EP3280127A1 - Systeme de camera - Google Patents

Systeme de camera Download PDF

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Publication number
EP3280127A1
EP3280127A1 EP16182914.8A EP16182914A EP3280127A1 EP 3280127 A1 EP3280127 A1 EP 3280127A1 EP 16182914 A EP16182914 A EP 16182914A EP 3280127 A1 EP3280127 A1 EP 3280127A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
carrier
printed circuit
lens
image sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP16182914.8A
Other languages
German (de)
English (en)
Other versions
EP3280127B1 (fr
Inventor
Jochen Scheja
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hexagon Technology Center GmbH
Original Assignee
Hexagon Technology Center GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hexagon Technology Center GmbH filed Critical Hexagon Technology Center GmbH
Priority to EP16182914.8A priority Critical patent/EP3280127B1/fr
Priority to CN201710655967.7A priority patent/CN107688268B/zh
Priority to US15/669,921 priority patent/US10349515B2/en
Publication of EP3280127A1 publication Critical patent/EP3280127A1/fr
Application granted granted Critical
Publication of EP3280127B1 publication Critical patent/EP3280127B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/028—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Definitions

  • the present invention relates to a camera system for measurement applications.
  • Camera systems as understood herein include: a lens; a lens carrier having a receiving opening into which the lens is inserted; an image sensor - also called camera chip -, wherein image sensor and lens are arranged to each other or can be arranged to each other so that on the image sensor, an image is sharply imaged; Furthermore, a printed circuit board - also called PCB or PCB - with which the image sensor is electrically conductively contacted, so that the electrical signals that are generated by incident light in the image sensor, are forwarded to the circuit board. The electrical signals can then be processed by an evaluation, which is located on the circuit board or represents a unit connected to this electrically connected unit or by means of other signal transmission means.
  • the term "objective” is used here in the sense that it means one or more objective lenses or else a hollow body, which as a rule is designed as a tube in which objective lenses are arranged. Wherein a focus can be done by adjusting the lenses or by rotating or moving the tube with the lenses located therein in the lens carrier.
  • a camera or camera chip can be used: CMOS, CCD, Range Imaging Camera (depth measurement with Time Of Light), photodiode array, focal plane arrays, Thermocam, multispectral sensors. in the optical path of the camera system, that is, for example, mounted in the tube or on the camera chip, also spectral filters can be provided depending on the requirements.
  • the camera system can be designed to image wavelengths in the visible range, but also in the near and far infrared wavelength range.
  • a typical example of a prior art camera system 10 is shown.
  • the lens 12 of the camera system 10 is provided in the example shown here with an external thread 14, by means of which the lens 12 is screwed into an internal thread of a receiving opening 17 of a lens carrier 16.
  • the receiving opening 17 is continuous and forms an extension of the optical axis 13 of the lens 12 has a recess 25 in which the image sensor 22 is arranged in the mounted state.
  • the sensor plane of the image sensor 22 is arranged as orthogonal as possible to the optical axis 13 of the lens 12 and the center of the sensor plane as possible aligned with the optical axis 13th
  • the image sensor 22 is fixed directly on a printed circuit board 20, wherein the fixation 24 is realized for example by a soldered connection or welded connection, so that the image sensor 22 is electrically conductively connected to the printed circuit board 20 and the electrical signals generated by incident light in the image sensor 22 be forwarded for processing on the circuit board 20.
  • the fixation 24 is realized for example by a soldered connection or welded connection, so that the image sensor 22 is electrically conductively connected to the printed circuit board 20 and the electrical signals generated by incident light in the image sensor 22 be forwarded for processing on the circuit board 20.
  • Particularly simple in the production and as a particularly stable, conductive, direct connection 24 between the image sensor 22 and circuit board 20 solder joints in the form of ball grid arrays have been found.
  • the printed circuit board 20 with the image sensor 22 fixed on it is mounted on the objective carrier 16 on the side of the objective carrier 16 opposite the lens 12 during assembly so that, on the one hand, the through opening 17 in the objective carrier 16 is closed by the printed circuit board 20 the recess 25 results, and on the other hand, the image sensor 22 then, as described above, as perpendicular as possible and placed in the middle of the optical axis 13 in the Anusappelung 25.
  • the lens carrier 16 threaded holes 18 for receiving screws 31.
  • the circuit board 20 has through holes 21, which are arranged so that they are then aligned with the threaded holes 18 of the lens carrier 16, when the fixed on the circuit board 20 image sensor 22 with its sensor plane approximately perpendicular to the optical axis 13 and with its center approximately aligned is aligned with the optical axis 13 of the lens 16. With the help of the screws 31, which are passed through the mounting holes 21 of the circuit board 20 and screwed into the threaded holes 18, the circuit board 20 is then detachably connected in this position fixedly connected to the lens carrier 16.
