EP3555967B1 - Procédé de fabrication d'au moins un élément de contact haute fréquence ou d'un ensemble d'élément de contact haute fréquence ainsi que des dispositifs associés - Google Patents

Procédé de fabrication d'au moins un élément de contact haute fréquence ou d'un ensemble d'élément de contact haute fréquence ainsi que des dispositifs associés Download PDF

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Publication number
EP3555967B1
EP3555967B1 EP19703289.9A EP19703289A EP3555967B1 EP 3555967 B1 EP3555967 B1 EP 3555967B1 EP 19703289 A EP19703289 A EP 19703289A EP 3555967 B1 EP3555967 B1 EP 3555967B1
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EP
European Patent Office
Prior art keywords
contact element
body part
frequency
contact
frequency contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
EP19703289.9A
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German (de)
English (en)
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EP3555967A1 (fr
Inventor
Hauke SCHÜTT
Waldemar Schmidt
Alexandra HENNIGER-LUDWIG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosenberger Hochfrequenztechnik GmbH and Co KG
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Rosenberger Hochfrequenztechnik GmbH and Co KG
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Publication of EP3555967A1 publication Critical patent/EP3555967A1/fr
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035—Plated dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2485—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point for contacting a ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2492—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point multiple contact points
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching
    • H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
    • H01R13/6476—Impedance matching by variation of conductive properties, e.g. by dimension variations by making an aperture, e.g. a hole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Definitions

  • the present invention relates to a method for producing at least one high-frequency contact element or a high-frequency contact element arrangement, as well as associated devices.
  • Modern connection technology does not only include contact elements for contacting and transmission of direct voltage or low frequency signals according to the DE 10 2016 004 520 A1 , but also contact elements for contacting and transmission of high-frequency signals.
  • a high-frequency signal is understood here and in the following to be a signal with a frequency from 3 MHz to 30 THz, that is to say almost the entire range of the electromagnetic spectrum.
  • Contact elements are preferably used for the transmission of high-frequency signals between contact connections of two adjacent circuit boards (so-called board-to-board connection; German: circuit board-to-circuit board connection).
  • contact elements for high-frequency signals is the contacting and transmission of a high-frequency signal between a contact connection of a circuit to be tested, for example an integrated circuit to be tested, and a contact connection of a printed circuit board that is connected to a measuring device.
  • the contact on the integrated circuit to be tested can take place here on a contact connection of the housing of the integrated circuit or directly on a contact connection or a contact surface on the substrate of the integrated circuit.
  • An application is also possible in which the contact element that contacts a contact connection of the circuit to be tested is connected with its other contact end directly to a measuring cable that is led to the measuring device.
  • contact elements for high-frequency signals are also conceivable, which electrically bridge the contact areas on the substrate of two integrated circuits.
  • a contact element designed in this way is matched in terms of its impedance at its contact points to the impedance on the associated contact connections to be contacted and prevents undesired reflections of the high-frequency signal to be contacted and transmitted at the contact points.
  • a transition between these two impedance values that is as constant as possible within the contact element is to be achieved with a view to minimizing signal reflections.
  • a contact element that has a reflection-minimized design both at its two contact points and between the two contact points with regard to its impedance has a set impedance along its longitudinal extension.
  • a set impedance of a contact element is understood here and below to mean an impedance which is matched between the two contact points to the impedance of the respective contact surface to be contacted.
  • a preferably constant impedance over the entire longitudinal extension is achieved by suitable shaping and choice of material for the contact element.
  • a continuous or at least multiple stepped transition between the two different values of an adapted impedance at the two contact points of the contact element is realized by means of shaping and material selection in the contact element.
  • Such a contact element must typically also meet other technical requirements:
  • the course of the cross-sectional geometry between the inner conductor and the outer conductor signal routing of a high-frequency contact element is to be made as continuous as possible both at the contact points to the contact connections to be contacted and between the contact points in order to avoid undesired To avoid modes of the high-frequency signal to be contacted and transmitted.
  • Contact elements are preferably designed to be elastic, on the one hand to compensate for variable distances between the contact connections to be contacted and on the other hand to exert sufficient contact pressure from the contact element on the contact connections to be contacted.
  • a multiplicity of contact connections to be contacted in parallel with an increasingly smaller grid spacing between the contact connections requires progressive miniaturization of the contact elements.
  • the miniaturization of the contact elements is also accelerated by the increasing reduction in the distance between the contact connections to be contacted.
  • contact elements Another challenge for the technical design of contact elements is that parallel contact elements each contact contact connections of an integrated circuit to be tested in a comparatively small grid spacing and translate into opposing contact surfaces with a comparatively larger grid spacing. In this way, a more easily manageable assembly of the measuring cables at the contact points of the individual contact elements as well as an easily manageable contact with contact terminals or contact surfaces on a circuit board that is connected to the measuring device is possible.
  • the miniaturization of contact elements is also subject to a technical limit with such conventional manufacturing technologies. In many cases, miniaturized contact elements below a certain size cannot be mass-produced.
  • the conventional production of a high-frequency contact element ultimately requires individual production of individual components, such as, for example, the inner conductor element, insulator element and outer conductor element, and subsequent assembly of the individual components to form the finished high-frequency contact element.
  • individual components such as, for example, the inner conductor element, insulator element and outer conductor element
  • assembly is still largely manual and makes the finished product considerably more expensive.
  • Isolator elements which each have several areas made of different materials in one piece, cannot be manufactured at all with conventional manufacturing technology.
  • the present invention is based on the object of developing a method for the cost-effective production of a contact element for contacting and transmission of a high-frequency signal which, with regard to its electrical and mechanical properties is optimized and can be produced with quality even to a very small extent.
  • a method for the cost-effective production of a contact element arrangement for contacting and transmission of a plurality of high-frequency signals, which contains a plurality of contact elements, and associated devices can also be implemented by the invention.
  • the main body part of the high-frequency contact element which has a bushing between a first end and a second end, is made of a dielectric material.
  • the base body part designed in this way represents the insulator element of the high-frequency contact element according to the invention.
  • the high-frequency contact element is preferably composed of a one-piece base body part.
  • the individual dielectric parts of the base body part are suitably connected to one another before coating, for example by means of gluing.
  • the dielectric base body part is also coated with an electrically conductive layer.
  • the electrically conductive layer is removed in an area surrounding the feedthrough at the first end and at the second end of the main body part.
  • the main advantage of this method according to the invention is that the individual components of the high-frequency contact element, ie the inner conductor element, the insulator element and the outer conductor element, no longer have to be manufactured individually and then need to be assembled into the finished high-frequency contact element in a comparatively complex manner. Instead, the high-frequency contact element is produced using three sequential production steps that can be automated.
  • the production of the base body part from a dielectric material by means of an additive manufacturing process in comparison to the production of individual parts in a conventional manufacturing technology, advantageously enables the realization of very complex geometries.
  • These complex geometries can also be advantageously combined with complex material combinations.
  • This enables high-frequency contact elements with complex electrical requirements, in particular complex requirements for impedance matching, to be met in combination with complex mechanical requirements.
  • extremely miniaturized high-frequency contact elements with very filigree geometric structures can be produced with the method according to the invention. High-quality high-frequency contact elements of this kind can only be manufactured in individual production using conventional methods in a very complex and therefore very cost-intensive manner.
  • additive manufacturing process which is also referred to as a “generative manufacturing process” is understood here and in the following to be a manufacturing process that is based on computer-internal data models from informal (liquids, gels / pastes, powders, etc.) or form-neutral (ribbon, wire, sheet) material using chemical and / or physical processes to manufacture products with high precision and at low cost. Although these are molding processes, no special tools are required for a specific product that have saved the respective geometry of the workpiece (for example casting molds).
  • 3-D laser lithography is particularly suitable for realizing very small geometric structures of the high-frequency contact element.
  • a photosensitive material preferably a liquid photosensitive material, particularly preferably a pasty photosensitive material, is bombarded by means of a laser, preferably in individual laser light flashes, and in the process hardens at special points. In this way, the main body part of the high-frequency contact element is built up gradually from the photosensitive dielectric material.
  • the base body part of the high-frequency contact element After the dielectric base body part of the high-frequency contact element has been produced using additive manufacturing technology, the base body part is coated with an electrically conductive layer.
  • An electrochemical coating process for example an electroplating process, is preferably suitable as the coating process.
