EP3245447B1 - Lighting module with diodes having improved cooling - Google Patents

Lighting module with diodes having improved cooling Download PDF

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Publication number
EP3245447B1
EP3245447B1 EP16703568.2A EP16703568A EP3245447B1 EP 3245447 B1 EP3245447 B1 EP 3245447B1 EP 16703568 A EP16703568 A EP 16703568A EP 3245447 B1 EP3245447 B1 EP 3245447B1
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EP
European Patent Office
Prior art keywords
lighting module
cooling fluid
module according
box
diodes
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EP16703568.2A
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German (de)
French (fr)
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EP3245447A1 (en
Inventor
Maurice REBIFFE
Laurent MIVIS
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Xyzed SAS
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Xyzed SAS
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/59—Cooling arrangements using liquid coolants with forced flow of the coolant
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/20—Lighting for medical use
    • F21W2131/205—Lighting for medical use for operating theatres
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to the field of light emitting diode or laser projectors for stage or show lighting and more particularly relates to a diode lighting module having optimized heat dissipation.
  • LED LED
  • lasers requires to maintain the temperature of these diodes to a constant value. To do this, it is imperative to be able to evacuate any heat in excess, preferably homogeneously, while regulating the temperature.
  • a first method commonly used to remove heat is the use of an aluminum radiator with fins and placed on the surface to be cooled.
  • a fan is also often added to accelerate heat dissipation.
  • a second known method uses the heat pipe technique in which the heat is offset from the heat point by refrigerant-filled pipes coupled to ventilated fins.
  • the present invention proposes to overcome these limitations with a heat dissipating device for a diode matrix that allows efficiently and low cost to obtain a constant temperature easily and reliably.
  • An object of the invention is also to control this temperature without significant modification of the matrix.
  • said diodes are light-emitting diodes or laser diodes and said separator forms an integral part of said housing.
  • said foamed metal foam comprises two superimposed levels of cells each having calibrated holes drilled in said two perpendicular directions, additional holes being further provided at least at the top of each cell for the communication between these two levels. superimposed and, preferably, said two perpendicular directions are respectively inclined by approximately 45 ° and 135 ° relative to a direction of injection or return of the cooling fluid.
  • said housing comprises at least one groove and preferably two concentric grooves for receiving one or two annular seals sealing with said metal plate, said support plate being fixed to said housing by a plurality of screws arranged regularly outside of said at least one groove.
  • said support plate comprises a blind orifice adapted to receive a temperature sensor and said cooling fluid is water in the liquid phase or a water plus glycol mixture.
  • a light emitting diode module 10 of the electroluminescent or laser type for stage or stage projectors comprises a matrix of diodes 12 of the same predetermined wavelength, preferably having a regular distribution, and facing a optical system (not shown) providing the collimation of the light beam and formed of plastic or glass lenses of very small size carried by centering elements.
  • the matrix of diodes comprising a determined number of diodes whose power is variable according to the type and technology employed, is mounted on a support plate 14 comprising conductive tracks 16 (illustrated in FIG. figure 4 ) connected to power supply terminals 18 and in contact with which are disposed means 20 for dissipating the heat released by the diode matrix.
  • these heat dissipation means comprise a metal junction plate 22, an outer face 22A is in contact with the support plate and an inner face 22B supports a cellular foam 24 contained in a housing 26 having the form of a septate tank , sealed to a cooling fluid and the metal connecting plate 22 constitutes the cover.
  • the partitioning of the tank which separates the cellular foam into two identical independent parts is provided by a separator 28 (see FIG. figure 3 ) advantageously fixed in the metal joining plate 22 (however, a separator forming an integral part of the tank is also possible) and having a cutout 28A for the passage of the cooling fluid, so as to define a direction of circulation for this fluid with a a feed zone from an inlet orifice 26A and a reflux zone to an outlet orifice 26B, these inlet and outlet orifices, preferably of the same diameter, passing through the housing 26 being designed to receive connections 30A, 30B (see the figure 5 ) necessary to respectively inject and discharge the coolant from and to a liquid reservoir (not shown) via appropriate routing lines (also not shown).
  • a separator 28 advantageously fixed in the metal joining plate 22 (however, a separator forming an integral part of the tank is also possible) and having a cutout 28A for the passage of the cooling fluid, so as to define a direction of circulation for this fluid with
  • the seal between the partitioned tank 26 and the metal joining plate 22 illustrated in FIG. figure 4 is provided by at least one annular seal 32 disposed in a groove 26C of the housing 26. However, preferably, this seal is provided by two annular seals 32, 34 disposed in two concentric grooves 26C, 26D.
  • the fixing of the tank / plate assembly is in turn obtained by a plurality of screws 36 arranged regularly outside the grooves.
  • the foamed metal foam 24 has a plurality of calibrated holes passing through each cell according to two perpendicular directions, so as to form four holes in each cell of the metal foam.
  • each cell has a substantially spherical shape.
  • these two perpendicular directions are respectively inclined by approximately 30 ° to 60 ° (typically 45 °) and 120 ° to 150 ° (typically 135 °) with respect to the direction of injection or return of the cooling fluid defined as reference at 0 °.
  • the foamed metal foam 24 comprises two superimposed levels of cells and each of them is provided with at least one additional hole 24A at its top for a communication of the fluid between these two cell levels. More particularly, each cell is traversed by two holes facing each other, one at its top and the other at its base, the holes at the top in the upper level of cells ensuring direct contact of the cooling fluid with the plate. 22 and the holes at the base in the lower level of cells ensuring contact with the bottom of the tank 26.
  • the support plate 14 comprises at its periphery a blind hole 14A for receiving a temperature sensor intended to be connected to a control unit ensuring the injection of the cooling fluid into the housing 26.
  • the injection of the cooling fluid is carried out at a constant flow rate preferably at a temperature between 15 and 25 ° C and, to maintain the matrix of diodes at the desired temperature above, the return of the cooling fluid after its passage through the foamed metal foam 24 and the Heat exchange with the support plate of this diode matrix is then carried out at a temperature between 35 and 45 ° C.
  • the inclination of the drilling directions of the calibrated holes of the cellular foam with respect to the injection of the cooling fluid makes it possible, by the shocks created against the cells, to give this fluid a swirling effect and thus to maximize the heat exchanges. Indeed, entering "emulsion", the cooling fluid captures the best heat and released on the entire surface of the matrix of diodes.
  • the invention proposes a diode lighting module of simple embodiment, particularly effective from a thermal point of view because of the proximity of the cooling fluid to the matrix of diodes and which allows an optimization of the dissipation of the heat released by this matrix of diodes regularly and homogeneously.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

