EP3311983A1 - Dispositif et procede de fabrication additive d'objets tridimensionnels - Google Patents

Dispositif et procede de fabrication additive d'objets tridimensionnels Download PDF

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Publication number
EP3311983A1
EP3311983A1 EP17174401.4A EP17174401A EP3311983A1 EP 3311983 A1 EP3311983 A1 EP 3311983A1 EP 17174401 A EP17174401 A EP 17174401A EP 3311983 A1 EP3311983 A1 EP 3311983A1
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EP
European Patent Office
Prior art keywords
tempering
building material
diodes
process chamber
building
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP17174401.4A
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German (de)
English (en)
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EP3311983B1 (fr
Inventor
Frank Herzog
Florian DR. BECHMANN
Peter Dr. Pontiller-Schymura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CL Schutzrechtsverwaltung GmbH
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CL Schutzrechtsverwaltung GmbH
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Priority to EP20178609.2A priority Critical patent/EP3722077A1/fr
Publication of EP3311983A1 publication Critical patent/EP3311983A1/fr
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0288—Controlling heating or curing of polymers during moulding, e.g. by measuring temperatures or properties of the polymer and regulating the process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
    • B29C64/273—Arrangements for irradiation using laser beams; using electron beams [EB] pulsed; frequency modulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/36—Process control of energy beam parameters
    • B22F10/368—Temperature or temperature gradient, e.g. temperature of the melt pool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/38—Housings, e.g. machine housings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/41—Radiation means characterised by the type, e.g. laser or electron beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/90—Means for process control, e.g. cameras or sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • B23K26/342—Build-up welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B1/00—Producing shaped prefabricated articles from the material
    • B28B1/001—Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B17/00—Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
    • B28B17/0063—Control arrangements
    • B28B17/0081—Process control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/141—Processes of additive manufacturing using only solid materials
    • B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/295—Heating elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/44—Radiation means characterised by the configuration of the radiation means
    • B22F12/45—Two or more
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/46—Radiation means with translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0838—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Definitions

  • the invention relates to an apparatus for the additive production of three-dimensional objects by successive layer-wise selective exposure and concomitant solidification of building material layers from a building material which can be hardened by means of an energy beam.
  • Corresponding devices are known per se for the additive production of three-dimensional objects.
  • three-dimensional objects are constructed additively by successive layer-wise selective exposure and concomitant solidification of building material layers formed in a construction plane from a building material which can be hardened by means of an energy beam.
  • a temperature control of respective layers of building material may be expedient, if necessary even necessary.
  • the tempering serves, in particular, to reduce thermally induced stresses within the respective object (section) s, so that it is possible to influence the structural properties of the object to be produced additively or manufactured by means of targeted temperature control. Accordingly, devices of the type mentioned are regularly equipped with tempering, which are set up for at least partially temperature control of a building material layer formed in a building level.
  • the object of the invention is to specify an apparatus for the additive production of three-dimensional objects, in particular with regard to the possibility of individually adaptable temperature control of respective building material layers.
  • the object is achieved by a device for the additive production of three-dimensional objects according to claim 1.
  • the dependent claims relate to possible embodiments of the device.
  • the device (“device”) described herein is for the additive production of three-dimensional objects, i. H.
  • technical components or technical component groups by successively layered selective exposure and concomitant solidification of building material layers from a means of an energy beam, in particular a laser beam, solidified building material set up.
  • the building material may be a particulate or powdered metal, plastic and / or ceramic material.
  • the selective solidification of respective selectively to be consolidated building material layers is based on object-related Bau flowers.
  • Corresponding Bauberries describe the geometrical-constructive shape of each object to be produced additive and can, for example, "geslicte" CAD data of a respective additively produced object.
  • the device may be an SLM device, i. H. to a device for performing selective laser melting (SLM) method, in particular LaserCUSING® method, or to an SLS device, d. H. to an apparatus for performing selective laser sintering (SLS) method, act.
