EP3497368B1 - Dissipateur thermique - Google Patents

Dissipateur thermique Download PDF

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Publication number
EP3497368B1
EP3497368B1 EP17841178.1A EP17841178A EP3497368B1 EP 3497368 B1 EP3497368 B1 EP 3497368B1 EP 17841178 A EP17841178 A EP 17841178A EP 3497368 B1 EP3497368 B1 EP 3497368B1
Authority
EP
European Patent Office
Prior art keywords
electronic unit
mounting formation
heat sink
nook
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP17841178.1A
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German (de)
English (en)
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EP3497368A1 (fr
EP3497368A4 (fr
Inventor
Frederick JANSE VAN RENSBURG
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Individual
Original Assignee
Individual
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Publication date
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Publication of EP3497368A1 publication Critical patent/EP3497368A1/fr
Publication of EP3497368A4 publication Critical patent/EP3497368A4/fr
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Publication of EP3497368B1 publication Critical patent/EP3497368B1/fr
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0045—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • This invention relates to a heat sink. More particularly, the invention relates to a heat sink for improved heat dissipation from an electronic unit. The invention further relates to a method of mounting an electronic unit to a heat sink and to a method of manufacturing a heat sink.
  • PCB printed circuit board
  • Electronic components mounted on PCBs generate heat which, if not properly managed, may damage components, shorten their lifespan and/or cause failures.
  • Examples of electronic components which may be subject to these issues are processors, transistors and diodes.
  • a heat sink is a passive heat exchanger which can be used to manage heat generated by a heat source in the form of one or more electronic components.
  • a heat sink transfers heat from electronic components to a fluid medium (e.g. air), where it is dissipated away from the electronic components.
  • a heat sink is typically made from a material with desirable heat exchange properties, such as copper or aluminium. In the Applicant's experience, in applications where excessive mass is a concern, aluminium is generally used.
  • heat dissipation portions of heat sinks are shaped and dimensioned so as to increase a surface area in contact with the fluid medium for enhanced heat dissipation.
  • Electronic components are typically mounted to conductive tracks on a first side of a PCB (hereinafter referred to as “the component side") by way of soldered connections. As a result, a portion of the heat generated by the electronic components is operatively conducted to the PCB.
  • a dedicated heat sink for each individual electronic component. Furthermore, it may in some cases be impractical to do so, for instance, when a heat sink would block light operatively emitted by a light emitting diode (LED).
  • LED light emitting diode
  • a single heat sink can be mounted to a second side of the PCB (hereinafter referred to as "the track side").
  • a PCB may in such cases be provided with an additional conductive layer, such as an aluminium layer, to facilitate the dissipation of heat from the component side to the track side.
  • thermal paste also known as a heat paste or "thermal grease”
  • thermal paste is typically applied between the PCB and the heat sink to which it is mounted, to serve as an interface between the PCB and heat sink, facilitating the dissipation of heat away from the PCB.
  • Thermal paste is typically applied to one or both of the heat sink and the PCB such that it at least partially contacts an interface surface of the heat sink and the track side of the PCB.
  • Thermal paste typically consists of a polymerizable liquid matrix and large volume fractions of electrically insulating, but thermally conductive filler.
  • Typical matrix materials are epoxies, silicones, urethanes, and acrylates, solvent-based systems, hot-melt adhesives, and pressure-sensitive adhesive tapes. Aluminium oxide, boron nitride, zinc oxide, and aluminium nitride may be used as fillers.
  • thermal paste As mentioned above, it is desirable to limit the presence of air between the PCB and the heat sink by applying a thermal paste therebetween. It is also desirable to limit the thickness of thermal paste required, as the thermal conductivity of thermal paste, while higher than that of air, is typically lower than that of the heat sink material.
  • a PCB is typically mounted to a track side heat sink by sliding the PCB along elongate mounting formations extending along a length of the heat sink.
  • the arrangement includes an elongate PCB provided with an LED strip and an elongate heat sink (typically made from aluminium).
  • the heat sink includes mounting formations which define a longitudinally extending channel, complementally shaped to the PCB.
  • thermal paste may be applied to the interface surface of the heat sink, after which the PCB is slid into the channel along the length of the heat sink until its entire length is received therein.
