EP3555967A1 - Procédé de fabrication d'au moins un élément de contact haute fréquence ou d'un ensemble d'élément de contact haute fréquence ainsi que des dispositifs associés - Google Patents

Procédé de fabrication d'au moins un élément de contact haute fréquence ou d'un ensemble d'élément de contact haute fréquence ainsi que des dispositifs associés

Info

Publication number
EP3555967A1
EP3555967A1 EP19703289.9A EP19703289A EP3555967A1 EP 3555967 A1 EP3555967 A1 EP 3555967A1 EP 19703289 A EP19703289 A EP 19703289A EP 3555967 A1 EP3555967 A1 EP 3555967A1
Authority
EP
European Patent Office
Prior art keywords
contact element
frequency
body part
frequency contact
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19703289.9A
Other languages
German (de)
English (en)
Other versions
EP3555967B1 (fr
Inventor
Hauke SCHÜTT
Waldemar Schmidt
Alexandra HENNIGER-LUDWIG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosenberger Hochfrequenztechnik GmbH and Co KG
Original Assignee
Rosenberger Hochfrequenztechnik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rosenberger Hochfrequenztechnik GmbH and Co KG filed Critical Rosenberger Hochfrequenztechnik GmbH and Co KG
Publication of EP3555967A1 publication Critical patent/EP3555967A1/fr
Application granted granted Critical
Publication of EP3555967B1 publication Critical patent/EP3555967B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035—Plated dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2485—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point for contacting a ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2492—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point multiple contact points
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching
    • H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
    • H01R13/6476—Impedance matching by variation of conductive properties, e.g. by dimension variations by making an aperture, e.g. a hole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Definitions

  • a contact element both at its two contact points and between the two make contact with respect to its impedance reflection-minimized is executed, has a set impedance along its longitudinal extent.
  • a set impedance of a contact element is understood here and below to mean an impedance which is adapted between the two contact points to the impedance of the contact surface to be contacted in each case.
  • a preferably constant impedance over the entire longitudinal extent is realized by suitable shaping and choice of material of the contact element.
  • a continuous or at least multiple stepped transition between the two different values of a matched impedance at the two contact points of the contact element is realized by means of shaping and material selection in the contact element.
  • the elasticity is preferably formed in the connection region between the two contacting regions of the contact element.
  • only the contacting areas or the entire contact element can be designed to be elastic.
  • the contact element can also be composed of individual elas tical areas and arranged rigid areas between them.
  • Contacting areas with elasticity can be formed on the inner conductor and outer conductor side in each case preferably as dome-shaped components for contacting.
  • other geometrical shapes, which realize an elasticity such as, for example, feather-arm-shaped, plate-shaped derförmige or bending spring-shaped formations are used.
  • the impedance of the Hochfre frequency contact element in the two Kunststoff ists Schemeen and in certain sections between the two Kunststoffbe ranges along the length of the high-frequency contact element is determined in each case by a suitable choice of the lektrischen material of the main body part and by a suitable geometric shape of the dielectric body part ,
  • a multi-stepped change in the impedance along the longitudinal extension of the high-frequency contact element can be realized in a coaxial high-frequency contact element ⁇ light, that the innenleiter- and the outside
  • the individual high-frequency contact elements are additionally supported elastically by a separate elastic element.
  • This separate elastic ele ment is connected to the high-frequency contact element according to the invention in the connecting region between the two contacting regions of the high-frequency contact element and the connection plate in a suitable connection point.
  • an elastic element may preferably be a torsion spring are used, which is designed to allow the high-frequency contact element sufficient elasticity.
  • Space Translator assembly can be used.
  • Under a distance-translator assembly is understood to mean an assembly, each of which an electrical contact between each arranged in a first grid spacing and contact surfaces to be contacted and associated in a second Ras terabstand arranged and contact surfaces to be contacted Kon realized.
  • the first grid spacing is here at different than the second grid spacing.
  • 6F, 6G show a vertical and horizontal cross-sectional view of a high-frequency elastic contact element according to the invention of a fifth variant of an impedance matching
  • Fig. 8F is an isometric view of a high-frequency contact element arrangement according to the invention with predetermined breaking points.
  • the inner conductor and outer conductor side contacting regions 7u, 7i 2 , ⁇ zi and hi of the inventions to the invention high-frequency contact element 2 a one-piece or a multi-part technical solution can be realized.
  • the inner conductor and outer conductor-side contacting regions 7n, 712, 2i and ⁇ zi are realized in one piece with the connection region 8 within a single main body part 1.
  • the multi-part technical solution separate components for contacting in a conventional or additive manufacturing technology are produced and then connected to the single main body part containing the connecting portion 8 together in the additive manufacturing process and constructed to complete basic body part 1. Alternatively, the components for contacting after the additive construction and the coating process of the
  • the effective permittivity at the first end 6 1 is reduced to the same extent.
  • the coating 5 in the frontal region between the inner conductor side and the outer conductor side coating 5i and 5 2 but also a sufficient portion 10 of the underlying dielectric base body part 1 is removed.
  • the contact tips 12 2 , 12 a are preferably arranged in equidistant left-hand portions on a circle around the longitudinal axis 3 of the high-frequency contact element 2 according to the invention.
  • the input impedances of the contact pads to be contacted each have identical, standardized values, for example 50 W.
  • the contact surfaces respectively to be contacted with the contacting regions 7u, 712 and I21 or, 22 at the first and second ends 6 1 and 6 2 are each asymmetrically offset from one another and the high-frequency contact element 2 'according to the invention is elastically realized as a spring arm, this results a geometric shape of the inventive Shen high-frequency contact element 2 'shown in FIG. 6B.
  • the ratio between the outer and inner diameter de s high-frequency contact element 2, and thus the impedance of the high-frequency contact element 2 is continuous constant
  • a particular expression of a erfindungsge MAESSEN high-frequency contact element 2 is shown, in which a high-frequency contact element 2 is elastically supported by an additional elastic element 18.
  • the additional elastic element 18 is fastened between the high-frequency contact element 2 according to the invention and a connecting part 20 which will be explained below.
  • the additional elastic element 18 may also be connected to a printed circuit board 15 to be contacted by the high-frequency contact element 2 according to the invention.
  • a section of a high-frequency contact element arrangement 19 according to the invention is shown, in which the high-frequency Konta telement 2 is connected to a connecting the individual high-frequency contact element 2 connecting plate 20, which is designed as an electrical circuit carrier.
  • the electrical signal lines 23 may in this case be mounted on the upper side 24 and / or on the underside 25 of the connecting plate 20.
  • FIG. 8F shows a high-frequency contact element arrangement 19 according to the invention which, in the production process alone, holds the individual high-frequency contact elements 2 according to the invention together in a specific grid and serves as a support geometry.
  • the individual high-frequency contact elements 2 according to the invention within the high-frequency contact element arrangement 19 are separated from one another.
  • the connecting plate 20 which may be composed of individual connecting webs 20 between the individual high-frequency contact elements 2 according to the invention, each one predetermined breaking point 27 is provided.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'au moins un élément de contact haute-fréquence (2) ou d'un ensemble d'élément de contact haute-fréquence d'au moins un tel élément de contact haute-fréquence (2). L'invention concerne un procédé de fabrication d'un corps de base (1) de chaque élément de contact haute fréquence (2) à partir d'un matériau diélectrique au moyen d'un procédé de fabrication additif, ledit corps de base (1) comporte un passage (4) entre une première extrémité (61) et une deuxième extrémité (62) d'une extension longitudinale (3) de la partie du corps de base (1). Le procédé comprend en outre le revêtement de la partie du corps de base diélectrique (1) avec une couche électroconductrice (5) et le retrait de la couche électroconductrice (5) dans une zone entourant le passage (4) sur la première extrémité (61) et sur la deuxième extrémité (62) de la partie du corps de base (1) pour former un revêtement (51) électroconducteur côté conducteur extérieur et un revêtement (52) électroconducteur côté conducteur intérieur. La présente invention concerne en outre un élément de contact haute-fréquence (2) ou un ensemble d'élément de contact haute-fréquence.
EP19703289.9A 2018-02-26 2019-02-04 Procédé de fabrication d'au moins un élément de contact haute fréquence ou d'un ensemble d'élément de contact haute fréquence ainsi que des dispositifs associés Active EP3555967B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018104264.7A DE102018104264A1 (de) 2018-02-26 2018-02-26 Verfahren zur herstellung von mindestens einem hochfrequenz-kontaktelement oder einer hochfrequenz-kontaktelement-anordnung sowie zugehörige vorrichtung
PCT/EP2019/052562 WO2019162066A1 (fr) 2018-02-26 2019-02-04 Procédé de fabrication d'au moins un élément de contact haute fréquence ou d'un ensemble d'élément de contact haute fréquence ainsi que des dispositifs associés

Publications (2)

Publication Number Publication Date
EP3555967A1 true EP3555967A1 (fr) 2019-10-23
EP3555967B1 EP3555967B1 (fr) 2020-12-16

Family

ID=65279543

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19703289.9A Active EP3555967B1 (fr) 2018-02-26 2019-02-04 Procédé de fabrication d'au moins un élément de contact haute fréquence ou d'un ensemble d'élément de contact haute fréquence ainsi que des dispositifs associés

Country Status (5)

Country Link
US (1) US11984693B2 (fr)
EP (1) EP3555967B1 (fr)
CN (1) CN112136250B (fr)
DE (1) DE102018104264A1 (fr)
WO (1) WO2019162066A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11855376B2 (en) * 2021-03-24 2023-12-26 Teradyne, Inc. Coaxial contact having an open-curve shape
JP2024515754A (ja) * 2021-04-25 2024-04-10 華為技術有限公司 接続装置および無線周波数モジュール

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5158465A (en) * 1990-02-23 1992-10-27 General Electric Company Audio jack connector
JPH0754868B2 (ja) 1991-09-30 1995-06-07 松下電器産業株式会社 高周波モジュール基板
DE19945178C2 (de) * 1999-09-21 2003-05-28 Rosenberger Hochfrequenztech Meßspitze zur Hochfrequenzmessung und Verfahren zu deren Herstellung
JP2008021637A (ja) * 2006-06-12 2008-01-31 Fujikura Ltd ソケットとその製造方法及び半導体装置
WO2011153298A1 (fr) * 2010-06-03 2011-12-08 Hsio Technologies, Llc Logement d'isolant de connecteur électrique
US9276336B2 (en) * 2009-05-28 2016-03-01 Hsio Technologies, Llc Metalized pad to electrical contact interface
DE202011003443U1 (de) * 2011-03-02 2011-12-23 Bego Medical Gmbh Vorrichtung zur generativen Herstellung dreidimensionaler Bauteile
GB201418479D0 (en) 2014-10-17 2014-12-03 Creo Medical Ltd Cable for conveying radiofrequency and/or microwave frequency energy to an electrosurgical instrument
DE102016004520A1 (de) 2016-04-13 2017-10-19 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Kontaktstift und Testsockel mit Kontaktstiften

Also Published As

Publication number Publication date
CN112136250A (zh) 2020-12-25
US20200403364A1 (en) 2020-12-24
WO2019162066A1 (fr) 2019-08-29
EP3555967B1 (fr) 2020-12-16
DE102018104264A1 (de) 2019-08-29
US11984693B2 (en) 2024-05-14
CN112136250B (zh) 2022-04-08

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