EP3578385B1 - Verfahren zur veredelung einer grossformatig bereitgestellten bauplatte - Google Patents
Verfahren zur veredelung einer grossformatig bereitgestellten bauplatte Download PDFInfo
- Publication number
- EP3578385B1 EP3578385B1 EP18176816.9A EP18176816A EP3578385B1 EP 3578385 B1 EP3578385 B1 EP 3578385B1 EP 18176816 A EP18176816 A EP 18176816A EP 3578385 B1 EP3578385 B1 EP 3578385B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- embossing
- upper side
- building panel
- embossed
- depressions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 25
- 238000007670 refining Methods 0.000 title 1
- 238000004049 embossing Methods 0.000 claims description 44
- 239000002023 wood Substances 0.000 claims description 7
- 238000005299 abrasion Methods 0.000 claims description 6
- 239000004640 Melamine resin Substances 0.000 claims description 5
- 229920000877 Melamine resin Polymers 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000005496 tempering Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000003973 paint Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000001360 synchronised effect Effects 0.000 claims 1
- 238000003825 pressing Methods 0.000 description 9
- 238000005034 decoration Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 210000001503 joint Anatomy 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- 229920002522 Wood fibre Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 238000009408 flooring Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000002025 wood fiber Substances 0.000 description 1
Images
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/02005—Construction of joints, e.g. dividing strips
- E04F15/02033—Joints with beveled or recessed upper edges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/24—Pressing or stamping ornamental designs on surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C5/00—Processes for producing special ornamental bodies
- B44C5/04—Ornamental plaques, e.g. decorative panels, decorative veneers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C5/00—Processes for producing special ornamental bodies
- B44C5/04—Ornamental plaques, e.g. decorative panels, decorative veneers
- B44C5/043—Ornamental plaques, e.g. decorative panels, decorative veneers containing wooden elements
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
- E04F15/102—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials of fibrous or chipped materials, e.g. bonded with synthetic resins
Definitions
- the invention relates to a method for finishing a provided building board, in particular MDF or HDF, with a top side and a bottom side, at least in the top side in a first embossing step a relief as first strip-shaped depressions with two opposite side walls (5.1, 5.2), one this connecting bottom wall (5.3) and a depth, is embossed, and then a decoration is printed on the embossed upper side of the building board and the decoration is then sealed by applying an abrasion-resistant layer.
- Such a method is, for example, from WO 2017/164806 A1 known. With this method, a floor panel is refined by pressing a bevel into the side edges starting from the top.
- the ones from the EP 1 820 640 B1 known building panels are divided into individual panels after finishing and used, for example, as floor or wall and ceiling panels and are often provided with a wood, stone or fantasy decoration with an overlaid, three-dimensional surface.
- the divided panels have connecting means (tongue and groove) and are mostly equipped with locking means for locking adjacent panels in the horizontal and vertical direction (so-called click panels).
- the superimposition of decor and three-dimensional surface creates a realistic visual and haptic impression of the imitated material.
- Such a structure is called a decor-synchronous structure (embossed register).
- the decoration is either in the form of a paper layer laminated onto the carrier plate or as a layer of color printed directly on the carrier plate.
- the decor is also provided with a wear-resistant layer.
- abrasion-resistant paper layers so-called overlays, or, after hardening, abrasion-resistant lacquer or resin layers are used.
- the decor-synchronous structure is available as a three-dimensional surface structure and is embossed into the panel surface by means of a corresponding three-dimensionally structured press plate.
- the thermal components of the coating that can be activated under pressure melt and run and fill the three-dimensional structural embossing with curing.
- the structure usually has a height of up to 500 ⁇ m. The number and depth of the structures are limited on the one hand by the available amount of activatable components and on the other hand by the pressing force.
- the abutting edges at which adjacent floor panels meet are problematic. Depending on the incidence of light, even the smallest differences in height cause optically unsightly shadows that negatively affect the overall appearance of a floor.
- the panels are also sensitive to moisture due to the core made of wood-based material. Liquid spilled on the floor must be wiped away as quickly as possible to prevent the liquid from penetrating the joint between the abutting edges. If water penetrates, the wood fibers in the carrier board can expand and produce irreversible swelling, since the swelling pressure of the wood destroys the structure and / or the adhesive is partially hydrolyzed. For this reason, it is important that special attention is paid to the later abutting edges during the manufacture of the panels. Adjacent panels should be able to lie tightly against one another, the panels should have an optically uniform appearance to a floor and precautions must be taken to ensure that spilled liquid cannot immediately flow into the connecting joints.