  • Fig.1 recognizable are lens 12 and image sensor 22 at not quite firmly drawn screws 31 relative to each other - at least relative to a plane oriented approximately perpendicular to the optical axis 13 of the lens plane - adjustable in a lateral position, and then fixed by tightening the screws in this adjusted position.
  • a defined lateral position specification can also be realized, for example by mechanical positioning aids, such as, for example, arranged on the objective carrier Positioning pins which engage in counter-trained positioning recesses of the circuit board or vice versa. An additional fixation can be ensured for example by adhesive or paint points.
  • the distance between lens 12 and image sensor 22 can be adjusted by, for example, screwing the lens with its lens thread 14 deeper into the receiving opening 17 of the lens carrier 16 or turning it further out of it.
  • the image sensor 22 and the objective 12 can be arranged along the optical axis relative to each other such that an image projected onto the image sensor 22 via the objective 12 is imaged sharply on the image sensor 22.
  • a focusing device provides for a focusing.
  • the lens thread is actuated by a motor, which makes it possible to set the distance between the image sensor and lens as described above by rotating the lens in the lens carrier variable so that a sharp image on the image sensor can be generated in a wide range.
  • the requirements for camera systems used in such photographic cameras with regard to calibratability or with regard to accuracies or tolerable errors, which can also result, for example, from vibrations or temperature fluctuations, can be compared to those available today Constructions and technical components are usually well met.
  • such focusing devices often act as sources of error due to their many mutually movable components.
  • the above-mentioned camera systems often do not meet the specified requirements. Even in measuring devices in which a focusing device-and thus one of the error sources (see above) can be dispensed with in the camera system (for example, because the distance variance is small, which must be detectable by the camera system), such camera systems frequently detect errors. especially quantitatively often difficult or even unpredictable. In addition to sudden errors, e.g. after shocks, bumps or sudden temperature fluctuations, these are, inter alia, measured value drift and / or hysteresis effects. In the absence of predictability, it is often difficult or even impossible to compensate for such errors by means of software or a corresponding calibration, or a calibration must be carried out very frequently.
  • connection between the lens and the lens carrier in many cases remains as a source of error because, as explained above, the connection between the lens and the image sensor on the circuit board generally in the form of a formed on the lens carrier screw connection is formed.
  • a further source of error in precision applications may be different coefficients of thermal expansion within the objective, that is to say the objective lenses on the one hand, and the tube carrying the lenses on the other, but also between the objective and the objective carrier.
  • connection or attachment of the image sensor on the circuit board can also be another source of error.
  • various possibilities are known for this fastening, such as soldering and welding and an embodiment of the image sensor as an SMD chip with connection pins for THT connection technology.
  • the possibility of a direct connection between the image sensor and the printed circuit board, which is probably the stiffest of the known compounds, is the connection by means of a ball grid array (BGA).
  • BGA ball grid array
  • solder bumps arranged in a grid are reflowed by reflow soldering, that is to say by heating in a soldering oven, so that subsequently the melted and again solidified solder material firmly connects contact pads of the image sensor with contact pads of the printed circuit board.
  • Plug-in slots for pin-proven camera chips or positioning aids for direct-soldering SMD camera chips as well as the continuous mounting holes, via which the printed circuit board - usually with the help of screws - are connected to the lens mount and the lens located therein, can not in the circuit board with a for the requirements of such measuring instruments are manufactured with sufficient accuracy. Therefore, the position of the camera chip on the circuit board, the position of the circuit board relative to the lens carrier and thus the position of the camera chip with respect to the lens can not be determined with sufficient accuracy or change their positions to each other, for example, shocks or temperature fluctuations, etc ..
  • a positioning aid in the form of an aluminum template is proposed, which remains even after positioning in the camera system.
  • the aluminum template has a well-defined slot for the camera chip and is welded together with the camera chip on the circuit board.
  • the aluminum template is only slightly larger than the camera chip and has laterally from the camera chip through openings, which are aligned in the welded state with the mounting holes of the circuit board.
  • the aluminum template with your slot for the camera chip and their through holes can be worked much more accurate than the circuit board, a much more accurate positioning of the individual components to each other can be achieved with the help of the aluminum template during assembly.
  • a glass-based connection construction In other known camera systems, the errors which result, in particular, from manufacturing tolerances of the mounting openings of the printed circuit board, are to be avoided by a glass-based connection construction.
  • a rear side of the image sensor is connected in the usual way with a printed circuit board, the front surface of the image sensor, however, is glued to a carrier glass.
  • the carrier glass protrudes beyond the edge of the image sensor.
  • This projecting edge of the carrier glass is connected with its side facing away from the image sensor - for example by means of a temperature-stable bond - fixed to the lens carrier, in which the lens is screwed.
  • the circuit board is connected only via the image sensor with the lens carrier.
