Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
  • H10N10/01—Manufacture or treatment
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
  • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
  • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
  • H10N10/80—Constructional details
  • H10N10/81—Structural details of the junction
  • H10N10/813—Structural details of the junction the junction being separable, e.g. using a spring
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
  • H10N10/80—Constructional details
  • H10N10/82—Connection of interconnections
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
  • H01L2224/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0277—Bendability or stretchability details
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09009—Substrate related
  • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10219—Thermoelectric component
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/04—Soldering or other types of metallurgic bonding
  • H05K2203/049—Wire bonding
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
  • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs

Definitions

• the present invention relates to a thermoelectric device, in particular to a sensor device which is fed by a thermoelectric generator.
• the invention relates to a method of making such a thermoelectric device.
• the "Internet of Things” is considered to be one of the most important future developments in information technology, meaning that not only people have access to the internet, but devices are also networked via the Internet or a similar network and home automation using sensor devices installed in appropriate locations to capture variables such as temperature, pressure, illuminance, etc., such as wirelessly across the network to minimize installation, operating and maintenance costs .
• Sensor devices are used, regardless of batteries or power supply, the electrical energy required for operation with so-called “energy harvesters” from the environment.
• energy harvesters In addition to sensor devices with solar cells, in particular those with thermoelectric generators are known which recover energy from a temperature difference present in their environment, e.g. for mounting the sensor device to a heater.
• thermoelectric generators used for this purpose typically consist of an upper and a lower substrate, which via thermally parallel and electrically connected in series legs of thermoelectric material connected to each other. Within the thermoelectric generator, an electrical voltage is generated by the Seebeck effect at a temperature difference between the upper and lower substrates. In order to enable close thermal contact with two regions of different temperatures during operation, such a thermoelectric process is used in packaging
• thermoelectric generators in an electronic housing this usually at its top and bottom with thermally conductive materials hard attached to housing walls that are in operation with different temperature ranges in contact. This, however, any shock, vibration and thermo-mechanical tension is transmitted directly to the legs of the thermoelectric generator and can lead to damage to the legs and thus the entire device.
• thermoelectric arrangement which comprises a thermoelectric component arranged on a support, which is located under a cover likewise arranged on the support. Between a hot side and / or a cold side of the thermoelectric device and the carrier or the cover, a plate-like thermally conductive compensating material is arranged in each case, which has in particular elastic Eigen- create.
• thermoelectric generator By thermo-mechanical stresses, shocks or vibrations but shear forces in particular are caused, which are only partially absorbed by a compensation material of limited thickness. It is desirable to construct a small thermoelectric generator in a thermoelectric device such. B. to integrate a sensor device, so that the shear forces are reduced to the legs of the thermoelectric generator.
• thermoelectric device with a circuit board, arranged on the circuit board electrically powered device such.
• a thermoelectric see generator is thermally connected to the circuit board and the lid, to generate from a temperature difference between the circuit board and the lid, an electrical supply voltage for the device, wherein the spring unit holds the thermoelectric generator resiliently between the circuit board and the lid.
• the thermal connection of the thermoelectric generator to the printed circuit board can also consist in that the thermoelectric generator is thermally connected to a metal structure formed as part of the printed circuit board.
• the thermal conductivity of metals is typically a hundred times greater than the thermal conductivity of an electrically insulating base material of a printed circuit board. For example, in a circuit forming the printed circuit board of base material and metal webs, heat can be transported primarily via the metal webs, so that directional guidance is possible.
• the invention provides a method of manufacturing such a thermoelectric device.
• the manufacturing method comprises a step of arranging a device such as a semiconductor device. a sensor on a printed circuit board, a step of covering the printed circuit board with a lid, a step of thermoelectrically bonding the thermoelectric generator to the printed circuit board, and the lid to provide a device electrical supply voltage from a temperature difference between the printed circuit board and the lid and a step of providing a spring unit which resiliently holds the thermoelectric generator between the circuit board and the lid.
• thermoelectric device “Cover,” “top,” and “bottom,” etc. in the present specification, unless expressly stated otherwise, mean only relative orientation within the thermoelectric device. In particular, no preferred orientation of the device with respect to gravity is meant.
• the lid covers the component-carrying printed circuit board allows a particularly compact design of the thermoelectric device, because the printed circuit board at the same time electrical connections between the component, the thermoelectric generator, etc. and provide as a lower
• thermoelectric generator By holding the thermoelectric generator resiliently between the printed circuit board and the cover by the spring unit, in the manufacture of the thermoelectric device by, for example, reflow soldering or annealing steps, in further processing, e.g. the thermoelectric device is to be connected to another substrate, or in the operation of the thermoelectric device due to thermo-mechanical stresses, vibrations, shocks, etc. between the circuit board and the cover occurring shear forces and other forces compensated by the spring unit, which the mechanical load of the thermoelectric generator reduced.
