EP3189673B1 - Lautsprecheranordnung - Google Patents

Lautsprecheranordnung Download PDF

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Publication number
EP3189673B1
EP3189673B1 EP15757479.9A EP15757479A EP3189673B1 EP 3189673 B1 EP3189673 B1 EP 3189673B1 EP 15757479 A EP15757479 A EP 15757479A EP 3189673 B1 EP3189673 B1 EP 3189673B1
Authority
EP
European Patent Office
Prior art keywords
sound
loudspeaker
shielding wall
housing
hollow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP15757479.9A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3189673A1 (de
Inventor
Andrea Rusconi Clerici Beltrami
Ferruccio Bottoni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
USound GmbH
Original Assignee
USound GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by USound GmbH filed Critical USound GmbH
Publication of EP3189673A1 publication Critical patent/EP3189673A1/de
Application granted granted Critical
Publication of EP3189673B1 publication Critical patent/EP3189673B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/227—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only  using transducers reproducing the same frequency band
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/02—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H04R3/12—Circuits for transducers, loudspeakers or microphones for distributing signals to two or more loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Definitions

  • the present invention relates to a loudspeaker arrangement for a plurality of MEMS loudspeakers for generating sound waves in the audible wavelength spectrum.
  • the loudspeaker arrangement comprises a housing which has a sound-conducting cavity and at least one sound outlet opening, and at least two MEMS loudspeakers which are arranged opposite one another and spaced apart from one another in the interior of the housing and each have a cavity in the region of their side facing away from one another.
  • MEMS microelectromechanical systems. From the US 2012/0039499 A1 a microphone arrangement with a first and a second transducer is known, these being opposite one another and having a common volume. With a construction of this type, the sound waves of the transducers can influence one another, which can have negative effects on the quality of the system, so that this MEMS arrangement which is good in terms of production technology is unsuitable for loudspeaker applications.
  • GB 2 018 089 A shows an arrangement with two opposing moving armature loudspeakers, which are mounted in a housing, the housing having a common sound outlet.
  • the object of the present invention is therefore to create a loudspeaker arrangement which is simple to manufacture and has good sound quality.
  • a loudspeaker arrangement for MEMS loudspeakers for generating sound waves in the audible wave spectrum is proposed.
  • the loudspeaker arrangement has a housing and at least two MEMS loudspeakers.
  • the housing has a sound guide cavity and at least one sound exit opening.
  • the two MEMS speakers are opposite each other and spaced apart from one another by the sound-conducting cavity in the interior of the housing.
  • the MEMS loudspeakers each have a cavity in the region of their side facing away from one another.
  • the term “cavity” is to be understood as a cavity by means of which the sound pressure of the MEMS loudspeakers can be increased.
  • the loudspeaker arrangement comprises a shielding wall for acoustically decoupling the two MEMS loudspeakers from one another.
  • the shielding wall is arranged in the interior of the housing between the two MEMS loudspeakers in such a way that the sound-conducting cavity is subdivided into a first and second cavity region assigned to one of the two MEMS loudspeakers.
  • the sound waves emanating from the MEMS speakers hit the shielding wall and are reflected by it.
  • the sound waves introduced into one of the two cavity areas can therefore not penetrate as far as the other MEMS loudspeaker, in particular into the respective other cavity area.
  • the two mutually facing MEMS loudspeakers are thus acoustically decoupled from one another.
  • the sound waves from the two MEMS loudspeakers can therefore not negatively influence the acoustic quality of the opposite MEMS loudspeaker.
  • the sound waves are directed in the direction of the sound outlet opening via the respectively assigned first or second cavity region and can exit the housing through the latter.
  • the shielding wall extends from a first side inner surface of the sound-conducting cavity at least as far as and beyond the two MEMS loudspeakers and / or extends parallel to the latter into the sound-conducting cavity.
  • the first side inner surface is in particular opposite the sound outlet opening.
  • the shielding wall is advantageously arranged directly and / or acoustically sealing on the inner surface of the sound-conducting cavity. Essentially the entire circumference of the shielding wall is arranged directly on it. In order to shield the sound waves of the two MEMS loudspeakers from one another, in particular to decouple them acoustically, the shielding wall must be designed in such a way that the sound waves cannot circulate undesirably.
  • the housing comprises a sound-conducting channel, by means of which the sound waves that can be introduced via the respective MEMS loudspeaker can be brought together from the two cavity regions separated from one another by the shielding wall. The sound can thus be amplified and / or directed in one direction.
  • the sound conducting channel is advantageously arranged in the region of a first opening of the first cavity region and a second opening of the second cavity region.
  • the sound waves can thus be guided from the two MEMS loudspeakers via their respective hollow areas through the associated openings into the sound guide channel.
  • the sound guide channel is connected at one end to the sound guide cavity and / or at its other end to the sound outlet opening.
  • the sound channel is connected in particular to both cavity areas of the sound guide cavity.
  • the sound guide channel preferably extends from a second side inner surface of the sound guide cavity opposite the first side inner surface up to the sound outlet opening. It is particularly straight. The sound generated by the MEMS loudspeakers can thus be directed specifically in one direction or to one side of the loudspeaker arrangement.
  • the shielding wall extends from the first inner side surface into the area of the sound guide channel.
  • the shielding wall preferably ends at this area or extends partially into it.
  • the shielding wall and / or the sound guide channel are / are advantageously arranged centrally in the housing and / or coaxially with one another. Additionally or alternatively, the thickness of the shielding wall is smaller than the width of the sound guide channel.
  • the shielding wall and the sound guide channel are arranged in particular on an axis of symmetry of the housing. The two cavity areas for the propagation of the sound are therefore of the same size and can be guided outside through the sound guide channel under the same conditions.
  • the thickness of the shielding wall should be less than the width of the sound guide channel, since otherwise the sound waves cannot enter the sound guide channel. The path would be closed by the shielding wall and the second inner side surface.
  • the shielding wall is made in one piece with the housing. Silicon is recommended as the material here.
  • the shielding wall and the housing to represent separate components, the shielding wall, in particular with its edge region, preferably being connected to the housing in a form-fitting, non-positive and / or materially manner.
  • the shielding wall and the housing are made of different materials, the material of the shielding wall preferably having a higher rigidity than the material of the housing. A high degree of rigidity can ensure that the shielding wall does not vibrate itself is excited and as a result of which the other MEMS speaker is influenced undesirably.
  • the housing is advantageously made of silicon and / or the shielding wall is made of a metal, in particular aluminum, a ceramic and / or a composite material.
  • the housing is produced in particular in layers.
  • the circuit boards of the MEMS loudspeaker arrangement are preferably constructed in a sandwich-like manner from a plurality of layers arranged one above the other and / or connected to one another.
  • the entire loudspeaker arrangement, including the housing and the shielding wall integrated therein, and MEMS loudspeakers can be manufactured using a manufacturing method.
  • the loudspeaker arrangement can thus be designed in a cost-effective and very space-saving manner.
  • the housing comprises two housing halves connected to one another, each of which preferably accommodates one of the two MEMS loudspeakers.
  • the housing halves advantageously have one of the two cavity areas, the shielding wall being arranged and / or fastened in their connecting area.
  • the attachment is particularly positive, material and / or non-positive.
  • the housing halves can thus each be manufactured using the layer-by-layer production method and then connected to one another via the shielding wall, which can be an insert. This enables an inexpensive manufacturing process.
  • the cavity of at least one MEMS speaker is formed by a carrier substrate cavity of the MEMS speaker itself and / or by a cavity cavity of the housing.
  • the volume of the cavity which is formed at least by the one MEMS loudspeaker, can additionally be increased by the volume of the cavity cavity of the housing.
  • the loudspeaker arrangement comprises two loudspeaker units, each of which is preferably designed in accordance with the preceding description, the features mentioned being able to be present individually or in any combination.
  • the loudspeaker units are preferably arranged one behind the other so that the sound waves generated by the rear loudspeaker unit must be passed through the front one.
  • the shielding wall of the first loudspeaker unit preferably comprises at least one through-channel extending in its longitudinal direction, through which sound waves of the second loudspeaker unit, in particular from one of its two cavity areas, can be passed through and / or to the sound outlet opening. It is possible to arrange several pairs of MEMS loudspeakers within a housing, in particular one behind the other, in a space-saving manner.
  • the two cavity areas of the second loudspeaker unit are advantageously separated from one another by means of a second shielding wall and are each connected to the one common sound-conducting channel by means of a separate through-channel of the first shielding wall.
  • the sound waves of the MEMS loudspeakers of the second loudspeaker unit can thus be decoupled from one another and guided in the direction of the sound conducting channel without influencing the sound waves of the first loudspeaker unit.
  • FIG. 1 and Figure 2 show a first exemplary embodiment of a loudspeaker arrangement 1 in a schematic view ( Fig. 1 ) and a top view ( Fig. 2 ).
  • the loudspeaker arrangement 1 comprises a housing 2, two MEMS loudspeakers 5a, 5b and a shielding wall 7.
  • the housing 2 comprises two housing halves 17a, 17b, each of which preferably accommodates one of the two MEMS loudspeakers 5a, 5b.
  • the loudspeaker arrangement 1 has a sound guide cavity 3 and a sound outlet opening 4, which is arranged at the end of a sound guide channel 12.
  • the two MEMS loudspeakers 5a, 5b are arranged opposite one another and spaced apart from one another by the sound-conducting cavity 3 in the interior of the housing 2, in particular in each case in a housing half 17a, 17b.
  • the sound guide cavity 3 is divided into a first and second cavity area 8, 9, each associated with one of the two MEMS loudspeakers 5a, 5b. It is also arranged centrally on an axis of symmetry 16 of the housing 2.
  • the two cavity areas 8, 9 are separated from one another by the shielding wall 7.
  • the sound conducting channel 12 is arranged in the region of a first opening 13 of the first cavity region 8 and a second opening 14 of the second cavity region 9.
  • the two cavity areas 8, 9 thus open via their respective openings 13, 14 into the common sound guide channel 12.
  • the sound guide channel 12 is at one end with the sound guide cavity 3, in particular with both cavity areas 8, 9, and at its other end with the sound exit opening 4 connected.
