Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
  • H01P3/00—Waveguides; Transmission lines of the waveguide type
  • H01P3/12—Hollow waveguides
  • H01P3/121—Hollow waveguides integrated in a substrate
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
  • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
  • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
  • G01N27/20—Investigating the presence of flaws
  • G01N27/205—Investigating the presence of flaws in insulating materials
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
  • H01P1/00—Auxiliary devices
  • H01P1/165—Auxiliary devices for rotating the plane of polarisation
  • H01P1/17—Auxiliary devices for rotating the plane of polarisation for producing a continuously rotating polarisation, e.g. circular polarisation
  • H01P1/173—Auxiliary devices for rotating the plane of polarisation for producing a continuously rotating polarisation, e.g. circular polarisation using a conductive element
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
  • H01P1/00—Auxiliary devices
  • H01P1/20—Frequency-selective devices, e.g. filters
  • H01P1/207—Hollow waveguide filters
  • H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
  • H01P1/2088—Integrated in a substrate

Definitions

• the present invention relates to a microwave component of the transmission line type integrated into the substrate, comprising a waveguide comprising at least one upper layer having at least one electrically conductive surface, a lower layer having at least one electrically conductive surface, and a central layer defining a propagation zone of an electromagnetic wave, the propagation zone extending along an axis of propagation.
• GIS substrate-integrated waveguide
• Such GIS components are made from substrate layers commonly used in the field of electronics, which makes the manufacture of such GIS components inexpensive.
• GIS components generally have a light structure, and generally do not require shielding, while allowing a high density of integration.
• GIS components constitute a serious alternative to conventional waveguides, such as 3D metal waveguides which do not generally have such advantages, and printed circuits which are not as efficient as necessary. today for some applications, especially for millimeter-wave applications (30 GHz to 300 GHz).
• An object of the invention is therefore to provide a simple microwave component for providing a filter function of an electromagnetic wave and to respond to several applications.
• the subject of the invention is a microwave component of the aforementioned type, characterized in that the upper layer comprises at least one through-hole, the lower layer comprises at least one through-hole, and in that an electrically conductive wire is received through the upper hole, the propagation zone and said lower hole, the conductive wire being electrically connected to the electrically conductive surface of the upper layer and the electrically conductive surface of the lower layer.
• the microwave component according to the invention may comprise one or more of the following characteristics, taken separately or in any technically possible combination:
• the propagation zone comprises a cavity, the cavity being delimited by the upper layer, the lower layer and the central layer, the upper hole and the lower hole opening into the cavity, the conductive wire passing through the cavity;
• the upper layer comprises a plurality of through holes
• the lower layer comprises a plurality of through-holes, a plurality of electrically conductive wires each being received through one of the said upper holes, the propagation zone and one of the said lower holes; each conductive wire being electrically connected to the electrically conductive surface of the upper layer and to the electrically conductive surface of the lower layer;
• the set of upper holes receiving a conductive wire has a distribution having at least one plane of symmetry
• At least one of said lower holes and at least one of said upper holes do not receive conductive wire and are arranged opposite one another;
• an electrically conductive concealment member covers at least one lower hole and / or an upper hole in which no conductive wire is received;
• the conductive occulting member is an electrically conductive adhesive tape or an electrically conductive plate
• At least a portion of the upper holes are distributed over the upper layer so as to form a regular network
• the upper hole and the lower hole receiving said conductive wire are arranged opposite one another;
• the upper layer, the lower layer and the central layer comprises an electrically conductive upper sub-layer, an electrically conductive lower sub-layer and a dielectric central sub-layer, interposed between the underlayer upper and lower sub-layer;
• the waveguide is capable of guiding an electromagnetic wave having a wavelength greater than or equal to a predetermined minimum wavelength, each upper and lower hole having a projection respectively on the electrically conductive surface of the upper layer; and on the electrically conductive surface of the lower layer, a larger dimension strictly smaller than the predetermined minimum wavelength, in particular less than one-fifth of the predetermined minimum wavelength, preferably less than one-tenth of the length of the predetermined minimum wave;
• each conducting wire is fixed to the upper layer and to the lower layer, in particular by welding, and
• each lower hole and each upper hole have edges comprising an electrically conductive coating.
