EP3067982A1 - Antenne patch pour des dispositifs radio électroniques portatifs - Google Patents

Antenne patch pour des dispositifs radio électroniques portatifs Download PDF

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Publication number
EP3067982A1
EP3067982A1 EP15000749.0A EP15000749A EP3067982A1 EP 3067982 A1 EP3067982 A1 EP 3067982A1 EP 15000749 A EP15000749 A EP 15000749A EP 3067982 A1 EP3067982 A1 EP 3067982A1
Authority
EP
European Patent Office
Prior art keywords
metal surface
patch antenna
circuit board
patch
substrate layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15000749.0A
Other languages
German (de)
English (en)
Other versions
EP3067982B1 (fr
Inventor
Matthias Lungwitz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gigaset Communications GmbH
Original Assignee
Gigaset Communications GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gigaset Communications GmbH filed Critical Gigaset Communications GmbH
Priority to EP15000749.0A priority Critical patent/EP3067982B1/fr
Publication of EP3067982A1 publication Critical patent/EP3067982A1/fr
Application granted granted Critical
Publication of EP3067982B1 publication Critical patent/EP3067982B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/273—Adaptation for carrying or wearing by persons or animals

Definitions

  • the present invention relates to the field of antenna technology. It relates to a patch antenna according to the preamble of claim 1 and a correspondingly designed, portable electronic radio device with such a patch antenna.
  • Antennas referred to as patch antennas typically include a ground plane, a dielectric substrate disposed thereon, and one or more radiating elements disposed thereon, often referred to as "patches" in English.
  • radiating elements such as rectangular or elliptical, but many other geometrical shapes are considered in the literature.
  • patch antennas are thus planar antenna devices and as such suitable for application to a wide variety of objects.
  • patch antennas are often used interconnected to antenna groups, wherein the distance of the individual patch antennas within the group is given by the desired antenna characteristics and is generally smaller than a wavelength in free space.
  • a patch antenna consists, for example, of a metallized circuit board on both sides, in which the metallization of the underside forms a ground plane, while the metallization of the upper side is formed in its geometric dimensions as a patch surface and forms a planar antenna.
  • printed circuit boards for supplying electronic components with a supply voltage on one side of a carrier layer of electrically insulating material have a layer of electrical conductive material and on the other side a wiring layer, wherein a multi-layer printed circuit board may have a plurality of such layers.
  • connection points for surface-mountable components.
  • Lines for electrical connection of the connection points run within the wiring layer.
  • lines of a first wiring layer are first produced in a so-called core, a laminate of glass-fiber-reinforced epoxy resin with double-sided copper lamination, by etching away excess copper surfaces on one side. Thereafter, an insulating, photosensitive resin layer is applied, in which recesses are produced at certain points by illumination. On top of this, another copper layer is applied, in which the leads of a second wiring layer are again formed by etching.
  • Lines of the first and the second wiring layer are connected in this way by so-called converters. If necessary, further wiring layers, which are substantially electrically separated from one another by insulating layers, can be applied in the same way.
  • the supply voltage required for electronic components is supplied from the layer of electrically conductive material, which is located on the other side of the insulating substrate, through vias, so the circuit board penetrating holes with a conductive coated inner surface, pads on the surface of the wiring layer.
  • Another form of the known patch antenna is formed on a multi-layer board as a copper layer on one side and with a corresponding ground plane on the other side, wherein the structure of the multilayer board not must be limited to these locations.
  • a signal conductor and a ground conductor are formed, for example, by means of suitable plated-through holes or contacted by printed conductors.
  • the conductor tracks are typically guided in the form of a via contact through the layer (s).
  • a patch arranged above a conductive base area is used as the radiator.
  • Via Very Interconnection Access
  • the term Via is understood to mean a via which is arranged between the interconnect levels of a multilayer printed circuit board.
  • the connection is usually made with an internally metallized hole in the substrate of the circuit board or board.
  • individual pads can also be equipped purely mechanically by means of via rivets or pins.
  • Such plated-through holes are produced by germinating the hole in the carrier material, that is to say with a catalyst, then catalytically metallizing and then optionally electrolytically reinforcing it.
