EP3245447B1 - Beleuchtungsmodul mit dioden mit verbesserter kühlung - Google Patents

Beleuchtungsmodul mit dioden mit verbesserter kühlung Download PDF

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Publication number
EP3245447B1
EP3245447B1 EP16703568.2A EP16703568A EP3245447B1 EP 3245447 B1 EP3245447 B1 EP 3245447B1 EP 16703568 A EP16703568 A EP 16703568A EP 3245447 B1 EP3245447 B1 EP 3245447B1
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EP
European Patent Office
Prior art keywords
lighting module
cooling fluid
module according
box
diodes
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Active
Application number
EP16703568.2A
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English (en)
French (fr)
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EP3245447A1 (de
Inventor
Maurice REBIFFE
Laurent MIVIS
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Xyzed
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Xyzed
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/59—Cooling arrangements using liquid coolants with forced flow of the coolant
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/20—Lighting for medical use
    • F21W2131/205—Lighting for medical use for operating theatres
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to the field of light emitting diode or laser projectors for stage or show lighting and more particularly relates to a diode lighting module having optimized heat dissipation.
  • LED LED
  • lasers requires to maintain the temperature of these diodes to a constant value. To do this, it is imperative to be able to evacuate any heat in excess, preferably homogeneously, while regulating the temperature.
  • a first method commonly used to remove heat is the use of an aluminum radiator with fins and placed on the surface to be cooled.
  • a fan is also often added to accelerate heat dissipation.
  • a second known method uses the heat pipe technique in which the heat is offset from the heat point by refrigerant-filled pipes coupled to ventilated fins.
  • the present invention proposes to overcome these limitations with a heat dissipating device for a diode matrix that allows efficiently and low cost to obtain a constant temperature easily and reliably.
  • An object of the invention is also to control this temperature without significant modification of the matrix.
  • said diodes are light-emitting diodes or laser diodes and said separator forms an integral part of said housing.
  • said foamed metal foam comprises two superimposed levels of cells each having calibrated holes drilled in said two perpendicular directions, additional holes being further provided at least at the top of each cell for the communication between these two levels. superimposed and, preferably, said two perpendicular directions are respectively inclined by approximately 45 ° and 135 ° relative to a direction of injection or return of the cooling fluid.
  • said housing comprises at least one groove and preferably two concentric grooves for receiving one or two annular seals sealing with said metal plate, said support plate being fixed to said housing by a plurality of screws arranged regularly outside of said at least one groove.
  • said support plate comprises a blind orifice adapted to receive a temperature sensor and said cooling fluid is water in the liquid phase or a water plus glycol mixture.
  • a light emitting diode module 10 of the electroluminescent or laser type for stage or stage projectors comprises a matrix of diodes 12 of the same predetermined wavelength, preferably having a regular distribution, and facing a optical system (not shown) providing the collimation of the light beam and formed of plastic or glass lenses of very small size carried by centering elements.
  • the matrix of diodes comprising a determined number of diodes whose power is variable according to the type and technology employed, is mounted on a support plate 14 comprising conductive tracks 16 (illustrated in FIG. figure 4 ) connected to power supply terminals 18 and in contact with which are disposed means 20 for dissipating the heat released by the diode matrix.
  • these heat dissipation means comprise a metal junction plate 22, an outer face 22A is in contact with the support plate and an inner face 22B supports a cellular foam 24 contained in a housing 26 having the form of a septate tank , sealed to a cooling fluid and the metal connecting plate 22 constitutes the cover.
  • the partitioning of the tank which separates the cellular foam into two identical independent parts is provided by a separator 28 (see FIG. figure 3 ) advantageously fixed in the metal joining plate 22 (however, a separator forming an integral part of the tank is also possible) and having a cutout 28A for the passage of the cooling fluid, so as to define a direction of circulation for this fluid with a a feed zone from an inlet orifice 26A and a reflux zone to an outlet orifice 26B, these inlet and outlet orifices, preferably of the same diameter, passing through the housing 26 being designed to receive connections 30A, 30B (see the figure 5 ) necessary to respectively inject and discharge the coolant from and to a liquid reservoir (not shown) via appropriate routing lines (also not shown).
  • a separator 28 advantageously fixed in the metal joining plate 22 (however, a separator forming an integral part of the tank is also possible) and having a cutout 28A for the passage of the cooling fluid, so as to define a direction of circulation for this fluid with
  • the seal between the partitioned tank 26 and the metal joining plate 22 illustrated in FIG. figure 4 is provided by at least one annular seal 32 disposed in a groove 26C of the housing 26. However, preferably, this seal is provided by two annular seals 32, 34 disposed in two concentric grooves 26C, 26D.
  • the fixing of the tank / plate assembly is in turn obtained by a plurality of screws 36 arranged regularly outside the grooves.
  • the foamed metal foam 24 has a plurality of calibrated holes passing through each cell according to two perpendicular directions, so as to form four holes in each cell of the metal foam.
  • each cell has a substantially spherical shape.
  • these two perpendicular directions are respectively inclined by approximately 30 ° to 60 ° (typically 45 °) and 120 ° to 150 ° (typically 135 °) with respect to the direction of injection or return of the cooling fluid defined as reference at 0 °.
  • the foamed metal foam 24 comprises two superimposed levels of cells and each of them is provided with at least one additional hole 24A at its top for a communication of the fluid between these two cell levels. More particularly, each cell is traversed by two holes facing each other, one at its top and the other at its base, the holes at the top in the upper level of cells ensuring direct contact of the cooling fluid with the plate. 22 and the holes at the base in the lower level of cells ensuring contact with the bottom of the tank 26.
  • the support plate 14 comprises at its periphery a blind hole 14A for receiving a temperature sensor intended to be connected to a control unit ensuring the injection of the cooling fluid into the housing 26.
  • the injection of the cooling fluid is carried out at a constant flow rate preferably at a temperature between 15 and 25 ° C and, to maintain the matrix of diodes at the desired temperature above, the return of the cooling fluid after its passage through the foamed metal foam 24 and the Heat exchange with the support plate of this diode matrix is then carried out at a temperature between 35 and 45 ° C.
  • the inclination of the drilling directions of the calibrated holes of the cellular foam with respect to the injection of the cooling fluid makes it possible, by the shocks created against the cells, to give this fluid a swirling effect and thus to maximize the heat exchanges. Indeed, entering "emulsion", the cooling fluid captures the best heat and released on the entire surface of the matrix of diodes.
  • the invention proposes a diode lighting module of simple embodiment, particularly effective from a thermal point of view because of the proximity of the cooling fluid to the matrix of diodes and which allows an optimization of the dissipation of the heat released by this matrix of diodes regularly and homogeneously.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Claims (10)

  1. Diodenbeleuchtungsmodul (10), umfassend eine Diodenmatrix (12), die auf einer Trägerplatte (14) montiert ist, und Mittel zur Ableitung von Wärme, die von der Diodenmatrix abgegeben wird, dadurch gekennzeichnet, dass die Wärmeableitungsmittel umfassen:
    - eine Metallplatte (22), bei der eine Außenseite (22A) in Kontakt mit der Trägerplatte ist und eine Innenseite (22B) einen zelligen Metallschaum (24) trägt, wobei der zellige Metallschaum eine Vielzahl von kalibrierten Löchern (24A) umfasst, die durch jede Zelle in zwei senkrechten Richtungen verlaufen,
    - ein gefäßbildendes Gehäuse (26), das mit dem zelligen Metallschaum gefüllt ist und bei dem die Metallplatte den Deckel bildet, wobei das Gehäuse umfasst:
    - eine Eintrittsöffnung (26A), die durch das Gehäuse verläuft, zum Aufnehmen einer Kühlflüssigkeit,
    - eine Austrittsöffnung (26B) zum Abführen der Kühlflüssigkeit, und
    - einen Separator (28), der in dem zelligen Metallschaum zwei getrennte Zirkulationszonen für die Kühlflüssigkeit definiert, eine Zone zum Führen der Kühlflüssigkeit von der Eintrittsöffnung und eine Zone für den Rückfluss der Kühlflüssigkeit zu der Austrittsöffnung, wobei der Durchlauf von einer zu der anderen Zone auf Höhe eines Ausschnitts (28A) des Separators bewirkt wird.
  2. Beleuchtungsmodul nach Anspruch 1, dadurch gekennzeichnet, dass die Dioden Elektrolumineszenzdioden oder Laserdioden sind.
  3. Beleuchtungsmodul nach Anspruch 1 oder Anspruch 2, dadurch gekennzeichnet, dass der zellige Metallschaum zwei übereinanderliegende Ebenen von Zellen umfasst, die jeweils kalibrierte Löcher (24A) aufweisen, die entlang der zwei senkrechten Richtungen gebohrt sind, wobei zusätzliche Löcher (24A) außerdem zumindest an dem Scheitelpunkt jeder Zelle zur Kommunikation zwischen diesen zwei übereinanderliegenden Ebenen vorgesehen sind.
  4. Beleuchtungsmodul nach Anspruch 3, dadurch gekennzeichnet, dass die zwei senkrechten Richtungen um ungefähr 45° bzw. 135° in Bezug auf eine Richtung des Einspritzens oder des Rückführens der Kühlflüssigkeit geneigt sind.
  5. Beleuchtungsmodul nach Anspruch 1, dadurch gekennzeichnet, dass der Separator einen integralen Bestandteil des Gehäuses bildet.
  6. Beleuchtungsmodul nach Anspruch 1, dadurch gekennzeichnet, dass das Gehäuse mindestens eine Nut (26C) zum Aufnehmen einer ringförmigen Dichtung (32) umfasst, die die Dichtigkeit mit der Metallplatte sicherstellt.
  7. Beleuchtungsmodul nach Anspruch 6, dadurch gekennzeichnet, dass das Gehäuse zwei konzentrische Nuten (26C, 26D) umfasst, die jeweils eine ringförmige Dichtung (32, 34) aufnehmen, die die Dichtigkeit mit der Metallplatte sicherstellt.
  8. Beleuchtungsmodul nach Anspruch 6 oder Anspruch 7, dadurch gekennzeichnet, dass die Trägerplatte mittels einer Vielzahl von Schrauben (36), die gleichmäßig außerhalb der mindestens einen Nut angeordnet sind, an dem Gehäuse befestigt ist.
  9. Beleuchtungsmodul nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass die Trägerplatte eine Blindöffnung (14A) umfasst, die zum Aufnehmen eines Temperaturfühlers geeignet ist.
  10. Beleuchtungsmodul nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, dass die Kühlflüssigkeit Wasser in flüssiger Phase oder ein Wassergemisch plus Glykol ist.
EP16703568.2A 2015-01-12 2016-01-11 Beleuchtungsmodul mit dioden mit verbesserter kühlung Active EP3245447B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1550210A FR3031569B1 (fr) 2015-01-12 2015-01-12 Module d'eclairage a diodes a refroidissement ameliore
PCT/FR2016/050041 WO2016113491A1 (fr) 2015-01-12 2016-01-11 Module d'eclairage a diodes a refroidissement ameliore

Publications (2)

Publication Number Publication Date
EP3245447A1 EP3245447A1 (de) 2017-11-22
EP3245447B1 true EP3245447B1 (de) 2018-11-28

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EP16703568.2A Active EP3245447B1 (de) 2015-01-12 2016-01-11 Beleuchtungsmodul mit dioden mit verbesserter kühlung

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US (1) US10378750B2 (de)
EP (1) EP3245447B1 (de)
FR (1) FR3031569B1 (de)
WO (1) WO2016113491A1 (de)

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FR3126803B1 (fr) 2021-09-09 2023-10-20 Onx2 Sas Dispositif de detection et suivi d'objets dans une zone d'intérêt

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US20080105413A1 (en) * 2006-10-16 2008-05-08 Yu-Huang Peng Manufacturing Method of Water Block
CN101220934A (zh) * 2008-01-31 2008-07-16 宁波安迪光电科技有限公司 Led照明装置
US20090321045A1 (en) 2008-06-30 2009-12-31 Alcatel-Lucent Technologies Inc. Monolithic structurally complex heat sink designs
GB2465493B (en) * 2008-11-25 2011-07-27 Stanley Electric Co Ltd Liquid-cooled LED lighting device
CN101865370B (zh) * 2009-04-16 2013-08-07 富准精密工业(深圳)有限公司 发光二极管灯具
CN101943335B (zh) * 2009-07-07 2013-06-05 富准精密工业(深圳)有限公司 发光二极管灯具
US9374904B2 (en) * 2014-01-10 2016-06-21 i2C Solutions, LLC Thermal ground planes and light-emitting diodes

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Also Published As

Publication number Publication date
FR3031569A1 (fr) 2016-07-15
FR3031569B1 (fr) 2018-11-16
EP3245447A1 (de) 2017-11-22
WO2016113491A1 (fr) 2016-07-21
US20180003372A1 (en) 2018-01-04
US10378750B2 (en) 2019-08-13

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