  • an electrical circuit is built up between a cathode, which is connected to the body to be electroplated, and an anode made of the coating material. Copper is preferred as the coating material. Palladium, silver, gold, nickel, tin or tin lead can also be used.
  • a chemical process can also be used for the coating.
  • a starting material that is bound to a carrier gas or dissolved in a liquid reacts with the base body part made of dielectric material under certain reaction conditions, for example temperature and pressure, and produces an electrically conductive layer, preferably a metallic layer, as the reaction result.
  • a physical process such as the sputtering process or other evaporation processes can also be used as the coating process.
  • a combination of an electrochemical process with a chemical process or a combination of an electrochemical process with a physical process is also conceivable as an alternative coating.
  • a mechanical method such as grinding the electrically conductive layer with a suitable grinding tool can be used.
  • the electrically conductive layer can also be removed using a physical or optical method, for example by means of laser ablation or laser evaporation.
  • the electrically conductive layer is removed from a surface of the main body part by bombarding it with laser radiation.
  • the laser radiation used here has a high power density, which leads to rapid heating and formation of a plasma on the surface.
  • the chemical bonds of the electrically conductive layer are broken and / or thrown out of the surface of the main body part.
  • the electrically conductive layer can also be removed using a chemical process, for example using the so-called lift-off process.
  • a sacrificial layer preferably made of photoresist, is applied between the electrically conductive layer and the base body part made of dielectric material.
  • the sacrificial layer is removed using a wet chemical process with a solvent such as acetone. With the sacrificial layer, the electrically conductive layer with lift off and washed away.
  • the layer thickness of the coating i.e. the electrically conductive layer, carried out within the implementation comparatively larger than the layer thickness of the coating on the outer surface of the base body part.
  • the coating fills the bushing completely.
  • an electrically conductive starter layer must be applied to the electrically insulating material of the base body part by means of a chemical process, for example.
  • the coating of the dielectric base body part with an electrically conductive layer thus preferably includes coating the dielectric base body part with a plurality of electrically conductive layers.
  • Each electrically conductive layer is preferably a metallic layer in each case.
  • the individual metallic layers, ie the starting layer and the at least one further metallic layer placed thereon, are preferably made from a different metallic material.
  • the contact element according to the invention contains the two contacting areas, which each serve to make electrical contact with the contact surfaces or contact connections to be contacted on a circuit board, on a substrate or on a housing of an integrated circuit, and the connection area arranged between the two contacting areas.
  • the high-frequency contact element is designed to be elastic in at least one area in order to exert sufficient contact pressure on the contact surfaces or contact connections to be contacted and to compensate for variable distances between the contact surfaces or contact connections to be contacted due to manufacturing tolerances.
  • the elasticity is preferably formed in the connection area between the two contacting areas of the contact element.
  • only the contacting areas or the entire contact element can be made elastic.
  • the contact element can also be composed of individual elastic regions and rigid regions arranged in between.
  • the elasticity in the individual areas of the high-frequency contact element is achieved by a suitable material selection and / or by a suitable shape.
  • the dielectric material of the base body part is preferably selected to be elastic.
  • An elastomer, for example silicone or natural rubber, can be used as the dielectric material with elastic properties.
  • Geometric shapes that give a contact element for high-frequency signal transmission a certain elasticity are concentrated on elastic realizations in which the at least one inner conductor can be completely surrounded by a common, electrically shielding outer conductor over the entire length of the contact element.
  • a coaxial formation between the inner and outer conductors over the entire length of the high-frequency contact element is preferred.
  • a shaping as a torsion spring or as a spring arm is particularly suitable.
  • the spring arm can also be designed in a meandering shape from at least three turns or loops. Due to the meander shape, the elasticity of the contact element is additionally increased with each additional turn or loop.
  • the base body part has both the two contacting areas as well as the connection area connecting the two contacting areas.
  • a multi-part solution is also possible in which a separate component for contacting is attached to the base body part in the area of the contacting.
  • This separate component for contacting can also be constructed from a dielectric material by means of additive manufacturing technologies and a subsequent metallic coating can be produced.
  • any suitable conventional metal processing technology or any structure and layer technology known from the semiconductor field can also be used here.
  • the two contacting areas are each implemented as first and second ends of the contact element formed on the face, which are each provided with at least one metallic layer on the inner and outer conductor sides.
  • a face contact with associated inner conductor and outer conductor-side contact connections or contact areas on a circuit board, an IC substrate or an IC housing is possible.
  • the contacting areas of the high-frequency contact element can also have more complex shapes due to the diverse geometrical implementation options of additive manufacturing technology.
  • several contact tips preferably arranged in a circle in the contacting region on the outer conductor side are conceivable.
  • an annular shape with a conically shaped contacting edge can be used on the inner and outer conductor sides. In both cases a point or line contact between the Realized respective contacting area of the contact element and the respective contact surface to be contacted, which enables reliable contact formation even with uneven contact surfaces.
  • Elastic contact areas can also be implemented with a one-piece solution when using additive manufacturing technology on the inner and outer conductor sides.
  • several geometric shapes are implemented in the inner conductor and outer conductor side contacting area, which are based on the spring arm principle.
  • the inner-conductor and outer-conductor-side contacting area has a contact that is directed into a radial extension of the main body part.
  • the contacting area on the inner conductor side makes contact with a contact area and the contact area on the inner conductor side makes contact with a plurality of contact areas.
  • the contact surfaces to be contacted are preferably each spherical and represent the contact surface of an electrically conductive ball, preferably an electrically conductive solder ball, which is electrically and mechanically connected to a printed circuit board, an IC housing or an IC substrate.
  • an electrically conductive ball preferably an electrically conductive solder ball
  • one solder ball for the inner conductor-side contact and several solder balls for the outer conductor-side contact are provided, each of which is arranged on a concentric circle around the solder ball for the inner conductor contact.
  • the diameter of the solder ball for the inner conductor contact is adapted to the inner diameter of the coated bushing of the contact element.
  • solder ball in the case of a high-frequency contact element for the transmission of at least one differential high-frequency signal, a solder ball must be provided for making contact with each individual inner conductor.
  • the solder balls for the outer conductor contact are to be arranged in such a way that they enclose all solder balls for the inner conductor contacts on a self-contained line.
  • the dielectric base body part of the high-frequency contact element according to the invention is preferably to be provided with a bevel or step in the area of the contact area on the inner and outer conductors.
  • the contact contains not only a radially directed component, but also an axially directed component.
  • a conically shaped and electrically conductive body for example a conical or a frustoconical body, can alternatively be used.
  • a cylindrical body can alternatively also be used.
  • components for contacting can likewise each be implemented as contact tips or ring-shaped bodies with a conically shaped contacting edge. These components for contacting are connected in the inner conductor and outer conductor-side contacting area of the high-frequency contact element according to the invention to the coated base body part, preferably by means of soldering. Contact crowns can also be used as components on the inner conductor and outer conductor side for making contact.
  • Contacting areas with elasticity can each preferably be formed as dome-shaped components for contacting the inner conductor and outer conductor side.
  • Other geometrical shapes that realize elasticity such as, for example, spring-arm-shaped, plate-spring-shaped or spiral-spring-shaped shapes, can also be used.
  • the components for contacting are manufactured separately in additive or conventional manufacturing and fed with the dielectric base body part to the additive manufacturing process for manufacturing the high-frequency contact element.
  • the impedance of the high-frequency contact element in the two contacting areas and in certain sections between the two contact areas along the length of the high-frequency contact element is determined by a suitable choice of the dielectric material of the base body part and by a suitable geometric shape of the dielectric base body part.
  • a coaxially implemented one is implemented with regard to impedance matching High-frequency contact element in each case preferably a continuous change of an inner conductor-side diameter and an outer-conductor-side diameter of the high-frequency contact element formed between the first end and the second end of the contact element.
  • the ratio between the inner-conductor-side diameter and the outer-conductor-side diameter of the high-frequency contact element is in this case made constant between the first end and the second end of the contact element.
  • an at least one-step change in an inner-conductor-side diameter and an outer-conductor-side diameter of the high-frequency contact element is achieved formed between the first end and the second end of the preferably rotationally symmetrical high-frequency contact element.
  • both the input impedances and the geometrical dimensions of the two inner conductor or outer conductor-side contact surfaces to be contacted differ from one another, a constant or multiple step change in an inner-conductor-side diameter and an outer-conductor-side diameter of the coaxially designed high-frequency contact element between the first end and the second end of the high-frequency contact element formed.
