EP3550624A4 - Composition pour agent d'encapsulation d'élément électronique organique, et agent d'encapsulation formé utilisant celle-ci - Google Patents

Composition pour agent d'encapsulation d'élément électronique organique, et agent d'encapsulation formé utilisant celle-ci Download PDF

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Publication number
EP3550624A4
EP3550624A4 EP17875300.0A EP17875300A EP3550624A4 EP 3550624 A4 EP3550624 A4 EP 3550624A4 EP 17875300 A EP17875300 A EP 17875300A EP 3550624 A4 EP3550624 A4 EP 3550624A4
Authority
EP
European Patent Office
Prior art keywords
encapsulant
composition
same
electronic element
organic electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP17875300.0A
Other languages
German (de)
English (en)
Other versions
EP3550624A1 (fr
Inventor
Sun Yu
Nan Soo Kim
Minjae Jeong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Momentive Performance Materials Korea Co Ltd
Original Assignee
Momentive Performance Materials Korea Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Momentive Performance Materials Korea Co Ltd filed Critical Momentive Performance Materials Korea Co Ltd
Publication of EP3550624A1 publication Critical patent/EP3550624A1/fr
Publication of EP3550624A4 publication Critical patent/EP3550624A4/fr
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/151—Copolymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80—Constructional details
    • H10K10/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/40—Organosilicon compounds, e.g. TIPS pentacene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/458—Block-or graft-polymers containing polysiloxane sequences containing polyurethane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Electroluminescent Light Sources (AREA)
  • Silicon Polymers (AREA)
EP17875300.0A 2016-11-30 2017-11-28 Composition pour agent d'encapsulation d'élément électronique organique, et agent d'encapsulation formé utilisant celle-ci Withdrawn EP3550624A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160162213A KR20180062201A (ko) 2016-11-30 2016-11-30 유기 전자 소자 봉지재용 조성물 및 이를 이용하여 형성된 봉지재
PCT/KR2017/013701 WO2018101706A1 (fr) 2016-11-30 2017-11-28 Composition pour agent d'encapsulation d'élément électronique organique, et agent d'encapsulation formé utilisant celle-ci

Publications (2)

Publication Number Publication Date
EP3550624A1 EP3550624A1 (fr) 2019-10-09
EP3550624A4 true EP3550624A4 (fr) 2020-07-29

Family

ID=62241686

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17875300.0A Withdrawn EP3550624A4 (fr) 2016-11-30 2017-11-28 Composition pour agent d'encapsulation d'élément électronique organique, et agent d'encapsulation formé utilisant celle-ci

Country Status (8)

Country Link
US (1) US10836907B2 (fr)
EP (1) EP3550624A4 (fr)
JP (1) JP6770204B2 (fr)
KR (1) KR20180062201A (fr)
CN (1) CN109983595B (fr)
AU (1) AU2017367465B2 (fr)
TW (1) TWI733960B (fr)
WO (1) WO2018101706A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018106011A1 (fr) * 2016-12-09 2018-06-14 모멘티브퍼포먼스머티리얼스코리아 주식회사 Composition pour agent d'encapsulation d'élément électronique organique et agent d'encapsulation formé en utilisant celle-ci
EP3565014A4 (fr) * 2016-12-27 2020-08-12 Momentive Performance Materials Korea Co., Ltd. Composition d'encapsulation de dispositif électronique organique et encapsulation formée à l'aide de celle-ci
TWI724765B (zh) * 2020-01-21 2021-04-11 達興材料股份有限公司 可雷射離型的組成物、其積層體和雷射離型方法
CN111269259A (zh) * 2020-03-27 2020-06-12 吉林奥来德光电材料股份有限公司 化合物、光电器件封装用组合物、制备方法、封装薄膜

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998046693A1 (fr) * 1997-04-14 1998-10-22 Dsm N.V. Composition de resine liquide durcissable
JP2006052356A (ja) * 2004-08-16 2006-02-23 Shin Etsu Chem Co Ltd 紫外線硬化性コーティング組成物
JP2014001341A (ja) * 2012-06-20 2014-01-09 Momentive Performance Materials Inc 紫外線硬化型シリコーン樹脂組成物、及びそれを用いた画像表示装置
KR20140140769A (ko) * 2013-05-30 2014-12-10 제일모직주식회사 봉지용 조성물, 이를 포함하는 장벽층 및 이를 포함하는 봉지화된 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3729309B2 (ja) * 1998-06-19 2005-12-21 株式会社成和化成 シラン化合物共重合組成物の製造方法
KR101553717B1 (ko) 2009-08-21 2015-09-16 코오롱인더스트리 주식회사 봉지재용 조성물, 경화물 및 유기발광소자
KR101253528B1 (ko) 2010-06-29 2013-04-11 차혁진 봉지막의 제조방법，이로부터 제조된 봉지막 및 이를 포함하는 유기전자소자
CN103946998B (zh) * 2011-11-18 2017-03-29 Lg化学株式会社 用于封装有机电子器件的光可固化压敏粘合剂膜，有机电子器件及其封装方法
KR101591142B1 (ko) 2013-03-22 2016-02-02 제일모직주식회사 광경화 조성물, 이를 포함하는 장벽층 및 이를 포함하는 봉지화된 장치
KR101687874B1 (ko) * 2013-09-30 2016-12-19 주식회사 엘지화학 라디칼 경화형 접착제 조성물, 이를 포함하는 편광판 및 광학 부재
TWI624510B (zh) * 2014-02-04 2018-05-21 日商道康寧東麗股份有限公司 硬化性聚矽氧組合物、其硬化物及光半導體裝置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998046693A1 (fr) * 1997-04-14 1998-10-22 Dsm N.V. Composition de resine liquide durcissable
JP2006052356A (ja) * 2004-08-16 2006-02-23 Shin Etsu Chem Co Ltd 紫外線硬化性コーティング組成物
JP2014001341A (ja) * 2012-06-20 2014-01-09 Momentive Performance Materials Inc 紫外線硬化型シリコーン樹脂組成物、及びそれを用いた画像表示装置
KR20140140769A (ko) * 2013-05-30 2014-12-10 제일모직주식회사 봉지용 조성물, 이를 포함하는 장벽층 및 이를 포함하는 봉지화된 장치

Also Published As

Publication number Publication date
WO2018101706A1 (fr) 2018-06-07
TWI733960B (zh) 2021-07-21
CN109983595B (zh) 2023-04-04
AU2017367465A1 (en) 2019-06-06
JP6770204B2 (ja) 2020-10-14
TW201829627A (zh) 2018-08-16
AU2017367465B2 (en) 2020-07-23
KR20180062201A (ko) 2018-06-08
EP3550624A1 (fr) 2019-10-09
CN109983595A (zh) 2019-07-05
JP2020513674A (ja) 2020-05-14
US10836907B2 (en) 2020-11-17
US20200056041A1 (en) 2020-02-20

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