EP3216327A1 - Agencement électrique et installation électrique équipée d'un dispositif électrique - Google Patents
Agencement électrique et installation électrique équipée d'un dispositif électriqueInfo
- Publication number
- EP3216327A1 EP3216327A1 EP15791503.4A EP15791503A EP3216327A1 EP 3216327 A1 EP3216327 A1 EP 3216327A1 EP 15791503 A EP15791503 A EP 15791503A EP 3216327 A1 EP3216327 A1 EP 3216327A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- electrical arrangement
- contacting
- arrangement
- electrically operated
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
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- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- XMKVMJPCDLDMTQ-UHFFFAOYSA-N ethenyl(diethoxy)silane Chemical compound CCO[SiH](C=C)OCC XMKVMJPCDLDMTQ-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 1
- HOMYFVKFSFMSFF-UHFFFAOYSA-N ethenyl-[ethenyl(diphenyl)silyl]oxy-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C=C)O[Si](C=C)(C=1C=CC=CC=1)C1=CC=CC=C1 HOMYFVKFSFMSFF-UHFFFAOYSA-N 0.000 description 1
- MBGQQKKTDDNCSG-UHFFFAOYSA-N ethenyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(C=C)OCC MBGQQKKTDDNCSG-UHFFFAOYSA-N 0.000 description 1
- URZLRFGTFVPFDW-UHFFFAOYSA-N ethenyl-diethoxy-phenylsilane Chemical compound CCO[Si](OCC)(C=C)C1=CC=CC=C1 URZLRFGTFVPFDW-UHFFFAOYSA-N 0.000 description 1
- IJNRGJJYCUCFHY-UHFFFAOYSA-N ethenyl-dimethoxy-phenylsilane Chemical compound CO[Si](OC)(C=C)C1=CC=CC=C1 IJNRGJJYCUCFHY-UHFFFAOYSA-N 0.000 description 1
- NUFVQEIPPHHQCK-UHFFFAOYSA-N ethenyl-methoxy-dimethylsilane Chemical compound CO[Si](C)(C)C=C NUFVQEIPPHHQCK-UHFFFAOYSA-N 0.000 description 1
- MABAWBWRUSBLKQ-UHFFFAOYSA-N ethenyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)C=C MABAWBWRUSBLKQ-UHFFFAOYSA-N 0.000 description 1
- DLMXAVXJJRREPX-UHFFFAOYSA-N ethenyl-tris(2-ethoxyethoxy)silane Chemical compound CCOCCO[Si](OCCOCC)(OCCOCC)C=C DLMXAVXJJRREPX-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- AQIHUSFQDQCINN-UHFFFAOYSA-N methyl(trimethoxysilylmethoxy)carbamic acid Chemical compound CN(C(=O)O)OC[Si](OC)(OC)OC AQIHUSFQDQCINN-UHFFFAOYSA-N 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- XCOASYLMDUQBHW-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)butan-1-amine Chemical compound CCCCNCCC[Si](OC)(OC)OC XCOASYLMDUQBHW-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229940089951 perfluorooctyl triethoxysilane Drugs 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- SGCFZHOZKKQIBU-UHFFFAOYSA-N tributoxy(ethenyl)silane Chemical compound CCCCO[Si](OCCCC)(OCCCC)C=C SGCFZHOZKKQIBU-UHFFFAOYSA-N 0.000 description 1
- AVYKQOAMZCAHRG-UHFFFAOYSA-N triethoxy(3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctyl)silane Chemical compound CCO[Si](OCC)(OCC)CCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F AVYKQOAMZCAHRG-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09754—Connector integrally incorporated in the printed circuit board [PCB] or in housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
Definitions
- the invention relates to an electrical arrangement.
- the invention relates to an article with such an electrical arrangement. Electrical arrangements are known in the art in a variety of ways.
- LED tapes are state of the art in order to illuminate objects in a variety of ways.
- Such LED strips have in addition to the light-emitting diodes and printed conductors.
