EP3527044A1 - Ruban de diodes électroluminescentes, procédé de fabrication d'une bande de diodes électroluminescentes et bande de diodes électroluminescentes - Google Patents

Ruban de diodes électroluminescentes, procédé de fabrication d'une bande de diodes électroluminescentes et bande de diodes électroluminescentes

Info

Publication number
EP3527044A1
EP3527044A1 EP17784627.6A EP17784627A EP3527044A1 EP 3527044 A1 EP3527044 A1 EP 3527044A1 EP 17784627 A EP17784627 A EP 17784627A EP 3527044 A1 EP3527044 A1 EP 3527044A1
Authority
EP
European Patent Office
Prior art keywords
strip
emitting diode
led
base profile
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP17784627.6A
Other languages
German (de)
English (en)
Other versions
EP3527044B1 (fr
Inventor
Gerhard Kager
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102017106291.2A external-priority patent/DE102017106291A1/de
Application filed by Individual filed Critical Individual
Publication of EP3527044A1 publication Critical patent/EP3527044A1/fr
Application granted granted Critical
Publication of EP3527044B1 publication Critical patent/EP3527044B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/26—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic
    • B60Q1/2696—Mounting of devices using LEDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/26—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic
    • B60Q1/30—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating rear of vehicle, e.g. by means of reflecting surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/26—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic
    • B60Q1/32—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating vehicle sides, e.g. clearance lights
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q3/00—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors
    • B60Q3/30—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors for compartments other than passenger or driving compartments, e.g. luggage or engine compartments
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/15—Strips of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • LED strips in the following, in particular LED strips, in which LED chips are mounted in chip-on-board (COB) technology on flexible printed circuit boards (also called flex PCBs), must have an encapsulation that the LED chips including circuit board sealed and thus protects against mechanical damage, dust, water and other environmental influences.
  • COB chip-on-board
  • LED chips include both light-emitting housings provided with a housing, for example with a lead-frame-based plastic sheath
  • Semiconductor bodies eg PLCC2 SMD LEDs, PLCC4 SMD LEDs or PLCC6 SMD LEDs
  • PLCC2 SMD LEDs PLCC2 SMD LEDs
  • PLCC4 SMD LEDs PLCC4 SMD LEDs
  • PLCC6 SMD LEDs Semiconductor bodies
  • Semiconductor bodies can be based on inorganic or
  • a disadvantage of the conventional potting methods is that the available potting systems a low degree of automation and consequently too low productivity as well as restrictions on the length of the
  • the invention relates to a first object.
  • LED chip equipped flexible conductor strip comprises and rolling up the LED strip on a second roll;
  • the elastic base profile is produced by means of profile extrusion.
  • the elastic base profile is essentially made
  • thermoplastic elastomer (TPE) material for example, thermoplastic urethane-based elastomer (TPU)
  • the elastic base profile is substantially made of PVC material, in particular soft PVC material, or im
  • Potting compound on the base profile, by means of a corona, a plasma, a chemical and / or a mechanical process, a surface texture of the material of the base profile, in particular its surface tension modified.
  • the LED strip by means of a
  • Connecting layer in particular by means of a double-sided adhesive tape or by means of an adhesive layer in
  • Treated potting compound and / or the cover profile provided base profile in a hardening or drying oven and the
  • finished LED strip is subsequently assembled into predetermined lengths or rolled up on a third roll.
  • the invention further relates to
  • a light-emitting diode strip in which a roll-up LED strip, which has a light-emitting diodes (LED) chips populated flexible conductor strip (Flex-PCB), in one
  • rolled up elastic base profile is fixed and is covered with a potting compound and / or, in particular rollable, cover profile.
  • the elastic base profile is produced by means of profile extrusion.
  • the elastic base profile comprises thermoplastic elastomer (TPE) material (for example, thermoplastic urethane-based elastomer (TPU)).
  • TPE thermoplastic elastomer
  • TPU thermoplastic urethane-based elastomer
  • the elastic base profile comprises PVC material, in particular soft PVC material, or another elastic thermoplastic material or an elastic thermoset material.
  • the potting compound is made of at least one PU material.
  • the LED strip (323) is sealed separately.