  • the impedance in the connection area of the high-frequency contact element between the two contact-making areas of the high-frequency contact element and the two different input impedances of the contact areas to be contacted are brought closer to the two different input impedances. In this way, too, there is a reflection-minimized and thus high-frequency optimized transmission in the high-frequency contact element according to the invention.
  • a multi-step change in the impedance along the longitudinal extension of the high-frequency contact element can be achieved with a coaxial high-frequency contact element in that the inner conductor and the outer conductor-side diameter of the coaxially designed high-frequency contact element according to the invention are each made constant in individual sections of the high-frequency contact element are.
  • the inner conductor and outer conductor-side diameter of the coaxially designed high-frequency contact element according to the invention change in the same ratio in each case in successive sections.
  • the dielectric base body part can be constructed from layers following one another in the longitudinal axis direction of the base body part, each made of a dielectric material with a changed relative permittivity.
  • each of these cavities is filled with a further dielectric material, the relative permittivity of which is different, preferably smaller, than the relative permittivity of the dielectric material of the base body part. It is preferably filled with air.
  • another gaseous substance or a liquid substance or a solid dielectric material can be used. In this way, the effective permittivity of the high-frequency contact element along the longitudinal extent of the high-frequency contact element in which the respective hollow space is formed can be suitably reduced by the individual cavity.
  • the impedance can thus be kept constant when the inner conductor and outer conductor side diameter changes, in order to match it to the identical intrinsic impedance of the two contact surfaces to be contacted with the high-frequency contact element according to the invention adapt.
  • a steady or multi-step change of the impedance can alternatively be achieved by the arrangement and geometric design of the at least one cavity.
  • slots inside the main body are alternatively also conceivable, each of which runs over the entire radial extension of the main body part.
  • these slots are to be filled with a dielectric material in the manufacturing process of the base body part using additive manufacturing technology. which, in contrast to the dielectric material of the rest of the base body part, can be selectively removed again.
  • sacrificial layers made of a suitable dielectric material, for example a light-sensitive photoresist, are built up additively within the base body part.
  • the metallic coating in the sections of the slots filled with dielectric sacrificial layers is removed by means of known methods, for example by means of laser ablation. To identify these sections, these sections have, for example, a curved surface, ie a concave or a convex surface, compared to the remaining sections of the base body part.
  • the sacrificial layers are removed with a suitable solvent, for example acetone, while the remaining areas of the base body part made of an insoluble dielectric material do not react with the solvent. In this way, slots are created within the main body part which extend to the side edge of the coated main body part.
  • the effective permittivity of the dielectric base body part and thus the course of the impedance of the high-frequency contact element according to the invention along its longitudinal extent can be specifically influenced by suitable arrangement and geometric design of such slots.
  • the elasticity of the high-frequency contact element according to the invention can advantageously be additionally increased.
  • the circumference of the high-frequency contact element can advantageously be slightly widened in the area of the slots.
  • the metallic coating on the inner conductor side must also be removed in this case.
  • the two contact connections or contact surfaces to be contacted with the high-frequency contact element can not only be arranged at a certain axial distance from one another in the direction of the longitudinal axis of the contact element, but in real applications also be arranged axially offset from one another with regard to their surface axes and / or with regard to the Orientation of their surface axes have an angular offset.
  • the high-frequency contact element no longer extends along a longitudinal axis, but can have a more complex shape.
  • Such a variable longitudinal extension of the high-frequency contact element can on the one hand be implemented continuously with suitably dimensioned curvatures.
  • such a high-frequency contact element can also be assembled in a stepped manner from individual sections which each run along an associated longitudinal axis and have an associated orientation to one another.
  • Both cases of a variable longitudinal extension of the high-frequency contact element can be manufactured with a dielectric base body part manufactured by means of an additive manufacturing process with little effort and with a high manufacturing quality even down to the nanometer range.
  • connection part can for example be a common connecting plate made of a dielectric material, in which the individual high-frequency contact elements are arranged in a certain grid and mechanically fixed.
  • the connecting part can also be a connecting web made of a dielectric material, which connects two high-frequency contact elements arranged in a specific grid with one another and thus spaced them apart at a specific grid spacing.
  • the connecting plate and the individual connecting webs can be manufactured together with the base body parts of the individual high-frequency contact elements in a common manufacturing step using additive manufacturing technology.
  • the connecting plate or the individual connecting webs can be prefabricated by an additive or a conventional manufacturing technology and fed to the additive manufacturing process for manufacturing the high-frequency contact element arrangement.
  • the connecting plate and the individual connecting webs are only used as a so-called support geometry for mutual support and spacing of the individual base body parts in the additive manufacturing process, the individual high-frequency contact elements are separated from the connecting plate or connecting webs in a final production step.
  • the connecting plate or the connecting webs each have a predetermined breaking point at a suitable point.
  • the separation can be mechanical by means of milling or grinding or done optically by laser.
  • the separation of the individual high-frequency contact elements from one another can take place in the same production step as the removal of the metallic layer at the first and second ends of the individual high-frequency contact elements.
  • the connecting plate can be arranged at any desired position in the longitudinal extension of the individual high-frequency contact elements.
  • a high-frequency contact element arrangement is also possible in which a high-frequency contact element is arranged at individual opposite positions on the top and bottom of the connecting plate. These two opposite high-frequency contact elements are each connected to each other via a metallically coated bore and form a pair of high-frequency contact elements for electrical contacting and transmission of a high-frequency signal between contact surfaces to be contacted on a circuit board, an IC substrate or an IC housing.
  • connection plate is implemented as an electrical circuit carrier and has on its top and / or bottom electrical signal lines.
  • the outer conductor of the high-frequency contact element can be contacted directly with an adjacent contact surface or an adjacent contact connection of an electrical signal line.
  • the inner conductor of the high-frequency contact element is contacted with an associated contact surface or an associated contact connection of an electrical signal line via a signal line within the connection plate.
  • This signal line is connected to the metallic coating of two bores within the connection plate, one of which is aligned with the high-frequency contact element and the other with the associated contact surface on the upper or lower side of the connection plate.
  • the individual high-frequency contact elements are additionally elastically supported by a separate elastic element.
  • This separate elastic element is connected to the high-frequency contact element according to the invention in the connection area between the two contacting areas of the high-frequency contact element and to the connection plate at a suitable connection point.
  • a torsion spring which is suitably designed to allow the high-frequency contact element to have sufficient elasticity can preferably be used as the elastic element.
  • connection plate is connected to high-frequency contact elements, each of which has a clear longitudinal extension in a direction transverse to the connection axis between the two contact surfaces to be contacted
  • a high-frequency contact element arrangement according to the invention can be used as a so-called space translator assembly can be used.
  • Distance translator assembly is understood to mean an assembly which in each case realizes electrical contact between contact surfaces that are respectively arranged and to be contacted in a first grid spacing and associated contact surfaces that are respectively arranged and to be contacted in a second grid spacing.
  • the first grid spacing is different from the second grid spacing.
  • FIG Figures 1A to 1C the principle of the method according to the invention for producing a high-frequency contact element is explained using FIG Figures 1A to 1C explained:
  • a base body part 1 of the high-frequency contact element 2 according to the invention is produced from a dielectric material.
  • the main body part 1 has a passage 4 in the direction of its longitudinal axis 3.
  • the main body part 1 has a single passage 4 which runs along the longitudinal axis 3.
  • the geometry of the dielectric base body part 1 does not necessarily have to be hollow cylindrical, as in FIG Figures 1A to 1C is shown for the sake of simplicity.
  • the geometry of the base body part 1 is preferably formed rotationally symmetrical to the longitudinal axis 3 in order to achieve coaxiality between the inner conductor and the outer conductor coating of the high-frequency contact element 2 according to the invention with the base body part 1 serving as an insulator element.
  • This coaxiality is an essential prerequisite for high-frequency-optimized contacting and transmission in an RF contact element.
  • the dielectric base body part 1 is coated with an electrically conductive coating 5, preferably a metallic coating 5.
  • the coating 5 completely encloses the dielectric base body part 1. Even with comparatively complex geometric shapes of the base body part 1, the entire outer surface of the base body part 1 is provided with a metallic coating 5 without any gaps.
  • the metallic coating 5 typically contains a metallic layer.
  • the dielectric base body part 1 is to be coated with an electrically conductive, preferably a metallic, starting layer by means of a non-electrochemical coating process.
