EP3059519B1 - Refrigeration cycle device - Google Patents
Refrigeration cycle device Download PDFInfo
- Publication number
- EP3059519B1 EP3059519B1 EP13895676.8A EP13895676A EP3059519B1 EP 3059519 B1 EP3059519 B1 EP 3059519B1 EP 13895676 A EP13895676 A EP 13895676A EP 3059519 B1 EP3059519 B1 EP 3059519B1
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- EP
- European Patent Office
- Prior art keywords
- refrigerant
- condenser
- temperature
- refrigeration cycle
- flow path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005057 refrigeration Methods 0.000 title claims description 110
- 239000003507 refrigerant Substances 0.000 claims description 452
- 239000007788 liquid Substances 0.000 claims description 72
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 422
- 239000007789 gas Substances 0.000 description 25
- 238000010586 diagram Methods 0.000 description 21
- 230000008901 benefit Effects 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 14
- 239000002826 coolant Substances 0.000 description 10
- 239000013526 supercooled liquid Substances 0.000 description 10
- 238000003303 reheating Methods 0.000 description 9
- 230000009467 reduction Effects 0.000 description 8
- 238000009833 condensation Methods 0.000 description 7
- 230000005494 condensation Effects 0.000 description 7
- 230000002401 inhibitory effect Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 238000005338 heat storage Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 238000004781 supercooling Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 230000002528 anti-freeze Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007791 dehumidification Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003673 groundwater Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- -1 underground heat Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D17/00—Domestic hot-water supply systems
- F24D17/02—Domestic hot-water supply systems using heat pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D19/00—Details
- F24D19/10—Arrangement or mounting of control or safety devices
- F24D19/1006—Arrangement or mounting of control or safety devices for water heating systems
- F24D19/1051—Arrangement or mounting of control or safety devices for water heating systems for domestic hot water
- F24D19/1054—Arrangement or mounting of control or safety devices for water heating systems for domestic hot water the system uses a heat pump
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H15/00—Control of fluid heaters
- F24H15/10—Control of fluid heaters characterised by the purpose of the control
- F24H15/196—Automatically filling bathtubs or pools; Reheating the water in bathtubs or pools
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H15/00—Control of fluid heaters
- F24H15/20—Control of fluid heaters characterised by control inputs
- F24H15/212—Temperature of the water
- F24H15/215—Temperature of the water before heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H15/00—Control of fluid heaters
- F24H15/30—Control of fluid heaters characterised by control outputs; characterised by the components to be controlled
- F24H15/305—Control of valves
- F24H15/325—Control of valves of by-pass valves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H15/00—Control of fluid heaters
- F24H15/30—Control of fluid heaters characterised by control outputs; characterised by the components to be controlled
- F24H15/375—Control of heat pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H15/00—Control of fluid heaters
- F24H15/30—Control of fluid heaters characterised by control outputs; characterised by the components to be controlled
- F24H15/375—Control of heat pumps
- F24H15/38—Control of compressors of heat pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H15/00—Control of fluid heaters
- F24H15/30—Control of fluid heaters characterised by control outputs; characterised by the components to be controlled
- F24H15/375—Control of heat pumps
- F24H15/385—Control of expansion valves of heat pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H15/00—Control of fluid heaters
- F24H15/30—Control of fluid heaters characterised by control outputs; characterised by the components to be controlled
- F24H15/375—Control of heat pumps
- F24H15/39—Control of valves for distributing refrigerant to different evaporators or condensers in heat pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H15/00—Control of fluid heaters
- F24H15/40—Control of fluid heaters characterised by the type of controllers
- F24H15/414—Control of fluid heaters characterised by the type of controllers using electronic processing, e.g. computer-based
- F24H15/421—Control of fluid heaters characterised by the type of controllers using electronic processing, e.g. computer-based using pre-stored data
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B6/00—Compression machines, plants or systems, with several condenser circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2339/00—Details of evaporators; Details of condensers
- F25B2339/04—Details of condensers
- F25B2339/047—Water-cooled condensers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/04—Refrigeration circuit bypassing means
- F25B2400/0403—Refrigeration circuit bypassing means for the condenser
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2600/00—Control issues
- F25B2600/25—Control of valves
- F25B2600/2501—Bypass valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2600/00—Control issues
- F25B2600/25—Control of valves
- F25B2600/2519—On-off valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/21—Temperatures
- F25B2700/2116—Temperatures of a condenser
- F25B2700/21161—Temperatures of a condenser of the fluid heated by the condenser
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B40/00—Subcoolers, desuperheaters or superheaters
Definitions
- the present invention relates to a refrigeration cycle device for heating a heat medium with a condenser.
- Patent Literature 1 discloses a heat pump type hot water supply device including: a refrigeration cycle circuit including a compressor, a four-way valve, a water heat exchanger (condenser), a pressure reducing device, and an air heat exchanger (evaporator) connected via a refrigerant pipe; and a water circuit including a pump, a water heat exchanger, and a hot water storage tank connected via a water pipe, hot water heated by the water heat exchanger in the refrigeration cycle circuit being stored in the hot water storage tank, wherein R410A or R407C is used as refrigerant for the refrigeration cycle circuit.
- high pressure side design pressure is, for example, 4.25 MPa, which is converted into a saturation temperature of about 65°C. Any pressure described herein is absolute pressure.
- design pressure needs to be 4.25 MPa as in the air conditioner so that components such as a compressor and a heat exchanger are common to those in the air conditioner.
- Patent Literature 1 when condensation pressure is 4.75 MPa, a saturation temperature is about 70°C, and a feed-water temperature is 5°C in use of the R410A refrigerant, output hot water temperature is about 85°C.
- the design pressure of 4.25 MPa of the air conditioner as described above is an upper limit, a saturation temperature is about 65°C and an output hot water temperature is about 80°C.
- a refrigerant temperature at a condenser outlet is 10°C.
- WO 2013/058154 A1 discloses an air conditioning apparatus for a vehicle which, by ensuring the necessary amount of dissipated heat in a radiator during a dehumidification cooling operation, makes it possible to reliably ensure that the temperature of air being supplied to a passenger compartment is the set temperature.
- the valve opening degree of a condensing-pressure-regulating means side of a first control valve (24) is made smaller than when the opening degree (SW) is less than the predetermined opening degree.
- WO 2013/058154 A1 discloses a refrigeration cycle device according to the preamble of claim 1.
- a heat pump heating system includes: a refrigerant circuit including a compressor, a radiator, and an expansion member, and an evaporator; a circulation path for circulating a liquid through the radiator to produce a heated liquid; and a heater for dissipating heat of the heated liquid.
- the refrigerant circuit is provided with an internal heat exchanger for transferring heat from a high pressure refrigerant that has released heat in the radiator to a low pressure refrigerant.
- the liquid flowing through the circulation path is cooled in a liquid cooling heat exchanger by means of the high pressure refrigerant flowing out of the internal heat exchanger, before the liquid flows into the radiator.
- US2013192285A1 provides a refrigerator including an evaporator configured to evaporate a coolant and to cool a storage compartment, a compressor configured to compress the coolant evaporated in the evaporator, a condenser configured to condense the coolant compressed in the compressor, a hot line configured to receive condensed coolant, a first capillary tube configured to receive condensed coolant from the hot line, a second capillary tube configured to receive condensed coolant and arranged to allow bypassing of the hot line, a first coolant configured to adjust flow of condensed coolant from the hot line to the first capillary tube and a second coolant adjusting valve configured to control flow of condensed coolant from the condenser to the hot line and the second capillary tube.
- a feed-water temperature to a condenser in a heat pump type hot water supply device is usually similar to an outside air temperature.
- the feed-water temperature is about 50°C or higher when hot water reduced in temperature by thermal dissipation in a hot water storage tank is reheated, or when hot water heated by a condenser is circulated to a heat exchanger for heating bathtub water. If an upper limit of a refrigerant saturation temperature in the condenser is about 65°C, refrigerant at a condenser outlet is brought into a gas-liquid two-phase state or a gas state when the feed-water temperature is high.
- an average density of the refrigerant in the condenser is reduced. Also, a refrigerant enthalpy difference in the condenser is reduced to increase dryness of the refrigerant at an evaporator inlet, and reduce an average density of the refrigerant in the evaporator. Therefore, when the feed-water temperature is high, an amount of refrigerant in the condenser, a refrigerant pipe from the condenser outlet to the evaporator inlet, and the evaporator is reduced, thereby producing a surplus of the refrigerant in the refrigerant circuit.
- the present invention is achieved to solve the problems described above, and has an object to provide a refrigeration cycle device capable of reliably inhibiting an increase in high pressure side refrigerant pressure and liquid compression by a compressor even when a temperature of a heat medium before heating is high.
- a refrigeration cycle device of the invention includes: a compressor configured to compress refrigerant; a first condenser including a refrigerant flow path and a heat medium flow path, the first condenser being configured to condense the refrigerant compressed by the compressor; a second condenser including a refrigerant flow path and a heat medium flow path, the second condenser being configured to further condense the refrigerant having passed through the first condenser; an evaporator configured to evaporate the refrigerant; a heat medium path configured to allow a liquid heat medium subjected to heat exchange with the refrigerant to pass through the second condenser and the first condenser in this order; a high/low pressure heat exchanger including a high pressure portion and a low pressure portion, the high/low pressure heat exchanger being configured to exchange heat between a high pressure refrigerant after heat exchange with the heat medium and a low pressure refrigerant having passed through the evaporator; a second condenser bypass
- a condenser is divided into a first condenser and a second condenser, a second condenser bypass passage for bypassing a refrigerant flow path or a heat medium flow path in the second condenser and a high/low pressure heat exchanger are provided, and when a temperature of a heat medium before heating is high, a flow rate of refrigerant or heat medium bypassing the second condenser is increased to increase a heat exchange rate in the high/low pressure heat exchanger, thereby increasing a redundant refrigerant stored in an evaporator.
- This can reliably inhibit an increase in high pressure side refrigerant pressure and liquid compression by a compressor even when the temperature of the heat medium before heating is high.
- FIG. 1 is a configuration diagram of a refrigeration cycle device according to embodiment 1.
- the embodiment 1 is used merely for a better understanding of the current application, but does not form part of the invention.
- a refrigeration cycle device 1A of this embodiment 1 includes a refrigerant circuit including a compressor 2, first condensers 3A, 3B, a second condenser 4, an expansion valve 5, an evaporator 6, an accumulator 7, and a high/low pressure heat exchanger 8 connected by a refrigerant piping.
- the refrigeration cycle device 1A further includes a heat medium path 9, a second condenser bypass passage 10, a flow path switching valve 11, a blower 12 for blowing air into the evaporator 6, an entry heat medium temperature sensor 13, and a control device 50 for controlling an operation of the refrigeration cycle device 1A.
- the refrigeration cycle device 1A of this embodiment 1 functions as a heat pump for heating a liquid heat medium.
- the heat medium in this embodiment 1 is water, the heat medium in the present invention may be antifreeze, brine, or the like.
- the refrigeration cycle device 1A of this embodiment 1 is used as a hot water supply device, the refrigeration cycle device according to the present invention may be used for heating a heat medium for applications other than hot water supply (such as an indoor heating).
- specific enthalpy [kJ/kg] is simply referred to as enthalpy.
- the two first condensers 3A, 3B have the same configuration and are connected in parallel.
- the first condensers 3A, 3B each include a refrigerant flow path 31 and a heat medium flow path 32.
- the second condenser 4 includes a refrigerant flow path 41 and a heat medium flow path 42.
- the compressor 2 compresses a low pressure refrigerant gas into a high pressure refrigerant gas.
- the high pressure refrigerant gas compressed by the compressor 2 is divided to flow into the refrigerant flow path 31 in the first condenser 3A and the refrigerant flow path 31 in the first condenser 3B.
- the first condensers 3A, 3B function as one condenser. In the present invention, the first condensers 3A, 3B may be integrated.
- the high/low pressure heat exchanger 8 includes a high pressure portion 81 and a low pressure portion 82.
- the high pressure refrigerant having passed through the refrigerant flow path 41 in the second condenser 4 flows into the high pressure portion 81 in the high/low pressure heat exchanger 8.
- the expansion valve 5 is a pressure reducing device for reducing pressure of and expanding the high pressure refrigerant. An opening of the expansion valve 5 is preferably changeable.
- the high pressure refrigerant having passed through the high pressure portion 81 in the high/low pressure heat exchanger 8 is reduced in pressure and expanded by the expansion valve 5 into a low pressure refrigerant.
- the low pressure refrigerant flows into the evaporator 6.
- the low pressure refrigerant having passed through the evaporator 6 flows into the low pressure portion 82 in the high/low pressure heat exchanger 8.
- the evaporator 6 is a heat exchanger for exchanging heat between refrigerant and air.
- the evaporator 6 causes the refrigerant to absorb heat from outside air blown in by the blower 12.
- a heat source of the evaporator 6 in this embodiment 1 is outside air.
- the heat source of the evaporator in the present invention is not limited to the outside air, but may be, for example, waste heat, underground heat, groundwater, solar hot water or the like.
- a fluid cooled by the evaporator may be used for an indoor cooling or the like.
- the high/low pressure heat exchanger 8 exchanges heat between the high pressure refrigerant flowing through the high pressure portion 81, that is, the high pressure refrigerant after heat exchange with the heat medium, and the low pressure refrigerant flowing through the low pressure portion 82, that is, the low pressure refrigerant having passed through the evaporator 6.
- the low pressure refrigerant having passed through the low pressure portion 82 in the high/low pressure heat exchanger 8 flows into the accumulator 7. Out of the refrigerant having flowed into the accumulator 7, a refrigerant liquid is stored in the accumulator 7, while a refrigerant gas flows out of the accumulator 7 and is sucked into the compressor 2.
- the accumulator 7 stores a surplus of the refrigerant liquid in the refrigerant circuit.
- a section before the high pressure refrigerant compressed by the compressor 2 flows into the pressure reducing device is referred to as a "high pressure side”
- a section before the low pressure refrigerant reduced in pressure by the pressure reducing device is sucked into the compressor 2 is referred to as a "low pressure side”.
- the heat medium path 9 allows water to pass through the heat medium flow path 42 in the second condenser 4 and the heat medium flow paths 32 in the first condensers 3A, 3B in this order.
- the heat medium path 9 connects a water inlet 91 and an inlet of the heat medium flow path 42 in the second condenser 4, connects an outlet of the heat medium flow path 42 in the second condenser 4 and inlets of the heat medium flow paths 32 in the first condensers 3A, 3B, and connects outlets of the heat medium flow paths 32 in the first condensers 3A, 3B and a water outlet 92.