Domaine de l'inventionField of the invention

La présente invention se rapporte au domaine des projecteurs à diodes électroluminescentes ou lasers pour l'éclairage de scène ou de spectacle et elle concerne plus particulièrement un module d'éclairage à diodes présentant une dissipation de chaleur optimisée.The present invention relates to the field of light emitting diode or laser projectors for stage or show lighting and more particularly relates to a diode lighting module having optimized heat dissipation.

Art antérieurPrior art

La technologie actuelle à diodes électroluminescentes (DEL ou LED) ou lasers impose de maintenir la température de ces diodes à une valeur constante. Pour ce faire, il est impératif de pouvoir évacuer toute chaleur en excès, de préférence de façon homogène, tout en régulant la température.The current LED technology (LED or LED) or lasers requires to maintain the temperature of these diodes to a constant value. To do this, it is imperative to be able to evacuate any heat in excess, preferably homogeneously, while regulating the temperature.

Une première méthode communément utilisée pour évacuer de la chaleur est le recours à un radiateur aluminium disposant d'ailettes et posé sur la surface à refroidir. Un ventilateur est en outre souvent ajouté pour accélérer la dissipation de la chaleur.A first method commonly used to remove heat is the use of an aluminum radiator with fins and placed on the surface to be cooled. A fan is also often added to accelerate heat dissipation.

