EP3553813A4 - Matrizenkomponentenzuführvorrichtung - Google Patents

Matrizenkomponentenzuführvorrichtung Download PDF

Info

Publication number
EP3553813A4
EP3553813A4 EP16923292.3A EP16923292A EP3553813A4 EP 3553813 A4 EP3553813 A4 EP 3553813A4 EP 16923292 A EP16923292 A EP 16923292A EP 3553813 A4 EP3553813 A4 EP 3553813A4
Authority
EP
European Patent Office
Prior art keywords
matrix elements
providing matrix
providing
elements
matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP16923292.3A
Other languages
English (en)
French (fr)
Other versions
EP3553813A1 (de
EP3553813B1 (de
Inventor
Masashi Hayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Publication of EP3553813A1 publication Critical patent/EP3553813A1/de
Publication of EP3553813A4 publication Critical patent/EP3553813A4/de
Application granted granted Critical
Publication of EP3553813B1 publication Critical patent/EP3553813B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9505—Wafer internal defects, e.g. microcracks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/084—Product tracking, e.g. of substrates during the manufacturing process; Component traceability
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
EP16923292.3A 2016-12-06 2016-12-06 Matrizenkomponentenzuführvorrichtung Active EP3553813B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/086149 WO2018105032A1 (ja) 2016-12-06 2016-12-06 ダイ部品供給装置

Publications (3)

Publication Number Publication Date
EP3553813A1 EP3553813A1 (de) 2019-10-16
EP3553813A4 true EP3553813A4 (de) 2020-01-01
EP3553813B1 EP3553813B1 (de) 2023-07-26

Family

ID=62490886

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16923292.3A Active EP3553813B1 (de) 2016-12-06 2016-12-06 Matrizenkomponentenzuführvorrichtung

Country Status (5)

Country Link
US (1) US10879096B2 (de)
EP (1) EP3553813B1 (de)
JP (1) JP6623310B2 (de)
CN (1) CN110024098B (de)
WO (1) WO2018105032A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI756142B (zh) * 2021-06-15 2022-02-21 博磊科技股份有限公司 基板切斷裝置及基板切斷裝置的作動方法
JP7701815B2 (ja) * 2021-07-08 2025-07-02 株式会社Fuji 検査装置
JP7853114B2 (ja) * 2022-02-16 2026-04-28 株式会社ディスコ 基板の加工方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6149047A (en) * 1998-06-23 2000-11-21 Nec Corporation Die-bonding machine
WO2013145202A1 (ja) * 2012-03-29 2013-10-03 富士機械製造株式会社 ウエハマップデータ照合システム及びウエハマップデータ照合方法
WO2014068763A1 (ja) * 2012-11-02 2014-05-08 富士機械製造株式会社 ダイ供給装置のエキスパンドリング内径計測システム及び突き上げ動作干渉回避システム
WO2015022861A1 (ja) * 2013-08-14 2015-02-19 株式会社新川 半導体製造装置及び半導体装置の製造方法
EP2938176A1 (de) * 2012-12-20 2015-10-28 Fuji Machine Mfg. Co., Ltd. Chipzufuhrvorrichtung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4338374B2 (ja) * 2002-09-30 2009-10-07 株式会社日立ハイテクインスツルメンツ ダイピックアップ装置及びダイピックアップ方法
JP2011061069A (ja) 2009-09-11 2011-03-24 Renesas Electronics Corp 半導体装置の製造方法
JP2013004794A (ja) * 2011-06-17 2013-01-07 Renesas Electronics Corp 半導体チップのピックアップ装置、ピックアップ方法、ダイボンディング装置、ダイボンディング方法、半導体装置の製造方法
JP5941715B2 (ja) * 2012-03-19 2016-06-29 ファスフォードテクノロジ株式会社 ダイピックアップ装置及びダイピックアップ方法
JP5988453B2 (ja) * 2012-03-27 2016-09-07 富士機械製造株式会社 ダイ供給装置
WO2014083606A1 (ja) * 2012-11-27 2014-06-05 富士機械製造株式会社 ダイ供給装置
EP3280240B1 (de) * 2015-03-30 2023-05-17 FUJI Corporation Informationsverwaltungsvorrichtung und informationsverwaltungsverfahren

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6149047A (en) * 1998-06-23 2000-11-21 Nec Corporation Die-bonding machine
WO2013145202A1 (ja) * 2012-03-29 2013-10-03 富士機械製造株式会社 ウエハマップデータ照合システム及びウエハマップデータ照合方法
WO2014068763A1 (ja) * 2012-11-02 2014-05-08 富士機械製造株式会社 ダイ供給装置のエキスパンドリング内径計測システム及び突き上げ動作干渉回避システム
EP2938176A1 (de) * 2012-12-20 2015-10-28 Fuji Machine Mfg. Co., Ltd. Chipzufuhrvorrichtung
WO2015022861A1 (ja) * 2013-08-14 2015-02-19 株式会社新川 半導体製造装置及び半導体装置の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2018105032A1 *

Also Published As

Publication number Publication date
WO2018105032A1 (ja) 2018-06-14
CN110024098B (zh) 2023-04-25
EP3553813A1 (de) 2019-10-16
US10879096B2 (en) 2020-12-29
JPWO2018105032A1 (ja) 2019-07-25
EP3553813B1 (de) 2023-07-26
CN110024098A (zh) 2019-07-16
JP6623310B2 (ja) 2019-12-18
US20190355602A1 (en) 2019-11-21

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