DE3307669C2 - - Google Patents
Info
- Publication number
- DE3307669C2 DE3307669C2 DE3307669A DE3307669A DE3307669C2 DE 3307669 C2 DE3307669 C2 DE 3307669C2 DE 3307669 A DE3307669 A DE 3307669A DE 3307669 A DE3307669 A DE 3307669A DE 3307669 C2 DE3307669 C2 DE 3307669C2
- Authority
- DE
- Germany
- Prior art keywords
- sink
- optical
- recess
- electrical
- optical waveguide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
- G02B6/3696—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier by moulding, e.g. injection moulding, casting, embossing, stamping, stenciling, printing, or with metallic mould insert manufacturing using LIGA or MIGA techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19833307669 DE3307669A1 (de) | 1983-03-04 | 1983-03-04 | Koppelanordnung zwischen einem elektro-optischen und/oder opto-elektrischen halbleiterbauelement und einem lichtwellenleiter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19833307669 DE3307669A1 (de) | 1983-03-04 | 1983-03-04 | Koppelanordnung zwischen einem elektro-optischen und/oder opto-elektrischen halbleiterbauelement und einem lichtwellenleiter |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3307669A1 DE3307669A1 (de) | 1984-09-06 |
DE3307669C2 true DE3307669C2 (fr) | 1992-05-21 |
Family
ID=6192501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19833307669 Granted DE3307669A1 (de) | 1983-03-04 | 1983-03-04 | Koppelanordnung zwischen einem elektro-optischen und/oder opto-elektrischen halbleiterbauelement und einem lichtwellenleiter |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE3307669A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4240460A1 (de) * | 1992-12-02 | 1994-06-09 | Ant Nachrichtentech | Vorrichtung zur lösbaren Verbindung von Lichtwellenleitern |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3433717A1 (de) * | 1984-09-14 | 1986-03-27 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum koppeln optischer bauelemente und anordnung zur durchfuehrung des verfahrens |
FR2573220B1 (fr) * | 1984-11-13 | 1987-01-16 | Cit Alcatel | Source optique |
DE3531734A1 (de) * | 1985-09-05 | 1987-03-12 | Siemens Ag | Einrichtung zur positionierung eines halbleiterlasers mit selbstjustierender wirkung fuer eine anzukoppelnde glasfaser |
JPS6273437A (ja) * | 1985-09-26 | 1987-04-04 | Mitsubishi Electric Corp | 光学式ヘツド装置 |
EP0219359B1 (fr) * | 1985-10-16 | 1990-03-07 | BRITISH TELECOMMUNICATIONS public limited company | Interféromètre de Fabry-Pérot |
US4976506A (en) * | 1989-02-13 | 1990-12-11 | Pavlath George A | Methods for rugged attachment of fibers to integrated optics chips and product thereof |
EP0635737A1 (fr) * | 1993-07-23 | 1995-01-25 | Lucas Industries Public Limited Company | Brasage d'une fibre optique de verre à un substrat de silicium |
SE508068C2 (sv) * | 1996-12-19 | 1998-08-24 | Ericsson Telefon Ab L M | Mikroreplikering i metall |
EP0871049A1 (fr) * | 1997-04-11 | 1998-10-14 | Hewlett-Packard Company | Dispositif semi-conducteur |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7505629A (nl) * | 1975-05-14 | 1976-11-16 | Philips Nv | Inrichting voor het koppelen van een lichtbron met een optische vezel. |
JPS5433683A (en) * | 1977-07-08 | 1979-03-12 | Hitachi Ltd | Air seal mounting for light emitting element |
FR2426347A1 (fr) * | 1978-05-18 | 1979-12-14 | Thomson Csf | Source laser a semi-conducteur et son procede de fabrication |
-
1983
- 1983-03-04 DE DE19833307669 patent/DE3307669A1/de active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4240460A1 (de) * | 1992-12-02 | 1994-06-09 | Ant Nachrichtentech | Vorrichtung zur lösbaren Verbindung von Lichtwellenleitern |
Also Published As
Publication number | Publication date |
---|---|
DE3307669A1 (de) | 1984-09-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8127 | New person/name/address of the applicant |
Owner name: LICENTIA PATENT-VERWALTUNGS-GMBH, 6000 FRANKFURT, |
|
8110 | Request for examination paragraph 44 | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |