EP3689993A1 - Film adhésif - Google Patents

Film adhésif Download PDF

Info

Publication number
EP3689993A1
EP3689993A1 EP18863312.7A EP18863312A EP3689993A1 EP 3689993 A1 EP3689993 A1 EP 3689993A1 EP 18863312 A EP18863312 A EP 18863312A EP 3689993 A1 EP3689993 A1 EP 3689993A1
Authority
EP
European Patent Office
Prior art keywords
laser beam
absorbent
psa
prescribed
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP18863312.7A
Other languages
German (de)
English (en)
Other versions
EP3689993A4 (fr
Inventor
Hakaru Horiguchi
Kosuke YONEZAKI
Hiroyuki Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of EP3689993A1 publication Critical patent/EP3689993A1/fr
Publication of EP3689993A4 publication Critical patent/EP3689993A4/fr
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/383—Natural or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron
    • C08K2003/2275—Ferroso-ferric oxide (Fe3O4)
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate

Definitions

  • the present invention relates to a pressure-sensitive adhesive (PSA) film.
  • PSA pressure-sensitive adhesive
  • Patent Document 1 discloses a technique to increase hole-making reliability or workability, etc., by pressure-bonding an auxiliary PSA sheet to a copper-clad board and projecting a carbon dioxide laser onto the auxiliary PSA sheet to make holes in the copper-clad board.
  • Patent Documents 2 and 3 disclose PSA films suited for short-wavelength laser cutting, the laser having a center wavelength between about 1000 nm and 1100 nm.
  • the PSA film applied on a workpiece is irradiated with the short-wavelength laser to process the workpiece along with the PSAfilm.
  • the PSAfilm in Patent Document 2 can be cut well with a short-wavelength laser, but it has been difficult to increase the rate of processing workpieces with the PSAfilm applied thereon.
  • the PSA film in Patent Document 3 it leaves black residues derived from the PSAfilm on the processed workpieces, may degrading the appearance.
  • an objective of this invention is to provide a PSA film that enables efficient laser machining of a workpiece when applied the film on, using a short-wavelength laser having a center wavelength of 900 nm to 1100 nm; and is less likely to cause deterioration of the visual quality (appearance) of the processed workpiece.
  • the present description provides a PSA film comprising a resin film as a substrate and a PSAlayer provided at least on one face of the substrate.
  • the PSAfilm includes a laser beam absorbent that comprises, as a constituent element, a metal having a specific heat of less than 900 J/kg ⁇ K and a heat conductivity of less than 200 W/m ⁇ K.
  • the PSAfilm has a laser beam absorbance of 20 % or higher in the wavelength range between 900 nm and 1100 nm. It is noted that aluminum (Al) has a specific heat of 917 J/kg ⁇ K and a heat conductivity of 238 W/m ⁇ K.
  • the PSA film in such an embodiment can efficiently absorb a laser beam having a center wavelength in the range between 900 nm and 1100 nm (or a "prescribed laser beam” hereinafter) and can be suitably cut, using the energy of the prescribed laser beam absorbed.
  • This cutting may indicate cutting the PSAfilm by causing a local part of the PSA film to decompose and disappear or to melt down by projecting the prescribed laser beam thereto.
  • the PSAfilm includes the laser beam absorbent (or the prescribed absorbent, hereinafter) comprising, as a constituent element, a metal having a specific heat of less than 900 J/kg ⁇ K and a heat conductivity of less than 200 W/m ⁇ K; and therefore, for instance, as compared to an embodiment using Al powder in place of the prescribed absorbent, the energy of the prescribed laser beam absorbed is allowed to more effectively act on the workpiece (an object being processed). Because the PSA film includes the prescribed absorbent, the workpiece can be effectively processed, even with no use of a laser beam absorbent that is likely to leave black residues on the processed workpiece or with its reduced usage.
  • the laser beam absorbent or the prescribed absorbent, hereinafter
  • blackening or “contamination”
  • contamination causing little to no blackening
  • (having) anti-blackening properties or “(having) non-contaminating properties”
  • the PSA film disclosed herein enables efficient processing of a workpiece with the prescribed laser beam while preventing or reducing blackening of the workpiece.
  • a black metal compound can be preferably used as the prescribed absorbent.
  • the black metal compound in the PSA film can effectively increase the prescribed laser beam absorbance.
  • workpieces can be efficiently processed even when a potential blackening laser beam absorbent is not used or used in a reduced amount; and it is possible to improve the speed of processing with the prescribed laser beam while preventing the workpieces from blackening.
  • the black metal compound can be used in an amount equivalent to, for instance, about 0.05 % or greater and 10 % or less by weight in the PSAfilm.
  • the PSA film according to some preferable embodiments includes less than 0.05 % carbon black (CB) by weight.
  • CB content less than 0.05 % by weight encompasses a CB-free case, that is, a case where the CB content is 0 % by weight. According to the art disclosed herein, even when the CB content is limited as above, processing speed can be assured with the prescribed laser beam. Thus, higher process efficiency can be obtained while preventing blackening.
  • At least one species can be selected from the group consisting of, for instance, iron-based oxides, titanium black and manganese-based oxides. From the standpoint of the material availability, iron-based oxides exemplify preferable prescribed absorbents.
  • the substrate forming the PSA film comprises the prescribed absorbent.
  • the substrate preferably has a prescribed laser beam absorbance of 20 % or higher.
  • the PSA film disclosed herein can be favorably practiced in an embodiment having such a substrate.
  • the substrate is a polyolefin resin film or a polyester resin film.
  • a resin film having such a substrate is preferable because, when cut with the prescribed laser beam, the cut width can be easily controlled and the resulting cut edge surface is likely to have a precise shape. It is also preferable to be able to cut the PSA film with high precision from the standpoint of improving the appearance of the processed workpiece.
  • the substrate may have a monolayer structure.
  • a substrate having a monolayer structure can be advantageous in terms of manufacturing efficiency and quality consistency of the substrate.
  • the PSAfilm disclosed herein can be constituted to absorb the prescribed laser beam well while being less likely to cause black residues, that is, having excellent anti-blackening properties.
  • the present description provides a PSA film for laser cutting that is formed of a PSA film disclosed herein used in an application involving cutting with the prescribed laser beam.