  • the object of the present invention is to provide a camera system that is simple and inexpensive to manufacture and yet at least some of the above-mentioned, in particular for use in precision measuring instruments serious disadvantages such as measured value drift, hysteresis and difficult to predict errors , reduces or avoids.
  • Such a camera system comprises an objective with a tube and with at least one objective lens arranged in the tube, a lens carrier carrying the objective, an image sensor and a printed circuit board.
  • the printed circuit board and the image sensor are electrically connected to each other so that the electronic signals that can be passed through the light which passes through the lens on the image sensor for processing to the circuits of the circuit board.
  • the image sensor and the lens can be arranged relative to each other so that an image projected onto the image sensor via the lens can be imaged sharply on the image sensor.
  • the lens carrier and the printed circuit board are made of materials whose thermal expansion coefficient deviates by less than 30%.
  • the printed circuit board comprises a printed circuit board carrier on which at least one circuit layer is arranged.
  • the circuit layer essentially comprises a layer of electrically insulating material, such as PA or FR4, and the predetermined, preferably made of copper circuits of the circuit board.
  • the printed circuit board carrier is made of a material whose thermal expansion coefficient a L differs by at most 30%, better still by at most 25%, even better by at most 20% from the thermal expansion coefficient a o of the material from which the lens carrier is made. It is understood that the thermal expansion coefficients a L , a o refer to a temperature range of about -5 ° C to + 90 ° C. Particularly preferred are materials for the printed circuit board carrier which also have a good conductivity, such as copper or aluminum and their alloys.
  • thermal expansion coefficients of the printed circuit board carrier a L and the lens carrier a o are at most 30%, better at most 20% to 25% of each other, thermal stresses between the printed circuit board and the lens carrier can be avoided Errors, especially lead to measured value drift. If lens carrier and circuit board, as known from the prior art, are connected to each other by means of screw, so this can also be counteracted loosening of the screw.
  • the tube, lens carrier and printed circuit board carrier are each made of a material whose thermal expansion coefficient deviates by at most 30%, better by at most 25% from the thermal expansion coefficient of the at least one objective lens.
  • the printed circuit board carrier is made in this example of a material whose thermal expansion coefficient differs by at most 25% to 30% of the thermal expansion coefficient of the image sensor / camera chip.
  • Other possible materials for the printed circuit board carrier in this case are ceramics or glass ceramics. In these, the coefficient of expansion can usually be set individually by selecting the mixture components.
  • the mentioned components of the camera system namely lens carrier; Objective lens (s) and tube (collectively referred to as objective); Printed circuit board carrier and circuit layer (s) (collectively referred to as printed circuit board) can either be interconnected by means of connection types described in more detail below or they can only be interconnected by a thermally stable bond or in addition to the connection types described in more detail below be glued together.
  • the adhesive used either has a coefficient of thermal expansion which differs at most by 25% to 30% from the expansion coefficient of the materials from which the components to be joined are made, and / or the adhesive is chosen so that it can absorb the thermal stresses that arise due to different thermal expansion coefficients of the components to be connected, so that the components do not move or minimal to each other despite the different extent.
  • the material from which the lens carrier or the printed circuit board carrier is made a material from the following group of materials: Cu alloys, such as bronze or brass; stainless steel, in particular low-alloyed stainless steel; Magnesium alloy; Aluminum, aluminum alloys, in particular aluminum wrought alloys, such as EN AW-6061; Alternatively, more complex printed circuit board carrier made of glass, glass ceramic or ceramic can be used; wherein the materials are selected such that for the deviation ⁇ a L of the thermal expansion coefficient a L of the material of the printed circuit board carrier from the coefficient of thermal expansion a o of the material of the lens carrier: 0% ⁇ ⁇ a L ⁇ 30%, better 0% ⁇ ⁇ a L ⁇ 20 % or even better 0% ⁇ ⁇ a L ⁇ 10%.
  • the printed circuit board carrier is made of a metal, this has the additional effect that heat is dissipated well, which also counteracts thermal stresses and thus thermally induced errors.
  • the manufacturing tolerances can be kept small, e.g. Mating bores with a tolerance field smaller than 10 microns, which also prevents measurement errors and also counteracts a loosening of screw connections.
  • Good machinability means, in particular, that the material can be machined or machined well, e.g. Fliesss fondne forms or in the machining (such as turning, milling, drilling, grinding), a good surface quality can be achieved or the material shows a high cutting edge (cutting capacity, see for example DIN 6583).
  • the connecting elements are made of a material whose thermal expansion coefficient a v in relation to the coefficient of expansion of the lens carrier is in the range of 0 ⁇ ⁇ a ⁇ 30%, better still 0 ⁇ ⁇ a ⁇ 20%, even better 0 ⁇ ⁇ a ⁇ 10%.
  • washers and / or screw locking elements such as spring washers, Schnorrin, etc., made of material whose thermal expansion coefficient with respect to the expansion coefficient of the lens carrier is in the range of 0 ⁇ ⁇ a ⁇ 30%.