  • the via hole may simultaneously serve as a land for leaded electronic components or be attached only for the purpose of electrical contact.
  • One of the disadvantages of the known patch antennas is that the antenna and its ground plane rest directly on a surface of the printed circuit board and thus close to the electronic components of the portable radio device, this proximity necessitating a special arrangement of the components and a relatively complicated shielding in order to reduce or even avoid mutual interference between the antenna and the electronic components, in particular a display device and the electronic radio device. In small-sized portable radio devices using patch antennas, this is particularly difficult. This shielding makes the operations of joining the various elements and components of this portable electronic radio device.
  • a further disadvantage of the known patch antennas lies in the fact that the outer sheath of the portable electronic radio device must necessarily be made of a material which does not disturb the function of the antenna, in particular of a non-metallic material.
  • the aesthetics of the portable electronic radio device is thus dependent on a limited selection of materials that can be used to make the casing of the portable electronic radio device.
  • a mounting opening e.g. for the use of such a radio device as a key fob, aggravating the problem, on the one hand small dimensions to reach, and on the other hand to make the portable electronic radio device as a nondescript keychain.
  • the mounting hole is located outside of the rectangular design and thus outside the antenna and outside the electronic components, or the key fob has a much larger outer dimension than the circuit board.
  • Fasteners such as e.g. Metal rings, screws, nails, rivets, hoes or key rings, which are commonly used for attachment, often have a large diameter and require a correspondingly large opening in the trailer.
  • the invention is thus based on the object of specifying a patch antenna, in particular for a portable electronic radio device, in particular in battery-operated signal transmitters, and a portable electronic radio device with such a patch antenna, wherein the patch antenna has small dimensions offers good flexibility for the design of the electronic radio device and its design makes the use of metallic materials for the execution of the outer sheath of the portable electronic radio device possible.
  • the invention thus provides a patch antenna comprising a first metal surface, a second metal surface, wherein the first and second metal surfaces are arranged parallel to each other, a first substrate layer disposed between the first metal surface and the second metal surface for electrically insulating the first metal surface from the second metal surface, and a via via electrically connected to the first metal surface for signal supplying the first metal surface extending through the substrate layer and the second metal surface, wherein in one of the corner regions of the patch antenna at least through the first metal surface, the substrate layer and the second metal surface through a through hole arranged is.
  • the arrangement of the passage opening in one of the corner regions of the patch antenna practically does not affect the field distribution on the patch antenna.
  • the properties of the orthogonal polarization for example, when using two signal supplies, are not affected.
  • the formation of an interruption in the form of the passage opening on the patch antenna can thus take place in order to provide a compact antenna.
  • the wave polarization is in principle linear.
  • a circular polarization can be generated because the asymmetry, for example in the form of the passage opening, can lead to slightly shifted resonant frequencies. This can be influenced by the exact arrangement of the through hole as well as your dimensions.
  • a circular polarization can be achieved with only one via via for signal supply.
  • circular polarization of the radiated field is often advantageous because the alignment of transmitter and receiver relative to each other is not previously known and may even vary during transmission.
  • a further advantage of the present invention is that a robust mechanical hold of the antenna is ensured, for example, on a housing.
  • their electrical connection to the active circuitry of the portable electronic radio device is simplified and the structure of the portable electronic radio device as a key fob in a simple manner, without projecting beyond the limits of the patch antenna used.
  • the radiating element may be round or square or each assume any geometrical shape adapted to this technique.
  • the first metal surface is substantially congruent with the second metal surface and the first substrate layer arranged therebetween.
  • the substrate layer and the first and second metal surfaces are arranged flush with each other at the edges, forming a right-angled end edge of the patch antenna.
  • the passage opening has a suitable geometric cross-sectional shape including a square shape, a rectangular shape, a circular shape, an elliptical shape, a triangular shape, a diamond shape or their variants.
  • the geometric shape may in particular follow a curved, oblique or organically free line shape.
  • the passage opening through the first metal surface, the first substrate layer and the second metal surface has an insulating layer on its inner wall.
  • the opening in one of the corner regions of the patch antenna is e.g. electrically insulated by an inserted plastic sleeve to perform a metallic ring, without causing a short circuit of the first metal surface with the second metal surface.
  • the insulation layer preferably extends over all layers of the patch antenna.
  • the patch antenna is designed as part of a multilayer printed circuit board.
  • the multilayer printed circuit board allows easy manufacture of the patch antenna, wherein, for example, a first metal layer of the multilayer printed circuit board forming the first metal surface, a second metal layer of the multilayer printed circuit board forming the second metal surface, and a first substrate layer for electrical isolation between the first metal surface and the second metal surface.
  • Wiring layer can also be formed on the multilayer printed circuit board, which is formed, in particular, by a rear side of the patch antenna, ie the back side is opposite to the first metal surface.
  • an electronics and power supply for the patch antenna can be accommodated on the wiring layer. This enables easy provision of a portable radio device with the patch antenna.
  • the arrangement on the multilayer printed circuit board also offers the advantage that the electronic components do not adversely affect the antenna properties.
  • the populated multi-layer printed circuit board can now be locked in place in a metal trough with the aid of a peripheral insulation.
  • the peripheral edge of the multilayer printed circuit board is preferably covered with insulating material, such as plastic, since a field builds up circumferentially in the edge zones, the so-called "fringe" field.
  • the first metal layer may terminate with the second metal layer at the edge as long as the spacing of the layers is very small.
  • the first metal surface and the second metal surface of a highly electrically conductive material in particular copper, aluminum, silver, brass or an alloy with at least one of these materials and that the first metal surface and the second Metal surface have a material thickness which is substantially greater than the penetration depth of the skin effect at a designated operating frequency.
  • a highly electrically conductive material in particular copper, aluminum, silver, brass or an alloy with at least one of these materials and that the first metal surface and the second Metal surface have a material thickness which is substantially greater than the penetration depth of the skin effect at a designated operating frequency.
  • Dielectric losses can be reduced by using low loss factor insulating materials.
  • a reduction of the skin effect losses is possible by an enlargement of the conductor cross-section.
  • separating layers of layers of conductive material can be inserted into the multilayer printed circuit board for the reduction of the skin effect losses.
  • the separating layers may preferably be designed such that they consist of alternating layers of conductive material.
  • a trailer is provided with a patch antenna above, wherein the trailer has an upper housing part, a lower housing part, a plastic strip arranged therebetween and a passage opening for receiving fastening means.
  • the housing comprises two parts and is shaped so that the patch antenna can be inserted and locked in its interior, wherein the housing parts with a strip of plastic which is arranged circumferentially around the edge of the patch antenna, are not separated by the radiating peripheral fringe field to disturb or shield.
  • the housing upper and lower part consists e.g. from a cast in one piece metal part, wherein for receiving the power supply, a lid may be provided. The lid may also be cast in one piece, including its fixing lips.
  • the basic idea of the radio device is thus to propose a patch antenna which has a passage opening, wherein the passage opening does not require metallization and, because of its position on the outer edge, can accommodate a trailer ring with a significantly larger space requirement.
  • the arrangement of the passage opening in one of the corner regions of the patch antenna practically does not affect the field distribution on the patch antenna. As a result, the properties of the orthogonal polarization are not affected.
  • the formation of an interruption in the form of the passage opening on the patch antenna can thus take place in order to provide a compact antenna.
  • Another advantage of the present invention is that a simple electrical connection of the patch antenna with the active circuitry is made possible, so that the structure of the portable electronic radio device can be done as a key fob in a simple manner.
  • the size of the trailer can be substantially limited to the size of the patch antenna, since the through-hole, without noticeably beyond the limits of the patch antenna used protrude.
  • the radiator element can be round or square or adopt any geometric shape adapted to this technique.