• the invention also relates to a method for adjusting a microwave component comprising the following steps:
• a microwave component of the transmission line type integrated into the substrate comprising a waveguide comprising at least one upper layer having an electrically conductive surface, a lower layer having an electrically conductive surface, and a central layer; defining a propagation zone of an electromagnetic wave, the propagation zone extending along an axis of propagation, the upper layer delimiting one or more upper hole (s) through, and the layer lower bounding one or more lower hole (s) through;
• the installation step comprising, for each wire:
• the adjusting method may include the following optional feature: the top layer comprises a plurality of through-holes, and the bottom layer comprises a plurality of through-holes, the method comprising providing at least a plurality of electrically conductive wires; the method further comprising a step of determining a set of lower holes and a set of upper holes into which to insert said lead wires, so the waveguide has a predetermined transfer function, each upper hole of the set of upper holes being associated with a lower hole of the set of lower holes;
• FIG. 1 is a schematic sectional view orthogonal to the axis of propagation of a first embodiment of a component according to the invention
• Figure 2 is a schematic top view of the component of Figure 2;
• FIG. 3 to 5 are schematic top views similar to that of Figure 2 other embodiments of components according to the invention.
• FIGS. 1 and 2 A first embodiment of a microwave component 10 according to the invention is illustrated in FIGS. 1 and 2.
• the microwave component 10 is for example a filter, in particular a microwave filter band-pass, low-pass, high-pass or band-stop.
• the microwave component 10 is for example a multiplexer, a coupler, a divider, a combiner, an antenna, an oscillator, an amplifier, a load, a circulator or an insulator.
• the microwave component 10 is here of the "guide integrated in the substrate” type.
• the component 10 comprises a waveguide 12 for guiding an electromagnetic wave along an X-X propagation axis, the electromagnetic wave having a wavelength greater than or equal to a predetermined minimum wavelength.
• the waveguide 12 comprises an upper layer 14, a lower layer 16, and a core layer 18 defining a propagation zone 20 of the electromagnetic wave, extending along the X-X propagation axis.
• the waveguide 12 further comprises a plurality of electrically conductive wires 22 passing through the propagation zone 20, as hereinafter described.
• the upper layer 14 extends along a plane XY, defined by the axis of propagation XX and by a transverse axis YY orthogonal to the axis of propagation XX.
• transverse direction a direction parallel to the transverse axis YY.
• the upper layer 14 comprises an electrically conductive upper sublayer 24A, an electrically conductive lower sublayer 24B and a dielectric core sublayer 24C interposed between the upper sub-layer 24A and the sub-layer 24A. lower layer 24B.
• the upper layer 14 thus forms a substrate.
• electrically conductive element means that said element has an electrical conductivity greater than 1 * 10 6 S. m- 1 , preferably equivalent to that of a metal of the copper, silver or aluminum type.
• dielectric element means that said element has a relative dielectric permittivity greater than or equal to 1.
• the upper sub-layer 24A and the lower sub-layer 24B are for example made of copper.
• the central sub-layer 24C is for example made of epoxy resin, or Teflon.
• the upper layer 14 thus has an upper surface 26 electrically conductive and a lower surface 28 electrically conductive.
• the upper layer 14 comprises at least one upper through hole 30. Each upper hole 30 opens into the propagation zone 20.
• Each upper hole 30 passes through the upper sub-layer 24A, the lower sub-layer 24B and the central dielectric sub-layer 24C of the upper layer 14.
• Each upper hole 30 has, in projection on the upper surface 26 of the upper layer 14, a maximum dimension strictly less than the predetermined minimum wavelength, in particular less than one fifth of the predetermined minimum wavelength, preferably less than to one-tenth of the predetermined minimum wavelength. Radiation losses are thus avoided.
• Each upper hole 30 has here a circular cylindrical shape of revolution.
• Each upper hole 30 preferably has edges 38 comprising an electrically conductive coating.
• the upper sub-layer 24A and the lower sub-layer 24B of the upper layer 14 are then electrically connected.
• the edges 38 are devoid of such an electrically conductive coating.
• the upper layer 14 comprises a plurality of through holes 30, in particular eight upper holes 30. through. Alternatively, it has any number of through holes.
• the upper holes 30 are distributed along the axis of propagation X-X in pairs of two, the two upper holes 30 of the same pair being aligned in the transverse direction Y-Y.
• the upper layer 14 thus has, successively along the X-X axis, an input torque 32, two intermediate pairs 34 and an output torque 36.
• the distance in the Y-Y direction transverse between the two upper holes 30 of the intermediate pairs 34 is substantially identical.
• the respective distances in the transverse Y-Y direction between the two upper holes 30 of the input torque 32 and the output torque 36 are substantially identical.
• the set of upper holes 30 has a distribution having two planes of symmetry orthogonal to the upper surface 26 of the upper layer 14.
• One of said planes of symmetry is parallel to the axis of propagation X-X and the other of said planes of symmetry is parallel to the transverse axis Y-Y.
• the lower layer 16 extends along the XY plane.
• the lower layer 16 comprises an electrically conductive upper sub-layer 40A, an electrically conductive lower sub-layer 40B and a central dielectric sub-layer 40C, interposed between the underlayer upper 40A and the lower sub-layer 40B.
• the lower layer 16 thus forms a substrate.
• the lower layer 16 thus has an upper surface 42 electrically conductive and a lower surface 44 electrically conductive.
• the lower layer 16 comprises at least one lower through hole 46.
• Each lower through hole 46 opens into the propagation zone 20.
• Each lower through hole 46 passes through the upper sub-layer 40A, the lower sub-layer 40B and the central dielectric sub-layer 40C of the lower layer 16.
• Each lower hole 46 has, in projection on the lower surface 44 of the lower layer 16, a maximum dimension strictly less than the predetermined minimum wavelength, in particular less than one-fifth of the predetermined minimum wavelength, preferably less than to one-tenth of the predetermined minimum wavelength.
• Each lower hole 46 here has a circular cylinder shape of revolution.
• Each lower hole 46 preferably has edges 48 comprising an electrically conductive coating.
• the upper sub-layer 40A and the lower sub-layer 40B of the lower layer 16 are then electrically connected.
• the edges 48 are devoid of such an electrically conductive coating.
• Each lower hole 46 is disposed opposite one of the upper holes 30 along a direction Z-Z orthogonal to the axis of propagation X-X and to the transverse axis Y-Y.
• the number of lower holes 46 is equal to the number of upper holes 30.
• the central layer 18 extends along the XY plane.
• the central layer 18 comprises an electrically conductive upper sub-layer 50A, an electrically conductive lower sub-layer 50B and a dielectric center sub-layer 50C, interposed between the underlayer upper 50A and the lower underlayer 50B.
• the central layer 18 thus forms a substrate.
• the central sub-layer 50C of the central layer 18 has a first relative dielectric permittivity.
• the central layer 18 thus has an electrically conductive upper surface 52 and an electrically conductive lower surface 54.
• the upper layer 14 and the lower layer 16 are arranged at a distance from one another, on either side of the central layer 18, in contact with the central layer 18.
• the lower surface 28 of the upper layer 14 is in contact with the upper surface 52 of the central layer 18.
• the lower surface 54 of the central layer 18 is in contact with the upper surface 42 of the lower layer 16.
• the upper layer 14, the lower layer 16 and the central layer 18 form a stack.
• the lower sub-layer 24B of the upper layer 14 is electrically connected with the upper sub-layer 50A of the central layer 18.
• the lower sub-layer 50B of the central layer 18 is electrically connected with the sub-layer.
• the propagation zone 20 corresponds to an area in which the electromagnetic wave is confined during its propagation in the waveguide 12.
• the propagation zone 20 is delimited by the lower surface 28 of the upper layer 14, the upper surface 42 of the lower layer 16 and two lateral boundaries 56 spaced from each other (see FIG. 2). As illustrated in FIG. 1, the propagation zone 20 comprises a cavity 58.
• the lateral boundaries 56 of the propagation zone 20 are adapted to prevent the passage of an electromagnetic wave having a wavelength greater than or equal to the predetermined minimum wavelength.
• the lateral boundaries 56 extend parallel to the axis of propagation X-X and are here parallel to each other.
• the lateral boundaries 56 are in particular disposed on either side of the cavity 58, for example outside the cavity 58.
• At least one of the lateral borders 56 comprises a row of electrically conductive vias, arranged at least through the central layer 18.
• via means a hole, arranged at least through the central layer 18 , having walls covered with an electrically conductive coating, for example metallized.
• each via extends in the direction Z-Z orthogonal to the axis of propagation X-X and to the transverse axis Y-Y, crossing at least the central layer 18.
• each via is arranged through the central layer 18, the upper layer 14 and the lower layer 16.