  • the dielectric base body part 1 can each have a plurality of metallic layers over the entire surface or preferably selectively in certain areas in order to achieve special mechanical and electrical properties with this multiple coating.
  • the longitudinal extension of the base body part 1 is in contrast to the connection area 8 connecting the contact areas 7 11 or 7 12 and 7 21 or 7 22 , respectively, with increased mechanical and electrical requirements.
  • an additional gold layer in the two contacting areas 711, 7 12 , 7 21 and 7 22 , respectively advantageously brings about a higher abrasion resistance and at the same time a lower contact resistance.
  • the electrically conductive coating 5, preferably the metallic coating 5, is removed in an area 9 1 and 9 2 enclosing the bushing 5 at the first and second end 6 1 and 6 2 of the high-frequency contact element 2 according to the invention.
  • self-contained areas of the coating 5, which are each galvanically separated from one another, are formed on the outer surface of the base body part 1. These areas are on the one hand the area on the outer jacket surface of the base body part 1, which forms the outer conductor of the high-frequency contact element 2 according to the invention, and the areas in the individual bushings 5, which each form the individual inner conductors of the high-frequency contact element 2 according to the invention.
  • the original coating is divided into a coating 5 1 on the outer conductor side and a coating 5 2 on the inner conductor side.
  • an outer-conductor-side contacting area 7 11 and an outer-conductor-side contacting area 7 12 are formed at the first end 6 1 of the high-frequency contact element 2.
  • an outer-conductor-side contacting area 7 21 and an outer-conductor-side contacting area 7 22 are formed at the second end 6 2 of the high-frequency contact element 2.
  • a high-frequency contact element 2 according to the invention for contacting and transmitting a high-frequency signal can be produced by means of three successive and typically automatable production steps, without producing individual parts for the inner conductor element, the insulator element and the outer conductor element, which are then comparatively complex to assemble.
  • FIG. 2A and 2B shows a high-frequency contact element 2 according to the invention for contacting and transmission of a differential high-frequency signal.
  • it has two bushings 4 1 and 4 2 , which each run from the first end 6 1 to the second end 6 2 in the longitudinal extension of the high-frequency contact element 2.
  • the coatings 5 2 1 and 5 2 2 in the two bushings 4 1 and 4 2 each serve as an inner conductor, while the coating 5 1 on the outer jacket surface forms the outer conductor.
  • any number of technically sensible number of bushing pairs can be provided, the inner coating of which realizes the inner conductor pairs for transmitting a differential high frequency signal.
  • the individual pairs of bushings can be arranged either in a star shape or parallel to one another within the base body part 1.
  • a high-frequency contact element 2 is based Fig. 3 emerged.
  • the feedthrough 4 of the base body part 1 is completely filled with coating material by means of selective coating.
  • a coating can also be implemented within the feedthrough 4 which, compared to the coating 5 1 on the outside of the conductor, has a greater layer thickness and at the same time does not completely fill the feedthrough 4.
  • Such a selective coating with an increased layer thickness in the inner conductor area is particularly advantageous when contacting and transmitting high-frequency signals in a higher power range.
  • An increased layer thickness carried out by means of selective coating in a contact area 7 11 , 7 12 , 7 21 and 7 22 of the high-frequency contact element 2 according to the invention enables an extension of the service life of the high-frequency contact element, which is steadily shortening due to abrasion in the contact area.
  • Contact elements typically have an elastic behavior in connection area 8, on the one hand to achieve sufficient contact force in the contacting area with the contact surfaces or contact connections to be contacted and on the other hand to compensate for manufacturing tolerances between the contact surfaces or contact connections to be contacted.
  • the elasticity is preferably achieved over the entire longitudinal extent of the high-frequency contact element, ie over the entire connecting area 8 between the contacting areas 7 11 or 7 12 and 7 21 or 7 22 of the high-frequency contact element according to the invention.
  • only certain longitudinal sections of the high-frequency contact element can each be made elastic, between which inelastic longitudinal sections are provided.
  • FIG Figure 4A An embodiment for a longitudinal section of a high-frequency contact element according to the invention with elasticity, in which in particular the transmission of a high-frequency signal is possible, is shown in FIG Figure 4A evident.
  • the high-frequency contact element is implemented in the form of a torsion spring.
  • the cross-section of a torsion spring-shaped high-frequency contact element enables coaxiality to be achieved between the inner conductor and outer conductor-side coating 5 1 and 5 2 over the entire longitudinal extent and thus the realization of a elastic high-frequency contact element for contacting and transmission of a high-frequency signal.
  • additive manufacturing technology is preferably suitable for producing a base body part 1 with a torsion spring-shaped longitudinal extension in a comparatively simple manner.
  • expansions for the torsion spring-shaped high-frequency contact element can also be implemented, which allow a spacing for adjacent torsion-spring-shaped high-frequency contact elements, which is required when testing conductor tracks in semiconductor integration densities that can be realized today and in the future.
  • FIG. 4B Another suitable embodiment for a high-frequency contact element according to the invention with elasticity is a high-frequency contact element in the form of a spring arm according to FIG Figure 4B
  • the spring arm has, as in Figure 4B is shown, preferably two turns or curvatures (S-shaped course). This represents an implementation of a spring arm between the contacting areas 7 11 or 7 12 and 7 21 or 7 22 , which are each arranged in two mutually parallel planes, with minimal effort.
  • While the outer and inner diameter of the high-frequency contact element 2 at the first end 6 1 is smaller than the outer and inner diameter of the spring-arm-shaped connecting area 8 of the high-frequency contact element 2, the outer and inner diameter of the high-frequency contact element 2 at the second end 6 2 enlarged compared to the outer and inner diameter of the spring arm-shaped connecting area 8.
  • contact areas 7 11 and 7 12 on the first end 6 1 can be used to make contact with the outer conductor and inner conductor-side contact areas or contact connections on an integrated circuit to be tested, which have a comparatively small extent and / or a comparatively small distance from one another.
  • contact areas or contact connections can be made with the outer conductor and inner conductor side contacting areas 7 21 and 7 22 at the second end 6 2 , which are typically designed as an interface to a measuring device with a larger area and / or are arranged at a greater distance from one another.
  • the diameter jump on the inner conductor side is also offset in relation to the outer conductor side diameter jump in the area of the first and second ends 6 1 and 6 2 (so-called low-pass compensated, reflection-minimized transition).
  • a further variant for a high-frequency contact element according to the invention with elasticity is to produce the base body part 1 from an elastic dielectric material.
  • an elastomer for example silicone or natural rubber, is suitable, which can also be built up into any complex geometry using additive manufacturing technology. Since the layer thickness of the metallic coating 5 1 and 5 2 of the dielectric base body part 1 is comparatively very small in relation to the expansion of the dielectric base body part 1, the metallic coating 5 1 and 5 2 deforms together with the elastic dielectric base body part 1 when certain compression occurs - or tensile forces on the high-frequency contact element 2 according to the invention.
  • the inner conductor and outer conductor-side contacting areas 7 11 , 7 12 , 7 21 and 7 22 of the high-frequency contact element 2 When realizing the inner conductor and outer conductor-side contacting areas 7 11 , 7 12 , 7 21 and 7 22 of the high-frequency contact element 2 according to the invention, a one-part or a multi-part technical solution can be realized.
  • the inner conductor and outer conductor-side contacting areas 711, 7 12 , 7 21 and 7 22 are implemented in one piece with the connection area 8 within a single base body part 1.
  • the multi-part technical solution separate components for contacting are produced in a conventional or additive manufacturing technology and then jointly connected to the single base body part containing the connecting area 8 in the additive manufacturing process and built up to form a complete base body part 1.
  • the components for contacting can also be connected to the single base body part containing the connection area 8 by means of conventional connection technology, for example by means of soldering.
  • Out Figure 5A shows an exemplary embodiment for a one-piece implementation of the contacting areas with the connecting area 8 of the high-frequency contact element 2 according to the invention.
  • an end contact with the contact surface to be contacted or with the contact connection to be contacted is realized both on the inner conductor side and on the outer conductor side.
  • the first end 6 1 of the high-frequency contact element 2 according to the invention has an end face which is oriented such that, in the contacting state, it is oriented parallel or approximately parallel to the contact surfaces to be contacted.
  • a coating 5 1 or 5 2 on the outer conductor or inner conductor side is provided on the end face in the contacting area 7 11 and 7 12 on the outer conductor and inner conductor side.