  • the light-emitting diode ribbon is wound onto a roll.
  • LED strip a light-emitting diode strip
  • Another method for producing "endless” fabricated LED strips is specified in claim 6.
  • Advantageous developments of the method are given in claims 7 to 16.
  • An “endless” manufactured LED strip is specified in claim 17.
  • Advantageous developments of the LED strip are specified in the claims 18 to 28. The disclosure of the claims is hereby expressly incorporated by reference to the description.
  • FIG. 1 shows a schematic representation of a perspective view of an LED strip produced according to the presently described method
  • Figure 2 a schematic representation of a
  • Encapsulation system for producing a LED strip - -
  • Figure 4 is a schematic representation of a perspective view of a base profile with Nutensteintechnik
  • FIG. 5 shows a schematic representation of a variant of an encapsulation system for carrying out the method
  • Figure 12 is a schematic representation of an exemplary embodiment of a system for encapsulation by means of a base profile and a cover;
  • Figure 13 is a schematic representation of a side view of a waved LED strip for use in an LED strip
  • Figure 18 a schematic representation of a sectional view of another embodiment of an LED strip with
  • thermoplastic elastomer (TPE) material for example thermoplastic urethane-based elastomer (TPU)
  • TPU thermoplastic urethane-based elastomer
  • PU aliphatic or aromatic polyurethane
  • PU aliphatic or aromatic polyurethane
  • PU aliphatic or aromatic polyurethane
  • the base profile consists essentially of PVC material, in particular soft PVC material, or essentially PVC material
  • soft PVC material having.
  • elastic thermoset materials such as unsaturated polyester (UP)
  • other thermoplastic materials such as polymethylmethacrylate (PMMA)
  • thermoplastic elastomer material thermoset material or thermoplastic material also include those materials which essentially comprise at least one thermoplastic material
  • thermoset material at least one thermoset material and / or at least one thermoplastic material, such as corresponding composite materials.
  • the elastic base profile 1 is preferably made with a wall thickness (or wall thickness) of between 1 mm and 3 mm, preferably between 1 mm and 2 mm (the
  • This base profile 1 is preferably rolled up; It can be produced in a wide variety of geometries and colors, resulting in increased design freedom. After the extrusion of the base profile 1, for example by means of a corona, a plasma, a chemical and / or a mechanical method a
  • TPE a PU material, which is used for casting, ie sealing the LED chips 3 including flexible printed circuit board, can be achieved.
  • TPE is mainly for the extrusion of the base profile 1, the use of others for the
  • thermoplastic polyurethane preferably a
  • PU aliphatic or aromatic polyurethane
  • PVC polyurethane
  • suitable textiles e.g., aluminum and copper
  • the base profile 1 is made in any length, preferably on a roll. This can be different
  • a nozzle 23 is arranged above the base profile 1
  • specified material preferably consists of PU, in the
  • Base profile 1 filled.
  • an LED strip 323 is inserted, which has a plurality of LED chips 3 arranged on a flexible conductor strip (Flex-PCB) 32.
  • the base profile 1 is made, for example, from TPE
  • the LED strip 323 can, for example, by means of a double-sided - -
  • Bonding layer to be fixed in the base profile.
  • Conductor band 32 (Flex PCB), ie the LED strip 323, via suitable guide means (not shown) in the
  • Base profile 1 is filled with a potting compound 2, preferably with a PU mass.
  • casting compound 2 is also conceivable, for example, silicone material. From the potting system 20 so spilled base profile 1 runs with the therein arranged LED chips 3 on flexible circuit board 32 for curing the potting compound 2 directly into a hardness or
  • Drying oven 4 and is then wound as a finished "endless" LED tape 5 on a particular intended for storage and transport roller 55 or alternatively
  • the entire casting system 20 is arranged in a curing or drying chamber or that, for example, the finished LED tape is not rolled up, but for example custom made in any length.
  • the potting compound 2 can be formed in multiple layers and can have several different layers.
  • a transparent, in other words transparent, in particular transparent, base-encapsulation 21 (for example PU transparent), produced via the LED chips, can be provided with a translucent, ie translucent, but opaque deck encapsulation 22 (for example, PU diffuse, for example by means of a
  • the potting compound 2 brings with it the particular advantage that luminescent spots, in particular caused by spaced apart LED chips, can be made "invisible” from the outside and thus the LED strip can be seen from the outside as a continuous homogeneous radiating luminescent band.