- the EP 3 059 020 A1 discloses a method for producing a wood-based panel provided with a decorative layer, which provides at least a portion of treat their surface with water-based steam, sand the moistened surface and then provide at least one decorative layer.
- the U.S. 4,579,767 A discloses a hardboard in which a tile pattern simulated by indentations running in the longitudinal direction and transverse direction is embossed and which is coated in such a way that tiles are imitated. A large number of individual tiles are each depicted on a hardboard. Several hardboard can be placed next to each other.
- the DE 10 2014 010 747 A1 describes a process for the production of building boards in which the last applied plastic layer is embossed with the circumferential contours of a plurality of panels in the melted plastic layer when the structure is pressed and, after the laminate has cooled, individual panels are cut out of the laminate along the circumferential contours that are at least embossed in the plastic layer become.
- a generic method according to the invention provides that the at least one further recess running at an angle transverse to the at least one recess is embossed. And the provided building board is divided into individual panels by making a saw cut in and along the depressions. The top is then lowered at the side edges through the embossed depressions. The abutting edges of adjacent panels are opposite the So the top is lower. In such a case, a height offset cannot create shadows that are visually noticeable because all butt joints are lowered. Corresponding edge profiling enables a firm connection to be achieved between adjacent panels, which effectively prevents liquid from penetrating the butt joint too quickly.
- an MDF or HDF board is used as the building board, it is provided that its raw density profile (course of the density over the cross section of the board) compared to a conventional raw density profile, as it is, for example, from the EP 3 023 261 B1 is known to be lowered.
- the fiber cake is pressed into a building board of the desired thickness, the greatest raw density results in the area of the top and bottom of the board.
- a pressed skin forms on the top and bottom, which is also known as the "rotting layer”.
- the board has been pressed with a maximum density in the outer layers of 950-1000 kg / m 3 , it can be provided as mill-finished, that is, the pressed skin is not removed. However, it is also possible to at least partially grind the pressed skin on the upper side in order to reduce the density.
- a coating agent which is preferably an aqueous melamine resin, can be applied to the upper side.
- the tempering means that the previously reduced bulk density on the upper side (in the top layer) is increased again in order to achieve sufficient strength properties on the later panels.
- the building board is heated to 40 to 80 ° C., preferably 60 ° C., and a surface temperature of up to 220 ° C. is established when the at least one depression is embossed.
- the building board can be heated using steam.
- the top of the building board can be primed with a white paint before embossing the recess.
- At least the recess can be printed with a single-color or multi-color decoration by means of a digital printer.
- a white paint for the primer, any other color can be used if necessary.
- the first embossing step can be carried out by means of at least one calender roller. This has the advantage that the embossing step can be integrated into the production line. The embossing can then immediately follow the pressing of the wood-based panel in a contra press, in which the previously scattered fiber cake was pressed into a plate of the desired thickness, or it can precede the printing of the top in a printing system. This optimizes production.
- the building board After completion of the structure, which consists of at least a primer, the decor and an abrasion-resistant layer, the building board is laminated in a short-cycle press under pressure and temperature and in a second embossing step it is embossed again into the at least one strip-shaped recess in order to create the To achieve side walls without changing the position of the bottom wall in depth.
- the side walls formed in the first embossing step are "rounded" so that these rounded areas are converted back into a flat surface by the second embossing step.
- the melamine resin hardens already during the first embossing step and increases the bulk density. If the hardening agent is applied after the first embossing step, it hardens in the short-cycle press. The same also applies in the event that a sufficiently high temperature is not achieved in the first embossing step.
- the depth of the at least one depression is preferably up to 0.7 mm and can in particular be stepped so that the bottom wall is stepped. In such a case, several first pressing steps with different pressing depths are carried out.
- markings can be printed on the bottom walls of the at least one recess, which markings can consist of lines, circles, points, crosses or other graphic symbols. Lines are preferred.
- a camera system can be used to align the building board for the second embossing step and further subsequent processing steps.
- the repeated embossing in the recess in the second embossing step is preferably carried out in a short-cycle press in which strip-shaped elevations are applied to the press plate.