  • the Applicant has also found that the sliding motion required to assemble or mount the PCB to the heat sink may cause damage to the PCB, in some cases even leading to short circuits or faulty tracks.
  • WO 2015/069104A1 discloses a profile for a LED tube.
  • the profile comprises an elongated base section having a substantially U-shaped cross section and a supporting section extending from the base section for supporting a printed circuit board, wherein each of the arms of the base section is provided with a protrusion for retaining the PCB between the supporting section and the protrusions, wherein the supporting section is formed by a resilient member.
  • the PCB presses the arms apart, such that the PCB can pass protrusion and enter recess.
  • the profile will then snap back, thereby locking the PCB in recesses. However, this snapping operation may still cause damage to the PCB.
  • US 2012/0314431 A1 discloses a system comprising a heat sink and an electronic unit according to the preamble of claim 1.
  • Embodiments of the present invention aim to address the issues identified above, at least to some extent.
  • a system comprising a heat sink and an electronic unit, the heat sink having a body which includes a channel-shaped mounting formation configured to hold the electronic unit captive therein, the channel-shaped mounting formation defining a mouth having a transverse width which is less than a width of the electronic unit, and a nook which is configured to permit mounting of the electronic unit to the heat sink by passing the electronic unit through the mouth and angularly displacing the electronic unit relative to the mounting formation of the body.
  • the mounting formation is configured removably to hold the electronic unit captive therein.
  • the body is elongate.
  • the body is configured for heat exchange with the electronic unit.
  • the channel-shaped mounting formation defines a slot extending along a longitudinal axis of the body.
  • the slot is configured to receive the electronic unit by relative angular and transverse displacement of the electronic unit and the mounting formation of the body.
  • the mounting formation is further configured removably to hold the electronic unit captive in the slot.
  • the slot includes the mouth and an inner receiving region which includes the nook which is disposed toward one side.
  • the inner receiving region has a transverse width which is greater than the width of the electronic unit.
  • the inner receiving region is configured to permit the electronic unit to be received therein via the mouth by relative angular and transverse displacement of the electronic unit and the body.
  • the channel-shaped mounting formation is configured such that the electronic unit is receivable in the nook of the inner receiving region via the mouth by:
  • a contact surface of the electronic unit may be in abutment with the interface surface of the mounting formation.
  • a thermally conductive substance or compound may be sandwiched between the contact surface of the electronic unit and the interface surface of the mounting formation to facilitate effective heat dissipation from the electronic unit to the body of the heat sink.
  • the nook may extend lengthwise and may be dimensioned to permit a length and a portion of the width of the electronic unit to be received therein when the electronic unit is inclined relative to an interface surface of the mounting formation.
  • At least part of the nook may be defined by an inclined sidewall of the mounting formation.
  • the channel-shaped mounting formation may include a pair of inwardly orientated, opposing lips which extend lengthwise and define the mouth between them.
  • the electronic unit may include a printed circuit board (PCB) having a component side to which at least one electronic component is mounted and an opposite contact surface.
  • the PCB may include a series of light emitting diodes (LEDs) on the component side thereof.
  • the body may be made from aluminium.
  • the channel-shaped mounting formation may be configured to receive an electronic unit having a width of 75 mm or less.
  • the electronic unit may have a length of at least 100 mm.
  • the heat sink may include a resilient spacer which is accommodated in the nook and is configured to urge a side of the electronic unit into abutment with the channel-shaped mounting formation to inhibit lateral or transverse movement of the electronic unit relative to the mounting formation.
  • a lip opposite to the nook may be wedge-shaped and configured to urge the electronic unit into contact with an interface surface of the mounting formation.
  • the heat sink may include at least one shim removably inserted between the channel-shaped mounting formation and a component side of the electronic unit.
  • the body may include a heat dissipation portion on a side of the body opposite to the channel-shaped mounting formation.
  • the heat dissipation portion may have a semi-cylindrical shape.
  • the heat dissipation portion may have a series of radially extending, angularly spaced apart fins.
  • the heat dissipation portion may be substantially planar and may have attachment formations for fitting the heat sink to a mounting plate of a light fitting such that the planar heat dissipation portion is in thermal contact with the mounting plate for effective heat dissipation.
  • the invention extends to a method of mounting a system as described above, the method including the steps of:
  • the step of angularly and transversely displacing the electronic unit relative to the mounting formation may include:
  • the method may further include: inserting a resilient spacer into the nook before the electronic unit is mounted to the heat sink.