• Each via electrically connects the upper layer 14 and the lower layer 16 between them.
• the spacing between two successive vias of a lateral border is less than the predetermined minimum wavelength, in particular less than one tenth of the predetermined minimum wavelength, preferably less than one twentieth of the minimum wavelength. predetermined.
• At least one of the lateral boundaries 56 of the symmetrical chamber comprises an electrically conductive plate.
• the cavity 58 of the propagation zone 20 is delimited by the upper layer 14, the lower layer 16 and the central layer 18. More precisely, the cavity 58 is delimited by the lower surface 28 of the upper layer 14, the upper surface 42 of the lower layer 16 and the lateral edges 60 of the central layer 18.
• the lateral edges 60 of the central layer 18 are substantially rectilinear and parallel with respect to each other and with respect to the X-X propagation axis.
• the lateral edges 60 extend orthogonally to the lower surface 28 of the upper layer 14 and to the upper surface 42 of the lower layer 16.
• the lateral edges 60 are advantageously covered with an additional dielectric layer, not shown.
• the side edges 60 may be metallized, that is to say, covered with an electrical conductor.
• the cavity 58 is filled with a fluid 62 having a second relative dielectric permittivity lower or higher than the first relative dielectric permittivity.
• the fluid 62 is for example air.
• the cavity 58 defines a sealed closed volume, it is filled with air, nitrogen or is empty of fluid 62.
• Each electrically conductive wire 22 is respectively received through one of said upper holes 30, the propagation zone 20 and one of said lower holes 46 disposed opposite the upper hole 30.
• Each conducting wire 22 in particular passes through the cavity 58 of the propagation zone 20.
• Each conductive wire 22 is electrically connected to the upper surface 26 of the upper layer 14 and to the lower surface 44 of the lower layer 16.
• Each conductive wire 22 is for example made of silver or is covered with a silver coating.
• Each conductive wire 22 is fixed to the upper layer 14 and to the lower layer 16, in particular by welding. Alternatively, each conductive wire 22 is fixed to the upper layer 14 and the lower layer 16 so that it is flush with the upper surface 26 of the upper layer 14 and with the lower surface 44 of the lower layer 16.
• the conductive wires 22 are claimed. They then extend in a rectilinear manner, along the axis Z-Z orthogonal to the axis of propagation X-X and to the transverse axis Y-Y.
• each upper hole 30 and lower hole 46 receive a lead 22.
• the interior of the upper holes 30 receiving a conductive wire 22 are hatched.
• the presence of a conducting wire 22 in the propagation zone 20 causes a local variation of the geometry of the propagation zone 20, and therefore a variation of the properties of the waveguide 12, for example a variation of the response of the guide wave 12.
• each conductive wire 22 constitutes an obstacle along the path of an electromagnetic wave propagating in the propagation zone 20, which has the effect of modifying the electromagnetic wave at the output, with respect to the electromagnetic wave in output obtained in the absence of the lead 22.
• the arrangement and the number of upper and lower holes 46 receiving a conductive wire 22 are determined so that the waveguide 12 has a predetermined transfer function.
• the method comprises providing the microwave component 10 described above, wherein none of the upper and lower holes 46 receive electrically conductive wire.
• the method then comprises providing an electrically conductive wire 22 and installing said conductive wire 22.
• the installation of the conducting wire 22 comprises its insertion through one of said lower holes 46, the propagation zone 20 and one of said upper holes 30 disposed opposite the lower hole 46.
• the conducting wire 22 is then electrically connected to the upper surface 26 of the upper layer 14 and to the lower surface 44 of the lower layer 16.
• FIG. 1 A second embodiment of a component according to the invention is illustrated in FIG.
• This second embodiment differs from the first embodiment of FIG. 2 in that the set of upper holes 30 has a distribution devoid of plane of symmetry parallel to the propagation axis XX and orthogonal to the upper surface 26 of the upper layer 14 and the lower surface 44 of the lower layer 16.
• FIG. 1 A third embodiment of a component according to the invention is illustrated in FIG.
• This third embodiment differs from the embodiments of FIGS. 2 and 3 in that one or a plurality of the lower holes 46 and a plurality of the upper holes 30 receive no conductive wire.
• Each upper hole receiving no conductive wire is disposed opposite a lower hole receiving no conductive wire.