  • the image sensor can be welded, soldered or soldered by means of a ball grid array on the printed circuit board or its circuit layer.
  • a ball grid array on the printed circuit board or its circuit layer.
  • conductive connections such as electrically conductive adhesive, conductive rubber, spring contacts, flex circuit boards, bonding wires or connectors (THT), etc., or combinations thereof.
  • the image sensor is connected along its edges by means of electrically conductive connection to the circuit layer of the printed circuit board, wherein the circuit layer has a hole in an area under the image sensor, and this hole is surrounded by the / near the conductive connection (s).
  • the image sensor is fixedly connected to the printed circuit board carrier through this hole by means of a support element.
  • the support member is made of a material whose thermal expansion coefficient in terms of the expansion coefficient of the circuit board support is in the range of 0 ⁇ ⁇ a ⁇ 30%, more preferably 0 ⁇ ⁇ a ⁇ 20% to 25%, thermal effects are minimized. Even further, thermal effects can be minimized if the support element is made of the same material as the printed circuit board carrier and in particular, if it is formed integrally with the printed circuit board carrier.
  • the printed circuit board substrate and the support element are made of a material which almost or actually has the same coefficient of thermal expansion as the lens carrier, but in any case with a difference ⁇ a in the range of 0 ⁇ ⁇ a ⁇ 30%, it is possible to almost completely increase thermally induced measurement errors eliminate.
  • connection between the image sensor and the supporting element is advantageously realized by soldering, welding, cementing or a thermally stable bonding.
  • the image sensor floating on the printed circuit board carrier, because this counteracts thermal and mechanical stresses.
  • the image sensor is firmly connected to the printed circuit board carrier at most by means of three hard adhesive dots, better only by means of a hard adhesive dot.
  • it can also be connected to the printed circuit board carrier by means of further, soft adhesive dots. How many hard glue dots and whether and how many soft glue dots are used in such a floating storage depends on the size of the image sensor and the materials that make up the image sensor and the printed circuit board carrier. Under hard adhesive dots are understood adhesive points, in which the adhesive in the cured state, at least in comparison with the soft adhesive points has a higher shear stiffness.
  • connection support The properties of the connection of two components referred to herein as "floating support” are determined by the choice of adhesive (s), but also by the geometry of the bond, e.g. by the adhesive gap thickness, the number and distribution of the splices and the ratio of glued and unglued surface.
  • a printed circuit board which either has a circuit layer only on one side of the circuit board carrier, or a circuit board having both on the side facing the image sensor of the circuit board carrier has a circuit layer as well as on the the image sensor side facing away.
  • multi-layer printed circuit boards with one or more circuit board carriers and corresponding to a plurality of either directly superimposed circuit layers or at least partially separated by printed circuit board carrier circuit layers are conceivable.
  • printed circuit boards with a symmetrical structure ie with a printed circuit board carrier, for example made of aluminum or an aluminum alloy or another metal or ceramic, glass, glass ceramic, and an equal number of stacked circuit layers on each side of the printed circuit board carrier, wherein the Circuit layers comprise circuits, preferably made of copper with a thickness of 0.035mm to 0.02mm are made and a dielectric with a relatively small thickness of, for example 0.05mm to 0.8mm, in particular of 0.3mm.
  • the dielectric preferably has little or no fiber reinforcement and is for example a PA or FR4.
  • 5 to 8 or even more such circuit layers can be provided one above the other on the side of the printed circuit board carrier.
  • the circuit layers are pressed and glued over the whole surface. Due to the resulting shear-resistant composite and the lower stiffness of the circuit layers relative to the printed circuit board carrier, the circuit layers essentially follow the expansion of the printed circuit board carrier.
  • the lens carrier is provided in the region of the mounting recesses for receiving connecting elements with positioning flanges, which protrude in the direction of the circuit board to be mounted and preferably extend the mounting recesses in alignment.
  • the mounting holes in the circuit board are configured to receive the positioning flanges of the lens carrier, advantageously with little or no play; such as with a clearance H7 / g6, or by means of a press fit.
  • different geometries can be provided in partial press fits, such as square positioning flange in circular mounting opening with correspondingly matched diameter or edge length u.ä ..
  • the lens carrier and the printed circuit board carrier each have threads, by means of which they are screwed together.
  • the direct Verschraubles of these two elements with each other, instead of screws and nuts can be eliminated more sources of error.
  • the lens carrier and the printed circuit board carrier are welded, soldered or glued together. Although the elements can then no longer be separated from one another without destruction, the stability of this compound, in particular its thermal stability, is outstanding.
  • two-component epoxy adhesives with good thermal conductivity in the range of 1.2 W / mK to 1.6 W / mK and a thermal expansion coefficient in the range of 20 * 10-6 K -1 to 27 * 10-6 are suitable K -1 .
  • a softer in the cured state or harder such two-component adhesive is advantageous.