  • the "laser beam absorbance in the wavelength range between 900 nm and 1100 nm” refers to the minimum laser beam absorbance in the said wavelength range.
  • the term “laser beam absorbance” refers to the minimum laser beam absorbance in the wavelength range between 900 nm and 1100 nm unless otherwise specified.
  • the laser beam absorbance refers to the laser beam absorbance of the backside (the surface to be irradiated with the prescribed laser beam, i.e. the face on the reverse side of the face applied to a workpiece) of the PSA film or the substrate.
  • the "laser beam absorbent” refers to a material capable of increasing the laser beam absorbance in comparison to a case not using the laser beam absorbent.
  • the "prescribed absorbent” refers to a species among the aforementioned species of laser beam absorbent that comprises a metal having a heat capacity of lower than 900 J/kg ⁇ K and a heat conductivity of lower than 200 W/m ⁇ K.
  • a layer comprising a laser beam absorbent possibly a prescribed absorbent
  • the PSA film disclosed herein has a PSA layer on at least one face of the resin film as the substrate. It may be a single-faced PSAfilm (an adhesively single-faced PSA film) having a PSA layer only on one face (first face) of the substrate, or it may be a double-faced PSA sheet (an adhesively double-faced PSAfilm) having a PSAlayer on each of the two faces (the first and second faces) of the substrate.
  • a main example being an embodiment where it is applied to a single-faced PSAfilm while the application of the art disclosed herein is not to be limited to such an embodiment.
  • Fig. 1 shows the constitution of the PSA film according to an embodiment.
  • PSA film 1 comprises a resin film 10 as a substrate and a PSAlayer 20 provided on a first face 10A thereof, and is used by applying the PSAlayer 20 to an adherend.
  • a second face (backside) 10B of resin film 10 forms a releasable surface (release face).
  • PSAfilm 1 Prior to use (i.e., before applied to the adherend), PSAfilm 1 can be wound in a roll so that a surface (adhesive face) 20A of PSA layer 20 is brought in contact with the backside 10B of resin film 10, whereby surface 20A is protected.
  • the surface 20A of PSAlayer 20 may be protected with a release liner 30 having a release face at least on the PSAlayer 20 side.
  • PSA film 1 in this embodiment has, as all or part of resin film 10, a laser beam-absorbing layer 42 comprising a laser beam absorbent.
  • Laser beam-absorbing layer 42 is typically a layer formed from a resin composition comprising a prescribed absorbent 402 as the laser beam absorbent.
  • resin film 10 has a monolayer structure formed of laser beam-absorbing layer 42; however, the structure of resin film 10 is not limited to a monolayer structure. For instance, as PSA film 2 shown in Fig.
  • resin film 10 can be a laminate including a plurality of layers (here, the first and second layers 42 and 44 placed on the PSA layer 20 side and on the backside thereof, respectively) and at least one of the layers can be a laser beam-absorbing layer 42.
  • the first layer 42 is a layer (laser beam-absorbing layer) formed from a resin composition comprising a prescribed absorbent 402 and the second layer 44 is a layer formed from a resin composition free of a laser beam absorbent.
  • the PSA film disclosed herein is characterized by having a laser beam absorbance of 20 % or higher in the wavelength range between 900 nm and 1100 nm.
  • the laser beam absorbance indicates the ratio of the prescribed laser beam (energy) actually absorbed by the PSA film to the prescribed laser beam (total energy) projected onto the PSA film. With the PSA film having a 20 % or higher laser beam absorbance, the prescribed laser beam can be efficiently absorbed.
  • the PSA film has a laser beam absorbance of, for instance, higher than 20 %, possibly 25 % or higher, 30 % or higher, 45 % or higher, 60 % or higher, or even 75 % or higher.
  • the laser beam absorbance of the PSA film can be 100 %. For practical use, it is preferably 95 % or lower, or possibly 90 % or lower.
  • the transmittance of the PSA film is not particularly limited. From the standpoint of facilitating an increase in laser beam absorbance, in some embodiments, the PSA film may have a prescribed laser beam transmittance of, for instance, lower than 70 %, lower than 50 %, lower than 40 %, or even lower than 35 %.
  • the minimum transmittance of the PSA film is not particularly limited. From the standpoint of facilitating inspection of the workpiece through the PSA film, in some embodiments, the PSA film may have a transmittance of, for instance, 1 % or higher, 5 % or higher, 8 % or higher, 10 % or higher, or even 20 % or higher. It is useful to be able to inspect the workpiece through the PSA film when checking the processed area and the state of adhesion of the PSA film.
  • the reflectance of the PSA film is not particularly limited. From the standpoint of readily obtaining a higher laser beam absorbance, in some embodiments, at the wavelength where the laser beam absorbance minimizes in the wavelength range between 900 nm and 1100 nm, the PSA film may have a prescribed laser beam reflectance of, for instance, lower than 50 %, lower than 40 %, lower than 20 %, or even lower than 10 %.
  • the minimum reflectance of the PSA sheet is not particularly limited and can be zero. From the practical standpoint, the reflectance of the PSA sheet is usually suitably 1 % or higher, or possibly 3 % or higher.
  • the PSA film may include one, two or more species of laser beam absorbent.
  • these laser beam absorbents can be used as a blend or can be included separately in different layers in the PSA film.
  • the shape of particles forming the powder is not particularly limited.
  • it can be flaky, spherical, needle-shaped, polyhedral, irregularly-shaped, etc.
  • a flaky, spherical or needle-shaped laser beam absorbent can be preferably used.
  • the mean particle diameter of the laser beam absorbent is not particularly limited. It can be, for instance, 0.005 ⁇ m or greater and 20 ⁇ m or less. From the standpoint of the dispersibility, it is usually preferable to use a laser beam absorbent having a mean particle diameter of 10 ⁇ m or less, or 5 ⁇ m or less.
  • the laser beam absorbent can have a mean particle diameter of, for instance, 3 ⁇ m or less, 1 ⁇ m or less, 0.6 ⁇ m or less, 0.4 ⁇ m or less, or even 0.3 ⁇ m or less.
  • the laser beam absorbent may have a mean particle diameter of, for instance, 0.008 ⁇ m or greater, 0.01 ⁇ m or greater, 0.05 ⁇ m or greater, 0.1 ⁇ m or greater, 0.15 ⁇ m or greater, or even 0.2 ⁇ m or greater.
  • the "mean particle diameter” refers to a particle diameter at 50 % cumulative volume (i.e., 50 % volume-based mean particle diameter) in a size distribution measured using a particle counter based on the laser scattering/diffraction method.
  • the PSA film disclosed herein comprises, as the laser beam absorbent, a prescribed absorbent, that is, a laser beam absorbent that comprises, as a constituent element, a metal having a specific heat of lower than 900 J/kg ⁇ K and a heat conductivity of lower than 200 W/m ⁇ K.
  • the prescribed absorbent can be selected from the group consisting of, any of a single metal species satisfying the specific heat and the heat conductivity; an alloy comprising any of a single metal species that satisfies the specific heat and the heat conductivity, with the metal species contained at a ratio higher than 50 % by weight, higher than 70 % by weight, or even higher than 90 % by weight; an alloy comprising two or more metal species satisfying the specific heat and the heat conductivity, with the metal species contained at a total ratio higher than 50 % by weight, higher than 70 % by weight or higher than 90 % by weight; and a metal compound comprising, as a constituent element, a metal species that qualifies as the single metal species or as the alloy.
  • the prescribed absorbent examples include iron, an iron alloy (e.g. an alloy of iron that includes at least one species of element selected from the group consisting of Cr, Ni, Si, W, Mn and C) and a metal compound (iron-based metal) that comprises, as a constituent element, iron or a metal (iron-based compound) that qualifies as the iron alloy.
  • an iron-based compound for instance, an iron-based oxide (an oxide of the iron-based metal) can be preferably used.
  • Other examples of the prescribed absorbent include a Mn-based compound that comprises, as a constituent element, Mn or a metal (Mn-based metal) that qualifies as a Mn alloy. In particular, a Mn-based oxide is preferable.
  • the prescribed absorbent solely one species or a combination of two or more species can be used. In the PSAfilm comprising two or more species of prescribed absorbent, these prescribed absorbents can be used as a blend or included separately in different layers of the PSA film.
  • the prescribed absorbent allows the energy of the absorbed prescribed laser beam to more effectively act on the workpiece as compared to a laser beam absorbent (e.g. Al powder) comprising, as a constituent element, a metal that does not satisfy one or both of the specific heat and the heat conductivity. For instance, one reason for this can be presumed as below. It is noted that the scope of this invention is not limited by this. In particular, with decreasing specific heat of the laser beam absorbent (or simply the "absorbent" hereinafter), calories required to increase the absorbent's temperature by 1 °C will decrease. Because of this, when the energy of the absorbed prescribed laser beam is converted to heat and the workpiece is heated to a temperature required for the machining, the energy loss associated with heating the absorbent itself can be reduced.
  • a laser beam absorbent e.g. Al powder
  • the energy of the absorbed prescribed laser beam can be more efficiently used to heat the workpiece.
  • the present inventors have focused on that, after a PSA film using Al powder as the absorbent was applied to a workpiece and the workpiece was cut with a prescribed laser beam, heat damage was found in the surroundings of the cut area in the PSAfilm as well. This suggests that part of the energy of the absorbed prescribed laser beam is not directed to the workpiece and is wasted through dispersion in in-plane directions (divergent directions) of the PSAfilm.
  • the dispersion of heat in in-plane directions of the PSA film can be inhibited to conduct the energy of the absorbed prescribed laser beam to the area being processed in the workpiece efficiently. It is presumed that because of these reasons, according to a laser beam absorbent that has (as a constituent element) a metal having a specific heat of lower than 900 J/kg K and a heat conductivity of lower than 200 W/m ⁇ K, a workpiece can be efficiently processed with the prescribed laser beam.
  • Fe has a specific heat of 456 J/kg•K and a heat conductivity of 78.2 W/m•K
  • Mn has a specific heat of 486 J/kg•K and a heat conductivity of 7.8 W/m•K
  • Ti has a specific heat of 528 J/kg•K and a heat conductivity of 21.6 W/m•K
  • Zn has a specific heat of 394 J/kg•K and a heat conductivity of 119.5 W/m•K.
  • Examples of other metal that satisfies the specific heat of lower than 900 J/kg•K and the heat conductivity of lower than 200 W/m•K include Ni and Co which are iron-group metals.
  • Other examples include Zr, Mo and Cr.
  • Al has a specific heat of 917 J/kg ⁇ K and a heat conductivity of 238 W/m ⁇ K.
  • the concept of prescribed absorbent here does not include Al power or alumina.
  • the specific heat of the metal in the prescribed absorbent can be, for instance, below 600 J/kg ⁇ K or below 500 J/kg ⁇ K.
  • the minimum specific heat of the metal is not particularly limited. From the standpoint of facilitating the decomposition and disappearance of the PSA film by the heat conducted from the prescribed absorbent, in some embodiments, the metal may have a specific heat of, for instance, 200 J/kg ⁇ K or higher, 300 J/kg ⁇ K or higher, 350 J/kg ⁇ K or higher, or even 400 J/kg ⁇ K or higher.
  • the metal in the prescribed absorbent may have a heat conductivity of, for instance, lower than 150 W/m ⁇ K, lower than 125 W/m ⁇ K, or even lower than 100 W/m ⁇ K.
  • the minimum specific heat of the metal is not particularly limited. From the standpoint of facilitating the decomposition and disappearance of the PSAfilm by the heat that is conducted from the prescribed absorbent heated with the prescribed laser beam, in some embodiments, the metal may have a heat conductivity of, for instance, 20 W/m ⁇ K or higher, 40 W/m ⁇ K or higher, or even 60 W/m ⁇ K or higher.
  • the heat conductivity of the metals in the prescribed absorbent refers to the sum of multiplication products between the heat conductivities of the metal species and the molar fractions of the corresponding metal species in the total number of moles of all metals in the prescribed absorbent. The same applies to the specific heat of the prescribed absorbent that comprises several metal species.
  • one, two or more species can be preferably used, selected from the group consisting of metals belonging to any of Group 4 to Group 12 (more preferably any of Group 4 to Group 10) in the Periodic Table and metal compounds comprising these metals as constituent elements.
  • the use of such a prescribed absorbent can efficiently increase the prescribed laser beam absorbance.
  • the metal compounds comprising these metals as constituent elements are more preferable.
  • a metal compound comprising the metal as a constituent element tend to have lower specific heat and heat conductivity values.
  • the prescribed absorbent it is preferable to use a metal compound comprising, as a constituent element, a metal that satisfies (has) preferable specific heat and heat conductivity values disclosed herein.
