EP3144979B1 - Antimonide-based high bandgap tunnel junction for semiconductor devices - Google Patents

Antimonide-based high bandgap tunnel junction for semiconductor devices Download PDF

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EP3144979B1
EP3144979B1 EP16178410.3A EP16178410A EP3144979B1 EP 3144979 B1 EP3144979 B1 EP 3144979B1 EP 16178410 A EP16178410 A EP 16178410A EP 3144979 B1 EP3144979 B1 EP 3144979B1
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doped
layer
arsenide
emitter
base
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EP3144979A1 (en
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Philip T. Chiu
Moran Haddad
Richard R. King
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Boeing Co
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Boeing Co
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Definitions

  • the disclosed system and method relate to a semiconductor solar cell device and, more particularly, to a semiconductor device including a tunnel junction that has a n-doped tunnel layer and a p-doped tunnel layer, where the p-doped tunnel layer is constructed of aluminum gallium arsenide antimonide (AlGaAsSb).
  • AlGaAsSb aluminum gallium arsenide antimonide
  • Wafer bonding technology may be used to monolithically join two materials with different lattice structures together. Wafer bonding technology has great potential. For example, joining gallium arsenide (GaAs) or indium phosphide (InP) based materials to other semiconductor materials may result in the integration of optical, photovoltaic, and electronic devices and enhance the performance of computers, solar cells, light emitting diodes and other electronic devices.
  • GaAs gallium arsenide
  • InP indium phosphide
  • a five-junction (5J) cell which is created by bonding a three-junction (3J) GaAs-based cell with a two-junction (2J) InP-based cell, results in a terrestrial solar cell having an efficiency of about 39% and a space solar cell having an efficiency of about 36%.
  • One requirement for an InP-based multi-junction solar cell is a high transparency (which is also referred to as bandgap) tunnel junction.
  • the tunnel junctions currently available that are employed in InP-based multi-junction solar cells may sometimes absorb high amounts of light, or have very low peak tunneling currents.
  • one type of tunnel junction that is currently available includes a n-doped InP layer and a p-doped InAlGaAs layer.
  • this tunnel junction may not always be easy to grow. This is because compounds containing a large amount of indium, such as InAlGaAs, are typically challenging to dope p-type.
  • this type of tunnel junction may have a limited peak tunnel current as well.
  • a tunnel junction having a p-doped gallium arsenide antimonide (GaAsSb) layer and a n-doped indium gallium arsenide (InGaAs) layer may be used.
  • This tunnel junction has a relatively high peak tunnel current, but both layers of this tunnel junction may also absorb light that is intended for active junctions of the solar cell.
  • a semiconductor device having a tunnel junction that is relatively easy to dope has a relatively high transparency, and a relatively high peak tunnel current.
  • US 2005/253164 A1 states a tunnel junction device with minimal hydrogen passivation of acceptors includes a p-type tunnel junction layer of a first semiconductor material doped with carbon.
  • the first semiconductor material includes aluminum, gallium, arsenic and antimony.
  • An n-type tunnel junction layer of a second semiconductor material includes indium, gallium, arsenic and one of aluminum and phosphorous. The junction between the p-type and an-type tunnel junction layers forms a tunnel junction.
  • TIMMONS M L ET AL "AlGaAsSB/GaAsSb cascade solar cells",15th IEEE Photovoltaic specialists conference, 1981, p1289-1293 there are described AlGaAsSB/GaAsSb cascade solar cells.
  • US 5 019 177 A states a single-crystal, monolithic, tandem, photovoltaic solar cell is described which includes (a) an InP substrate having upper and lower surfaces, (b) a first photoactive subcell on the upper surface of the InP substrate, and (c) a second photoactive subcell on the first subcell.
  • the first photoactive subcell is GaInAsP of defined composition.
  • the second subcell is InP.
  • the two subcells are lattice matched.
  • the solar cell can be provided as a two-terminal device or a three-terminal device.
  • US 5 679 963 A states the incorporation of a pseudomorphic GaAsSb layer in a tunnel diode structure that affords a new degree of freedom in designing runnel junctions for p-n junction device interconnects. Previously only doping levels could be varied to control the tunneling properties. This disclosure uses the valence band alignment band of the GaAsSb with respect to the surrounding materials to greatly relax the doping requirements for tunneling.