- the refrigerant and the water form counter flows in the first condensers 3A, 3B.
- the refrigerant and the water form counter flows.
- the second condenser bypass passage 10 bypasses the heat medium flow path 42 in the second condenser 4.
- the flow path switching valve 11 is a three-way valve.
- the flow path switching valve 11 is provided in a middle of the heat medium path 9 between the water inlet 91 and the inlet of the heat medium flow path 42 in the second condenser 4.
- One end of the second condenser bypass passage 10 is connected to the flow path switching valve 11, and the other end of the second condenser bypass passage 10 is connected in a middle of the heat medium path 9 between the outlet of the heat medium flow path 42 in the second condenser 4 and the inlets of the heat medium flow paths 32 in the first condensers 3A, 3B.
- the flow path switching valve 11 can be switched between a state where all of water having flowed in from the water inlet 91 is allowed to flow to the heat medium flow path 42 in the second condenser 4, and a state where all of water having flowed in from the water inlet 91 is allowed to flow to the second condenser bypass passage 10.
- the flow path switching valve 11 may be able to change a rate of distribution of the water having flowed in from the water inlet 91 to the heat medium flow path 42 in the second condenser 4 and the second condenser bypass passage 10.
- the flow path switching valve 11 corresponds to a flow path controlling element capable of varying a bypass rate that is a flow rate of water flowing through the second condenser bypass passage 10.
- the entry heat medium temperature sensor 13 is provided in the middle of the heat medium path 9 between the water inlet 91 and the flow path switching valve 11.
- the entry heat medium temperature sensor 13 detects a temperature of a heat medium, that is, water before heat exchange with the refrigerant.
- a temperature detected by the entry heat medium temperature sensor 13 is referred to as an "feed-water temperature”.
- the control device 50 is control means for controlling an operation of the refrigeration cycle device 1A.
- the compressor 2, the expansion valve 5, the flow path switching valve 11, the blower 12, and the entry heat medium temperature sensor 13 are electrically connected to the control device 50.
- actuators, sensors, a user interface device, or the like may be further connected to the control device 50.
- the control device 50 has a processor 50a and a memory 50b that stores a control program and data or the like.
- the control device 50 controls operations of the compressor 2, the expansion valve 5, the flow path switching valve 11, and the blower 12 according to the program stored in the memory 50b based on information detected by each sensor, instruction information from the user interface device, or the like, to control the operation of the refrigeration cycle device 1A.
- R32 is used as the refrigerant.
- An advantage of using R32 as the refrigerant will be described later.
- FIG. 2 is a perspective view showing a part of a heat exchanger that constitutes the first condensers 3A, 3B and the second condenser 4.
- a heat exchanger 60 includes one twisted pipe 61 and three refrigerant heat transfer pipes 62, 63, 64.
- An inside of the twisted pipe 61 constitutes a heat medium flow path. Specifically, water flows through the twisted pipe 61.
- An inside of each of the refrigerant heat transfer pipes 62, 63, 64 constitutes a refrigerant flow path. The refrigerant is divided to flow through the three refrigerant heat transfer pipes 62, 63, 64 in parallel.
- the refrigerant heat transfer pipes 62, 63, 64 are hatched for convenience. Specifically, the hatching in Figure 2 does not show a cross section.
- the twisted pipe 61 has three parallel helical grooves 61a, 61b, 61c in an outer periphery thereof.
- the refrigerant heat transfer pipes 62, 63, 64 are fitted in the grooves 61a, 61b, 61c, respectively, and wound into a helical along shapes of the grooves 61a, 61b, 61c.
- Such a configuration can increase a contact heat transfer area between the twisted pipe 61 and the refrigerant heat transfer pipes 62, 63, 64.
- the first condenser 3A, the first condenser 3B, and the second condenser 4 are each constituted by a heat exchanger having substantially the same structure as the heat exchanger 60 described above. Specifically, the first condenser 3A, the first condenser 3B, and the second condenser 4 each include one heat medium flow path and three refrigerant flow paths. In Figure 1 , for simplicity, the heat medium flow path in each of the first condenser 3A, the first condenser 3B, and the second condenser 4 is shown by one line.
- the first condensers 3A, 3B function as one condenser.
- the first condensers 3A, 3B are constituted by two heat exchangers 60 connected in parallel.
- the first condensers 3A, 3B as a whole have two heat medium flow paths and six refrigerant flow paths.
- a sectional area of the refrigerant flow path in the second condenser 4 is desirably smaller than a sectional area of the refrigerant flow path in the first condensers 3A, 3B. The reason therefor will be described later.
- the sectional area of the refrigerant flow path in the condenser is a sum of sectional areas of the plurality of refrigerant flow paths.
- the sectional area of the refrigerant flow path in the first condensers 3A, 3B is a sum of sectional areas of six refrigerant flow paths
- the sectional area of the refrigerant flow path in the second condenser 4 is a sum of sectional areas of three refrigerant flow paths.
- a sectional area of one refrigerant flow path in the first condensers 3A, 3B is equal to a sectional area of one refrigerant flow path in the second condenser 4, in this embodiment 1, the sectional area of the refrigerant flow path in the second condenser 4 is one-half of the sectional area of the refrigerant flow path in the first condensers 3A, 3B.
- the first condenser and the second condenser in the present invention are not limited to the twisted pipe type heat exchanger as described above, but may be a heat exchanger of a different type such as a plate type heat exchanger.
- the numbers of the refrigerant flow paths and the heat medium flow paths are not limited to those in the above example.
- FIG 3 is a configuration diagram of a hot water storage type hot water supply system including the refrigeration cycle device 1A of this embodiment 1 and a tank unit 20.
- a hot water storage tank 21 and a water pump 22 are provided in the tank unit 20.
- the refrigeration cycle device 1A and the hot water storage tank 21 are connected by water channels 23, 24.
- the refrigeration cycle device 1A and the tank unit 20 are connected by electric wiring (not shown).
- One end of the water channel 23 is connected to the water inlet 91 of the refrigeration cycle device 1A.
- the other end of the water channel 23 is connected to a lower part of the hot water storage tank 21 in the tank unit 20.
- a water pump 22 is provided in a middle of the water channel 23 in the tank unit 20.
- One end of the water channel 24 is connected to the water outlet 92 of the refrigeration cycle device 1A.
- the other end of the water channel 24 is connected to an upper part of the hot water storage tank 21 in the tank unit 20.
- the water pump 22 may be placed in the refrigeration cycle device 1A.
- a water supply pipe 25 is further connected to the lower part of the hot water storage tank 21 in the tank unit 20.
- Water supplied from an external water source such as waterworks flows through the water supply pipe 25 into the hot water storage tank 21 and is stored.
- the water from the water supply pipe 25 flows into the hot water storage tank 21, which is always kept filled with water.
- a hot water supplying mixing valve 26 is further provided in the tank unit 20.
- the hot water supplying mixing valve 26 is connected to the upper part of the hot water storage tank 21 by a hot water pipe 27.
- a water supply branch pipe 28 branching off from the water supply pipe 25 is connected to the hot water supplying mixing valve 26.
- One end of a hot water supply pipe 29 is further connected to the hot water supplying mixing valve 26.
- the other end of the hot water supply pipe 29 is connected to a hot water supply terminal such as a tap, a shower, or a bathtub, although not shown.
- the water stored in the hot water storage tank 21 is fed by the water pump 22 through the water channel 23 to the refrigeration cycle device 1A, and heated in the refrigeration cycle device 1A into high temperature hot water.
- the high temperature hot water generated in the refrigeration cycle device 1A returns through the water channel 24 to the tank unit 20, and flows into the hot water storage tank 21 from the upper part.
- hot water is stored in the hot water storage tank 21 so as to form a temperature stratification with a high temperature upper side and a low temperature lower side.
- hot water When hot water is supplied from the hot water supply pipe 29 to the hot water supply terminal, high temperature hot water in the hot water storage tank 21 is supplied through the hot water pipe 27 to the hot water supplying mixing valve 26, and low temperature water is supplied through the water supply branch pipe 28 to the hot water supplying mixing valve 26.
- the high temperature hot water and the low temperature water are mixed by the hot water supplying mixing valve 26, and then supplied through the hot water supply pipe 29 to the hot water supply terminal.
- the hot water supplying mixing valve 26 adjusts a mixing ratio between the high temperature hot water and the low temperature water so as to achieve a hot water supply temperature set by a user.
- a reheating heat exchanger 30 for reheating a bathtub is further provided in the tank unit 20.
- Pipes for circulating bathtub water to the reheating heat exchanger 30, and pipes for switching connection of the water channels 23, 24 from the hot water storage tank 21 to the reheating heat exchanger 30 are provided in the tank unit 20, although not shown.
- the pipes are used to circulate the bathtub water and the high temperature hot water generated in the refrigeration cycle device 1A to the reheating heat exchanger 30 and exchange heat therebetween, thereby increasing a temperature of an inside of the bathtub.
- FIG. 4 is a flowchart showing a control operation in the refrigeration cycle device 1A of this embodiment 1.
- the control device 50 compares a feed-water temperature detected by the entry heat medium temperature sensor 13 with a previously set reference temperature ⁇ . In this embodiment 1, the reference temperature ⁇ is 50°C. If the feed-water temperature is lower than the reference temperature ⁇ in step S1, the control device 50 moves to step S2. In step S2, the refrigeration cycle device 1A performs a low temperature water input operation. On the other hand, if the feed-water temperature is not lower than the reference temperature ⁇ in step S1, the control device 50 moves to step S3. In step S3, the refrigeration cycle device 1A performs a high temperature water input operation.
- the control device 50 controls an operation of the flow path switching valve 11 so that a bypass rate in the high temperature water input operation is larger than a bypass rate in the low temperature water input operation.
- a bypass percentage in the low temperature water input operation is 0%.
- the control device 50 controls the operation of the flow path switching valve 11 so that all of water flowing in from the water inlet 91 flows through the second condenser 4.
- a bypass percentage in the high temperature water input operation is 100%.
- the control device 50 controls the operation of the flow path switching valve 11 so that all of water flowing in from the water inlet 91 flows through the second condenser bypass passage 10 rather than the second condenser 4.
- two reference temperatures may be set to provide hysteresis to switching between the low temperature water input operation and the high temperature water input operation.
- the feed-water temperature in a heat accumulating operation is similar to the outside air temperature.
- the reference temperature ⁇ is higher than the outside air temperature.
- the feed-water temperature may be higher than the reference temperature ⁇ .
- the feed-water temperature may be higher than the reference temperature ⁇ .
- the refrigeration cycle device 1A performs the high temperature water input operation.
- Figure 5 shows the low temperature water input operation of the refrigeration cycle device 1A of this embodiment 1.
- the water having flowed in from the water inlet 91 is heated in the second condenser 4 and then divided into two streams to flow through the first condensers 3A, 3B in parallel and further heated.
- the refrigerant flows out of the compressor 2 and is then divided into two streams to flow through the first condensers 3A, 3B in parallel. Immediately before an inlet of a heat transfer portion in the first condenser 3A, the refrigerant is further divided to flow into three refrigerant flow paths. Similarly, immediately before an inlet of a heat transfer portion in the first condenser 3B, the refrigerant is further divided to flow into the three refrigerant flow paths. In the first condensers 3A, 3B, the refrigerant is partially condensed into a gas-liquid two-phase state. Streams of the refrigerant having passed through the first condensers 3A, 3B merge and then flow to the second condenser 4. Immediately before an inlet of a heat transfer portion in the second condenser 4, the refrigerant is divided to flow into the three refrigerant flow paths. The refrigerant is further condensed in the second condenser 4.
- Figure 6 shows an example of changes in temperature of the refrigerant and the water in the first condensers 3A, 3B and the second condenser 4 in the low temperature water input operation of the refrigeration cycle device 1A of this embodiment 1.
- the abscissa represents enthalpy of the refrigerant
- the ordinate represents temperature.
- a temperature difference at a pinch point where a temperature difference between the refrigerant and the water is minimum is about 3 K.
- a condensation temperature of the refrigerant is 62°C (at saturation pressure of 4.11 MPa)
- a temperature of a refrigerant gas at inlets of the first condensers 3A, 3B is 126°C
- a water temperature at outlets of the first condensers 3A, 3B is 80°C
- a temperature of a refrigerant liquid at an outlet of the second condenser 4 is 12°C.
- hot water of 80°C can be produced at high pressure side pressure of 4.25 MPa or lower that is design pressure for a typical air conditioner.
- specifications of the compressor 2 may be common to those of the air conditioner, thereby reducing cost.
- a water temperature at the outlets of the first condensers 3A, 3B is referred to as an "output hot water temperature”.
- Figure 7 shows a P-h diagram, that is, a Mollier diagram of the low temperature water input operation of the refrigeration cycle device 1A of this embodiment 1.
- a low pressure refrigerant gas is compressed by the compressor 2 from a point G1 to a point A1 into a high pressure refrigerant gas.
- the high pressure refrigerant gas is cooled in the first condensers 3A, 3B from the point A1 to a point B1, and starts to condense during that time.
- the point B1 is a gas-liquid two-phase state.
- the high pressure refrigerant in the gas-liquid two-phase state is further condensed in the second condenser 4 into a supercooled liquid.
- the high pressure refrigerant is changed from the point B1 to the point C1 in the second condenser 4.
- the high pressure refrigerant having flowed out of the second condenser 4 is subjected to heat exchange with the low pressure refrigerant having flowed out of the evaporator 6 and thus cooled in the high/low pressure heat exchanger 8.
- the high pressure refrigerant is changed from the point C1 to a point D1 in the high/low pressure heat exchanger 8.
- the refrigerant in the supercooled liquid state having flowed out of the high/low pressure heat exchanger 8 is expanded and reduced in pressure to a point E1 by the expansion valve 5 into a low pressure refrigerant in the gas-liquid two-phase state.
- the low pressure refrigerant in the gas-liquid two-phase state absorbs heat in the evaporator 6 from the point E1 to a point F1 so as to evaporate.
- Figure 7 shows a case where the low pressure refrigerant at an outlet of the evaporator 6 (point F1) is in the gas-liquid two-phase state, but the low pressure refrigerant at the outlet of the evaporator 6 may be superheated vapor.
- the low pressure refrigerant having flowed out of the evaporator 6 is subjected to heat exchange with the high pressure refrigerant in the high/low pressure heat exchanger 8, thus heated from the point F1 to the point G1, and sucked through the accumulator 7 into the compressor 2.
- FIG. 8 shows an example of a relationship between the outside air temperature and the feed-water temperature in the low temperature water input operation.
- the example of the feed-water temperature of 9°C in Figure 5 corresponds to a case of the outside air temperature of 7°C.
- the feed-water temperature also increases with increasing outside air temperature.
- Figure 9 shows the high temperature water input operation of the refrigeration cycle device 1A of this embodiment 1.
- the water having flowed in from the water inlet 91 passes through the second condenser bypass passage 10 rather than the second condenser 4, and is divided into two streams to flow through the first condensers 3A, 3B in parallel and heated.
- the refrigerant flows along the same path as in the low temperature water input operation.
- heat exchange with water is not performed in the second condenser 4, and thus the refrigerant is not condensed in the second condenser 4.
- Figure 10 shows an example of changes in temperature of the refrigerant and the water in the first condensers 3A, 3B in the high temperature water input operation of the refrigeration cycle device 1A of this embodiment 1.
- the abscissa represents enthalpy of the refrigerant
- the ordinate represents temperature.
- a temperature difference at a pinch point where a temperature difference between the refrigerant and the water is minimum is about 3 K.
- a condensation temperature of the refrigerant is 62°C (at saturation pressure of 4.11 MPa)
- a temperature of a refrigerant gas at the inlets of the first condensers 3A, 3B is 126°C
- a water temperature at the outlets of the first condensers 3A, 3B, that is, an output hot water temperature is 80°C.
- FIG 11 is a P-h diagram of the high temperature water input operation of the refrigeration cycle device 1A of this embodiment 1.
- a low pressure refrigerant gas is compressed by the compressor 2 from a point G2 to a point A2 into a high pressure refrigerant gas.
- the high pressure refrigerant gas is cooled in the first condensers 3A, 3B from the point A2 to a point B2, and starts to condense during that time.
- the point B2 is a gas-liquid two-phase state.
- water does not flow and heat exchange is not performed.
- the refrigerant is not reduced in enthalpy but is reduced in pressure due to pressure loss.
- the refrigerant is changed from the point B2 to the point C2 in the second condenser 4.
- the high pressure refrigerant having flowed out of the second condenser 4 is subjected to heat exchange with the low pressure refrigerant having flowed out of the evaporator 6 and thus cooled in the high/low pressure heat exchanger 8, and further condenses.
- the high pressure refrigerant is changed from the point C2 to the point D2 in the high/low pressure heat exchanger 8.
- Figure 11 shows a case where the high pressure refrigerant at an outlet of the high/low pressure heat exchanger 8 (point D2) is a supercooled liquid, but the high pressure refrigerant at the outlet of the high/low pressure heat exchanger 8 may be in a gas-liquid two-phase state or be a saturation liquid.
- the high pressure refrigerant having flowed out of the high/low pressure heat exchanger 8 is expanded to a point E2 and reduced in pressure by the expansion valve 5 into a low pressure refrigerant in the gas-liquid two-phase state.
- the low pressure refrigerant in the gas-liquid two-phase state absorbs heat in the evaporator 6 from the point E2 to a point F2 so as to evaporate.
- the low pressure refrigerant is also in the gas-liquid two-phase state at the outlet of the evaporator 6 (point F2).
- the low pressure refrigerant in the gas-liquid two-phase state having flowed out of the evaporator 6 is subjected to heat exchange with the high pressure refrigerant in the high/low pressure heat exchanger 8 and thus heated from the point F2 to the point G2, and further evaporates.
- the low pressure refrigerant having flowed out of the evaporator 6 is sucked through the accumulator 7 into the compressor 2.
- a heat exchange rate in the high/low pressure heat exchanger 8 is proportional to a difference between a refrigerant temperature at an inlet of the high pressure portion 81, that is, a refrigerant temperature at an outlet of the second condenser 4, and a refrigerant temperature at an inlet of the low pressure portion 82, that is, a refrigerant temperature at an outlet of the evaporator 6.
- a degree of supercooling of the refrigerant at the outlet of the second condenser 4 is large.
- the degree of supercooling refers to a fall in temperature from a condensation temperature, that is, a saturation temperature.
- the refrigerant in the high temperature water input operation, the refrigerant is not condensed in the second condenser 4, and thus the refrigerant temperature at the inlet of the high pressure portion 81 in the high/low pressure heat exchanger 8 is a temperature reduced from the refrigerant temperature at the outlets of the first condensers 3A, 3B due to the pressure loss in the second condenser 4.
- Average refrigerant dryness from the point B2 to the point C2 of the second condenser 4 in the high temperature water input operation is higher than average refrigerant dryness from the point B1 to the point C1 of the second condenser 4 in the low temperature water input operation.
- an average refrigerant density in the second condenser 4 in the high temperature water input operation is lower than an average refrigerant density in the second condenser 4 in the low temperature water input operation.
- average refrigerant dryness from the point E2 to the point F2 of the evaporator 6 in the high temperature water input operation is higher than average refrigerant dryness from the point E1 to the point F1 of the evaporator 6 in the low temperature water input operation.
- an average refrigerant density in the evaporator 6 in the high temperature water input operation is lower than an average refrigerant density in the evaporator 6 in the low temperature water input operation.
- an amount of the refrigerant required for the second condenser 4 and the evaporator 6 is smaller than in the low temperature water input operation, thereby producing a surplus of the refrigerant in the refrigerant circuit.
- the refrigeration cycle device 1A of this embodiment 1 in the high temperature water input operation, the refrigerant is cooled in the high/low pressure heat exchanger 8 to reduce enthalpy of the refrigerant at the inlet of the evaporator 6. This increases the average refrigerant density in the evaporator 6, thereby allowing the redundant refrigerant to be partially stored in the evaporator 6. Also, in the high temperature water input operation, the redundant refrigerant is also stored in the accumulator 7.
- Figure 12 shows an example of a relationship between positions and temperatures of the refrigerant and the water in the first condensers 3A, 3B and the second condenser 4 of the refrigeration cycle device 1A of this embodiment 1.
- the ordinate represents temperature.
- the abscissa represents a distance ratio from a water inlet of the second condenser 4 when a sum of a length of one heat medium flow path in the first condensers 3A, 3B and a length of one heat medium flow path in the second condenser 4 is one.
- the length of the heat medium flow path is a length of a central axis in a flowing direction of the heat medium flow path.
- An operation condition in the example in Figure 12 is the same as an operation condition in Figure 6 or 10 described above.
- Lp1:Lp2 0.55:0.45, where Lp1 is the length of one heat medium flow path in the first condensers 3A, 3B and Lp2 is the length of one heat medium flow path in the second condenser 4.
- L1:L2 1.10:0.45 ⁇ 2.4:1.0, where L1 is a total length of the heat medium flow paths in the first condensers 3A, 3B and L2 is a total length of the heat medium flow path in the second condenser 4.
- water in the low temperature water input operation at a feed-water temperature of, for example, 9°C, as shown in Figure 12 , water can be heated from 9°C to 50°C by the second condenser 4 and then heated from 50°C to 80°C by the first condensers 3A, 3B.
- water in the high temperature water input operation at a feed-water temperature of, for example, 50°C, water can be heated from 50°C to 80°C by the first condensers 3A, 3B.
- the redundant refrigerant can be stored in large amounts in the evaporator 6 in the high temperature water input operation, an amount of the refrigerant liquid stored in the accumulator 7 can be reduced as compared to a case where the redundant refrigerant is stored only in the accumulator 7. This can reduce the possibility that the compressor 2 is damaged by liquid compression that causes a large amount of the refrigerant liquid to be sucked into the compressor 2. Also, the need for increasing a size of the accumulator 7 is reduced.
- the high pressure refrigerant in the gas-liquid two-phase state having flowed out of the second condenser 4 is cooled in the high/low pressure heat exchanger 8, and thus the high pressure refrigerant at the inlet of the expansion valve 5 can be brought into a state of a supercooled liquid or a state with low dryness.
- a capacity (for example, an aperture) of the expansion valve 5 can be reduced. Specifically, there is no need to significantly change the capacity of the expansion valve 5 between the low temperature water input operation and the high temperature water input operation.
- the refrigerant in the second condenser 4 is in the gas-liquid two-phase state or a gas state, thereby increasing a flow speed as compared to a supercooled liquid.
- the pressure loss of the refrigerant in the second condenser 4 in the high temperature water input operation is larger than the pressure loss of the refrigerant in the second condenser 4 in the low temperature water input operation.
- the refrigerant in the second condenser 4 is reduced in temperature due to the pressure loss. This reduces a temperature difference between the refrigerant and the water, thereby reducing a heat exchange rate at constant pressure.
- the pressure loss of the refrigerant further increases in the second condenser 4 a part where the refrigerant temperature is lower than the feed-water temperature is created.
- the refrigerant draws heat from the water to cause loss of heat. This reduces efficiency of the refrigeration cycle device 1A heating the water.
- the water is not passed through the second condenser 4 in the high temperature water input operation, and thus even if the part where the refrigerant temperature is lower than the feed-water temperature is created in the second condenser 4, the refrigerant can be reliably inhibited from drawing heat from the water, thereby inhibiting loss of heat.
- the sectional area of the refrigerant flow path is smaller and the number of refrigerant flow paths is smaller in the second condenser 4 than in the first condensers 3A, 3B, which is likely to increase the pressure loss of the refrigerant.
- the sectional area of the refrigerant flow path is larger and the number of refrigerant flow paths is larger in the first condensers 3A, 3B than in the second condenser 4, thereby causing smaller refrigerant pressure loss.
- a sufficient heat exchange rate can be ensured without increasing condensation pressure even in the high temperature water input operation at a high feed-water temperature.
- the sectional area of the refrigerant flow path in the second condenser 4 is smaller than the sectional area of the refrigerant flow path in the first condensers 3A, 3B, thereby providing an advantage described below.
- the refrigerant In the low temperature water input operation, the refrigerant is supercooled in the second condenser 4 and the refrigerant temperature at the outlet of the second condenser 4 is reduced to increase an enthalpy difference, thereby increasing COP.
- the refrigerant in the supercooled liquid state has a low flow speed and a lower heat-transfer coefficient than a gas-liquid two-phase part by its nature.
- the sectional area of the refrigerant flow path in the second condenser 4 is smaller than the sectional area of the refrigerant flow path in the first condensers 3A, 3B, thereby inhibiting a reduction in flow speed of the refrigerant in the supercooled liquid state in the second condenser 4 and thus inhibiting a reduction in heat-transfer coefficient.
- heat exchange efficiency in the second condenser 4 can be increased to further increase COP.
- the number of the refrigerant flow paths in the second condenser 4 is smaller than the number of refrigerant flow paths in the first condensers 3A, 3B, thereby more reliably preventing a reduction in heat-transfer coefficient of the refrigerant in the second condenser 4.
- R32 is used as the refrigerant to provide an advantage described below.
- Figure 13 shows a comparison between compressor discharge temperatures of an R410A refrigerant and an R32 refrigerant.
- compressor suction pressure is 0.81 MPa that is saturation vapor pressure of R32 at 0°C
- compressor discharge pressure is 4.25 MPa equal to design pressure of the air conditioner
- a degree of superheat of the refrigerant sucked into the compressor 2 is 0 K
- compressor efficiency is assumed to be 100%.
- the compressor discharge temperature of R410A is 91°C
- the compressor discharge temperature of R32 is 110°C.
- the degree of superheat refers to a rise in temperature from an evaporation temperature, that is, a saturation temperature.
- the surplus of the refrigerant liquid is stored in the accumulator 7 as described above, and thus the degree of superheat of the refrigerant sucked into the compressor 2 is 0 K (or 0 K or less).
- the degree of superheat of the refrigerant sucked into the compressor 2 is 0 K, the R410A refrigerant is reduced in compressor discharge temperature to 91°C as described above.
- R410A is used as the refrigerant, it is difficult to increase the output hot water temperature in the high temperature water input operation.
- the compressor discharge temperature can be increased to 110°C.
- using R32 as the refrigerant can increase the output hot water temperature in the high temperature water input operation to be higher than when using the R410A refrigerant. This can increase a heat storage amount with the same capacity of the hot water storage tank 21.
- the output hot water temperature is about 80°C maximum.
- the hot water storage temperature in the hot water storage tank 21 is also about 80°C maximum.
- An output hot water temperature of a heat pump hot water supply device using CO 2 as the refrigerant is about 90°C maximum, and the hot water storage temperature is also about 90°C maximum.
- the heat storage amount of the heat pump hot water supply device using the CO 2 refrigerant is larger.
- the temperature of hot water supplied from the hot water supply pipe 29 to the hot water supply terminal is about 40 to 60°C, there is no problem in the hot water storage temperature of 80°C.
- the refrigeration cycle device 1A of this embodiment 1 also for the high temperature water input operation at the feed-water temperature of about 50°C or higher, an efficient operation can be performed with the output hot water temperature of 80°C or higher.
- a heat accumulating operation of the high temperature water input operation by the refrigeration cycle device 1A can be performed to efficiently reheat the hot water reduced in temperature in the hot water storage tank 21.
- a critical temperature of CO 2 is about 31°C
- a critical temperature of R32 is about 78°C and high.
- a ratio of the number of refrigerant flow paths in the first condenser to the number of refrigerant flow paths in the second condenser is defined as a ratio between the numbers of refrigerant flow paths.
- the number of the refrigerant flow paths in the first condensers 3A, 3B is six
- the number of the refrigerant flow paths in the second condenser 4 is three
- the ratio between the numbers of refrigerant flow paths is two.
- Figure 14 shows a relationship between the ratio between the numbers of refrigerant flow paths and a magnitude of refrigerant pressure loss in the first condenser.
- the ordinate represents the magnitude of refrigerant pressure loss in the first condenser, which is 100% when the ratio between the numbers of refrigerant flow paths is one.
- the pressure loss of the refrigerant in the first condenser decreases with increasing ratio between the numbers of refrigerant flow paths. However, if the ratio between the numbers of refrigerant flow paths exceeds 2.5, further reducing the pressure loss of the refrigerant is less effective. With too high a ratio between the numbers of refrigerant flow paths, the reduction in refrigerant flow speed reduces the heat-transfer coefficient, which may reduce the heat exchange rate.
- the ratio between the numbers of refrigerant flow paths is desirably about 1.5 to 2.5, and as in this embodiment 1, the ratio between the numbers of refrigerant flow paths is particularly desirably two.
- the first condensers 3A, 3B and the second condenser 4 are constituted by heat exchangers having substantially the same structure. Specifically, two heat exchangers having substantially the same structure as the second condenser 4 are connected in parallel to constitute the first condensers 3A, 3B.
- a water bypass percentage is 0% and all water is heated in the second condenser 4, thereby increasing the output hot water temperature.
- the water bypass percentage does not need to be always 0%, but a small amount of water may be passed through the second condenser bypass passage 10 in the low temperature water input operation.
- the water bypass percentage is 100% and all water flows through the second condenser bypass passage 10, thereby reliably preventing the water from drawing heat from the refrigerant in the second condenser 4.
- the water bypass percentage does not need to be always 100% in the high temperature water input operation, but a small amount of water may be passed through the second condenser 4.
- a first reference temperature and a second reference temperature higher than the first reference temperature may be set, and the control device 50 may control the operation of the flow path switching valve 11 so that the bypass percentage is 0% when the feed-water temperature is lower than the first reference temperature, the bypass percentage is 100% when the feed-water temperature is higher than the second reference temperature, and the bypass percentage continuously or stepwise increases with increasing feed-water temperature when the feed-water temperature is between the first reference temperature and the second reference temperature. This allows smooth transition between the low temperature water input operation and the high temperature water input operation.
- changing a flow rate of air blown by the blower 12 can change the heat exchange rate in the evaporator 6.
- Increasing the flow rate of air blown by the blower 12 increases the heat exchange rate in the evaporator 6, and reducing the flow rate of air blown by the blower 12 reduces the heat exchange rate in the evaporator 6.
- control in the high temperature water input operation, control may be performed so that the flow rate of air blown by the blower 12 is reduced as compared to in the low temperature water input operation to reduce the heat exchange rate in the evaporator 6.
- the control device 50 may perform control to reduce a driving speed of the blower 12 in the high temperature water input operation in step S3 as compared to in the low temperature water input operation in step S2.
- the heat exchange rate in the evaporator 6 is reduced in the high temperature water input operation to reduce an evaporation rate of the refrigerant, thereby increasing an average refrigerant density in the evaporator 6 and thus increasing the redundant refrigerant stored in the evaporator 6.
- the advantage 1 described above can be more significantly exerted.
- the blower 12 corresponds to evaporator heat exchange rate variable means.
- the heat source of the evaporator 6 is a liquid
- a pump for feeding the liquid to the evaporator 6 may be used as the evaporator heat exchange rate variable means.
- FIG. 15 is a configuration diagram of a refrigeration cycle device according to embodiment 2.
- the embodiment 2 is used merely for a better understanding of the current application, but does not form part of the invention
- a refrigeration cycle device 1B of this embodiment 2 shown in Figure 15 includes a high/low pressure heat exchanger bypass passage 14 that bypasses a low pressure portion 82 in a high/low pressure heat exchanger 8, and an on-off valve 15 that opens/closes the high/low pressure heat exchanger bypass passage 14.
- a control device 50 performs control to open the on-off valve 15 in a low temperature water input operation in step S2, and close the on-off valve 15 in a high temperature water input operation in step S3.
- Figure 15 shows the high temperature water input operation.
- the on-off valve 15 is closed, and thus a low pressure refrigerant having flowed out of an evaporator 6 flows through the low pressure portion 82 in the high/low pressure heat exchanger 8 rather than the high/low pressure heat exchanger bypass passage 14.
- Such a high temperature water input operation in this embodiment 2 is similar to the high temperature water input operation in embodiment 1.
- the high pressure refrigerant having flowed out of the second condenser 4 is inhibited from being cooled in the high/low pressure heat exchanger 8, thereby increasing enthalpy of refrigerant at an inlet of the evaporator 6.
- an amount of refrigerant in the evaporator 6 can be reduced in the low temperature water input operation, thereby reducing an amount refrigerant required in a refrigerant circuit in the low temperature water input operation.
- an amount of refrigerant sealed in the refrigerant circuit can be reduced to reduce a surplus of the refrigerant in the high temperature water input operation.
- the on-off valve 15 is closed so as to prevent the refrigerant from flowing in the high temperature water input operation, but a small amount of refrigerant may flow through the on-off valve 15 in the high temperature water input operation.
- an opening of the on-off valve 15 in the high temperature water input operation may be smaller than an opening of the on-off valve 15 in the low temperature water input operation.
- a high/low pressure heat exchanger bypass passage that bypasses the high pressure portion 81 in the high/low pressure heat exchanger 8 and an on-off valve that opens/closes the high/low pressure heat exchanger bypass passage may be provided and controlled as described above. Also in that case, similar advantages as described above can be obtained.
- FIG 16 is a configuration diagram of a refrigeration cycle device according to embodiment 3 of the present invention.
- a refrigeration cycle device 1C of this embodiment 3 shown in Figure 16 includes a second condenser bypass passage 16 and a bypass valve 17 rather than the second condenser bypass passage 10 and the flow path switching valve 11.
- the second condenser bypass passage 16 bypasses a refrigerant flow path 41 in a second condenser 4.
- One end of the second condenser bypass passage 16 is connected to a refrigerant pipe between refrigerant flow paths 31 in first condensers 3A, 3B and the refrigerant flow path 41 in the second condenser 4.
- the other end of the second condenser bypass passage 16 is connected to a refrigerant pipe between an expansion valve 5 and an evaporator 6.
- the bypass valve 17 is provided in a middle of the second condenser bypass passage 16 and opens/closes the second condenser bypass passage 16.
- a high pressure portion 81 in a high/low pressure heat exchanger 8 is connected to a middle of the second condenser bypass passage 16 upstream of the bypass valve 17.
- the bypass valve 17 also functions as a pressure reducing device for reducing pressure of and expanding a high pressure refrigerant.
- the bypass valve 17 preferably has a changeable opening.
- An entry heat medium temperature sensor 13 is provided in a middle of a heat medium path 9 between a water inlet 91 and the second condenser 4.
- a percentage of the refrigerant flowing through the second condenser bypass passage 16 rather than the second condenser 4 is referred to as a "bypass percentage".
- the expansion valve 5 and the bypass valve 17 correspond to a flow path controlling element that can vary a bypass rate that is a flow rate of the refrigerant flowing through the second condenser bypass passage 16.
- the flow rate of high pressure refrigerant flowing through the high pressure portion 81 in the high/low pressure heat exchanger 8 increases with increasing bypass rate, thereby increasing a heat exchange rate in the high/low pressure heat exchanger 8.
- all of water having flowed in from the water inlet 91 flows through the second condenser 4 both in a low temperature water input operation and in a high temperature water input operation.
- the refrigeration cycle device 1C performs the low temperature water input operation when a feed-water temperature is lower than a reference temperature ⁇ , and performs the high temperature water input operation when the feed-water temperature is higher than the reference temperature ⁇ .
- the reference temperature ⁇ is 50°C as in embodiment 1.
- the control device 50 controls operations of the expansion valve 5 and the bypass valve 17 so that a bypass rate in the high temperature water input operation is larger than a bypass rate in the low temperature water input operation. This increases the heat exchange rate in the high/low pressure heat exchanger 8 in the high temperature water input operation.
- the bypass percentage in the low temperature water input operation is 0%, and the bypass percentage in the high temperature water input operation is 100% for description.
- FIG 16 shows the low temperature water input operation of the refrigeration cycle device 1C of this embodiment 3.
- the control device 50 closes the bypass valve 17 to an opening that prevents the refrigerant from flowing. This causes all of refrigerant having passed through the first condensers 3A, 3B to flow through the second condenser 4 and the expansion valve 5 to the evaporator 6.
- the refrigerant does not flow through the high pressure portion 81 in the high/low pressure heat exchanger 8, and thus heat exchange is not performed in the high/low pressure heat exchanger 8.
- Figure 17 is a P-h diagram of the low temperature water input operation of the refrigeration cycle device 1C of this embodiment 3.
- a low pressure refrigerant gas is compressed by the compressor 2 from a point G3 to a point A3 into a high pressure refrigerant gas.
- the high pressure refrigerant gas is cooled in the first condensers 3A, 3B from the point A3 to a point B3, and starts to condense during that time.
- the point B3 is a gas-liquid two-phase state.
- the high pressure refrigerant in the gas-liquid two-phase state is further condensed in the second condenser 4 into a supercooled liquid.
- the high pressure refrigerant is changed from the point B3 to a point C3 in the second condenser 4.
- the high pressure refrigerant having flowed out of the second condenser 4 does not flow through the high/low pressure heat exchanger 8, but is expanded to a point E3 and reduced in pressure by the expansion valve 5 into a low pressure refrigerant in the gas-liquid two-phase state.
- the low pressure refrigerant in the gas-liquid two-phase state absorbs heat in the evaporator 6 from the point E3 to a point G3 so as to evaporate.
- the low pressure refrigerant having flowed out of the evaporator 6 passes through a low pressure portion 82 in the high/low pressure heat exchanger 8, but heat exchange is not performed in the high/low pressure heat exchanger 8, thereby causing no change in enthalpy.
- the low pressure refrigerant having passed through the low pressure portion 82 in the high/low pressure heat exchanger 8 and an accumulator 7 is sucked into a compressor 2.
- FIG 18 shows the high temperature water input operation of the refrigeration cycle device 1C of this embodiment 3.
- the control device 50 opens the bypass valve 17, and closes the expansion valve 5 to an opening that prevents the refrigerant from flowing.
- all of refrigerant having passed through the first condensers 3A, 3B flows through the second condenser bypass passage 16 and the high/low pressure heat exchanger 8 rather than the second condenser 4.
- the high pressure refrigerant having passed through the high pressure portion 81 in the high/low pressure heat exchanger 8 is expanded and reduced in pressure by the bypass valve 17, and flows toward the evaporator 6.
- Figure 19 is a P-h diagram of the low temperature water input operation of the refrigeration cycle device 1C of this embodiment 3.
- the low pressure refrigerant gas is compressed by the compressor 2 from a point G4 to a point A4 into a high pressure refrigerant gas.
- the high pressure refrigerant gas is cooled in the first condensers 3A, 3B from the point A4 to a point B4, and starts to condense during that time.
- the point B4 is a gas-liquid two-phase state.
- the high pressure refrigerant having flowed out of the first condensers 3A, 3B is subjected to heat exchange with the low pressure refrigerant having flowed out of the evaporator 6 and thus cooled in the high/low pressure heat exchanger 8, and further condenses.
- the high pressure refrigerant is changed from the point B4 to a point D4 in the high/low pressure heat exchanger 8.
- Figure 19 shows a case where the high pressure refrigerant at an outlet of the high/low pressure heat exchanger 8 (point D4) is a supercooled liquid, but the high pressure refrigerant at an outlet of the high/low pressure heat exchanger 8 may be in a gas-liquid two-phase state or be a saturation liquid.
- the high pressure refrigerant having flowed out of the high/low pressure heat exchanger 8 is expanded to a point E4 and reduced in pressure by the bypass valve 17 into a low pressure refrigerant in the gas-liquid two-phase state.
- the low pressure refrigerant in the gas-liquid two-phase state absorbs heat in the evaporator 6 from the point E4 to a point F4 so as to evaporate.
- the low pressure refrigerant is also in the gas-liquid two-phase state at the outlet of the evaporator 6 (point F4).
- the low pressure refrigerant in the gas-liquid two-phase state having flowed out of the evaporator 6 is subjected to heat exchange with the high pressure refrigerant in the high/low pressure heat exchanger 8 and thus heated from the point F4 to the point G4, and further evaporates.
- the low pressure refrigerant having flowed out of the evaporator 6 is sucked through the accumulator 7 into the compressor 2.
- the heat exchange rate in the high/low pressure heat exchanger 8 can be increased in the high temperature water input operation, thereby increasing the redundant refrigerant stored in the evaporator 6, and allowing the redundant refrigerant in a refrigerant circuit produced in the high temperature water input operation to be efficiently stored in the evaporator 6.
- the heat exchange in the high/low pressure heat exchanger 8 can be inhibited in the low temperature water input operation.
- the high pressure refrigerant having been subjected to heat exchange with water is inhibited from being cooled in the high/low pressure heat exchanger 8, thereby increasing enthalpy of the refrigerant at an inlet of the evaporator 6.
- an amount of refrigerant in the evaporator 6 can be reduced in the low temperature water input operation, thereby reducing an amount of refrigerant required in a refrigerant circuit in the low temperature water input operation.
- an amount of refrigerant sealed in the refrigerant circuit can be reduced to reduce a surplus of the refrigerant in the high temperature water input operation.
- the refrigerant does not flow through the second condenser 4 in the high temperature water input operation, and thus a part where the refrigerant temperature is lower than the feed-water temperature can be reliably inhibited from being created in the second condenser 4. This can reliably inhibit the refrigerant from drawing heat from water, and thus reliably inhibiting a reduction in efficiency of the refrigeration cycle device 1C heating the water.
- the refrigerant in the gas-liquid two-phase state or a gas state having passed through the first condensers 3A, 3B does not need to flow through the second condenser 4 having a small sectional area of the refrigerant flow path, thereby avoiding a temperature reduction of the refrigerant in the second condenser 4 due to pressure loss.
- the refrigerant does not flow through the second condenser 4 in the high temperature water input operation, thereby further reducing the pressure loss of the refrigerant as compared to in embodiment 1.
- This can more reliably inhibit an increase in condensation pressure in the first condensers 3A, 3B and more reliably ensure a sufficient heat exchange rate even in the high temperature water input operation.
- the refrigerant bypass percentage is 0% and the total flow of the refrigerant flows through the second condenser 4, thereby increasing an output hot water temperature.
- the refrigerant bypass percentage does not need to be always 0% in the low temperature water input operation, but a small portion out of the total flow of the refrigerant may be passed through the second condenser bypass passage 16.
- the refrigerant bypass percentage is 100% and the total flow of the refrigerant flows through the second condenser bypass passage 16, thereby reliably reducing the pressure loss of the refrigerant.
- the refrigerant bypass percentage does not need to be always 100% in the high temperature water input operation, but a small portion out of the total flow of the refrigerant may be passed through the second condenser 4.
- Figure 20 is a configuration diagram of a refrigeration cycle device according to embodiment 4 of the present invention. As shown in Figure 20 , a configuration of a refrigeration cycle device 1D of this embodiment 4 is the same as in embodiment 3, and descriptions thereof will be omitted.
- FIG 21 is a flowchart showing a control operation of the refrigeration cycle device 1D of this embodiment 4.
