EP3180805A1 - Corps de support céramique comprenant des cellules solaires - Google Patents

Corps de support céramique comprenant des cellules solaires

Info

Publication number
EP3180805A1
EP3180805A1 EP15748258.9A EP15748258A EP3180805A1 EP 3180805 A1 EP3180805 A1 EP 3180805A1 EP 15748258 A EP15748258 A EP 15748258A EP 3180805 A1 EP3180805 A1 EP 3180805A1
Authority
EP
European Patent Office
Prior art keywords
carrier body
solar cell
cooling
ceramic
sintered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15748258.9A
Other languages
German (de)
English (en)
Inventor
Thomas Betz
Harald KREß
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ceramtec GmbH
Original Assignee
Ceramtec GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec GmbH filed Critical Ceramtec GmbH
Publication of EP3180805A1 publication Critical patent/EP3180805A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/052—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/052—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
    • H01L31/0521—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells using a gaseous or a liquid coolant, e.g. air flow ventilation, water circulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the invention relates to a carrier body for solar cells.
  • a solar cell is understood to mean a photovoltaic cell.
  • the invention has for its object to improve a carrier body for solar cells so that the thermal resistance of the connection between the solar cell and the carrier body or a heat sink is significantly reduced.
  • the carrier body consists of a ceramic material with sintered Metallmaschines Siemensen, on the carrier body at least one solar cell soldered or sintered and electrically connected to the metallization and the carrier body has ceramic cooling elements.
  • the thermal resistance is significantly improved, the solar cells are sufficiently cooled, improves the efficiency and extends the life.
  • Carrier body made of a ceramic material with sintered metallization rapidly dissipate heat and distribute it in the carrier body. The cooling elements of the carrier body ultimately dissipate the heat to the environment.
  • the support body may have a three-dimensional structure as cooling elements that produce the largest possible surface, such as fins for air cooling or the cooling elements are closed inner channels or chambers with supply ports for externally supplied cooling with gas or liquid.
  • the inner channels and chambers have the largest possible surface area. It can be done either a cooling with a gas, in particular an air cooling, or cooling with liquids.
  • the carrier body is plate-shaped and thus has an upper side, a lower side and side surfaces, wherein sintered metallization regions are arranged both on the upper side and on the lower side and are electrically connected via sintered metallization regions on the side surfaces and at the corners.
  • the connection of the metallization from top to bottom can also be done by one or more via holes (vias).
  • one or more solar cells are soldered onto one of the upper and lower sides and electrical or electronic control elements for the at least one solar cell are soldered onto the metallizations on the respective other upper and lower side. This separation of the solar cells from the electrical or electronic controls has the advantage that the electrical or electronic controls are decoupled from the heat of the solar cells, i. are not exposed to increased heat load.
  • the ceramic material is preferably Al 2 O 3, MgO, SiO 2, mixed oxide ceramics, or nitride ceramics such as AIN, Si 3 N 4.
  • An inventive method for producing a carrier body according to any one of claims 1 to 5 is characterized in that the Carrier body is made with inner channels or chambers and forms a cooling unit and printed by screen, pad or stencil printing process with AgPt paste and baked and then a solar cell on its back side electroplated with Ag and then cooling unit and solar cell by, for example, an interposed Lotfolie be connected.
  • Another inventive method for producing a carrier body according to any one of claims 1 to 5 is characterized in that the carrier body is manufactured with inner channels or chambers and forms a cooling unit and printed by screen, pad or stencil printing process with AgPt paste and baked and a solar cell is degreased and a paste with the finest silver particles is screen printed on the cooling unit and then the solar cell is laid and a solid metallic composite is produced.
  • Solar cells are soldered or sintered onto the sintered metallization regions of the ceramic carrier body.
  • the heat sinks connected to the carrier body may be simple ceramic substrates, they may have a three-dimensional structure (eg fins) or they may also have closed channels or chambers (with supply connections) to the outside.
  • the cooling itself can be done by a gas or a liquid.
  • Metallizations can be filled and cured coatings, the usual thick film metallizations such as tungsten, molybdenum, silver, silver-palladium, silver-platinum, etc., but also AMB or DCB composites.
  • the heat sinks may be made of the usual ceramics such as Al 2 O 3, MgO, SiO 2, mixed oxide ceramics, or nitride ceramics such as AlN, Si 3 N 4 be prepared.
  • the molding can be by film casting, extrusion, dry pressing, injection molding, hot casting, die casting, additive or generative shaping (3D printing) directly or by mechanical processing of blankets of ceramic materials or unsintered moldings (green compacts), which are subsequently sintered in the required shape to be brought.
  • a cooling unit made of AIN is screen printed with AgPt paste and baked.
  • a solar cell is galvanically coated with Ag on the rear side. At approx. 265 ° C, the cooling unit and the solar cell are connected by a solder foil placed between them.
  • a cooling unit made of AIN is screen printed with AgPt paste and baked at approx. 860 ° C.
  • a solar cell is degreased. Then a paste with the finest silver particles is screen-printed on the cooling unit. The solar cell is placed on top and at about 400 ° C with access of air a solid metallic composite is produced.
  • FIG. 1 shows an embodiment according to the invention of a carrier body 1 made of a ceramic material.
  • the carrier body 1 has an upper side 5, a lower side 6 and side surfaces 7.
  • the reference numeral 3 are denoted by the carrier body 1 sintered metallization, forming a circuit board.
  • these metallization regions 3 are arranged on the upper side 5 as well as on the underside 6 and the side surfaces 7 and the corners 8.
  • Solar cells 2 are arranged only on the top 5.
  • Figure 1 is not to scale.
  • cooling channels arranged, which are connected to the supply terminals 4. Cooling fluid is conducted into the carrier body 1 via these supply ports 4, which cools the carrier body.
  • the metallization areas 3 5 solar cells 2 are soldered here only on the top.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Photovoltaic Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un corps de support (1) pour des cellules solaires (2). L'invention vise à améliorer de manière significative la liaison entre la cellule solaire (2) et le corps de support (1) ou un corps de refroidissement. A cet effet, selon l'invention, le corps de support (1) est constitué d'un matériau céramique présentant des zones de métallisation (3) frittées, au moins une cellule solaire (2) est brasée ou frittée sur le corps de support (1) et est reliée électriquement aux zones de métallisation (3) et le corps de support (1) comprend des éléments de refroidissement céramiques.
EP15748258.9A 2014-08-12 2015-08-12 Corps de support céramique comprenant des cellules solaires Withdrawn EP3180805A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014215971 2014-08-12
PCT/EP2015/068545 WO2016023945A1 (fr) 2014-08-12 2015-08-12 Corps de support céramique comprenant des cellules solaires

