EP3087579B1 - Conducteur fusible, coupe-circuit a fusible, procédé de fabrication d'un coupe-circuit a fusible, d'un fusible a smd et d'un comutateur a smd - Google Patents

Conducteur fusible, coupe-circuit a fusible, procédé de fabrication d'un coupe-circuit a fusible, d'un fusible a smd et d'un comutateur a smd Download PDF

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Publication number
EP3087579B1
EP3087579B1 EP13824496.7A EP13824496A EP3087579B1 EP 3087579 B1 EP3087579 B1 EP 3087579B1 EP 13824496 A EP13824496 A EP 13824496A EP 3087579 B1 EP3087579 B1 EP 3087579B1
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EP
European Patent Office
Prior art keywords
fuse
fuse element
conductor
conductive track
overlay
Prior art date
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Application number
EP13824496.7A
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German (de)
English (en)
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EP3087579A1 (fr
Inventor
Peter Straub
Hans-Peter Blättler
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Schurter AG
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Schurter AG
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Priority to PL13824496T priority Critical patent/PL3087579T3/pl
Publication of EP3087579A1 publication Critical patent/EP3087579A1/fr
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/08—Fusible members characterised by the shape or form of the fusible member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/06—Fusible members characterised by the fusible material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/08—Fusible members characterised by the shape or form of the fusible member
    • H01H85/11—Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/20—Bases for supporting the fuse; Separate parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/20—Bases for supporting the fuse; Separate parts thereof
    • H01H85/205—Electric connections to contacts on the base