  • the base potting advantageously as a clear potting (eg. From clear PU or clear silicone material)
  • This can be a
  • the deck potting is also made of PU or silicone material.
  • a light-scattering filler are, for example, powder of silica,
  • potting compound 2 one or more, in particular partially differently colored
  • the first embodiment described above is the case with a cover profile 7 (see Figures 8 to 11), closed, which is preferably in turn made by means of profile extrusion.
  • Cover profile 7 may be elastic.
  • the cover profile 7 can advantageously one or more of the above in connection with the base profile. 1
  • cited materials in particular impact-modified PMMA or UV-stabilized PC have or consist of and is at least partially permeable formed for a light generated by the LED band light.
  • the base profile 1 and the cover profile 7 can
  • the cover 7 can advantageously an optical
  • Have functionality for example, be designed such that it has a lens (see Figure 10, lens part 9) and / or Strahlumsch Sweet (see Figure 11, reflector part 10) or with diffusers for
  • the flexible conductor strip 32 equipped with LED chips 3 can be sealed, for example, by means of painting processes, polymer coating, parylene coating or the like, for example for spray-water protection.
  • a seal does not provide adequate protection against mechanical influences and / or coarser
  • this protective function takes over the covering profile 7 together with the base profile 1. This makes it possible to realize high IP protection classes in a simple and thus economically favorable manner.
  • FIG. 12 shows a schematic representation of an exemplary embodiment of a system for encapsulation by means of a base profile 1 and a cover profile 7 according to the second development of the method.
  • the base profile 1 and the cover 7 are here as well as the LED strip 323 each of an associated in particular for storage and transport roller 11, 77 and 33 unrolled and suitable guide means (not
  • Cover profile 7 is placed on the base profile 1.
  • a subsequently arranged joining device 8 which has, for example, two rollers arranged one above the other, the base profile 1 and the cover profile 7
  • the joining process can be a compression (eg by tongue and groove principle), gluing,
  • Joining device 8 downstream hardening or drying oven 4 can be omitted if after connecting the
  • Drying step for example, for any one
  • Bonding layer e.g., adhesive layer
  • a possible sealing layer for the equipped with LED chips 3 flexible conductor strip 32 is required.
  • the joining device 8 the so-manufactured "endless" -LED-tape 5 is wound on another particular intended for storage and transport roller 55.
  • the first and the second advantageous development are combined.
  • Base profile 1 with casting compound 2 is also conceivable.
  • Such a combination of base profile 1, potting compound 2 and cover profile 7 can bring particular advantages especially in regions with high UV and / or surface load, in particular by wind and sand.
  • the cover 7 can be designed so that it is worn by environmental and
  • Base profiles 1 show. The following figures belong together in pairs: 3a / 3d; 3b / 3e; 3c / 3f and 3g / 3h).
  • extruded base profiles 1 and / or cover profiles 7 can be easily equipped with additional features such as mounting tabs (see Figures 3g and 3h) or other mounting elements, in a so-called in-line process without significant additional steps.
  • Base profile 1 can, for example, to its
  • Reinforcement / stiffening example a metal rail or other stiffening elements are arranged.
  • An integrated metal rail can also become one
  • FIG. 4 shows a schematic representation of a perspective view of a basic profile configured in this way.
  • a polymethyl methacrylate (PMMA), a polycarbonate or a polypropylene film (or other suitable transparent films) which may have a
  • a functional film 6 is unrolled from another roller 66, in particular for storage and transport, and is guided by suitable guide means (not shown) onto the LED chips 3 of FIG Led strip 323 out.
  • the "endless” LED strip 5 produced in this way is placed on another roller 55, which is provided in particular for storage and transport
  • a functional film 6 may also be incorporated according to a method as described above in connection with FIG. 12.
  • the hardening or drying oven 4 arranged downstream of the casting installation 20 or the joining apparatus 8 can be omitted and the installation comprising the rolls 11, 33 and 55 and optionally 66 and / or 77, if necessary the casting installation 20 , if necessary, the joining device 8 and the - -
  • Hardening or drying chamber can be arranged.
  • a laminated on the LED chips film such as a PMMA film (for example, to avoid a
  • Color locus shift can advantageously be laminated exactly over the LED chips, if desired with slight projection, so that the flanks of the LED chip are partially or completely covered by the functional film (see Figures 6 and 7, which are schematic sectional views