  • the method may include, once the electronic unit is mounted to the channel-shaped mounting formation, inserting a shim between the mounting formation and a component side of the electronic unit.
  • the slot may be configured to receive an electronic unit having a width of 75 mm or less, preferably 50 mm or less, more preferably 25 mm or less.
  • the slot may be configured to receive an electronic unit having a length of 100 mm or more, preferably 200 mm or more, more preferably 300 mm or more.
  • FIG. 1 to FIG. 3 illustrate an embodiment of a heat sink 10 according to the invention, along with an electronic unit 40 mountable to the heat sink 10 for operative heat exchange between the heat sink 10 and the electronic unit 40, specifically from the electronic unit 40 to the heat sink 10.
  • the heat sink 10 has an elongate body 12 made from a thermally conductive material, in this case aluminium.
  • the body 12 includes a channel-shaped mounting formation formed by a pair of sidewalls 16, 17 and two opposing, parallel lips or lip portions 18, the free ends of which face inwardly toward each other, as best illustrated in FIG. 2 .
  • the channel-shaped mounting formation defines a slot 14 extending along a longitudinal axis A of the body 12.
  • the sidewalls 16, 17 and lip portions 18 extend along the longitudinal axis A.
  • the body 12 further includes a pair of inclined flanges 20 on either side of the body 12.
  • the flanges 20 extend, from respective lip portions 18, upwardly and away from the slot 14.
  • the slot 14 includes an outer mouth or mouth region 22 defined between the free ends of the lip portions 18 and an inner receiving region 24 defined between the sidewalls 16, 17 and above an interface surface 26 of the body 12.
  • the interface surface 26 is generally flat or planar, but includes a transversely inclined portion 28 which defines a nook or recess 30 in a side of the inner receiving region 24.
  • the recess or nook 30 is further defined by one of the side walls 16 which is inclined relative to the opposite side wall 17. Similarly to the remainder of the slot 14, the recess 30 extends along the longitudinal axis A.
  • the electronic unit 40 includes a printed circuit board (PCB) 42 with a strip of light emitting diodes (LEDs), or LED strip 44, mounted to a component side 46 thereof.
  • a track side 48 of the PCB 42 forms a contact surface thereof.
  • the heat sink is configured as a heat sink for a heat source in the form of an LED lighting arrangement.
  • the channel-shaped mounting formation is configured such that the electronic unit 40 can be received in the inner receiving region 24 of the body 12 by relative angular and transverse displacement of the electronic unit 40 and the body 12, as will become apparent from the following discussion.
  • the mouth region 22 has a width, taken along a transverse axis B of the body 12, which is less than a width of the electronic unit 40 (i.e. the width of the PCB 42).
  • the inner receiving region 24 has a width, taken along the transverse axis B, which is greater than the width of the electronic unit 40.
  • This is achieved by angling the electronic unit 40 relative to the body 12 such that the contact surface extending along a transverse axis of the electronic unit 40 is inclined relative to the transverse axis B of the body 12, inserting a side 50 of the electronic unit 40 into the receiving region 24 and the specifically into the recess 30 thereof, and angling the electronic unit 40 relative to the channel-shaped mounting formation of the body 12 such that the contact surface of the electronic unit 40 is parallel to and contiguous with the interface surface 26 and the transverse axis of the electronic unit is generally parallel to or coplanar with the transverse axis B of the body 12 and the electronic unit 40 is held captive in the receiving region 24 by the channel-shaped mounting formation, particularly by the lip portions 18.
  • FIG. 2 illustrates, in broken lines, a first position of the electronic unit 40, in which it is angled or inclined relative to the interface surface 26 of the body 12 and partially inserted into the receiving region 24 and recess 30, and, in solid lines, a second position of the electronic unit 40, in which it is held captive in the channel-shaped mounting formation, as explained above.
  • the interface surface 26 of the body 12 is configured to mate with or be in abutment with the contact surface of the PCB 42, which is provided by its track side 48.
  • the body 12 may be configured such that, when the electronic unit 40 is received in the receiving region 24, provision may be made for a gap 32 to exist between the interface surface 26 and the contact surface 48, as illustrated in FIG. 2 , to provide for a thermal paste.
