EP3724286A1 - Multifunktionales flexibles klebeprodukt mit messungs- und drahtloskommunikationsfähigkeiten - Google Patents
Multifunktionales flexibles klebeprodukt mit messungs- und drahtloskommunikationsfähigkeitenInfo
- Publication number
- EP3724286A1 EP3724286A1 EP18887258.4A EP18887258A EP3724286A1 EP 3724286 A1 EP3724286 A1 EP 3724286A1 EP 18887258 A EP18887258 A EP 18887258A EP 3724286 A1 EP3724286 A1 EP 3724286A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- flexible
- adhesive product
- tracking
- segments
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 319
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 319
- 238000004891 communication Methods 0.000 title claims description 50
- 239000010410 layer Substances 0.000 claims description 115
- 239000000758 substrate Substances 0.000 claims description 56
- 230000004044 response Effects 0.000 claims description 18
- 230000008859 change Effects 0.000 claims description 14
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 13
- 229920005570 flexible polymer Polymers 0.000 claims description 12
- 239000004593 Epoxy Substances 0.000 claims description 10
- 239000002390 adhesive tape Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 claims description 6
- 230000007704 transition Effects 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000003306 harvesting Methods 0.000 claims 5
- 230000007613 environmental effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 56
- 238000004519 manufacturing process Methods 0.000 abstract description 26
- 230000004807 localization Effects 0.000 abstract description 24
- 238000003860 storage Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 4
- 238000007726 management method Methods 0.000 abstract description 3
- 238000012384 transportation and delivery Methods 0.000 abstract description 3
- 239000012790 adhesive layer Substances 0.000 description 31
- 230000008569 process Effects 0.000 description 27
- 230000001413 cellular effect Effects 0.000 description 11
- 230000006870 function Effects 0.000 description 11
- 239000004020 conductor Substances 0.000 description 9
- 238000013461 design Methods 0.000 description 8
- 239000000470 constituent Substances 0.000 description 7
- 229920001296 polysiloxane Polymers 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 230000006399 behavior Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- QVFWZNCVPCJQOP-UHFFFAOYSA-N chloralodol Chemical compound CC(O)(C)CC(C)OC(O)C(Cl)(Cl)Cl QVFWZNCVPCJQOP-UHFFFAOYSA-N 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004049 embossing Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920006254 polymer film Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000002085 persistent effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 241001465754 Metazoa Species 0.000 description 1
- 241000699670 Mus sp. Species 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- OJIJEKBXJYRIBZ-UHFFFAOYSA-N cadmium nickel Chemical compound [Ni].[Cd] OJIJEKBXJYRIBZ-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000010267 cellular communication Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000000802 evaporation-induced self-assembly Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
- G01C21/04—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by terrestrial means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
- G01C21/10—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration
- G01C21/12—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning
- G01C21/16—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
- G01C21/26—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 specially adapted for navigation in a road network
- G01C21/28—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 specially adapted for navigation in a road network with correlation of data from several navigational instruments
- G01C21/30—Map- or contour-matching
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
- G06K19/0776—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W4/00—Services specially adapted for wireless communication networks; Facilities therefor
- H04W4/02—Services making use of location information
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2519/00—Labels, badges
- B32B2519/02—RFID tags
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
Definitions
- Tracking devices can track people and objects in real time. These devices typically ascertain information relating to their physical locations based on communications with a variety of different wireless locationing systems (e.g., the Global Positioning System (GPS), cellular network systems (e.g., GSM), and wireless local area networks (e.g., a system of Wi-Fi access points).
- GPS Global Positioning System
- GSM cellular network systems
- Wi-Fi access points wireless local area networks
- Tracking devices that incorporate multiple locationing mechanisms have been proposed to provide localization functionality across heterogeneous environments, ranging from environments equipped with localization equipment (e.g., satellites, cellular towers, and wireless access points), to environments without any localization equipment.
- localization equipment e.g., satellites, cellular towers, and wireless access points
- incorporating a variety of different locationing components into a tracking device poses significant integration difficulties and challenges optimizing weight, size, cost, and battery life for a given application.
- localization techniques used in areas without any infrastructure support are notoriously inaccurate and typically require a person to physically traverse a storage facility until the person is close enough to the target to distinguish the signals (e.g., RFID signals) emitted from multiple co-located tracking devices.
- signals e.g., RFID signals
- This specification describes a low-cost, multi-function tracking system with a form factor that unobtrusively integrates the components needed to implement a combination of different localization techniques and also is able to perform a useful ancillary function that otherwise would have to be performed with the attendant need for additional materials, labor, and expense.
- the tracking system is implemented as an adhesive product that integrates tracking components within a flexible adhesive structure in a way that not only provides a cost-effective platform for interconnecting, optimizing, and protecting the components of the tracking system but also maintains the flexibility needed to function as an adhesive product that can be deployed seamlessly and unobtrusively into various tracking applications and workflows, including person and object tracking applications, and asset management workflows such as manufacturing, storage, shipping, delivery, and other logistics associated with moving products and other physical objects.
- the adhesive product can have a variety of form factors, including a multilayer roll or sheet that includes a plurality of divisible adhesive segments each of which is equipped with tracking functionality.
- each adhesive segment can function, for example, as an adhesive tape, label, sticker, decal, or the like and, at the same time, as an inconspicuous location tracker.
- each adhesive segment can track location information either autonomously or collectively with other activated segments.
- an adhesive segment can be configured to communicate with a variety of different wireless locationing systems and equipment to determine or assist in determining information relating to its geographic or relative location.
- a set of segments can additionally communicate with one another to self-organize and self-configure into, for example, a mesh network and, thereby, create mechanisms or opportunities for acquiring and/or sharing acquired location information in or across areas that are not supported by existing infrastructure equipment.
- Embodiments of the subject matter described in this specification include methods, processes, systems, apparatus, and tangible non-transitory carrier media encoded with one or more program instructions for carrying out one or more methods and processes for enabling tracking and fabrication functionalities of the described systems and apparatus.
- a tracking adhesive product includes a plurality of segments of a flexible laminated structure comprising a flexible cover and a flexible substrate laminated to a pressure sensitive adhesive layer.
- Each segment includes components comprising: a flexible antenna; a wireless communication system coupled to the flexible antenna; a processor coupled to the wireless communications system; an energy source coupled to the processor and the wireless communication system; and at least one non-transitory processor-readable medium comprising instructions which, when executed by the processor, configures the processor to perform operations comprising controlling the wireless communication system to communicate wireless messages with one or more network nodes associated with a locationing service.
- each of the plurality of segments includes the flexible antenna, the wireless communication system, and the processor arranged in a device layer between the flexible cover and the substrate.
- the energy source is arranged in the device layer; in other examples, the energy source is arranged between the device layer and the flexible substrate.
- the energy source includes a cylindrical single cell battery arranged in the device layer between the flexible cover and the substrate.
- the energy source includes a planar flexible battery arranged between the device layer and the substrate.
- Some embodiments include a flexible planarization layer between the device layer and the flexible cover, where the planarization layer planarizes the device layer with a substantially planar surface facing the flexible cover.
- the flexible planarization layer includes a flexible epoxy.
- peripheral portions of the flexible cover and the flexible substrate are bonded together.
- Particular embodiments of the tracking adhesive product additionally include peripheral sidewalls adhered to the flexible cover and the flexible substrate of the tracking adhesive product.
- the peripheral sidewalls include extensions of one or both of the flexible cover and the flexible substrate.
- one or more of the components are arranged in a first device layer and one or more other ones of the components are arranged in a second device layer.
- an interposer is between the first and second device layers and includes one or more through-interposer vias electrically coupling one or more of the components in the first device layer with one or more of the components in the second device layer.
- the flexible substrate and the pressure sensitive adhesive layer are elements of a prefabricated adhesive tape.
- the flexible cover can be an element of a prefabricated adhesive tape.
- Each segment can additionally include one or more sensors selected from an altimeter, a gyrator, an accelerometer, a temperature sensor, and a strain sensor.
- each of the plurality of segments is configured to automatically turn on in response to separation of the respective segment from the tracking adhesive product.
- each of the plurality of segments comprises a respective wake circuit that delivers power from the respective energy source to the respective processor and the respective wireless communications system in response to an event.
- the respective wake circuit delivers power to the processor and the wireless communications system in response to a cut across the tracking adhesive product that creates an open circuit in an electrical path of the respective wake circuit.
- a segment comprises a respective sensor, and the respective wake circuit delivers power to the respective processor and the respective wireless communications system in response to an output of the sensor.
- a segment includes a strain sensor that produces a wake signal based on a change in strain in the respective segment.
- a segment includes a capacitive sensor that produces a wake signal based on a change in capacitance in the respective segment.
- a segment comprises a near field communications sensor that produces a wake signal based on a change in inductance in the respective segment.
- the flexible cover comprises visible demarcations of respective sections of the tracking adhesive product that correspond to the segments.
- the tracking adhesive product is in the form of a roll comprising the plurality of segments.