  • the lateral extent of the inner conductor-side and outer-conductor-side coating 5 1 and 5 2 is to be dimensioned in such a way that there is in each case a sufficient contact area with the respective contact area to be contacted and thus a good transition resistance.
  • the outer diameter of the base body part 1 and thus the outer diameter of the high-frequency contact element 2 according to the invention in the outer conductor-side contacting area 7 11 is increased.
  • the effective permittivity at the first end 6 1 is reduced to the same extent.
  • the coating 5 removed in the frontal area between the inner conductor-side and outer-conductor-side coating 5 1 and 5 2 but also a sufficient area 10 of the dielectric base body part 1 below.
  • FIG Figure 5B A multi-part technical solution for the inner conductor and outer conductor-side contacting areas of a high-frequency contact element 2 according to the invention is shown in FIG Figure 5B shown.
  • the enlargement of the contact area in the inner conductor and outer conductor-side contacting areas 7 11 and 7 12 and the respective contact surfaces or contact connections to be contacted is achieved by applying to the coated base body part 1 in the area of the inner-conductor-side and outer-conductor-side contacting areas 7 11 and 7 12 a contact crown 11 1 or 11 2 is placed.
  • This contact crown 11 1 or 11 2 is made from a metal with good electrical conductivity and is preferably connected to the inner conductor-side or outer-conductor-side coating 5 1 and 5 2 by means of soldering.
  • FIG. 5C Another variant of a multi-part technical solution for the inner conductor and outer conductor-side contacting areas of a high-frequency contact element 2 according to the invention is based Figure 5C emerged.
  • contact tips 12 1 , 12 2 , 12 3 are used as components for making contact.
  • the individual contact tips 12 1 , 12 2 , 12 3 are each made of a metal with good electrical conductivity and each have a shaft with which they are inserted into an associated bore of the high-frequency contact element 2 according to the invention.
  • a single contact tip 12 1 is preferred for contacting the inner conductor inserted with its shaft in the feedthrough 4 of the coated base body part 1 and soldered to the coating on the inner conductor side.
  • a plurality of contact tips 12 2 , 12 3 are preferably provided for the external conductor contact, each of which is inserted with its shaft in a hole arranged in the area of the external conductor-side coating 5 2 .
  • the contact tips 12 2 , 12 3 are here preferably arranged in equidistant angular sections on a circle around the longitudinal axis 3 of the high-frequency contact element 2 according to the invention.
  • Out Figure 5D a further variant of a multi-part technical solution for the inner conductor and outer conductor-side contacting areas of a high-frequency contact element 2 according to the invention emerges.
  • the components for contacting are each designed to be elastic. These elastic components for contacting 13 1 , 13 2 , 13 3 can be implemented in the connection area 8 as an alternative or in addition to the elasticity shown above.
  • the elastic components for contacting 13 1 , 13 2 , 13 3 are spring-arm-shaped components, which are also made hollow to increase the elasticity along the spring arm.
  • the elastic components for contacting 13 1 , 13 2 , 13 3 also have a shaft with which they are inserted into a bore at the first end 6 1 .
  • the individual elastic components for contacting 13 1 , 13 2 , 13 3 are each preferably equivalent to the arrangement of the contact tips on the inner conductor side and outer conductor side Figure 5C arranged.
  • the more complicated geometries can be used in the contacting according to the Figures 5C and 5D - namely contact tip and spring arm-shaped contact element - can also be produced in one piece in combination with the connection area 8 as a one-piece dielectric base body part 1 in an additive manufacturing process and by subsequent metallic coating.
  • This form of implementation is limited to the contacting on the outer conductor side.
  • the individual geometries of a component for contacting can each be produced separately as dielectric base body parts in an additive manufacturing process and then built up in combination with the dielectric base body part 1, which contains the connection area 8, in a continued additive manufacturing process to form a one-piece and complete base body part 1 .
  • This one-piece and complete basic body part 1 is then coated with metal.
  • outer conductor and inner conductor-side contacting regions 7 21 and 7 22 at the second end 6 2 of the high-frequency contact element 2 can be equivalent to the ones shown in FIG Figures 5A to 5D for the first end 6 1 each illustrated characteristics of a contact are carried out.
  • a special variant of a contact between the high-frequency contact element 2 according to the invention and the contact surfaces or contact connections to be contacted results from the Figures 5E and 5F :
  • the contact is made primarily in the radial direction between the contact area on the inner conductor side 7 12 of the high-frequency contact element 2 according to the invention and a solder ball 14 1 and between the outer conductor-side contacting area 7 11 of the high-frequency contact element 2 according to the invention and preferably several solder balls 14 2 and 14 3 .
  • the solder balls 14 1 , 14 2 and 14 3 are soldered onto a circuit board 15 and connected to associated conductor tracks.
  • contact can also be made with a housing of an integrated circuit or directly with a substrate.
  • solder balls 14 2 and 14 3 which are in electrical contact with the outer conductor-side contacting area are preferably shown in FIG Figure 5F arranged on a circle, which is located coaxially to the solder ball 14 1 , which makes contact with the inner conductor-side contacting area 7 12 of the high-frequency contact element 2 according to the invention.
  • the distance between the inner solder balls 14 1 and the outer solder balls 14 2 , 14 3 , 14 4 , 14s, 14 6 , and 14 7 is based on the diameter of the coated dielectric base body part 1 in the inner conductor or outer conductor-side contacting area 7 12 and 7 11 adapt.
  • the outer-conductor-side or inner-conductor-side contacting areas 7 11 and 7 12 of the high frequency according to the invention each have a bevel.
  • a step can be provided in the outer conductor-side or inner-conductor-side contacting area 7 11 or 7 12 of the high-frequency contact element 2 according to the invention.
  • the contact has not only a radially directed component, but also an axially directed component.
  • this contacting technology is also suitable for extremely miniaturized high-frequency contact elements according to the invention, which can be manufactured in the smallest dimensions using additive manufacturing process technology .
  • contact bodies which have a conically shaped contact surface, for example conical or frustoconical contact bodies, are preferably suitable.
  • cylindrical contact bodies are also conceivable.
  • solder balls can also be used as components for contacting based on the variants of Figures 5B, 5C and 5D belong to the high-frequency contact element 2 according to the invention and be connected to the coated dielectric base body part 1 of the high-frequency contact element 2 according to the invention.
  • the solder balls make contact with correspondingly curved, that is to say concave, contact surfaces in a printed circuit board, in an IC housing or directly in an IC substrate.
  • magnets with a specific polarity can be inserted in the base body part 1 adjacent to the contacting areas 7 11 , 7 12 , 7 21 and 7 22 .
  • These magnets can have magnetic or magnetizable areas which are in the contact surfaces or contact connections to be contacted or adjacent to the contact surfaces or contact connections to be contacted are arranged, interact and enable better contact.
  • the individual forms of impedance matching within the high-frequency contact element according to the invention between the respective contact surfaces or contact connections to be contacted are based on Figures 6A and presented until 6H:
  • the input impedances of the contact surfaces to be contacted each have identical, standardized values, for example 50 ⁇ .
  • the inner conductor and outer conductor-side contact surfaces to be contacted by the contacting areas 7 11 or 7 12 and 7 21 or 7 22 at the first and second ends 6 1 and 6 2 of the high-frequency contact element 2 each have different diameters, then in With regard to an impedance matching and at the same time a geometric matching, the associated contacting areas 7 11 or 7 12 and 7 21 or 7 22 at the first and second ends 6 1 and 6 2 to be adapted to the impedance and geometrical relationships of the contact surfaces to be contacted.
  • the coated base body part 1 takes of the high-frequency contact element 2 according to the invention according to Figure 6A the shape of a truncated cone.
  • the outer diameter of the high-frequency contact element 2 changes between the first and second ends 6 1 and 6 2 in the same ratio as the inner diameter.
  • the contact surfaces to be contacted with the contacting areas 7 11 or 7 12 and 7 21 or 7 22 at the first and second ends 6 1 and 6 2 are each asymmetrically offset from one another and the high-frequency contact element 2 'according to the invention is implemented elastically as a spring arm, this results in a geometric shape of the high-frequency contact element 2 'according to the invention Figure 6B .
  • the ratio between the outer and inner diameter de s high-frequency contact element 2, and thus the impedance of the high-frequency contact element 2 is continuously constant.
  • the impedance is in the contacting areas 7 11 or 7 12 and 7 21 or 7 22 to adapt to the impedance in the associated contact surfaces to be contacted and at the same time a continuous impedance transition as possible between the first and second ends 6 1 and 6 2 in the connection area 8 of the high-frequency contact element 2 according to the invention to accomplish.