• This enables the thermal connection of the thermoelectric generator according to the invention with the circuit board and with the cover, in particular without entering the heat path, e.g. to insert plate-shaped compensating material, consistently over highly thermally conductive, such. Metallic to produce materials, resulting in a total of
• thermoelectric legs of the thermoelectric generator can be achieved with consistently good thermal connection. It should be noted that the reduction of the mechanical load of the thermoelectric generator advantageously also extends to influences caused by mechanical and thermal stresses during manufacture - such as e.g. Sawing the printed circuit board from a larger piece -, occur during transport to the site or during installation at the site.
• the spring unit has at least one spring arranged between the printed circuit board and the thermoelectric generator. This already protects the thermoelectric generator from vibrations during the manufacture of the thermoelectric device, e.g. when sawing out individual circuit boards with already mounted thermoelectric
• the spring is essentially formed from a base material of the printed circuit board.
• the printed circuit board has a lower, middle and upper printed circuit board layer, wherein the spring is essentially formed from the upper printed circuit board layer and the middle printed circuit board layer has a recess in the region of the spring. This allows, by the recess provides freedom of movement for the spring and the lower circuit board layer protection to form the spring in a particularly simple manner at low height of the thermoelectric device.
• a metal track is formed on the spring, which deflects the heat in a specific direction, for example, to allow thermal coupling to the underside with thermal vias through the printed circuit board.
• the metal tracks can be rationally formed in a common process with electrical conductors.
• At least one metal bushing is formed by the printed circuit board which thermally connects the thermoelectric generator to a lower side of the printed circuit board. This allows a particularly good thermal connection to a lying in the operation outside of the thermoelectric device under the circuit board temperature range.
• the spring unit has at least one spring arranged between the cover and the thermoelectric generator. This allows a particularly good protection of the thermoelectric generator against mechanical effects such as. Vibrations over the lid of the thermoelectric device.
• the thermal bonding comprises a step of forming a sacrificial layer which at least partially prevents springing of the spring unit, a step of fixing the thermoelectric generator to the spring unit, forming the sacrificial layer, and a step of Removing the sacrificial layer after attaching the thermoelectric generator.
• the sacrificial layer stabilizes the spring unit during fastening so that the stability required for fastening is not provided by the spring unit itself. needs to be made
• the spring unit can be made particularly soft and protective for the thermoelectric generator.
• FIG. 1 Schematic plan view of a thermoelectric device according to an embodiment of the invention, wherein a lid is not shown.
• Figure 2 Schematic cross-sectional view of the device of Figure 1 along the arrow marks A-A.
• FIG. 3 A schematic cross-sectional view of a thermoelectric device according to a further embodiment.
• Figure 4A-B Schematic plan view and side view of a spring of the device of Figure 3.
• Figure 5A-B Schematic plan view and side view of a spring of a thermoelectric device according to another embodiment.
• Figure 6A-B Schematic plan view and side view of a spring of a thermoelectric device according to another embodiment.
• FIG. 7 shows a flow chart of a production method, according to an embodiment, for the device from FIG. 1.
• FIG. 8 Schematic cross-sectional view of a thermoelectric device according to a further embodiment.
• FIG. 1 is a top view of the thermoelectric device 100, with an actual lid 106 not shown.
• FIG. 2 is a cross-sectional view of the same thermoelectric see device 100, including the lid 106 omitted in Figure 1, along a cutting plane indicated by the arrow marks AA in Figure 1.
• the thermoelectric device 100 comprises a rectangular printed circuit board 102, which is multilayered with a lower printed circuit board layer 121, a middle printed circuit board layer 122 and an upper printed circuit board layer 123 of an electrically insulating base material such.
• B. fiber-reinforced plastic is formed.
• the printed circuit board layers 121-123 are, for. B.