Une seconde méthode connue utilise la technique des caloducs dans laquelle la chaleur est déportée du point de chaleur par des tubulures remplies de fluide frigorigène couplées à des ailettes ventilées.A second known method uses the heat pipe technique in which the heat is offset from the heat point by refrigerant-filled pipes coupled to ventilated fins.

Toutefois, ces deux méthodes sont peu adaptées aux technologies actuelles d'éclairage à diodes car celles-ci nécessitent des refroidissements plus importants mais également plus précis pour assurer un rendement optimal des diodes. Le refroidissement par fluide (généralement par eau) est donc devenu indispensable et des systèmes à bloc froid avec compresseur sont aujourd'hui couramment utilisés. Dans ces systèmes, des platines, qui sont souvent des plaques en aluminium, prennent en « sandwich » les circuits ou conduites acheminant le fluide refroidi par le bloc froid afin de capter un maximum de chaleur. Il en résulte un système lourd, complexe et couteux affecté d'inconvénients notables. En effet, l'empilement des différents matériaux crée de nombreux ponts thermiques et les conduites de circulation du fluide nécessitent un espace important tout en limitant la dissipation de chaleur.However, these two methods are poorly adapted to current diode lighting technologies because they require greater cooling but also more accurate to ensure optimal diode efficiency. Fluid cooling (usually by water) has become essential and cold block compressor systems are now commonly used. In these systems, plates, which are often aluminum plates, sandwich the circuits or conduits conveying the cooled fluid through the tube. cold block to capture maximum heat. The result is a heavy, complex and expensive system with significant disadvantages. Indeed, the stack of different materials creates many thermal bridges and the fluid flow lines require a large space while limiting the heat dissipation.

Le document US 2008/0105413 montre un module d'éclairage refroidi par la circulation d'un fluide.The document US 2008/0105413 shows a lighting module cooled by the circulation of a fluid.

Objet et définition de l'inventionObject and definition of the invention

La présente invention propose de s'affranchir de ces limitations avec un dispositif de dissipation de chaleur pour une matrice à diodes qui permette avec efficacité et à faible coût l'obtention d'une température constante de façon simple et fiable. Un but de l'invention est aussi de contrôler cette température sans modification notable de la matrice.The present invention proposes to overcome these limitations with a heat dissipating device for a diode matrix that allows efficiently and low cost to obtain a constant temperature easily and reliably. An object of the invention is also to control this temperature without significant modification of the matrix.

Ces buts sont atteints par un module d'éclairage à diodes comportant une matrice de diodes montée sur une plaque support et des moyens de dissipation de la chaleur dégagée par ladite matrice de diodes, caractérisé en ce que lesdits moyens de dissipation de chaleur comportent :

  • une plaque métallique dont une face externe est en contact avec ladite plaque support et une face interne supporte une mousse métallique alvéolaire, ladite mousse métallique alvéolaire comportant une pluralité de trous calibrés traversant chaque alvéole selon deux directions perpendiculaires,
  • un boitier formant cuve rempli par ladite mousse métallique alvéolaire et dont ladite plaque métallique constitue le couvercle, ledit boitier comportant :
    • un orifice d'entrée traversant ledit boitier pour recevoir un fluide de refroidissement,
    • un orifice de sortie pour évacuer ledit fluide de refroidissement, et
    • un séparateur définissant dans ladite mousse métallique alvéolaire deux zones séparées de circulation pour ledit fluide de refroidissement, une zone d'amenée dudit fluide de refroidissement depuis ledit orifice d'entrée et une zone de reflux dudit fluide de refroidissement vers ledit orifice de sortie, le passage de l'une à l'autre zone s'effectuant au niveau d'une découpe dudit séparateur.
These objects are achieved by a diode lighting module comprising a matrix of diodes mounted on a support plate and heat dissipation means released by said matrix of diodes, characterized in that said heat dissipation means comprise:
  • a metal plate whose outer face is in contact with said support plate and an inner face supports a cellular foam metal, said cellular foam metal having a plurality of calibrated holes passing through each cell in two perpendicular directions,
  • a casing forming a tank filled with said foamed metal foam and of which said metal plate constitutes the cover, said casing comprising:
    • an inlet orifice passing through said housing for receiving a cooling fluid,
    • an outlet for discharging said cooling fluid, and
    • a separator defining in said foamed metal foam two separate circulation zones for said cooling fluid, a zone for supplying said cooling fluid from said inlet orifice and a reflux zone for said cooling fluid to said outlet orifice, the passage from one to the other zone being effected at a cutout of said separator.