  • Such an impedance matching can, for example, with an inner conductor and outer conductor side diameter jump or several inner conductor and outer conductor side diameter jumps, as they are in the contacting areas 7 11 or 7 12 and 7 21 or 7 22 of Figure 4B are shown.
  • FIG Figure 6C Another variant of an impedance-matched transmission within the high-frequency contact element according to the invention between contact areas to be contacted with the contact areas 7 11 or 7 12 and 7 21 or 7 22, each with an identical input impedance, is shown in FIG Figure 6C shown: While in this high-frequency contact element 2 according to the invention the inner diameter remains constant over the entire longitudinal extension of the contact element, the outer diameter increases from the first end 6 1 to the second end 6 2 over several stages.
  • the dielectric base body part 1 is built up by means of several layers 16 1 , 16 2 , 16 3 and 16 4 of a dielectric material, each with a different relative permittivity, stacked in the longitudinal direction .
  • the relative permittivity of the individual dielectric layers 16 1 , 16 2 , 16 3 and 16 4 decreases from the first end 6 1 to the second end 6 2 of the high-frequency contact element 2 according to the invention with regard to a constant impedance.
  • the relative permittivity of the individual dielectric layers within the dielectric base body part 1 changes indirectly proportionally to the change in the ratio between the outer and inner diameter in the individual layers.
  • the relative permittivity of the individual dielectric layers can be adjusted equivalently with regard to a constant impedance.
  • the number of stepped outside and / or inside diameter jumps and the associated number of dielectric layers with different relative permittivities are based on the technical possibility of finding and using dielectric materials with differently stepped relative permittivities for the additive manufacturing process.
  • a further technical variant of an impedance matching along the longitudinal extent of the high-frequency contact element 2 according to the invention is the modification of the effective permittivity of the dielectric base body part 1 along its longitudinal extent.
  • Cavities 17 are provided within the dielectric base body part 1, which are completely surrounded by the dielectric material of the base body part 1 and are preferably filled with air. Since the relative permittivity of air is one and is therefore lower than the relative permittivity of any other dielectric material used in the base body part 1, the effective permittivity in the longitudinal sections of the base body part 1 with cavities 17 is reduced compared to the longitudinal sections of the base body part 1 without cavities 16.
  • the effective permittivity of the high-frequency contact element 2 according to the invention can be specifically influenced along its longitudinal extent.
  • slots 28 can also be realized in the dielectric base body part 1 by means of an additive manufacturing process, which according to FIG Figures 6E to 6G extend over the entire radial extent of the base body part 1.
  • the effective permittivity along the longitudinal extent of the high-frequency contact element 2 according to the invention can also be specifically influenced by a suitable number, arrangement and geometric shape of such slots 28 and used for impedance matching along the longitudinal extent of the high-frequency contact element 2.
  • the elasticity of the high-frequency contact element 2 according to the invention can also be specifically influenced via these slots 28.
  • the high-frequency contact element 2 according to the invention can namely by means of the parallel slitting in the longitudinal direction of extent with a compression in the longitudinal axis direction, expand comparatively easily in the radial direction.
  • the slot width of the individual slots is smaller, preferably significantly smaller, than the wavelength of the high-frequency signal to be transmitted.
  • layers of a dielectric material must be built up in these slots 28 in the additive manufacturing process, which prevent metallization of the side walls of the slots 28 during the metallic coating of the base body part 1 and after the coating process are removable again.
  • photoresist can be used as the dielectric material for such sacrificial layers, which can also be selectively built up within the base body part 1 using additive manufacturing technology.
  • a suitable solvent for example by means of acetone
  • the outer conductor-side coating 5 1 must be removed in the area of the slot-shaped cavities 17 '.
  • the outer surface of the individual slots 28 is, for example, curved, that is to say concave or convex.
  • the metallic layer on the individual slits 28 can thus easily be recognized by an optical device, for example a laser device, which removes the metallic coating in these areas.
  • the individual cavities 17 and slots 28 according to the fourth and fifth embodiment of the invention can also be arranged and shaped in such a way that a continuous or stepped transition between two different impedances at the first and second end 6 1 and 6 2 can be realized.
  • a special form of a high-frequency contact element 2 according to the invention is shown, in which a high-frequency contact element 2 is elastically supported by an additional elastic element 18.
  • the additional elastic element 18 is attached between the high-frequency contact element 2 according to the invention and a connecting part 20 to be explained below.
  • the additional elastic element 18 can also be connected to a printed circuit board 15 to be contacted by the high-frequency contact element 2 according to the invention.
  • the elastic element 18, as in Fig. 7 is shown, preferably act to a torsion spring.
  • other elastic elements for example a plate spring, a spiral spring or a spring arm, are also possible. While the elasticity of all of these elastic elements is achieved by the geometric shape of the elastic element, a comparatively simply shaped element, for example a cylindrical element, made of an elastic material, for example an elastomer, can alternatively be used.
  • the connecting part 20 can be a connecting plate which is connected to the high-frequency contact element 2 according to the invention directly or with the interposition of a component for making contact.
  • the elastic element 18 can also be a printed circuit board 15 which is contacted by the high-frequency contact element according to the invention.
  • the high-frequency contact element arrangement 19 according to the invention can be, on the one hand, an arrangement of interconnected high-frequency contact elements 2 according to the invention, which are only connected together in the manufacturing process, preferably in the additive manufacturing process, and then separated for technical use.
  • the high-frequency contact element arrangement 19 according to the invention can, on the other hand, contain a plurality of high-frequency contact elements 2 according to the invention which are permanently connected to one another in technical application.
  • the second case it can be, for example, an interposer arrangement in which several high-frequency contact elements 2 according to the invention, connected in parallel, contact mutually parallel contact surfaces or contact connections on a circuit board, on an IC housing or directly on an IC substrate in parallel .
  • the individual high-frequency contact elements 2 according to the invention which are each connected to one another in parallel, can be shaped in such a way that their longitudinal extension also has a transverse component.
  • high-frequency contact elements for example, which run at an angle, as they are for example in FIG Fig. 7 is shown, a translation between contact areas to be contacted at a first grid spacing and contact areas to be contacted at a second grid spacing different from the first grid spacing is also possible.
  • the inventive High-frequency contact element arrangement as a distance translation assembly (English: space translator).
  • high-frequency contact elements 2 are each connected to the top of a connecting part 20 implemented as a connecting plate 20 via inner-conductor and outer-conductor-side contact components 21 with associated inner-conductor and outer-conductor-side contact surfaces on the top of connecting plate 20.
  • several high-frequency contact elements 2 according to the invention are connected on the underside of the connecting plate 20 via inner-conductor and outer-conductor-side contact components 21 with associated inner-conductor and outer-conductor-side contact surfaces on the underside of the connecting plate 20.
  • the connecting plate 20 is here made of an electrically non-conductive, i.e. dielectric, material made.
  • the contact components 21 are made of an electrically conductive material.
  • the connecting plate 20 can be manufactured in a separate conventional or additive manufacturing process.
  • the individual high-frequency contact elements 2 according to the invention can be arranged on the top and bottom of the connecting plate in a row at a certain constant or at a different distance.
  • an arrangement in a two-dimensional grid with a preferably constant or also a variable grid spacing from one another is possible.
  • there is also an arrangement of the high-frequency contact elements in a three-dimensional grid with several parallel ones Connecting plates and individual connecting webs connecting the parallel connecting plates are possible.
  • a bore 22 with an electrically conductive coating realizes an inner conductor-side connection between an inner-conductor-side contact component 21 on the top and on the underside of the connecting plate 20 and thus between a high-frequency contact element 2 according to the invention on the top and the bottom of the connecting plate 20
  • Contact components 21 each realize a connection on the outer conductor side between the individual high-frequency contact elements 2 according to the invention and a contact connection of a common ground on the lower or upper side of the connection plate 19.
  • the individual high-frequency contact elements 2 according to the invention are each connected on the inner conductor and outer conductor side to the associated inner conductor or outer conductor-side contact components 21, preferably by means of soldering, which in turn is connected to the electrically conductive inner coating of the associated bore 22 or to the associated contact connection of the common ground of the connecting plate 20 are preferably connected by soldering.
