connecting a plurality of LEDs via their associated pads such that multiple strings of series connected LEDs are formed, and
  • the invention may provide that said LEDs are arranged on a first side of the circuit board and the method comprises:
  • the tracks located outside the first side can be mechanically and / or electrically separated from the tracks located on the first side. Preferably, however, they represent a continuation of the conductor tracks located on the first side and / or they are located on the same component, for example on the same insulating film.
  • the invention may provide that said tracks and said LEDs are disposed on a first side of the circuit board and the method comprises:
  • the method may also provide:
  • the method may also provide: Providing printed circuit traces in the region of the rear side of the printed circuit board which are mechanically or partially connected to the carrier of the printed circuit board and which are electrically connected to printed conductors on the first side of the printed circuit board, and electrical connection of an electrical device other than an LED to printed conductors in the region of Back of the circuit board.
  • the invention may provide that the second carrier is or will be connected to the first carrier via a flexible mechanical connection.
  • the invention may provide that the said conductor tracks are or are applied to an insulating film on the first side of the printed circuit board, the method comprising:
  • the invention can provide that the insulating film after folding with the first carrier on the back completely or partially glued.
  • the invention may provide that after being folded over, the insulating film is completely or partially bonded to a second carrier located in the region of the rear side of the first carrier on that side of the second carrier which is remote from the first carrier.
  • the conductor tracks on the first side and the conductor tracks on the rear side may be integrally formed with each other so that they extend continuously from the first side in the region of the rear side of the printed circuit board.
  • se parate conductor tracks are provided which are then electrically connected by a connecting element which is provided at the edge of the circuit board and engages over the edge of the circuit board.
  • the invention may provide that the electrical device is fastened to the second carrier in the region of the rear side of the printed circuit board.
  • SMD surface mounted device
  • the tracks of the LED module are led directly to the ballast, bringing at least two terminals (plus and minus) on the LED component and thus account for a lamp that has this component. Likewise, eliminates the corresponding lines, so that the number of components of the LED component and thus a corresponding lamp is reduced in total.
  • Fig. 1 shows a plan view of an embodiment of an LED component according to the invention with a single LED chain.
  • Fig. 2 shows a perspective view of an LED component according to the embodiment of Fig. 1, wherein a part of the component is bent over.
  • Fig. 3 shows a plan view of an inventive LED component with multiple LED chains.
  • Fig. 4 shows an associated circuit diagram
  • Fig. 5 shows a schematic side view of an inventions to the invention LED component according to a second embodiment form, in which two LED components are connected in the form of a master-slave circuit.
  • the component comprises two rigid supports 1 and 3 in the form of a plate made of aluminum, Steel or other conductive material and has a rectangular shape in this embodiment.
  • a continuous polyimide film 5 is adhered to the carrier so that the two carriers 1 and 3 are mechanically connected by this polyimide film, a gap 7 remaining between the carriers 1 and 3 which is bridged by the polyimide film 5. In this way, a flexible mechanical connection between the carriers 1 and 3 is generated.
  • the carrier 3 can, as shown in FIG. 2 can be bent, so that it is located in the back of the carrier 1.
  • Components that were placed with a placement machine on the metal plate 11a - lld so that they each bridge the gap between two adjacent metal plates 11a - lld and their connections are each electrically connected to one of the two metal plates.
  • the inner metal plates 11 b and 11 c are each connected to a terminal of two adjacent LED, so that a series circuit is generated.
  • the metal plate 11a is connected via a conductive SMD component 15a, z.
  • a jumper connected to the conductor 9a and the metal plate Lld is electrically connected via a conductive component 15b, for example a jumper, with the other conductor 9b.
  • the series connection of the LED 13a-13c is connected between the conductor tracks 9a and 9b. Accordingly, the series-connected LED 13a - 13c can be operated by applying a voltage between the two tracks 9a and 9b.
  • SMD resistors which generate a voltage drop between the conductive strips 9a, 9b and the corresponding metal plates 11a or 11d, preferably SMD resistors with a low resistance, if this is the case is appropriate or required due to the specification of the LED component.
  • Such a resistor can be useful, for example, if LED chains of different lengths are connected in parallel between the same strip conductors.
  • a diode in particular a diode designed as an SMD component, which generates a corresponding voltage drop, which can be provided in particular for bringing the forward voltage of differently long LED chains connected in parallel to one level
  • a conductive SMD component 15a, 15b by an SMD diode and the other conductive SMD component can be replaced by an SMD resistor or a conductive SMD device 15a, 15b can also be replaced by a combination of an SMD resistor and an SMD diode.
  • FIG. 3 shows an embodiment in which, in contrast to the embodiment shown in Fig. 1, the metal plate 11a - lld, which form the contact surfaces for the LED 13a - 13c and the conductive components 15 a and 15 b, a different Have width.
  • the contact surfaces 11a and 11d connected to only a single LED are narrower than the intermediate metal plates 11b and 11c.
  • the above-spoken to parallel connection of multiple LED chains is realized.
  • two further chains of series-connected LEDs 20a, 20b, 20c and 22a, 22b and 22c are connected in parallel between the two tracks 9a and 9b.
  • four successive spaced-apart metal plates 24a to 24d or 26a to 26d are respectively provided on the polyimide film 5.
  • the LEDs 20a-20c and 22a-22c are each mounted between two successive metal plates, so that a series connection of the LED 20a-20c and 22a-22c is realized.
  • FIG. 5 shows a schematic representation of an embodiment of an LED component 40 according to the invention, on the rear side of which an electronic ballast (electronic ballast) 42 is mounted, this LED component 40 being connected to a further LED component 44 in the manner of a master ballast. Slave circuit is connected.
  • the LED component 40 is constructed in the same way as the LED component shown in FIG. 1 or FIG. 3, ie it has two carriers which are connected via a polyimide film 50 which is glued onto the two carriers. On the polyimide film 50 are printed conductors 51 which extend from the first carrier to the second carrier and thereby electrically connect the two regions of the LED device corresponding to the two carriers in addition to the mechanical connection through the foil 50.
  • the two carriers are not shown separately, son countries only as a single carrier device 52 shown.
  • the drawing of FIG. 5 shows that the polyimide film extends around the left end of this support device 52 in the drawing on its rear side.
  • LED 54 is provided, which are connected in a suitable manner, for example, as shown in Fig. 3, with each other.
  • the conductor 51 On the lower or rear side, at the end of the film 50, the conductor 51 has a free end 56, which is connected via a plug connector 58 to the electronic ballast 42, which is located in the region of the rear side of the LED component 40.
  • the electronic ballast 42 can give an appropriate voltage on the tracks on the underside of the LED component 40, which extend around the edge of the Trä gervorides around on the top so that the LED 54 on the front of the component 40 accordingly supplied via these tracks with the voltage of the electronic ballast who the.
  • the second LED component 44 is also as described above be composed of a carrier 70 and a glued Po lyimidfolie 72 constructed on the two conductor tracks 73 extend to the left in the drawing edge of the carrier 70.
  • LED 74 are mounted, which are electrically verbun in a suitable manner with these tracks 73.
  • the circuits of the LED components 40 and 44 are basically independent of each other in that all electrical components are connected on the circuit boards between the respective tracks of the two components, via which a suitable voltage can be applied.
  • the two tracks of the LED components 40 and 44 are each Weil by an electrical conductor 80 connected to each other, which bridges the gap between the two LED components 40 and 44 and an electrical connection between the Einan the corresponding traces on the LED components 40 and 44 produces.
  • the conductor 80 can also be realized by an insulating film, on the same distance as in the LED components 40 and 44, two electrical conductors are present, and so over the space between the carriers
  • the film itself can be fixed in a suitable manner, in particular by gluing, so that the electrical connection between the two LED components 40 and 44 is permanently preserved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