- a structure can be embossed into the upper side, which at least partially runs synchronously with the decor, which is called “embossed register” in technical language.
- the starting point is a large-format HDF board with a length of 2,800 or 1,860 mm, a width of 2,070 mm and a thickness of 7 to 14 mm.
- the bulk density is lower than that of a conventional HDF board, as compared to the Figure 7 with the Figures 8 and 9 shows.
- the top layer tips were lowered by at least 40 kg / m 3 compared to the standard. Good results were achieved with a reduction of up to 60 kg / m 3 .
- the bulk density is in the range from 950 to 1000 kg / m 3 .
- An example of the bulk density profile of a conventional HDF board is in Figure 7 shown.
- Figures 8 and 9 show examples of bulk density profiles of building boards used according to the invention.
- this is first heated to a temperature between 30 and 50 ° C. by means of steam. Then 10 to 50 g / m 3 , preferably 30 g / m 3 of aqueous melamine resin are applied as a coating agent.
- This can be a standard impregnating resin with a solids content of 50 to 65% by weight, preferably 60% by weight.
- other additives such as hardeners, wetting agents and the like can be present in the solution.
- UF resin or a mixture of UF and melamine resin can also be used as connecting means.
- flexibilizers e.g. 1,4-butanediol, caprolactam, polyglycol, etc.
- a subsequent addition of the elasticizing agent should be of the order of about 3 to 7% by weight.
- the building board 1 pretreated in this way is passed under one or more calender rollers 20 arranged one behind the other with embossing rings 21 arranged thereon parallel to one another.
- embossing rings 21 arranged thereon parallel to one another.
- indentations 5, 6 with a depth T of up to 0.7 mm are embossed in the upper side 2 via the at least two embossed rings 21 in the longitudinal direction L and transverse direction Q.
- the line pressure of the embossed rings 21 is up to 300 N / mm and the surface temperature is up to 220 ° C.
- the coating agent is at least partially converted on the upper side 2, that is to say at least partially hardens and thereby increases the density.
- the depressions 5, 6 can be designed in a stepped manner, for example by using several calender rollers 20 with different embossing rings 21 and, for example, first 0.3 mm and then a further depth T of up to 0.7 mm is embossed. Between the embossing rings 21, a structure can be engraved in the jacket 22 of the calender roller 20, which structure is then embossed next to the depressions 5, 6 in the top side 3 in the first embossing step.
- the top 2 is primed with a white base color.
- a decor 3 is printed onto the primer 11 by means of digital printing, the color dots of the digital printer being mapped not only on the flat top 2, but also on the side walls 5.1, 5.2 and the bottom wall 5.3 of the strip-shaped depressions 5, 6 so that the wells 5, 6 are completely decorated.
- the decoration 3 can be single-colored or multi-colored and is applied in such a way that it runs at least partially synchronously with the structure that was first impressed.
- markings 7 are printed on the bottom wall 5.3.
- the markings 7 can be circles 7.1, crosses 7.2, lines 7.3 and lines 7.4 or other geometric figures. Using these markings 7, the building board 2 can be aligned using a camera system in order to carry out further processing steps.
- a counter-pull 8 is placed on the underside 9 of the building board 1 and an overlay paper 4 is placed on the decor 3.
- an overlay paper 4 is placed on the decor 3.
- a liquid overlay can also be applied by roller application, into which corundum is mixed or scattered.
- the backing 8 can also be applied in liquid form.
- This structure is then fed to a short-cycle press 30, the upper press plate 31 of which is provided with strip-shaped elevations 32.
- the building board 1 is aligned using the markings 7 and a camera system, so that the elevations 32 once again dip into the embossed depressions 5, 6 when the structure is subsequently pressed and the side walls 5.1, 5.2 of the depressions 5, 6 that are rounded when the top 2 is coated are again embossed in order to set parallel and flat side walls 5.1, 5.2 in a second embossing step without changing the depth T of the depressions 5, 6 or the position of the bottom walls 5.3.
- the elevations 32 in the transition area from the side walls 5.1, 5.2 to the bottom wall 5.3 are made larger than the width of the recesses 5, 6 in order to reliably form the lower edges of the recesses 5, 6.