  • SLM selective laser melting
  • SLS selective laser sintering
  • the device comprises the functional components typically required for carrying out additive construction processes, ie in particular an energy beam generation device for generating an energy beam, ie in particular a laser beam, for the successive layer-wise selective exposure and concomitant solidification of building material layers, and a coater for the formation of selectively to be exposed or selectively to be consolidated building material layers in a building level.
  • an energy beam generation device for generating an energy beam, ie in particular a laser beam
  • a coater for the formation of selectively to be exposed or selectively to be consolidated building material layers in a building level.
  • the actual selective exposure or the actual selective solidification of respective selectively to be consolidated building material layers takes place;
  • at least one building material layer to be selectively strengthened or selectively solidified is formed in a construction plane.
  • Additive building processes carried out by means of the device take place in an inertizable process chamber associated with the device.
  • the process chamber may form part of an (outer) housing structure of the device, on or in which device
  • the device comprises a tempering device as a further functional component.
  • the temperature control device is a functional component of the device that is separate from the energy beam generation device.
  • the tempering device is designed for the at least partial tempering of a building material layer formed in a construction plane, in particular (still) selectively to be consolidated or (already) selectively solidified. As will be seen below, the tempering device is set up for a locally limited tempering of individual or several contiguous or non-contiguous regions of a building material layer to be tempered.
  • Under a temperature control of a building material layer can (controlled) heating at least a portion of a building material layer to a certain heating temperature or a certain heating temperature range and / or holding a heated area at a heating temperature or a heating temperature range and a (controlled) cooling at least a portion of Building material layer to a specific cooling temperature or a specific cooling temperature range and / or holding a cooled area to be understood on a cooling temperature or a cooling temperature range.
  • the tempering device comprises at least one tempering element.
  • the tempering is set up to produce a, in particular electromagnetic, tempering.
  • the tempering which can be realized by means of the tempering device is thus effected by means of at least one electromagnetic tempering beam and thus by a targeted introduction of electromagnetic radiation - as will be described hereinafter laser radiation - into at least one region of a building material layer to be tempered, selectively solidified or selectively solidified.
  • the tempering is formed as a tempering or comprises such.
  • a tempering diode is understood to be a semiconductor element set up to produce a tempering beam, which is a laser beam.
  • the optical properties, d. H. z. As the wavelength of the temperature can be generated via a tempering temperature u. a. depending on the semiconductor material (s) used.
  • the tempering z. B wavelengths between 650 and 2000 nm, in particular between 800 and 1000 nm, and generate laser power in the range between 0.1 and 10 watts; Of course, exceptions to the top and / or below are conceivable.
  • a tempering diode is a surface emitting diode, in short a surface emitter, which is set up to radiate a laser beam perpendicularly from a plane of the semiconductor element forming the actual tempering diode; the emission surface of a corresponding semiconductor element is typically oriented towards a respective layer of building material to be tempered in the mounting state of the tempering device.
  • Corresponding surface emitting diodes are also referred to as vertical cavity surface emitting laser (VCSEL) and are distinguished from other diode types, in particular with respect to edge emitter diodes, in particular by variable beam properties, ie in particular beam profiles, intensities, of the laser beams generated by these.
  • VCSEL vertical cavity surface emitting laser
  • thermo stresses can be reduced in the building material layers to be tempered and thus in the object (s) to be produced or produced additively, which has a positive effect on the structural properties, ie. H. z.
  • the mechanical stability and dimensional stability that affects objects.
  • u.a. specifically influence the temperature-dependent absorption properties of the building material.
  • the tempering diodes can typically be varied in at least one tempering beam parameter relating to the beam properties of the tempering beam that can be generated via this, in particular in terms of its output power, intensity, wavelength, etc.
  • the device expediently comprises a control device that can be assigned to or assigned to the tempering device and implemented in hardware and / or software.
  • the control device is designed to control the operation, ie, in particular, to control at least one tempering beam parameter relating to the beam properties of the tempering beam that can be generated via a respective tempering diode, individual or a plurality of tempering diodes.