  • the inner conductor-side and outer-conductor-side contacting areas of the individual high-frequency contact elements 2 according to the invention can alternatively be connected directly to the electrically conductive inner coating of the associated bore 22 or to the associated contact connection of the common ground of the connecting plate 20 without the interposition of inner-conductor and outer-conductor-side contact components 21.
  • the design of the individual high-frequency contact element 2 according to the invention connected to the connecting plate 20 does not necessarily have to be, as in FIG Figure 8A is shown, hollow cylindrical be executed, but can take any of the forms shown above. Also, not all high-frequency contact elements 2 according to the invention have to have the same form within the high-frequency contact element arrangement according to the invention.
  • the high-frequency contact elements on the underside of the connecting plate 20 can each be non-elastic and hollow-cylindrical shaped high-frequency contact elements, while the high-frequency contact elements on the upper side of the connecting plate 20 can each be designed as elastic high-frequency contact elements shaped as a spring arm.
  • Out Figure 8B shows another variant of a high-frequency contact element arrangement 19 'according to the invention, in which the individual high-frequency contact elements 2' according to the invention are produced together with the connecting plate 20 'in a joint additive manufacturing process.
  • the connecting plate 20 ' only connects the high-frequency contact elements 2' arranged in each grid point to one another.
  • the inner conductor-side coating 5 2 of the individual high-frequency contact element 2 ' consequently extends from the inner-conductor-side contacting region 7 12 above the connecting plate 20' via an inner bore in the connecting plate 20 'to the inner conductor-side contacting area 7 22 below the connecting plate 20'.
  • the outer conductor-side coating 5 1 of the individual high-frequency contact element 2 ' extends between the outer-conductor-side contacting areas 7 11 of all high-frequency contact elements 2' located above the connecting plate 20 'and the top of the connecting plate 20' serving as a common ground, as well as between those below external conductor-side contacting regions 7 21 of all high-frequency contact elements 2 'located on the outer conductor side of the connecting plate 20' and the underside of the connecting plate 20 'serving as a common ground.
  • the position of the connecting plate 20 'along the longitudinal extent of the individual high-frequency contact elements 2' does not necessarily have to be in the middle of the longitudinal extent, but can also be at any other position between the first and second ends 6 1 and 6 2 of the high-frequency contact elements 2 '.
  • several high-frequency contact elements 2' according to the invention can also be provided for increased mechanical stabilization suitably spaced apart connecting plates 20 'are used.
  • Figure 8C represents an arrangement of several high-frequency contact elements 2 according to the invention, each arranged in a two-dimensional grid, between two printed circuit boards 15 1 and 15 2 to be contacted, IC housings 15 1 and 15 2 or IC substrates 15 1 and 15 2 .
  • Contact elements 2 each have elasticity due to their torsion spring-shaped shaping present in the central region of the longitudinal extension.
  • the arrangement of parallel contact elements 2 is in the variant of Figure 8C realized without a connecting plate 20 or without connecting webs 20 in order to also limit the bending of the individual elastic high-frequency contact elements 2 in the transverse direction when the individual elastic high-frequency contact elements 2 are compressed to a greater extent in addition to the compression of the individual contact elements 2 in the longitudinal direction enable.
  • Out Figure 8D shows a high-frequency contact element arrangement in which several high-frequency contact elements 2 according to the invention, each arranged in a two-dimensional grid, are between two printed circuit boards 15 1 and 15 2 , IC housings 15 1 and 15 2 or IC substrates 15 1 and 15 2 are located.
  • the individual high-frequency contact elements 2 according to the invention are on the one hand each angled, preferably twice angled, shaped and on the other hand are each stepped with regard to their outer diameter.
  • the high-frequency contact element arrangement 19 it is possible with the high-frequency contact element arrangement 19 according to the invention to make electrical contact with individual contact surfaces arranged in a comparatively narrow grid on a circuit board 15 1 , an IC housing 15 1 or an IC substrate 15 1 and with associated Contact areas arranged in a larger grid on a circuit board 15 2 , an IC package 15 2 or an IC substrate 15 2 to connect.
  • a so-called high-frequency spacer assembly space translator arrangement
  • the coarser grid spacing enables the use of a simpler and therefore more cost-effective production technology on the printed circuit board 15 2 , on the IC housing 15 2 or on the IC substrate 15 2 .
  • a connection to high-frequency cables, lines and plugs, which are typically larger in size, can be realized.
  • FIG 8E a section of a high-frequency contact element arrangement 19 according to the invention is shown, in which the high-frequency contact element 2 is connected to a connecting plate 20 which connects the individual high-frequency contact elements 2 and which are each designed as an electrical circuit carrier.
  • the electrical signal lines 23 can be attached to the top 24 and / or to the bottom 25 of the connecting plate 20.
  • These electrical signal lines 23 connect the individual high-frequency contact elements 2 according to the invention, which are located above and / or below the connecting plate 20 serving as an electrical circuit carrier, with associated active or passive electronic components on the top 24 or bottom 25 of the connecting plate 20 the high-frequency contact element 2 according to the invention each contacted and transmitted high-frequency signals via these electrical signal lines 23, which are preferably optimized in terms of high-frequency technology Striplines are realized, to be led to a common high-frequency connector which is positioned at a suitable point on the connecting plate 20.
  • the outer conductor-side coating 5 1 of the individual high-frequency contact element 2 according to the invention is in each case connected directly to an associated signal line 23 applied to the top 24 and / or bottom 25, which represents the ground line of a stripline.
  • the inner conductor-side coating 5 2 of the individual high-frequency contact elements 2 according to the invention is in each case connected via an electrical signal line 26 running within the connecting plate 20 to an electrical signal line 23 applied to the top 24 and / or bottom 25.
  • High-frequency contact element arrangement 19 ′ according to the invention implemented in one piece is connected directly to the inner conductor-side coating 5 2 of the high-frequency contact element 2.
  • the electrical signal line 26 running inside the connecting plate 20 is connected to the electrical coating of a bore 22 running in alignment with the lead-through 4 of the high-frequency contact element 2 within the connecting plate 20.
  • the electrically conductive coating of the bore 22 within the connecting plate 20 makes contact with the inner conductor-side coating 5 2 of the high-frequency contact element 2.
  • the electrical connection between the electrical signal line 26 running within the connecting plate 20 and the electrical signal line 23 running on the top or bottom 24 or 25 of the connecting plate 20 is carried out via an electrically conductive coating of a bore 22 ', which is connected to an electrical signal line 23 on the top or bottom 24 or 25 of the connecting plate 20 is applied.
  • This electrical signal line 23 represents the inner conductor of a stripline.
  • a high-frequency contact element arrangement 19 according to the invention emerges, which only in the manufacturing process holds the individual high-frequency contact elements 2 according to the invention together in a certain grid and serves as a support geometry.
  • the individual high-frequency contact elements 2 according to the invention are separated from one another within the high-frequency contact element arrangement 19.
  • a predetermined breaking point 27 is provided in the connecting plate 20, which can also be composed of individual connecting webs 20 between the individual high-frequency contact elements 2 according to the invention.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Leads Or Probes (AREA)

Claims (16)

  1. Procédé de fabrication d'au moins un élément de contact à haute fréquence (2) ou d'une disposition d'éléments de contact à haute fréquence (19), constituée d'au moins un tel élément de contact à haute fréquence (2), avec les étapes suivantes :
    • fabrication d'une partie de corps de base (1) de chaque élément de contact à haute fréquence (2) à partir d'un matériau diélectrique au moyen d'un procédé de fabrication additif, dans lequel la partie de corps de base (1) comprend un passage (4 ; 41, 42) entre une première extrémité (61) et une deuxième extrémité (62) d'une extension longitudinale de la partie de corps de base (1),
    • revêtement de la partie de corps de base (1) avec une couche électroconductrice, caractérisé par l'étape supplémentaire suivante :
    • élimination de la couche électroconductrice dans une zone (91, 92) entourant le passage (4 ; 41, 42) au niveau de la première extrémité (61) et de la deuxième extrémité (62) de la partie de corps de base (1) pour la formation d'un revêtement électroconducteur côté conducteur externe (51) et d'un revêtement électroconducteur côté conducteur interne (52).
  2. Procédé selon la revendication 1,
    caractérisé en ce que
    le revêtement est réalisé de façon à ce que le passage (4 ; 41, 42) soit entièrement rempli avec la couche électroconductrice.
  3. Procédé selon la revendication 1 ou 2
    caractérisé en ce que
    le revêtement du corps de base diélectrique (1) est un revêtement avec plusieurs couches métalliques, dans lequel les couches métalliques sont constituées chacune d'un matériau métallique différent.