- the control device 50 compares a feed-water temperature detected by an entry heat medium temperature sensor 13 with a previously set first reference temperature ⁇ . In this embodiment 4, the first reference temperature ⁇ is 30°C. If the feed-water temperature is not higher than the first reference temperature ⁇ in step S11, the control device 50 moves to step S12.
- the refrigeration cycle device 1D performs a low temperature water input operation. This low temperature water input operation is the same as the low temperature water input operation in embodiment 3 ( Figure 16 ).
- the control device 50 opens an expansion valve 5 and closes a bypass valve 17 to an opening that prevents refrigerant from flowing.
- step S13 the control device 50 compares the feed-water temperature with a previously set second reference temperature ⁇ . In this embodiment 4, the second reference temperature ⁇ is 50°C. If the feed-water temperature is not lower than the second reference temperature ⁇ in step S13, the control device 50 moves to step S14.
- step S14 the refrigeration cycle device 1D performs a high temperature water input operation. This high temperature water input operation is the same as the high temperature water input operation in embodiment 3 ( Figure 18 ). Specifically, in step S14, the control device 50 opens the bypass valve 17 and closes the expansion valve 5 to an opening that prevents refrigerant from flowing.
- step S13 If the feed-water temperature is lower than the second reference temperature ⁇ in step S13, that is, if the feed-water temperature is between the first reference temperature ⁇ and the second reference temperature ⁇ , the control device 50 moves to step S15.
- step S15 the refrigeration cycle device 1D performs a middle temperature water input operation.
- Figure 20 shows the middle temperature water input operation of the refrigeration cycle device 1D of this embodiment 4.
- the control device 50 controls the openings of the expansion valve 5 and the bypass valve 17 so that refrigerant having passed through first condensers 3A, 3B is divided to flow through a second condenser 4 and a second condenser bypass passage 16.
- Figure 22 shows a relationship between the feed-water temperature and a bypass percentage in the middle temperature water input operation of the refrigeration cycle device 1D of this embodiment 4.
- the control device 50 controls the openings of the expansion valve 5 and the bypass valve 17 so that the bypass percentage continuously increases with increasing feed-water temperature.
- Rb Grb / Grc + Grb ⁇ 100
- Rb [%] is a bypass percentage
- Grc is a flow rate of the refrigerant flowing through the second condenser 4
- Grb is a flow rate of the refrigerant flowing through the second condenser bypass passage 16.
- the first reference temperature ⁇ is desirably approximately a water temperature at a position where dryness of the refrigerant in the second condenser 4 is zero, that is, a water temperature at a position where the refrigerant is between a gas-liquid two-phase zone and a supercooled zone.
- the water temperature at the position where dryness of the refrigerant is zero is about 30°C.
- the first reference temperature ⁇ is 30°C.
- ⁇ h ⁇ h 1 + Grc / Grc + Grb ⁇ ⁇ h 2
- ⁇ h1 is a refrigerant enthalpy difference in the first condensers 3A, 3B
- ⁇ h2 is a refrigerant enthalpy difference in the second condenser 4
- ⁇ h is an overall refrigerant enthalpy difference in the first condensers 3A, 3B and the second condenser 4.
- the overall refrigerant enthalpy difference of the first condensers 3A, 3B and the second condenser 4 is ⁇ h calculated by the above expression.
- the overall refrigerant enthalpy difference of the first condensers 3A, 3B and the second condenser 4 is ⁇ h1.
- the refrigerant enthalpy difference can be more increased than in a case where the total flow of the refrigerant flows through the second condenser bypass passage 16 when the feed-water temperature is not lower than the first reference temperature ⁇ , thereby further increasing COP.
- the bypass percentage of the refrigerant can be increased with increasing feed-water temperature to increase the heat exchange rate in the high/low pressure heat exchanger 8.
- the enthalpy at the inlet of the evaporator 6 can be more reduced than in embodiment 3, thereby allowing a larger amount of the redundant refrigerant to be stored in the evaporator 6.
- the middle temperature water input operation is performed between the low temperature water input operation and the high temperature water input operation, thereby allowing smooth transition between the operations.
- the openings of the expansion valve 5 and the bypass valve 17 are controlled so that the bypass percentage continuously increases with increasing feed-water temperature in the middle temperature water input operation, but in the present invention, the openings of the expansion valve 5 and the bypass valve 17 may be controlled so that the bypass percentage increases in a stepwise fashion with increasing feed-water temperature in the middle temperature water input operation.
- FIG 23 is a configuration diagram of a refrigeration cycle device according to embodiment 5 of the present invention.
- a liquid receiver 18 for storing a refrigerant liquid is provided in a middle of a second condenser bypass passage 16 between a high pressure portion 81 in a high/low pressure heat exchanger 8 and a bypass valve 17.
- the configuration is the same as in embodiments 3 and 4, and a description thereof will be omitted.
- a control operation of the refrigeration cycle device IE of this embodiment 5 may be the same as in embodiment 3 or as in embodiment 4.
- Figure 23 shows a middle temperature water input operation for distributing a high pressure refrigerant having passed through first condensers 3A, 3B into both a second condenser 4 and a second condenser bypass passage 16.
- Figure 24 is a P-h diagram of the middle temperature water input operation of the refrigeration cycle device IE of this embodiment 5. As shown in Figure 24 , in the middle temperature water input operation in this embodiment 5, a low pressure refrigerant gas is compressed by a compressor 2 from a point G5 to a point A5 into a high pressure refrigerant gas. The high pressure refrigerant gas is cooled in the first condensers 3A, 3B from the point A5 to the point B5, and starts to condense during that time.
- the point B5 is a gas-liquid two-phase state.
- One part of the high pressure refrigerant having flowed out of the first condensers 3A, 3B is further condensed in the second condenser 4 into a supercooled liquid.
- the high pressure refrigerant is changed from the point B5 to a point D5 in the second condenser 4.
- the high pressure refrigerant having flowed out of the second condenser 4 is expanded and reduced in pressure by the expansion valve 5 into a low pressure refrigerant in a gas-liquid two-phase state.
- the other part of the high pressure refrigerant having flowed out of the first condensers 3A, 3B is subjected to heat exchange with the low pressure refrigerant having flowed out of the evaporator 6 and thus cooled into a saturation liquid in the high/low pressure heat exchanger 8.
- the high pressure refrigerant is changed from the point B5 to a point C5 in the high/low pressure heat exchanger 8.
- the refrigerant liquid having flowed out of the high/low pressure heat exchanger 8 is stored in the liquid receiver 18.
- the refrigerant liquid having flowed out of the liquid receiver 18 is expanded and reduced in pressure by the bypass valve 17 into a low pressure refrigerant in a gas-liquid two-phase state.
- the low pressure refrigerant absorbs heat in the evaporator 6 from the point E5 to a point F5 so as to evaporate.
- the low pressure refrigerant is in the gas-liquid two-phase state.
- the low pressure refrigerant in the gas-liquid two-phase state having flowed out of the evaporator 6 is subjected to heat exchange with the high pressure refrigerant in the high/low pressure heat exchanger 8, heated from the point F5 to the point G5, and further evaporates.
- the low pressure refrigerant having flowed out of the evaporator 6 is sucked through the accumulator 7 into the compressor 2.
- the liquid receiver 18 is provided to allow a larger amount of the redundant refrigerant to be stored in the high temperature water input operation or the middle temperature water input operation, thereby more reliably inhibiting an excessive increase in high pressure side refrigerant pressure and liquid compression by the compressor 2. If the liquid receiver 18 is provided as in this embodiment 5, the accumulator 7 does not need to store the redundant refrigerant.
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Description
- The present invention relates to a refrigeration cycle device for heating a heat medium with a condenser.
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Patent Literature 1 below discloses a heat pump type hot water supply device including: a refrigeration cycle circuit including a compressor, a four-way valve, a water heat exchanger (condenser), a pressure reducing device, and an air heat exchanger (evaporator) connected via a refrigerant pipe; and a water circuit including a pump, a water heat exchanger, and a hot water storage tank connected via a water pipe, hot water heated by the water heat exchanger in the refrigeration cycle circuit being stored in the hot water storage tank, wherein R410A or R407C is used as refrigerant for the refrigeration cycle circuit. - For an air conditioner using an R410A refrigerant, high pressure side design pressure is, for example, 4.25 MPa, which is converted into a saturation temperature of about 65°C. Any pressure described herein is absolute pressure. When the R410A refrigerant is used for a refrigeration cycle in a hot water supply device, design pressure needs to be 4.25 MPa as in the air conditioner so that components such as a compressor and a heat exchanger are common to those in the air conditioner.
- In
Patent Literature 1, when condensation pressure is 4.75 MPa, a saturation temperature is about 70°C, and a feed-water temperature is 5°C in use of the R410A refrigerant, output hot water temperature is about 85°C. On the other hand, if the design pressure of 4.25 MPa of the air conditioner as described above is an upper limit, a saturation temperature is about 65°C and an output hot water temperature is about 80°C. In this case, a refrigerant temperature at a condenser outlet is 10°C. -
WO 2013/058154 A1 discloses an air conditioning apparatus for a vehicle which, by ensuring the necessary amount of dissipated heat in a radiator during a dehumidification cooling operation, makes it possible to reliably ensure that the temperature of air being supplied to a passenger compartment is the set temperature. When the calculated opening degree (SW) of an air mixing damper (16) is a predetermined opening degree or greater, the valve opening degree of a condensing-pressure-regulating means side of a first control valve (24) is made smaller than when the opening degree (SW) is less than the predetermined opening degree. This makes it possible to elevate the condensing pressure of a refrigerant in a radiator (15) and increase the temperature of the radiator (15) in a case where the amount of heating in the radiator (15) is insufficient during a cooling operation and during a humidification cooling operation; therefore, the amount of heating needed to heat air being blown into a passenger compartment can be ensured, and it becomes possible to reliably ensure that the temperature of air being supplied to the passenger compartment is the set temperature. Moreover,WO 2013/058154 A1 discloses a refrigeration cycle device according to the preamble ofclaim 1. -
- Patent Literature 1: Japanese Patent Laid-Open No.
2002-89958 - Patent Literature 2: Japanese Patent Laid-Open No.
2002-310498 - Patent Literature 3: Japanese Patent Laid-Open No.
2007-232285 - Patent Literature 4: Japanese Patent Laid-Open No.
2013-44441 - Patent Literature 5: Japanese Patent Laid-Open No.
2009-222246 - Patent Literature 6: Japanese Patent Laid-Open No.
2010-14374 - Patent Literature 7: Japanese Patent Laid-Open No.
2001-82818 -
US2012000236A1 discloses a heat pump heating system includes: a refrigerant circuit including a compressor, a radiator, and an expansion member, and an evaporator; a circulation path for circulating a liquid through the radiator to produce a heated liquid; and a heater for dissipating heat of the heated liquid. The refrigerant circuit is provided with an internal heat exchanger for transferring heat from a high pressure refrigerant that has released heat in the radiator to a low pressure refrigerant. The liquid flowing through the circulation path is cooled in a liquid cooling heat exchanger by means of the high pressure refrigerant flowing out of the internal heat exchanger, before the liquid flows into the radiator. -
US2013192285A1 provides a refrigerator including an evaporator configured to evaporate a coolant and to cool a storage compartment, a compressor configured to compress the coolant evaporated in the evaporator, a condenser configured to condense the coolant compressed in the compressor, a hot line configured to receive condensed coolant, a first capillary tube configured to receive condensed coolant from the hot line, a second capillary tube configured to receive condensed coolant and arranged to allow bypassing of the hot line, a first coolant configured to adjust flow of condensed coolant from the hot line to the first capillary tube and a second coolant adjusting valve configured to control flow of condensed coolant from the condenser to the hot line and the second capillary tube. - A feed-water temperature to a condenser in a heat pump type hot water supply device is usually similar to an outside air temperature. However, the feed-water temperature is about 50°C or higher when hot water reduced in temperature by thermal dissipation in a hot water storage tank is reheated, or when hot water heated by a condenser is circulated to a heat exchanger for heating bathtub water. If an upper limit of a refrigerant saturation temperature in the condenser is about 65°C, refrigerant at a condenser outlet is brought into a gas-liquid two-phase state or a gas state when the feed-water temperature is high. If the refrigerant at the condenser outlet is brought into the gas-liquid two-phase state or the gas state, an average density of the refrigerant in the condenser is reduced. Also, a refrigerant enthalpy difference in the condenser is reduced to increase dryness of the refrigerant at an evaporator inlet, and reduce an average density of the refrigerant in the evaporator. Therefore, when the feed-water temperature is high, an amount of refrigerant in the condenser, a refrigerant pipe from the condenser outlet to the evaporator inlet, and the evaporator is reduced, thereby producing a surplus of the refrigerant in the refrigerant circuit. This increases high pressure side refrigerant pressure. Also, if all of the redundant refrigerant liquid is stored in an accumulator, an overflow of the accumulator may cause the refrigerant liquid to be sucked into the compressor, leading to liquid compression. Thus, a size of the accumulator needs to be increased.
- The present invention is achieved to solve the problems described above, and has an object to provide a refrigeration cycle device capable of reliably inhibiting an increase in high pressure side refrigerant pressure and liquid compression by a compressor even when a temperature of a heat medium before heating is high.
- The object of the present invention is solved by
claim 1. Advantageous embodiments are described by the dependent claims. - A refrigeration cycle device of the invention includes: a compressor configured to compress refrigerant; a first condenser including a refrigerant flow path and a heat medium flow path, the first condenser being configured to condense the refrigerant compressed by the compressor; a second condenser including a refrigerant flow path and a heat medium flow path, the second condenser being configured to further condense the refrigerant having passed through the first condenser; an evaporator configured to evaporate the refrigerant; a heat medium path configured to allow a liquid heat medium subjected to heat exchange with the refrigerant to pass through the second condenser and the first condenser in this order; a high/low pressure heat exchanger including a high pressure portion and a low pressure portion, the high/low pressure heat exchanger being configured to exchange heat between a high pressure refrigerant after heat exchange with the heat medium and a low pressure refrigerant having passed through the evaporator; a second condenser bypass passage configured to bypass the refrigerant flow path or the heat medium flow path in the second condenser; a flow path controlling element capable of varying a bypass rate that is a flow rate of the refrigerant or the heat medium flowing through the second condenser bypass passage; and control means for controlling an operation of the flow path controlling element so that the bypass rate becomes, when an entry heat medium temperature that is a temperature of the heat medium before heat exchange with the refrigerant is higher than a reference temperature, larger than in a case where the entry heat medium temperature is lower than the reference temperature, so as to increase a heat exchange rate in the high/low pressure heat exchanger Accordingly, below introduced
embodiments - According to the refrigeration cycle device of the present invention, a condenser is divided into a first condenser and a second condenser, a second condenser bypass passage for bypassing a refrigerant flow path or a heat medium flow path in the second condenser and a high/low pressure heat exchanger are provided, and when a temperature of a heat medium before heating is high, a flow rate of refrigerant or heat medium bypassing the second condenser is increased to increase a heat exchange rate in the high/low pressure heat exchanger, thereby increasing a redundant refrigerant stored in an evaporator. This can reliably inhibit an increase in high pressure side refrigerant pressure and liquid compression by a compressor even when the temperature of the heat medium before heating is high.
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Figure 1 is a configuration diagram of a refrigeration cycle device according toembodiment 1 . -
Figure 2 is a perspective view showing a part of a heat exchanger that constitutes a first condensers and a second condenser. -
Figure 3 is a configuration diagram of a hot water storage type hot water supply system including the refrigeration cycle device ofembodiment 1 and a tank unit. -
Figure 4 is a flowchart showing a control operation in the refrigeration cycle device ofembodiment 1. -
Figure 5 shows a low temperature water input operation of the refrigeration cycle device ofembodiment 1. -
Figure 6 shows an example of changes in temperature of refrigerant and water in the first condensers and the second condenser in the low temperature water input operation of the refrigeration cycle device ofembodiment 1. -
Figure 7 shows a P-h diagram of the low temperature water input operation of the refrigeration cycle device ofembodiment 1. -
Figure 8 shows an example of a relationship between an outside air temperature and a feed-water temperature in the low temperature water input operation. -
Figure 9 shows a high temperature water input operation of the refrigeration cycle device ofembodiment 1. -
Figure 10 shows an example of changes in temperature of refrigerant and water in the first condensers in the high temperature water input operation of the refrigeration cycle device ofembodiment 1. -
Figure 11 is a P-h diagram of the high temperature water input operation of the refrigeration cycle device ofembodiment 1. -
Figure 12 shows an example of a relationship between positions and temperatures of refrigerant and water in the first condensers and the second condenser of the refrigeration cycle device ofembodiment 1. -
Figure 13 shows a comparison between compressor discharge temperatures of an R410A refrigerant and an R32 refrigerant. -
Figure 14 shows a relationship between a ratio between the numbers of refrigerant flow paths and a magnitude of refrigerant pressure loss in the first condenser. -
Figure 15 is a configuration diagram of a refrigeration cycle device according toembodiment 2. -
Figure 16 shows a low temperature water input operation of a refrigeration cycle device according toembodiment 3 of the present invention. -
Figure 17 is a P-h diagram of the low temperature water input operation of the refrigeration cycle device ofembodiment 3. -
Figure 18 shows a high temperature water input operation of the refrigeration cycle device ofembodiment 3. -
Figure 19 is a P-h diagram of the low temperature water input operation of the refrigeration cycle device ofembodiment 3. -
Figure 20 shows a middle temperature water input operation of a refrigeration cycle device according toembodiment 4 of the present invention. -
Figure 21 is a flowchart showing a control operation of the refrigeration cycle device ofembodiment 4. -
Figure 22 shows a relationship between a feed-water temperature and a bypass percentage in the middle temperature water input operation of the refrigeration cycle device ofembodiment 4. -
Figure 23 is a configuration diagram of a refrigeration cycle device according toembodiment 5 of the present invention. -
Figure 24 is a P-h diagram of a middle temperature water input operation of the refrigeration cycle device ofembodiment 5. - Now, with reference to the drawings, embodiments of the present invention will be described. Throughout the drawings, like components are denoted by like reference numerals, and overlapping descriptions will be omitted. The present invention includes any combinations of embodiments described below.
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Figure 1 is a configuration diagram of a refrigeration cycle device according toembodiment 1. Theembodiment 1 is used merely for a better understanding of the current application, but does not form part of the invention. As shown inFigure 1 , arefrigeration cycle device 1A of thisembodiment 1 includes a refrigerant circuit including acompressor 2,first condensers second condenser 4, anexpansion valve 5, anevaporator 6, anaccumulator 7, and a high/lowpressure heat exchanger 8 connected by a refrigerant piping. Therefrigeration cycle device 1A further includes aheat medium path 9, a secondcondenser bypass passage 10, a flowpath switching valve 11, ablower 12 for blowing air into theevaporator 6, an entry heatmedium temperature sensor 13, and acontrol device 50 for controlling an operation of therefrigeration cycle device 1A. Therefrigeration cycle device 1A of thisembodiment 1 functions as a heat pump for heating a liquid heat medium. Although the heat medium in thisembodiment 1 is water, the heat medium in the present invention may be antifreeze, brine, or the like. Although therefrigeration cycle device 1A of thisembodiment 1 is used as a hot water supply device, the refrigeration cycle device according to the present invention may be used for heating a heat medium for applications other than hot water supply (such as an indoor heating). In the description below, for simplicity of description, specific enthalpy [kJ/kg] is simply referred to as enthalpy. - The two
first condensers first condensers refrigerant flow path 31 and a heatmedium flow path 32. Thesecond condenser 4 includes arefrigerant flow path 41 and a heatmedium flow path 42. Thecompressor 2 compresses a low pressure refrigerant gas into a high pressure refrigerant gas. The high pressure refrigerant gas compressed by thecompressor 2 is divided to flow into therefrigerant flow path 31 in thefirst condenser 3A and therefrigerant flow path 31 in thefirst condenser 3B. Streams of the high pressure refrigerant having passed through thefirst condensers refrigerant flow path 41 in thesecond condenser 4. Thefirst condensers first condensers - The high/low
pressure heat exchanger 8 includes ahigh pressure portion 81 and alow pressure portion 82. The high pressure refrigerant having passed through therefrigerant flow path 41 in thesecond condenser 4 flows into thehigh pressure portion 81 in the high/lowpressure heat exchanger 8. Theexpansion valve 5 is a pressure reducing device for reducing pressure of and expanding the high pressure refrigerant. An opening of theexpansion valve 5 is preferably changeable. The high pressure refrigerant having passed through thehigh pressure portion 81 in the high/lowpressure heat exchanger 8 is reduced in pressure and expanded by theexpansion valve 5 into a low pressure refrigerant. The low pressure refrigerant flows into theevaporator 6. The low pressure refrigerant having passed through theevaporator 6 flows into thelow pressure portion 82 in the high/lowpressure heat exchanger 8. - The
evaporator 6 is a heat exchanger for exchanging heat between refrigerant and air. Theevaporator 6 causes the refrigerant to absorb heat from outside air blown in by theblower 12. A heat source of theevaporator 6 in thisembodiment 1 is outside air. However, the heat source of the evaporator in the present invention is not limited to the outside air, but may be, for example, waste heat, underground heat, groundwater, solar hot water or the like. Also, in the present invention, a fluid cooled by the evaporator may be used for an indoor cooling or the like. - The high/low
pressure heat exchanger 8 exchanges heat between the high pressure refrigerant flowing through thehigh pressure portion 81, that is, the high pressure refrigerant after heat exchange with the heat medium, and the low pressure refrigerant flowing through thelow pressure portion 82, that is, the low pressure refrigerant having passed through theevaporator 6. The low pressure refrigerant having passed through thelow pressure portion 82 in the high/lowpressure heat exchanger 8 flows into theaccumulator 7. Out of the refrigerant having flowed into theaccumulator 7, a refrigerant liquid is stored in theaccumulator 7, while a refrigerant gas flows out of theaccumulator 7 and is sucked into thecompressor 2. As such, theaccumulator 7 stores a surplus of the refrigerant liquid in the refrigerant circuit. In the refrigerant circuit as described above, generally, a section before the high pressure refrigerant compressed by thecompressor 2 flows into the pressure reducing device is referred to as a "high pressure side", and a section before the low pressure refrigerant reduced in pressure by the pressure reducing device is sucked into thecompressor 2 is referred to as a "low pressure side". - The
heat medium path 9 allows water to pass through the heatmedium flow path 42 in thesecond condenser 4 and the heatmedium flow paths 32 in thefirst condensers heat medium path 9 connects awater inlet 91 and an inlet of the heatmedium flow path 42 in thesecond condenser 4, connects an outlet of the heatmedium flow path 42 in thesecond condenser 4 and inlets of the heatmedium flow paths 32 in thefirst condensers medium flow paths 32 in thefirst condensers water outlet 92. In thefirst condensers second condenser 4, the refrigerant and the water form counter flows. - The second
condenser bypass passage 10 bypasses the heatmedium flow path 42 in thesecond condenser 4. The flowpath switching valve 11 is a three-way valve. The flowpath switching valve 11 is provided in a middle of theheat medium path 9 between thewater inlet 91 and the inlet of the heatmedium flow path 42 in thesecond condenser 4. One end of the secondcondenser bypass passage 10 is connected to the flowpath switching valve 11, and the other end of the secondcondenser bypass passage 10 is connected in a middle of theheat medium path 9 between the outlet of the heatmedium flow path 42 in thesecond condenser 4 and the inlets of the heatmedium flow paths 32 in thefirst condensers - The flow
path switching valve 11 can be switched between a state where all of water having flowed in from thewater inlet 91 is allowed to flow to the heatmedium flow path 42 in thesecond condenser 4, and a state where all of water having flowed in from thewater inlet 91 is allowed to flow to the secondcondenser bypass passage 10. The flowpath switching valve 11 may be able to change a rate of distribution of the water having flowed in from thewater inlet 91 to the heatmedium flow path 42 in thesecond condenser 4 and the secondcondenser bypass passage 10. In thisembodiment 1, out of the total flow of water flowing in from thewater inlet 91, a percentage of water flowing through the secondcondenser bypass passage 10 rather than thesecond condenser 4 is referred to as a "bypass percentage". In thisembodiment 1, the flowpath switching valve 11 corresponds to a flow path controlling element capable of varying a bypass rate that is a flow rate of water flowing through the secondcondenser bypass passage 10. - The entry heat
medium temperature sensor 13 is provided in the middle of theheat medium path 9 between thewater inlet 91 and the flowpath switching valve 11. The entry heatmedium temperature sensor 13 detects a temperature of a heat medium, that is, water before heat exchange with the refrigerant. Hereinafter, a temperature detected by the entry heatmedium temperature sensor 13 is referred to as an "feed-water temperature". - The
control device 50 is control means for controlling an operation of therefrigeration cycle device 1A. Thecompressor 2, theexpansion valve 5, the flowpath switching valve 11, theblower 12, and the entry heatmedium temperature sensor 13 are electrically connected to thecontrol device 50. Besides, actuators, sensors, a user interface device, or the like may be further connected to thecontrol device 50. Thecontrol device 50 has aprocessor 50a and amemory 50b that stores a control program and data or the like. Thecontrol device 50 controls operations of thecompressor 2, theexpansion valve 5, the flowpath switching valve 11, and theblower 12 according to the program stored in thememory 50b based on information detected by each sensor, instruction information from the user interface device, or the like, to control the operation of therefrigeration cycle device 1A. - In this
embodiment 1, R32 is used as the refrigerant. An advantage of using R32 as the refrigerant will be described later. -
Figure 2 is a perspective view showing a part of a heat exchanger that constitutes thefirst condensers second condenser 4. As shown inFigure 2 , aheat exchanger 60 includes one twistedpipe 61 and three refrigerantheat transfer pipes pipe 61 constitutes a heat medium flow path. Specifically, water flows through the twistedpipe 61. An inside of each of the refrigerantheat transfer pipes heat transfer pipes Figure 2 , for easy distinction among the refrigerantheat transfer pipes heat transfer pipes Figure 2 does not show a cross section. Thetwisted pipe 61 has three parallelhelical grooves heat transfer pipes grooves grooves twisted pipe 61 and the refrigerantheat transfer pipes - The
first condenser 3A, thefirst condenser 3B, and thesecond condenser 4 are each constituted by a heat exchanger having substantially the same structure as theheat exchanger 60 described above. Specifically, thefirst condenser 3A, thefirst condenser 3B, and thesecond condenser 4 each include one heat medium flow path and three refrigerant flow paths. InFigure 1 , for simplicity, the heat medium flow path in each of thefirst condenser 3A, thefirst condenser 3B, and thesecond condenser 4 is shown by one line. - As described above, the
first condensers first condensers heat exchangers 60 connected in parallel. Thus, thefirst condensers second condenser 4 is desirably smaller than a sectional area of the refrigerant flow path in thefirst condensers first condensers second condenser 4 is a sum of sectional areas of three refrigerant flow paths. If a sectional area of one refrigerant flow path in thefirst condensers second condenser 4, in thisembodiment 1, the sectional area of the refrigerant flow path in thesecond condenser 4 is one-half of the sectional area of the refrigerant flow path in thefirst condensers - The first condenser and the second condenser in the present invention are not limited to the twisted pipe type heat exchanger as described above, but may be a heat exchanger of a different type such as a plate type heat exchanger. The numbers of the refrigerant flow paths and the heat medium flow paths are not limited to those in the above example.