  • tempering diodes By means of the control device, an individual activation of respective tempering diodes and thus an individually adaptable temperature control of respective building material layers to be tempered are possible.
  • the geometry of corresponding Temperierstrahlungsprofile by a corresponding control of single or multiple tempering diodes (almost) be adjusted arbitrarily.
  • Corresponding Temperierstrahlungsprofile z. B. be strip-shaped, so that a locally limited strip-shaped area of a temperature to be tempered building material layer is temperature controlled. The same applies, of course, to other tempering radiation profile geometries.
  • any locally and / or temporally variable, locally controlled, tempering radiation profiles which are composed of the tempering beams generated by respective tempering diodes, in particular with regard to a building material layer to be tempered .
  • any desired temperature and time and / or temperature ramps can be realized to a specific heating temperature.
  • any desired temperature and time and / or temperature ramps can be realized to a specific cooling temperature.
  • the device may comprise a detection device, which is designed to detect the temperature of a building material layer to be tempered.
  • the detection device can be used as a temperature sensor, for. B. in the form of a pyrometer, be formed or include such.
  • the or another device-side control device if present, can be set up to control the operation of individual or multiple tempering diodes based on detection information generated by the detection device, describing the detected temperature of a building material layer to be selectively solidified or selectively solidified, with respect to a particular heating - or cooling temperature to control.
  • the control of the operation of the tempering diodes ie generally the temperature of a building material layer to be tempered, can therefore be accompanied by a temperature monitoring of the building material layer to be tempered.
  • the tempering device typically comprises not just one but a plurality of tempering diodes.
  • the tempering diodes are basically in any spatial arrangements relative to a construction level, in which respective building material layers to be tempered are formed or can be arranged or arranged.
  • An exemplary arrangement provides that the tempering diodes or a plurality of tempering diodes in the sense of a subset of a tempering device related total number of tempering diodes rows and / or columns are arranged in at least one common, in particular parallel to the building level.
  • An arrangement of Temperierdioden in contiguous rows and columns can be referred to as a matrix-like arrangement, short matrix.
  • a corresponding matrix thus comprises at least one row, typically several rows arranged in parallel, of (in each case) at least two tempering diodes and at least one column, typically a plurality of parallel columns of (in each case) at least two tempering diodes.
  • a corresponding row of tempering diodes extends at an angle, in particular perpendicular, to a corresponding column of tempering diodes and vice versa.
  • the tempering diodes or a plurality of tempering diodes in terms of a subset of tempering device related total existing number of tempering diodes in several, in particular parallel to the building level, levels can be arranged one above the other.
  • An arrangement of tempering diodes in several levels one above the other can result in a particularly compact, optionally nested, arrangement of corresponding tempering diodes.
  • the tempering diodes arranged in respective superimposed planes can be arranged in a specific spatial offset relative to one another.
  • the tempering beam generated by a tempering diode arranged in an upper level thus does not impinge on a tempering diode arranged in a lower plane, but passes through a free space, eg. B. in the form of a gap, a bore or other opening, between immediately adjacent in a lower level arranged tempering diodes.
  • the arrangement of the tempering diodes in several levels one above the other is chosen in any case so that the tempering can be directed to a respective temperature to be heated building material layer.
  • the tempering diodes can - regardless of their specific arrangement relative to each other - be arranged on or in a, in particular a housing-like, holding device.
  • the holding device can be arranged or formed outside or inside the device-side process chamber.
  • the holding device can also be arranged in a process chamber wall of the process chamber.
  • An arrangement of the tempering outside the device-side process chamber requires a suitable Einstrahliffkeit of the tempering generated by the tempering or generated tempering, which z. B. by a arranged in a process chamber wall or trained, a passage of respective tempering beams in the process chamber enabling passage window can be realized.
  • the holding device may comprise a, in particular frame-like or -shaped, holding structure on or in which the tempering diodes are arranged.
  • the holding structure typically comprises a number of predeterminable or predetermined arrangement positions on or in which at least one tempering diode can be arranged or arranged.