  • the metal compound that can be used as the prescribed absorbent may be, for instance, an oxide, sulfide, carbide, nitride, hydroxide or oxyhydroxide of a metal that satisfies (has) preferable specific heat and heat conductivity values disclosed herein.
  • the metal compound that can be used as the prescribed absorbent include an organometallic compound (a coordination compound, etc.) that includes ions of the metal.
  • an organometallic compound a coordination compound, etc.
  • oxides, sulfides, carbides and nitrides of the metals are preferable and the oxides are particularly preferable.
  • oxides include, but are not limited to, iron oxides (FeO, Fe 3 O 4 , Fe 2 O 3 , etc.), manganese dioxide, titanium black, chromium oxides (CrO, Cr 2 O 3 , etc.) and ferrite.
  • the sulfides include, but are not limited to, iron sulfides and molybdenum sulfides.
  • the prescribed absorbent content is not particularly limited and it can be suitably selected, for instance, in a range of 0.01 % or greater and 20 % or less by weight.
  • the prescribed absorbent content can be, for instance, 0.05 % by weight or greater, 0.1 % by weight or greater, 0.3 % by weight or greater, 0.5 % by weight or greater, or even 0.8 % by weight or greater.
  • the prescribed laser beam absorbance tends to increase.
  • an excessive prescribed absorbent content may facilitate dispersion of the energy of the absorbed prescribed laser beam in in-plane directions, resulting in a greater energy loss.
  • the prescribed absorbent content is usually suitably 15 % by weight or less, preferably 10 % by weight or less, more preferably 7 % by weight or less, possibly 5 % by weight or less, or even less than 5 % by weight.
  • the PSAfilm disclosed herein may secondarily include a non-prescribed laser beam absorbent as necessary.
  • a non-prescribed laser beam absorbent used secondarily may be referred to as a "secondary absorbent.”
  • the secondary absorbent may be used for purposes such as increasing the PSA film's absorbance, adjusting the transmittance or reflectance, adjusting the appearance, etc.
  • the secondary absorbent it is possible to use metals such as aluminum, copper, silver and gold; metal compounds such as oxides, nitrides and carbides of these metals; carbon black; organic compounds such as phthalocyanine-based compounds, cyanine-based compounds, aminium-based compounds, naphthalocyanine-based compounds, naphthoquinone-based compounds, diimmonium-based compounds and anthraquinone-based compounds.
  • metals such as aluminum, copper, silver and gold
  • metal compounds such as oxides, nitrides and carbides of these metals
  • carbon black organic compounds such as phthalocyanine-based compounds, cyanine-based compounds, aminium-based compounds, naphthalocyanine-based compounds, naphthoquinone-based compounds, diimmonium-based compounds and anthraquinone-based compounds.
  • the secondary absorbent is preferably used in an amount equivalent to less than 50 % by weight of the total amount of laser beam absorbents in the PSAfilm (i.e. the combined amount of the prescribed and non-prescribed absorbents); or it can be less than 25 %, less than 10 %, or even less than 5 %.
  • the PSA film can also be essentially free of a secondary absorbent.
  • being essentially free of a secondary absorbent means that a secondary absorbent is not used at least intentionally.
  • the total amount of laser beam absorbents in the PSAfilm is suitably 25 % by weight or less of the PSAfilm, or more preferably 20 % by weight or less, 15 % by weight or less, or 10 % by weight or less.
  • the carbon black (CB) content of the PSA film is preferably below 0.3 % by weight, more preferably below 0.1 % by weight, yet more preferably below 0.05 % by weight, or particularly preferably below 0.02 % by weight. With decreasing CB content, the PSAfilm tends to have greater anti-blackening properties.
  • the PSAfilm may be essentially free of CB. In other words, in the PSA film, CB may not be used at least intentionally.
  • the PSA film disclosed herein includes the prescribed absorbent; and therefore, a workpiece can be efficiently processed even when CB is not used or used only in a limited amount as described above. According to such a PSAfilm, an increase in efficiency of workpiece machining can be favorably obtained with anti-blackening properties.
  • a black metal compound can be preferably used as the prescribed absorbent.
  • the laser beam absorbance of the PSAfilm can be efficiently increased.
  • a PSA film having an aforementioned preferable laser beam absorbance can be favorably obtained.
  • Studies by the present inventors have revealed that, surprisingly, unlike CB, such a black metal compound is less likely to cause black residues.
  • an increase in efficiency of workpiece machining can be favorably obtained with anti-blackening properties.
  • black metal compound examples include, but are not limited to, iron oxides, manganese dioxide, titanium black, chromium oxides, iron sulfides and molybdenum sulfides.
  • Black metal compounds preferable in terms of availability include iron oxides (e.g. FeO, Fe 3 O 4 , etc.), titanium black and manganese dioxide.
  • the titanium black refers to black particles having titanium atoms and preferably black particles of titanium oxynitride, lower titanium oxides, etc. Examples of particularly preferable black metal compounds include iron oxides and titanium black.
  • the amount of the black metal compound in the PSA film can be, for instance, 0.05 % by weight or greater. From the standpoint of increasing the laser beam absorbance, it can be 0.1 % by weight or greater, 0.3 % by weight or greater, 0.5 % by weight or greater, or even 0.8 % by weight or greater. From the standpoint of reducing the energy loss caused by dispersion in in-plane directions of the PSA film, the amount of the black metal compound included is usually suitably 15 % by weight or less, preferably 10 % by weight or less, more preferably 7 % by weight or less, possibly 5 % by weight or less, or even less than 5 % by weight.
  • the ratio of the black metal compound in the prescribed absorbent can be, for instance, higher than 50 % by weight, 70 % by weight or higher, 90 % by weight or higher, or even essentially 100 % by weight.
  • the backside of the PSAfilm preferably has a lightness L* below 95.
  • the backside of the PSA film may have a lightness L* below 90, below 70, below 60, below 50, below 45, or even below 40.
  • the minimum lightness L* is not particularly limited. From the standpoint of the design capability, surface printability, weathering resistance, easy identification, etc., it is usually suitably 20 or higher, or possibly 30 or higher.
  • the backside of the PSA film may have a lightness L* of, for instance, 40 or higher, or even 50 or higher.
  • the chromatic coordinate a* of the backside of the PSA film is not particularly limited.
  • the backside of the PSA film may have a chromatic coordinate a* in a range, for instance, between -15 and +15, between -10 and +10, between -5 and +7, between -3 and +5, between -1.5 and +3, or even between 0 and +2.