Definitions

  • the present invention relates to a fuse, a fuse, a method of manufacturing a fuse, an SMD fuse and an SMD circuit.
  • SMD surface-mounted device
  • fuses For many circuit applications, for example in automotive engineering, measurement and control technology, etc., small, surface-mounted device (SMD) device fuses or fuses are required.
  • the publications describe WO 99/16097 A1 . DE 10 2005 002091 A1 . US 5 900 798 A and US 5,898,357 A Fuses in which a fusible conductor and a support each comprise materials which diffuse upon passage of electrical current through the fusible conductor.
  • SMD fuses which include fuses, are usually automatically positioned and placed on FR4 boards by pick-and-place machines.
  • the SMD fuses are soldered by means of reflow soldering or wave soldering on the circuit board.
  • base materials for SMD fuses for example, FR4 printed circuit board materials or Al 2 O 3 ceramics are used, ie all common base materials for printed circuit board production.
  • Fuses include a fusible conductor disposed on a base support, which comprises, for example, copper.
  • the fusible conductor usually serves to protect overcurrents and thereby protects downstream electronic components.
  • Fuses have the disadvantage that the base supports usually have limited operating temperatures.
  • the operating temperature of a base carrier made of FR4 base material is only 200 ° C. Higher temperatures damage the FR4 base material.
  • the material delaminates and dissolves the fusible link, which generally consists of a copper foil, from the base carrier. After a short time decomposition and charring of the material occur. By charring again arise conductive layers with a low electrical resistance in comparison, which then produce impermissibly low insulation resistance.
  • thermal fuses can not be soldered on an SMD basis by, for example, reflow soldering.
  • the reason for this is to be found in the fact that the known thermal fuses trigger immediately at the high temperatures occurring in a range of 240 ° C to 265 ° C.
  • the fusible conductor comprises two connection contacts and an interconnected conductor track, the conductor track having at least sections a reduced conductor cross-section in relation to the connection contacts, furthermore comprising at least one support, wherein the fusible conductor and the support each comprise materials which, when a predetermined ambient temperature and at Conducting an electric current through the fusible conductor to enter a diffusion.
  • a fusible conductor is created in a surprisingly simple manner, which does not trigger in the occurring during soldering high temperatures, but in the Operation at high ambient temperatures, for example, more than 200 ° C will trigger.
  • This advantage is achieved by a diffusion process which is activated as soon as the ambient temperature exceeds a predetermined temperature, for example 200 ° C., and additionally an electric current (eg rated current) flows through the fusible conductor.
  • a predetermined temperature for example 200 ° C.
  • an electric current eg rated current
  • the diffusion process takes place in a region in which the at least one support communicates with the fusible conductor (also called the diffusion zone).
  • the melting temperature of the diffusion zone of 1080 ° C drops to about 500 ° C.
  • the reduced melting temperature of about 500 ° C even at low currents (eg rated current) is reached, whereby the fusible conductor is triggered and advantageously the circuit is reliably interrupted.
  • the fuse retains under original conditions the property continues to act as a fuse to protect against overcurrent.
  • An essential advantage of the inventive fusible conductor is that the fusible conductor in operation at predetermined high ambient temperatures (over-temperature threshold) of, for example, more than 200 ° C triggers, even if no overcurrent flows.
  • triggering means a melting or burning through of the fusible conductor.
  • the line cross section of the conductor track is reduced at least in sections in a plane perpendicular to the longitudinal direction of the fusible conductor in relation to the line cross section of the connection contacts.
  • This relation has a value less than 1 ( ⁇ 1).
  • the cable cross-sections of the terminal contacts in relation to each other are constant.
  • a fusible conductor is created which has an H-profile in plan view.
  • the fusible conductor can also have a different profile, as long as the surfaces of the terminal contacts in relation to the conductor track are possible large.
  • the areas of the terminal contacts may be rectangular, circular, elliptical or triangular.
  • the fusible conductor may be formed by punching out a one-piece material. Alternatively, the fusible conductor can be formed by cutting, for example by means of a laser.
  • the respective ambient temperature at which the fusible conductor triggers can be predetermined by selecting the relation of the line cross-section of the conductor track to the line cross-section of the connection contacts. By appropriate selection of the aforementioned relation, an overcurrent threshold value can also be defined, from which the fusible conductor will be triggered.
  • a fusible fuse SMD-based by, for example, a Reflow soldering process can be connected to the circuit board without the fuse element is triggered at the high temperatures occurring here. Since no current flows in the course of this process (reflow soldering process), these high temperatures cause no change in the fusible conductor.
