EP3135434B1 - Verfahren zum herstellen eines mehrdimensional skalierbaren werkzeugs - Google Patents
Verfahren zum herstellen eines mehrdimensional skalierbaren werkzeugs Download PDFInfo
- Publication number
- EP3135434B1 EP3135434B1 EP16185598.6A EP16185598A EP3135434B1 EP 3135434 B1 EP3135434 B1 EP 3135434B1 EP 16185598 A EP16185598 A EP 16185598A EP 3135434 B1 EP3135434 B1 EP 3135434B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- recesses
- layer
- particles
- primary
- abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000002245 particle Substances 0.000 claims description 87
- 239000000463 material Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 27
- 238000007650 screen-printing Methods 0.000 claims description 16
- 239000011230 binding agent Substances 0.000 claims description 15
- 238000007639 printing Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000005245 sintering Methods 0.000 claims description 6
- 244000007853 Sarothamnus scoparius Species 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000001513 hot isostatic pressing Methods 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 238000005219 brazing Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 85
- 238000005520 cutting process Methods 0.000 description 16
- 230000000694 effects Effects 0.000 description 8
- 239000002356 single layer Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 235000021384 green leafy vegetables Nutrition 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 239000012254 powdered material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/04—Zonally-graded surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/02—Wheels in one piece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/14—Zonally-graded wheels; Composite wheels comprising different abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/02—Wheels in one piece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives
Definitions
- WO 2013/142988 A1 discloses an abrasive article and also a method for its manufacture.
- the WO 2013/142988 A1 discloses a method for producing a multi-layer tool in which a green part is produced by producing a primary layer provided with recesses from a primary material provided with an organic binder system and subsequently introducing particles with an abrasive effect into the recesses and then a cover layer made from the the primary material provided with the organic binder system is applied to fix the abrasive particles in the recesses, with the tool being obtained by a final heat treatment of the green part.
- the present invention is therefore based on the object of proposing a method for producing a tool that avoids the disadvantages mentioned, with which particles with an abrasive effect can therefore be easily arranged at defined positions of the tool.
- the abrasive particles can be introduced in a targeted manner in the primary layer and thus in the finished tool.
- the spatial positions of the recesses and thus also of the abrasive particles or cutting particles subsequently introduced into them are therefore fixed and precisely defined.
- Stencil printing can cause these to have an abrasive effect Particles can continue to be introduced and positioned easily and quickly.
- the final covering layer finally fixes the cutting particles.
- the final heat treatment drives out the organic binder system, which preferably contains polymer binders and additives, and the primary material remains and forms the tool.
- At least one subsequent layer is applied to the layer provided with the abrasive particles in an intermediate step.
- the gaps are usually spatially offset from the gaps in the primary layer or an adjacent layer, so that the gaps in the layer already applied with the abrasive particles contained therein are also filled with the primary material provided with the binder system.
- a stencil is used for stencil printing, which has a maximum thickness of 30 percent of the maximum diameter of the abrasive particles, in order to be able to carry out the stencil printing reliably.
- the recesses 2 which can also be referred to as cavities, cavities or channels, have a width of between 40 ⁇ m and 3 mm and are at the same distance from one another.
- all the recesses 2 in the primary layer 1 are the same, that is to say they have an identical width and an identical depth.
- the designs shown have a square opening, so their maximum width is equal to their maximum length. In further exemplary embodiments, however, the opening can of course also have other shapes, for example round, or the recesses 2 can also all have different dimensions. Provision can also be made for identical recesses 2 to be provided in the primary layer 1 in a periodically repeating manner. Likewise, the distances between the individual recesses 2 can be of different sizes.
- FIG 2 shows in one figure 1
- abrasive particles 3 made of diamond or cutting particles are introduced into the recesses 2.
- the abrasive particles 3 are triangular in cross section in the illustrated embodiment, but can also have any other shape.
- the recesses 2 have a depth that corresponds to just 75 percent of a maximum diameter of the abrasive particles 3 .
- the abrasive particles 3 therefore protrude from the recesses 2 as soon as they have been introduced. In further exemplary embodiments, however, there can also be a flush termination of the abrasively acting particles 3 with an opening in the recesses 2 .
- all abrasive particles 3 used for the primary layer 1 are identical, but identical particles 3 can also be used for just one layer or different particles 3 can be used independently of the layer. Only the abrasive particles 3 are introduced into the recesses 2 by dry squeegeeing, with exactly one of the abrasive particles 3 fitting in one of the recesses 2 and further additives being unnecessary.
- a subsequent layer 7 or, if this layer to be applied is the final layer, a top layer on the abrasive particles 3 introduced into the primary layer 1 is in figure 3 in a figure 1 corresponding schematic sectional view shown.
- the subsequent layer 7 is in turn applied from the primary material in powder or paste form and provided with the organic binder system through the screen 8 with an integrated layout, the integrated layout 9 closing the screen 8 at the positions of the abrasive particles 3 . If the cover layer is applied as the last layer to be applied, the gaps 2 in the layer immediately below are only filled, but no new gaps 2 are formed.
- the particles 3 with an abrasive effect are embedded in the primary material and at the same time new recesses 2 are defined and formed by the shaded areas when the subsequent layer 7 is applied.