-
Figure 3 is a configuration diagram of a hot water storage type hot water supply system including therefrigeration cycle device 1A of thisembodiment 1 and atank unit 20. As shown inFigure 3 , a hotwater storage tank 21 and awater pump 22 are provided in thetank unit 20. Therefrigeration cycle device 1A and the hotwater storage tank 21 are connected bywater channels refrigeration cycle device 1A and thetank unit 20 are connected by electric wiring (not shown). One end of thewater channel 23 is connected to thewater inlet 91 of therefrigeration cycle device 1A. The other end of thewater channel 23 is connected to a lower part of the hotwater storage tank 21 in thetank unit 20. Awater pump 22 is provided in a middle of thewater channel 23 in thetank unit 20. One end of thewater channel 24 is connected to thewater outlet 92 of therefrigeration cycle device 1A. The other end of thewater channel 24 is connected to an upper part of the hotwater storage tank 21 in thetank unit 20. Instead of the shown configuration, thewater pump 22 may be placed in therefrigeration cycle device 1A. - A
water supply pipe 25 is further connected to the lower part of the hotwater storage tank 21 in thetank unit 20. Water supplied from an external water source such as waterworks flows through thewater supply pipe 25 into the hotwater storage tank 21 and is stored. The water from thewater supply pipe 25 flows into the hotwater storage tank 21, which is always kept filled with water. A hot water supplying mixingvalve 26 is further provided in thetank unit 20. The hot water supplying mixingvalve 26 is connected to the upper part of the hotwater storage tank 21 by ahot water pipe 27. Also, a watersupply branch pipe 28 branching off from thewater supply pipe 25 is connected to the hot water supplying mixingvalve 26. One end of a hotwater supply pipe 29 is further connected to the hot water supplying mixingvalve 26. The other end of the hotwater supply pipe 29 is connected to a hot water supply terminal such as a tap, a shower, or a bathtub, although not shown. - In a heat accumulating operation for increasing a heat storage amount of the hot
water storage tank 21, the water stored in the hotwater storage tank 21 is fed by thewater pump 22 through thewater channel 23 to therefrigeration cycle device 1A, and heated in therefrigeration cycle device 1A into high temperature hot water. The high temperature hot water generated in therefrigeration cycle device 1A returns through thewater channel 24 to thetank unit 20, and flows into the hotwater storage tank 21 from the upper part. By the heat accumulating operation, hot water is stored in the hotwater storage tank 21 so as to form a temperature stratification with a high temperature upper side and a low temperature lower side. - When hot water is supplied from the hot
water supply pipe 29 to the hot water supply terminal, high temperature hot water in the hotwater storage tank 21 is supplied through thehot water pipe 27 to the hot water supplying mixingvalve 26, and low temperature water is supplied through the watersupply branch pipe 28 to the hot water supplying mixingvalve 26. The high temperature hot water and the low temperature water are mixed by the hot water supplying mixingvalve 26, and then supplied through the hotwater supply pipe 29 to the hot water supply terminal. The hot water supplying mixingvalve 26 adjusts a mixing ratio between the high temperature hot water and the low temperature water so as to achieve a hot water supply temperature set by a user. - A reheating
heat exchanger 30 for reheating a bathtub is further provided in thetank unit 20. Pipes for circulating bathtub water to the reheatingheat exchanger 30, and pipes for switching connection of thewater channels water storage tank 21 to the reheatingheat exchanger 30 are provided in thetank unit 20, although not shown. In a bathtub reheating operation, the pipes are used to circulate the bathtub water and the high temperature hot water generated in therefrigeration cycle device 1A to the reheatingheat exchanger 30 and exchange heat therebetween, thereby increasing a temperature of an inside of the bathtub. -
Figure 4 is a flowchart showing a control operation in therefrigeration cycle device 1A of thisembodiment 1. In step S1 inFigure 4 , thecontrol device 50 compares a feed-water temperature detected by the entry heatmedium temperature sensor 13 with a previously set reference temperature α. In thisembodiment 1, the reference temperature α is 50°C. If the feed-water temperature is lower than the reference temperature α in step S1, thecontrol device 50 moves to step S2. In step S2, therefrigeration cycle device 1A performs a low temperature water input operation. On the other hand, if the feed-water temperature is not lower than the reference temperature α in step S1, thecontrol device 50 moves to step S3. In step S3, therefrigeration cycle device 1A performs a high temperature water input operation. Thecontrol device 50 controls an operation of the flowpath switching valve 11 so that a bypass rate in the high temperature water input operation is larger than a bypass rate in the low temperature water input operation. In thisembodiment 1, a bypass percentage in the low temperature water input operation is 0%. Specifically, in step S2, thecontrol device 50 controls the operation of the flowpath switching valve 11 so that all of water flowing in from thewater inlet 91 flows through thesecond condenser 4. In thisembodiment 1, a bypass percentage in the high temperature water input operation is 100%. Specifically, in step S3, thecontrol device 50 controls the operation of the flowpath switching valve 11 so that all of water flowing in from thewater inlet 91 flows through the secondcondenser bypass passage 10 rather than thesecond condenser 4. - In order to prevent frequent switching between the low temperature water input operation and the high temperature water input operation when the feed-water temperature is close to the reference temperature α, two reference temperatures may be set to provide hysteresis to switching between the low temperature water input operation and the high temperature water input operation.
- If the low temperature water supplied from the
water supply pipe 25 is located on a lower side in the hotwater storage tank 21, the feed-water temperature in a heat accumulating operation is similar to the outside air temperature. The reference temperature α is higher than the outside air temperature. Thus, in the heat accumulating operation when the low temperature water supplied from thewater supply pipe 25 is located on the lower side in the hotwater storage tank 21, the feed-water temperature is lower than the reference temperature α, and thus therefrigeration cycle device 1A performs the low temperature water input operation. - On the other hand, in a heat accumulating operation for reheating hot water in the hot
water storage tank 21 reduced in temperature by thermal dissipation or the like, the feed-water temperature may be higher than the reference temperature α. Also in the bathtub reheating operation, the feed-water temperature may be higher than the reference temperature α. In such cases, therefrigeration cycle device 1A performs the high temperature water input operation. -
Figure 5 shows the low temperature water input operation of therefrigeration cycle device 1A of thisembodiment 1. In the low temperature water input operation, the water having flowed in from thewater inlet 91 is heated in thesecond condenser 4 and then divided into two streams to flow through thefirst condensers - The refrigerant flows out of the
compressor 2 and is then divided into two streams to flow through thefirst condensers first condenser 3A, the refrigerant is further divided to flow into three refrigerant flow paths. Similarly, immediately before an inlet of a heat transfer portion in thefirst condenser 3B, the refrigerant is further divided to flow into the three refrigerant flow paths. In thefirst condensers first condensers second condenser 4. Immediately before an inlet of a heat transfer portion in thesecond condenser 4, the refrigerant is divided to flow into the three refrigerant flow paths. The refrigerant is further condensed in thesecond condenser 4. -
Figure 6 shows an example of changes in temperature of the refrigerant and the water in thefirst condensers second condenser 4 in the low temperature water input operation of therefrigeration cycle device 1A of thisembodiment 1. InFigure 6 , the abscissa represents enthalpy of the refrigerant, and the ordinate represents temperature. In this example, a temperature difference at a pinch point where a temperature difference between the refrigerant and the water is minimum is about 3 K. When a feed-water temperature is 9°C, a condensation temperature of the refrigerant is 62°C (at saturation pressure of 4.11 MPa), and a temperature of a refrigerant gas at inlets of thefirst condensers first condensers second condenser 4 is 12°C. As such, with therefrigeration cycle device 1A of thisembodiment 1, hot water of 80°C can be produced at high pressure side pressure of 4.25 MPa or lower that is design pressure for a typical air conditioner. Thus, specifications of thecompressor 2 may be common to those of the air conditioner, thereby reducing cost. In the description below, a water temperature at the outlets of thefirst condensers -
Figure 7 shows a P-h diagram, that is, a Mollier diagram of the low temperature water input operation of therefrigeration cycle device 1A of thisembodiment 1. As shown inFigure 7 , in the low temperature water input operation, a low pressure refrigerant gas is compressed by thecompressor 2 from a point G1 to a point A1 into a high pressure refrigerant gas. The high pressure refrigerant gas is cooled in thefirst condensers second condenser 4 into a supercooled liquid. Specifically, the high pressure refrigerant is changed from the point B1 to the point C1 in thesecond condenser 4. The high pressure refrigerant having flowed out of thesecond condenser 4 is subjected to heat exchange with the low pressure refrigerant having flowed out of theevaporator 6 and thus cooled in the high/lowpressure heat exchanger 8. Specifically, the high pressure refrigerant is changed from the point C1 to a point D1 in the high/lowpressure heat exchanger 8. The refrigerant in the supercooled liquid state having flowed out of the high/lowpressure heat exchanger 8 is expanded and reduced in pressure to a point E1 by theexpansion valve 5 into a low pressure refrigerant in the gas-liquid two-phase state. The low pressure refrigerant in the gas-liquid two-phase state absorbs heat in theevaporator 6 from the point E1 to a point F1 so as to evaporate.Figure 7 shows a case where the low pressure refrigerant at an outlet of the evaporator 6 (point F1) is in the gas-liquid two-phase state, but the low pressure refrigerant at the outlet of theevaporator 6 may be superheated vapor. The low pressure refrigerant having flowed out of theevaporator 6 is subjected to heat exchange with the high pressure refrigerant in the high/lowpressure heat exchanger 8, thus heated from the point F1 to the point G1, and sucked through theaccumulator 7 into thecompressor 2. - In the low temperature water input operation, the refrigerant is supercooled to a temperature close to the feed-water temperature, and thus an enthalpy difference of the refrigerant is increased, thereby increasing COP of the
refrigeration cycle device 1A.Figure 8 shows an example of a relationship between the outside air temperature and the feed-water temperature in the low temperature water input operation. The example of the feed-water temperature of 9°C inFigure 5 corresponds to a case of the outside air temperature of 7°C. The feed-water temperature also increases with increasing outside air temperature. -
Figure 9 shows the high temperature water input operation of therefrigeration cycle device 1A of thisembodiment 1. In the high temperature water input operation, the water having flowed in from thewater inlet 91 passes through the secondcondenser bypass passage 10 rather than thesecond condenser 4, and is divided into two streams to flow through thefirst condensers second condenser 4, and thus the refrigerant is not condensed in thesecond condenser 4. -
Figure 10 shows an example of changes in temperature of the refrigerant and the water in thefirst condensers refrigeration cycle device 1A of thisembodiment 1. InFigure 10 , the abscissa represents enthalpy of the refrigerant, and the ordinate represents temperature. In this example, a temperature difference at a pinch point where a temperature difference between the refrigerant and the water is minimum is about 3 K. When a feed-water temperature is 50°C, a condensation temperature of the refrigerant is 62°C (at saturation pressure of 4.11 MPa), and a temperature of a refrigerant gas at the inlets of thefirst condensers first condensers -
Figure 11 is a P-h diagram of the high temperature water input operation of therefrigeration cycle device 1A of thisembodiment 1. As shown inFigure 11 , in the high temperature water input operation, a low pressure refrigerant gas is compressed by thecompressor 2 from a point G2 to a point A2 into a high pressure refrigerant gas. The high pressure refrigerant gas is cooled in thefirst condensers second condenser 4, water does not flow and heat exchange is not performed. Thus, in thesecond condenser 4, the refrigerant is not reduced in enthalpy but is reduced in pressure due to pressure loss. Specifically, the refrigerant is changed from the point B2 to the point C2 in thesecond condenser 4. The high pressure refrigerant having flowed out of thesecond condenser 4 is subjected to heat exchange with the low pressure refrigerant having flowed out of theevaporator 6 and thus cooled in the high/lowpressure heat exchanger 8, and further condenses. Specifically, the high pressure refrigerant is changed from the point C2 to the point D2 in the high/lowpressure heat exchanger 8.Figure 11 shows a case where the high pressure refrigerant at an outlet of the high/low pressure heat exchanger 8 (point D2) is a supercooled liquid, but the high pressure refrigerant at the outlet of the high/lowpressure heat exchanger 8 may be in a gas-liquid two-phase state or be a saturation liquid. The high pressure refrigerant having flowed out of the high/lowpressure heat exchanger 8 is expanded to a point E2 and reduced in pressure by theexpansion valve 5 into a low pressure refrigerant in the gas-liquid two-phase state. The low pressure refrigerant in the gas-liquid two-phase state absorbs heat in theevaporator 6 from the point E2 to a point F2 so as to evaporate. The low pressure refrigerant is also in the gas-liquid two-phase state at the outlet of the evaporator 6 (point F2). The low pressure refrigerant in the gas-liquid two-phase state having flowed out of theevaporator 6 is subjected to heat exchange with the high pressure refrigerant in the high/lowpressure heat exchanger 8 and thus heated from the point F2 to the point G2, and further evaporates. The low pressure refrigerant having flowed out of theevaporator 6 is sucked through theaccumulator 7 into thecompressor 2. - A heat exchange rate in the high/low
pressure heat exchanger 8 is proportional to a difference between a refrigerant temperature at an inlet of thehigh pressure portion 81, that is, a refrigerant temperature at an outlet of thesecond condenser 4, and a refrigerant temperature at an inlet of thelow pressure portion 82, that is, a refrigerant temperature at an outlet of theevaporator 6. In the low temperature water input operation, a degree of supercooling of the refrigerant at the outlet of thesecond condenser 4 is large. The degree of supercooling refers to a fall in temperature from a condensation temperature, that is, a saturation temperature. Here, when the refrigerant temperature at the outlet of thesecond condenser 4 is 12°C, and the evaporation temperature of the refrigerant in theevaporator 6 is 0°C, a temperature difference ΔT1 of the high/lowpressure heat exchanger 8 in the low temperature water input operation is represented by the following expression: - On the other hand, in the high temperature water input operation, the refrigerant is not condensed in the
second condenser 4, and thus the refrigerant temperature at the inlet of thehigh pressure portion 81 in the high/lowpressure heat exchanger 8 is a temperature reduced from the refrigerant temperature at the outlets of thefirst condensers second condenser 4. Here, when the refrigerant temperature at the outlets of thefirst condensers second condenser 4 is assumed to be 5 K, a temperature difference ΔT2 in the high/lowpressure heat exchanger 8 in the high temperature water input operation is represented by the following expression: - Average refrigerant dryness from the point B2 to the point C2 of the
second condenser 4 in the high temperature water input operation is higher than average refrigerant dryness from the point B1 to the point C1 of thesecond condenser 4 in the low temperature water input operation. Thus, an average refrigerant density in thesecond condenser 4 in the high temperature water input operation is lower than an average refrigerant density in thesecond condenser 4 in the low temperature water input operation. Also, average refrigerant dryness from the point E2 to the point F2 of theevaporator 6 in the high temperature water input operation is higher than average refrigerant dryness from the point E1 to the point F1 of theevaporator 6 in the low temperature water input operation. Thus, an average refrigerant density in theevaporator 6 in the high temperature water input operation is lower than an average refrigerant density in theevaporator 6 in the low temperature water input operation. For these reasons, in the high temperature water input operation, an amount of the refrigerant required for thesecond condenser 4 and theevaporator 6 is smaller than in the low temperature water input operation, thereby producing a surplus of the refrigerant in the refrigerant circuit. With therefrigeration cycle device 1A of thisembodiment 1, in the high temperature water input operation, the refrigerant is cooled in the high/lowpressure heat exchanger 8 to reduce enthalpy of the refrigerant at the inlet of theevaporator 6. This increases the average refrigerant density in theevaporator 6, thereby allowing the redundant refrigerant to be partially stored in theevaporator 6. Also, in the high temperature water input operation, the redundant refrigerant is also stored in theaccumulator 7. -