  • a fuse provided with this fusible conductor can be easily soldered by a reflow soldering process according to JEDEC standard (240 ° C to 265 ° C, 10s) on the circuit board.
  • the at least one support is at least partially disposed within the conductor track.
  • the respective extension of the support provided to the fusible conductor eg length, width and thickness in relation to the fusible conductor
  • tripping characteristics of the conductor track of the fusible conductor can be determined.
  • the at least one support within the conductor track is arranged adjacent to one of the connection contacts of the fusible conductor.
  • the diffusion zone can be placed particularly close to an adjacent electronic component (eg power transistor) to be protected with regard to overcurrent and excess temperature.
  • an adjacent electronic component eg power transistor
  • It may be provided a support adjacent to a terminal contact or it may be two Pads may be provided adjacent to the two terminal contacts. Fuses are increasingly needed for the protection of power transistors on printed circuit boards for use in high-energy equipment, such as automotive, heating and ventilation technology, renewable energy, etc. High-energy applications are optimally regulated today, for example, to reduce energy consumption.
  • the power transistors often operate in pulsed mode. In fault-free operation, the maximum thermal load of the power transistors in pulsed operation is not exceeded.
  • the power transistors are driven with a constant signal in the event of a fault or the power transistor is damaged, high temperatures of, for example, more than 200 ° C. occur in the power transistor. This creates a fire hazard. However, this danger is prevented by the fusible conductor according to the invention, which triggers immediately when it exceeds a predetermined high temperature. This advantageous effect is further increased by the fuse is mounted in the immediate vicinity of the power transistor.
  • the diffusion zone ie the support
  • a further advantage of this arrangement is that a base support underlying the fusible conductor has a reduced heat dissipation capability at the edge region, ie adjacent to one of the terminal contacts of the fusible conductor, than, for example, in the middle region.
  • connection contacts in relation to the conductor track on better properties for heat dissipation.
  • the highest temperature values will thus advantageously occur in the middle of the conductor track.
  • the conductor cross-section of the conductor path progressively increases over the line cross-section of the connection contacts.
  • the conductor cross section of the conductor can increase linear or non-linear.
  • the conductor cross-section of the conductor increases gradually at each of the two ends of the conductor track with a minimum line cross-section and grows to a maximum line cross-section, which is equal to the line cross-section of the connection contacts.
  • the cable cross-section of the connection contacts can be constant starting from this section.
  • the fusible conductor assumes a bone shape that appears in plan view.
  • the at least one support is arranged at least in sections within the conductor track in a region of the stepwise increasing line cross section. This provides a further design parameter by which it is possible to set from which temperature and / or from which current value the fusible conductor is to be triggered.
  • the at least one support is preferably arranged in a region of the conductor track with a gradually increasing conductor cross-section adjacent to a section of the conductor track with a minimum conductor cross-section.
  • the fusible conductor further comprises at least one introduced into the conductor track recess in which the at least one support is arranged.
  • This is the diffusion zone is diluted as a whole, so that a diffusion of the atoms of the material of the fusible conductor into the material of the support which is necessary or sufficient for triggering the fusible conductor takes place more rapidly.
  • the temperature threshold for triggering the fusible conductor decreases.
  • the current threshold drops to trip on overcurrent.
  • the extent of the recess is an important design parameter by which the temperature threshold and the current threshold are set.
  • the at least one recess is aligned transversely to the longitudinal direction of the conductor track.
  • the fusible conductor is usually formed as an elongate, thin strip body.
  • the recess is introduced on the surface and perpendicular to the current direction in the material of the conductor track. In the case of tripping of the fusible conductor, the current flow can thus be completely interrupted.
  • the recess is introduced, for example, by means of photolithography, a laser, etc. in the conductor track.
  • This recess is then filled with the material of the support, for example by means of a galvanic process.
  • the recess can be partially or completely filled.
  • the recess can also be filled over the edge of the recess away with the material of the pad. It may be one or more recesses may be provided, which are each filled with a support.
  • the material of the fusible conductor comprises copper and the material comprises the support tin.