  • CN 102 832 285 A states a three-junction solar battery and a preparation method thereof.
  • Indium phosphide InP
  • InP Indium phosphide
  • a first subcell, a second subcell InP and a third subcell In 1-x Al x As are formed on the InP growth substrate, a stress compensation quantum well is plugged in a base area of the InP subcell, so that the absorptive edge is effectively widened, the lattice matching between batteries can be effectively overcome through a gradient buffering layer, and the dislocation density is reduced.
  • a semiconductor solar cell device according to claim 1 is disclosed.
  • FIG. 1 is an illustration of an embodiment of the disclosed semiconductor device 10.
  • the semiconductor device 10 is an indium phosphide (InP)-based dual-junction solar cell, meaning the semiconductor device 10 includes two photovoltaic cells (which are also referred to as subcells).
  • the semiconductor device 10 includes a first photovoltaic cell 22, a second photovoltaic cell 24, and the disclosed tunnel junction 26, which is located between the first photovoltaic cell 22 and the second photovoltaic cell 24.
  • the tunnel junction 26 includes a n-doped tunnel layer and a p-doped tunnel layer, where the p-doped tunnel layer is constructed of aluminum gallium arsenide antimonide (AlGaAsSb).
  • AlGaAsSb aluminum gallium arsenide antimonide
  • the tunnel junction 26 may be referred to as a p-n junction.
  • the first photovoltaic cell 22 includes a first emitter and base 20.
  • the first emitter and base 20 is a material layer selected from group consisting of indium gallium arsenide phosphide (GaInPAs), aluminum arsenide antimonide (AlAsSb), aluminium gallium arsenide antimonide (AlGaAsSb), aluminum indium arsenide (AlInAs), indium phosphide (InP), aluminum gallium indium arsenide (AlGaInAs), gallium indium arsenide (GaInAs), or gallium arsenide antimonide (GaAsSb).
  • the first emitter and base 20 includes a separate emitter layer and base layer (not shown), where the emitter layer is nearest to incident light.
  • the first photovoltaic cell 22 includes a bandgap of 1.1 eV. In another embodiment, the first photovoltaic cell 22 may include a bandgap of from about 0.73 to 2.45 eV. In yet another embodiment, the first photovoltaic cell 22 may include a bandgap of from about 1.0 to 1.1 eV and may be included in a three or more junction solar cell.
  • the first photovoltaic cell 22 may be sensitive to a first-photoactive-subcell-layer wavelength. As used herein, the term wavelength may mean a single discrete wavelength, or, wavelength may include a range of wavelengths at which the layer material achieves a good light-to-electricity conversion efficiency.
  • the first photovoltaic cell 22 may also include a window layer 28.
  • the window layer 28 may be disposed on a first side 30 of the first emitter and base 20, which would be positioned nearest to incident light L.
  • the relative terms top and bottom are used to indicate the surface nearest to and farthest from the incident light L, respectively.
  • upper or above or overlying may refer to a layer closer to the sun, and lower or below or underlying may refer to a layer further from the sun or other source of illumination.
  • the window layer 28 may be an InP, AlGaInAs, AlInAs, AlAsSb, AlGaAsSb, or a GalnPAs composition that provides bandgap energy greater than about 1.1 eV.
  • the window layer 28 has two functions.
  • the first function of the window layer 28 is to reduce minority-carrier recombination (i.e., to passivate) on a front surface 32 of the first photovoltaic cell 22. Additionally, the optical properties of the window material must be such that as much light as possible is transmitted to the first photovoltaic cell 22, and any additional photoactive subcell layers that may be disposed underneath thereof (not shown), where the photogenerated charge carriers may be collected more efficiently. If there is substantial light absorption in the window layer 28, carriers generated in the window layer are less likely to be subsequently collected and hence light absorption in the window degrades overall conversion efficiency.
  • the semiconductor device 10 may optionally include an antireflection (AR) layer or coating (not shown) disposed on the front surface 32 of the semiconductor device 10 nearest the incident light L, which is shown impinging from the direction indicated by the arrows.
  • the AR coating may be disposed atop the window layer 28.
  • the AR coating may reduce surface reflections between the optically transparent media above the semiconductor device 10 (such as air, glass, or polymer) and various semiconductor layers of the semiconductor device 10, thereby enabling more photons to enter the semiconductor device 10.