• an electrical trace 126 is shown by way of example, wherein further, not shown for clarity, interconnects in different planes at a formed by the upper circuit layer 123 top 119 of the circuit board 102, at one through the lower circuit board layer 121st formed underside 118 of the printed circuit board 102 and in intermediate layers between the
• Printed circuit board layers 121-123 may be formed. Further, by way of example, five electrical vias 127 are shown, which lead through the middle printed circuit board layer 122 and the middle 122 and upper printed circuit board layer 123, whereby further vias, not shown for the sake of clarity, can be provided to electrically interconnect printed conductors in different planes ,
• the thermoelectric device 100 furthermore comprises a further component 104 arranged on the printed circuit board 102, for example an integrated circuit, a light-emitting diode or a sensor, which in the present embodiment is to be assumed as a temperature sensor by way of example, but also a different type of sensor such as a sensor.
• B. may be a light, sound, field strength, vibration, position, acceleration, rotation, pressure or humidity sensor or other electrical component.
• the component 104 is mechanically fastened, for example by gluing, to the upper side 119 of the printed circuit board 102 and is connected to electrical vias 127 of the printed circuit board 102 by means of connecting wires 105.
• the connecting wires may also be drawn on any conductive structures on the substrate, which in turn may be electrically conductively connected to electrical vias on another level.
• the thermoelectric generator 180 is also arranged on the circuit board 102.
• other components such as sensors, microcontrollers, resistors, coils, radio modules, etc. may be arranged on the printed circuit board 102, which are not shown in the figures for ease of illustration , Such components may, for. B. by gluing or
• Bonding be mechanically and electrically connected to the circuit board 102, which also Wendemontage is possible.
• components are arranged only on the upper side 119 of the printed circuit board 102, but may also be provided on the underside 118 in alternative embodiments.
• the thermoelectric generator 180 has two opposite temperature sides 181, 182, of which, in the present embodiment, a cold side 181 faces away from the printed circuit board 102 and a hot side 182 is arranged facing the printed circuit board 102. It should be noted that in alternative embodiments, the cold side 181 and the hot side 182 may be reversed or each of the temperature sides 181, 182 may be operable as both a hot and a cold side.
• the thermoelectric generator 180 is designed to supply the thermoelectric device 100, including the component 104, with an electrical supply voltage U when a predetermined temperature difference prevails between the temperature sides 181, 182. For this purpose, the thermoelectric generator 180 is electrically connected by flexible wire bonds 184 to the circuit board 102, so that the resulting supply voltage U can be used to operate the remaining components or to charge an energy storage, not shown.
• the thermoelectric generator 180 is fixed with its cold side 181 via a thermally conductive paste 132 on the lid 106 of the thermoelectric device 100.
• the lid 106 has a flat, downwardly open box shape with a roof surface 161 having in the projection perpendicular to the circuit board 102 having a matching outline, and four side surfaces 162 extending from the edge of the roof surface 161 vertically down to the circuit board 102 extend where it is connected to the circuit board 102 z. B. are firmly connected by gluing.
• the thermally conductive paste 132 serves the thermal connection of Cold side 181 of the thermoelectric generator 180 with the lid 106 and at the same time for tolerance compensation when placing the lid 106 on the circuit board 102 during the manufacture of the thermoelectric device 100.
• thermoelectric generator 180 In the region of the thermoelectric generator 180, a recess 114 is formed in the middle circuit board layer 122, whose outline in the projection perpendicular to the printed circuit board 102 completely encloses the thermoelectric generator in it. Along the edge of the recess 114 a plurality of decoupling slots 113 are formed in the upper circuit board, between which thin webs 112 remain, which surrounds one of the decoupling slots 113
• the recess 114 and the island region 115 are formed by way of example rectangular, but in other embodiments, but z. B. circular or in other suitable forms, even different, be formed.
• four of the decoupling slots 113 are each trapezoidally shaped with the long base side along one of the four side edges of the rectangular recess 114, so that two leg sides of adjacent trapezoidal decoupling slots 113 parallel to each other define one of four ridges 112 extending from each extend a corner of the rectangular recess 114 in the direction of the center of the recess 114.
• a heat-conducting metal sheet 116 is formed substantially on the entire island region 115, on two of the webs 112 and in a bank region 125 extending between these opposite the island region 115.
• the webs 112 are characterized in that they have very good heat-conducting properties.
• the metal sheet 116 may, for. Example, as part of a structured metallization together with (not shown in the figures) electrical conductor tracks on the upper side 119 of the printed circuit board 102 may be formed, which simplifies the manufacture of the thermoelectric device 100.
• the metal web 116 can also be used independently of this be formed conductive tracks, z. B. with greater thickness or of a metal with higher thermal conductivity.
• the metal sheet 116 is formed with a thickness of 18-100 ⁇ copper whose thermal conductivity of 350 W / m K is well above the thermal conductivity of typical printed circuit board materials.
