EP3346490A1 - Wärmeverwaltung in eletronikbauteil - Google Patents

Wärmeverwaltung in eletronikbauteil Download PDF

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Publication number
EP3346490A1
EP3346490A1 EP18150748.4A EP18150748A EP3346490A1 EP 3346490 A1 EP3346490 A1 EP 3346490A1 EP 18150748 A EP18150748 A EP 18150748A EP 3346490 A1 EP3346490 A1 EP 3346490A1
Authority
EP
European Patent Office
Prior art keywords
electronic component
polymer material
heat sink
fluid polymer
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP18150748.4A
Other languages
English (en)
French (fr)
Inventor
John Huss
Alan Kasner
Mark W. Metzler
Ernest Thompson
Debabrata Pal
Charles Patrick Shepard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamilton Sundstrand Corp
Original Assignee
Hamilton Sundstrand Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamilton Sundstrand Corp filed Critical Hamilton Sundstrand Corp
Publication of EP3346490A1 publication Critical patent/EP3346490A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass

Definitions

  • Electronic components are commonly used in a wide variety of applications in a wide variety of environments. In many cases, electronic components are configured or are disposed with other components configured to remove heat generated by the electronic components during operation.
  • Heat-generating electronic components are designed to operate at a normal operating temperature or within a normal operating temperature range. However, if the rate of removal of heat from the device is less than the rate of heat generated by the device plus any added heat, the device can be subject to temperatures above normal operating temperature. Excessive temperatures can adversely affect the performance of the electronic component and any associated devices.
  • heat can be removed by the transfer of heat from the electronic component to a heat sink.
  • Transfer of heat from the electronic component to the heat sink can be by various techniques, including convection, radiation, or conduction.
  • convection and radiative heat transfer are not readily available for electronic components because of factors such as the electronic component's integration within a protective housing that interferes with convective flow paths or line of sight connection to lower temperature heat sinks.
  • One technique to increase heat transfer away from an electronic component is by thermal conduction to a heat sink structure, which can transfer heat by radiative means (e.g., through a larger surface area than that of the electronic component) or convective means.
  • thermal interface material such as a thermal grease or a thermal pad/sealant provides a conductive pathway for heat transfer to the heat sink.
  • Thermal interface materials are known to include thermally conductive fillers to promote thermal conductivity of the material.
  • thermally conductive fillers can be subject to problems and limitations such as limits on achievable thermal conductivity, beyond which the inclusion of additional filler loading is subject to diminished or adverse effectiveness for thermal conductivity, or adverse impacts of greater filler loadings on the properties or processability of the thermal interface material.
  • Another factor that can interfere with the transferring of heat from an electronic component is the presence of protective materials on the electronic component.
  • electronic components can be potted or otherwise encapsulated in or coated by a polymer material, and such polymer materials can present a thermal barrier to removal of heat from the electronic component. Attempts have been made to mitigate this thermal barrier effect by the inclusion of thermally conductive fillers in potting compositions, but loading levels of the fillers in potting compositions has been limited by adverse impacts on product performance and processability at higher loading levels.
  • a method of making an assembly that includes an electronic component comprises disposing the electronic component proximate to a second component configured as a heat sink.
  • a conductive heat transfer medium is disposed between the electronic component and the heat sink in contact with each of the electronic component and the heat sink by dispensing a fluid polymer material including boron nitride nanotubes dispersed therein between the electronic component and the heat sink in contact with each of the electronic component and the heat sink, and hardening the fluid polymer material.
  • a method of cooling an electronic component comprises disposing the electronic component proximate to a heat sink, and disposing a conductive heat transfer medium between the electronic component and the heat sink in contact with each of the electronic component and the heat sink by dispensing a fluid polymer material including boron nitride nanotubes dispersed therein between the electronic component and the heat sink in contact with each of the electronic component and the heat sink, and hardening the fluid polymer material.
  • a potted electronic assembly comprises an electronic component and a heat sink.
  • a conductive heat transfer medium is disposed between the electronic component and the heat sink in contact with each of the electronic component and the heat sink.
  • the conductive heat transfer medium comprises a hardened fluid polymer material including boron nitride nanotubes dispersed therein between the electronic component and the heat sink in contact with each of the electronic component and the heat sink.
  • FIGS. 1, 2, and 3 provide a schematic depiction of an example embodiment in which a fluid polymer material is disposed between an electronic component and a heat sink, and is hardened, also known as potting.
  • FIG. 1 shows a housing 10 and an electronic component 20.
  • the housing 10 is shown as a cross-section of a housing with a bottom and four sides, but any configuration of housing capable of retaining the electronic component(s) and the polymer material can be used.
  • the housing includes retaining surfaces in at least two dimensions, such as the bottom and side dimensions of the housing 10.