  • the AR coating may be constructed of materials such as, for example, titanium dioxide (TiO 2 ), tantalum pentoxide (Ta 2 O 5 ), silicon dioxide (SiO 2 ), and magnesium fluoride (MgF 2 ).
  • the thickness of the AR coating may vary, but may range between about 0.04 and 0.35 microns. While an AR coating can be applied to the semiconductor device 10, in other embodiments another subcell may be stacked or applied above the semiconductor device 10.
  • the first photovoltaic cell 22 may further include a p-doped back surface field (BSF) layer 34 disposed on a bottom surface 36 of the first emitter and base 20.
  • the p-doped BSF layer 34 is a p-doped InP BSF layer.
  • the p-doped BSF layer 34 may be an AlGaInAs, GaAsSb, AlAsSb, AlGaAsSb, AlInAs, GaInPAs and their alloys layer.
  • the BSF layer 34 is lattice-matched to InP.
  • the BSF layer 34 may be a coherently strained layer with a thickness below a Matthews-Blakeslee critical thickness.
  • the second photovoltaic cell 24 includes a second emitter and base 40.
  • the second emitter and base 40 is a GaInPAs layer having an InP lattice constant.
  • the second emitter and base 40 is a material layer selected from group consisting of: GaInAs, GaAsSb, AlGaInAs, AlGaAsSb, GaInPAs and their alloys having an InP lattice constant.
  • the second emitter and base 40 has a bandgap lower than the bandgap of the first emitter and base 20.
  • the second photovoltaic cell 24 has a bandgap of about 0.8 eV. In another embodiment, the second photovoltaic cell 24 may have a bandgap of from about 0.73 to 2.0 eV. In yet another embodiment, the second photovoltaic cell 24 may have a bandgap of from about 0.73 to 0.8 eV and be included in a three or more junction solar cell lattice-matched to InP.
  • the second photovoltaic cell may 24 further include a n-doped window layer 42 disposed on a top surface 44 of the second emitter and base 40.
  • the characteristics of the n-doped window layer 42 are similar to the window characteristics of the window layer 28.
  • the n-doped window 42 may include a n-doping concentration of between about 2 ⁇ 10 18 /cm 3 and 2 ⁇ 10 19 /cm 3 .
  • the n-doped window 42 has a n-doping concentration of about 1 ⁇ 10 19 /cm 3 to create a relatively large electric field and to passivate the p-n junction.
  • the second photovoltaic cell 24 may further include a second BSF layer 48 below the second emitter and base 40, which is similar to the BSF layer 34.
  • the tunnel junction 26 may electrically connect the first photovoltaic cell 22 and the second photovoltaic cell 24 together with one another in electrical series. It should also be appreciated that the tunnel junction 26 is a type-II tunnel junction, which reduces the tunneling energy barrier within the tunnel junction 26. This in turn increases tunneling probability as well as the peak tunneling current of the tunnel junction 26.
  • the tunnel junction 26 may include a peak tunneling current of 372 A/cm 2 and a specific resistance of 0.55 m ⁇ -cm 2 .
  • both layers of the tunnel junction 26 may be doped at relatively high levels.
  • the tunnel junction 26 includes a p-doped tunnel layer 60 and a n-doped tunnel layer 62.
  • the p-doped tunnel layer 60 is constructed of aluminum gallium arsenide antimonide (AlGaAsSb).
  • AlGaAsSb aluminum gallium arsenide antimonide
  • the p-doped tunnel layer 60 may be doped with relatively high levels of carbon (i.e., C-doping or carbon doping). Thatis, the p-doped tunnel layer 60 may include a C-doping concentration ranging from about 10 19 /cm 3 to 2 ⁇ 10 20 /cm 3 .
  • carbon doping employs dopants that include relatively low diffusion coefficients, thereby resulting in relatively stable doping profiles and tunnel juction performance.
  • an indium-based material such as, for example, an InAlGaAs layer may be challenging to dope because indium precursors may inhibit the incorporation of carbon dopants.
  • the p-doped tunnel layer 60 may be lattice-matched with the p-doped InP BSF layer 34.
  • the inclusion of antimonide in the p-doped tunnel layer 60 allows for lattice-matching with the p-doped InP BSF layer 34.
  • the inclusion of aluminium within the p-doped tunnel layer 60 results in a relatively high bandgap (i.e., transparency) and a low level of light absorption.