  • Conventional fused conductors for overcurrent protection are usually formed of copper.
  • tin as the material of the overlay an excellent material is found which undergoes diffusion with the copper as the material of the fusible conductor in case of excess temperature and current flow through the fusible conductor.
  • the copper atoms diffuse into the tin and thus a copper-tin alloy is formed.
  • this load on the fusible conductor does not cause any change.
  • a fuse comprising a fuse element according to any one of claims 1 to 8 and further comprising a base support made of an electrically insulating material, wherein the fuse element is disposed on a surface of the base support.
  • a base support for example, a FR4 base material or an Al 2 O 3 ceramic can be used.
  • thermal fuses would trigger immediately at the necessary high temperatures of for example 240 ° C - 265 ° C, so far so expensive Countermeasures are taken, such as the provision of wire terminations. Due to the particular advantage of the fuse according to the invention, an automatic assembly is possible and is also the cost of this greatly reduced in contrast to the prior art, since, for example, can be dispensed with the provision of wire terminations. In addition, the inventive fuse is cheaper and much smaller than previously known thermal fuses. The fuse also complies with all known approvals (IEC 60127 and UL248-14 standard). In addition, the fuse is resistant to strong current pulses.
  • the fusible conductors are disposed on opposite surfaces of the base support.
  • a fuse based on a multilayer construction with two fuse elements can be provided in parallel.
  • the diffusion zones of the individual fusible conductors can be arranged in mutually offset positions in relation to the longitudinal direction. This ensures a more reliable triggering of the fuse in the event of overheating.
  • the fuse further comprises two base contacts, which are electrically connected to each of the base support opposite terminal contacts of the fuse element.
  • base contacts may also be formed of copper.
  • the base carrier comprises a Rogers 4000 material.
  • Conventional fuses are usually composed of base carriers, which comprise, for example, FR4 base materials, or circuit board materials, or Al 2 O 3 ceramics.
  • the FR4 base material is made of glass fabric reinforced with epoxy resin. This material has good coefficients of expansion in the x and y directions. These coefficients of expansion are in the range of 14 to 17 ppm / K and come very close to the coefficient of expansion of copper as the material of the fusible conductor at 17 ppm / K.
  • Copper foils having various thicknesses, for example 6, 9, 12, 18, 35, 70, 120 and 240 ⁇ m, are pressed on the FR4 base material under pressure and temperature and form the basis for the fusible conductor.
  • the limited operating temperatures of the FR4 base materials which have a max. 200 ° C. Even higher temperatures damage the FR4 base material.
  • the FR4 base material delaminates and a copper foil provided, for example, as a fusible conductor separates from the FR4 base material. This is followed by decomposition and charring of the FR4 base material. The charring causes conductive, relatively low-resistance layers, which thus produce impermissibly low insulation resistances.
  • Rogers4000 material As the material of the base support, as proposed, all advantages of the Al 2 O 3 ceramic and the FR4 base material are advantageously combined.
  • the Rogers4000 material is therefore excellently suited as the material of the base carrier of the fuse. This applies to all types and sizes of the basic carrier.
  • the Rogers4000 material is also compatible with all board processes and is durable even at temperatures up to 300 ° C.
  • the at least one fusible conductor is preferably coated with a protective lacquer, in particular a polymer protective lacquer. As a result, the fusible conductor is reliably protected against environmental influences.
  • the above-mentioned object is likewise achieved by a method for producing a fuse, wherein the method comprises the steps of providing at least one fuse conductor comprising two connection contacts and an interconnected conductor track, such that the conductor track reduces at least in sections one in relation to the connection contacts Line cross-section has; Providing a base carrier; Providing the fusible conductor with at least one support, the fusible conductor and the support each being selected from materials which diffuse when a predetermined ambient temperature is exceeded and an electric current is passed through the fusible conductor; and arranging the at least one fusible conductor on the base support.
  • a fuse is produced, which triggers quickly and reliably at excess temperature.
  • this fuse can be produced inexpensively by only a few steps.
  • the ambient temperature (overtemperature threshold value) at which the fusible conductor is to be triggered is predetermined.
  • This selection of the relation can also be used to define an overcurrent threshold at which the fusible conductor will be triggered.
  • the line cross section of the conductor track is reduced in a plane perpendicular to the longitudinal direction of the fusible conductor in relation to the line cross section of the connection contacts.
  • a fusible conductor is provided which has an H-profile in plan view.