• the metal sheet 116 may additionally with an oxidation protection
• NiPdAu or similar alloys are NiPdAu or similar alloys.
• thermoelectric generator 180 With its hot side 182, the thermoelectric generator 180 is fixed to the portion of the metal track 116 covering the island region 115 by means of thermally conductive adhesive or thermal compound.
• a thermal feedthrough 117 is formed by the printed circuit board 102, which thermally connects the metal sheet 116 to the underside 118 of the printed circuit board 102.
• the thermal passage 117 may, for. B. be executed in the form of a vollverkupferten sleeve or a copper insert.
• the above structure allows the island portion 115 within limits, the number, arrangement and dimensions of the ridges 112, the elasticity of the base material of the printed circuit board 102 and the thicknesses of the printed circuit board layers 121-123 can be suitably specified to move elastically with respect to the rest of the circuit board 102 in different spatial directions and / or tilt.
• the webs 112 thus represent springs of a spring unit which resiliently holds the thermoelectric generator 180 between the printed circuit board 102 and the cover 106 and at the same time provides a thermal connection of the thermoelectric generator 180 to the printed circuit board 102.
• the number and dimensions of the lands 112 should preferably be selected so that the spring unit is flexible enough to accommodate thermo-mechanical stresses or to reduce vibrations, but at the same time stiff enough to pass through the thermoelectric generator 180 during fabrication of the thermoelectric device 100 z. As bonding or bonding on the island region 115 to fix. Therefore, a parallel connection of a plurality of thin resilient webs 112 is particularly suitable, so that the individual webs 112 can absorb stresses, but the spring unit as a whole is so hard that sel Suite 115 when equipping with the thermoelectric generator 180 is sufficiently stationary.
• the spring unit has a total spring constant between 5 kN / m and 500 kN / m with respect to horizontal and vertical deflection.
• An advantageously particularly soft resilient holding of the thermoelectric generator 180 with a spring constant below 5 kN / m can be made possible by supporting the island region 115 during the assembly of the thermoelectric generator 180 by a temporary sacrificial layer 130.
• This sacrificial layer 130 may be made of, for example, a thermally decomposable polymer, a water-soluble adhesive, or the like. be formed.
• This temporary stiffening of the spring unit ensures reliable loading and wire bonding of the thermoelectric generator 180.
• the thickness of the upper may be made of, for example, a thermally decomposable polymer, a water-soluble adhesive, or the like.
• Circuit board layer 123 from which the resilient webs 112 are formed, between about 0.2 and 0.4 mm, the width of the webs 112 between 0.2 mm and 1 mm and the length at less than 2 mm, whereby the total spring constant of the Spring unit can be reduced to up to 1 kN / m.
• a typical elastic modulus of 30 GPa is assumed for printed circuit boards or glass fiber epoxy systems.
• FIG. 3 shows, in a schematic cross-sectional view, a thermoelectric device 100 according to a further embodiment, in which the spring unit does not enter the printed circuit board as in the first embodiment described above
• a single-layered standard printed circuit board 102 is used here, while the spring unit has a suitably shaped metal spring 112 made of, for example, aluminum.
• B. copper which is connected by gluing, conductive bonding or soldering with the metal sheet 116 formed on the upper side 119 of the printed circuit board 102 and with the cold side 181 of the thermoelectric generator 180 mechanically and thermally.
• a sacrificial layer 130 may be used as in the first embodiment.
• Figure 4A shows the spring 112 of the thermoelectric device 100 of Figure 3 in a schematic plan view
• Figure 4B the same spring 112 in a schematic side view shows.
• the spring 112 is formed by bending back a metal sheet having a rectangular basic shape on itself and has a circuit board connection portion 140 for connection to the circuit board 102, a generator connection portion 142 for connection to the thermoelectric see generator 180 and one between the PCB connection portion
• the spring 112 may be formed with a D-shaped profile as shown in Figure 5A-B or S-shaped profile as in Figure 6A-B, with otherwise unchanged construction of the thermoelectric device 100.
• other spring geometries are conceivable.
• thermo-mechanical stress of the system can be compensated by a multiplicity of thin spring struts 144, which extend parallel to one another from opposite edges of the rectangularly formed generator connection section 142, and at the same time ensure a relatively high overall spring constant.
• a spring 112 preferably has at least four spring struts 144, but two spring struts are sufficient.
• the thickness of the metal spring 112 is preferably not less than 0.1 mm, the width also not less than 0.1 mm.