  • the housing includes a bottom wall, a sidewall enclosure and an opening for introducing the fluid polymer composition.
  • the electronic component 20 can be any sort of electronic component, connection, or circuit, or a collection of multiple electronic components.
  • the electronic component as shown in FIGS. 1-3 can include a circuit board 22 with connected electronic components 24, 26 and connector lead 28.
  • connector lead 28 can provide power to the circuit board 22 with connected electronic components 24, 26.
  • connector lead 28 can provide power and signal connections to the circuit board 22 with connected electronic components 24, 26.
  • Examples of electronic components 24 or other electronic components that can be potted can include but are not limited to such as semiconductor devices, transistors, integrated circuits (IC), discrete devices, light emitting diodes (LED), inductors, transformers, capacitors, etc.
  • the circuit board 22 is disposed into the housing 10 as shown.
  • a fluid polymer material 30 is introduced to the housing 10.
  • the fluid polymer material 30 can partially encase the electronic components, as shown in FIG. 3 for electronic components 24.
  • the fluid polymer material can completely encase the electronic components as shown in FIG. 3 for electronic components 26.
  • the fluid polymer material can fill the housing 10 as shown FIG. 3 .
  • the fluid polymer material can be dispensed locally or discretely onto one or more electronic components without complete filling of the surrounding space.
  • the walls of the housing 10 can serve as a heat sink, which can be cooled by convection or radiative heat removal to the outside of the housing 10.
  • fluid polymer materials for potting can include silicones, polyurethanes (single-part or two-part), or epoxy resins (single part or two part).
  • Hybrid polymers e.g., siliconized urethanes or siliconized epoxies
  • polymer blends can also be used.
  • thermoplastics or solvent-based casting polymer compositions can be used, thermoset resins are more commonly used as they can provide dimensional stability during the curing process (compared to some solvent-based polymer casting compositions) and mild conditions to which the electronic components are subjected (compared to some thermoplastics).
  • Thermoset fluid polymer materials can be hardened by curing conditions that can include exposure to ambient air, exposure to radiation such as visible light, UV light, or electron beam.
  • the fluid polymer material can be dispensed around the electronic components component 20 or portions thereof by various techniques and equipment, including pouring, spraying, jet coating, nozzle extrusion, or others.
  • the particular dispensing technique and application settings are of course dependent on the particulars of the fluid polymer material, as will be appreciated by the skilled person.
  • Boron nitride nanotubes can be synthesized by known techniques, and are commercially available. Examples of techniques for making boron nitride nanotubes include arc-discharge, laser ablation, chemical vapor deposition, the pressurized vapor/condenser method, or ball milling of amorphous boron mixed with an iron powder catalyst under NH 3 atmosphere followed by subsequent annealing at about 1100 °C under nitrogen atmosphere.
  • the boron nitride nanotubes as well as other additive materials to the fluid polymer material can be dispersed into the fluid polymer material by various mixing operations, which can be particular to the type of polymer material involved. Direct mixing or masterbatch mixing techniques can be used.
  • the amount of boron nitride nanotubes in the fluid polymer material can be in a range with a low end of >0 wt.%, 0.1 wt.%, 0.2 wt.%, or 0.3 wt.%, and a high end of 20 wt.%, 10 wt.%, 5 wt.%, 4 wt.%, 3 wt.%, 2 wt.%, or 1 wt.%, based on total weight of the fluid polymer material including the boron nitride nanotubes and any other dispersed or dissolved components.
  • the fluid polymer material can have a viscosity at fabrication temperature that allows for flow of the material into contact with the heat sink and the electronic component(s).
  • heat can be applied during fabrication to promote flowability of the fluid polymer material. All possible combinations of the above-mentioned range endpoints (excluding impossible combinations where a low endpoint would have a greater value than a high endpoint) are explicitly included herein as disclosed ranges.
  • the fluid polymer material can include other components, including but not limited to boron nitride in forms other than nanotubes (e.g., 2D particles such as flakes or 3D particles such as spherical particles) with particle sizes expressed as mean diameter ranging from 300 nm to 600 nm.
  • boron nitride in forms other than nanotubes (e.g., 2D particles such as flakes or 3D particles such as spherical particles) with particle sizes expressed as mean diameter ranging from 300 nm to 600 nm.
  • the amount of boron nitride in the fluid polymer material in forms other than nanotubes can be in a range with a low end of 10 wt.%, 18 wt.%, or 20 wt.%, and a high end of 40 wt.%, 30 wt.%, or 20 wt.%, based on the total weight of boron nitride and fluid polymer material. All possible combinations of the above-mentioned range endpoints (excluding impossible combinations where a low endpoint would have a greater value than a high endpoint) are explicitly included herein as disclosed ranges.
  • the hardened fluid polymer material can have a thermal conductivity in a range with a low end of point of 1 W/m ⁇ K, 3 W/m ⁇ K, or 4 W/m ⁇ K, and a high end of 32 W/m ⁇ K, 30 W/m ⁇ K, or 28 W/m ⁇ K. All possible combinations of the above-mentioned range endpoints (excluding impossible combinations where a low endpoint would have a greater value than a high endpoint) are explicitly included herein as disclosed ranges.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Composite Materials (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP18150748.4A 2017-01-09 2018-01-09 Wärmeverwaltung in eletronikbauteil Withdrawn EP3346490A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15/401,872 US20180199461A1 (en) 2017-01-09 2017-01-09 Electronics thermal management