Avec cette mousse alvéolaire parcourue sur toute sa surface, le fluide froid en provenance du bloc froid entre en émulsion par effet de tourbillons et capte ainsi mieux la chaleur dégagée.With this cellular foam traversed over its entire surface, the cold fluid from the cold block emulsified by vortices and thus better captures the heat released.

De préférence, lesdites diodes sont des diodes électroluminescentes ou des diodes lasers et ledit séparateur forme partie intégrante dudit boitier.Preferably, said diodes are light-emitting diodes or laser diodes and said separator forms an integral part of said housing.

Selon un mode de réalisation, ladite mousse métallique alvéolaire comporte deux niveaux superposés d'alvéoles ayant chacune des trous calibrés percés selon lesdites deux directions perpendiculaires, des trous supplémentaires étant en outre prévus au moins au sommet de chaque alvéole pour la communication entre ces deux niveaux superposés et, de préférence, lesdites deux directions perpendiculaires sont inclinées respectivement d'environ 45° et 135° par rapport à une direction d'injection ou de retour du fluide de refroidissement.According to one embodiment, said foamed metal foam comprises two superimposed levels of cells each having calibrated holes drilled in said two perpendicular directions, additional holes being further provided at least at the top of each cell for the communication between these two levels. superimposed and, preferably, said two perpendicular directions are respectively inclined by approximately 45 ° and 135 ° relative to a direction of injection or return of the cooling fluid.

Avantageusement, ledit boitier comporte au moins une rainure et de préférence deux rainures concentriques pour recevoir un ou deux joints annulaires assurant l'étanchéité avec ladite plaque métallique, ladite plaque support étant fixée au dit boitier par une pluralité de vis disposées régulièrement à l'extérieur de ladite au moins une rainure.Advantageously, said housing comprises at least one groove and preferably two concentric grooves for receiving one or two annular seals sealing with said metal plate, said support plate being fixed to said housing by a plurality of screws arranged regularly outside of said at least one groove.

De préférence, ladite plaque support comporte un orifice borgne apte à recevoir un capteur de température et ledit fluide de refroidissement est de l'eau en phase liquide ou un mélange eau plus glycol.Preferably, said support plate comprises a blind orifice adapted to receive a temperature sensor and said cooling fluid is water in the liquid phase or a water plus glycol mixture.

Brève description des dessinsBrief description of the drawings

Les caractéristiques et avantages de la présente invention ressortiront mieux de la description suivante, faite à titre indicatif et non limitatif, en regard des dessins annexés sur lesquels :

  • la figure 1 est une vue en perspective d'un module d'éclairage selon l'invention,
  • la figure 2 illustre un exemple de mousse métallique alvéolaire mise en oeuvre dans le module d'éclairage de la figure 1,
  • la figure 3 illustre un exemple de séparateur mis en oeuvre dans le module d'éclairage de la figure 1,
  • la figure 4 est une vue en coupe selon un plan médian vertical de la figure 1, et
  • la figure 5 est une vue en coupe selon le plan médian horizontal de la figure 1.
The features and advantages of the present invention will emerge more clearly from the following description, given by way of non-limiting indication, with reference to the appended drawings in which:
  • the figure 1 is a perspective view of a lighting module according to the invention,
  • the figure 2 illustrates an example of foamed metal foam implemented in the lighting module of the figure 1 ,
  • the figure 3 illustrates an example of a splitter implemented in the lighting module of the figure 1 ,
  • the figure 4 is a sectional view along a vertical median plane of the figure 1 , and
  • the figure 5 is a sectional view along the horizontal median plane of the figure 1 .