• a spring constant of a few kN / m can also be achieved with the metal springs 112 by suitable choice of the geometry. For example, by forming the spring 112 shown in FIG. 5A-B with a length of more than 2 mm, a spring constant of -10 kN / m can be achieved for a single one of the spring struts 144.
• the metallic springs can also be made of aluminum (modulus of elasticity about 70 GPa), whereby lower spring hardness can be achieved. Both copper and aluminum can be coated with an oxidation protection.
• a production method for a thermoelectric device 100 as shown in FIG. 1 will be described with reference to a flowchart shown in FIG. 7, reference being also made to FIGS. 1 and 2.
• a spring consisting of webs 112 is formed from a circuit board layer which will form the upper circuit board layer 123 in the thermoelectric device 100 by punching out decoupling slots 113, which surround an island region 115, as shown in FIG.
• a recess 114 is punched out of an equally large further circuit board layer, which will form the middle circuit board layer 122 in the thermoelectric device 100. Thereafter, the upper circuit board layer 123, the middle circuit board layer 122, and a lower circuit board layer 121 also of the same size are laminated to a circuit board 102 such that the recess 114 is located under the spring 112. Executed in this way, the steps 902, 904 and 906 form with possibly further steps for
• thermoelectric generator Forming conductor tracks, vias, etc., a parent step 900 of providing a printed circuit board 102 with an integrated spring unit for resiliently holding a thermoelectric generator in the finished thermoelectric device 100th
• a device 104 to be electrically powered such as a sensor and other electronic components, are mounted on the circuit board 102 and bonded by wire bonding. ⁇ . electrically connected to the circuit board 102.
• a sacrificial layer 130 of a polymer material is provided in the recess 114 of the printed circuit board 102, which reinforces the spring unit.
• the thermoelectric generator 180 is attached to the island region 115 held by the lands 112 of the spring assembly and the sacrificial layer 130.
• step 946 the sacrificial layer 130 is removed again, eg by exposure to heat or by means of a suitable solvent.
• a thermally conductive adhesive paste 132 is applied to the thermoelectric generator 180 and a cover 106 is mounted over the printed circuit board 102 so that the thermoelectric generator 180 comes in contact with heat-conductive adhesive paste 132 and adheres to the cover 106.
• the thermoelectric generator 180 is resiliently held between the circuit board 102 and the lid 106.
• Steps 942, 944, 946 and 960 form a superordinated step 940 of the thermal connection of the thermoelectric generator 180 to the printed circuit board 102 and to the cover 106, so that the thermoelectric device 100 completed during operation of the thermoelectric device 100 From a temperature difference between the printed circuit board 102 and the cover 106, the generator 180 can generate an electrical supply voltage U for the component 104 and the thermoelectric device 100 as a whole.
• FIG 8 is a schematic cross-sectional view of a thermoelectric device 100 according to another embodiment, wherein the circuit board 102 is formed as in the embodiment shown in Figure 3, but divergent, the hot side 182 of the thermoelectric generator 180 without intervening spring directly by gluing, soldering o. ⁇ . attached to the metal track 116 and thus connected to the circuit board 102 hard. Instead, the thermoelectric device 100 has an upper spring 111 fastened to the cover 106, which mechanically and thermally contacts the thermoelectric generator 180 at its cold side 181.
• This embodiment offers the same advantages in terms of reduction of shear forces by thermo-mechanical stresses or vibrations as the previous embodiments.
• thermoelectric device 100 the manufacturing of the thermoelectric device 100 is facilitated, because the thermoelectric generator 180 is hard attached to the substrate and can be contacted electrically in this state by bonding before the lid is set in one of the last manufacturing steps.
• the spring constant of the upper spring 111 can be selected arbitrarily soft, which allows a very soft and flexible holding the thermoelectric generator 180.
• the upper spring 111 may be formed in different shapes and with a metal such as copper or aluminum. It is also possible to combine the previously described embodiments by the spring unit both a lower spring 112 and a Upper spring 111 which hold the thermoelectric generator from both sides resiliently.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
• Toys (AREA)
• Structure Of Printed Boards (AREA)

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• 2015
  • 2015-04-29 DE DE102015207857.4A patent/DE102015207857A1/de not_active Withdrawn
• 2016
  • 2016-04-22 US US15/566,784 patent/US20180123014A1/en not_active Abandoned
  • 2016-04-22 CN CN201680024484.0A patent/CN107534400A/zh active Pending
  • 2016-04-22 WO PCT/EP2016/058955 patent/WO2016173931A1/de active Application Filing
  • 2016-04-22 EP EP16717941.5A patent/EP3289621A1/de not_active Withdrawn

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