  • adhesives with hardnesses in the range from 75 to 95 Shore D, better still in the range from 80 to 85 Shore D are usable.
  • a first embodiment of a camera system 10 according to the invention is shown. It comprises an objective 12, which is provided with an external thread 14.
  • the lens 12 comprises a tube and arranged therein at least one lens, also called objective lens (s).
  • the lens (s) are made of glass or other optically transparent medium that is tuned to the requirements of a meter in which the camera system is to be used.
  • the camera system 10 comprises a lens carrier 16 with a receiving opening 17 for receiving the objective 12, which is configured throughout in this example.
  • the receiving opening 17 is provided with an internal thread, wherein the internal thread does not have to be continuous but can be continuous.
  • the internal thread and the diameter of the receiving opening 17 in the region of the internal thread are matched to the outer diameter of the lens 12 in the region of its external thread 14, so that the lens 12 can be screwed into the lens carrier 16 with the aid of the objective thread 14. In many cases fine threads are used here, especially with little or preferably no thread play.
  • the continuous receiving opening 17 in the direction of the optical axis 13 of the screwed-in objective 12 together with a part of the objective 12 forms a recess 25 in the objective carrier 16, which is accessible from the side opposite the objective 12 and serves to receive the image sensor 22 .
  • the image sensor 22 is connected by means of an electrically conductive connection 24 to a printed circuit board 20, in particular by means of a stable solder connection, such as by means of a ball grid array.
  • the printed circuit board 20 with the image sensor 22 fixed thereon is fastened to the objective carrier 16 during assembly on that side of the objective carrier 16 opposite the lens 12 such that the image sensor 22 fastened to the printed circuit board 20 is preferably aligned with its center and with its sensor plane so far technically possible perpendicular to the optical axis 13 aligned in the recess 25 is placed.
  • the printed circuit board 20 is provided with through attachment holes 21 which are arranged so that they are then aligned with the mounting recesses 19 of the lens carrier 16 when the fixed on the circuit board 20 image sensor 22 is aligned with its center aligned with the optical axis 13 of the lens.
  • connection elements 30 ' With the aid of connecting elements 30 ', the printed circuit board 20 and with it the image sensor 22 in the described position releasably connected to the lens support 16 is connected.
  • the connecting elements 30 ' are formed in the embodiment shown here as co-operating with the threaded bores 18 screws 32' made of any suitable material.
  • the fixation by means of screws 32 'can with washer / screw locking element 50' - such as spring ring, snap rings, Schnorr disk, etc. - take place, as shown on the left side of Fig. 2 is shown or something less favorable without washer and / or without screw locking elements (spring washer, Schnorrfrac etc.), as shown on the right side of the Fig. 2 is shown.
  • washer / screw locking member 50 ' are in this example of any suitable material.
  • the printed circuit board 20 advantageously comprises a printed circuit board carrier 40 and, on its side facing the image sensor 22, a circuit layer 42 with which the image sensor 22 is electrically conductively connected.
  • the circuit layer 42 can be clamped during assembly between the circuit board carrier 40 and the lens carrier 16 or the circuit view 42 may have a recess 48 in this area, so that the lens carrier 16 and PCB holder 40 touch here as on the right side of the Fig. 2 is shown.
  • the circuit board 20 is connected to the image sensor 22 fixed thereto with the lens support 16, that the through hole 17 and the recess 25 is closed by the circuit board 20.
  • the recess 25 in this way dirt and dustproof and even better sealed with respect to moisture.
  • a corresponding seal for example, with rubber seal, silicone seal, labyrinth seal, etc. may be provided.
  • the recess is not tightly closed by the circuit board after assembly or even slightly spaced from the lens support is fixed to this, which is advantageous for corresponding requirements, for example, in terms of accessibility of the components. Also, then there is no pinching of the circuit layer or it is then unnecessary a corresponding recess in the circuit layer.
  • the printed circuit board 20 as in Fig. 2 shown, a circuit layer 42 of electrically insulating material with the predetermined circuits of the circuit board and possibly other electrical components and a printed circuit board carrier 40 which is made of a material whose thermal expansion coefficient a L by at most 25% to 30% of the coefficient of thermal expansion a o of the lens carrier 16 is different.
  • thermal stresses between the printed circuit board 20 and the lens carrier 16 are avoided, which can lead to errors, in particular to measured value drift.
  • a L printed circuit board
  • a o lens carrier
  • the above-mentioned measuring errors can also be counteracted by the connecting elements 30 are selected from a material whose thermal expansion coefficient a v of that of the lens carrier a o is also as similar as possible, as for example in Fig. 3 is shown.
  • a material whose thermal expansion coefficient a v of that of the lens carrier a o is also as similar as possible, as for example in Fig. 3 is shown.
  • differences in the coefficients of expansion of at most 25% to 30%, better still at most 10% are favorable.