- the tracking adhesive product is in the form of a planar sheet comprising the plurality of segments.
- a mobile phone is used to configure the tape (e.g., wake up conditions, tracking intervals) as well as associate to the unique tape specific information such as a picture of the package that the user wants to track using the tracking adhesive product.
- the tape e.g., wake up conditions, tracking intervals
- associate to the unique tape specific information such as a picture of the package that the user wants to track using the tracking adhesive product.
- the frequency of measuring location can be different than the frequency of communication the location information.
- the communicate medium is also used for locationing (vs. for example separate cellular connection and separate GPS).
- the tape pro-actively sends a signal and deals with upcoming battery shortage (e.g., thru shutting down or going to a lower battery consumption mode).
- Particular embodiments perform a method of fabricating a tracking adhesive product.
- a flexible tape substrate comprising a first adhesive layer is provided.
- one or more device layers are formed, the one or more device layers comprising one or more additional adhesive layers, an energy source, and a respective flexible circuit electrically connecting one or more components configured to perform one or more location tracking functions.
- a flexible tape cover comprising a second adhesive layer is provided. The one or more device layers between the flexible tape substrate and the flexible tape cover are annealed to form a flexible composite tracking adhesive product structure.
- the energy source includes a flexible battery
- the one or more components electrically connected by the respective flexible circuit comprise a processor, a flexible antenna, and a wireless communication circuit.
- the method further comprises, at locations on a flexible carrier tape corresponding the respective segment locations, fixing the processor, the flexible antenna, and the wireless communication circuit on the respective flexible circuit to form a respective flexible circuit assembly.
- Each respective flexible circuit assembly is incorporated into one of the one or more device layers at a respective segment location along the flexible tape substrate.
- the fabrication method further includes planarizing each device layer with a flexible polymer adhesive.
- FIG. 1 A is a diagrammatic view of a package that has been sealed for shipment using a segment of an example tracking adhesive product dispensed from a roll.
- FIG. 1 B is a diagrammatic top view of a portion of the segment of the example tracking adhesive product shown in FIG. 1 A.
- FIG. 2 is a diagrammatic view of an example of an envelope carrying a segment of an example tracking adhesive product dispensed from a backing sheet.
- FIG. 3 is a diagrammatic view of an example of a network environment supporting location tracking with segments of tracking adhesive products.
- FIG. 4 is a schematic view of an example tracking adhesive product segment.
- FIG. 5A is a diagrammatic top view of a length of an example tracking adhesive product.
- FIG. 5B is a diagrammatic cross-sectional side view of a portion of the tracking adhesive product shown in FIG. 5A.
- FIG. 6 is a flow diagram of an example process for fabricating a tracking adhesive product.
- FIG. 7A is a diagrammatic side view of tracking adhesive product fabrication system.
- FIG. 7B is a diagrammatic side view of tracking adhesive product fabrication system.
- FIG. 8A is a diagrammatic top view of a length of an example tracking adhesive product.
- FIG. 8B is a diagrammatic cross-sectional side view of a first example implementation of the tracking adhesive product shown in FIG. 8A.
- FIG. 9 is a diagrammatic cross-sectional side view of a second example implementation of the tracking adhesive product shown in FIG. 6.
- FIG. 10 is a diagrammatic cross-sectional side view of a portion of an example tracking adhesive product segment.
- FIG. 11 is a diagrammatic top view of a length of an example tracking adhesive product.
- FIG. 12A is a diagrammatic cross-sectional side view of a first example implementation of the tracking adhesive product shown in FIG. 11.
- FIG. 12B is a diagrammatic cross-sectional side view of a second example implementation of the tracking adhesive product shown in FIG. 11.
- FIG. 13A is a diagrammatic top view of a length of an example tracking adhesive product.
- FIG. 13A is a diagrammatic top view of a length of an example tracking adhesive product.
- FIG. 14 is diagrammatic cross-sectional side view of an example tracking adhesive product and an example package.
- FIG. 15 is a block diagram of an example computer apparatus.
- a tracking adhesive product that includes a plurality of segments that can be separated from the adhesive product (e.g., by cutting, tearing, peeling, or the like) and adhesively attached to a variety of different surfaces to inconspicuously implement any of a wide variety of different tracking applications. Examples of such applications include inventory tracking, package tracking, person tracking, animal (e.g., pet) tracking, manufacturing parts tracking, and vehicle tracking.
- each segment of an adhesive product is equipped with an energy source, wireless communication functionality, and processing functionality that enable the segment to perform one or more locationing functions and report the locationing results to a remote server or other computer system.
- the tracking components of the system are encapsulated within a flexible adhesive structure that protects the tracking components from damage while
- example embodiments also include one or more sensors that extend the utility of the platform by providing supplemental information regarding characteristics of the state and or environment of a tracked article, object, vehicle, or person over time.
- the instant specification also describes systems and processes for fabricating flexible multifunction adhesive products in efficient and low-cost ways.
- the fabrication systems and processes are configured to optimize the placement and integration of tracking components within the flexible adhesive structure to achieve high flexibility and ruggedness. In this way, these fabrication systems and processes are able to create a useful and reliable tracking adhesive products that also can provide locationing and, in some examples, ambient sensing functionality. This functionality together with the low cost of production is expected to encourage the ubiquitous deployment of adhesive product segments and thereby alleviate at least some of the problems arising from gaps in conventional locationing infrastructure coverage that prevent continuous tracking across heterogeneous environments.
- FIG. 1A shows an example package 10 that is sealed for shipment using an example tracking adhesive product 12 that includes embedded tracking components 14.
- a segment 13 of the tracking adhesive product 12 is dispensed from a roll 16 and applied to the package 10.
- the tracking adhesive product 12 includes an adhesive side 18 and a non-adhesive side 20.
- the tracking adhesive product 12 can be dispensed from the roll 16 in the same way as any conventional packing tape, shipping tape, or duct tape.
- the tracking adhesive product 12 may be dispensed from the roll 16 by hand, laid across the seam where the two top flaps of the package 10 meet, and cut to a suitable length either by hand or using a cutting instrument (e.g., scissors or an automated or manual tape dispenser).
- a cutting instrument e.g., scissors or an automated or manual tape dispenser
- the non-adhesive side 20 of the segment 13 of the adhesive product 12 includes writing or other markings that may convey instructions, warnings, or other information to a person or machine (e.g., a bar code reader), or may simply be decorative and/or entertaining.
- the segment 13 of the tracking adhesive product 12 includes a two- dimensional bar code 22, written instructions 24 (i.e.,“Cut Flere”), and an associated cut line 26 that indicates where the user should cut the tracking adhesive product 12.
- the written instructions 24 and the cut line 26 typically are printed or otherwise marked on the top, non-adhesive surface 20 of the tracking adhesive product 12 during
- the two-dimensional bar code 22 may be marked on the non-adhesive surface 20 of the tracking adhesive product 12 during the manufacture of the adhesive product 12 or, alternatively, may be marked on the non-adhesive surface 20 of the tracking adhesive product 12 as needed using, for example, a printer or other marking device.
- the cut lines 26 typically demarcate the boundaries between adjacent segments at locations that are free of any tracking components 14.
- the spacing between the tracking components 14 and the cut lines 26 may vary depending on the intended tracking application or the intended adhesive application.
- the length of the tracking adhesive product 12 that is dispensed to seal the package 10 corresponds to a single segment of the tracking adhesive product 12.
- the length of tracking adhesive product 12 needed to seal a package or otherwise serve the adhesive function for which the tracking adhesive product is being applied may include multiple segments 13 of the tracking adhesive product 12, one or more of which segments 13 may be activated upon cutting the length of the tracking adhesive product 12 from the roll 16 and/or applying the length of the tracking adhesive product to the package 10.
- the tracking components 14 embedded in one or more segments 13 of the tracking adhesive product 12 are activated when the adhesive product 12 is cut along the cut line 26.
- the tracking adhesive product 12 includes one or more embedded energy sources (e.g., thin film batteries or conventional cell batteries, such as conventional watch style batteries) that supply power to the tracking components 14 in one or more segments of the tracking adhesive product 12 in response to being separated from the adhesive product 12 (e.g., along a cut line 26).
- embedded energy sources e.g., thin film batteries or conventional cell batteries, such as conventional watch style batteries
- each segment 13 of the tracking adhesive product is a segment 13 of the tracking adhesive product
- each energy source is configured to only supply power to the components in its respective tracking adhesive product segment regardless of the number of contiguous segments 13 that are in a given length of tracking adhesive product 12.
- the energy sources in the respective segments 13 are configured to supply power to the tracking components 14 in all of the segments 13 in the given length of the tracking adhesive product 12.
- the energy sources are connected in parallel and concurrently activated to power the tracking components 14 in all of the segments
- the energy sources are connected in parallel and alternately activated to power the tracking components 14 in respective ones of the tracking adhesive product segments 13 at different time periods, which may or may not overlap.
- FIG. 2 shows an example tracking adhesive product 30 that includes a set of adhesive segments 32 each of which includes a respective set of embedded tracking components 34, and a backing sheet 36 with a release coating that prevents the adhesive segments 34 from adhering strongly to the backing sheet 36.
- Each segment 32 includes an adhesive side facing the backing sheet 36, and an opposing non-adhesive side 40.
- a particular segment 32’ of the tracking adhesive product 30 has been removed from the backing sheet 36 and affixed to an envelope 44.
- Each segment 32 of the tracking adhesive product 30 can be removed from the backing sheet 36 in the same way that adhesive labels can be removed from a conventional sheet of adhesive labels (e.g., by manually peeling a segment 32 from the backing sheet 36).
- the non-adhesive side 40’ of the segment 32’ may include any type of writing, markings, decorative designs, or other ornamentation.
- the non-adhesive side 40’ of the segment 32’ includes writing or other markings that correspond to a destination address for the envelope 44.
- the envelope 44 also includes a return address 46 and, optionally, a postage stamp or mark 48.
- each segment 32 of the tracking adhesive product 12 is activated when the segment 32 is removed from the backing sheet 32.
- each segment 32 includes an embedded capacitive sensing system that can sense a change in
- a segment 32 of the adhesive product 30 includes one or more embedded energy sources (e.g., thin film batteries or common disk-shaped cell batteries) that can be configured to supply power to the tracking components 34 in the segment 32 in response to the detection of a change in capacitance between the segment 32 and the backing sheet 36 as a result of removing the segment 32 from the backing sheet 36.
- embedded energy sources e.g., thin film batteries or common disk-shaped cell batteries
- FIG. 3 shows an example network environment 50 that includes a network 52 that supports communications between a tracking service 54, localization equipment 56, and a client device 58.
- the network 52 includes one or more network communication systems and technologies, including any one or more of wide area networks, local area networks, public networks (e.g., the internet), private networks (e.g., intranets and extranets), wired networks, and wireless networks.
- the localization equipment 56 includes any one or more of (i) satellite based tracking systems 60 (e.g., GPS, GLONASS, and NAVSTAR) that transmit geolocation data that can be received by suitably equipped receivers in segments of a tracking adhesive product, (ii) cellular based systems that use mobile communication technologies (e.g., GSM, GPRS, CDMA, etc.) to implement one or more cell-based localization techniques, and (iii) localization equipment 56, such as wireless access points (e.g., Wi-Fi nodes, Bluetooth nodes, ZigBee nodes, etc.) and other shorter range localization technologies (e.g., ultrasonic localization and/or dead reckoning based on motion sensor measurements).
- location data for one or more activated tracking adhesive product segments 64 can be obtained using one or more of the localization systems and technologies described above.
- a tracking adhesive product segment 64 that includes a GPS receiver is operable to receive location data (e.g., geolocation data) from the Global Positioning System (GPS).
- location data e.g., geolocation data
- GPS Global Positioning System
- the tracking adhesive product segment 64 periodically monitors signals from multiple GPS satellites. Each signal contains information about the time the signal was transmitted and the position of the satellite at the time of transmission. Based on the location and time information for each of four or more satellites, the GPS receiver determines the geolocation of the tracking adhesive product segment 64 and the offset of its internal clock from true time.
- the tracking adhesive product segment 64 can either forward the received GPS location data to the tracking service 54 to determine its geolocation, or first compute geolocation coordinates from the received GPS location data and report the computed geolocation coordinates to the tracking service 54.
- the tracking adhesive product segment 64 can only determine its GPS location when it is able to receive signals from at least four GPS satellites at the same time. As a result, GPS localization typically is limited or unavailable in urban
- a tracking adhesive product segment 64 can be configured to determine or assist in determining its location using terrestrial locationing techniques. For example, Received Signal Strength
- RSSI Indicator
- techniques may be used to determine the location of a tracking adhesive product segment 64. These techniques include, for example, fingerprint matching, trilateration, and triangulation.
- RSSI fingerprinting process one or more predetermined radio maps of a target area are compared to geo-reference RSSI fingerprints that are obtained from measurements of at least three wireless signal sources (e.g., cellular towers or wireless access points) in the target area to ascertain the location of the tracking adhesive product segment 64.
- the predetermined radio maps typically are stored in a database that is accessible by the tracking service 54.
- the location of a tracking adhesive product segment 64 can be determined from measurements of signals transmitted from at least three omnidirectional wireless signal sources (e.g., cellular towers or wireless access points).
- the triangulation and trilateration localization techniques may involve use of one or more of time of arrival (TOA), angle of arrival (AOA), time difference of arrival (TDOA), and uplink-time difference of arrival (U- TDOA) techniques.
- TOA time of arrival
- AOA angle of arrival
- TDOA time difference of arrival
- U- TDOA uplink-time difference of arrival
- RSSI fingerprint matching, trilateration, and triangulation techniques can be used with cellular and wireless access points that are configured to
- GSM Global System for Mobile communications
- CDMA Code Division Multiple Access
- Wi-Fi Wireless Fidelity
- Bluetooth Wireless Fidelity
- BLE Bluetooth Low Energy
- LoRa LoRa
- ZigBee ZigBee
- Z- wave Z- wave
- RF Radio Resource
- a tracking adhesive product segment 64 that includes a GSM/GPRS transceiver can scan GSM frequency bands for signals transmitted from one or more GSM cellular towers. For each signal received by the tracking adhesive product segment 64, the tracking adhesive product segment 64 can determine the signal strength and the identity of the cellular tower that transmitted the signal. The tracking adhesive product segment 64 can send the signal strength and transmitter identifier to the tracking service 54 to determine the location of the adhesive product segment 64. If signal strength and transmitter identifier is available from only one cellular tower, the tracking service 54 can use nearest neighbor localization techniques to determine the location of the tracking adhesive product segment 64. If signal strength and transmitter identifier is received from two or more cellular towers, the tracking service 54 can use localization techniques, such as fingerprint matching, trilateration, and triangulation, to calculate the position of the tracking adhesive product segment 64.
- localization techniques such as fingerprint matching, trilateration, and triangulation
- a tracking adhesive product segment 64 that includes a Wi-Fi (Wireless-Fidelity) transceiver can scan Wi-Fi frequency bands for signals transmitted from one or more Wi-Fi access points. For each signal received by the tracking adhesive product segment 64, the tracking adhesive product segment 64 can determine the signal strength and the identity of the access point that transmitted the signal. The tracking adhesive product segment 64 can send the signal strength and transmitter identifier information to the tracking service 54 to determine the location of the adhesive product segment 64. If signal strength and transmitter identifier
- the tracking service 54 can use nearest neighbor localization techniques to determine a location of the adhesive product segment 64. If signal strength and transmitter identifier information is received from two or more Wi-Fi access points, the tracking service 54 can use localization techniques, such as trilateration, and triangulation, to calculate the position of an adhesive product segment 64. RSSI fingerprint matching also can be used to determine the location of the tracking adhesive product segment 64 in areas (e.g., indoor and outdoor locations, such as malls, warehouses, airports, and shipping ports) for which one or more radio maps have been generated.
- areas e.g., indoor and outdoor locations, such as malls, warehouses, airports, and shipping ports
- the wireless transceiver in the tracking adhesive product segment 64 can transmit a wireless signal (e.g., a Wi-Fi, Bluetooth, Bluetooth Low Energy, LoRa, ZigBee, Z-wave, and/or RF signal) that includes the identifier of the tracking adhesive product segment 64.
- the wireless signal can function as a beacon that can be detected by a mobile computing device (e.g., a mobile phone) that is suitably configured to ascertain the location of the source of the beacon.
- a user may use the mobile computing device to transmit a signal into an area (e.g., a warehouse) that includes the identifier of a target tracking adhesive product segment 64 and configures the target tracking adhesive product segment 64 to begin emitting the wireless beacon signal.
- the target tracking adhesive product segment 64 will not begin emitting the wireless beacon signal until the user/operator self-authenticates with the tracking service 54.
- the tracking service 54 includes one or more computing resources (e.g., server computers) that can be located in the same or different geographic locations.
- the tracking service 54 executes a locationing application 62 to determine the locations of activated tracking adhesive product segments 64.
- the tracking service 54 receives location data from one or more of the adhesive product segments 64.
- the tracking service 54 processes the data received from tracking adhesive product segments 64 to determine the physical locations of the tracking adhesive product segments 64.
- the adhesive product segments 64 may be configured to obtain locationing information from signals received from a satellite system (e.g., GPS, GLONASS, and NAVSTAR), cell towers, or wireless access points, and send the locationing information to the tracking service 54 to ascertain the physical locations of the tracking adhesive product segments 64.
- the tracking adhesive product segments 64 are configured to ascertain their respective physical locations from the signals received from a satellite system (e.g., GPS, GLONASS, and NAVSTAR), cell towers, or wireless access points, and to transmit their respective physical locations to the tracking service 54.
- the tracking service 54 typically stores the locationing information and/or the determined physical location for each tracking adhesive product segment in association with the respective unique identifier of the tracking adhesive product segment.
- the stored data may be used by the tracking service 54 to determine time, location, and state (e.g., sensor based) information about the tracking adhesive product segments 64 and the objects or persons to which the tracking adhesive product segments 64 are attached. Examples of such information include tracking the current location of a tracking adhesive product segment 64, determining the physical route traveled by the tracking adhesive product segment 64 over time, and ascertaining stopover locations and durations.
- state e.g., sensor based
- the client device 58 includes a client application 66 and a display 68.
- the client application 66 establishes sessions with the tracking service 54 during which the client application obtains information regarding the locations of the tracking adhesive product segments 64.
- a user of the client device 58 must be authenticated before accessing the tracking service 54.
- the user typically presents multiple authentication factors to the system (e.g., user name and password).
- the tracking service 54 transmits to the client device 58 data associated with the user’s account, including information relating to the tracking adhesive product segments 64 that are associated with the user’s account.
- the information may include, for example, the current location of a particular tracking adhesive product segment 64, the physical route traveled by the tracking adhesive product segment 64 over time, stopover locations and durations, and state and/or changes in state information (as measured by one or more sensors associated with the tracking adhesive product segment 64).
- the information may be presented in a user interface on the display 68. Location and state information may be presented in the user interface in any of a variety of different ways, including in a table, chart, or map. In some examples, the location and state data presented in the user interface are updated in real time.
- FIG. 4 shows a block diagram of the components of a segment 70 of a tracking adhesive product 64.
- the tracking adhesive product segment 70 includes a number of communication systems 72, 74, an energy source 76, a processor 78, and, optionally, one or more sensors 80.
- Example communication systems 72, 74 include a GPS system that includes a GPS receiver circuit 82 (e.g., a receiver semiconductor circuit) and a GPS antenna 84, and one or more wireless communication systems each of which includes a respective transceiver circuit 86 (e.g., a transceiver semiconductor circuit) and a respective antenna 88.
- Example wireless communication systems include a cellular communication system (e.g., GSM/GPRS), a Wi-Fi communication system, an RF communication system (e.g., LoRa), a Bluetooth communication system (e.g., a Bluetooth Low Energy system), a Z-wave communication system, and a ZigBee communication system.
- the tracking adhesive product segment 70 also includes a processor 90 (e.g., a microcontroller or microprocessor), an energy source 92 (e.g., a printed flexible battery or a conventional single or multiple cell battery), and, optionally, one or more sensors 94.
- a processor 90 e.g., a microcontroller or microprocessor
- an energy source 92 e.g., a printed flexible battery or a conventional single or multiple cell battery
- Example sensors include a capacitive sensor, an altimeter, a gyroscope, an accelerometer, a temperature sensor, a strain sensor, a pressure sensor, a light sensor, and a humidity sensor.
- the tracking adhesive product segment 70 includes a memory 96 for storing data (e.g., localization data and a unique identifier 98 associated with the segment 70).
- the memory 96 may be incorporated into one or more of the processor 90 or sensors 94, or may be a separate component that is integrated in the tracking adhesive product segment 70 as shown in FIG. 4.
- Each segment 70 of the tracking adhesive product 64 integrates components of a tracking system with a flexible adhesive structure in a way that not only provides a cost-effective platform for interconnecting, optimizing, and protecting the components of the tracking system but also maintains the flexibility needed to function as a flexible adhesive product (e.g., a functional flexible tape or label) that can be deployed seamlessly and unobtrusively into various tracking applications and
- a flexible adhesive product e.g., a functional flexible tape or label
- tracking adhesive products are designed to be fabricated using cost-effective fabrication methods, including roll-to-roll and sheet-to-sheet fabrication processes.
- the components of a tracking adhesive product 64 are designed and arranged to optimize performance, flexibility, and robustness for each target application. This encompasses factors, such as material selection, component layout, and mechanical integrity of the integrated system.
- electronic design automation tools are used to optimize the design across the constituent layers of a tracking adhesive product given prescribed performance targets (e.g., mechanical integrity targets, electrical performance targets, and/or wireless communication performance targets). This includes simulations of electromagnetic wave behavior across layers, heat dissipation behavior, electrical parasitic behavior across layers (e.g., inductances, capacitances, and resistances), and mechanical behaviors (e.g., the impact of bending and impressing bonding patterns on the tracking adhesive product 64).
- process technology design rules are developed for designing tracking adhesive products, including rules for integrating layers, rules for selecting the number of layers, and rules for selecting the types of layers (e.g., through interposer vias, component layers, cover layers, substrate layers, and adhesive layers).
- design rules are developed regarding the layout of components in the different layers of a tracking adhesive product 64.
- minimum spacing and/or proximity rules are developed for the placement of antennas, rigid components, flexible components, passive components, and active components.
- rigid and active components such as the communication circuits 82, 86 (e.g., receivers, transmitters, and transceivers) and the processor 90, can have larger minimum spacing requirements than flexible and passive components.
- rigid and active components such as the communication circuits 82, 86 (e.g., receivers, transmitters, and transceivers) and the processor 90, can have larger minimum spacing requirements than flexible and passive components.
- rigid and active components such as the communication circuits 82, 86 (e.g., receivers, transmitters, and transceivers)
- FIG. 5A shows a top view of a portion of an example tracking adhesive product 100 that includes a first segment 102 and a portion of a second segment 104.
- Each segment 102, 104 of the tracking adhesive product 100 includes a respective set of tracking components 106, 108.
- the segments 102, 104 and their respective sets of tracking components 106, 108 typically are identical and configured in the same way.
- the segments 102, 104 and/or their respective sets of tracking components 106, 108 may be different and/or configured in different ways.
- different sets of the segments of the tracking adhesive product 100 may have different sets or configurations of tracking components that are designed and/or optimized for different tracking applications, or different sets of tracking adhesive product segments may have different ornamentations and/or different (e.g., alternating) lengths.
- FIG. 5B shows a cross-sectional side view of a portion of a segment 102 of the tracking adhesive product 100 that includes tracking components 106.
- the tracking adhesive product segment 102 includes a flexible substrate 110 with an adhesive layer 112 on its top surface and an optional adhesive layer 114 on its bottom surface. If the bottom adhesive layer 114 is present, a release liner (not shown) may be (weakly) adhered to the bottom surface of the adhesive layer 114.
- the flexible substrate 110 is implemented as a prefabricated adhesive tape that includes the adhesive layers 112, 114 and the optional release liner. In other examples, the adhesive layers 112, 114 are applied to the top and bottom surfaces of the flexible substrate 110 during the fabrication of the tracking adhesive product 100.
- the adhesive layer 112 bonds the flexible substrate 110 to a bottom surface of a flexible battery 116
- an adhesive layer 118 bonds the flexible battery 116 to a flexible circuit 120 that includes one or more wiring layers (not shown) that connect the processor 90, the circuit 82, the antenna 84, and other components in a device layer 122 to each other and to the flexible battery 116 and, thereby, enable the tracking and other functionalities of the tracking adhesive product segment 102.
- the adhesive layer 118 is implemented by a double-sided adhesive tape.
- the adhesive layer 118 is implemented by a flexible adhesive (e.g., silicone) that can planarize the top portion of the flexible battery layer.
- a flexible polymer layer 124 encapsulates the device layer 122 and thereby reduces the risk of damage that may result from the intrusion of contaminants and/or liquids (e.g., water).
- the flexible polymer layer 124 also planarizes the device layer 122. This facilitates stacking of additional layers on the device layer 122 and also distributes forces generated in, on, or across the tracking adhesive product segment 102 so as to reduce potentially damaging asymmetric stresses that might be caused by the application of bending, torqueing, pressing, or other forces on the tracking adhesive product segment 102 during use.
- a flexible cover 128 is bonded to the planarizing polymer 124 by an adhesive layer 128.
- the flexible cover 126 and the flexible substrate 110 may have the same or different compositions depending on the intended locationing application.
- the flexible cover 126 and the flexible substrate 110 typically include flexible film layers and/or paper substrates.
- Example compositions for the flexible film layers include polymer films, such as polyester, polyimide, polyethylene terephthalate (PET), and other plastics.
- the adhesive layer 128 on the bottom surface of the flexible cover 126 and the adhesive layers 112, 114 on the top and bottom surfaces of the flexible substrate 110 typically include a pressure-sensitive adhesive.
- the adhesive layers 128, 112, 110 are applied to the flexible cover 126 and the flexible substrate 110 during manufacture of the tracking adhesive product 100 (e.g., during a roll-to-roll or sheet-to- sheet fabrication process).
- the flexible cover 126 may be
- the flexible polymer layer 122 is composed of a flexible epoxy (e.g., silicone).
- the flexible battery 116 includes a printed
- the flexible battery may include lithium-ion cells or nickel-cadmium electro-chemical cells.
- the flexible battery 116 typically is formed by process that includes printing or laminating the electro-chemical cells on a flexible substrate (e.g., a polymer film layer).
- a flexible substrate e.g., a polymer film layer.
- other components may be integrated on the same substrate as the flexible battery 116.
- one or more of the flexible antennas 84, 88, the circuits 82, 86, 120, and/or the processor 90 may be integrated on the flexible battery substrate.
- one or more of these other components also (e.g., the flexible antennas and the flexible interconnect circuits) may be printed on the flexible battery substrate.
- the flexible circuit 120 is formed on a flexible substrate by printing, etching, or laminating circuit patterns on the flexible substrate.
- the flexible circuit 120 may be implemented by one or more of a single sided flex circuit, a double access or back bared flex circuit, a sculpted flex circuit, a double-sided flex circuit, a multi-layer flex circuit, a rigid flex circuit, and a polymer thick film flex circuit.
- a single-sided flexible circuit has a single conductor layer made of, for example, a metal or conductive (e.g., metal filled) polymer on a flexible dielectric film.
- a double access or back bared flexible circuit has a single conductor layer but is processed so as to allow access to selected features of the conductor pattern from both sides.
- a sculpted flex circuit is formed using a multi-step etching process that produces a flex circuit that has finished copper conductors that vary in thickness along their respective lengths.
- a multilayer flex circuit has three of more layers of conductors, where the layers typically are interconnected using plated through holes.
- Rigid flex circuits are a hybrid construction of flex circuit consisting of rigid and flexible substrates that are laminated together into a single structure, where the layers typically are electrically interconnected via plated through holes.
- PTF polymer thick film
- the flexible circuit 120 is a double access flex circuit that includes a front side conductive pattern that interconnects the communication systems 72, 74, the processor 90, the one or more sensors 94, and the memory 96, and allows through-hole access (not shown) to a back-side conductive pattern that is connected to the flexible battery 116.
- the front-side conductive pattern of the flexible circuit 120 connects the communications circuits 82, 86 (e.g., receivers, transmitters, and transceivers) to their respective antennas 84, 88 and to the processor 90, and also connects the processor 90 to the one or more sensors 94 and the memory 96.
- the backside conductive pattern connects the active electronics (e.g., the processor 90, the communications circuits 82, 86, and the sensors) on the front-side of the flexible circuit 120 to the electrodes of the flexible battery 116 via one or more through holes in the substrate of the flexible circuit 120.
- the active electronics e.g., the processor 90, the communications circuits 82, 86, and the sensors
- FIG. 6 shows an example method 130 of fabricating the adhesive product 100 (see FIGS. 5A-5B) according to a roll-to-roll fabrication process.
- a double-sided adhesive flexible tape substrate 110 is rolled out (FIG. 6, block 132).
- the flexible tape substrate 110 includes respective adhesive layers 112, 114 on the top and bottom surfaces of the flexible tape substrate 110 (i.e., the flexible tape substrate 110
- the flexible substrate 110 may be implemented by a prefabricated double-sided pressure-sensitive adhesive tape.
- the adhesive layers 112, 114 are applied to the flexible substrate 110 during manufacture of the adhesive product 100 (e.g., in a process step that precedes process block 132).
- each flexible battery 116 on a tape are rolled out and adhered to the top of the flexible tape substrate 110 by the adhesive layer 112 (FIG. 6, block 134).
- each flexible battery 116 is prefabricated.
- the flexible batteries 116 are printed and/or laminated on a roll of flexible base tape.
- Each of the flexible batteries 116 includes one or more printed electrochemical cells, an anode, and a cathode.
- individual flexible batteries 116 are separated automatically from the roll of flexible base tape and attached to the top of the flexible tape substrate 110 at spaced apart locations.
- each flexible battery 116 is located in a respective segment 102,
- a double-sided adhesive tape 118 is applied to the top surfaces of the flexible batteries (FIG. 6, block 136).
- an adhesive planarization layer can be deposited on the top of the flexible batteries.
- the adhesive planarization layer creates a planar surface for the device layer across the entirety of each segment 102, 104 of the tracking adhesive product 100.
- the components of the flexible circuit 120 are assembled and mounted on the flexible circuit 120 (FIG. 6, block 138). In some examples, this assembly occurs in a separate tape-based, roll-to-roll or sheet-to-sheet process in parallel with the main process flow.
- the resulting flexible circuit assembly is attached to the adhesive planarization layer 118 (FIG. 6, block 140).
- the fabrication process involves a hierarchical assembly approach in which one or more smaller tape-based modules (i.e. , Systems-on-Tape), such as the flexible circuit assemblies created in block 138, are created and subsequently integrated into a larger System-on-Tape.
- the flexible circuit 120 is a double access flex circuit that includes a front-side conductive pattern that interconnects the communication systems 72, 74, the processor 90, the one or more sensors 94, and the memory 96, and allows through-hole access to a back-side conductive pattern that is mechanically and electrically connected to the flexible battery 116.
- the front-side conductive pattern of the flexible circuit 120 connects the communications circuits 82, 86 to their respective antennas 84, 88 and to the processor 90, and also connects the processor 90 to the one or more sensors 94 and the memory 96.
- the active electronics (e.g., the processor 90, the communications circuits 82, 86, and the sensors) on the front-side of the flexible circuit 120 are electrically connected to a backside conductive pattern of the flexible circuit 120 by means of one or more through-hole vias in the substrate of the flexible circuit 120.
- the backside conductive pattern defines contact pads that are mechanically and electrically coupled to the electrodes of the flexible battery 116 in order to power the active electronics on the front-side of the flexible circuit 120.
- the contact pads are bonded to the flexible battery electrodes using electrically conductive ink or an electrically conductive adhesive.
- the flexible battery 116 is printed on the front side of the flexible circuit 120, in which case a single-sided flex circuit may be used instead of the double access flex circuit.
- a flexible polymer planarization layer 124 is deposited on top of the flexible circuit assembly (FIG. 6, block 142).
- the flexible polymer is a flexible epoxy (e.g., silicone).
- the flexible polymer layer 124 encapsulates the device layer 122 and thereby reduces the risk of damage that may result from the intrusion of contaminants and/or liquids (e.g., water).
- the flexible polymer layer 124 also planarizes the device layer 122.
- the flexible polymer layer 124 planarizes the entirety of each segment 102, 104 of the adhesive product 100.
- a single-sided flexible tape cover 126 is rolled out and adhered to the top of the epoxy planarization layer 124 (FIG. 6, block 144).
- the flexible tape cover 126 includes a pressure-sensitive adhesive layer on the backside of the flexible tape cover 126 (i.e. , the flexible tape cover 126 incorporates layer 128).
- the flexible tape cover 126 may be implemented by a prefabricated single-sided pressure-sensitive adhesive tape.
- the adhesive layer 128 is applied to the flexible tape cover 126 during manufacture of the adhesive product 100 (e.g., in a process step that precedes process block 144).
- the resulting multilayer tracking adhesive product structure is laminated (FIG. 6, block 146).
- the multilayer tracking adhesive product structure is annealed at a suitable annealing temperature (e.g., 120° C). A variety of different annealing equipment may be used to anneal the multilayer tracking adhesive product structure.
- the multilayer tracking adhesive product structure is annealed in a laminator.
- a laminator 150 is used to anneal and laminate the component elements of the tracking adhesive product 100.
- the laminating rolls 152 of the laminator 150 can apply a programmed heating intensity profile over time that is designed to avoid or at least minimize degradation of heat sensitive components of the tracking adhesive product 100, such as the flexible battery 116.
- a laminator 160 that includes an anvil 162 and an embossing roller 164 is used to anneal and laminate the multilayer tracking adhesive product structure with bonding patterns that are designed control one or more different specific properties of the tracking adhesive product.
- bonding patterns For example, the combination and pressure and an embossing pattern that is selected to increase the adhesion between the constituent layers of the adhesive tracking product 100.
- the bonding patterns also can be designed to increase adhesive between the layers while preserving the functionality and performance of the electronic and other components of the adhesive tracking product 100, such as the flexible battery 116 and the antennas 84, 88.
- the constituent layers of the adhesive tracking product 100 can be embossed with an embossing pattern with a spatial frequency that is selected to minimize any deformation or other change in the structure or properties of one or more of the antennas that would result in degrading one or more performance characteristics of the antennas (e.g., gain, radiation pattern, efficiency, and impedance match).
- FIGS. 8A and 8B respectively show a top view and a cross-sectional side view (along the line 8B-8B in FIG. 8A) of a portion of an example tracking adhesive product 170 that includes first and second segments 172, 174 each of which includes a respective set of tracking components 176, 178.
- the structure and operation of tracking adhesive product 170 and its constituent components substantially corresponds to the tracking adhesive product 100 and its constituent components (see FIGS. 5A and 5B) except that the tracking adhesive product 170 additionally includes lateral ruggedization features 180, 182 that extend along the sides of the tracking adhesive product 170.
- each lateral ruggedization feature 180, 182 wraps around a respective longitudinal side of the tracking adhesive product 170, from the bottom adhesive layer 114 to the top surface of the cover 126.
