EP3235643A1 - Tête à jet d'encre, dispositif d'impression à jet d'encre, et procédé de fabrication de tête à jet d'encre - Google Patents

Tête à jet d'encre, dispositif d'impression à jet d'encre, et procédé de fabrication de tête à jet d'encre Download PDF

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Publication number
EP3235643A1
EP3235643A1 EP15869830.8A EP15869830A EP3235643A1 EP 3235643 A1 EP3235643 A1 EP 3235643A1 EP 15869830 A EP15869830 A EP 15869830A EP 3235643 A1 EP3235643 A1 EP 3235643A1
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EP
European Patent Office
Prior art keywords
hole
channel
inkjet head
ink
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15869830.8A
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German (de)
English (en)
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EP3235643B1 (fr
EP3235643A4 (fr
Inventor
Hideyuki Kobayashi
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Konica Minolta Inc
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Konica Minolta Inc
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Publication of EP3235643A1 publication Critical patent/EP3235643A1/fr
Publication of EP3235643A4 publication Critical patent/EP3235643A4/fr
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Publication of EP3235643B1 publication Critical patent/EP3235643B1/fr
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14145—Structure of the manifold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • B41J2002/14225—Finger type piezoelectric element on only one side of the chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2002/14306—Flow passage between manifold and chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14419—Manifold

Definitions

  • the present invention relates to an inkjet head, an inkjet recording apparatus including the inkjet head, and a method for manufacturing the inkjet head.
  • Patent Literature 1 JP 2004-268315 A
  • the present inventor has focused attention on the flow path resistance of the through hole and the shape of the through hole and has reached the present invention.
  • An object of the present invention is to provide an inkjet head, an inkjet recording apparatus including the inkjet head, and a method for manufacturing an inkjet head enabling even low-viscosity ink to be ejected in a stable manner.
  • an inkjet head includes:
  • an inkjet recording apparatus includes:
  • a method for manufacturing the inkjet head includes:
  • a method for manufacturing the inkjet head includes:
  • Fig. 1 is a schematic configuration diagram of an inkjet recording apparatus 100.
  • the inkjet recording apparatus 100 includes a conveyance belt (supporting unit) 101 supporting a recording medium, a carriage rail (traveling unit) 102 adapted to cause a carriage 103 including an inkjet head H to travel, a cleaning liquid supplying unit 104 including a cleaning roller 80, an ink rack 105, and a computer 106.
  • Fig. 2 is an exploded perspective view illustrating an example of the inkjet head H.
  • Fig. 3 is a view of a head chip of the inkjet head H illustrated in Fig. 2 seen from the rear side.
  • Fig. 4 is a partial cross-sectional view of the inkjet head H illustrated in Fig. 2 . It is to be noted that, in Fig. 4 , illustration of a manifold is omitted.
  • the inkjet head H includes a head chip 1, a nozzle plate 2, a wiring board 3, and a manifold 4.
  • the head chip 1 is a hexahedron including a front surface 1a, a rear surface 1b, and four upper, lower, right, and left side surfaces interposed between the front surface 1a and the rear surface 1b.
  • multiple straight channels 11 are formed.
  • Partition walls partitioning the adjacent channels 11 are driving walls 12 made of a piezoelectric device.
  • the multiple channels 11 and driving walls 12 are alternately arranged to constitute each of channel rows 10A to 10D.
  • the head chip 1 is a so-called harmonica type head chip in which the channels 11 and the driving walls 12 are alternately arrayed and in which an outlet and an inlet of each channel 11 are disposed to be opposed to each other on the front surface 1a and the rear surface 1b of the head chip 1.
  • the four channel rows 10A to 10D are provided and are arrayed in an up-down direction in Fig. 2 .
  • the front surface of the head chip 1 is a surface on a side on which nozzles are arranged to eject ink
  • the rear surface is an opposite surface
  • the inkjet head H is an inkjet head of an independent driving type in which the channels 11 in the respective channel rows 10A to 10D include driving channels 11a into which ink is supplied and from which the ink is ejected and dummy channels 11b into which no ink is supplied and from which no ink is ejected.
  • the driving channels 11a and the dummy channels 11b are alternately arranged.
  • the head chip 1 is a shear mode type head chip, and in the driving channel 11a, an opening on the side of the front surface 1a is an outlet of ink while an opening 110 on the side of the rear surface 1b is an inlet of ink.
  • the dummy channel 11b has similar openings, and the openings of the dummy channel 11b are closed by the below-mentioned nozzle plate 2 and wiring board 3 and do not allow ink to go therein or thereout.
  • a driving electrode 13 for voltage application configured to deform the driving wall 12 is closely attached and formed by means of sputtering, deposition, non-electrolytic plating, or the like.
  • a connecting electrode 14 electrically connected to the driving electrode 13 via the opening 110 of each of the channels 11a and 11b is formed by means of sputtering, deposition, non-electrolytic plating, or the like to be extracted from one side of each opening 110 of each of the channels 11a and 11b.
  • the connecting electrode 14 of each of the channels 11a and 11b in the two channel rows 10A and 10B out of the channel rows 10A to 10D is formed to extend from the opening 110 of each of the channels 11a and 11b toward a side edge e1 close to the channel row 10A while the connecting electrode 14 of each of the channels 11a and 11b in the two other channel rows 10C and 10D is formed to extend from the opening 110 of each of the channels 11a and 11b toward a side edge e2 close to the channel row 10D.
  • each of the connecting electrodes 14 in the channel rows 10B and 10C stops behind the channel rows 10A and 10D respectively adjacent to the channel rows 10B and 10C.
  • the nozzle plate 2 is attached to the front surface 1a of the head chip 1.
  • Nozzles 21 are formed to pass through the nozzle plate 2 only at positions corresponding to the driving channels 11a. Thus, the openings of the dummy channels 11b on the side of the front surface 1a are closed by the nozzle plate 2.
  • the wiring board 3 is connected via adhesive (not illustrated).
  • the wiring board 3 is larger in area than the rear surface 1b of the head chip 1, and, in a state in which the wiring board 3 is attached to the rear surface 1b of the head chip 1, end portions 3a and 3b arranged in a direction perpendicular to the channel row direction extend further than the head chip 1 and project significantly in the up-down direction in Fig. 2 .
  • the wiring board 3 is provided only at positions thereof corresponding to the driving channels 11a of the head chip 1 individually with through holes 31 adapted to supply the respective driving channels 11a with ink stored in the manifold 4 to be connected to a back surface side of the wiring board 3.
  • the wiring board 3 is provided at positions thereof corresponding to the dummy channels 11b with no through holes.
  • the openings 110 of the dummy channels 11b on the side of the rear surface 1b are closed by the wiring board 3.
  • the wiring board 3 As a material for the wiring board 3, an appropriate material such as glass, ceramic, silicon, and one of various plastics such as polyamide can be used. Among these, the glass is preferable in that the glass is adequately rigid, cheap, and easy to process. Furthermore, by using a transparent glass board, (below-mentioned) wiring electrodes 32 and the connecting electrodes 14 of the head chip 1 can be seen through the wiring board 3 from the rear side, and positioning between the wiring electrodes 32 and the connecting electrodes 14 can be performed easily.
  • a transparent glass board (below-mentioned) wiring electrodes 32 and the connecting electrodes 14 of the head chip 1 can be seen through the wiring board 3 from the rear side, and positioning between the wiring electrodes 32 and the connecting electrodes 14 can be performed easily.
  • the thickness of the wiring board 3 is preferably in the range of 200 ⁇ m or more and 800 ⁇ m or less. Setting the thickness of the wiring board 3 to 200 ⁇ m or more can provide favorable handling at the time of manufacture. Setting the thickness of the wiring board 3 to 800 ⁇ m or less can prevent formation of the through holes 31 from being extremely time-consuming and can provide favorable bubble removability at the time of introduction of ink into the through holes 31.
  • the elastic modulus of the wiring board 3 is preferably 30 GPa or more. Setting the elastic modulus of the wiring board 3 to 30 GPa or more can prevent pressure waves (energy) generated in the channels in the shear mode from being attenuated due to a damping effect of the wiring board to cause ejection of ink to be unstable.
  • Fig. 5 illustrates a shape of the through hole 31 formed in the wiring board 3.
  • the through hole 31 is formed at a center thereof in a shape in which a constricted portion 31b having a shorter distance in the right-left direction than those of a front end portion 31a and a rear end portion 31c of the through hole 31 (having a smaller cross-sectional area as seen in the front-back direction) is formed. Furthermore, the front end portion 31a, the constricted portion 31b, and the rear end portion 31c of the through hole 31 are circular as seen in the front-back direction.
  • the front end portion 31a of the through hole 31 has an equivalent or smaller opening area to or than that of the opening 110 to face the head chip 1, and the rear end portion 31c of the through hole 31 has an equivalent or larger opening area to or than that of the front end portion 31a.
  • ink to be supplied into the channel is smoothly introduced through the constricted portion 31b, ink introducing performance can be improved further than in a case in which the stereoscopic shape is a cylindrical shape.
  • bubbles in the channel since the bubbles are smoothly introduced into the constricted portion 31b and are removed out of the channel, bubble removability can be improved.
  • the flow path resistance of the through hole 31 is set to a value of 0.2 or higher. Setting the flow path resistance of the through hole 31 to a value of 0.2 or higher enables overflow of ink to be restricted even when low-viscosity ink having viscosity resistance of 5 cp or less is used.
  • the through hole 31 is formed in the above shape, the through hole 31 can restrict ink overflow while keeping ink introducing performance.
  • ink can be ejected in a stable manner even when low-viscosity ink is ejected in a high driving cycle, for example.
  • the flow path resistance of the through hole 31 It is more preferable to set the flow path resistance of the through hole 31 to a value in a range of 0.4 or higher and 1.0 or lower. Setting the flow path resistance of the through hole 31 to 0.4 or higher can provide favorable ejection stability of ink having viscosity resistance of 5 cp or less. Setting flow path resistance of the through hole 31 to 1.0 or lower can prevent a problem in which refilling gets poor to disable high-speed driving from being generated.
  • the through hole 31 can be formed by means of any of various processing methods such as sandblasting, laser processing, electric spark forming, and ultrasonic processing, and the sandblasting is especially preferable in terms of quality, cost, and productivity.
  • a glass plate (board main body) serving as a material for the wiring board 3 is provided with a masking material that protects a non-processed region, and a processed region of the glass plate is cut by spraying compressed air mixed with a polishing agent to the processed region from a nozzle.
  • the processing amount at this time is adjusted in accordance with a targeted processing shape.
  • three glass plates (board main bodies) 3A, 3B, and 3C may respectively be sandblasted on either or both surfaces to form hole portions having different areas (hole portion forming process) and may be attached to each other so that the hole portions may overlap with each other to produce the wiring board 3 provided with the drum-shaped through holes 31 (through hole forming process).
  • the shape of the through hole 31 is not limited to one illustrated in Figs. 5 and 6 and may be one illustrated in each of Figs. 7A and 7B .
  • Fig. 7A illustrates an example of the through hole 31 having a constricted portion 31d having a predetermined length in the front-back direction.
  • Fig. 7B illustrates an example of the through hole 31 having a constricted portion 31e formed in a curved shape. Furthermore, a plurality of constricted portions may be formed although illustration thereof is omitted.
  • the wiring electrodes 32 are formed by means of sputtering, deposition, non-electrolytic plating, or the like to correspond to the respective connecting electrodes 14 arrayed on the rear surface 1b of the head chip 1 in a one-to-one relationship.
  • each of the wiring electrodes 32 In a state in which the head chip 1 and the wiring board 3 are attached, one end of each of the wiring electrodes 32 reaches the vicinity of the corresponding opening 110 of each of the driving channels 11a and the dummy channels 11b while the other end extends toward each of the end portions 3a and 3b of the wiring board 3 projecting in the up-down direction of the head chip 1.
  • the other end of each of the wiring electrodes 32 corresponding to the channel rows 10A and 10B extends toward the end portion 3a on the upper side of the figure while the other end of each of the wiring electrodes 32 corresponding to the channel rows 10C and 10D extends toward the end portion 3b on the lower side of the figure.
  • Fig. 8 illustrates an example of the driving signal to be used in the present embodiment.
  • the driving signal in Fig. 8 is applied to each of the driving channels 11a adapted to eject ink, and each of the dummy channels 11b is connected to the earth.
  • the driving signal includes in a driving cycle T a first pulse Pa serving as a positive voltage (+ Von) rectangular wave that expands the volume of the channel and recovers the original volume after a lapse of a predetermined period of time and a second pulse Pb serving as a negative voltage (- Voff) rectangular wave that contracts the volume of the channel and recovers the original volume after a lapse of a predetermined period of time.
  • a first pulse Pa serving as a positive voltage (+ Von) rectangular wave that expands the volume of the channel and recovers the original volume after a lapse of a predetermined period of time
  • a second pulse Pb serving as a negative voltage (- Voff) rectangular wave that contracts the volume of the channel and recovers the original volume after a lapse of a predetermined period of time.
  • the predetermined period of time which is a duration period for expanding or contracting the volume of the channel 11, is expressed as an AL (Acoustic Length).
  • the AL is 1/2 of an acoustic resonance period of the pressure wave in the channel 11.
  • the AL is derived as a pulse width that maximizes the flying speed of ink droplets to be ejected at the time of applying the rectangular wave driving pulse to the driving electrode when a voltage value of the rectangular wave is set to be constant, and when the pulse width of the rectangular wave is changed.
  • the pulse is a rectangular wave whose peak value is constant voltage.
  • peak value voltage is 100%
  • the pulse width is defined as a period of time between a 10% rising point from 0 V and a 10% falling point from the peak value voltage.
  • the rectangular wave is a waveform in which each of the rising time and the falling time between 10% and 90% of voltage is within 1/2 of the AL, preferably within 1/4 of the AL.
  • ink is ejected from the nozzle 21 with use of resonance of the pressure wave generated in the channel 11.
  • ink can be ejected more efficiently.
  • the driving voltage can be kept low.
  • the head chip 1 since the head chip 1 receives voltage at all times regardless of whether or not ink is ejected, low driving voltage is important to suppress heat generation of the head chip 1 and to eject ink in a stable manner.
  • the rectangular wave can easily be generated by using a simple digital circuit, the rectangular wave is advantageous in that the circuit configuration can be simplified further than in a case of using a trapezoidal wave having an inclined wave.
  • the inkjet head H includes the head chip 1 including the driving channel 11a and the nozzle 21 ejecting ink in the driving channel 11a and provided on a surface of the driving wall 12 facing an inside of the driving channel 11a with the driving electrode 13 and the wiring board 3 connected to the rear surface 1b of the head chip 1 to cover the driving channel 11a.
  • the wiring board 3 is provided at a position thereof corresponding to the driving channel 11a with the through hole 31 adapted to introduce ink into the driving channel 11a.
  • the constricted portion 31b having a smaller cross-sectional area than those of the end portions 31a and 31c is formed, and flow path resistance of the through hole 31 is a value of 0.2 or higher.
  • overflow of ink can be restricted when low-viscosity ink is used, and even low-viscosity ink can be ejected in a stable manner.
  • the end portions 31a and 31c and the constricted portion 31b of the through hole 31 are circular as seen in the ink introducing direction.
  • the flow path resistance of the through hole 31 is a value in a range of 0.4 or higher and 1.0 or lower.
  • setting the flow path resistance of the through hole 31 to 0.4 or higher can provide favorable ejection stability of ink having viscosity resistance of 5 cp or less.
  • Setting flow path resistance of the through hole 31 to 1.0 or lower can prevent a problem in which refilling gets poor to disable high-speed driving from being generated.
  • an elastic modulus of the wiring board 3 is 30 GPa or more.
  • an outlet and an inlet of the driving channel 11a are disposed to be opposed to each other on the front surface 1a and the rear surface 1b of the head chip 1.
  • the head chip 1 is easy to manufacture and is easily provided with multiple nozzles.
  • the driving channel 11a ejecting ink and the dummy channel 11b ejecting no ink are alternately arranged via the driving wall 12, and the wiring board 3 has the through hole 31 at a position corresponding to the driving channel 11a ejecting ink.