- the pressing time in the second embossing step is between 10 and 30 seconds, preferably 12 to 15 seconds, in which the resins melt and bond with the building board 1.
- the temperature of the press plates 31, 33 is increased during the pressing, so that a surface temperature of 120 ° is obtained on the pressed part up to 180 ° C during the pressing process.
- the pressure curve takes place starting from a pressure build-up phase, transitioning into a holding phase and a pressure reduction phase.
- the embossing depth T will take place in the sense of a path control.
- the at least one calender roll 20 is integrated into the printing system or is located directly in front of it. For a meaningful design, at least two recesses 5, 6 in the longitudinal direction L and two in the transverse direction Q must be embossed in the first embossing step so that the side edges of the divided panels are all lowered.
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Finishing Walls (AREA)
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES21174458T ES2971683T3 (es) | 2018-06-08 | 2018-06-08 | Procedimiento para el acabado de un panel de construcción de gran formato |
EP18176816.9A EP3578385B1 (de) | 2018-06-08 | 2018-06-08 | Verfahren zur veredelung einer grossformatig bereitgestellten bauplatte |
PL21174458.6T PL3885155T3 (pl) | 2018-06-08 | 2018-06-08 | Sposób uszlachetniania dostarczonej wielkoformatowej płyty budowlanej |
PT181768169T PT3578385T (pt) | 2018-06-08 | 2018-06-08 | Processo para acabamento de um painel de construção de grande formato |
EP21174458.6A EP3885155B1 (de) | 2018-06-08 | 2018-06-08 | Verfahren zur veredlung einer grossformatig bereitgestellten bauplatte |
PL18176816T PL3578385T3 (pl) | 2018-06-08 | 2018-06-08 | Sposób uszlachetnienia dostarczonej wielkoformatowej płyty budowlanej |
ES18176816T ES2882709T3 (es) | 2018-06-08 | 2018-06-08 | Procedimiento para el refinado de una placa de construcción de formato grande |
US16/972,430 US11156004B2 (en) | 2018-06-08 | 2019-04-02 | Method for finishing a supplied building panel |
CN201980038212.XA CN112423995B (zh) | 2018-06-08 | 2019-04-02 | 对提供的建筑板进行精整的方法 |
RU2020141787A RU2757241C1 (ru) | 2018-06-08 | 2019-04-02 | Способ отделки поставляемой строительной панели |
PCT/EP2019/058287 WO2019233652A1 (de) | 2018-06-08 | 2019-04-02 | Verfahren zur veredlung einer bereitgestellten bauplatte |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP18176816.9A EP3578385B1 (de) | 2018-06-08 | 2018-06-08 | Verfahren zur veredelung einer grossformatig bereitgestellten bauplatte |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP21174458.6A Division EP3885155B1 (de) | 2018-06-08 | 2018-06-08 | Verfahren zur veredlung einer grossformatig bereitgestellten bauplatte |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3578385A1 EP3578385A1 (de) | 2019-12-11 |
EP3578385B1 true EP3578385B1 (de) | 2021-05-26 |
Family
ID=62712757
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP21174458.6A Active EP3885155B1 (de) | 2018-06-08 | 2018-06-08 | Verfahren zur veredlung einer grossformatig bereitgestellten bauplatte |
EP18176816.9A Active EP3578385B1 (de) | 2018-06-08 | 2018-06-08 | Verfahren zur veredelung einer grossformatig bereitgestellten bauplatte |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP21174458.6A Active EP3885155B1 (de) | 2018-06-08 | 2018-06-08 | Verfahren zur veredlung einer grossformatig bereitgestellten bauplatte |
Country Status (8)
Country | Link |
---|---|
US (1) | US11156004B2 (pl) |