  • the line cross-section of the fusible conductor can increase linearly or non-linearly to the line cross-section of the connection contacts.
  • a fusible conductor is created, which corresponds to a bone profile in plan view.
  • the fusible conductor is in Trap of overtemperature and / or overcurrent always in the section with reduced line cross-section, ie in the course of the conductor, trigger.
  • the fusible conductor is formed, for example, by punching a one-piece material. Alternatively, the fusible conductor is formed by cutting, for example by means of laser.
  • the at least one support is preferably arranged at least in sections within the conductor track of the fusible conductor.
  • the at least one support within the conductor track is arranged adjacent to one of the connection contacts of the fusible conductor.
  • the diffusion zone can thus be arranged in close proximity to an electronic component to be protected, for example a power transistor.
  • the reliability can be further increased, with which the fusible conductor is triggered quickly and reliably when a predetermined temperature is exceeded.
  • the step of providing the fusible conductor with the at least one support comprises arranging the support in at least one recess introduced in the conductor track.
  • a temperature threshold can be determined or defined, beyond which the fuse is triggered.
  • tripping characteristics of the fuse conductor can be easily determined.
  • an SMD fuse which comprises a fuse according to one of claims 9 to 13. This makes it possible to assemble an SMD printed circuit board with an SMD fuse as a thermocouple.
  • an SMD circuit comprising an SMD fuse according to claim 17.
  • an SMD circuit which comprises at least one SMD fuse for thermal monitoring of individual electronic components.
  • a fuse 10 comprises two fuse elements 12 ', 12 ", which are each arranged on opposite surfaces of a base support 14 viewed in the longitudinal direction of the fuse 10.
  • the base support 14 is made of an electrically insulating material, which is also at high temperatures, for example up to to 300 ° C. It is particularly preferred to use Rogers 4000 material as the material of the base support 14.
  • the fusible conductors 12 ', 12 "lying on the base support 14 are each provided on their outer surface facing surface with a support 16', 16"
  • the supports 16 ', 16 each extend in a region of the fuse elements 12', 12", which extends transversely to the current direction.
  • Respective ends of the opposite fusible conductors 12 ', 12 “ are electrically connected to each other via base contacts 18', 18".
  • These base contacts The fuse elements 12 ', 12 "and the base contacts 18', 18” are formed, for example, from copper Current exceeds a predetermined or defined current value (current threshold), in the usual way, one of the fusible conductor 12 ', 12 “melt or burn. Because of the thus reduced line cross-section, the further fusible conductor will then likewise melt or burn out directly. The current path is thus interrupted.
  • the fuse 10 also provides protection against overheating.
  • a diffusion process is activated according to the invention, in which the atoms of the material of the fusible conductor (copper) diffuse into the material of the support 16 ', 16 ", for which purpose the material of the support 16', 16" made of tin is chosen as the diffusion partner.
  • a copper-tin alloy is formed by diffusing the copper atoms into the tin overlay.
  • the diffusion zone is designed by appropriate choice of design parameters, such as size, choice of material, etc., such that the reduced melting temperature of about 500 ° C even at relatively low currents is achieved and the circuit thus reliably by triggering or Thus, the fuse 10 will trip even at predetermined ambient temperatures (overtemperature), for example, more than 200 ° C., when no overcurrent flows, the operation and advantage of the fuse 10 will be explained below after closer inspection of the fusible link.
  • overtemperature for example, more than 200 ° C.
  • FIGS. 3 and 4 show in detail a fuse element 12_1 according to a first embodiment of the invention in each case in a perspective view and in a sectional view.
  • the fusible conductor 12_1 is assembled in one piece from two connection contacts 24_1 ', 24_1 "and a conductor track 26_1 arranged between the connection contacts 24_1', 24_1", wherein the conductor track 26_1 has a continuously reduced conductor cross-section in relation to the connection contacts 24_1 ', 24_1 " the conductor 26_1 is over the total extension of the conductor 26_1 away constant.
  • the connection contacts 24_1 ', 24_1 "in relation to the conductor track 26_1 have a very large surface area.
  • the outer shape of the fusible conductor 12_1 assumes an H-profile.
  • the connection contacts 24_1 ', 24_1 are of rectangular design, wherein the connection contacts 24_1', 24_1" can also take on other forms, as long as the total considered in a plane perpendicular to the longitudinal direction of the fuse conductor, the conductor cross section of the conductor 26_1 in relation to the line cross section of the connection contacts
  • the fusible conductor 12_1 is formed by punching out a one-piece material (eg copper)
  • the fusible conductor 12 may be formed by cutting, for example by means of a laser.
  • the support 16_1 is filled in the recess 20_1, which is introduced in the material of the conductor track 26_1.
  • recesses each with filled-in.