  • the surfaces 26, 48 must be contiguous for effective heat dissipation.
  • FIG. 3 provides, primarily as an example, dimensions and angles of the heat sink 10 and the electronic unit 40.
  • a thermally conductive substance or compound such as a thermal paste (not shown), may be provided in the gap 32.
  • Thermal paste is typically applied to the interface surface 26 of the body 12 before mounting the electronic unit 40 to the body 12.
  • the gap 32 is dimensioned such that a thermal paste layer having a thickness of about 0.1 mm can be applied. Thermal paste may also be applied to the contact surface of the electronic unit 40.
  • a heat sink in accordance with the invention, may typically and preferably include not only a channel-shaped mounting formation as shown in FIG. 1 to FIG. 3 , but also a heat dissipation portion depending from a side of the body opposite to the channel-shaped mounting formation for heat exchange with a fluid medium (e.g. air or liquid).
  • a fluid medium e.g. air or liquid
  • FIG. 4 to FIG. 7 illustrate another embodiment of a heat sink 60 according to the invention.
  • FIG. 4 and FIG. 5 only a portion of a length of the heat sink 60 is shown.
  • the heat sink 60 may have any suitable length along a longitudinal axis C, which is indicated in FIG. 4 .
  • the heat sink 60 has a base 62 including a channel-shaped mounting formation substantially similar to that of the heat sink 10 described with reference to FIG. 1 to FIG. 3 , and, accordingly, the components and functioning of the base 62 will thus not be described in detail with reference to this embodiment.
  • the heat sink 60 further includes a heat dissipation portion 64 depending from sides of the base 62.
  • the heat dissipation portion 64 is generally half-annular in cross-section or semi-cylindrical, as shown in FIG. 5 .
  • Four sets of longitudinally extending ribs 66 are circumferentially spaced apart about an outer surface 68 of the heat dissipation portion 64.
  • FIG. 6 and FIG. 7 illustrate the manner in which a PCB 70 may be mounted to the channel-shaped mounting formation of the base 62 of the heat sink 60. This is essentially done in the same manner as described with reference to FIG. 2 .
  • the PCB 70 is angled or inclined relative to an interface surface of the base 62, and relative to a transverse axis D of the base 62 shown in FIG. 4 , and a side of the PCB 70 is inserted into a recess or nook formed in a side of an inner receiving region of the base 62.
  • the PCB 70 is then angularly displaced relative to the channel-shaped mounting formation of the base 62 and then moved transversely away from the recess or nook until the PCB 70 is held captive in channel-shaped mounting formation of the base 62.
  • the Applicant believes that the present invention provides an improved heat sink and an advantageous method of mounting an electronic unit to a heat sink.
  • a thermally conductive material into a body including a channel-shaped mounting formation which defines a slot as described herein, numerous advantages may be obtained.
  • the shape and dimensions of the heat sink described herein permit the length and a portion of the width of the electronic unit 40 or PCB 70, to be received in the channel-shaped mounting formation of the heat sink when the electronic unit is angled or inclined relative to the heat sink such that the electronic unit is inclined to a certain extent relative to the transverse axis D of the heat sink.
  • the electronic unit 40 can then be held captive in the heat sink by further angular and transverse displacement relative to the channel-shaped mounting formation.
  • the heat sink is configured removably to hold the electronic unit captive in the inner receiving region.
  • the Applicant has found that it may be easier to apply thermal paste evenly and to provide a relatively thin layer thereof when using the heat sink 10, 60 and technique of the present invention, as opposed to the conventional technique of longitudinally sliding a PCB and a heat sink in relation to each other. Further, the Applicant has found that the present invention makes it easier to ensure that an entire interface or contact surface area between the electronic unit and heat sink, or a substantial portion thereof, is covered with thermal paste. As a result improved heat dissipation via the heat sink is achieved.
  • the heat sink 80 may be provided with a spacer or stopper 82 configured to be received in a nook or recess 84 in a side of an inner receiving region 86 of the heat sink 80, as described above.
  • the stopper 82 may be manufactured from a resilient material and, in use, may be received between a side of the electronic unit (not shown) and an inclined sidewall 88 of the heat sink 80 such that lateral movement of the electronic unit is substantially prevented from occurring.