EP (2) | EP3885155B1 (pl) |
CN (1) | CN112423995B (pl) |
ES (2) | ES2971683T3 (pl) |
PL (2) | PL3885155T3 (pl) |
PT (1) | PT3578385T (pl) |
RU (1) | RU2757241C1 (pl) |
WO (1) | WO2019233652A1 (pl) |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4579767A (en) * | 1983-08-30 | 1986-04-01 | Abitibi-Price Corporation | Simulated ceramic tile |
SE516696C2 (sv) * | 1999-12-23 | 2002-02-12 | Perstorp Flooring Ab | Förfarande för framställning av ytelement vilka innefattar ett övre dekorativt skikt samt ytelement framställda enlit förfarandet |
DE10341172B4 (de) * | 2003-09-06 | 2009-07-23 | Kronotec Ag | Verfahren zum Versiegeln einer Bauplatte |
DE102006007976B4 (de) | 2006-02-21 | 2007-11-08 | Flooring Technologies Ltd. | Verfahren zur Veredelung einer Bauplatte |
DE102008012220A1 (de) * | 2008-03-03 | 2009-09-17 | Flooring Technologies Ltd. | Verfahren und Vorrichtung zum Herstellen einer Holzwerkstoffplatte |
CN101998896B (zh) * | 2008-04-07 | 2014-12-10 | 瓦林格创新股份有限公司 | 具有薄的表面层的基于木质纤维的镶板 |
EP2730430B1 (de) * | 2012-11-12 | 2014-11-05 | Flooring Technologies Ltd. | Verfahren zur Behandlung einer Holzwerkstoffplatte und Bauplatte mit einem Kern aus Holzwerkstoff |
EP2905135A3 (de) * | 2014-02-05 | 2015-12-02 | Dirk Dammers | Verfahren zur Herstellung eines Paneels |
DE102014010747B4 (de) * | 2014-07-23 | 2017-01-19 | Flooring Technologies Ltd. | Verfahren zur Herstellung von Bauplatten, insbesondere Fußbodenpaneelen |
PL3023261T3 (pl) | 2014-11-20 | 2017-12-29 | Flooring Technologies Ltd. | Sposób uszlachetnienia płyty z tworzywa drzewnego |
CN204435729U (zh) * | 2014-12-24 | 2015-07-01 | 上海伊兆实业有限公司 | 一种装饰板 |
EP3059020B1 (de) * | 2015-02-23 | 2017-05-24 | Flooring Technologies Ltd. | Verfahren zur Herstellung einer Holzwerkstoffplatte, insbesondere einer mit einer Dekorschicht versehenen Holzwerkstoffplatte |
DE102015005864A1 (de) | 2015-05-11 | 2016-11-17 | Fritz Egger Gmbh & Co. Og | Verfahren zur Herstellung von Vertiefungen aufweisenden Paneelen |
EP3433105A4 (en) | 2016-03-24 | 2019-11-13 | Välinge Innovation AB | METHOD FOR FORMING A DECOR ON A SUBSTRATE |
-
2018
- 2018-06-08 EP EP21174458.6A patent/EP3885155B1/de active Active
- 2018-06-08 ES ES21174458T patent/ES2971683T3/es active Active
- 2018-06-08 EP EP18176816.9A patent/EP3578385B1/de active Active
- 2018-06-08 ES ES18176816T patent/ES2882709T3/es active Active
- 2018-06-08 PL PL21174458.6T patent/PL3885155T3/pl unknown
- 2018-06-08 PL PL18176816T patent/PL3578385T3/pl unknown
- 2018-06-08 PT PT181768169T patent/PT3578385T/pt unknown
-
2019
- 2019-04-02 RU RU2020141787A patent/RU2757241C1/ru active
- 2019-04-02 CN CN201980038212.XA patent/CN112423995B/zh active Active
- 2019-04-02 WO PCT/EP2019/058287 patent/WO2019233652A1/de active Application Filing
- 2019-04-02 US US16/972,430 patent/US11156004B2/en active Active
Non-Patent Citations (1)
Title |
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None * |
Also Published As
Publication number | Publication date |
---|---|
WO2019233652A1 (de) | 2019-12-12 |
US20210230880A1 (en) | 2021-07-29 |
PT3578385T (pt) | 2021-08-19 |
RU2757241C1 (ru) | 2021-10-12 |
EP3885155C0 (de) | 2023-11-22 |
EP3885155A1 (de) | 2021-09-29 |
CN112423995A (zh) | 2021-02-26 |
PL3885155T3 (pl) | 2024-04-15 |
EP3885155B1 (de) | 2023-11-22 |
PL3578385T3 (pl) | 2021-12-27 |
EP3578385A1 (de) | 2019-12-11 |
ES2971683T3 (es) | 2024-06-06 |
CN112423995B (zh) | 2021-12-07 |
ES2882709T3 (es) | 2021-12-02 |
US11156004B2 (en) | 2021-10-26 |
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