Description détaillée d'un mode de réalisation préférentielDetailed description of a preferred embodiment

Comme il est connu et l'illustre la figure 1, un module 10 d'éclairage à diodes de type électroluminescente ou laser pour des projecteurs de scène ou de spectacle comporte une matrice de diodes 12 d'une même longueur d'onde prédéterminée, présentant de préférence une répartition régulière, et faisant face à un système optique (non représenté) assurant la collimation du faisceau lumineux et formé de lentilles plastiques ou en verre de très petite taille portées par des éléments de centrage. La matrice de diodes comportant un nombre déterminé de diodes dont la puissance est variable selon le type et la technologie employés, est montée sur une plaque support 14 comportant des pistes conductrices 16 (illustrée à la figure 4) reliées à des bornes d'alimentation en courant 18 et au contact de laquelle sont disposés des moyens 20 de dissipation de la chaleur dégagée par la matrice de diodes.As he is known and illustrates it the figure 1 a light emitting diode module 10 of the electroluminescent or laser type for stage or stage projectors comprises a matrix of diodes 12 of the same predetermined wavelength, preferably having a regular distribution, and facing a optical system (not shown) providing the collimation of the light beam and formed of plastic or glass lenses of very small size carried by centering elements. The matrix of diodes comprising a determined number of diodes whose power is variable according to the type and technology employed, is mounted on a support plate 14 comprising conductive tracks 16 (illustrated in FIG. figure 4 ) connected to power supply terminals 18 and in contact with which are disposed means 20 for dissipating the heat released by the diode matrix.

Selon l'invention et comme illustré à la figure 2, ces moyens de dissipation de chaleur comportent une plaque métallique de jonction 22 dont une face externe 22A est en contact avec la plaque support et une face interne 22B supporte une mousse métallique alvéolaire 24 contenue dans un boitier 26 ayant la forme d'une cuve cloisonnée, étanche à un fluide de refroidissement et dont la plaque métallique de jonction 22 constitue le couvercle.According to the invention and as illustrated in figure 2 , these heat dissipation means comprise a metal junction plate 22, an outer face 22A is in contact with the support plate and an inner face 22B supports a cellular foam 24 contained in a housing 26 having the form of a septate tank , sealed to a cooling fluid and the metal connecting plate 22 constitutes the cover.

Le cloisonnement de la cuve qui sépare la mousse alvéolaire en deux parties identiques indépendantes est assurée par un séparateur 28 (voir la figure 3) avantageusement fixé dans la plaque métallique de jonction 22 (toutefois un séparateur formant partie intégrante de la cuve est aussi envisageable) et comportant une découpe 28A pour le passage du fluide de refroidissement, de sorte à définir un sens de circulation pour ce fluide avec une zone d'amenée depuis un orifice d'entrée 26A et une zone de reflux vers un orifice de sortie 26B, ces orifices d'entrée et de sortie, de préférence de même diamètre, traversant le boitier 26 étant prévus pour recevoir des raccords 30A, 30B (voir la figure 5) nécessaires pour respectivement injecter et évacuer le liquide de refroidissement depuis et vers un réservoir de liquide (non représenté) via des conduites d'acheminement appropriées (également non représentée).The partitioning of the tank which separates the cellular foam into two identical independent parts is provided by a separator 28 (see FIG. figure 3 ) advantageously fixed in the metal joining plate 22 (however, a separator forming an integral part of the tank is also possible) and having a cutout 28A for the passage of the cooling fluid, so as to define a direction of circulation for this fluid with a a feed zone from an inlet orifice 26A and a reflux zone to an outlet orifice 26B, these inlet and outlet orifices, preferably of the same diameter, passing through the housing 26 being designed to receive connections 30A, 30B (see the figure 5 ) necessary to respectively inject and discharge the coolant from and to a liquid reservoir (not shown) via appropriate routing lines (also not shown).