  • the two housing halves 17a, 17b each receive one of the two MEMS loudspeakers 5a, 5b, which each have one of the two cavity regions 8, 9.
  • the shielding wall 7 is connected to the housing halves 17a, 17b in particular in a form-fitting, material-fitting and / or non-positive manner.
  • the housing 2 can also be formed in one piece, the shielding wall 7 preferably being fixed in the housing by means of a layered construction of the housing 2 as an insert.
  • the two MEMS loudspeakers 5a, 5b are each assigned a cavity 6, of which only one is provided with a reference symbol for reasons of clarity.
  • the cavity 6 is formed in each case by a carrier substrate cavity 18 and a cavity cavity 19 of the housing 2.
  • the carrier substrate cavity 18 is arranged on the side of the MEMS speakers 5 facing away from the sound guide cavity 3.
  • the cavity 19 of the housing 2 borders directly on the carrier substrate cavity 18.
  • the shielding wall 7 extends from the first side inner surface 10 of the sound guide cavity 3, starting from the two MEMS loudspeakers 5, to a second side inner surface 15 of the sound guide cavity 3.
  • the first side inner surface 10 is arranged on the side of the housing 2 opposite the sound guide channel 12.
  • the second inner side surface 15 lies opposite the first inner side surface 10 and is in particular in the Area of the first and second openings 13, 14 of the first and second cavity areas 8, 9 arranged.
  • the shielding wall 7 extends over the entire height and width of the housing 2, so that the sound waves emanating from the MEMS loudspeakers 5a, 5b have no possibility to pass around the shielding wall 7 into the cavity area 8, 9 of the other MEMS loudspeaker to get.
  • the shielding wall 7 is also connected to the housing 2 in a form-fitting, force-fitting and / or integral manner.
  • FIG. 3 and Figure 4 show a second and third embodiment of the loudspeaker arrangement 1.
  • the loudspeaker arrangement 1 comprises two loudspeaker units 20, 21, a first and second shielding wall 23, 24, at least one with the sound conducting channel 12 and at least one through channel 22.
  • Both loudspeaker units 20, 21 are essentially like the one in Figures 1 and 2 described loudspeaker arrangement 1 constructed. Consequently, two housing halves 17 each form a loudspeaker unit 20, 21.
  • the housing halves 17 are positively, non-positively and / or cohesively connected to one another via the first and / or second shielding wall 23, 24 such that the MEMS loudspeakers 5 arranged therein lie opposite one another.
  • the two loudspeaker units 20, 21 are likewise positively, non-positively and / or materially connected in the longitudinal direction, in particular coaxially.
  • the first loudspeaker unit 20 has the sound outlet opening 4 and the sound conducting channel 12 connected to it on the side opposite the second loudspeaker unit 21.
  • the cavities 8, 9 of the MEMS loudspeakers 5 together form a sound-conducting cavity 3, in the area of which the first shielding wall 23 is formed.
  • the first shielding wall 23 extends from the first inner side surface 10 to the second inner side surface 15, in particular up to the sound outlet opening 4.
  • the cavity 6 of the MEMS loudspeakers 5 is formed by the cavity 19 of the housing 2.
  • the carrier substrate cavity 18 is arranged on the side facing away from the cavity 19 of the MEMS loudspeaker 5 Figure 2 shown orientation of the MEMS speaker 5 is conceivable.
  • the second loudspeaker unit 21 likewise has two openings 13, 14 on the side opposite the first inner side surface 10 and is connected to the sound guide channel 12 via these, in particular by means of a through-channel 22.
  • the through-channel 22 extends from the two openings 13, 14 of the second loudspeaker unit 21 to the sound-conducting channel 12.
  • the through-channel 22 is formed in the first shielding wall 23.
  • the second loudspeaker unit 21 has a second shielding wall 24, as shown in FIG Figure 1 has already been described. It extends according to the in Figure 4
  • the exemplary embodiment shown extends from the first inner side surface 10 of the second loudspeaker unit 21 to the sound guide channel 12 which is arranged on the first loudspeaker unit 20.
  • the shielding wall 24 of the second loudspeaker unit 21 forms the two separate through channels 22.
  • the sound waves of the second loudspeaker unit 21 are brought together in the single through channel 22 and routed to the sound guide channel 12.
  • the illustrated embodiment thus corresponds to that in FIG Figure 3 illustrated embodiment.
  • the shielding wall 7 can be integrated in the loudspeaker arrangement 1 in the layered manufacturing process, for example in the form of an insert. From the sound outlet opening 4 of the second loudspeaker unit 21, in particular the first inner side surface 10 of the first loudspeaker unit 20, to the sound guide channel 12, the two separate through channels 22 extend parallel to the shielding wall 7 on both sides.
  • the sound waves of the second loudspeaker unit 21 are decoupled from one another by the first or second cavity region 8, 9 of the MEMS loudspeaker 5 to the respective opening 12, 13 in the region of the sound outlet opening 4 of the second loudspeaker unit 21. From there, the sound waves each reach the adjacent through-channel 22 and are guided to the sound-conducting channel 12.
  • the sound waves of the first loudspeaker unit 20 are also decoupled from the shielding wall 7 or the through channel 22 to the sound guide channel 12.
  • the sound waves of the four MEMS loudspeakers 5 meet and are bundled out of the housing 2.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • General Health & Medical Sciences (AREA)
  • Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
  • Headphones And Earphones (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
EP15757479.9A 2014-09-04 2015-09-01 Lautsprecheranordnung Active EP3189673B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014112784.6A DE102014112784A1 (de) 2014-09-04 2014-09-04 Lautsprecheranordnung
PCT/EP2015/069905 WO2016034563A1 (de) 2014-09-04 2015-09-01 Lautsprecheranordnung