  • the arrangement of the tempering diodes on or in the support structure can be (damage or non-destructive) solvable, which z. B. a simplified, such as in the case of service and / or repair required replacement.
  • the holding device can be movably mounted in at least one degree of freedom of movement relative to the device-side process chamber or the building level. Movements of the holding device via a coupled or coupled with this, in particular (electro) motor, drive and / or guide device. About movements of the holding device, it is possible to Tempering diodes, z. B. with regard to a specific tempering, to move relative to a temperature to be tempered building material layer. Movements of the holding device may include translational degrees of freedom of movement along at least one translation axis and / or rotational degrees of freedom of movement about at least one axis of rotation. During movements of the holding device, it may be z. B. to act linear, rotary, tilting or pivoting movements. Of course, combined movements in several different degrees of freedom of movement are possible.
  • a corresponding drive and / or guide device can be provided by a device-side functional component movably mounted in at least one degree of freedom of movement within the device-side process chamber.
  • the holding device can accordingly be motion-coupled with a device-side functional component movably mounted in at least one degree of freedom of movement within the device-side process chamber.
  • the device-side functional component may be, for. B. to the coater, which is set up to form selectively or selectively to be consolidated building material layers in the building level act.
  • the coating device is typically movably mounted in a translatory degree of freedom of movement relative to the building plane.
  • the holding device may therefore be coupled with the coater movement, which z. B. can be realized such that the holding device directly or indirectly, d. H. with the interposition of at least one component or a group of components, is arranged on the coater.
  • the holding device can comprise a, in particular frame-like or -shaped, holding structure on or in which the tempering diodes are arranged. Movements of tempering diodes, z. B. with regard to a specific tempering situation, relative to a building material layer to be tempered can also be realized such that at least one Temperierdiode is mounted relative to the support structure and thus relative to a building material layer to be tempered in at least one degree of freedom of movement or in the support structure movable. On the part of the holding structure, a suitable drive and / or guide device, by means of which movements of tempering diodes can be realized, is provided for this purpose.
  • the above statements in connection with the movement of the holding device relative to the building level apply analogously to the movement of a temperature-controlling diode relative to the holding structure.
  • the invention also relates to a method for the additive production of three-dimensional objects by successive layerwise selective exposure and concomitant solidification of building material layers formed in a construction plane from a building material which can be solidified by means of an energy beam by means of an energy beam.
  • the method is characterized in that a device as described is used for its implementation. Consequently, all statements in connection with the device apply analogously to the method.
  • Fig. 1 shows a schematic diagram of a device 1 according to an embodiment.
  • the device 1 is used for the additive production of three-dimensional objects 2, ie in particular technical components or technical component groups, by successively layerwise selective exposure and concomitant solidification of building material layers of a solidifiable powdery building material 3, ie, for example, a metal powder, by means of a laser beam 5 generated by a laser beam generating device 4.
  • the selective exposure and the concomitant selective solidification of respective building material layers to be consolidated is carried out on the basis of object-related construction data.
  • Corresponding Bauberries describe the geometric or geometrical-constructive shape of each object to be produced additive 2.
  • Such Bauberries, for example, "geslicte" CAD data of the object to be produced 2 include.
  • the device 1 comprises an inertizable process chamber 6, in which the actual additive production of respective objects 2 takes place.
  • the process chamber 6 may form part of a housing structure (not shown) of the device 1.
  • movably mounted coating device 7 which is set up for training to be consolidated building material layers in a building level, arranged or formed. Visible are functional modules, d. H.
  • the functional modules can be detachably connected or connected to the process chamber 6 in the sense of swap bodies.
  • the tempering device 11 is a functional component of the device 1 that is separate from the laser beam generating device 4.
  • the tempering device 11 is designed for at least partial temperature control of a layer plane, in particular (yet) selectively to be consolidated or (already ) selectively solidified, building material layer furnished.