- metals and plastic-based protective layers have different thermal expansion coefficients and plastics generally deform under the action of heat or expand irreversibly without external force, delamination can be expected during operation, which likewise has a negative effect on the resistance of the entire line. Due to the influence of oxidizing media, which can penetrate into the gradually emerging cavity, the electrical resistance is also increased, the efficiency of the lighting system can be so decline. This can lead to premature failure of the arrangement. at
- Solder joints, crimp connections and similar joining techniques can lead to irreversible bond breakage or component failure in the case of a tensile load on the component.
- the electrical arrangement should be simple in construction, be available in a cost-effective production method and have a high degree of operational reliability, in particular during contacting, such as, for example, polarity reversal protection.
- Another object of the present invention is to provide an article with such an electrical arrangement.
- an electrical arrangement comprising a carrier element on which at least one conductor track, at least one electrically operated component and at least one contacting are arranged element, wherein the contacting element for producing a current and / or data-conducting connection to the at least one conductor of the electrical arrangement is then designed very advantageous, if it is provided that the contacting element has a shell surrounded by a cavity in the at least one contact element is arranged, which is connected to the at least one conductor track of the electrical arrangement.
- the electrical arrangement is surrounded by at least one protective layer. This protective layer also acts in the sense of an insulating material.
- the carrier element is in the simplest case a thin film of polymer, cellulose, inorganic paper, metal, ceramic, glass in a thickness of ⁇ 5 mm, preferably of ⁇ 500 ⁇ m or a textile carrier.
- the contacting element thus constitutes a separate component which is arranged on the carrier element of the electrical arrangement, fastened there and whose contact element present in the cavity surrounded by a sheath is connected to the at least one conductor track of the electrical arrangement.
- the contacting element has a cavity surrounded by a shell, wherein in the cavity at least one contact element is arranged.
- This contact element is connected to the at least one conductor track of the electrical arrangement, so that a power and / or data exchange can take place.
- Such a contacting element with a cavity enclosed by a shell can be produced in a simple manner from polymer material by bringing it into an approximately parallelepipedal shape, for example an injection molding process and / or a blow molding process and / or a deep drawing process and / or a Laminiervorgang and / or a bonding process and / or a welding operation and / or a combination of the aforementioned can be used.
- the cavity is surrounded by the shell on all sides.
- the cavity of the contacting element is thus bounded on all sides by the shell, wherein the shell preferably consists of a polymer material.
- the cavity of the contacting element has no opening to the outside, but is completely closed.
- the choice of the polymer material from which the sheath of the contacting element is formed takes place from the viewpoint of stability, easy processability, easy attachability, insulating ability, compatibility and / or weldability with the protective layer, with which the electrical arrangement is optionally surrounded, and the possibility of being able to at least partially separate the envelope.
- thermoplastic and / or an elastomer and / or a thermoset and / or a chemically and / or physically crosslinked polymer material and / or a mixture and / or combination thereof can be used as polymer material - as is the case, for example, in a coextrusion process or a multilayer injection molding process is - to be used.
- thermoplastic which is present as homo- and / or copolymer, are suitable:
- Poly (meth) acrylates for example PMMA (polymethylmethacrylate),
- PAI polyamide-imide
- PI polyimide
- PPO polyphenylene oxide
- PPSU polyphenylsulfone
- PES polyethersulfone
- PET polyethylene terephthalate
- PBT polybutylene terephthalate
- PEN polybutylene terephthalate
- TPV crosslinked thermoplastic elastomers based on olefins
- TPU urethane-based thermoplastic elastomers
- TPE-E thermoplastic polyester elastomers
- TPE-S styrene block copolymers (SBS, SEBS, SEPS, SEEPS and MBS),
- TPE-A Thermoplastic copolyamides, e.g. PEBAX (Arkema).
- thermosets are suitable:
- Epoxy resins epoxy resins, phenolic resins, acrylate resins, polyurethane resins, melamine resins,
- Lignins polyester resins, phenolic epoxy resins, resins with components of benzoxazines and / or cyanate esters.
- Suitable elastomers and / or rubbers are:
- Silicone rubbers acrylonitrile elastomers (ACM), cis-1,4-polybutadiene, chloroprene and / or neoprene rubber (CR) and / or a chlorosulfonated polyethylene (CSM) and / or an ethylene-propylene-diene terpolymer (EPDM) and / or an ethylene-propylene elastomer (EPM) and / or a fluoroelastomer (FKM), and / or an ethylene-acrylic polymer (AEM) and / or an acrylonitrile-butadiene-elastomer (HBR) and / or a hydrogenated acrylonitrile Butadiene rubber (HNBR) and / or a natural rubber (NR) and / or a chlorinated polyethylene (PE-C) and / or a polyester urethane (AU) and / or a polyether urethane (EU), and / or
- Suitable fillers in the polymer material are:
- glass fibers In particular, glass fibers, alumina fibers, aluminum silicate fibers, carbon fibers (CF), inorganic particles, chalk, talc, wollastonite, glasses, zeolites, layer silicates, boron nitride, aluminum nitride, carbon black, coated carbon nanofibers, graphene, titanium dioxide, barium sulfate, chalk, hollow glass microspheres, ceramic fibers and kaolin suitable as fillers.
- Fillers are selected from fibers and / or powders and / or particles and / or hollow particles, consisting of metals and / or carbon modifications and / or natural substances and / or glasses and / or ceramics and / or metal oxides and / or plastics and / or sheet silicates.
- Metal oxides are spherical metal oxide particles and / or monodisperse metal oxide nanoparticles and / or nanoscale metal oxide fibers and / or nanoscale ceramic whiskers and / or sheet silicates and / or aerosils and / or aerogels and / or zeolites and / or silsesquioxanes and / or mixtures thereof.
- Sheet silicates are selected from montmorillonite or beidellite series smectite phyllosilicates, comprising montmorillonite and / or beidellite and / or nontronite and / or saponite and / or hectorite and / or exfoliated phyllosilicates and / or organoclay and / or mixtures thereof.
- Components for improving the flame and fire protection are selected from inorganic and organic flame retardant additives, as well
- polyimide polyoxazoles, polythiadiazoles, p-phenylene heterocyclic polymers (poly (p-phenylene-2,6-benzo) bisthiazole, PBZT); poly (p-phenylene-2,6-benzobisoxazole, PBO;
- Silicates (potassium aluminum silicate, phyllosilicates, mica (muscovite, phlogopite)),
- Phosphorus-modified polysulfones P-PSU
- phosphates P-PSU
- phosphites Phosphorus-modified polysulfones
- phosphonates metal phosphinates
- the contacting element is formed as a cuboid with a cavity located in its interior.
- this cuboid may have an order of several mm 3 volume, up to several cm 3 .
- the electrical arrangement of the present invention is embodied in a further development such that it has a multiplicity of conductor tracks and / or electrically operated components. len and / or contacting elements, which are preferably present in a regular arrangement. It may be provided that the electrical arrangement has a very long length, that is, for example, is designed as a band which can be wound on a roll in a simple manner.
- this may have a high inherent rigidity and be self-supporting. It then has the shape of a rod.
- a multiplicity of strip conductors and / or electrically operated components and / or contacting elements are then present in a regular arrangement.
- preference is given to an electrical arrangement which has a regularly recurring pattern of conductor tracks, electrically operated components and contacting elements, so that such an electrical arrangement can be divided into sections which are constructed identically to one another.
- Such an electrical arrangement can also be divided so that an integer multiple of such a smallest repeat unit of printed conductors, electrically operated components and contacting elements occurs on a section.
- Such an electrical arrangement is preferably suitable for the manual or mechanical loading of objects with sections of a certain length.
- the band-shaped and / or rod-shaped design of the electrical arrangement also makes it possible to keep the height low and thus easily equip the object to be equipped with the electrical arrangement and in particular to equip it in a simple manner.
- the electrical arrangement of the present invention may be formed in a further embodiment such that it is provided that the contacting element is arranged on a longitudinal side and / or approximately centrally between the two longitudinal sides of the band-shaped and / or rod-shaped electrical arrangement.
- the contacting element is arranged on a longitudinal side of the band-shaped and / or rod-shaped electrical arrangement, the contacting can be For example, be made to an external power source in a simple manner after opening the shell from the longitudinal side.
- the contacting element in which the contacting element is arranged approximately centrally between the two longitudinal sides of the band-shaped and / or rod-shaped electrical arrangement, the contacting takes place, for example, to an external voltage source according to the opening of the shell centered between these two longitudinal sides.
- both the contacting element is arranged on a longitudinal side as well as approximately centrally between the two longitudinal sides of the band-shaped and / or rod-shaped electrical arrangement.
- the electrical arrangement is designed such that the contacting element has a vertical extent approximately perpendicular to the plane of the carrier element, which corresponds approximately to the vertical extent of at least one electrically operated component.
- an electrically operated component is also understood to
- the data and / or current flow takes place after connection of the electrical arrangement mono- and / or at least bidirectionally via at least one contacting element to at least one further external connection partner or at least one further external connection partner to the at least one contacting element, wherein the at least one another connection partner may be a data and / or a voltage source and / or a combination thereof.
- the above-mentioned elements can be used in any combination and in any number.
- the interconnects are made of copper, glass fiber, polymer optical fiber (POF) or are printed, and have proportionally at least the elements silver and / or platinum and / or copper and / or aluminum and / or gold and / or tin and / or zinc and / or carbon modifications and / or graphene.
- PEF polymer optical fiber
- a layer may be an adhesive layer or a protective layer or a spacer layer or an insulating layer or a heat dissipating layer or the like.
- the electrical arrangement is designed such that it has a protective layer, wherein the protective layer is preferably formed on all sides on the surface.
- This protective layer causes the electrical arrangement to be protected from mechanical forces. Furthermore, this has the advantage that the electrical arrangement is protected against corrosive media.
- the protective layer can be applied to the electrical arrangement, for example in the form of a liquid paint.
- Other techniques include, for example, overmolding in an injection molding process with a polymeric material or coextrusion in an extrusion process with a suitably suitable polymeric material.
- the protective layer is present as at least one-ply polymeric and / or inorganic film or thin layer, with a thickness of less than 500 ⁇ m, and / or as at least one-component extruded and / or coextruded polymer layer and / or as a cast resin layer.
- thermoplastic and / or an elastomer and / or a thermoset and / or a chemically and / or physically crosslinked polymer material and / or a mixture and / or combination thereof can be used.
- thermoplastic which is present as homo- and / or copolymer, are suitable:
- Poly (meth) acrylates for example PMMA (polymethylmethacrylate),
- PPO polyphenylene oxide
- PPSU polyphenylsulfone
- PES polyethersulfone
- PET polyethylene terephthalate
- PBT polybutylene terephthalate
- PEN polybutylene terephthalate
- thermoplastic elastomers which are present as homopolymers and / or copolymers are:
- TPO thermoplastic elastomers based on olefins
- TPV crosslinked thermoplastic elastomers based on olefins
- TPU urethane-based thermoplastic elastomers
- TPE-E thermoplastic polyester elastomers
- TPE-S styrene block copolymers (SBS, SEBS, SEPS, SEEPS and MBS),
- TPE-A Thermoplastic copolyamides, e.g. PEBAX (Arkema). As thermosets are suitable:
- Epoxy resins epoxy resins, phenolic resins, acrylate resins, polyurethane resins, melamine resins,
- Lignins polyester resins, phenolic epoxy resins, resins with components of benzoxazines and / or cyanate esters.
- Suitable elastomers and / or rubbers are:
- Silicone rubbers acrylonitrile elastomers (ACM), cis-1,4-polybutadiene, chloroprene and / or neoprene rubber (CR) and / or a chlorosulfonated polyethylene (CSM) and / or an ethylene-propylene-diene terpolymer (EPDM) and / or an ethylene-propylene elastomer (EPM) and / or a fluoroelastomer (FKM), and / or an ethylene-acrylic polymer (AEM) and / or an acrylonitrile-butadiene-elastomer (HBR) and / or a hydrogenated acrylonitrile Butadiene rubber (HNBR) and / or a natural rubber (NR) and / or a chlorinated polyethylene (PE-C) and / or a polyester urethane (AU) and / or a polyether urethane (EU), and / or
- glass fibers In particular, glass fibers, alumina fibers, aluminum silicate fibers, carbon fibers (CF), inorganic particles, chalk, talc, wollastonite, glasses, zeolites, layered silicates, boron nitride, carbon black, titanium dioxide, barium sulfate, chalk, hollow glass microspheres, ceramic fibers and kaolin are suitable as fillers.