L'étanchéité entre la cuve cloisonnée 26 et la plaque métallique de jonction 22 illustrée à la figure 4 est assurée par au moins un joint annulaire 32 disposé dans une rainure 26C du boitier 26. Toutefois, de préférence, cette étanchéité est assurée par deux joints annulaires 32, 34 disposés dans deux rainures concentriques 26C, 26D. La fixation de l'ensemble cuve/plaque est quant à elle obtenue par une pluralité de vis 36 disposées régulièrement à l'extérieur des rainures.The seal between the partitioned tank 26 and the metal joining plate 22 illustrated in FIG. figure 4 is provided by at least one annular seal 32 disposed in a groove 26C of the housing 26. However, preferably, this seal is provided by two annular seals 32, 34 disposed in two concentric grooves 26C, 26D. The fixing of the tank / plate assembly is in turn obtained by a plurality of screws 36 arranged regularly outside the grooves.

Afin de garantir que le boitier ne soit jamais à une pression de fluide supérieure à 50KPa (0,5 bar - pression en deçà de laquelle, compte tenu de l'absence de risques de fuite significatifs, des dispositifs de sécurité spécifiques ne sont pas réglementairement obligatoires) à la pression de service (ainsi pour une pression de service de 3 bar, on choisira une pression de fluide de 3,5 bar), la mousse métallique alvéolaire 24 comporte plusieurs trous calibrés traversant chaque alvéole selon deux directions perpendiculaires, de sorte à former quatre trous dans chaque alvéole de la mousse métallique. Avantageusement, chaque alvéole présente une forme sensiblement sphérique. De préférence et comme le montre la figure 2, ces deux directions perpendiculaires sont respectivement inclinées d'environ 30° à 60° (typiquement 45°) et 120° à 150° (typiquement 135°) par rapport à la direction d'injection ou de retour du fluide de refroidissement définie comme référence à 0°.To ensure that the case is never at a fluid pressure above 50KPa (0.5 bar - pressure below which, given the absence of significant leakage risks, specific safety are not required by law) at the operating pressure (thus for a working pressure of 3 bar, a fluid pressure of 3.5 bar will be chosen), the foamed metal foam 24 has a plurality of calibrated holes passing through each cell according to two perpendicular directions, so as to form four holes in each cell of the metal foam. Advantageously, each cell has a substantially spherical shape. Preferably and as shown in figure 2 these two perpendicular directions are respectively inclined by approximately 30 ° to 60 ° (typically 45 °) and 120 ° to 150 ° (typically 135 °) with respect to the direction of injection or return of the cooling fluid defined as reference at 0 °.

Dans l'exemple illustré, la mousse métallique alvéolaire 24 comporte deux niveaux superposés d'alvéoles et chacune d'entre elles est pourvue au moins d'un trou supplémentaire 24A à son sommet pour une communication du fluide entre ces deux niveaux d'alvéoles. Plus particulièrement, chaque alvéole est traversée par deux trous se faisant face, l'un à son sommet et l'autre à sa base, les trous au sommet dans le niveau d'alvéoles supérieur assurant un contact direct du fluide de refroidissement avec la plaque 22 et les trous à la base dans le niveau d'alvéoles inférieur assurant un contact avec le fond de la cuve 26.In the illustrated example, the foamed metal foam 24 comprises two superimposed levels of cells and each of them is provided with at least one additional hole 24A at its top for a communication of the fluid between these two cell levels. More particularly, each cell is traversed by two holes facing each other, one at its top and the other at its base, the holes at the top in the upper level of cells ensuring direct contact of the cooling fluid with the plate. 22 and the holes at the base in the lower level of cells ensuring contact with the bottom of the tank 26.