  • a thickness of the wiring board 3 is in a range of 200 ⁇ m or more and 800 ⁇ m or less.
  • setting the thickness of the wiring board 3 to 200 ⁇ m or more can provide favorable handling at the time of manufacture.
  • Setting the thickness of the wiring board 3 to 800 ⁇ m or less can provide favorable bubble removability at the time of introduction of ink into the through hole 31.
  • the board is the wiring board 3 provided with the wiring electrode 32 adapted to apply a driving signal to the driving electrode 13.
  • the head chip 1 of the inkjet head H includes the four channel rows 10A to 10D in the description of the above embodiment, the number of channel rows of the head chip 1 is not particularly limited in the present invention. The number may be only one, two, three, or a plural such as five or more.
  • the inkjet head of the independent driving type including the driving channels 11a and the dummy channels 11b is illustrated in the description of the above embodiment, an inkjet head not including the dummy channels 11b may be provided.
  • an upper wall or a lower wall of the channel may be a driving wall made of a piezoelectric device such as a PZT, and the upper wall or the lower wall may be subject to shear deformation.
  • the inkjet recording apparatus 100 which conveys a recording medium while conveying a carriage in a direction perpendicular to a conveying direction of the recording medium and ejects ink to the recording medium from an upper side
  • the inkjet recording apparatus is not limited to one having such a configuration.
  • a so-called line head inkjet recording apparatus which performs image formation only by means of conveyance of the recording medium, may be employed.
  • the driving wall 12 made of a piezoelectric device may be driven by an actuator.
  • the configuration in which the wiring board 3 is connected to the rear surface 1b of the head chip 1 is illustrated in the description of the above embodiment, another configuration may be employed such as a configuration in which the connecting electrodes are extracted from a side surface of the head chip 1, and in which the wiring board is connected to the side surface.
  • a head chip, a nozzle plate, and a wiring board of each inkjet head are as follows.
  • a shear mode type head chip in which a PZT was used as a material for a driving wall, and in which a groove width was 70 ⁇ m, a depth was 250 ⁇ m, and a length was 2.0 mm was used.
  • nozzle plate As the nozzle plate, a polyimide sheet provided with nozzles each having a diameter of 25 ⁇ m was used.
  • the through holes in Examples 1 to 12 were formed in a drum shape illustrated in Fig. 5
  • the through hole in Example 13 was formed in a drum shape illustrated in Fig. 7A .
  • a diameter (A) ⁇ m of a front end portion, a diameter (B) ⁇ m of a constricted portion, and a diameter (C) ⁇ m of a rear end portion are shown as (A/B/C).
  • Ink was ejected with use of the inkjet heads shown in Comparative Examples 1 to 4 and Examples 1 to 13 in Table 1, and three-level ( ⁇ , ⁇ , and ⁇ ) evaluation was performed based on the following criteria in terms of evaluation items of ink introducing performance, upper limit driving frequency (KHz), and overflow (liquid ratio) (%).
  • Ink was introduced at 7 KPa, and after three-time purge, a case in which the ratio of nozzles that cannot eject ink was over 10% was evaluated as x, a case in which the ratio was 5% or less was evaluated as ⁇ , and a case in which the ratio was zero was evaluated as ⁇ .
  • Aqueous ink having viscosity resistance of 3 cp was used.
  • a case in which the driving frequency was 20 KHz or higher was evaluated as ⁇
  • a case in which the driving frequency was 30 KHz or higher was evaluated as ⁇
  • the other case was evaluated as x.
  • a difference between the liquid amount at 1 KHz and the liquid amount ejected from each of the inkjet heads shown in Comparative Examples 1 to 4 and Examples 1 to 13 in Table 1 was expressed as a liquid ratio (%). It is to be noted that, as the overflow is more significant, the liquid ratio (%) is higher, which is not preferable.
  • a case in which the liquid ratio was 50% or less was evaluated as ⁇
  • a case in which the liquid ratio was 30% or less was evaluated as ⁇
  • the other case was evaluated as x.
  • the flow path resistance was calculated by calculating the flow path resistance on each of right and left sides of the through hole having a drum-shaped stereoscopic shape in accordance with the following equation (1) and adding up the two values.