Publications (1)

Publication Number Publication Date
EP3180805A1 true EP3180805A1 (fr) 2017-06-21

Family

ID=53800998

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15748258.9A Withdrawn EP3180805A1 (fr) 2014-08-12 2015-08-12 Corps de support céramique comprenant des cellules solaires

Country Status (5)

Country Link
US (1) US20170317223A1 (fr)
EP (1) EP3180805A1 (fr)
CN (1) CN107078175A (fr)
DE (1) DE102015215374A1 (fr)
WO (1) WO2016023945A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3355667A1 (fr) * 2017-01-30 2018-08-01 Siemens Aktiengesellschaft Procédé de fabrication d'un circuit électrique et circuit électrique

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5904499A (en) * 1994-12-22 1999-05-18 Pace; Benedict G Package for power semiconductor chips
US6680195B1 (en) * 1997-11-26 2004-01-20 Inhibitex, Inc. Extracellular matrix-binding proteins from staphylococcus aureus
KR100366349B1 (ko) * 2001-01-03 2002-12-31 삼성에스디아이 주식회사 태양 전지 및 그의 제조 방법
DE202004008563U1 (de) * 2004-05-29 2004-08-12 Ixys Semiconductor Gmbh Solarmodul mit einem Substratträger aus Keramik
US8212238B2 (en) * 2005-12-27 2012-07-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US20070158050A1 (en) * 2006-01-06 2007-07-12 Julian Norley Microchannel heat sink manufactured from graphite materials
TWI449137B (zh) * 2006-03-23 2014-08-11 Ceramtec Ag 構件或電路用的攜帶體
US20070272295A1 (en) * 2006-05-26 2007-11-29 Rubin Leonid B Heat sink for photovoltaic cells
US20080008345A1 (en) * 2006-07-06 2008-01-10 Supress Products, Llc Method and apparatus for sound engineered metal channel supports and panel products
US20080083450A1 (en) * 2006-10-04 2008-04-10 United Technologies Corporation Thermal management of concentrator photovoltaic cells
DE102007011403A1 (de) * 2007-03-08 2008-09-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Frontseitig serienverschaltetes Solarmodul
KR101519813B1 (ko) * 2007-04-24 2015-05-14 세람테크 게엠베하 표면이 금속화된 세라믹 베이스를 구비하는 부품
US8759138B2 (en) * 2008-02-11 2014-06-24 Suncore Photovoltaics, Inc. Concentrated photovoltaic system modules using III-V semiconductor solar cells
KR20110042271A (ko) * 2008-07-03 2011-04-26 아이엠이씨 멀티-접합 광전지 모듈 및 그것의 처리 방법
US20110271999A1 (en) * 2010-05-05 2011-11-10 Cogenra Solar, Inc. Receiver for concentrating photovoltaic-thermal system
US8383946B2 (en) * 2010-05-18 2013-02-26 Joinset, Co., Ltd. Heat sink
IT1402064B1 (it) * 2010-10-08 2013-08-28 Luxferov S R L Pannello fotovoltaico ad elevata efficienza