  • a relatively high bandgap may be any value greater than about 0.73 eV.
  • the p-doped tunnel layer 60 may include bandgap ranging from about 0.7 to about 1.4 eV.
  • the n-doped tunnel layer 62 is also lattice-matched to InP.
  • the n-doped tunnel layer 62 is high bandgap III-V semiconductor having an InP lattice constant and that forms type II band alignment with the p-doped tunnel layer 60.
  • the n-doped tunnel layer 62 is a highly n-doped aluminium indium phosphide arsenide (AlInPAs) tunnel layer having a bandgap greater than or equal to 1.35 eV and an InP lattice constant.
  • AlInPAs aluminium indium phosphide arsenide
  • the n-doped tunnel layer 62 is an InP tunnel layer having a bandgap of 1.35 eV.
  • the n-doped tunnel layer 62 may be doped with relatively high levels of silicon or tellurium (i.e., Si or Te-doping). That is, the n-doped tunnel layer 62 may include an Si or Te-doping concentration of at least about 10 19 /cm 3 .
  • the p-doped tunnel layer 60 and the n-doped tunnel layer 62 may be grown sequentially in a metalorganic vapor phase epitaxy (MOVPE) reactor.
  • MOVPE metalorganic vapor phase epitaxy
  • the semiconductor device 10 as well as various device components are grown in a MOVPE reactor.
  • the tunnel junction 26 may be grown in a chemical beam epitaxy (CBE), hydride vapor phase epitaxy (HVPE) or atomic layer deposition (ALD) reactor.
  • CBE chemical beam epitaxy
  • HVPE hydride vapor phase epitaxy
  • ALD atomic layer deposition
  • the semiconductor device 10 is an upright solar cell configuration where new layers are grown just above a prior layer, and the highest bandgap layer is grown last.
  • the semiconductor device 10 may be inverted, where the highest bandgap layer is grown first.
  • FIG. 2 is an illustration of an exemplary band offset diagram for the disclosed tunnel junction 26 not forming part of the claimed present invention
  • FIG. 3 is the band offset diagram shown in FIG. 2 after thermal equilibrium.
  • the band offset diagrams shown in FIGS. 2-3 illustrate a valence band E v and a conduction band E c of both the p-doped tunnel layer 60 as well as the n-doped tunnel layer 62 of the tunnel junction 26, as well as a valence band (VB) edge.
  • both the valence band E v and the conduction band E c both bend between the p-doped tunnel layer 60 and the n-doped tunnel layer 62.
  • Joining the p-doped tunnel layer 60 and the n-doped tunnel layer 62 creates a staggered gap (type II) heterostructure.
  • both the valence band E v and the conduction band E c of the n-doped tunnel layer 62 are lower in energy when compared to the p-doped tunnel layer 60.
  • a heterojunction includes two or more semiconductor materials that are grown on one another, and a heterostructure includes the heterojunction. It should be appreciated that a type II heterostructure results in a lower effective energy barrier for tunneling.
  • FIG. 4 is a graph illustrating measured characteristics for an exemplary tunnel junction 26 after annealing. Specifically, the tunnel junction 26 was exposed to a thirty minute anneal at temperatures comparable to those experienced for active junction growth. It should be appreciated that there was negligible or no change in performance of the tunnel junction 26 before or after annealing, which is an indication that the dopants used for both the p-doped tunnel layer 60 and the n-doped tunnel layer 62 ( FIG. 1 ) do not readily diffuse. As seen in FIG. 3 , the tunnel junction 26 may include a peak tunneling current of 372 A/cm 2 and a specific resistance of 0.55 m ⁇ -cm 2 . The peak tunneling current is equivalent to a solar cell operating at more than 30,000 suns, which is well in excess of a practical concentration.
  • FIG. 5 is an alternative embodiment of a semiconductor device 100, not forming part of the claimed present invention.
  • the semiconductor device 100 includes a similar structure as the device shown in FIG. 1 , except that a n-doped tunnel layer 162 is now constructed of AlGaInAs instead of InP.
  • a n-doped tunnel layer 162 is now constructed of AlGaInAs instead of InP.
  • the n-doped tunnel layer 162 may be doped with relatively high levels of silicon, tellurium, or a combination of both materials. That is, the n-doped tunnel layer 62 may include a doping concentration of at least about 10 19 /cm 3 of silicon, tellurium, or a combination of both materials.