- CF carbon fibers
- Fillers are selected from fibers and / or powders and / or particles and / or hollow particles, consisting of metals and / or carbon modifications and / or natural substances and / or glasses and / or ceramics and / or metal oxides and / or plastics and / or sheet silicates.
- Metal oxides are spherical metal oxide particles and / or monodisperse metal oxide nanoparticles and / or nanoscale metal oxide fibers and / or nanoscale ceramic whiskers and / or sheet silicates and / or aerosils and / or aerogels and / or zeolites and / or silsesquioxanes and / or mixtures thereof.
- Sheet silicates are selected from montmorillonite or beidellite series smectite phyllosilicates, comprising montmorillonite and / or beidellite and / or nontronite and / or saponite and / or hectorite and / or exfoliated phyllosilicates and / or organoclay and / or mixtures thereof.
- Components for improving the flame and fire protection are selected from inorganic and organic flame retardant additives, as well
- polyimide polyoxazoles, polythiadiazoles, p-phenylene heterocyclic polymers (poly (p-phenylene-2,6-benzo) bisthiazole, PBZT); poly (p-phenylene-2,6-benzobisoxazole, PBO;
- Silicates (potassium aluminum silicate, phyllosilicates, mica (muscovite, phlogopite)),
- Phosphorus-modified polysulfones P-PSU
- phosphates P-PSU
- phosphites Phosphorus-modified polysulfones
- phosphonates metal phosphinates
- the material of the protective layer is applied in such a way that a cohesive and possibly bubble-free bond results in the covering of the contacting element.
- the physical coating method may be one of the following coating methods:
- CVD Chemical Vapor Deposition
- PVD Physical Vapor Deposition
- PECVD Pullasma Enhanced Chemical Vapor Deposition
- PICVD Pullasma Vapor Deposition
- the polymer layer and / or sol-gel layer and / or adhesive layer and / or lacquer layer contains functional groups selected from amino and / or imino and / or amido and / or imido and / or epoxy and / or Hydroxy and / or carboxylic acid and / or sulfonic acid and / or methacrylic acid and / or urea and / or maleic anhydride groups.
- the polymer layer and / or sol-gel layer and / or adhesive layer and / or lacquer layer may contain silane compounds.
- the silane compound may be selected from or include:
- Examples of these are vinyltrimethoxysilane and / or vinyltriethoxysilane and / or
- the protective layer may be at least partially transparent and in the form of an optical element.
- the optical element is used for light guidance and / or light conduction and / or influencing the light distribution and / or for light bundling and may be a lens and / or a reflector and / or a collimator and / or a prism and / or a beam splitter and / or a condenser and / or a mirror and / or a combination of these.
- the optical element has a concave and / or convex and / or plano-convex and / or plano-concave and / or parabolic shape and / or polyhedral and / or polygonal and / or prismatic shape and / or a combination thereof.
- a structure for light guidance and light conduction and / or light distribution may be present on the surface of the material of the protective layer, which serves in a particular embodiment as a light exit surface.
- These structures which may be in the form of depressions and / or raised structures, can be obtained by embossing and / or coating with a UV-curing lacquer and / or be applied by a film and / or by laser structuring and / or by an extrusion process with appropriate tool geometry.
- Such structures are lenses, prisms, microprisms, grooves, or at least partially diffuse imprints.
- the protective layer is transparent or partially transparent or opaque in order not to obstruct or enable optical processes when using the electrical arrangement.
- the electrical arrangement has at least one marking element, on which it is separable.
- a marking element is, for example, a line or a dot arrangement or an arrangement of arrows or the like.
- the object of the marking element is to define a location or a plane at which the electrical arrangement can be separated by means of a separating process.
- Such a separation process is, for example, a scissors and / or a knife and / or a laser beam and / or a hot wire cutting process and / or a sawing and / or a milling and / or a planing process and / or a buckling and / or or a breaking process.