  • This in itself is already a sensible measure to counteract a loosening of the screw connection and thus measurement errors.
  • the connecting elements 30 in the form of screws 32 to realize (shown in Fig. 3 on the left side), it is also conceivable in the form of threaded bolts 33 and nuts 34 (shown in FIG Fig. 3 on the right side) or through bolts and nuts, rivets, etc. to realize.
  • the mounting recesses 19 are then configured accordingly as a continuous recesses 19 '(right), which are provided with or without thread or only partially threaded as needed. If you work with threaded bolts 33 and nuts 34 or through bolts and nuts, it is also executable the printed circuit board carrier 40 with a thread 31 to provide (see right side, bottom right in Fig. 3 ). Again, it is possible the connection with or without washers / screw locking elements 50 to realize. Wherein also with respect to the washers / screw locking elements 50, a corresponding choice of material with a matched thermal expansion coefficient is positive.
  • Fig. 4 A development of the camera system 10 as it is based on the Figures 2 and 3 is described in is Fig. 4 shown.
  • the image sensor 20 in turn formed as an SMD chip, but in this case electrically connected only along its edges with the circuit layer 42 of the circuit board 20.
  • the circuit layer 42 has a hole 28.
  • the image sensor 22 by means of a support member 43, 44 fixedly connected to the circuit board carrier 40, wherein the support member 43, 44 is preferably made of the same material as the circuit board carrier 40 or at least of a material with a very similar thermal expansion coefficient.
  • the support element 43, 44 is designed either as a separate component 43 (left in FIG Fig. 4 shown), which is preferably fixedly connected by soldering, welding or gluing to the printed circuit board carrier 40 or even better; it is integrally formed with the printed circuit board carrier 40 (support member 44, right in Fig. 4 shown).
  • the image sensor 22 is also preferably connected to the support member 43, 44 by either soldering, welding or gluing.
  • the circuit layer 42 has a recess 48 in the region of the connection between the printed circuit board 20 and the lens carrier 16.
  • the lens carrier 16 and the printed circuit board carrier 40 do not touch, as in FIG Fig. 2 but they are separated by pressure-resistant spacers 46 and kept at a distance, wherein the distance in this case corresponds approximately to the thickness of the circuit layer. In this way, it is possible to prevent the circuit view from being squeezed when the circuit board is connected to the lens carrier 16.
  • the spacers 48 can also be chosen such that they keep the printed circuit board 20 and the lens carrier 16 at a much greater distance from one another, so that, for example, the image sensor 22 remains more accessible.
  • a circuit layer 42 is shown which is connected by means of a floating bearing 41 with a printed circuit board carrier 40.
  • Floating means that the circuit layer 42 is firmly connected to the printed circuit board carrier 40 by means of up to three hard adhesive dots 34 - which is only a centrally arranged hard adhesive point 34 (which is the preferred variant).
  • hard adhesive dots 34 which is only a centrally arranged hard adhesive point 34 (which is the preferred variant).
  • Adhesive dots 36 are also possible for all printed circuit boards described here, the more or less full-surface bonding of circuit board 40 and circuit layer 42nd
  • the floating bearing 41 with hard and soft adhesive dots 34/36, as in Fig. 5a is illustrated and explained for a circuit layer 42, with analog advantages also for the connection of an image sensor 22 with a circuit board carrier 40 can be used (see Fig. 5b ).
  • a printed circuit board 20 is shown with a printed circuit board carrier 40 which is symmetrically provided on both sides with a circuit layer 42, 42 '.
  • a printed circuit board carrier 40 which is symmetrically provided on both sides with a circuit layer 42, 42 '.
  • thermal stresses that could lead to a mechanical bending of the printed circuit board 20, as is known for example from bi-metals avoid.
  • printed circuit boards 20, as here in 6a and 6b shown also for the here discussed camera systems 10 preferably used. Examples are also in the Fig. 7 and 9 shown.
  • circuit layers are usually glued together more or less over the entire surface and / or pressed. Equally possible here, however, is also a floating mounting 41 of the printed circuit board carrier 40 directly adjacent circuit layer 42/42 'or 42a, 42'a on the printed circuit board carrier 40, as shown in each case on the right side of Fig. 6a / 6b is shown.
  • the printed circuit board carrier 40 in the in Fig. 7 illustrated embodiment on its side facing the image sensor 22 side of a circuit layer 42 and on its side remote from the image sensor 22 side another circuit layer 42 '.
  • This can just as well as multilayer printed circuit boards (not shown, see description above), depending on the requirements, which will meet the circuit board 20, be useful.
  • the electrically conductive connection of the image sensor 22 with its facing circuit layer 42 is realized as for the examples from the Figures 2 and 3 (please refer Fig. 7 left side), but can also be linked here again with a fixation of the image sensor 22 by means of support element 43/44 on the printed circuit board carrier 40 of the printed circuit board 20 through a hole 28 of the circuit layer 42 (see Fig. 7 right side).