Pour garantir un éclairage ayant une luminosité toujours identique, notamment après des durées de fonctionnement importantes, il est nécessaire de maintenir la matrice de diodes 12 à une température constante autour de 20 à 30°C (soit plus ou moins 5°C par rapport à une température de référence de typiquement 25°C) et de contrôler cette température. Aussi, la plaque support 14 comporte à sa périphérie un orifice borgne 14A pour recevoir un capteur de température destiné à être relié à une unité de commande assurant l'injection du fluide de refroidissement dans le boitier 26. L'injection du fluide de refroidissement, avantageusement de l'eau en phase liquide ou un mélange eau-glycol, est effectuée à débit constant de préférence à une température comprise entre 15 à 25°C et, pour maintenir la matrice de diodes à la température souhaitée précitée, le retour de ce fluide de refroidissement après son passage au travers de la mousse métallique alvéolaire 24 et l'échange thermique avec la plaque support de cette matrice à diodes s'effectue alors à une température comprise entre 35 et 45°C.In order to guarantee lighting always having the same luminosity, especially after long operating periods, it is necessary to keep the matrix of diodes 12 at a constant temperature around 20 to 30 ° C. (more or less 5 ° C. compared to a reference temperature of typically 25 ° C) and to control this temperature. Also, the support plate 14 comprises at its periphery a blind hole 14A for receiving a temperature sensor intended to be connected to a control unit ensuring the injection of the cooling fluid into the housing 26. The injection of the cooling fluid, advantageously water in the liquid phase or a water-glycol mixture, is carried out at a constant flow rate preferably at a temperature between 15 and 25 ° C and, to maintain the matrix of diodes at the desired temperature above, the return of the cooling fluid after its passage through the foamed metal foam 24 and the Heat exchange with the support plate of this diode matrix is then carried out at a temperature between 35 and 45 ° C.

Avantageusement, l'inclinaison des directions de perçage des trous calibrés de la mousse alvéolaire par rapport à l'injection du fluide de refroidissement permet par les chocs créés contre les alvéoles de donner à ce fluide un effet tourbillonnaire et ainsi de maximiser les échanges thermiques. En effet, en entrant en « émulsion », le fluide de refroidissement capte au mieux la chaleur dégagée et cela sur toute la surface de la matrice de diodes.Advantageously, the inclination of the drilling directions of the calibrated holes of the cellular foam with respect to the injection of the cooling fluid makes it possible, by the shocks created against the cells, to give this fluid a swirling effect and thus to maximize the heat exchanges. Indeed, entering "emulsion", the cooling fluid captures the best heat and released on the entire surface of the matrix of diodes.

Ainsi, l'invention propose un module d'éclairage à diodes de réalisation simple, particulièrement efficace d'un point de vue thermique du fait de la proximité du fluide de refroidissement avec la matrice de diodes et qui permet une optimisation de la dissipation de la chaleur dégagée par cette matrice de diodes de façon régulière et homogène.Thus, the invention proposes a diode lighting module of simple embodiment, particularly effective from a thermal point of view because of the proximity of the cooling fluid to the matrix of diodes and which allows an optimization of the dissipation of the heat released by this matrix of diodes regularly and homogeneously.

Claims (10)