- the present invention for example, in the furnishing of furniture or furniture parts by the electrical arrangement is attached to corresponding sections of the furniture or the furniture part.
- Such furniture can be next to furniture in the Living or sleeping area also include those that are available in kitchens or bathrooms.
- applications to corresponding objects in workshops, laboratories, production facilities and others are also possible.
- the invention offers the possibility to provide such an electrical arrangement in a certain length, wherein the connection to an external coupling partner, such as a voltage and / or data source in a simple manner vorappelbar.
- an external coupling partner such as a voltage and / or data source in a simple manner vorappelbar.
- Fig. 1 is a schematic cross-sectional view of an electrical arrangement of a first embodiment
- Fig. 2 is a schematic partially sectioned plan view of an electrical arrangement of a first type
- Fig. 3 is a schematic cross-sectional view of an electrical arrangement
- FIG. 4 shows a schematic partially sectioned plan view of an electrical arrangement of the second type
- FIG. 5 shows a schematic plan view of an electrical arrangement of the first type and of an article comprising such an electrical arrangement.
- Fig. 1 is a schematic cross-sectional view of an electrical arrangement 1 according to the present invention is shown in a first embodiment.
- the electrical arrangement 1 comprises a carrier element 2, which in the present case is in the form of a plastic film.
- the carrier element 2 in the form of a plastic film has two longitudinal sides 2.1, 2.1.
- a layer 2.2 is applied, which in the present case consists of a polymer material.
- the thickness of the layer 2.2 is approximately selected such that it corresponds to twice the thickness of the carrier element 2 in the form of a plastic film.
- the interconnects 3 can be formed as metallic interconnects, preferably made of copper, aluminum, iron or silver.
- the interconnects 3 are insulated from each other by the layer 2.2.
- a component 4 which is electrically operated, arranged on the layer 2.2.
- the component 4 can be adhesively bonded to the layer 2.2, for example, or be otherwise secured to the layer 2.2.
- the component 4, which is electrically operated, is connected to at least one conductor 3, so that a power and / or data exchange can take place.
- the contacting element 5 has a sheath 5.1, which has a cavity 5.2 in the contacting element 5 surrounds all sides.
- the contacting element 5 is formed approximately as a cuboid in the present embodiment.
- the sheath 5.1 of the contacting element 5 is formed from a polymer material.
- the contacting element 5 is connected to the layer 2.2, for example, by a gluing process or a welding process or by another technique.
- the cavity 5.2 of the contacting element 5 at least one contact element 5.3 is arranged.
- two contact elements 5.3 are arranged in the cavity 5.2 of the contacting element 5.
- the contact elements 5.3 of the contacting element 5 are connected to the conductor track 3 in a conductive connection.
- FIG. 2 the electrical arrangement 1 according to the present invention is shown in a first Ausfactüngsart in a schematic partially sectioned plan view.
- the reference numerals in FIG. 2 correspond to those of FIG. 1.
- Fig. 2 it is particularly shown that the two contact elements 5.3, which are arranged in the cavity 5.2 of the contacting element 5, are conductively connected to the two interconnects 3.
- the two interconnects 3 in turn are conductively connected to the component 4, which is electrically operated.
- a marking element 1.1 which is designed in the form of a line which is for example printed, is approximately orthogonally aligned with the two longitudinal sides 2.1, 2.1 of the carrier element 2.
- the electrical arrangement 1 can be divided along the marking element 1.1 by, for example, subjecting the electrical arrangement 1 to a cutting process.
- FIG. 3 an electrical arrangement 1 of the present invention is shown in a schematic cross-sectional view of a second embodiment.
- FIG. 3 correspond to those of FIG. 1 and FIG. 2.
- the contacting element 5 arranged on the layer 2.2 is designed in such a way that it comes to rest in an edge area of the carrier element 2. Accordingly, the component 4, which is electrically operated, is also arranged on the edge side of the longitudinal side 2.1 of the carrier element 2 on the layer 2.2.
- a securing element 8 is arranged such that it closes an opening to the cavity 5.2 of the contacting element 5.
- the securing element 8 is designed to approximately in the form of a plug.