  • Under a temperature control of a building material layer is a (controlled) heating at least a portion of a building material layer to a specific heating temperature or a specific Aufloomtemperatur Siemens and / or holding a heated area on a heating temperature or a heating temperature range and a (controlled) cooling at least a portion of a building material layer to a specific cooling temperature or a certain cooling temperature range and / or holding a cooled portion at a cooling temperature or a Cooling temperature range to understand.
  • the tempering device 11 comprises a plurality of tempering elements 12 (cf. Fig. 3 ).
  • the tempering elements 12 are each set up to produce a, in particular electromagnetic, temperature control beam.
  • the tempering beams generated by the respective tempering elements 12 are combined to form a tempering radiation profile 13.
  • the temperature control which can be realized by means of the tempering device 11 is thus effected by means of an electromagnetic tempering radiation and thus by a targeted introduction of electromagnetic radiation into at least one region of a building material layer to be tempered.
  • the tempering elements 12 are each formed as Temperierdiode, ie concretely as surface emitting diode.
  • a tempering diode is understood to be a semiconductor element set up to produce a tempering beam, which is a laser beam.
  • the optical properties, ie, for example, the intensity and the wavelength, of the tempering beam that can be generated via a tempering diode are dependent, inter alia, on the semiconductor material (s) used.
  • the tempering z. B wavelengths between 800 and 1000 nm and laser powers in the range between 0.1 and 10 watts.
  • the surface emitting diodes used as tempering diodes are characterized by variable beam properties of the laser beams that can be generated by them. By means of the surface emitting diodes, different tempering beams of different beam properties can be generated accordingly. Such an individual or individually customizable, yet homogeneous tempering of building material layers is possible.
  • the tempering diodes are therefore typically variable in at least one tempering beam parameter relating to the beam properties of the tempering beam that can be generated by the latter, in particular in terms of its output power, intensity, wavelength, etc.
  • the device 1 comprises a control device 14, which is assigned to the tempering device 11 in a hardware and / or software implementation.
  • the control device 14 is used to control the operation, ie. H. in particular for controlling at least one tempering beam parameter relating to the beam properties of the tempering beam that can be generated via a respective tempering diode, single or multiple tempering diodes.
  • the control device 14 an individual control of respective tempering diodes and thus an individually adaptable temperature control of respective building material layers to be tempered are possible.
  • corresponding Temperierstrahlungsprofile 13 by a corresponding control of single or multiple tempering diodes (almost) can be adjusted arbitrarily.
  • Corresponding Temperierstrahlungsprofile 13 may, for. B. be strip-shaped, so that a locally limited strip-shaped area of a temperature to be tempered building material layer is temperature controlled. The same applies, of course, to other tempering radiation profile geometries.
  • any desired temperature and time and / or temperature ramps can be realized to a specific heating temperature.
  • any desired temperature and time and / or temperature ramps can be realized to a specific cooling temperature.
  • the device 1 may comprise a detection device (not shown because optional), which is designed to detect the temperature of a building material layer to be tempered.
  • the detection device can as a temperature sensor, z. B. in the form of a pyrometer, be formed.
  • the control device 14 can be set up to control the control of the operation of individual or multiple tempering diodes based on a detection information generated by the detection device, describing the detected temperature of a selectively to be solidified or selectively solidified building material layer individually with regard to a particular heating or cooling temperature.
  • the control of the operation of the tempering diodes ie generally the temperature of a building material layer to be tempered, can therefore be accompanied by a temperature monitoring of the building material layer to be tempered.
  • Fig. 3 shows a schematic diagram of a tempering device 11 according to an embodiment
  • the tempering device 11 comprises a plurality of tempering elements 12 and a plurality of tempering diodes.
  • the tempering diodes are arranged in rows and columns in a common plane, in particular lying parallel to the building plane. This arrangement of Temperierdioden can be referred to as a matrix-like arrangement, short matrix.
  • the tempering diodes can be arranged one above the other in several, in particular parallel to the building level, levels one above the other.
  • the tempering diodes arranged in respective superimposed planes can be arranged relative to one another in a specific spatial offset.
  • the tempering beam generated by a tempering diode arranged in an upper level thus does not impinge on a tempering diode arranged in a lower plane, but passes through a free space, eg. B. in the form of a gap, a bore or other opening, arranged in a lower plane directly adjacent tempering diodes.
  • the tempering diodes are arranged on or in a housing-like holding device 15.
  • the holding device 15 comprises a frame-like or holding structure 16, on or in which the tempering diodes are arranged.
  • the holding structure 16 comprises a number of predeterminable or predetermined arrangement positions (unspecified) on or in which at least one tempering diode can be arranged or arranged.
  • the arrangement of the tempering diodes on or in the support structure 16 can be detachable (without damage or destruction).
  • the holding device 15 and thus the tempering device 11 can be arranged or formed outside the process chamber 6.
  • the holding device 15 is arranged or formed in the region of a process chamber wall forming a ceiling region of the process chamber 6.
  • Shown in dashed lines is an alternative possibility of arrangement of the or a further holding device 15, which is arranged or formed in the region of a process chamber wall which forms a side region of the process chamber and projects, for example, at an angle.
  • the above arrangements of the tempering device 11 outside of the device-side process chamber requires a suitable Einstrahlschstedkeit the producible by the tempering or generated tempering, which z. B. by a arranged in a process chamber wall or trained, a passage of respective tempering beams in the process chamber 6 enabling passage window can be realized.
  • the holding device 15 could also be integrated in a process chamber wall of the process chamber 6.
  • the holding device 15 and the tempering device 11 is movably mounted in a degree of freedom of movement relative to the process chamber 6 and the construction level. Movements of the holding device 15 can take place via a coupling or coupled with this, in particular (electric) motor, drive and / or guide device.
  • the tempering diodes, z. B. with regard to a specific tempering, relative to move to a building material layer to be tempered. Movements of the holding device 15 may include translational degrees of freedom of movement along at least one translation axis and / or rotational degrees of freedom of movement about at least one axis of rotation. During movements of the holding device 15, it may be z. B. to act linear, rotary, tilting or pivoting movements.
  • Fig. 2 shows a schematic diagram of a device 1 according to another embodiment. Unlike the in Fig. 1 the embodiment shown, the holding device 15 and the temperature control 11 is disposed within the process chamber 6.
  • the holding device 15 is movably mounted in a degree of freedom of movement relative to the process chamber 6 or the building level. This is realized in such a way that the holding device 15 is arranged on a functional component of the device 1 movably mounted within the process chamber 6 in at least one degree of freedom of movement.
  • the functional component is the coater 7, which, as indicated by the arrow P1, is movably mounted in a translatory degree of freedom of movement relative to the building plane.
  • a stationary arrangement of the holding device 15 and the tempering device 11 within the process chamber 6 is also conceivable.
  • movements of the tempering diodes relative to a building material layer to be tempered can alternatively or additionally also be realized in such a way that individual or several tempering diodes relative to the support structure 16 and thus also relative to a building material layer to be tempered in at least one degree of freedom of movement or are movably mounted in the support structure 16.
  • a suitable drive and / or guide device (not shown), by means of which a movement of tempering diodes can be realized, would be provided for this purpose.
  • FIG. 1 shows a method for Additive manufacturing of three-dimensional objects 2 by successive layerwise selective exposure and concomitant solidification of building material layers formed in a building level from a by means of an energy beam 5 solidifiable building material 3 implement.

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CN111645324A (zh) 2020-09-11
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JP2020073328A (ja) 2020-05-14
EP3722077A1 (fr) 2020-10-14
JP2018065378A (ja) 2018-04-26
EP3311983B1 (fr) 2021-02-17
US20180111317A1 (en) 2018-04-26
CN107962778B (zh) 2020-07-10
US20220072782A1 (en) 2022-03-10
US11198251B2 (en) 2021-12-14
DE102016120044A1 (de) 2018-04-26
CN107962778A (zh) 2018-04-27

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