  1. A diode lighting module (10) comprising both a diode matrix (12) mounted on a support plate (14) and heat dissipator means for dissipating the heat given off by said diode matrix, the module being characterized in that said heat dissipator means comprise:
    • a metal plate (22) having an outside face (22A) in contact with said support plate and an inside face (22B) supporting a cellular metal foam (24), said cellular metal foam including a plurality of calibrated holes (24A) passing through each cell in two perpendicular directions; and
    • a vessel-forming box (26) filled with said cellular metal foam and for which said metal plate constitutes a lid, said box including:
    • an inlet orifice (26A) passing through said box to receive a cooling fluid;
    • an outlet orifice (26B) for discharging said cooling fluid; and
    • a separator (28) defining two separate flow zones for said cooling fluid in said cellular metal foam, one zone for feeding said cooling fluid from said inlet orifice and one zone for discharging said cooling fluid towards said outlet orifice, the passage from one zone to the other taking place via a cutout (28A) in said separator.
  2. A lighting module according to claim 1, characterized in that said diodes are light-emitting diodes or laser diodes.
  3. A lighting module according to claim 1 or claim 2, characterized in that said cellular metal foam has two superposed levels of cells, each having calibrated holes (24A) pierced along said two perpendicular directions, additional holes (24A) also being provided at least in the top of each cell for communication between these two superposed levels.
  4. A lighting module according to claim 3, characterized in that said two perpendicular directions are inclined respectively at about 45° and at about 135° relative to an injector or return direction for the cooling fluid.
  5. A lighting module according to claim 1, characterized in that said separator forms an integral portion of said box.
  6. A lighting module according to claim 1, characterized in that said box includes at least one groove (26C) for receiving an annular gasket (32) for providing sealing with said metal plate.
  7. A lighting module according to claim 6, characterized in that said box includes two concentric grooves (26C, 26D), each receiving an annular gasket (32, 34) for providing sealing with said metal plate.
  8. A lighting module according to claim 6 or claim 7, characterized in that said support plate is fastened to said box by a plurality of screws (36) arranged regularly outside said at least one groove.
  9. A lighting module according to any one of claims 1 to 8, characterized in that said support plate includes a blind orifice (14A) suitable for receiving a temperature sensor.
  10. A lighting module according to any one of claims 1 to 9, characterized in that said cooling fluid is water in the liquid phase or a mixture of water plus glycol.
EP16703568.2A 2015-01-12 2016-01-11 Lighting module with diodes having improved cooling Active EP3245447B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1550210A FR3031569B1 (en) 2015-01-12 2015-01-12 IMPROVED COOLING DIODE LIGHTING MODULE
PCT/FR2016/050041 WO2016113491A1 (en) 2015-01-12 2016-01-11 Lighting module with diodes having improved cooling

Publications (2)

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EP3245447A1 EP3245447A1 (en) 2017-11-22
EP3245447B1 true EP3245447B1 (en) 2018-11-28

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EP16703568.2A Active EP3245447B1 (en) 2015-01-12 2016-01-11 Lighting module with diodes having improved cooling

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US (1) US10378750B2 (en)
EP (1) EP3245447B1 (en)
FR (1) FR3031569B1 (en)
WO (1) WO2016113491A1 (en)

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Publication number Priority date Publication date Assignee Title
FR3126803B1 (en) 2021-09-09 2023-10-20 Onx2 Sas DEVICE FOR DETECTING AND TRACKING OBJECTS IN AN AREA OF INTEREST

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US20080105413A1 (en) * 2006-10-16 2008-05-08 Yu-Huang Peng Manufacturing Method of Water Block
CN101220934A (en) * 2008-01-31 2008-07-16 宁波安迪光电科技有限公司 LED illumination device
US20090321045A1 (en) * 2008-06-30 2009-12-31 Alcatel-Lucent Technologies Inc. Monolithic structurally complex heat sink designs
GB2465493B (en) * 2008-11-25 2011-07-27 Stanley Electric Co Ltd Liquid-cooled LED lighting device
CN101865370B (en) * 2009-04-16 2013-08-07 富准精密工业(深圳)有限公司 Light-emitting diode lamp
CN101943335B (en) * 2009-07-07 2013-06-05 富准精密工业(深圳)有限公司 Light-emitting diode lamp
US9374904B2 (en) * 2014-01-10 2016-06-21 i2C Solutions, LLC Thermal ground planes and light-emitting diodes

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Publication number Publication date
US10378750B2 (en) 2019-08-13
FR3031569A1 (en) 2016-07-15
WO2016113491A1 (en) 2016-07-21
FR3031569B1 (en) 2018-11-16
US20180003372A1 (en) 2018-01-04
EP3245447A1 (en) 2017-11-22

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