- the electrical arrangement 1 according to FIG. 3 can be separated along a parting plane T, which is perpendicular to the drawing plane, so that the securing element 8, which closes the opening of the cavity 5.2 of the contacting element 5, is uncovered.
- the fuse element 8 is also partially severed for this purpose.
- the cavity 5.2 of the contacting element 5 is freely accessible in order to establish a connection to an external voltage and / or data source with the contact element 5.3 present there.
- Fig. 4 the electrical arrangement 1 of the present invention is shown in a schematic partially sectioned plan view of the second type.
- the reference numerals in Fig. 4 correspond to those of the preceding figures.
- the contacting element 5 is arranged on the layer 2.2 such that it comes to rest on a longitudinal side 2.1 of the carrier element 2.
- the securing element 8 is aligned with its outer side parallel to the longitudinal side 2.1 of the carrier element 2.
- the arranged in the cavity 5.2 of the contacting element 5 contact elements 5.3 are conductively connected to the conductor tracks 3.
- the interconnects 3, in turn, are conductively connected to the component 4, which is electrically operated.
- FIG. 3 illustrates the sectional view along the line B-B of FIG. 4.
- FIG. 5 shows a schematic plan view of the electrical arrangement 1 of the first type and an object 9 comprising such an electrical arrangement 1.
- the electrical arrangement 1 is shown, which has a plurality of components 4, which are electrically operated, wherein these components 4 are approximately equidistant on the layer 2.2 to their respective direct neighbors.
- two contacting elements 5 are disposed on the layer 2.2 in such a way that they are arranged one from the other so that five components 4 are arranged between these two contacting elements 5.
- FIG. 5 For the sake of clarity, no printed conductors 3 are shown in FIG.
- the contacting elements 5 are shown in a schematic way so that two contact elements 5.3 are arranged therein. Marking elements 1.1 in the form of lines are respectively shown on the two contacting elements 5.
- an object 9 is shown, for example, represents an edge of a furniture component by a groove is introduced.
- the electrical arrangement 1 is arranged in the groove of the object 1, for example by an adhesive process or another type of attachment.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202014105355.7U DE202014105355U1 (de) | 2014-11-07 | 2014-11-07 | Elektrische Anordnung und Gegenstand mit einer solchen elektrischen Anordnung |
PCT/EP2015/002219 WO2016070997A1 (fr) | 2014-11-07 | 2015-11-04 | Agencement électrique et installation électrique équipée d'un dispositif électrique |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3216327A1 true EP3216327A1 (fr) | 2017-09-13 |
Family
ID=54478699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15791503.4A Withdrawn EP3216327A1 (fr) | 2014-11-07 | 2015-11-04 | Agencement électrique et installation électrique équipée d'un dispositif électrique |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP3216327A1 (fr) |
DE (1) | DE202014105355U1 (fr) |
WO (1) | WO2016070997A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016211535B4 (de) * | 2016-06-27 | 2023-08-31 | Ifm Electronic Gmbh | Verfahren zur Herstellung eines LED-Bandes |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007043401A1 (de) * | 2007-09-12 | 2009-03-19 | Osram Gesellschaft mit beschränkter Haftung | Leuchtvorrichtung und Verfahren zur Herstellung derselben |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009020851A1 (de) * | 2009-05-12 | 2010-11-25 | Osram Gesellschaft mit beschränkter Haftung | Leuchtband und Verfahren zum Herstellen eines Leuchtbands |
-
2014
- 2014-11-07 DE DE202014105355.7U patent/DE202014105355U1/de not_active Expired - Lifetime
-
2015
- 2015-11-04 EP EP15791503.4A patent/EP3216327A1/fr not_active Withdrawn
- 2015-11-04 WO PCT/EP2015/002219 patent/WO2016070997A1/fr active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007043401A1 (de) * | 2007-09-12 | 2009-03-19 | Osram Gesellschaft mit beschränkter Haftung | Leuchtvorrichtung und Verfahren zur Herstellung derselben |
Non-Patent Citations (1)
Title |
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See also references of WO2016070997A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE202014105355U1 (de) | 2016-02-10 |
WO2016070997A1 (fr) | 2016-05-12 |
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