- the lateral ruggedization features 180, 182 are rectangular sheets of tape that typically are formed of a polymer film, such as, polyester, polyimide, polyethylene terephthalate (PET), and/or other plastic material).
- the lateral ruggedization features 180, 182 are bonded to the tracking adhesive product 170 using an adhesive, such as a pressure-sensitive adhesive or other adhesive such as a flexible epoxy (e.g., silicone).
- the lateral ruggedization features 180, 182 improve the ruggedness of the tracking adhesive product 170 by bonding a common flexible sheet to the exposed edges of the constituent layers on each side of the tracking adhesive product 170. In this way, the lateral ruggedization features 180, 182 provide additional structural support for holding the sheets together and reducing opportunities for the sides of the constituent layers of the tracking adhesive product 170 to fray and/or delaminate.
- FIG. 9 shows a cross-sectional side view of an alternative example of a tracking adhesive product 184 with lateral ruggedization features.
- the lateral ruggedization features 180, 182 of the preceding example tracking adhesive product 170 are implemented by lateral extensions of an example flexible substrate 186.
- the lateral sides of the flexible substrate 186 extend out laterally and wrap around the lateral sides of the tracking adhesive product 184.
- the lateral extensions of the flexible substrate 186 are bonded to the tracking adhesive product 170 using an adhesive, such as a pressure-sensitive adhesive or other adhesive such as a flexible epoxy (e.g., silicone).
- FIG. 10 shows a cross-sectional side view of an example of a tracking adhesive product 190 that includes a stacked arrangement of first and second interconnected device layers 192, 194.
- the stacked arrangement of device layers 192, 194 enables the tracking adhesive product 190 to have a tightly integrated structure that occupies a relatively small areal footprint in the tape structure and a potentially optimal layout of active components (e.g., processor 90, wireless circuits 200, 202, and sensors 203).
- the first device layer 192 includes a flexible circuit 196 and a planarization layer 198, which may be a flexible epoxy (e.g., silicone).
- the flexible circuit 196 includes one or more wiring layers that interconnect the processor 90 and the wireless circuits 200, 202 to each other and to the flexible battery 116.
- the wireless circuit 200 is a GPS receiver
- the wireless circuit 202 is a Wi-Fi transceiver 202.
- the second device layer 194 includes a flexible interposer 204 and a planarization layer 206, which may be a flexible epoxy (e.g., silicone).
- the flexible interposer 204 includes one or more wiring layers (not shown) that connect the sensor(s) 212 to contact pads 214 on the flexible interposer 204.
- the contact pads 214 are connected to the electrodes of the flexible battery 116 by means of a pair of connected vias 216, 218 (i.e. ,“Through-Tape- Vias”) that respectively extend through the flexible interposer 204, the planarization layer 198, and the flexible circuit 196.
- the antennas 208, 210 are connected to the respective wireless circuits 200, 202 by means of respective Through-Tape- Vias 220, 222.
- placing the antennas 208, 210 and the sensors 203 in the top device layer 194 may improve the performance of these devices. For example, positioning the antennas 208, 210 in the top device layer 194 may improve one or more transmission and/or reception performance characteristics of the antennas 208, 210 (e.g., gain, radiation pattern, efficiency, and impedance match). Positioning the sensors 203 in the top device layer 194 also may improve their performance. For example, depending on the sensor type, one or more of the sensors 203 may require direct access or exposure to the exterior environment. Examples of these types of sensors include temperature sensors, ambient humidity sensors, ambient pressure sensors, ambient light sensors, and sound sensors. For these types of sensors, one or more openings or windows can be created in the flexible cover 126 and optionally through the pressure-sensitive adhesive layer 128 and the planarization layer 206.
- the tracking components 106, 108 in each segment 102, 104 are grouped in a central portion of their respective segment 102, 104.
- Such a layout may be advantageous for achieving certain performance targets, such as improved electrical performance (e.g., lower parasitic resistance, capacitance, and inductance) as a result of placing components closer together.
- tracking components 106, 108 in each segment 102, 104 with larger minimum spacing requirements longitudinally along the length and/or laterally along the width of each segment 102, 104 and/or avoiding a staggered placement of rigid components in different layers across the lateral and/or longitudinal dimensions of the tracking adhesive product segments 102, 104 that otherwise would reduce the flexibility of the tracking adhesive product.
- FIG. 11 shows a top view of a portion of an example tracking adhesive product 230 that includes a first segment 232 and a portion of a second segment 234.
- Each segment 232, 234 of the tracking adhesive product 230 includes a respective set of tracking components 236, 238 and optionally may include a respective set of one or more sensor components.
- the tracking components 236, 238 (and optional sensor components) are distributed laterally and/or longitudinally over a larger area of the tracking adhesive product 230 in order to satisfy larger minimum spacing requirements and flexibility requirements.
- the tracking components 236, 238 are laid out in a single device layer.
- FIG. 12A shows a cross-sectional side view of a portion of a segment 232 of the tracking adhesive product 231 that includes tracking components 236.
- the tracking adhesive product segment 232 includes a flexible substrate 110 with an adhesive layer 112 on its top surface and an optional adhesive layer 114 on its bottom surface. If the bottom adhesive layer 114 is present, a release liner (not shown) may be (weakly) adhered to the bottom surface of the adhesive layer 114.
- the adhesive layer 112 bonds the flexible substrate 110 to a bottom surface of a flexible circuit 242 that includes one or more wiring layers (not shown) that connect a processor, a circuit (e.g., a wireless receiver circuit, wireless transmitter circuit, or wireless transceiver circuit), an antenna, and other components (e.g., one or more sensors) in the device layer to each other and to the flexible battery 240 and, thereby, enable the tracking and other functionalities of the tracking adhesive product segment 231.
- a flexible polymer layer 244 encapsulates the device layer and thereby reduces the risk of damage that may result from the intrusion of contaminants and/or liquids (e.g., water).
- the flexible polymer layer 244 also planarizes the device, which distributes forces generated in, on or across the tracking adhesive product segment 232 so as to reduce potentially damaging asymmetric stresses that might be caused by the application of bending, torqueing, pressing, or other forces on the tracking adhesive product segment 231.
- a flexible cover 246 is bonded to the planarizing polymer 244 by an adhesive layer 248.
- FIG. 12B shows a cross-sectional side view of an alternative example 250 of the segment 232 of the tracking adhesive product 231 shown in FIG. 12A.
- the only difference between this alternative example 250 and the example 232 shown in FIG. 12A is that the flexible battery 240 in the example 232 has been replaced by a conventional single or multiple cell battery 252 (e.g., a watch style disk or button cell battery) and associated electrical connection apparatus 254 (e.g., a metal clip) that electrically connects the electrodes of the battery 252 to contact pads on the flexible circuit 242.
- a conventional single or multiple cell battery 252 e.g., a watch style disk or button cell battery
- associated electrical connection apparatus 254 e.g., a metal clip
- tracking adhesive product segments are preconfigured in a power-off state and to remain in the power-off state until a predetermined event occurs.
- the predetermined event indicates that the adhesive product segment has been deployed for use in the field.
- Example events include cutting a segment of a tracking adhesive product from a roll, bending a segment of a tracking adhesive product as it is being peeled off of a roll, separating a segment of a tracking adhesive product from a sheet, and detecting a change in state of the tracking adhesive product.
- each of one or more of the segments 270, 272 of a tracking adhesive product 274 includes a respective circuit 275 that delivers power from the respective energy source 276 to the respective tracking circuit 278 (e.g., a processor and one or more wireless communications circuits) in response to an event.
- the wake circuit 275 is configured to transition from an off state to an on state when the voltage on the wake node 277 exceeds a threshold level, at which point the wake circuit transitions to an on state to power-on the segment 270.
- a designated location e.g., along a designated cut-line 280.
- a minimal amount of current flows through the resistors Ri and R 2.
- the voltage on the wake node 270 remains below the threshold turn-on level.
- the user creates an open circuit in the loop 282, which pulls the voltage of the wake node above the threshold level and turns on the wake circuit 275.
- the resistance vale of resistor Ri is greater than the resistance value of R 2.
- the resistance values of resistors Ri and R 2 are selected based on the overall design of the adhesive product system (e.g., the target wake voltage level and a target leakage current).
- each of one or more of the segments of a tracking adhesive product includes a respective sensor and a respective wake circuit that delivers power from the respective energy source to the respective one or more of the respective tracking components 278 in response to an output of the sensor.
- the respective sensor is a strain sensor that produces a wake signal based on a change in strain in the respective segment.
- the strain sensor is affixed to a tracking adhesive product and configured to detect the stretching of the tracking adhesive product segment as the segment is being peeled off a roll or a sheet of the tracking adhesive product.
- the respective sensor is a capacitive sensor that produces a wake signal based on a change in capacitance in the respective segment.
- the capacitive sensor is affixed to a tracking adhesive product and configured to detect the separation of the tracking adhesive product segment from a roll or a sheet of the tracking adhesive product.
- the respective sensor is a flex sensor that produces a wake signal based on a change in curvature in the respective segment.