  • the chromatic coordinate b* of the backside of the PSA film is not particularly limited. For instance, it can be in a range between -15 and +15, between -10 and +10, between -5 and +5, between -3 and +2, or even between -1.5 and +1.
  • suitable lightness L* and chromatic coordinates a* and b* can be selected in the same ranges described above for those of the backside of the PSA film.
  • the lightness L* and chromatic coordinates a* and b* can be each comparable or different between the front face and backside of the PSA film.
  • the lightness L* and chromatic coordinates a* and b* refer to the lightness L* and chromatic coordinates a* and b* specified by the L*a*b* color space based on the definition suggested by the International Commission on Illumination in 1976 or specified by JIS Z8729.
  • the lightness L* and chromatic coordinates a* and b* can be determined, using a colorimeter (trade name "CR-400" available from Konica Minolta Holdings Inc.; chromameter).
  • the lightness L* and chromatic coordinates a* and b* can be adjusted through selection of a species of laser beam absorbent and its amount used, the use or absence of use of other colorant(s) besides the laser beam absorbent, the species of colorant and its amount used if any, and so on.
  • the thickness of the PSAfilm is not particularly limited. It is usually suitably about 10 ⁇ m to 200 ⁇ m. From the standpoint of the handling properties of the PSA film, in some embodiments, the PSA film may have a thickness of, for instance, 20 ⁇ m or greater, 25 ⁇ m or greater, 40 ⁇ m or greater, 55 ⁇ m or greater, or even 80 ⁇ m or greater. From the standpoint of rapid and precise laser machining, the thickness of the PSA film can be, for instance, 150 ⁇ m or less, 120 ⁇ m or less, or even 100 ⁇ m or less. In some cases, the thickness of the PSA film can be 80 ⁇ m or less, 60 ⁇ m or less, or even 50 ⁇ m or less.
  • the PSAfilm disclosed herein comprises a resin film as the substrate.
  • the resin material forming the resin film include, but are not limited to, polyester resins such as polyethylene terephthalate (PET) and polybutylene terephthalate (PBT); and polyolefin resins such as polyethylene, polypropylene, ethylene-propylene copolymers and polypropylene-polyethylene blend resins; as well as vinyl chloride resins (typically a soft vinyl chloride resin), vinyl acetate resins and polyamide resins.
  • the substrate may have a monolayer structure or a multilayer structure having two or more layers.
  • a multilayer substrate can be preferably used.
  • the multilayer substrate has an advantage that, for instance, the front face (to be applied to the workpiece) and the backside can be easily differentiated in function and appearance.
  • the resin materials forming the respective layers can be of the same or different species.
  • the multilayer substrate can have, for instance, a two-layer to five-layer structure, or a two-layer or three-layer structure. In an embodiment, a three-layer substrate can be preferably used.
  • the substrate may have a monolayer structure.
  • the monolayer substrate can be advantageous in terms of productivity and quality consistency of the substrate.
  • a polyolefinic resin film or a polyester-based resin film can be preferably used as the resin film.
  • the polyolefinic resin film refers to a resin film whose primary component is a polyethylene (PE) resin and/or a polypropylene (PP) resin.
  • the primary component refers to a component whose content is higher than 50 % by weight unless otherwise specified.
  • the polyolefinic resin film may include a PE resin and/or a PP resin and the total amount of the PE and PP resins may be more than 50 % by weight of the polyolefin resin film, or preferably 70 % by weight or more, for instance, 85 % by weight or more. In the resin film that includes a PE resin, but is free of a PP resin, the total amount equals to the PE resin content.
  • the PE resin may include, as the primary component, various kinds of polymer (ethylenic polymer) in which ethylene is the primary monomer unit. It can be a PE resin essentially formed of one, two or more species of ethylenic polymer.
  • the ethylenic polymer can be ethylene homopolymer or a copolymer (random copolymer, block copolymer, etc.) of ethylene as the primary monomer and other ⁇ -olefin as a secondary monomer.
  • ⁇ -olefins include ⁇ -olefins with 3 to 10 carbon atoms, such as propylene, 1-butene (possibly a branched 1-butene), 1-hexene, 4-methyl-1-pentene and 1-octene.
  • a preferable PE resin includes, as the primary component, an ethylenic polymer in which an ⁇ -olefin as the secondary monomer is copolymerized in an amount up to 10 % by weight (typically up to 5 % by weight).
  • the PE resin may include a copolymer of ethylene and a functional group-containing monomer (a monomer having a different functional group) in addition to the polymerizable functional group; or it can be a PE resin obtained by copolymerizing such a functional group-containing monomer with an ethylenic polymer, etc.
  • Examples of the copolymer of ethylene and the functional group-containing monomer include ethylenevinyl acetate copolymer (EVA), ethylene-acrylic acid copolymer (EAA), ethylene-methacrylic acid copolymer (EMAA), ethylene-methyl acrylate copolymer (EMA), ethylene-ethyl acrylate copolymer (EEA), ethylene-methyl methacrylate copolymer (EMMA), and ethylene-(meth)acrylic acid (i.e. acrylic acid and/or methacrylic acid) copolymer crosslinked with a metal ion.
  • EVA ethylenevinyl acetate copolymer
  • EAA ethylene-acrylic acid copolymer
  • EAA ethylene-methacrylic acid copolymer
  • EMAA ethylene-methyl acrylate copolymer
  • EMMA ethylene-methyl methacrylate copolymer
  • EMMA ethylene-(meth)acrylic acid
  • the density of the PE resin is not particularly limited.
  • the concept of PE resin here includes all of high-density polyethylene (HDPE), middle-density polyethylene (MDPE), low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE).
  • the PE resin may have a density of, for instance, about 0.90 g/cm 3 to 0.94 g/cm 3 .
  • Preferable PE resins include LDPE and LLDPE.
  • the PP resin may include, as the primary component, various species of polymer (propylene-based polymer) formed from propylene as the primary monomer unit, that is, polymer in which propylene accounts for more than 50 % by weight of all the monomers (starting monomers).
  • the PP resin can be essentially formed of one, two or more species of propylene-based polymer.
  • the concept of propylene-based polymer encompasses propylene homopolymer as well as random and block copolymers of propylene and other monomer(s) (random polypropylene and block polypropylene).
  • the substrate preferably includes a laser beam-absorbing layer.
  • the laser beam-absorbing layer preferably includes the prescribed absorbent.