  • the stopper 82 may therefore serve to bias the electronic unit toward an opposite side of the channel-shaped mounting formation.
  • the stopper 82 may be removable from the body.
  • shims 90, 92 may be provided which are configured to be removably inserted between an underside of each lip portion 94, 96 and a side region of the component side of the electronic unit (not shown) when the electronic unit is received in the receiving region 86. This is illustrated by the directional arrows 98, 100 in FIG. 8 .
  • the shims 90, 92 may then act to urge the electronic unit downwardly towards and into abutment with the interface surface 104 of the heat sink 80 or into contact with the thermal paste provided between the electronic unit and the heat sink.
  • an underside 102 of the lip portion 96 on the opposite side of the recess 84 may be wedge shaped or inclined so as to urge a side of the electronic unit in the direction of the interface surface 104 of the heat sink when the electronic unit is moved transversely towards the lip portion 96 to capture or wedge the electronic unit in the receiving region 86.
  • FIGS. 9A and 9B A further embodiment of a heat sink 110, which includes another envisaged change, is conceptually illustrated in FIGS. 9A and 9B .
  • the heat sink 110 is provided with shims 90, 92 as illustrated in and described with reference to FIG. 8 .
  • the heat sink 110 is additionally provided with a transverse shim 112 which is shaped and dimensioned such that a length of the shim 112 operatively extends across the entire width of the mouth region 114 of the heat sink.
  • Respective ends of the shim 112 are operatively received under the lip portions 94, 96 and the shim 112 acts to urge the electronic unit downwardly towards the heat sink 110, in use.
  • Broken lines 112A, 112B in FIG. 9B indicate the manner in which the shim 112 may be slid and/or urged into position.
  • one or more transverse shims 112 may thus be employed.
  • both types of shims 90, 92, 112 may be employed.
  • the transverse shim 112 may be dimensioned so as to be fitted between such electronic components along the length of the PCB.
  • the shim may, for example, be about 4mm in width.
  • FIG. 10 Another embodiment of a heat sink 120 is illustrated in FIG. 10 .
  • the heat sink 120 has a base 122 having a channel-shaped mounting formation with components substantially similar to the channel-shaped mounting formation of the body 12 of the heat sink 10 described with reference to FIG. 1 to FIG. 3 , and the components and functioning of the base 122 will thus not be described in detail with reference to this embodiment.
  • the base 122 includes a pair of flanges 124, 126 similar to the flanges 20 of the embodiment of FIG. 1 to FIG. 3 . However, end regions of the flanges 124, 126 are provided with mounting slots which are configured to receive complementally shaped free ends 128, 130 of a generally half-annular or semi-cylindrical cover portion 132.
  • the cover portion 132 is made from a transparent or translucent plastics material and is configured to cover an electronic unit mounted to the heat sink 120, in use.
  • the flanges 124, 126 may also serve as reflector plates to reflect light radiated by the electronic unit.
  • the heat sink 120 further includes a heat dissipation portion 134 on a side of the base 122 opposite the channel-shaped mounting formation.
  • the heat dissipation portion 134 is integrally formed with the base 122 and extends away from an underside 135 of the base 122.
  • the base 122 and the heat dissipation portion 134 are, in this embodiment, made from aluminium.
  • the heat dissipation portion 134 has a solid core region 136 which is generally semi-circular in cross-section.
  • a plurality of fins 138 are circumferentially spaced apart about the core region 136 and extend radially away from the core region 136.
  • the fins 138 provide a relatively large surface area for enhanced heat dissipation, as will be well understood by those of ordinary skill in the art in question.
  • FIG. 11 Yet another embodiment of a heat sink 150 in accordance with the invention is illustrated in FIG. 11 .
  • This heat sink 150 may be mounted to a substantially planar mounting plate 151 of a light fitting in order to improve heat dissipation from light sources in the form of one or more LED strips (not shown).
  • LED light strips may be fastened to the mounting plate at discrete points.
  • air gaps exist between the LED strips and the mounting plate which give rise to inadequate heat dissipation from the LED strips which could potentially damage the LEDs shortening their operative life span.
  • the heat sink 150 in accordance with the invention includes a body having a channel-shaped mounting formation, as previously described, and a heat dissipation portion 152.
  • the heat dissipation portion 152 is in the form of planar flanges or plates which extend laterally from opposite sides of the channel-shaped mounting formation.