Publications (2)

Publication Number Publication Date
EP3189673A1 EP3189673A1 (de) 2017-07-12
EP3189673B1 true EP3189673B1 (de) 2019-12-18

Family

ID=54056187

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15757479.9A Active EP3189673B1 (de) 2014-09-04 2015-09-01 Lautsprecheranordnung

Country Status (6)

Country Link
US (1) US10085093B2 (zh)
EP (1) EP3189673B1 (zh)
KR (1) KR20170060008A (zh)
CN (1) CN106797509B (zh)
DE (1) DE102014112784A1 (zh)
WO (1) WO2016034563A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3672277B1 (en) * 2018-12-19 2024-04-03 Sonion Nederland B.V. Miniature speaker with multiple sound cavities
CN112261562A (zh) * 2020-09-29 2021-01-22 瑞声科技（南京）有限公司 Mems扬声器
TWI741928B (zh) * 2021-01-04 2021-10-01 富祐鴻科技股份有限公司 雙面揚聲器
CN217116396U (zh) * 2022-03-03 2022-08-02 瑞声开泰科技(武汉)有限公司 Mems扬声器

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
DE1079675B (de) * 1957-02-22 1960-04-14 Philips Patentverwaltung Lautsprecheranordnung
AU4256778A (en) 1977-12-19 1979-07-05 Commw Of Australia Reduction of feedback in electroacoustic systems
US7392880B2 (en) * 2002-04-02 2008-07-01 Gibson Guitar Corp. Dual range horn with acoustic crossover
DK1895811T3 (en) 2006-08-28 2016-08-29 Sonion Nederland Bv Several speakers with a common acoustic tube
CN101222784B (zh) * 2007-01-12 2011-08-24 富准精密工业(深圳)有限公司 音箱结构及采用该音箱结构的移动电子设备
US8199953B2 (en) * 2008-10-30 2012-06-12 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Multi-aperture acoustic horn
KR20120014591A (ko) 2009-05-18 2012-02-17 노우레스 일렉트로닉스, 엘엘시 감소된 진동 감도를 갖는 마이크로폰
US8452038B2 (en) * 2010-04-29 2013-05-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Multi-throat acoustic horn for acoustic filtering
US8804982B2 (en) * 2011-04-02 2014-08-12 Harman International Industries, Inc. Dual cell MEMS assembly
TWM453318U (zh) * 2012-11-21 2013-05-11 Ozaki Int Co Ltd 入耳式耳機

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Also Published As

Publication number Publication date
CN106797509B (zh) 2019-12-10
KR20170060008A (ko) 2017-05-31
EP3189673A1 (de) 2017-07-12
US20170289700A1 (en) 2017-10-05
US10085093B2 (en) 2018-09-25
WO2016034563A1 (de) 2016-03-10
DE102014112784A1 (de) 2016-03-10
CN106797509A (zh) 2017-05-31

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