  • at least one layer is preferably a laser beam-absorbing layer that includes the prescribed absorbent.
  • the substrate including the laser beam-absorbing layer can be configured so that the PSA film has a laser beam absorbance of 20 % or higher.
  • the substrate has a laser beam absorbance of, for instance, possibly 15 % or higher, usually suitably 20 % or higher, further possibly 25 % or higher, 30 % or higher, 45 % or higher, 60 % or higher, or even 75 % or higher.
  • the laser beam absorbance of the substrate can be 100 %.
  • the substrate has a laser beam absorbance of preferably 95 % or lower, or possibly 90 % or lower.
  • the substrate's transmittance and reflectance can be suitably selected in the same ranges described above for those of the PSA film.
  • the laser beam absorbent added to the substrate solely one species or a combination of two or more species can be used among the aforementioned same examples of the laser beam absorbent that can be used in the PSAfilm.
  • the laser beam absorbent includes the prescribed absorbent
  • solely one species or a combination of two or more species can be used among the aforementioned same examples of the prescribed absorbent that can be used in the PSAfilm.
  • the laser beam absorbent content and the prescribed absorbent content in the substrate the respective sets of examples of those in the PSA film can be applied.
  • suitable lightness L* and chromatic coordinates a* and b* can be selected in the same ranges described above for those of the backside of the PSA film.
  • suitable lightness L* and chromatic coordinates a* and b* can be selected in the same ranges described above for those of the front face of the PSA film.
  • the method for forming the substrate is not particularly limited.
  • a suitable method can be employed among heretofore known extrusion methods, for instance, inflation extrusion method, casting method, and like methods.
  • the substrate may be unstretched or stretched uniaxially, biaxially, etc. It is possible to obtain a multilayer substrate by employing a single method or a suitable combination of methods among a method where resin compositions corresponding to the respective layers are molded simultaneously (e.g. by a multilayer inflation molding), a method where the respective layers are individually formed and then bonded together, a method where a pre-formed layer is casted with another layer, and so on.
  • additives can be added as necessary.
  • additives include fire-retardant, anti-static agent, photo-stabilizer (radical scavenger, UV absorbent, etc.) and antioxidant.
  • a surface of the substrate may be subjected as necessary to a suitable surface treatment to enhance the tightness of adhesion to its adjacent material or facilitate its release therefrom.
  • Examples of the surface treatment to enhance the tightness of adhesion include corona discharge treatment, acid treatment, UV irradiation, plasma treatment and primer coating. Such a surface treatment can be preferably applied to both the front face (i.e. the surface on the side to be provided with the PSA layer) and the backside of the substrate.
  • the surface treatment to facilitate the release can be carried out, using a general silicone-based, long-chain alkyl-based, fluorine-based or like release agent. Such a surface treatment can be preferably applied to the backside of the substrate.
  • the substrate's thickness is not particularly limited and can be about, for instance, 5 ⁇ m to 150 ⁇ m. From the standpoint of the handling properties of the substrate or of the PSA film having the substrate, in some embodiments, the substrate may have a thickness of, for instance, 15 ⁇ m or greater, 20 ⁇ m or greater, 35 ⁇ m or greater, 50 ⁇ m or greater, or even 75 ⁇ m or greater. From the standpoint of rapid and precise laser machining, in some embodiment, the substrate's thickness can be, for instance, 130 ⁇ m or less, 110 ⁇ m or less, or even 90 ⁇ m or less. In some cases, the substrate's thickness can be 70 ⁇ m or less, 50 ⁇ m or less, or even 40 ⁇ m or less.
  • the thickness of the laser beam-absorbing layer in the substrate including a laser beam-absorbing layer, the combined thickness of these layers can be, for instance, 3 ⁇ m or greater, 5 ⁇ m or greater, or even 10 ⁇ m or greater. From the standpoint of rapid and precise laser machining, in some embodiments, the thickness of the laser beam-absorbing layer (i.e. a place where the laser beam absorbent is present) may be, for instance, 20 % or more, 50 % or more, 70 % or more, or even 90 % or more of the thickness of the entire substrate. It is noted that in a monolayer substrate formed of a laser beam-absorbing layer or in a substrate formed of several laser beam-absorbing layers, the thickness of the laser beam-absorbing layer(s) accounts for 100 % of the thickness of the entire substrate.
  • the PSA forming the PSA layer is not particularly limited.
  • a rubber-based PSA acrylic PSA, polyester-based PSA, polyurethane-based PSA, silicone-based PSA, or the like.
  • a rubber-based PSA or an acrylic PSA can be preferably used.
  • the PSA layer may have a monolayer structure, or a laminate structure having two or more layers of different compositions.
  • Examples of the rubber-based PSA include natural rubber-based PSA and synthetic rubber-based PSA.
  • a preferable acrylic PSA comprises, as the base polymer (the primary component among polymers), for instance, an acrylic polymer having a monomer composition comprising primarily an alkyl (meth)acrylate such as butyl (meth)acrylate and 2-ethylhexyl (meth)acrylate and further comprising as necessary a modifying monomer copolymerizable with the alkyl (meth)acrylate.
  • the modifying monomer include hydroxyl group-containing monomers such as 2-hydroxyethyl (meth)acrylate; carboxyl group-containing monomers such as (meth)acrylic acid; styrene-based monomers such as styrene; vinyl esters such as vinyl acetate.
  • Such an acrylic PSA can be obtained by a commonly used polymerization method such as solution polymerization, emulsion polymerization, and ultraviolet ray (UV) polymerization.
  • the PSAlayer may include a laser beam absorbent as necessary.
  • the PSA layer can be a laser beam-absorbing layer.
  • at least one layer among them can include a laser beam absorbent.
  • the laser beam absorbent content of the PSA layer is usually suitably 5 % by weight or less. From the standpoint of the adhesive properties, it is preferably 3 % by weight or less, or possibly 1 % by weight or less.
  • the art disclosed herein can be preferably practiced in an embodiment where the PSAlayer is essentially free of a laser beam absorbent.
  • the PSAlayer can contain optional additives as necessary.
  • additives include crosslinking agent, tackifier, softening agent, fire retardant, anti-static agent, colorant (pigment, dye, etc.), photo-stabilizer (radical scavenger, UV absorbent, etc.) and antioxidant.