  • connection between the lens carrier 16 and circuit board 20 is again realized by screws 32 wherein the circuit layers 42, 42 'again either squeezed, see illustration on the left side of Fig. 7 , or but the squeezing is avoided by on the side of the image sensor 22 by spacers 46 in a recess 48 and on the opposite side, by a recess 48 'is provided around the mounting hole, in which, for example. also a washer / screw shear 50, 50 'fits with adapted thickness and thus can act as a spacer at the same time, as on the right side of the Fig. 7 is shown.
  • the printed circuit board 20 is shown here as a printed circuit board 20 with a printed circuit board carrier 40 and two opposing circuit layers 42, 42 ', wherein the image sensor 22 by means of ball grid array is electrically connected to its associated circuit layer 42 of the circuit board 20. It is understood, however, that all variants of the printed circuit board and the attachment or electrical connection 24 between the printed circuit board 20 and the image sensor 22, including those with the support element 43, 44, can also be realized. Likewise, all variants of the connection described above can be realized be realized between the printed circuit board 20 and the lens carrier 16.
  • circuit board 20 and lens support 16 are that the lens carrier 16 in the region of the mounting recesses 19, 19 'for receiving connecting elements 30, 30' Position istsflansche 15, the actual lens carrier in the direction of the circuit board to be mounted 20th protrude and preferably the recesses 19, 19 'surrounded or extend this aligned in the direction of the circuit board to be mounted.
  • the mounting holes 21 in the circuit board are designed so that they receive these positioning flanges 15 with very little tolerance, eg H7 / h6, or even better in the form of a press fit, as shown on the left side of Fig. 9 is shown.
  • FIG. 9 Another option (in which the manufacturing tolerances of the mounting holes 21 and the positioning flanges 15 may be slightly larger) is on the right side of the Fig. 9 shown. Here are the outer sides of the positioning flanges 15 and / or the inside of the mounting holes 21 with slow-curing adhesive 58 provided. If the connection by means of the connecting elements 30, 30 'installed and the adhesive 58 cured, circuit board 20 and lens support 16 are glued together and displacements of the circuit board 20 relative to the lens carrier 16 is almost impossible.
  • a lens mount made of aluminum or aluminum alloy and a printed circuit board carrier also made of aluminum or a very similar aluminum alloy and connected by means of an adhesive, which has a similar thermal expansion coefficient as the aluminum or the Aluminum alloy (s) has.
  • the lens 14 is glued into the lens mount 16 at a position that produces a sharp image on the image sensor 22 at the required imaging distance, as shown in FIG Fig. 8 is shown on a section of a further variant of the camera system 10.
  • a slow-curing adhesive 60 is applied to the internal thread of the receiving opening 17 of the lens carrier 16 and / or on the external thread 14 of the lens 12.
  • the lens 14 is screwed into the lens carrier 16 to a position that produces a sharp image on the image sensor 22 at the required imaging distance and left there to rest until the adhesive 60 has cured.
  • the lens can of course be glued, if it instead of being screwed into the lens carrier, in a sliding fit of the lens carrier is inserted, as is known in the art, and has been brought to a focusing position.
  • an adhesive 58/60 is used for each of these adhesives, which is either able to absorb stresses due to thermal expansion differences between the adjoining materials so that it can compensate for different expansions of these materials.
  • Fig. 10 an embodiment is shown in which the lens carrier 16 is formed at its opposite end of the lens 12 outside and inside cylindrical and in the region of this cylinder correspondingly has an external thread 78 and an internal thread 74.
  • the printed circuit board carrier 40 of the printed circuit board 20 is slightly thicker and equipped with a corresponding groove-shaped recess 68 with oppositely formed inner and outer threads 72, 76, so that the lens carrier 16 can be screwed into the Leiteplatte 20, or the circuit board 20 can be screwed onto the lens carrier 16. It is understood that in the groove 68, only an internal thread 76 or only an external thread 72 may be provided with a corresponding thread 74, 78 on the lens carrier 16.
  • the image sensor 22 in a known manner with a circuit layer 42 of the circuit board 20th connected.
  • the printed circuit board 42 with the image sensor 22 is in this example connected to the circuit layer 42 'on the opposite side of the printed circuit board carrier 40 by means of an electrical connection 26 guided through the printed circuit board carrier 40.
  • the electrically conductive connection 26 is realized via a through opening in the printed circuit board carrier 40, through which an insulated cable is passed, or which is coated on its walls with insulating paint for a defined electrical contact and then filled with an electrically conductive material, such as with electrically conductive plastic, electrically conductive adhesive, electrically conductive paint, electrically conductive solder.
  • Fig. 11 is a variant of the camera system 10 from Fig. 10 shown, in which case the circuit board 20 has a central cylindrical type with external thread 72, which carries the image sensor 22 and on which the lens carrier 16 is screwed with an internal thread 74.