  • the joining and the connection of the patch antenna and the trailer or the radio device are facilitated with this patch antenna. It is not necessary to equip the portable electronic radio device with a pair of different conductors, such as a coaxial excitation conductor, to allow the antenna to be driven since the ground conductor is advantageously integrally formed with the ground plane of the antenna. Therefore, the RF signal can be fed via a microstrip or triplate line from the transceiver to the via hole of the patch antenna. Furthermore, the arrangement of the antenna is such that the various electronic and electrical components of the portable electronic radio device are behind the ground plane of the antenna, which is an advantage in terms of reducing the interference with the antenna.
  • the active circuit arrangement is electrically connected to the first metal surface via the via via of the patch antenna.
  • a further embodiment of the patch antenna may consist of a patch surface placed on a final prepreg layer of the printed circuit board and consisting of a metal part, e.g. Stamped part is formed of aluminum, stainless steel, silver or gold, which at the same time forms one of the housing sides completely, wherein the RF contact for the antenna is formed by a rivet (feed point) to the RF circuit.
  • the ground plane is formed by a copper layer provided below a final prepreg layer and contacted with the antenna ground of the circuit.
  • the power supply of the portable electronic radio device is effected by a suitable energy storage, for example in the form a lithium battery.
  • a suitable energy storage for example in the form a lithium battery.
  • the battery receptacle for the battery cell is formed in the circuit board in a substrate layer.
  • the battery receptacle for the battery cell may be arranged at the wiring level.
  • the circuit board extends within the housing parallel to the end face of the lithium battery cell, which is thereby completely integrated into the housing. Some of the circuit board levels are located between the patch antenna and battery cell and can thus be adapted to the contact with the battery cell on the circuit board surface (back).
  • the circuit board forms the bottom of the battery compartment with respect to the battery cell.
  • the circuit board also contains the associated electronic components as a carrier or motherboard.
  • the printed circuit board is arranged in the base housing with a first surface (eg bottom side) facing the front side of the button cell battery and with a second surface (top side) facing the radiation element ,
  • the circuit board extends within the base housing parallel to the end face of the button cell battery and is thereby completely integrated into the base housing.
  • the circuit board is located between the beam element and the battery and can thus be adapted to the contact with the battery or with the beam element on the two circuit board surfaces (bottom and top).
  • the circuit board forms the bottom of the battery compartment with respect to the battery; With respect to the beam element, the printed circuit board forms the carrier or motherboard.
  • the patch antenna for broadcasting of radio frequencies, in particular in the frequency range of DECT or Bluetooth technology.
  • the proposed embodiment covers a wide frequency range, e.g. Frequencies in the range 2400 to 2486 MHz and is particularly suitable for use in the radio network with DECT or Bluetooth technology.
  • the use of the patch antenna is provided as a trailer.
  • the use of the patch antenna as a trailer allows good flexibility in the design of the electronic radio device, allowing the use of metallic materials to carry out the outer sheath of the portable electronic radio without significantly exceeding the limits of the patch antenna used.
  • a radio tag with a radio device and a fastening means for attachment to a keychain is provided, wherein the fastening means is preferably designed as a support ring and is guided through the through hole.
  • the key ring can be inserted through the through-hole in the radio tag with a radio device without affecting the antenna characteristics.
  • the electronics and power supply are also on the back of the patch antenna and the RF contact for the antenna is through via via to the RF circuit, thus ensuring reproducible RF contact.
  • FIG. 1 shows an antenna designed as a patch antenna according to the prior art.
  • an electromagnetic radiation takes place via a radiation surface in the form of a patch surface.
  • the patch antenna comprises a rectangular patch surface 101, which is designed as a metal surface and whose edge is indicated by dotted lines.
  • the patch area 101 is connected on the underside to a coaxial feed line 102 which runs perpendicular to the patch area 101 and projects through a via opening 103 within the dielectric substrate layer 104 as far as the antenna contact of the patch area 105.
  • the feed line is not perpendicular to the patch surface, but obliquely to this.
  • Below the dielectric substrate layer 104 is an electrically conductive ground plane 106.
  • the invention is based on FIGS. 2 to 8 explained.
  • Fig. 2 1 shows a first embodiment of a patch antenna according to the invention with a multilayer printed circuit board 201.