  • Conductor cross section of the trace 26_1 is one of the design parameters for setting the temperature threshold value. With decreasing line cross section of the conductor 26_1 (copper), the temperature threshold is increasingly reduced.
  • the geometric shape of the recess 20_1 as a whole allows a possibility for setting or defining the temperature threshold value.
  • the amount of material of the support 16_1 ie the amount of tin used.
  • Another design parameter for setting or defining the temperature threshold is shown by the choice of material composition of the two diffusion partners. In addition to the diffusion partners copper and tin presented here, other suitable diffusion partners can also be selected.
  • this can be coated with a protective lacquer 22_1, for example a polymer protective lacquer (see FIG. 4 ).
  • FIGS. 5 and 6 show in detail a fuse element 12_2 according to a second embodiment of the invention in each case in a perspective view and in a sectional view.
  • the fusible conductor 12_2 is made in one piece from two connection contacts 24_2 ', 24_2 "and a conductor track arranged between the connection contacts 24_2', 24_2" 26_2 composed equal to the one in FIGS. 4 and 5 shown construction of the fusible conductor 12_1 of the first embodiment.
  • the fusible conductor 12_2 according to the second embodiment differs from the fusible conductor 12_1 according to the first embodiment in that the conductor cross-section of the conductor track 26_2 approaches the larger conductor cross-section of the connection contacts 24_2 ', 24_2 "at both end sections in a stepped manner Line cross section of the conductor 26_2 not over the entire extent of the conductor 26_2 away constant.
  • the conductor track 26_2 thus comprises, viewed in plan view, at each of its two ends portions of the shape of an isosceles trapezoid.
  • the outer shape of the fusible conductor 12_2 thus assumes a bone-shaped profile.
  • the line cross section of the conductor track 26_2 can also increase non-linearly, whereby the end sections of the conductor track 26_2, viewed in plan view, are given a different geometric shape from the isosceles trapezoid.
  • connection contacts 24_2 ', 24_2 are further rectangular in plan view, wherein they can also assume other geometric shapes, as long as the total conductor cross-section of the conductor 26_2 decreases in relation to the line cross-section of the terminals 24_2', 24_2" to the center of the fusible conductor 12_2 extending ,
  • the fusible conductor 12_2 comprises two recesses 20_2 ', 20_2 "which are introduced in the material of the conductor track 26_2.
  • the recesses 20_2', 20_2" are respectively arranged in those regions of the conductor track 26_2 in which the conductor cross-section is like previously described increases.
  • the recesses 20_2 ', 20_2 " as viewed in plan view, are respectively disposed on the blunt tips of the trapezoidal end portions of the track 26_2.
  • fuse 10 may be single-sided or double-sided with one or more fuse elements 12_1 of the first embodiment (see FIGS. 3 and 4 ) or one or more fusible conductors 12_2 of the second embodiment (see FIGS. 5 and 6 ). There are also combinations possible.
  • a reliable fuse 10 for thermal and electrical monitoring of, for example, sibling power transistors is created.
  • One advantage is that the fuse 10 despite thermal fuse feature is suitable to be soldered by a direct reflow soldering on the circuit board without triggering. Since, in the course of this reflow soldering process, no current flows through the fusible conductor 12, the high temperatures which occur in this process do not trigger the fusible conductor 12 either. Only in the operating state, i. when passing a current, such as rated current, the fuse element 12 triggers even at excess temperatures, which may be lower than the temperatures occurring during the reflow soldering process.
  • a hitherto unprecedented SMD fuse is created, which can be automatically populated and soldered on SMD basis. Due to the small form factor of the SMD fuse, it can advantageously be placed very close to a highly heat-generating electrical component, for example a power transistor. As soon as this component assumes a temperature which exceeds a predetermined temperature threshold, eg caused by a defect of the component itself or a defect in the circuit, the SMD fuse triggers rapidly, whereby the current flow is reliably interrupted at this defective component.
  • a predetermined temperature threshold eg caused by a defect of the component itself or a defect in the circuit
  • the fuse 10 has a smallest possible form factor (for example, 0201, 0402, 0603, 1206, 1812, 2010, 2512, 4018, etc.). In addition, the fuse 10 has a high pulse load capacity, since the fusible conductor 12 is fixed on the base support 14.
  • the fuse 10 can be placed particularly close to highly heat-generating electrical components, such as power transistors, thereby permitting good thermal coupling, which immediately detects elevated temperatures, for example an elevated temperature of the power transistor caused by a malfunction of the power transistor As the fuse 10 triggers immediately when the defined excess temperature is exceeded, the risk of a fire development is thus eliminated In comparison with conventionally known thermal fuses, the fuse 10 offers a considerable overall improvement in terms of reliability, cost, size, weight, processing, pulse resistance, vibration resistance, response, etc.