Publications (1)

Publication Number Publication Date
EP3346490A1 true EP3346490A1 (de) 2018-07-11

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EP18150748.4A Withdrawn EP3346490A1 (de) 2017-01-09 2018-01-09 Wärmeverwaltung in eletronikbauteil

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EP (1) EP3346490A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11292925B2 (en) * 2018-04-12 2022-04-05 South Dakota Board Of Regents Flexible nano coating with significantly enhanced electrical, thermal and semiconductor properties
US11053124B2 (en) * 2018-04-12 2021-07-06 South Dakota Board Of Regents Conductive grease with enhanced thermal or electrical conductivity and reduced amount of carbon particle loading
US10986723B2 (en) * 2018-10-16 2021-04-20 Ingersoll-Rand Industrial U.S., Inc. Heat sink tray for printed circuit boards
US11439001B2 (en) * 2019-11-14 2022-09-06 Dell Products L.P. System and method for heat removal using a thermal potting solution in an information handling system
US11558981B2 (en) * 2020-03-27 2023-01-17 Mercury Mission Systems, Llc Thermal nanoparticles encapsulation for heat transfer
CN115214083B (zh) * 2022-08-25 2023-10-13 合肥通富微电子有限公司 一种塑封装置
CN115339045B (zh) * 2022-08-25 2023-10-13 合肥通富微电子有限公司 一种塑封方法

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5706579A (en) * 1995-02-06 1998-01-13 Rjr Polymers, Inc. Method of assembling integrated circuit package
EP1265281A2 (de) * 2001-06-06 2002-12-11 Polymatech Co., Ltd. Wärmeleitfähiger geformter Gegenstand und Herstellungsverfahren
EP1665377A1 (de) * 2003-09-03 2006-06-07 General Electric Company Thermisches leitfähiges Material mit elektrisch leitfähigen Nanopartikeln
EP1797155A2 (de) * 2004-08-23 2007-06-20 General Electric Company Thermisch leitende zusammensetzung und herstellungsverfahren dafür
US20070265379A1 (en) * 2003-05-22 2007-11-15 Zyvex Corporation Nanocomposites and methods thereto
US20080111234A1 (en) * 2006-11-10 2008-05-15 Fay Hua Electronic assembly with hot spot cooling
JP2008144046A (ja) * 2006-12-11 2008-06-26 Teijin Ltd 耐熱性樹脂複合組成物及びその製造方法
DE102008031297A1 (de) * 2008-07-02 2010-01-14 Siemens Aktiengesellschaft Halbleitermodul
US20160049349A1 (en) * 2014-08-14 2016-02-18 Qualcomm Incorporated Systems and methods for thermal dissipation
US20160325994A1 (en) * 2014-01-06 2016-11-10 Momentive Performance Materials Inc. High aspect boron nitride, methods, and composition containing the same
US20160340557A1 (en) * 2014-02-24 2016-11-24 Henkel IP & Holding GmbH Thermally conductive pre-applied underfill formulations and uses thereof

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5706579A (en) * 1995-02-06 1998-01-13 Rjr Polymers, Inc. Method of assembling integrated circuit package
EP1265281A2 (de) * 2001-06-06 2002-12-11 Polymatech Co., Ltd. Wärmeleitfähiger geformter Gegenstand und Herstellungsverfahren
US20070265379A1 (en) * 2003-05-22 2007-11-15 Zyvex Corporation Nanocomposites and methods thereto
EP1665377A1 (de) * 2003-09-03 2006-06-07 General Electric Company Thermisches leitfähiges Material mit elektrisch leitfähigen Nanopartikeln
EP1797155A2 (de) * 2004-08-23 2007-06-20 General Electric Company Thermisch leitende zusammensetzung und herstellungsverfahren dafür
US20080111234A1 (en) * 2006-11-10 2008-05-15 Fay Hua Electronic assembly with hot spot cooling
JP2008144046A (ja) * 2006-12-11 2008-06-26 Teijin Ltd 耐熱性樹脂複合組成物及びその製造方法
DE102008031297A1 (de) * 2008-07-02 2010-01-14 Siemens Aktiengesellschaft Halbleitermodul
US20160325994A1 (en) * 2014-01-06 2016-11-10 Momentive Performance Materials Inc. High aspect boron nitride, methods, and composition containing the same
US20160340557A1 (en) * 2014-02-24 2016-11-24 Henkel IP & Holding GmbH Thermally conductive pre-applied underfill formulations and uses thereof
US20160049349A1 (en) * 2014-08-14 2016-02-18 Qualcomm Incorporated Systems and methods for thermal dissipation

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