- the subsequent layer 7 or cover layer is directly attached to the filled primary layer 1, the gaps in the primary layer 1 are thus closed by the application of the subsequent layer 7 or the cover layer and the abrasive particles 3 are embedded and fixed in the primary layer.
- the green part produced in this way from the primary material made of metal or a metal alloy applied in layers and the abrasive particles 3 is sintered, pressure sintered, free sintered, hot pressed, hot isostatic pressed or soldered as a final heat treatment solidified, the organic binder system expelled and the multi-layer tool, in the illustrated embodiment an abrasive segment, completed.
- the entire tool shown has a length of 300 mm.
- Cutting tools produced with the method described can be designed very freely and definably. In addition to free forms, channels, cavities or cavities can be created. This free design is also an integration of z. B. cooling channels, guide grooves, support or integration structures possible during component development.
- By changing the print layout, in particular by changing a used Template during the layered construction of the abrasive particles 3, an adjustable offset of the abrasive particles 3 between the individual layers or plies can be implemented. This ensures that particles 3 with an abrasive effect are always available in the finished cutting tool along a wear axis.
- process-related structural adjustments can also be implemented in the form of guide holes and/or beads, which ensure that different layers overlap during the heat treatment.
- the particles 3 with an abrasive effect can have an adapted and narrow powder distribution curve and be smaller than a maximum diameter of a stencil opening.
- By changing the template layout it is also possible to use different abrasive substances, ie different materials for the abrasively acting particles 3, within the defined, three-dimensionally arranged particle positions.
- a local concentration or a gradation of the particles 3 with an abrasive action within the cutting tool is made possible by the change in printing screen or stencil layout described.
- these concentration islands are offset from one another by exactly 90°, but the concentration islands of the primary layer 1 are each offset by 45° in relation to the concentration islands of the subsequent layer 7 .
- both the particle concentration and the particle positions between the individual layers can be varied and a gradation in the direction of construction can be achieved.
- the top layer 6 is typically also applied to the subsequent layer 7 .
- a layer system with introduced abrasive bodies 3 can of course also have any other shape, in particular spherical or cylindrical, with the individual layers 1 or 7 being round, oval or elliptical in their basic shape.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015216538.8A DE102015216538B3 (de) | 2015-08-28 | 2015-08-28 | Verfahren zum Herstellen eines mehrdimensional skalierbaren Werkzeugs |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3135434A1 EP3135434A1 (de) | 2017-03-01 |
EP3135434B1 true EP3135434B1 (de) | 2022-10-12 |
Family
ID=56893699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16185598.6A Active EP3135434B1 (de) | 2015-08-28 | 2016-08-25 | Verfahren zum herstellen eines mehrdimensional skalierbaren werkzeugs |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3135434B1 (es) |
DE (1) | DE102015216538B3 (es) |
ES (1) | ES2929625T3 (es) |
PT (1) | PT3135434T (es) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DK180350B1 (da) * | 2019-09-18 | 2021-01-22 | Flex Trim As | Slibeelement til brug i roterende slibe- eller pudseværktøj |
DE102019127341A1 (de) * | 2019-10-10 | 2021-04-15 | Schmitz-Metallographie GmbH | Verfahren zur Herstellung einer Abrasiveinheit |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7124753B2 (en) * | 1997-04-04 | 2006-10-24 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US6755720B1 (en) * | 1999-07-15 | 2004-06-29 | Noritake Co., Limited | Vitrified bond tool and method of manufacturing the same |
KR100572669B1 (ko) * | 2004-02-09 | 2006-04-24 | 신한다이아몬드공업 주식회사 | 복수의 지립층이 형성된 절삭 공구 및 그 제조 방법 |
KR20080063588A (ko) * | 2007-01-02 | 2008-07-07 | 신한다이아몬드공업 주식회사 | 다이아몬드 공구 및 그 제조방법 |
TW201012596A (en) * | 2008-08-14 | 2010-04-01 | jian-min Song | Self-sharpening grits and associated methods |
US20110081848A1 (en) * | 2009-10-05 | 2011-04-07 | Chia-Pei Chen | Grinding tool and method of manufacturing the grinding tool |
DE102009053570B4 (de) * | 2009-10-19 | 2014-09-11 | Dr. Fritsch Sondermaschinen Gmbh | Kaltpresse und Verfahren zur Herstellung von Grünlingen |
CA2773197A1 (en) * | 2012-03-27 | 2013-09-27 | Yundong Li | Electroplated super abrasive tools with the abrasive particles chemically bonded and deliberately placed, and methods for making the same |
US9254548B2 (en) * | 2012-04-25 | 2016-02-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of forming diamond conditioners for CMP process |
-
2015
- 2015-08-28 DE DE102015216538.8A patent/DE102015216538B3/de active Active
-
2016
- 2016-08-25 PT PT161855986T patent/PT3135434T/pt unknown
- 2016-08-25 ES ES16185598T patent/ES2929625T3/es active Active
- 2016-08-25 EP EP16185598.6A patent/EP3135434B1/de active Active
Also Published As
Publication number | Publication date |
---|---|
ES2929625T3 (es) | 2022-11-30 |
PT3135434T (pt) | 2022-10-28 |
EP3135434A1 (de) | 2017-03-01 |
DE102015216538B3 (de) | 2016-10-13 |
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