  • the thickness of the PSAlayer can be suitably selected so that suitable adhesive properties can be obtained in accordance with the application of the PSA film. It is usually suitable that the PSAlayer has a thickness of 0.5 ⁇ m to 50 ⁇ m. From the standpoint of enhancing the tightness of adhesion to the workpiece, in some embodiments, the thickness of the PSA layer can be, for instance, 1.5 ⁇ m or greater, 3 ⁇ m or greater, 5 ⁇ m or greater, or even 7 ⁇ m or greater. From the standpoint of rapid and precise laser machining, in some embodiments, the PSA layer may have a thickness of, for instance, 30 ⁇ m or less, 20 ⁇ m or less, or even 15 ⁇ m or less.
  • the PSA film disclosed herein can be preferably used in an embodiment where it is applied to a workpiece to be processed with a short-wavelength laser having a center wavelength of 900 nm to 1100 nm and is laser-cut in this state along with the workpiece being laser-machined.
  • the type of laser machining applied to the workpiece bearing the PSA film disclosed herein is not particularly limited. For instance, it can be cutting, hole-making, carving and engraving.
  • the material of the workpiece is not particularly limited as long as it can be cut with the prescribed laser beam.
  • the material include metal and metalloid materials such as iron, iron alloys (carbon steel, stainless steel, chromium steel, nickel steel, etc.), aluminum, aluminum alloys, nickel, tungsten, copper, copper alloys, titanium, titanium alloys and silicon; resin materials such as polyolefin resins, polycarbonate resins and acrylic resins; ceramic materials such as alumina, silica, sapphire, silicon nitride, tantalum nitride, titanium carbide, silicon carbide, gallium nitride and plaster; glass materials such as aluminosilicate glass, soda lime glass, soda aluminosilicate glass and quartz glass; cellulose-based materials such as paper, cardboard, wood materials and plywood; and laminates and composites of these.
  • metal and metalloid materials such as iron, iron alloys (carbon steel, stainless steel, chromium steel, nickel steel, etc.), aluminum, aluminum alloys, nickel,
  • the workpiece include metal materials such as iron, aluminum, copper, titanium and alloys (stainless steel, etc.) comprising the respective metals as primary components.
  • the shape of the workpiece is not particularly limited and can be planar, cylindrical, in a rough mass, etc.
  • the PSA film disclosed herein can be preferably used in a state applied to the laser-irradiated side surface of a workpiece.
  • the PSA film can be applied to the surface on the reverse side (backside) of the laser-irradiated side.
  • the short-wavelength laser for instance, a fiber laser having a center wavelength of about 1050 nm or a diode laser having a center wavelength of about 950 nm can be used.
  • LDPE low density polyethylene (product name "PETROTHENE 186R” available from Tosoh Corporation) Fe 3 O 4 : triiron tetroxide powder of 250 nm in mean particle diameter
  • TiO 2 titanium dioxide powder of 0.2 ⁇ m in mean particle diameter
  • Al aluminum flake of 2 ⁇ m in mean particle diameter
  • CB carbon black powder of 20 nm in mean particle diameter
  • PSA composition P1 Amixture of 100 parts of natural rubber, 70 parts of a tackifier (product name QUINTONE A100 available from Zeon Corporation), 2 parts of an anti-aging agent (product name NOCRAC NS-5 available from Ouchi Shinko Chemical Industrial Co., Ltd.) and 3 parts of an isocyanate-based crosslinking agent (product name CORONATE L available from Nippon Polyurethane Industry Co., Ltd.) and toluene.
  • a tackifier product name QUINTONE A100 available from Zeon Corporation
  • an anti-aging agent product name NOCRAC NS-5 available
  • the ratio between the TiO 2 masterbatch and LDPE was changed to obtain a polyolefin resin composition containing 6.0% TiO 2 . Otherwise in the same manner as resin film F1, was obtained a resin film F5. Using resin film F5 in place of resin film F1, but otherwise in the same manner as Example 1, was obtained a PSA film according to this Example.
  • Measurement system spectrophotometer under model number "U-4100" available from Hitachi High-Technologies Corporation
  • Measurement conditions applied detection mode, %T data mode, 750 nm/min scan rate, 1 nm sampling interval, automated slit control, photomultiplier voltage automated at 1, intensity control mode fixed, high resolution measurement OFF, no dimming film used, PbS sensitivity at 1, 10 mm cell length.
  • Measurement system spectrophotometer under model number "U-4100" available from Hitachi High-Technologies Corporation
  • Measurement conditions applied detection mode, %R data mode, 750 nm/min scan rate, 1 nm sampling interval, automated slit control, photomultiplier voltage automated at 1, intensity control mode fixed, high resolution measurement OFF, no dimming film used, PbS sensitivity at 1, 10 mm cell length.
  • each PSA film With respect to the backside of each PSA film, were determined the lightness and the chromatic coordinates.
  • the sample was cut out a 10 cm by 10 cm sample. The sample was placed on a SUS430 plate. Using a chromameter (CR-400 available from Konica Minolta Holdings Inc.), the lightness L* and chromatic coordinates a* and b* were determined at 5 spots in total, namely four corner spots and one center spot, in the sample. Two measurements were carried out at each measurement spot and the average value of the 10 measurements was used.
  • CR-400 available from Konica Minolta Holdings Inc.
  • the PSAfilm according to each Example was applied to the top face of the workpiece.
  • Alaser beam was irradiated onto the top face side of the workpiece to carry out a cutting test.
  • a fiber laser cutting machine TruLaser 5030 available from TRUMPF, center wavelength 1050 nm
  • linear laser cutting was carried out under the conditions shown below.
  • the workpieces could be cut well along with the PSAfilms. These PSAfilms showed excellent anti-blackening properties on the cut workpieces.
  • the prescribed-absorbent-free PSAfilm of Example 6 while the cutting of the PSAfilm itself was successful, that of the workpiece was unsuccessful under the aforementioned laser cutting conditions.
  • the prescribed-absorbent-free PSAfilm of Example 7 with the absorbance adjusted to at least 20 % by addition of CB, blackening of the cut workpiece was observed.
  • the laser cutting test was carried out at varied cutting speeds while keeping the rest of the laser cutting conditions unchanged to determine the maximum cutting speed (i.e. the maximum speed at which the workpiece can be cut).
  • the maximum cutting speeds of the PSA films of Examples 1 to 3 were found significantly higher than those of the PSA films of Examples 4 and 5.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)
EP18863312.7A 2017-09-27 2018-09-18 Film adhésif Withdrawn EP3689993A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017187004A JP7058096B2 (ja) 2017-09-27 2017-09-27 粘着フィルム
PCT/JP2018/034405 WO2019065358A1 (fr) 2017-09-27 2018-09-18 Film adhésif