  • the heat dissipation portion 152 defines a substantially planar base for mounting to the mounting plate 151.
  • the heat dissipation portion 152 has attachment formations or holes 153 for fitting the heat sink 150 to the mounting plate 151 of the light fitting. Rivets can be used to fasten the heat sink 150 to the mounting plate 151 via the holes 153. Thermal paste is applied to improve heat dissipation between the heat sink 150 and the mounting plate 151.
  • the mounting plate 151 therefore effectively becomes an extension of the heat sink 150 which gives rise to very effective heat dissipation.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Claims (14)

  1. Système comprenant un dissipateur thermique (10) et une unité électronique (40), le dissipateur thermique ayant un corps (12) qui comporte une formation de montage en forme de canal configurée pour maintenir l'unité électronique captive à l'intérieur, la formation de montage en forme de canal définissant une bouche (22) ayant une largeur transversale qui est inférieure à une largeur de l'unité électronique, et un coin (30) qui est configuré pour permettre le montage de l'unité électronique sur le dissipateur thermique en faisant passer l'unité électronique à travers la bouche et en déplaçant angulairement l'unité électronique par rapport à la formation de montage du corps, dans lequel le corps est allongé et configuré pour l'échange thermique avec l'unité électronique et dans lequel la formation de montage en forme de canal définit une fente (14) s'étendant le long d'un axe longitudinal (A) du corps, la fente étant configurée pour recevoir l'unité électronique par déplacement angulaire et transversal relatif de l'unité électronique et la formation de montage du corps, la formation de montage étant en outre configurée de façon amovible pour maintenir l'unité électronique captive dans la fente, dans lequel la fente comporte la bouche et une région de réception intérieure (24) qui comporte le coin qui est disposé vers un côté, dans lequel la région de réception intérieure a une largeur transversale qui est supérieure à la largeur de l'unité électronique, la région de réception intérieure étant configurée pour permettre à l'unité électronique d'être reçue à l'intérieur par l'intermédiaire de la bouche par déplacement angulaire et transversal relatif de l'unité électronique et du corps, dans lequel la formation de montage en forme de canal est configurée de sorte que l'unité électronique peut être reçue dans le coin de la région de réception intérieure par l'intermédiaire de la bouche par :
    l'inclinaison de l'unité électronique par rapport à la formation de montage de sorte que l'unité électronique est inclinée par rapport à une surface d'interface (26) de la formation de montage ;
    l'insertion d'un côté d'insertion (50) de l'unité électronique dans le coin de la région de réception intérieure ;
    le déplacement angulaire de l'unité électronique par rapport à la formation de montage autour de l'axe longitudinal jusqu'à ce que l'unité électronique soit contiguë à la surface d'interface de la formation de montage ; et
    le déplacement transversal de l'unité électronique par rapport à la formation de montage jusqu'à ce que l'unité électronique soit maintenue captive dans la région de réception intérieure dans une configuration dans laquelle une surface de contact (48) de l'unité électronique est contiguë en continu à la surface d'interface de la formation de montage à partir d'un côté de non-insertion de l'unité électronique dans le coin afin d'assurer une dissipation thermique maximale de l'unité électronique au corps du dissipateur thermique, caractérisé en ce que
    la surface d'interface (26) est généralement plate ou plane, mais comporte une partie inclinée transversalement (28) qui définit le coin (30) dans un côté de la région de réception intérieure (24).
  2. Système selon la revendication 1, dans lequel, lorsque l'unité électronique est entièrement reçue à l'intérieur de la région de réception intérieure, la surface de contact de l'unité électronique est en butée avec la surface d'interface de la formation de montage.
  3. Système selon la revendication 2, dans lequel le système comprend en outre une substance ou un composé thermiquement conducteur pris en sandwich entre la surface de contact de l'unité électronique et la surface d'interface de la formation de montage pour faciliter une dissipation thermique efficace de l'unité électronique au corps du dissipateur thermique.
  4. Système selon la revendication 1, dans lequel le coin s'étend dans le sens de la longueur et est dimensionné pour permettre la réception d'une longueur et d'une partie de la largeur de l'unité électronique lorsque l'unité électronique est inclinée par rapport à la surface d'interface de la formation de montage.