- the flex sensor is affixed to a tracking adhesive product and configured to detect bending of the tracking adhesive product segment as the segment is being peeled off a roll or a sheet of the tracking adhesive product.
- the respective sensor is a near field communications sensor that produces a wake signal based on a change in inductance in the respective segment.
- FIG. 13B shows another example of a tracking adhesive product 294 that delivers power from the respective energy source 276 to the respective tracking circuit 278 (e.g., a processor and one or more wireless communications circuits) in response to an event.
- This example is similar in structure and operation as the tracking adhesive product 294 shown in FIG. 13A, except that the wake circuit 275 is replaced by a switch 296 that is configured to transition from an open state to a closed state when the voltage on the switch node 277 exceeds a threshold level.
- the voltage on the switch node is below the threshold level as a result of the low current level flowing through the resistors Ri and R 2.
- the user cuts across the tracking adhesive product 294 along the designated cut-line 280, the user creates an open circuit in the loop 282, which pulls up the voltage on the switch node above the threshold level to close the switch 296 and turn on the tracking circuit 278.
- FIG. 14 shows a diagrammatic cross-sectional front view of an example tracking adhesive product 300 and a perspective view of an example package 302.
- this example is configured to supply power from the energy source 302 to turn on the tracking circuit 306 in response to establishing an electrical connection between two power terminals 308, 310 that are integrated into the tracking adhesive product.
- each segment of the tracking adhesive product 300 includes a respective set of embedded tracking components, an adhesive layer 312, and an optional backing sheet 314 with a release coating that prevents the segments from adhering strongly to the backing sheet 314.
- the power terminals 308, 310 are composed of an electrically conductive material (e.g., a metal, such as copper) that may be printed or otherwise patterned and/or deposited on the backside of the tracking adhesive product 300.
- the tracking adhesive product can be activated by removing the backing sheet 314 and applying the exposed adhesive layer 312 to a surface that includes an electrically conductive region 316.
- the electrically conductive region 316 is disposed on a portion of the package 302.
- the power terminals 308, 310 are electrically connected to any respective nodes of the tracking circuit 306 that would result in the activation of the tracking circuit 306 in response to the creation of an electrical connection between the power terminals 308, 310.
- an adhesive product segment after an adhesive product segment is turned on, it will communicate with the tracking service 54 to confirm that the user/operator who is associated with the adhesive product segment is an authorized user who has authenticated himself or herself to the tracking service 54. In these examples, if the adhesive product segment cannot confirm that the user/operator is an authorized user, the adhesive product segment will turn itself off.
- FIG. 15 shows an example embodiment of computer apparatus that, either alone or in combination with one or more other computing apparatus, is operable to implement one or more of the computer systems described in this specification, including one or more of the tracking service system 54, the network system 52, the client system 58, and the localization equipment 56.
- the computer apparatus 320 includes a processing unit 322, a system memory 324, and a system bus 326 that couples the processing unit 322 to the various components of the computer apparatus 320.
- the processing unit 322 may include one or more data processors, each of which may be in the form of any one of various commercially available computer processors.
- the system memory 324 includes one or more computer-readable media that typically are associated with a software application addressing space that defines the addresses that are available to software applications.
- the system memory 324 may include a read only memory (ROM) that stores a basic input/output system (BIOS) that contains start-up routines for the computer apparatus 320, and a random access memory (RAM).
- ROM read only memory
- BIOS basic input/output system
- RAM random access memory
- the system bus 326 may be a memory bus, a peripheral bus or a local bus, and may be compatible with any of a variety of bus protocols, including PCI, VESA, MicroChannel, ISA, and EISA.
- the computer apparatus 320 also includes a persistent storage memory 328 (e.g., a hard drive, a floppy drive, a CD ROM drive, magnetic tape drives, flash memory devices, and digital video disks) that is connected to the system bus 326 and contains one or more computer-readable media disks that provide non-volatile or persistent storage for data, data structures and computer-executable instructions.
- a persistent storage memory 328 e.g., a hard drive, a floppy drive, a CD ROM drive, magnetic tape drives, flash memory devices, and digital video disks
- a user may interact (e.g., input commands or data) with the computer apparatus 320 using one or more input devices 330 (e.g. one or more keyboards, computer mice, microphones, cameras, joysticks, physical motion sensors, and touch pads). Information may be presented through a graphical user interface (GUI) that is presented to the user on a display monitor 332, which is controlled by a display controller 334.
- GUI graphical user interface
- the computer apparatus 320 also may include other input/output hardware (e.g., peripheral output devices, such as speakers and a printer).
- the computer apparatus 320 connects to other network nodes through a network adapter 336 (also referred to as a“network interface card” or NIC).
- a number of program modules may be stored in the system memory 324, including application programming interfaces 338 (APIs), an operating system (OS) 340 (e.g., the Windows® operating system available from Microsoft Corporation of Redmond, Washington U.S.A.), software applications 341 including one or more software applications programming the computer apparatus 320 to perform one or more of the steps, tasks, operations, or processes of the locationing and/or tracking systems described herein, drivers 342 (e.g., a GUI driver), network transport protocols 344, and data 346 (e.g., input data, output data, program data, a registry, and configuration settings).
- APIs application programming interfaces 338
- OS operating system
- software applications 341 including one or more software applications programming the computer apparatus 320 to perform one or more of the steps, tasks, operations, or processes of the locationing and/or tracking systems described herein
- drivers 342 e.g., a GUI driver
- network transport protocols 344 e.g., input data, output data, program data, a registry,
- Examples of the subject matter described herein can be implemented in data processing apparatus (e.g., computer hardware and digital electronic circuitry) operable to perform functions by operating on input and generating output. Examples of the subject matter described herein also can be tangibly embodied in software or firmware, as one or more sets of computer instructions encoded on one or more tangible non-transitory carrier media (e.g., a machine readable storage device, substrate, or sequential access memory device) for execution by data processing apparatus.
- data processing apparatus e.g., computer hardware and digital electronic circuitry
- Examples of the subject matter described herein also can be tangibly embodied in software or firmware, as one or more sets of computer instructions encoded on one or more tangible non-transitory carrier media (e.g., a machine readable storage device, substrate, or sequential access memory device) for execution by data processing apparatus.
- tangible non-transitory carrier media e.g., a machine readable storage device, substrate, or sequential access memory device
Landscapes
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Automation & Control Theory (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Adhesive Tapes (AREA)
- Position Fixing By Use Of Radio Waves (AREA)
- Navigation (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/842,861 US10262255B2 (en) | 2016-12-14 | 2017-12-14 | Multifunction adhesive product for ubiquitous realtime tracking |
US15/842,840 US10482369B2 (en) | 2016-12-14 | 2017-12-14 | Window based locationing of mobile targets using complementary position estimates |
US15/842,867 US10445634B2 (en) | 2016-12-14 | 2017-12-14 | Fabricating multifunction adhesive product for ubiquitous realtime tracking |
US201862670712P | 2018-05-11 | 2018-05-11 | |