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  • Manufacturing & Machinery (AREA)
  • Fuses (AREA)

Claims (18)

  1. Conducteur fusible (12_1 ; 12_2) comprenant deux contacts de raccordement (24_1', 24_1" ; 24_2', 24_2") et une piste conductrice intermédiaire (26_1 ; 26_2), la piste conductrice (26_1 ; 26_2) ayant au moins par endroits une section de conducteur réduite par rapport aux contacts de raccordement (24_1', 24_1" ; 24_2', 24_2"), comprenant en outre au moins un revêtement (16_1 ; 16_2', 16_2"), le conducteur fusible (12_1, 12_2) et le revêtement (16_1 ; 16_2', 16_2") étant chacun choisi dans des matériaux qui subissent une diffusion lorsqu'une température ambiante prédéfinie est dépassée et lorsqu'un courant électrique circule à travers le conducteur fusible (12_1 ; 12_2), le au moins un revêtement (16_1) étant agencé à l'intérieur de la piste conductrice (26_1) de façon adjacente à un des contacts de raccordement (24_1', 24_1") du conducteur fusible (12_1).
  2. Conducteur fusible (12_1 ; 12_2) selon la revendication 1, dans lequel le au moins un revêtement (16_1 ; 16_2', 16_2") est agencé au moins par endroits à l'intérieur de la piste conductrice (26_1 ; 26_2).
  3. Conducteur fusible (12_2) selon la revendication 1 ou 2, dans lequel la section de conducteur de la piste conductrice (26_2) passe progressivement de plus en plus sur la section de conducteur des contacts de raccordement (24_2', 24_2").
  4. Conducteur fusible (12_2) selon la revendication 3, dans lequel le au moins un revêtement (16_2', 16_2") est agencé au moins par endroits à l'intérieur de la piste conductrice (26_2) dans une zone de la section de conducteur qui augmente progressivement.
  5. Conducteur fusible (12_2) selon la revendication 3 ou 4, dans lequel le au moins un revêtement (16_2', 16_2") est agencé dans une zone de la piste conductrice (26_2) avec une section de conducteur qui augmente progressivement et de façon adjacente à une section de la piste conductrice (26_2) avec une section de conducteur minimale.
  6. Conducteur fusible (12_1 ; 12_2) selon l'une des revendications précédentes, comprenant en outre au moins un évidement (20_1, 20_2', 20_2") aménagé dans la piste conductrice (26_1 ; 26_2), dans lequel est agencé le au moins un revêtement (16_1 ; 16_2', 16_2").
  7. Conducteur fusible (12_1 ; 12_2) selon la revendication 6, dans lequel le au moins un évidement (20_1 ; 20_2', 20_2") est orienté en continu transversalement au sens longitudinal de la piste conductrice (26_1 ; 26_2).
  8. Conducteur fusible (12_1 ; 12_2) selon l'une des revendications précédentes, le matériau du conducteur fusible (12_1 ; 12_2) comprenant du cuivre et le matériau du revêtement (16_1 ; 16_2', 16_2") comprenant de l'étain.
  9. Fusible (10) comprenant au moins un conducteur fusible (12 ; 12', 12") selon l'une des revendications précédentes et comprenant en outre un support de base (14) constitué d'un matériau électriquement isolant, le conducteur fusible (12 ; 12', 12") étant agencé sur une surface du support de base (14).
  10. Fusible (10) selon la revendication 9, dans lequel le conducteur fusible (12', 12") est agencé sur des surfaces opposées du support de base (14).
  11. Fusible (10) selon la revendication 9 ou 10, comprenant en outre deux contacts de base (18', 18") qui sont reliés chacun électriquement par le biais du support de base (14) à des contacts de raccordement opposés du conducteur fusible (12', 12").
  12. Fusible (10) selon l'une des revendications 9 à 11, dans lequel le au moins un conducteur fusible (12 ; 12', 12") est recouvert d'un vernis de protection (22 ; 22', 22").
  13. Fusible (10) selon la revendication 12, dans lequel le vernis de protection (22 ; 22', 22") comprend un vernis de protection en polymère.
  14. Procédé pour fabriquer un fusible (10) selon l'une des revendications 9 à 13, comprenant les étapes consistant à :
    - fournir au moins un conducteur fusible (12 ; 12', 12") comprenant deux contacts de raccordement (24', 24") et une piste conductrice intermédiaire (26), de sorte que la piste conductrice (26) a au moins par endroits une section de conducteur réduite par rapport aux contacts de raccordement (24', 24"),
    - fournir un support de base (14) ;
    - fournir le conducteur fusible (12 ; 12', 12") avec au moins un revêtement (16 ; 16', 16"), lequel revêtement est agencé à l'intérieur de la piste conductrice (26) de façon adjacente à un des contacts de raccordement (24', 24") du conducteur fusible (12 ; 12', 12"), le conducteur fusible (12 ; 12', 12") et le revêtement (16 ; 16', 16") étant choisis dans des matériaux qui subissent une diffusion lorsqu'une température ambiante prédéterminée est dépassée et lorsqu'un courant électrique circule à travers le conducteur fusible (12 ; 12', 12") ; et
    - agencer le au moins un conducteur fusible (12 ; 12', 12") sur le support de base (14).
  15. Procédé selon la revendication 14, dans lequel le au moins un revêtement (16 ; 16', 16") est agencé au moins par endroits à l'intérieur de la piste conductrice (26) du conducteur fusible (12 ; 12', 12").
  16. Procédé selon la revendication 14 ou 15, dans lequel l'étape consistant à fournir le conducteur fusible (12 ; 12', 12") avec le au moins un revêtement (16 ; 16', 16") consiste à agencer le revêtement (16 ;16', 16") dans au moins un évidement (20 ; 20', 20") aménagé dans la piste conductrice (26).
  17. Fusible SMD comprenant un fusible (10) selon l'une des revendications 9 à 13.
  18. Circuit SMD comprenant un fusible SMD selon la revendication 17.
EP13824496.7A 2013-12-23 2013-12-23 Conducteur fusible, coupe-circuit a fusible, procédé de fabrication d'un coupe-circuit a fusible, d'un fusible a smd et d'un comutateur a smd Active EP3087579B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL13824496T PL3087579T3 (pl) 2013-12-23 2013-12-23 Topik, bezpiecznik topikowy, sposób wytwarzania bezpiecznika topikowego, bezpiecznik SMD i układ SMD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2013/077913 WO2015096853A1 (fr) 2013-12-23 2013-12-23 Conducteur fusible, protection par fusible, procédé de fabrication d'une protection par fusible, protection smd et circuit smd