  • the n-doped tunnel layer 162 may include a lower bandgap and a higher light absorbance than the n-doped tunnel layer 62 ( FIG. 1 ); however the lower bandgap of the n-doped tunnel layer 162 reduces the energy barrier to tunneling, which in turn exponentially increases the probability of tunneling and tunneling current density.
  • the n-doped tunnel layer 162 may include a bandgap of about 0.73 eV.
  • light absorption of the n-doped tunnel layer 162 may be mitigated by reducing the thickness of the n-doped tunnel layer, and by decreasing the Al content.
  • the thickness of the tunnel junction 26 may be reduced to a minimum of about 10 nm, and the amount of aluminium in the n-doped tunnel layer 162 may range from about zero (i.e., negligible amounts) to about 50%.
  • FIG. 6 is an illustration of an exemplary band offset diagram for the disclosed tunnel junction 26 shown in FIG. 5
  • FIG. 7 is the band offset diagram shown in FIG. 7 after thermal equilibrium.
  • aluminium may be added to the n-doped tunnel layer 162 to create an n+ AlGaInAs layer as well.
  • the disclosed tunnel junction includes the p-doped tunnel layer constructed of AlGaAsSb, which demonstrates improved performance characteristics when compared to some other tunnel junctions currently available.
  • the disclosed p-doped layer may be easier to grow, since AlGaAsSb may be doped more heavily with carbon.
  • compounds containing a high amount of indium are typically challenging to dope.
  • a p-doped InAlGaAs layer may only be capable of being doped to the level of about 1018 /cm3 , and even this level of doping may be challenging.
  • the disclosed tunnel junction also exhibits relatively high peak tunneling currents.
  • the disclosed p-doped tunnel layer constructed of AlGaAsSb also exhibits a higher bandgap (i.e., transparency) than some other types of tunnel junctions currently available.
  • high transparency is especially important in applications where the tunnel junction is placed in the upper portion of a solar cell that is located closer to incident light (i.e., the sun).
  • the tunnel junction may have the p-doped tunnel layer doped with carbon.
  • the tunnel junction may have the p-doped tunnel layer that includes a carbon concentration ranging from about 10 19 /cm 3 to 10 20 /cm 3 .
  • the tunnel junction may have the p-doped tunnel layer that includes bandgap ranging from about 0.7 to about 1.4 eV.
  • the tunnel junction may have the n-doped tunnel layer that is doped with a material selected from a group consisting of: silicon and tellurium.
  • the tunnel may have the n-doped tunnel layer that includes a silicon concentration or a tellurium concentration of at least about 10 19 /cm 3 .
  • the tunnel junction may have the n-doped tunnel layer that is doped with at least one of silicon and tellurium.
  • a semiconductor solar cell device may have the p-doped tunnel layer that includes a carbon concentration ranging from about 10 19 /cm 3 to 10 20 /cm 3 .
  • the semiconductor solar cell device may have the p-doped tunnel layer that includes a bandgap ranging from about 0.7 to about 1.4 eV.
  • the semiconductor solar cell device may have the n-doped tunnel layer that is doped with a material selected from a group consisting of: silicon and tellurium.
  • the semiconductor solar cell device may have the n-doped tunnel layer that includes a silicon concentration or a tellurium concentration of at least about 10 19 /cm 3 .
  • the semiconductor solar cell device may have the n-doped tunnel layer that is doped with at least one of silicon and tellurium.
  • a method may comprise doping the p-doped tunnel layer with carbon.
  • the method may include that the n-doped tunnel layer and the p-doped tunnel layer are grown sequentially in a reactor selected from the group consisting of a: metalorganic vapor phase epitaxy (MOVPE) reactor, a chemical beam epitaxy (CBE) reactor, a hydride vapor phase epitaxy (HVPE) reactor and an atomic layer deposition (ALD) reactor.
  • a reactor selected from the group consisting of a: metalorganic vapor phase epitaxy (MOVPE) reactor, a chemical beam epitaxy (CBE) reactor, a hydride vapor phase epitaxy (HVPE) reactor and an atomic layer deposition (ALD) reactor.
  • MOVPE metalorganic vapor phase epitaxy
  • CBE chemical beam epitaxy
  • HVPE hydride vapor phase epitaxy
  • ALD atomic layer deposition

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