  • the (release) film can be colored. It may alternatively or additionally to the homogenization of the LED chips
  • radiated light or be designed as a lens.
  • a film may alternatively or additionally have light-scattering and / or refractive properties.
  • Such a film can also cause a "glare shield", which
  • Means of transport such as trucks, trailers, motorhomes, etc.
  • the scratch resistance of the product can be considerably improved by means of a scratch-resistant or scratch-resistant coated film laminated to the potting compound 2 as the uppermost layer.
  • a scratch-resistant or scratch-resistant coated film laminated to the potting compound 2 as the uppermost layer.
  • Such a film may in in-line process before or after curing of the potting compound 2 on the composite of base profile 1, LED strips, if necessary _ _
  • Such a film may alternatively or additionally light-scattering and / or refractive
  • Such a film can also provide a "glare shield" which is achieved, for example, by an integrated refractive structure or grain.These properties generate substantial advantages for the illumination of means of transport such as trucks, trailers, campers, etc.
  • scratch-resistant or scratch-resistant coated Film can be a scratch-resistant paint, for example a
  • Polyurethane (PU) paint can be used, or applied in-line method highly crosslinked and thus
  • Such a layer can be transparent, translucent, homogenizing or
  • LED strips can be produced, which by means of extrusion
  • elastic base profile 1 in which a flexible, preferably made of polyimide - -
  • Printed circuit board (flex-PCB) 32 with chip-on-board (COB) -mounted LED chips 3 is arranged and for protection against
  • a flexible potting compound 2 particularly preferably with a PU material (furthermore preferred is e.g.
  • Silicone material for example, as described above is cast (see Figures 1, 6 and 7) or
  • Cover profile 7, for example, as described above is closed (see Figures 9 to 11) or
  • PU material preferably with a PU material (further preferred is, for example, silicone material), for example as above
  • the base profile 1 is preferably made of a material and in a wall thickness, as it has already been mentioned above in connection with the description of the method for its production (see above the second, third and fourth paragraph after the figure short description).
  • a double-sided adhesive tape or an otherwise adhesive layer (not shown in the figures) can be arranged.
  • a functional film 6 for example, a release film to avoid a Farbortverschiebung be arranged.
  • the functional film 6 may alternatively or additionally
  • the base profiles 1 may have mounting elements that facilitate assembly of the encapsulated LED strips.
  • the basic profiles can, for example, by means of coextrusion with different properties in different
  • Cross-sectional areas are designed.
  • the back wall 12 of the base profile 1 and thus the back of the LED strip 5 can be made opaque and the side walls 13,14 of the base profile 1 are designed to be translucent to a lateral
  • the extruded profiles used as the base profile can have heat-dissipating properties by equipping them with one or more suitable additives and thus in the
  • Operation of the LED tapes contribute to improved heat dissipation from the LED chips and extend their life and / or increase the performance of the LED tapes. For example, by coextrusion only the back wall 12 of the base profile 1 or only the support surface of the LED tapes.
  • thermally conductive additives for example metallic or ceramic additives are added (see Figure 18). Such a configuration can be much higher
  • Luminous flux / lumen can be achieved and also the life of the LED chips can be increased by this improved thermal management.
  • a material for such a configured rear wall 12 of the base profile 1 is, for example, ALCOM TCE PC 5020 15011 from Albis Plastic GmbH. - -
  • the insides of a base profile may be at least partially reflective equipped or formed, for example, reflective films (for example, metallized PET films) can be inexpensively laminated in the extrusion process.
  • reflective films for example, metallized PET films
  • the cover profile 7 is preferably made of impact-modified PMMA or UV-stabilized PC.
  • the flexible conductor strip 32 is formed such that it at least along the longitudinal direction L of the LED strip 323 - and thus also at least along the longitudinal direction of the LED strip 5 as well as the base profile 1 - with respect to a
  • Mounting surface M for the LED strip 323 runs wavy.
  • the flexible conductor strip 32 is formed such that its course at least along the
  • Mounting surface M for the LED strip 323 has a ripple.
  • Potting compound 2, LED strips 323, ...) which can lead to damage by tearing of the flexible conductor strip 32, can be significantly reduced. This becomes more important the longer the finished LED strips are.