  4. Procédé selon l'une des revendications 1 à 3,
    caractérisé en ce que
    l'élément de contact (2) est conçu, dans au moins une zone, de manière élastique, dans lequel l'au moins une zone conçue de manière élastique de l'élément de contact (2) est constituée d'un matériau diélectrique élastique ou est réalisée à l'aide d'un formage élastique, dans lequel le formage élastique est réalisé plus particulièrement par la formation d'un ressort de torsion ou d'un bras à ressort.
  5. Procédé selon l'une des revendications 1 à 4,
    caractérisé en ce que
    un tracé d'impédance de l'élément de contact à haute fréquence (2) entre la première extrémité (61) et la deuxième extrémité (62) est ajusté à l'aide du matériau et/ou du formage de la partie de corps de base (1).
  6. Procédé selon l'une des revendications 1 à 5,
    caractérisé en ce que
    la partie de corps de base (1) est réalisé avec un diamètre côté conducteur interne et côté conducteur externe variable (1) entre la première extrémité (61) et la deuxième extrémité (62), dans lequel un rapport entre le diamètre côté conducteur interne et le diamètre côté conducteur externe de la partie de corps de base (1) est constant entre la première extrémité (61) et la deuxième extrémité (62).
  7. Procédé selon l'une des revendications 1 à 5,
    caractérisé en ce que
    la partie de corps de base (1) est réalisé avec un diamètre côté conducteur interne et côté conducteur externe variable entre la première extrémité (61) et la deuxième extrémité (62), dans lequel le rapport entre le diamètre côté conducteur interne et le diamètre côté conducteur externe de la partie de corps de base (1) est variable en permanence entre la première extrémité (61) et la deuxième extrémité (62).
  8. Procédé selon l'une des revendications 1 à 7,
    caractérisé en ce que
    à l'intérieur de la partie de corps de base diélectrique (1) est formée au moins une cavité (17) qui est remplie avec un autre matériau diélectrique, plus particulièrement de l'air, dans lequel une permittivité relative de l'autre matériau diélectrique est différente d'une permittivité relative du matériau diélectrique de la partie de corps de base (1).
  9. Procédé selon l'une des revendications 1 à 8,
    caractérisé en ce que
    à l'intérieur de la partie de corps de base diélectrique (1), sont formées plusieurs fentes (28) s'étendant parallèlement dans une extension longitudinale de l'élément de contact (2), de façon à ce qu'elles s'étendent sur toute l'extension radiale de la partie de corps de base (1).
  10. Procédé selon l'une des revendications 1 à 9,
    caractérisé en ce que
    dans plusieurs couches de la partie de corps de base diélectrique (1), le long de l'extension longitudinale de la partie de corps de base (1), sont utilisés des matériaux diélectriques avec des permittivités relatives différentes.
  11. Procédé selon l'une des revendications 1 à 10,
    caractérisé en ce que
    la partie de corps de base (1) est reliée, au niveau de la première extrémité (61) et de la deuxième extrémité (62) de l'élément de contact (2), respectivement côté conducteur interne et côté conducteur externe, avec un composant pour une mise en contact, plus particulièrement, avec un composant élastique de mise en contact.
  12. Procédé selon l'une des revendications 1 à 11,
    caractérisé en ce que
    plusieurs éléments de contact à haute fréquence (2) sont fabriqués de manière cohérente à partir du matériau diélectrique sur au moins une partie de connexion (20 ; 20').
  13. Procédé selon la revendication 12,
    caractérisé en ce que
    une élimination d'au moins une partie de liaison (20 ; 20') et une élimination de la couche électroconductrice au niveau de la première extrémité (61) et de la deuxième extrémité (62) de chaque élément de contact (2) sont effectuées dans la même étape de fabrication.
  14. Procédé selon la revendication 12 ou 13,
    caractérisé en ce que
    entre la partie de liaison (20 ; 20') et au moins un élément de contact à haute fréquence (20), est réalisé un élément élastique (18) supplémentaire pour le montage élastique de l'élément de contact à haute fréquence sur la partie de liaison.
  15. Procédé selon l'une des revendications précédentes, dans lequel, au niveau de la première extrémité (61) et/ou de la deuxième extrémité (62) de la partie de corps de base (1), est réalisée une zone de mise en contact (711, 721, 712, 722), respectivement côté conducteur interne et côté conducteur externe, avec chacune une mise en contact orientée dans une extension radiale de la partie de corps de base (1), de façon à ce que la zone de mise en contact côté conducteur interne (712, 722) entre en contact, avec une première surface de contact, plus particulièrement avec une surface de contact sphérique d'une bille de soudure et zone de mise en contact côté conducteur externe (711, 721) entre en contact avec plusieurs surfaces de contact, plus particulièrement avec une surface de contact sphérique de plusieurs billes de soudure, dans la direction d'extension radiale.
  16. Élément de contact à haute fréquence (2) avec une disposition d'éléments de contact à haute fréquence (19 ; 19'), fabriqués chacun selon un procédé selon l'une des revendications 1 à 15.
EP19703289.9A 2018-02-26 2019-02-04 Procédé de fabrication d'au moins un élément de contact haute fréquence ou d'un ensemble d'élément de contact haute fréquence ainsi que des dispositifs associés Active EP3555967B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018104264.7A DE102018104264A1 (de) 2018-02-26 2018-02-26 Verfahren zur herstellung von mindestens einem hochfrequenz-kontaktelement oder einer hochfrequenz-kontaktelement-anordnung sowie zugehörige vorrichtung
PCT/EP2019/052562 WO2019162066A1 (fr) 2018-02-26 2019-02-04 Procédé de fabrication d'au moins un élément de contact haute fréquence ou d'un ensemble d'élément de contact haute fréquence ainsi que des dispositifs associés

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EP3555967A1 EP3555967A1 (fr) 2019-10-23
EP3555967B1 true EP3555967B1 (fr) 2020-12-16

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EP19703289.9A Active EP3555967B1 (fr) 2018-02-26 2019-02-04 Procédé de fabrication d'au moins un élément de contact haute fréquence ou d'un ensemble d'élément de contact haute fréquence ainsi que des dispositifs associés

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US (1) US11984693B2 (fr)
EP (1) EP3555967B1 (fr)
CN (1) CN112136250B (fr)
DE (1) DE102018104264A1 (fr)
WO (1) WO2019162066A1 (fr)

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Publication number Priority date Publication date Assignee Title
US11855376B2 (en) * 2021-03-24 2023-12-26 Teradyne, Inc. Coaxial contact having an open-curve shape
EP4318823A4 (fr) * 2021-04-25 2024-05-22 Huawei Technologies Co., Ltd. Dispositif de connexion et module radiofréquence

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US5158465A (en) * 1990-02-23 1992-10-27 General Electric Company Audio jack connector
JPH0754868B2 (ja) 1991-09-30 1995-06-07 松下電器産業株式会社 高周波モジュール基板
DE19945178C2 (de) 1999-09-21 2003-05-28 Rosenberger Hochfrequenztech Meßspitze zur Hochfrequenzmessung und Verfahren zu deren Herstellung
JP2008021637A (ja) * 2006-06-12 2008-01-31 Fujikura Ltd ソケットとその製造方法及び半導体装置
US9276336B2 (en) * 2009-05-28 2016-03-01 Hsio Technologies, Llc Metalized pad to electrical contact interface
WO2011153298A1 (fr) * 2010-06-03 2011-12-08 Hsio Technologies, Llc Logement d'isolant de connecteur électrique
DE202011003443U1 (de) * 2011-03-02 2011-12-23 Bego Medical Gmbh Vorrichtung zur generativen Herstellung dreidimensionaler Bauteile
GB201418479D0 (en) 2014-10-17 2014-12-03 Creo Medical Ltd Cable for conveying radiofrequency and/or microwave frequency energy to an electrosurgical instrument
DE102016004520A1 (de) 2016-04-13 2017-10-19 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Kontaktstift und Testsockel mit Kontaktstiften

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EP3555967A1 (fr) 2019-10-23
CN112136250B (zh) 2022-04-08
US11984693B2 (en) 2024-05-14
CN112136250A (zh) 2020-12-25
DE102018104264A1 (de) 2019-08-29
WO2019162066A1 (fr) 2019-08-29
US20200403364A1 (en) 2020-12-24

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