  • Flow path resistance R Ra + Rc
  • Ra and Rc were calculated based on Rx in the following equation (2).
  • Rx 128 / 3 ⁇ 1.0 / ⁇ ⁇ L / D 2 ⁇ D 1 ⁇ 1 / D 1 ⁇ 3 ⁇ 1 / D 2 ⁇ 3 ⁇ 1000
  • D1, D2, and L represent the following values.
  • D1 a diameter of a cross-section at a front end portion or a rear end portion ( ⁇ m)
  • D2 a diameter of a cross-section at a constricted portion ( ⁇ m)
  • L is a length from the surface A to the surface B or from the surface C to the surface B in Fig. 5 ( ⁇ m)
  • Ra, Rb, and Rc were calculated based on Rx in the above equation (2).
  • L in Ra is a length from the surface A to the surface B1 in Fig. 7A
  • L in Rb is a length from the surface B1 to the surface B2 in Fig. 7A
  • L in Rc is a length from the surface B2 to the surface C in Fig. 7A .
  • the flow path resistance of a cylinder is calculated.
  • the wiring board is provided with a through hole whose cross-section is circular and whose stereoscopic shape is a drum shape, and in which the flow path resistance of the through hole is approximately 0.2 or higher, the overflow restricting effect is high, and stable ink ejecting performance can be achieved.
  • the overall evaluation is 4 or 5 when the flow path resistance is a value in a range of 0.4 or higher and 1.0 or lower, which is more favorable.
  • the thickness of the wiring board is 200 ⁇ m or more and 800 ⁇ m or less, the overall evaluation is 3 or higher, which can achieve the effect of the present invention.
  • the thickness is less than 200 ⁇ m, handling at the time of manufacture is difficult.
  • the thickness is more than 800 ⁇ m, it takes time to form the through holes.
  • the elastic modulus of the wiring board is 30 GPa or higher, more favorable overall evaluation can be obtained.
  • the elastic modulus of the wiring board is less than 30 GPa, internal resonance interferes in the through hole, ink ejection is slightly unstable, and the upper value of the driving frequency is lowered.
  • the present invention can be applied to an inkjet head, an inkjet recording apparatus, and a method for manufacturing an inkjet head.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
EP15869830.8A 2014-12-17 2015-12-07 Tête à jet d'encre, dispositif d'impression à jet d'encre, et procédé de fabrication de tête à jet d'encre Active EP3235643B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014254905 2014-12-17
PCT/JP2015/084260 WO2016098625A1 (fr) 2014-12-17 2015-12-07 Tête à jet d'encre, dispositif d'impression à jet d'encre, et procédé de fabrication de tête à jet d'encre

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JP6965662B2 (ja) * 2017-09-26 2021-11-10 コニカミノルタ株式会社 インクジェットヘッド、インクジェットヘッドの製造方法、および画像形成装置

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JPH10272771A (ja) * 1997-03-31 1998-10-13 Brother Ind Ltd インクジェットヘッド
KR20020027942A (ko) * 2000-10-06 2002-04-15 윤종용 잉크젯 프린팅 헤드
JP2004167951A (ja) * 2002-11-22 2004-06-17 Ricoh Co Ltd 液滴吐出ヘッド及びその製造方法、インクカートリッジ並びにインクジェット記録装置
JP4480182B2 (ja) * 2007-09-06 2010-06-16 キヤノン株式会社 インクジェット記録ヘッド用基板及びインクジェット記録ヘッドの製造方法
JP2012121168A (ja) * 2010-12-06 2012-06-28 Canon Inc 液体吐出ヘッド及びその製造方法
JP5630255B2 (ja) * 2010-12-22 2014-11-26 コニカミノルタ株式会社 インクジェットヘッド
JP2012152970A (ja) * 2011-01-25 2012-08-16 Seiko Epson Corp 液体噴射ヘッドおよび液体噴射装置
JP5888341B2 (ja) * 2012-01-11 2016-03-22 コニカミノルタ株式会社 インクジェットヘッド

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EP3235643B1 (fr) 2021-01-20
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WO2016098625A1 (fr) 2016-06-23
EP3235643A4 (fr) 2018-07-25

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