Publications (2)

Publication Number Publication Date
EP3689993A1 true EP3689993A1 (fr) 2020-08-05
EP3689993A4 EP3689993A4 (fr) 2021-05-26

Family

ID=65902865

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18863312.7A Withdrawn EP3689993A4 (fr) 2017-09-27 2018-09-18 Film adhésif

Country Status (5)

Country Link
US (1) US20200248037A1 (fr)
EP (1) EP3689993A4 (fr)
JP (1) JP7058096B2 (fr)
CN (1) CN111108165B (fr)
WO (1) WO2019065358A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7326101B2 (ja) * 2019-10-07 2023-08-15 リンテック株式会社 保護膜形成用フィルム及び保護膜形成用複合シート
JP7326100B2 (ja) * 2019-10-07 2023-08-15 リンテック株式会社 保護膜形成用フィルム及び保護膜形成用複合シート
JP7326103B2 (ja) * 2019-10-07 2023-08-15 リンテック株式会社 保護膜形成用フィルム及び保護膜形成用複合シート
JP7326102B2 (ja) * 2019-10-07 2023-08-15 リンテック株式会社 保護膜形成用フィルム及び保護膜形成用複合シート
JP2021127360A (ja) 2020-02-10 2021-09-02 日東電工株式会社 粘着シート
WO2021187135A1 (fr) * 2020-03-16 2021-09-23 日東電工株式会社 Film adhésif
JP6945090B1 (ja) * 2020-08-31 2021-10-06 日東電工株式会社 粘着シート、表示装置および積層体

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4595284B2 (ja) 2003-01-28 2010-12-08 三菱瓦斯化学株式会社 炭酸ガスレーザーによる孔あけ用補助シート
JP2006111659A (ja) * 2004-10-12 2006-04-27 Nitto Denko Corp レーザー加工用粘着シート及びこれを用いたレーザー加工品の製造方法
CN101143364A (zh) * 2007-10-08 2008-03-19 南开大学 超声检测窄脉宽激光除污机及其除污方法
JPWO2011108442A1 (ja) * 2010-03-04 2013-06-27 リンテック株式会社 粘着シート
JP5717420B2 (ja) * 2010-11-30 2015-05-13 日立マクセル株式会社 切削加工用粘着テープ
JP5711516B2 (ja) * 2010-12-15 2015-04-30 リンテック株式会社 粘着シート
JP2013018964A (ja) 2011-06-17 2013-01-31 Nitto Denko Corp 粘着フィルム
JP6009812B2 (ja) 2011-06-17 2016-10-19 日東電工株式会社 粘着フィルム
JP6075978B2 (ja) * 2012-06-25 2017-02-08 日東電工株式会社 粘着フィルム
JP5976503B2 (ja) * 2012-11-01 2016-08-23 早川ゴム株式会社 レーザー接合用粘着テープ
EP3012288A1 (fr) * 2014-10-21 2016-04-27 Nitto Denko Corporation Film adhésif sensible à la pression pour des applications de coupe de faisceau laser
JP6401043B2 (ja) * 2014-12-24 2018-10-03 株式会社きもと レーザーダイシング用補助シート
EP3397490A1 (fr) * 2015-12-30 2018-11-07 3M Innovative Properties Company Films adhésifs absorbant les infrarouges et procédés associés
JP2017187004A (ja) 2016-04-08 2017-10-12 トヨタ自動車株式会社 燃料配管の保護部材
WO2018159591A1 (fr) * 2017-03-03 2018-09-07 日東電工株式会社 Film adhésif

Also Published As

Publication number Publication date
CN111108165A (zh) 2020-05-05
EP3689993A4 (fr) 2021-05-26
WO2019065358A1 (fr) 2019-04-04
JP7058096B2 (ja) 2022-04-21
JP2019059879A (ja) 2019-04-18
CN111108165B (zh) 2022-05-17
US20200248037A1 (en) 2020-08-06

Similar Documents

Publication Publication Date Title
EP3689993A1 (fr) Film adhésif
EP2722375A1 (fr) Film adhésif
EP2679332B1 (fr) Film adhésif sensible à la pression
EP2722376A1 (fr) Film adhésif
EP3012288A1 (fr) Film adhésif sensible à la pression pour des applications de coupe de faisceau laser
US8455083B2 (en) Pressure-sensitive adhesive sheet
US20180370205A1 (en) Infrared absorbing adhesive films and related methods
US8980399B2 (en) Pressure-sensitive adhesive sheet
EP2330168A1 (fr) Feuille de protection de film de peinture
EP2196512B1 (fr) Feuille de protection de film de peinture
WO2010100978A1 (fr) Feuille d'adhésif autocollant
WO2021187135A1 (fr) Film adhésif
EP4105291A1 (fr) Feuille adhésive
JP7507575B2 (ja) 粘着フィルム
JP2023138000A (ja) レーザ加工用粘着シート
JP2021187908A (ja) 表面保護フィルム
JP2004018683A (ja) 粘着テープ

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20200417

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Free format text: PREVIOUS MAIN CLASS: C09J0007380000

Ipc: C09J0007220000

A4 Supplementary search report drawn up and despatched

Effective date: 20210429

RIC1 Information provided on ipc code assigned before grant

Ipc: C09J 7/22 20180101AFI20210422BHEP

Ipc: C09J 7/38 20180101ALI20210422BHEP

Ipc: B32B 27/00 20060101ALI20210422BHEP

Ipc: C09J 201/00 20060101ALI20210422BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

18W Application withdrawn

Effective date: 20230714