L'invention concerne un composant LED comportant une pluralité de LED montées et interconnectées sur une carte de circuit imprimé, la carte de circuit imprimé comprenant un premier support et des surfaces de contact conductrices appliquées sur le support pour la connexion électrique aux bornes des LED, la carte de circuit imprimé comprenant au moins deux pistes conductrices et des surfaces de contact situées dans la région entre deux pistes conductrices afin que celles-ci puissent être appliquées à différents potentiels par connexion électrique individuelle sur une des deux pistes conductrices. L'invention concerne également un procédé de leur fabrication.
EP18829788.1A 2017-12-14 2018-12-14 Composant led et son procédé de fabrication Pending EP3725137A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017130010.4A DE102017130010A1 (de) 2017-12-14 2017-12-14 Led-bauteil und verfahren zur herstellung desselben
PCT/EP2018/085045 WO2019115800A2 (fr) 2017-12-14 2018-12-14 Composant led et son procédé de fabrication

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Publication Number Publication Date
EP3725137A2 true EP3725137A2 (fr) 2020-10-21

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EP18829788.1A Pending EP3725137A2 (fr) 2017-12-14 2018-12-14 Composant led et son procédé de fabrication

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EP (1) EP3725137A2 (fr)
DE (1) DE102017130010A1 (fr)
WO (1) WO2019115800A2 (fr)

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Publication number Priority date Publication date Assignee Title
WO2023220964A1 (fr) * 2022-05-16 2023-11-23 何季岭 Guirlande de lumières à del intelligente

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113666U (ja) * 1983-10-12 1985-08-01 日本電気アイシーマイコンシステム株式会社 混成集積回路装置
JPS60172365U (ja) * 1984-04-20 1985-11-15 ロ−ム株式会社 プリント基板の結線構造
JPS62169395A (ja) * 1986-07-16 1987-07-25 太陽誘電株式会社 電気回路装置の製造方法
US7186015B2 (en) * 2004-04-16 2007-03-06 Polymore Circuit Technologies, Inc. Backlight display system
US8779444B2 (en) * 2006-11-03 2014-07-15 Relume Technologies, Inc. LED light engine with applied foil construction
JP4772882B2 (ja) * 2009-03-06 2011-09-14 日本航空電子工業株式会社 配線基板および発光装置
CN102340932B (zh) * 2010-07-20 2013-12-11 王定锋 用转载胶膜和并置的扁平导线制作单面电路板的方法
CN102340931B (zh) * 2010-07-20 2013-08-28 王定锋 采用并置的导线制作单面电路板的方法
CN202048540U (zh) * 2010-07-23 2011-11-23 王定锋 用三条扁平导线制作的led灯电路板
DE102010049333B4 (de) * 2010-10-22 2012-07-05 Jürgen Hackert Verfahren und Vorrichtung zur Herstellung einer bandförmigen Struktur zur Aufnahme von elektronischen Bauteilen
CN202697035U (zh) * 2012-08-01 2013-01-23 田茂福 具有导电胶线路的柔性led线路板和led灯带
DE102013211457A1 (de) * 2013-06-19 2014-12-24 Osram Gmbh Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe
DE102016124559A1 (de) 2016-12-15 2018-06-21 Siteco Beleuchtungstechnik Gmbh Verfahren zur Herstellung eines LED-Moduls

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WO2019115800A3 (fr) 2019-09-19
WO2019115800A2 (fr) 2019-06-20

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