  • Encapsulation systems allow only very limited lengths of LED strips, because with increasing length of the LED strip mechanical stresses within the LED strip due to different thermal expansions or
  • conductor strip 32 has the advantage that the distance between the LED chips 3 in an LED strip 5 can be reduced in a simple manner. As a result, more homogeneous light solutions can be achieved.
  • corrugated herein is meant any form of flexible conductor band 32 (such as bent, zig-zagged, or a combination of creases and arcs), as a result of which the flexible conductor band 32, when inserted into the base profile 1 or is mounted on an otherwise flat support, along its longitudinal direction L is not continuous on the bottom or mounting surface M or on a compound layer applied thereto (eg., A double-sided adhesive tape) rests, but over this wavy runs in a predetermined manner, in each case between two contact zones A of the flexible conductor strip 32 on the base profile 1 and on the connecting layer a
  • a compound layer applied thereto eg., A double-sided adhesive tape
  • the flexible conductor strip 32 is shaped such that its course along _ -
  • the flexible conductor strip 32 is at a
  • a corrugated shape can be produced, for example, by bending or folding the flexible conductor strip 32 perpendicular to its main extension surface and transversely to its longitudinal direction L at predetermined intervals, for example in each case between two LED chips 3.
  • corrugated flexible conductor strip 32 is illustrated in FIG.
  • a corresponding bending or folding process for an LED strip 323, which is preferably carried out after the application of the LED chips 3 but also before, can be connected upstream of or in the above-described method
  • Folding process is an associated buckling or folding device in the devices according to Figures 2, 5 and 12 between the roller 33 with the LED strip 323 and the area
  • the flexible conductor strip 32 can be bent all dimensions due to this shaping and thus improved - -
  • the peak-to-valley value ST of the corrugated flexible conductor strip 32 in a base profile 1 is preferably between 1 mm and 6 mm, preferably between 2 and 6 mm. In other words, between two connection points between base profile 1 and flexible conductor strip 32 is the maximum
  • Distance of the flexible conductor strip 32 from the base profile 1 or optionally of the bonding layer preferably at least 1 mm and at most 6 mm, preferably between 2 and 6 mm.
  • FIGS. 14 to 17 Suitable methods for carrying out such a bending or folding process or for producing corrugated LED strips 323 are shown schematically in FIGS. 14 to 17.
  • the flexible conductor strip 32 of an LED strip 323 for example, in each case between two adjacent LED chips 3 by means of a two
  • embossing parts 12a and 12b pressing device 12 predetermined curvatures bent, which then leads to a generally described above in principle wavy shape of the LED strip 323 and the associated advantages for the LED strips 5 described above.
  • the bulges can also be arranged only every two, three, four or more LED chips 3 or at irregular intervals. Likewise, as needed between two LED chips 3 more such
  • LED chips 3 provided strip solder pads 324 of the flexible
  • Conductor band 32 run along its longitudinal sides. In a plurality of on one side of an LED chip 3rd
  • the associated solder pads 325 of the flexible conductor strip 32 are each in a row along the
  • solder pads 324 and 325 are schematically illustrated in FIG. 19. Such a longitudinal arrangement of the solder joints of the LED chips 3 increases the resistance of the LED strip 323 under torsional stress.
  • a conventional "cross brazed" LED chip in which an elongated solder pad or a plurality of on one side an LED chips
  • solder pads extending transversely to the longitudinal direction of the conductor strip or are arranged side by side, much lighter than an as described above in the longitudinal direction soldered LED chip.
  • LED bands represent the automotive sector, in particular the commercial vehicle or truck sector, and the architecture sector. - -
  • the LED strips are particularly suitable for trailer or container interior as well as
  • Luminaires or light bands from or with the above-mentioned LED strips can in the required IP protection class with much less effort in one
  • Conventional spot lighting can be an LED strip described above or a luminaire having such an LED strip, for example, in the upper edges of the trailer
  • installation aids integrated in the base profile with individually selected geometry can be installed. Subsequent installation (retrofitting) is on technical
  • LED bands according to the above solution or lights with such LED bands (light bands) in the required IP protection class with relatively little technical effort outside and / or inside of trailer or container can be integrated and used in boat and ship become.
  • the LED bands described herein can provide significant benefits, such as:

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)

Abstract

L'invention concerne un procédé de fabrication d'une bande de diodes électroluminescentes comprenant les étapes de procédé suivantes : fabriquer un profilé de base élastique (1) et enrouler le profilé de base élastique (1) sur un premier rouleau (11) ; fabriquer un ruban de LED (323) comportant une bande conductrice flexible (Flex-PCB) (32) équipée de puces (3) de diodes électroluminescentes (LED) et enrouler le ruban de LED (323) sur un second rouleau (33) ; dérouler le profilé de base (1) du premier rouleau (11) ; dérouler le ruban de LED (323) du second rouleau (33) et insérer le ruban de LED (323) dans le profilé de base (1) et recouvrir le ruban de LED (323) dans le profilé de base (1) avec une matière d'enrobage (2) et/ou un profilé de recouvrement (7). En outre, l'invention concerne une bande de diodes électroluminescentes dans laquelle un ruban de LED enroulable (323), qui comporte une bande conductrice élastique (Flex-PCB) (32) équipée de puces (3) de diodes électroluminescentes (LED), est fixé dans un profilé de base élastique enroulable (1) et recouvert avec une matière d'enrobage (2) et/ou un profilé de recouvrement (7) en particulier enroulable. Enfin, l'invention concerne un ruban de diodes électroluminescentes (323) dans lequel la bande conductrice flexible (32) est conçue de façon à onduler le long de sa direction longitudinale (L).
EP17784627.6A 2016-10-12 2017-10-12 Ruban de diodes électroluminescentes, procédé de fabrication d'une bande de diodes électroluminescentes et bande de diodes électroluminescentes Active EP3527044B1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DE102016119452 2016-10-12
DE102016123471 2016-12-05
DE102017000125 2017-01-09
DE102017106291.2A DE102017106291A1 (de) 2016-10-12 2017-03-23 Verfahren zum Herstellen eines Leuchtdiodenbandes und Leuchtdiodenband
DE102017110987 2017-05-19
PCT/EP2017/076084 WO2018069453A1 (fr) 2016-10-12 2017-10-12 Ruban de diodes électroluminescentes, procédé de fabrication d'une bande de diodes électroluminescentes et bande de diodes électroluminescentes

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EP3527044A1 true EP3527044A1 (fr) 2019-08-21
EP3527044B1 EP3527044B1 (fr) 2024-09-11

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EP17784627.6A Active EP3527044B1 (fr) 2016-10-12 2017-10-12 Ruban de diodes électroluminescentes, procédé de fabrication d'une bande de diodes électroluminescentes et bande de diodes électroluminescentes

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US (1) US11293606B2 (fr)
EP (1) EP3527044B1 (fr)
AU (1) AU2017343734B2 (fr)
DE (1) DE202017007378U1 (fr)
WO (1) WO2018069453A1 (fr)

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DE202017007378U1 (de) 2021-03-26
US20200182417A1 (en) 2020-06-11
WO2018069453A1 (fr) 2018-04-19
AU2017343734B2 (en) 2021-05-27
US11293606B2 (en) 2022-04-05
EP3527044B1 (fr) 2024-09-11
AU2017343734A1 (en) 2019-05-30

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