• the interior of the upper holes 30 receiving a conductive wire 22 is hatched and the interior of the upper holes 30 receiving no conductive wire is white.
• the waveguide 12 then advantageously comprises an electrically conductive occulting member not shown covering at least one lower hole or an upper hole in which no conductive wire is received.
• the conductive occulting member is attached to the upper surface 26 of the upper layer 14 or to the lower surface 44 of the lower layer 16.
• the conductive occulting member is for example an electrically conductive adhesive tape or an electrically conductive plate.
• the method differs from the method of adjusting the component according to the first embodiment described above in that it further comprises the provision of at least a plurality of other electrically conductive wires 22.
• the method comprises determining a set of lower holes 46 and a set of upper holes 30 into which said conductive wires 22 are inserted, so that the waveguide 12 has a predetermined transfer function, each upper hole 30 of the set of upper holes 30 being associated with a lower hole 46 of the set of lower holes 46 disposed opposite the upper hole 30.
• each lead wire 22 includes its insertion through one of the lower holes 46 of the lower set of holes 46, the propagation zone 20 and the associated upper hole 30 of the set of upper holes 30, and its placement. in electrical connection with the upper surface 26 of the upper layer 14 and the lower surface 44 of the lower layer 16.
• the waveguide thus has the predetermined transfer function.
• At least one of said lower holes 46 and at least one of said upper holes 30 receive no conductive wire.
• the method then comprises providing one or a plurality of occulting members and covering one or a plurality of upper and lower holes receiving no conductive wire by one of the occulting members.
• the method comprises reconfiguring the waveguide 12.
• the reconfiguration of the waveguide 12 then comprises a second step of determining the upper and lower holes 46 in which to insert the conductive wires 22, so that the waveguide 12 has the second predetermined transfer function.
• the reconfiguration then comprises a step of removing the conductive wires 22 received in the upper and lower holes 46.
• the lead wire 30 is advantageously not removed during the withdrawal step.
• one of the conductive wires 22 is inserted through said determined lower hole 46, the propagation zone 20 and said determined upper hole, and electrically connected with the upper surface 26 of the upper layer 14 and the lower surface 44 of the lower layer 16.
• FIG. 1 A fourth embodiment of a component according to the invention is illustrated in FIG.
• This fourth embodiment differs from the third embodiment of FIG. 4 in that at least a portion of the upper holes 30 are distributed over the upper layer 14 so as to form a regular network 64.
• all the upper holes 30 are advantageously distributed to form the regular network 64.
• all the lower holes 46 are advantageously distributed to form the regular network 64, being arranged facing the upper holes 30.
• regular network it is meant that these upper or lower holes 46 are distributed in a network of meshes repeating periodically on the upper layer 14 or on the lower layer 16 respectively.
• the regular network 64 is a grid.
• a plurality of the lower holes 46 and a plurality of the upper holes 30 do not receive lead.
• the interior of the upper holes 30 receiving a conductive wire 22 is hatched and the interior of the upper holes 30 receiving no conductive wire is white.
• Such a waveguide 12 makes it possible to easily configure a plurality of predetermined transfer functions of the waveguide 12.
• the upper layer 14 and / or the lower layer 16 is (are) formed by a one-piece layer made of electrically conductive material, for example made of metal.
• the upper layer 14, the lower layer 16 and the central layer 18 form a substrate.
• the upper layer 14 and the lower layer 16 are then each a single layer of electrically conductive material, and the central layer 18 is a single layer of dielectric material.
• the upper layer 14 and the lower layer 16 respectively have a single upper and lower through hole opening into the propagation zone 20, in particular opening into the cavity 58.
• the component 10 has an impedance matching function to another circuit or a T-divider.
• the component is easily manufacturable and provides a filtering function for a very competitive cost, with a method that allows the reuse of a device while facilitating interconnection with planar circuits.
• lead wires 22 may be implemented to impedance match to another circuit.
• the component has a fast design time, and can be reconfigured to perform another function.

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• 2017
  • 2017-06-02 FR FR1754929A patent/FR3067172B1/fr not_active Expired - Fee Related
• 2018
  • 2018-06-01 EP EP18727314.9A patent/EP3631893A1/de not_active Withdrawn
  • 2018-06-01 US US16/617,038 patent/US20210135329A1/en not_active Abandoned
  • 2018-06-01 WO PCT/EP2018/064505 patent/WO2018220195A1/fr active Application Filing

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