US201862680716P | 2018-06-05 | 2018-06-05 | |
PCT/US2018/064848 WO2019118400A1 (en) | 2017-12-14 | 2018-12-11 | Multifunction flexible adhesive product with sensing and wireless communication capabilities |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3724286A1 true EP3724286A1 (de) | 2020-10-21 |
EP3724286A4 EP3724286A4 (de) | 2021-09-01 |
Family
ID=66820621
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP18887803.7A Pending EP3724287A4 (de) | 2017-12-14 | 2018-12-11 | Herstellung eines flexiblen multifunktionsklebebands mit sensor- und drahtloskommunikationsfähigkeiten |
EP18887983.7A Withdrawn EP3724818A4 (de) | 2017-12-14 | 2018-12-11 | Flexible klebeband-plattform für drahtlose transduktorschaltungen und anwendungen |
EP18888295.5A Pending EP3725104A4 (de) | 2017-12-14 | 2018-12-11 | Fensterbasierte ortsbestimmung von mobilen zielen unter verwendung von komplementären positionsschätzungen |
EP18887258.4A Pending EP3724286A4 (de) | 2017-12-14 | 2018-12-11 | Multifunktionales flexibles klebeprodukt mit messungs- und drahtloskommunikationsfähigkeiten |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP18887803.7A Pending EP3724287A4 (de) | 2017-12-14 | 2018-12-11 | Herstellung eines flexiblen multifunktionsklebebands mit sensor- und drahtloskommunikationsfähigkeiten |
EP18887983.7A Withdrawn EP3724818A4 (de) | 2017-12-14 | 2018-12-11 | Flexible klebeband-plattform für drahtlose transduktorschaltungen und anwendungen |
EP18888295.5A Pending EP3725104A4 (de) | 2017-12-14 | 2018-12-11 | Fensterbasierte ortsbestimmung von mobilen zielen unter verwendung von komplementären positionsschätzungen |
Country Status (4)
Country | Link |
---|---|
EP (4) | EP3724287A4 (de) |
JP (1) | JP7421547B2 (de) |
CN (1) | CN112004900B (de) |
WO (4) | WO2019118403A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4111712A4 (de) * | 2020-03-21 | 2023-11-08 | Trackonomy Systems, Inc. | Drahtlose sensorknoten zur ausrüstungsüberwachung |
US11829829B2 (en) * | 2020-09-05 | 2023-11-28 | Trackonomy Systems, Inc. | Wireless vibration monitoring sensor device with flexible form factor |
US11885644B1 (en) | 2020-09-05 | 2024-01-30 | Trackonomy Systems, Inc. | Sensor form factors in hostile environments |
US11861441B1 (en) | 2020-12-21 | 2024-01-02 | Trackonomy Systems, Inc. | Spreading out electronics in an internet of things device for resiliency to environmental hazards |
CN113080977B (zh) * | 2021-03-25 | 2022-12-20 | 山东科技大学 | 一种柔性电极的制备方法、柔性电极以及所述电极的使用方法 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6045652A (en) * | 1992-06-17 | 2000-04-04 | Micron Communications, Inc. | Method of manufacturing an enclosed transceiver |
JP3052608B2 (ja) * | 1992-10-05 | 2000-06-19 | 株式会社デンソー | 電子荷札 |
US5495250A (en) * | 1993-11-01 | 1996-02-27 | Motorola, Inc. | Battery-powered RF tags and apparatus for manufacturing the same |
US6030423A (en) * | 1998-02-12 | 2000-02-29 | Micron Technology, Inc. | Thin profile battery bonding method and method of conductively interconnecting electronic components |
US8135413B2 (en) * | 1998-11-24 | 2012-03-13 | Tracbeam Llc | Platform and applications for wireless location and other complex services |
US7848905B2 (en) * | 2000-12-26 | 2010-12-07 | Troxler Electronic Laboratories, Inc. | Methods, systems, and computer program products for locating and tracking objects |
JP2002230499A (ja) | 2001-02-01 | 2002-08-16 | Dainippon Printing Co Ltd | 非接触icタグ |
US6614392B2 (en) | 2001-12-07 | 2003-09-02 | Delaware Capital Formation, Inc. | Combination RFID and GPS functionality on intelligent label |
US6972677B2 (en) * | 2002-08-27 | 2005-12-06 | Coulthard John J | Monitoring system |
US7405656B2 (en) * | 2004-01-30 | 2008-07-29 | United Parcel Service Of America, Inc. | Device and method for encapsulation and mounting of RFID devices |
KR100686735B1 (ko) * | 2005-08-29 | 2007-02-26 | 삼성전자주식회사 | 이동 단말기를 이용한 실내 위치 추적 방법 및 시스템 |
ES2560665T3 (es) * | 2005-10-03 | 2016-02-22 | Mallinckrodt Llc | Sistema y método radiofarmacéutico utilizando etiquetas de identificación por radiofrecuencia |
US7656292B2 (en) * | 2007-02-16 | 2010-02-02 | 3Si Security Systems, Inc. | Flexible anti-theft pack for tracking and location |
JP2008239282A (ja) * | 2007-03-26 | 2008-10-09 | Brother Ind Ltd | 配達システム及び無線タグ情報読み取り装置 |
US8214139B2 (en) | 2008-01-25 | 2012-07-03 | Garmin Switzerland Gmbh | Position source selection |
US8269633B2 (en) * | 2008-12-08 | 2012-09-18 | White Box, Inc. | Data logger |
CN101798446B (zh) * | 2009-02-11 | 2012-01-11 | 江苏华信塑业发展有限公司 | Rfid标签用petg印刷片材及其制造工艺 |
WO2011037191A1 (ja) * | 2009-09-24 | 2011-03-31 | 株式会社テララコード研究所 | Rfidタグ、タグリーダ/ライタ、データ管理システム及びデータ管理方法 |
US20110208424A1 (en) * | 2010-02-23 | 2011-08-25 | Eric Hirsch | Road Map Feedback Corrections in Tightly Coupled GPS and Dead Reckoning Vehicle Navigation |
US10288433B2 (en) * | 2010-02-25 | 2019-05-14 | Microsoft Technology Licensing, Llc | Map-matching for low-sampling-rate GPS trajectories |
US9311586B2 (en) * | 2011-03-22 | 2016-04-12 | Jamie Robinette | Apparatus and method for locating, tracking, controlling and recognizing tagged objects using active RFID technology |
JP5289594B2 (ja) * | 2012-02-08 | 2013-09-11 | 三菱電機インフォメーションシステムズ株式会社 | 警告システム |
US9234757B2 (en) * | 2013-11-29 | 2016-01-12 | Fedex Corporate Services, Inc. | Determining node location using a variable power characteristic of a node in a wireless node network |
US9591458B2 (en) * | 2014-03-12 | 2017-03-07 | Marvell World Trade Ltd. | Method and apparatus for adaptive positioning |
US20160006123A1 (en) * | 2014-07-01 | 2016-01-07 | Mc10, Inc. | Conformal electronic devices |
US9513666B2 (en) * | 2014-07-25 | 2016-12-06 | VivaLnk, Inc. | Highly compliant wearable wireless patch having stress-relief capability |
CN106574873A (zh) * | 2014-08-04 | 2017-04-19 | 艾利丹尼森公司 | 时温追踪标签 |
EP2950240A1 (de) * | 2014-11-04 | 2015-12-02 | idp invent ag | Durch ein mobiltelefon betreibbares transponderetikett, tragbares objekt, mobiltelefon und zugehörige verfahren |
US10445634B2 (en) * | 2016-12-14 | 2019-10-15 | Trackonomy Systems, Inc. | Fabricating multifunction adhesive product for ubiquitous realtime tracking |
-
2018
- 2018-12-11 JP JP2021509944A patent/JP7421547B2/ja active Active
- 2018-12-11 EP EP18887803.7A patent/EP3724287A4/de active Pending
- 2018-12-11 WO PCT/US2018/064859 patent/WO2019118403A1/en unknown
- 2018-12-11 WO PCT/US2018/064848 patent/WO2019118400A1/en unknown
- 2018-12-11 WO PCT/US2018/064919 patent/WO2019118440A1/en unknown
- 2018-12-11 WO PCT/US2018/064855 patent/WO2019118402A1/en active Application Filing
- 2018-12-11 EP EP18887983.7A patent/EP3724818A4/de not_active Withdrawn
- 2018-12-11 CN CN201880089501.8A patent/CN112004900B/zh active Active
- 2018-12-11 EP EP18888295.5A patent/EP3725104A4/de active Pending
- 2018-12-11 EP EP18887258.4A patent/EP3724286A4/de active Pending
Also Published As
Publication number | Publication date |
---|---|
EP3725104A1 (de) | 2020-10-21 |
EP3724287A4 (de) | 2021-10-27 |
WO2019118402A1 (en) | 2019-06-20 |
EP3724818A4 (de) | 2021-10-27 |
EP3724286A4 (de) | 2021-09-01 |
EP3724818A1 (de) | 2020-10-21 |
EP3724287A1 (de) | 2020-10-21 |
WO2019118440A1 (en) | 2019-06-20 |
WO2019118403A1 (en) | 2019-06-20 |
JP2021520018A (ja) | 2021-08-12 |
WO2019118400A1 (en) | 2019-06-20 |
CN112004900B (zh) | 2023-01-06 |
CN112004900A (zh) | 2020-11-27 |
JP7421547B2 (ja) | 2024-01-24 |
EP3725104A4 (de) | 2022-01-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11341392B2 (en) | Wake circuit for flexible adhesive product | |
US11934903B2 (en) | Wireless communications and transducer based event detection platform | |
US12061946B2 (en) | Package sealing tape types with varied transducer sampling densities | |
JP7421547B2 (ja) | 感知機能およびワイヤレス通信機能を備えた多機能フレキシブル接着製品の製作 | |
US20230028603A1 (en) | Hybrid RFID and Wireless Communication System for Tracking of Assets and People and Method Thereof | |
US11829829B2 (en) | Wireless vibration monitoring sensor device with flexible form factor | |
US11900195B2 (en) | Tearing to turn on wireless node with multiple cutouts for re-use | |
US12001993B2 (en) | System and methods of electronics sampling to optimize system performance, cost, and confidence levels | |
US20230152122A1 (en) | Wireless infrastructure setup and asset tracking, and method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20200714 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20210803 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C09J 7/38 20180101AFI20210728BHEP Ipc: B32B 37/12 20060101ALI20210728BHEP Ipc: B32B 37/06 20060101ALI20210728BHEP Ipc: H04W 4/02 20180101ALI20210728BHEP Ipc: B32B 7/12 20060101ALI20210728BHEP Ipc: B32B 27/08 20060101ALI20210728BHEP Ipc: B32B 27/28 20060101ALI20210728BHEP Ipc: B32B 27/36 20060101ALI20210728BHEP Ipc: B32B 29/00 20060101ALI20210728BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
|
17Q | First examination report despatched |
Effective date: 20240223 |