  5. Système selon la revendication 4, dans lequel au moins une partie du coin est définie par une paroi latérale inclinée (16) de la formation de montage.
  6. Système selon la revendication 1, dans lequel la formation de montage en forme de canal comporte une paire de lèvres opposées orientées vers l'intérieur (18) qui s'étendent dans le sens de la longueur et définissent la bouche entre elles.
  7. Système selon la revendication 1, dans lequel l'unité électronique comporte une carte de circuit imprimé (PCB) (42) ayant un côté composant (46) sur lequel au moins un composant électronique est monté et la surface de contact opposée, et dans lequel la PCB comporte une série de diodes électroluminescentes (DEL) (44) sur le côté composant de celle-ci.
  8. Système selon la revendication 1, dans lequel le corps est constitué d'aluminium et la formation de montage en forme de canal est configurée pour recevoir une unité électronique ayant une largeur de 75 mm ou moins, l'unité électronique ayant une longueur d'au moins 100 mm.
  9. Système selon la revendication 6, qui comporte une entretoise élastique (82) qui est logée dans le coin et est configurée pour pousser un côté de l'unité électronique en butée avec la formation de montage en forme de canal pour empêcher le mouvement latéral ou transversal de l'unité électronique par rapport à la formation de montage.
  10. Système selon la revendication 9, dans lequel une lèvre opposée au coin est cunéiforme et configurée pour pousser l'unité électronique en contact avec la surface d'interface de la formation de montage.
  11. Système selon la revendication 1, qui comporte au moins une cale insérée de manière amovible entre la formation de montage en forme de canal et un côté composant de l'unité électronique.
  12. Système selon la revendication 1, dans lequel le corps comporte une partie de dissipation thermique (64 ; 134) sur un côté du corps opposé à la formation de montage en forme de canal, la partie de dissipation thermique ayant une forme semi-cylindrique, ou ayant une série d'ailettes (66 ; 138) espacées angulairement s'étendant radialement, ou étant sensiblement planes et ayant des formations de fixation (153) pour adapter le dissipateur thermique à une plaque de montage (151) d'un luminaire de sorte que la partie de dissipation thermique plane est en contact thermique avec la plaque de montage (152) pour une dissipation thermique efficace.
  13. Procédé de montage d'un système selon l'une des revendications 1 à 12, caractérisé en ce que le procédé comporte les étapes :
    d'application d'une substance thermoconductrice à la surface d'interface de la formation de montage en forme de canal et/ou à la surface de contact de l'unité électronique ; et
    de montage de l'unité électronique sur le dissipateur thermique en faisant passer l'unité électronique par la bouche et en déplaçant angulairement et transversalement l'unité électronique par rapport à la formation de montage en forme de canal du corps jusqu'à ce que l'unité électronique soit maintenue captive par la formation de montage dans une configuration dans laquelle la surface de contact de l'unité électronique est contiguë en continu avec la surface d'interface de la formation de montage à partir d'un côté de non-insertion de l'unité électronique dans le coin afin d'assurer une dissipation thermique maximale de l'unité électronique au corps du dissipateur thermique.
  14. Procédé selon la revendication 13, dans lequel l'étape de déplacement angulaire et transversal de l'unité électronique par rapport à la formation de montage comporte :
    l'inclinaison de l'unité électronique par rapport à la formation de montage de sorte que l'unité électronique est inclinée par rapport à la surface d'interface de la formation de montage ;
    l'insertion d'un côté d'insertion de l'unité électronique dans le coin ;
    le déplacement angulaire de l'unité électronique par rapport à la formation de montage autour d'un axe longitudinal du corps jusqu'à ce que l'unité électronique soit contiguë à la surface d'interface de la formation de montage ; et le déplacement de façon coulissante de l'unité électronique latéralement à distance du coin jusqu'à ce qu'elle soit maintenue captive par la formation de montage.
EP17841178.1A 2016-08-19 2017-08-16 Dissipateur thermique Active EP3497368B1 (fr)

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US20190264903A1 (en) 2019-08-29
WO2018033864A1 (fr) 2018-02-22
US11346541B2 (en) 2022-05-31
EP3497368A4 (fr) 2019-08-28
ZA201901595B (en) 2020-08-26
CN109923346B (zh) 2020-08-04
CN109923346A (zh) 2019-06-21

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