  • the multilayer printed circuit board 201 has in this order a first metal surface 205, a second metal surface 204, and a third metal surface 206 as a wiring layer 206, wherein between the first and the second metal surface 205, 204 a first substrate layer 202 and between the second metal surface 204 and the wiring layer 206, a second substrate layer 207 is arranged.
  • On the wiring layer 206 associated electronic components 210 and a battery cell 211 are arranged, wherein for the battery cell 211 a battery compartment as Recording can be arranged, which is not shown on the drawings.
  • a wiring layer 206 of a multilayer printed circuit board 201 In the surface of the wiring layer 206, areal connections for surface-mountable components 210 are formed in this embodiment. Lines for the electrical connection of the connection points extend as a further layer within the wiring layer 206.
  • a wiring layer 206 of a multilayer printed circuit board 201 first of all, in a so-called core, a laminate of glass-fiber-reinforced epoxy resin with double-sided copper lamination, by etching away excess copper surfaces on one side Wiring layer generated. Thereafter, an insulating, photosensitive resin layer is applied, in which recesses are produced at certain points by illumination. On top of this, another copper layer is applied, in which the leads of a second wiring layer are again formed by etching.
  • Lines of the first and the second wiring layer are connected in this way by so-called converters.
  • further wiring layers which are essentially separated from one another by insulating layers, can be applied in the same way.
  • the supply voltage required for electronic components 210 is supplied from the layer of electrically conductive material, which is located on the other side of the insulating substrate, through vias, so the circuit board penetrating holes with a conductive coated inner surface, pads on the surface of the wiring layer.
  • a via via 208 connected to the first metal surface 205 and a feed line 208a electrically connected to the first metal surface 205 by an antenna contact 209 for signal supply.
  • a through-opening 203 is arranged in one of the corner regions 212 of the patch antenna, wherein the through-opening 203 passes through the first metal surface 205, the first substrate layer 202, the second metal surface 204, the second substrate layer 207 and the third metal surface 206.
  • the structure of the patch antenna has a plurality of layers 202, 204, 205, 206, 207 arranged one above the other.
  • the lowermost layer is the electrically conductive wiring layer 206 on which the second dielectric substrate layer 207 is located.
  • the wiring of the components may require additional wiring levels, each of which may be on another dielectric substrate layer, as described above.
  • the wiring layer 206 associated electronic components 210 are disposed. In this situation, a battery cell 211 and a battery compartment are housed.
  • the material for the first metal surface 205 As the material for the first metal surface 205, highly conductive material such as copper is used. Above the first metal surface 205, i. the patch surface, may additionally be arranged a film for electrical insulation, which is not shown on the drawings.
  • the through-opening 203 is located in the corner region 212 of the multilayer printed circuit board 201, wherein the through-opening 203 extends from the upper side of the multilayer printed circuit board 201 through the plurality of layers arranged one above the other to the underside of the multilayer printed circuit board 201.
  • the passage opening 203 has an insulation layer, not separately shown in the figures, on its inner wall.
  • a via between the first metal surface 205 and the third metal surface 206 is made.
  • a small opening is initially produced by drilling, punching or lasering.
  • the via hole 208 is filled or lined with a conductive substance so as to establish a galvanically conductive connection between the antenna contact 209 for signal supply of the first metal surface 205.
  • Via Very Interconnection Access
  • the term Via is understood to mean a via which is arranged between the interconnect levels of a multilayer printed circuit board 201.
  • the connection is usually made with an internally metallized hole in the substrate of the circuit board or board.
  • individual pads can be fitted purely mechanically by means of plated-through rivets or pins.
  • Such plated-through holes are produced by germinating the hole in the carrier material, that is to say with a catalyst, then catalytically metallizing and then optionally electrolytically reinforcing it.
  • the via hole may simultaneously serve as a land for leaded electronic components or be attached only for the purpose of electrical contact.
  • FIG. 3 shows a second embodiment of a patch antenna according to the invention with a multi-layer circuit board 201 gem.
  • Fig. 2 and with a strip of plastic 301 which is arranged circumferentially around the edge of the multilayer printed circuit board, the plastic strip 301 does not interfere with the radiating fringe surrounding field.