  • a filter 9 is provided in the cavity 25 of the objective carrier 16 by way of example, which is arranged upstream of the image sensor 22 in the optical path of the camera system.
  • This filter 9 may be, for example, an IR filter, a gray filter or other spectral filter, etc. act.
  • FIG. 12 Another variant of the camera system 10 from Fig. 10 is in Fig. 12 represented in this variant, the printed circuit board carrier 40 centrally a kind of cylindrical recess with internal thread 76 for receiving a lens carrier 16 with a corresponding external thread 78 is used.
  • Fig. 13a and 13b shown embodiments of the camera system 10 are lens support 16 and printed circuit board 20 welded together or soldered together.
  • the PCB carrier 40 knows in the in Fig. 13a shown variant of this embodiment, only on its lens 12 side facing away from a circuit layer 42.
  • the arranged in the recess 25 image sensor 22 is fixed directly on the circuit board carrier 40 and by an electrical connection 26 as already for Fig. 10 has been described with this circuit layer 42 connected.
  • the variant in Fig. 13b is formed almost the same, except that lens support 16 and PCB support 40 are glued together in this variant and the PCB support 40 also in the area below the image sensor 22 has a circuit layer 42 '.
  • the fixation of the image sensor 22 on the printed circuit board 20 or the printed circuit board carrier 40 can be realized as an electrically conductive bond, also in the form of a "floating storage" described above. Depending on the requirement, however, it is also conceivable to establish the connection between the image sensor 22 and the printed circuit board 20 by means of a ball-grid array.
  • the printed circuit board carrier can be formed flat on its side facing the lens 12 be like the one on the left in the Fig. 13a, 13b is shown, or it may have an increase in the center of the image sensor 22, as shown on the right side in the Fig. 13a, 13b is shown.
  • lens carrier 16 and printed circuit board carrier 40 are integrally formed, wherein in Fig. 14 the printed circuit board carrier 40 at least on its the lens 12 facing and the recess 25 limiting surface has a circuit layer 42, with which the image sensor 22 fixed in the recess 25 is electrically connected.
  • this circuit layer 42 arranged below the image sensor 22 is electrically conductively connected to a further circuit layer 42 'mounted on the opposite side of the printed circuit board carrier 40.
  • a filter 9 is applied by way of example in this embodiment, for example, glued.
  • This filter 9 can be, for example, an IR filter, a gray filter or another spectral filter, etc.
  • Fig. 15 is almost identical to that in Fig. 14 , just that under the image sensor 22 - unlike in Fig. 14 - No circuit layer is arranged. Instead, it is analogous to the variants Fig. 13a an electrical connection 26 to a circuit layer 42 on the side opposite the image sensor 22 side of the printed circuit board carrier 40 is provided.
  • This electrically conductive connection can, as indicated by the reference numeral 26, through the printed circuit board 20 and at least the Printed circuit board carrier 40 may be guided therethrough, or as indicated by the dashed line 26 ', laterally guided by the lens carrier 16.
  • the embodiment of Fig. 13a an electrical connection 26 to a circuit layer 42 on the side opposite the image sensor 22 side of the printed circuit board carrier 40 is provided.
  • This electrically conductive connection can, as indicated by the reference numeral 26, through the printed circuit board 20 and at least the Printed circuit board carrier 40 may be guided therethrough, or as indicated by the dashed line 26 ', laterally guided by the lens carrier 16.
  • the lens 12 is not connected by a thread with the lens support 16 and then possibly glued to this, but by the lens 12, in a sliding fit 17 'of the lens carrier 16th is used.
  • the lens 12 is designed as a lens and / or further optical elements - such as filter - containing tube.
  • the lens 12 can then be secured, for example, by a clamping mechanism or a bayonet lock, etc., in the lens carrier and, depending on the requirements of the camera system, optionally also additionally glued.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
EP16182914.8A 2016-08-05 2016-08-05 Systeme de camera Active EP3280127B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP16182914.8A EP3280127B1 (fr) 2016-08-05 2016-08-05 Systeme de camera
CN201710655967.7A CN107688268B (zh) 2016-08-05 2017-08-03 照相机系统
US15/669,921 US10349515B2 (en) 2016-08-05 2017-08-05 Camera system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP16182914.8A EP3280127B1 (fr) 2016-08-05 2016-08-05 Systeme de camera

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EP3280127A1 true EP3280127A1 (fr) 2018-02-07
EP3280127B1 EP3280127B1 (fr) 2020-07-22

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EP (1) EP3280127B1 (fr)
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Also Published As

Publication number Publication date
EP3280127B1 (fr) 2020-07-22
US20180042106A1 (en) 2018-02-08
CN107688268B (zh) 2021-03-26
CN107688268A (zh) 2018-02-13
US10349515B2 (en) 2019-07-09

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