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
None *
See also references of WO2016023945A1 *

Also Published As

Publication number Publication date
DE102015215374A1 (de) 2016-02-18
US20170317223A1 (en) 2017-11-02
WO2016023945A1 (fr) 2016-02-18
CN107078175A (zh) 2017-08-18

Similar Documents

Publication Publication Date Title
EP2387477B1 (fr) Procédé de production d'un composé fritté
EP1772900B1 (fr) Procédé de fabrication d'un dispositif avec des composants semi-conducteurs de puissance incluant une étape de frittage sous pression
DE102009045063B4 (de) Leistungshalbleitermodul mit angespritztem Kühlkörper, Leistungshalbleitermodulsystem und Verfahren zur Herstellung eines Leistungshalbleitermoduls
DE102014100309B4 (de) Chipanordnung und Verfahren zum Bilden einer Chipanordnung
DE102014117020A1 (de) Verfahren zum herstellen einer stoffschlüssigen verbindung zwischen einem halbleiterchip und einer metallschicht
DE102015104518B3 (de) Verfahren zur Herstellung einer Schaltungsträgeranordnung mit einem Träger, der eine durch ein Aluminium-Siliziumkarbid-Metallmatrixkompositmaterial gebildete Oberfläche aufweist
WO2019149778A1 (fr) Composant électronique
DE102010001565A1 (de) Leistungsmodul mit einer Schaltungsanordnung, elektrische/elektronische Schaltungsanordnung, Verfahren zur Herstellung eines Leistungsmoduls
DE10125577A1 (de) Kontaktier-Heizvorrichtung
DE102015109186A1 (de) Halbleiteranordnung, Halbleitersystem und Verfahren zur Ausbildung einer Halbleiteranordnung
DE10016129A1 (de) Verfahren zum Herstellen einer wärmeleitenden Verbindung zwischen zwei Werkstücken
DE102019211109A1 (de) Verfahren und Entwärmungskörper-Anordnung zur Entwärmung von Halbleiterchips mit integrierten elektronischen Schaltungen für leistungselektronische Anwendungen
WO2012152364A1 (fr) Substrat doté d'une zone électriquement neutre
DE102014213545A1 (de) Leistungshalbleitermodul
WO2016023945A1 (fr) Corps de support céramique comprenant des cellules solaires
EP2936944A1 (fr) Support de composant et dispositif support de composant
DE102015114521A1 (de) Verfahren zum Auflöten eines Isoliersubstrats auf einen Träger
DE102009000883B4 (de) Substrat zur Aufnahme mindestens eines Bauelements und Verfahren zur Herstellung eines Substrats
EP2954554B1 (fr) Métallisation multiniveaux sur un substrat en céramique
AT514074B1 (de) Verfahren zum Herstellen eines Leiterplattenelements
EP2278616B1 (fr) Module semi-conducteur de puissance doté d'un sandwich équipé d'un composant semi-conducteur de puissance
DE102014111439A1 (de) Elektronikmodul und Verfahren zu dessen Herstellung
DE102014203306A1 (de) Herstellen eines Elektronikmoduls
EP2665092B1 (fr) Procédé de fabrication d'un élément semi-conducteur sur un substrat de cuivre avec une couche d'isolation intermédiaire
JPH0336305B2 (fr)

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20170313

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20200818

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20210112