  • FIG. 4 shows the housing bases 401 and housing tops 402 according to a first or second embodiment of the present invention in a three-dimensional view, wherein a respective recess on the housing lower part 401a and a recess on the housing upper part 402a is visible.
  • FIG. 5 shows a radio device according to the invention with the arrangement of the housing upper parts 402, the patch antenna according to the invention with a multi-layer circuit board 201 gem.
  • Fig. 2 a strip of plastic 301 which is arranged circumferentially around the edge of the multilayer printed circuit board 201 and the housing lower parts 401 in a further embodiment.
  • the exploded view includes in the overview housing upper part 401, plastic strip 301, multi-layer printed circuit board 201, battery cell 211 and housing lower part 401st
  • FIG. 6 shows a fastener 601 (support ring) for attachment to another object.
  • the support ring 601 is designed and used for attachment to the previously described patch antenna or the radio device.
  • a subsequent attachment to another object can take place.
  • a radio tag is formed together with the radio device.
  • FIG. 7 1 shows an embodiment of the assembled components including the patch antenna according to the invention, wherein a multi-layer circuit board 201 with the through-hole 203 including the wiring layer 206, the battery compartment 702, the active circuitry 703 and the battery cell 704 is depicted.
  • FIG. 8 shows a plan view of a designed as a radio device 702a (trailer) form. Shown is the radio device with the intended housing opening 701a, wherein the housing opening is arranged corresponding to the passage opening of the multilayer printed circuit board 201 and between the openings of the housing parts, an electrically insulating plastic sleeve is inserted.

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EP15000749.0A 2015-03-13 2015-03-13 Antenne patch pour des dispositifs radio électroniques portatifs Active EP3067982B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP15000749.0A EP3067982B1 (fr) 2015-03-13 2015-03-13 Antenne patch pour des dispositifs radio électroniques portatifs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15000749.0A EP3067982B1 (fr) 2015-03-13 2015-03-13 Antenne patch pour des dispositifs radio électroniques portatifs

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EP3067982A1 true EP3067982A1 (fr) 2016-09-14
EP3067982B1 EP3067982B1 (fr) 2017-05-03

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000030268A1 (fr) * 1998-11-17 2000-05-25 Ericsson, Inc. Radiotelephones portables comportant des antennes a plaque
WO2000074172A1 (fr) * 1999-05-31 2000-12-07 Allgon Ab Antenne a plaque et dispositif de communication comprenant une telle antenne
EP1294051A1 (fr) * 2001-09-13 2003-03-19 Alcatel Composant pour terminal de radiocommunication constituant antenne, haut-parleur et sonnerie
EP1317116A1 (fr) * 2001-11-30 2003-06-04 Sagem SA Téléphone mobile avec organe intégré dans le volume de l'antenne
EP1388910A2 (fr) * 2002-07-31 2004-02-11 Matsushita Electric Industrial Co., Ltd. Appareil de communication radio portable muni d'un bras de support ajouré
WO2009090241A2 (fr) * 2008-01-18 2009-07-23 Geotate B.V. Appareil photographique avec un système de positionnement par satellite

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000030268A1 (fr) * 1998-11-17 2000-05-25 Ericsson, Inc. Radiotelephones portables comportant des antennes a plaque
WO2000074172A1 (fr) * 1999-05-31 2000-12-07 Allgon Ab Antenne a plaque et dispositif de communication comprenant une telle antenne
EP1294051A1 (fr) * 2001-09-13 2003-03-19 Alcatel Composant pour terminal de radiocommunication constituant antenne, haut-parleur et sonnerie
EP1317116A1 (fr) * 2001-11-30 2003-06-04 Sagem SA Téléphone mobile avec organe intégré dans le volume de l'antenne
EP1388910A2 (fr) * 2002-07-31 2004-02-11 Matsushita Electric Industrial Co., Ltd. Appareil de communication radio portable muni d'un bras de support ajouré
WO2009090241A2 (fr) * 2008-01-18 2009-07-23 Geotate B.V. Appareil photographique avec un système de positionnement par satellite

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