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EP3087579A1 EP3087579A1 (fr) 2016-11-02
EP3087579B1 true EP3087579B1 (fr) 2018-08-08

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EP13824496.7A Active EP3087579B1 (fr) 2013-12-23 2013-12-23 Conducteur fusible, coupe-circuit a fusible, procédé de fabrication d'un coupe-circuit a fusible, d'un fusible a smd et d'un comutateur a smd

Country Status (7)

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US (1) US10192705B2 (fr)
EP (1) EP3087579B1 (fr)
KR (1) KR102128065B1 (fr)
CN (1) CN105874553B (fr)
PL (1) PL3087579T3 (fr)
SG (1) SG11201604918XA (fr)
WO (1) WO2015096853A1 (fr)

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Publication number Priority date Publication date Assignee Title
WO2017121474A1 (fr) * 2016-01-14 2017-07-20 Schurter Ag Fusible thermique activable mécaniquement
US11359975B2 (en) 2019-02-08 2022-06-14 International Business Machines Corporation Using ionic liquids in a programmable sensor
DE102019004223A1 (de) * 2019-05-16 2020-11-19 Siba Fuses Gmbh Schmelzleiter und Sicherung
US11532452B2 (en) * 2021-03-25 2022-12-20 Littelfuse, Inc. Protection device with laser trimmed fusible element
US11605519B1 (en) * 2021-11-12 2023-03-14 Chi Lick Schurter Limited High breaking capacity strip fuse and the manufacture method of thereof

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Also Published As

Publication number Publication date
PL3087579T3 (pl) 2019-03-29
EP3087579A1 (fr) 2016-11-02
US20170040136A1 (en) 2017-02-09
WO2015096853A1 (fr) 2015-07-02
KR20160102298A (ko) 2016-08-29
CN105874553B (zh) 2018-11-27
US10192705B2 (en) 2019-01-29
KR102128065B1 (ko) 2020-06-30
SG11201604918XA (en) 2016-07-28
CN105874553A (zh) 2016-08-17

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