Figure 12 shows an example of a relationship between positions and temperatures of the refrigerant and the water in thefirst condensers second condenser 4 of therefrigeration cycle device 1A of thisembodiment 1. InFigure 12 , the ordinate represents temperature. InFigure 12 , the abscissa represents a distance ratio from a water inlet of thesecond condenser 4 when a sum of a length of one heat medium flow path in thefirst condensers second condenser 4 is one. Here, the length of the heat medium flow path is a length of a central axis in a flowing direction of the heat medium flow path. An operation condition in the example inFigure 12 is the same as an operation condition inFigure 6 or10 described above. - In the example in
Figure 12 , Lp1:Lp2 = 0.55:0.45, where Lp1 is the length of one heat medium flow path in thefirst condensers second condenser 4. In thisembodiment 1, there are two heat medium flow paths in thefirst condensers second condenser 4. Thus, L1:L2 = 1.10:0.45 ≈ 2.4:1.0, where L1 is a total length of the heat medium flow paths in thefirst condensers second condenser 4. - With the ratio between the length of the heat medium flow path in the
first condensers second condenser 4 as described above, in the low temperature water input operation at a feed-water temperature of, for example, 9°C, as shown inFigure 12 , water can be heated from 9°C to 50°C by thesecond condenser 4 and then heated from 50°C to 80°C by thefirst condensers first condensers - With the
refrigeration cycle device 1A of thisembodiment 1, advantages can be obtained as described below. - In the high temperature water input operation, water is not passed through the
second condenser 4, thereby inhibiting heat exchange in thesecond condenser 4 and thus increasing a heat exchange rate in the high/lowpressure heat exchanger 8. This increases a cooling rate of the high pressure refrigerant in the high/lowpressure heat exchanger 8, and reduces enthalpy of the refrigerant at the inlet of theevaporator 6, thereby increasing the redundant refrigerant stored in theevaporator 6. Thus, the redundant refrigerant in the refrigerant circuit produced in the high temperature water input operation can be efficiently stored in theevaporator 6, thereby preventing an excessive increase in high pressure side refrigerant pressure. Also, since the redundant refrigerant can be stored in large amounts in theevaporator 6 in the high temperature water input operation, an amount of the refrigerant liquid stored in theaccumulator 7 can be reduced as compared to a case where the redundant refrigerant is stored only in theaccumulator 7. This can reduce the possibility that thecompressor 2 is damaged by liquid compression that causes a large amount of the refrigerant liquid to be sucked into thecompressor 2. Also, the need for increasing a size of theaccumulator 7 is reduced. - In the high temperature water input operation, the high pressure refrigerant in the gas-liquid two-phase state having flowed out of the
second condenser 4 is cooled in the high/lowpressure heat exchanger 8, and thus the high pressure refrigerant at the inlet of theexpansion valve 5 can be brought into a state of a supercooled liquid or a state with low dryness. Thus, as compared to a case where a high pressure refrigerant with high dryness flows into theexpansion valve 5, a capacity (for example, an aperture) of theexpansion valve 5 can be reduced. Specifically, there is no need to significantly change the capacity of theexpansion valve 5 between the low temperature water input operation and the high temperature water input operation. - In the high temperature water input operation, the refrigerant in the
second condenser 4 is in the gas-liquid two-phase state or a gas state, thereby increasing a flow speed as compared to a supercooled liquid. Thus, the pressure loss of the refrigerant in thesecond condenser 4 in the high temperature water input operation is larger than the pressure loss of the refrigerant in thesecond condenser 4 in the low temperature water input operation. Thus, in the high temperature water input operation, the refrigerant in thesecond condenser 4 is reduced in temperature due to the pressure loss. This reduces a temperature difference between the refrigerant and the water, thereby reducing a heat exchange rate at constant pressure. If the pressure loss of the refrigerant further increases in thesecond condenser 4, a part where the refrigerant temperature is lower than the feed-water temperature is created. In a part where the refrigerant temperature is lower than the water temperature, the refrigerant draws heat from the water to cause loss of heat. This reduces efficiency of therefrigeration cycle device 1A heating the water. However, in thisembodiment 1, the water is not passed through thesecond condenser 4 in the high temperature water input operation, and thus even if the part where the refrigerant temperature is lower than the feed-water temperature is created in thesecond condenser 4, the refrigerant can be reliably inhibited from drawing heat from the water, thereby inhibiting loss of heat. This can reliably inhibit a reduction in efficiency of therefrigeration cycle device 1A heating the water. In particular, in thisembodiment 1, the sectional area of the refrigerant flow path is smaller and the number of refrigerant flow paths is smaller in thesecond condenser 4 than in thefirst condensers first condensers second condenser 4, thereby causing smaller refrigerant pressure loss. Thus, in thefirst condensers - In the
refrigeration cycle device 1A of thisembodiment 1, the sectional area of the refrigerant flow path in thesecond condenser 4 is smaller than the sectional area of the refrigerant flow path in thefirst condensers - In the low temperature water input operation, the refrigerant is supercooled in the
second condenser 4 and the refrigerant temperature at the outlet of thesecond condenser 4 is reduced to increase an enthalpy difference, thereby increasing COP. The refrigerant in the supercooled liquid state has a low flow speed and a lower heat-transfer coefficient than a gas-liquid two-phase part by its nature. However, in thisembodiment 1, the sectional area of the refrigerant flow path in thesecond condenser 4 is smaller than the sectional area of the refrigerant flow path in thefirst condensers second condenser 4 and thus inhibiting a reduction in heat-transfer coefficient. Thus, in the low temperature water input operation, heat exchange efficiency in thesecond condenser 4 can be increased to further increase COP. In particular, in thisembodiment 1, the number of the refrigerant flow paths in thesecond condenser 4 is smaller than the number of refrigerant flow paths in thefirst condensers second condenser 4. - Also in this
embodiment 1, R32 is used as the refrigerant to provide an advantage described below. -
Figure 13 shows a comparison between compressor discharge temperatures of an R410A refrigerant and an R32 refrigerant. In the example inFigure 13 , compressor suction pressure is 0.81 MPa that is saturation vapor pressure of R32 at 0°C, compressor discharge pressure is 4.25 MPa equal to design pressure of the air conditioner, a degree of superheat of the refrigerant sucked into thecompressor 2 is 0 K, and compressor efficiency is assumed to be 100%. Under these conditions, the compressor discharge temperature of R410A is 91°C, while the compressor discharge temperature of R32 is 110°C. The degree of superheat refers to a rise in temperature from an evaporation temperature, that is, a saturation temperature. In the high temperature water input operation, the surplus of the refrigerant liquid is stored in theaccumulator 7 as described above, and thus the degree of superheat of the refrigerant sucked into thecompressor 2 is 0 K (or 0 K or less). When the degree of superheat of the refrigerant sucked into thecompressor 2 is 0 K, the R410A refrigerant is reduced in compressor discharge temperature to 91°C as described above. Thus, if R410A is used as the refrigerant, it is difficult to increase the output hot water temperature in the high temperature water input operation. However, for the R32 refrigerant, even if the degree of superheat of the refrigerant sucked into thecompressor 2 is 0 K, the compressor discharge temperature can be increased to 110°C. Thus, using R32 as the refrigerant can increase the output hot water temperature in the high temperature water input operation to be higher than when using the R410A refrigerant. This can increase a heat storage amount with the same capacity of the hotwater storage tank 21. In therefrigeration cycle device 1A of thisembodiment 1, when R32 is used as the refrigerant and the design pressure is substantially equal to that of the air conditioner, the output hot water temperature is about 80°C maximum. Thus, the hot water storage temperature in the hotwater storage tank 21 is also about 80°C maximum. An output hot water temperature of a heat pump hot water supply device using CO2 as the refrigerant is about 90°C maximum, and the hot water storage temperature is also about 90°C maximum. Thus, with the same capacity of the hotwater storage tank 21, the heat storage amount of the heat pump hot water supply device using the CO2 refrigerant is larger. However, since the temperature of hot water supplied from the hotwater supply pipe 29 to the hot water supply terminal is about 40 to 60°C, there is no problem in the hot water storage temperature of 80°C. In therefrigeration cycle device 1A of thisembodiment 1, also for the high temperature water input operation at the feed-water temperature of about 50°C or higher, an efficient operation can be performed with the output hot water temperature of 80°C or higher. Thus, if the hot water storage temperature and the heat storage amount are reduced by thermal dissipation from the hotwater storage tank 21 or the like, a heat accumulating operation of the high temperature water input operation by therefrigeration cycle device 1A can be performed to efficiently reheat the hot water reduced in temperature in the hotwater storage tank 21. Also, a critical temperature of CO2 is about 31°C, while a critical temperature of R32 is about 78°C and high. Thus, with therefrigeration cycle device 1A of thisembodiment 1, condensation latent heat of the refrigerant can be used even in the high temperature water input operation, thereby allowing an operation with high COP. Also, since too high a hot water storage temperature increases thermal dissipation from the hotwater storage tank 21 to outside air, heat loss can be reduced by storing hot water at 80°C rather than at 90°C and again operating the heat accumulating operation when the heat storage amount is reduced. In the present invention, not only when refrigerant containing 100% R32 is used but also when refrigerant mainly containing R32 is used, similar advantages as described above can be obtained. When refrigerant mainly containing R32 is used, refrigerant containing 70 mass % or more, more preferably, 90 mass % or more of R32 may be used. - Here, a ratio of the number of refrigerant flow paths in the first condenser to the number of refrigerant flow paths in the second condenser is defined as a ratio between the numbers of refrigerant flow paths. As described above, in this
embodiment 1, the number of the refrigerant flow paths in thefirst condensers second condenser 4 is three, and thus the ratio between the numbers of refrigerant flow paths is two.Figure 14 shows a relationship between the ratio between the numbers of refrigerant flow paths and a magnitude of refrigerant pressure loss in the first condenser. InFigure 14 , the ordinate represents the magnitude of refrigerant pressure loss in the first condenser, which is 100% when the ratio between the numbers of refrigerant flow paths is one. As shown inFigure 14 , the pressure loss of the refrigerant in the first condenser decreases with increasing ratio between the numbers of refrigerant flow paths. However, if the ratio between the numbers of refrigerant flow paths exceeds 2.5, further reducing the pressure loss of the refrigerant is less effective. With too high a ratio between the numbers of refrigerant flow paths, the reduction in refrigerant flow speed reduces the heat-transfer coefficient, which may reduce the heat exchange rate. From the above, the ratio between the numbers of refrigerant flow paths is desirably about 1.5 to 2.5, and as in thisembodiment 1, the ratio between the numbers of refrigerant flow paths is particularly desirably two. Also, in thisembodiment 1, thefirst condensers second condenser 4 are constituted by heat exchangers having substantially the same structure. Specifically, two heat exchangers having substantially the same structure as thesecond condenser 4 are connected in parallel to constitute thefirst condensers - In the low temperature water input operation in this
embodiment 1, a water bypass percentage is 0% and all water is heated in thesecond condenser 4, thereby increasing the output hot water temperature. However, in the present invention, the water bypass percentage does not need to be always 0%, but a small amount of water may be passed through the secondcondenser bypass passage 10 in the low temperature water input operation. In the high temperature water input operation in thisembodiment 1, the water bypass percentage is 100% and all water flows through the secondcondenser bypass passage 10, thereby reliably preventing the water from drawing heat from the refrigerant in thesecond condenser 4. However, in the present invention, the water bypass percentage does not need to be always 100% in the high temperature water input operation, but a small amount of water may be passed through thesecond condenser 4. - In the present invention, a first reference temperature and a second reference temperature higher than the first reference temperature may be set, and the
control device 50 may control the operation of the flowpath switching valve 11 so that the bypass percentage is 0% when the feed-water temperature is lower than the first reference temperature, the bypass percentage is 100% when the feed-water temperature is higher than the second reference temperature, and the bypass percentage continuously or stepwise increases with increasing feed-water temperature when the feed-water temperature is between the first reference temperature and the second reference temperature. This allows smooth transition between the low temperature water input operation and the high temperature water input operation. - In this
embodiment 1, changing a flow rate of air blown by theblower 12 can change the heat exchange rate in theevaporator 6. Increasing the flow rate of air blown by theblower 12 increases the heat exchange rate in theevaporator 6, and reducing the flow rate of air blown by theblower 12 reduces the heat exchange rate in theevaporator 6. In thisembodiment 1, in the high temperature water input operation, control may be performed so that the flow rate of air blown by theblower 12 is reduced as compared to in the low temperature water input operation to reduce the heat exchange rate in theevaporator 6. Specifically, in the flowchart inFigure 4 , thecontrol device 50 may perform control to reduce a driving speed of theblower 12 in the high temperature water input operation in step S3 as compared to in the low temperature water input operation in step S2. As such, the heat exchange rate in theevaporator 6 is reduced in the high temperature water input operation to reduce an evaporation rate of the refrigerant, thereby increasing an average refrigerant density in theevaporator 6 and thus increasing the redundant refrigerant stored in theevaporator 6. Thus, theadvantage 1 described above can be more significantly exerted. In the high temperature water input operation, the enthalpy difference of the refrigerant in theevaporator 6 is smaller than in the low temperature water input operation, and thus reducing the heat exchange rate in theevaporator 6 slightly reduces the evaporation temperature and has little influence on COP. In thisembodiment 1, theblower 12 corresponds to evaporator heat exchange rate variable means. When the heat source of theevaporator 6 is a liquid, a pump for feeding the liquid to theevaporator 6 may be used as the evaporator heat exchange rate variable means. - Next, with reference to
Figure 15 ,embodiment 2 of the present invention will be described. Differences fromembodiment 1 described above will be mainly described, and like or corresponding components are denoted by like reference numerals and descriptions thereof will be omitted. -
Figure 15 is a configuration diagram of a refrigeration cycle device according toembodiment 2. Theembodiment 2 is used merely for a better understanding of the current application, but does not form part of the invention As compared to therefrigeration cycle device 1A ofembodiment 1, arefrigeration cycle device 1B of thisembodiment 2 shown inFigure 15 includes a high/low pressure heatexchanger bypass passage 14 that bypasses alow pressure portion 82 in a high/lowpressure heat exchanger 8, and an on-offvalve 15 that opens/closes the high/low pressure heatexchanger bypass passage 14. In thisembodiment 2, in the flowchart inFigure 4 , acontrol device 50 performs control to open the on-offvalve 15 in a low temperature water input operation in step S2, and close the on-offvalve 15 in a high temperature water input operation in step S3.Figure 15 shows the high temperature water input operation. In the high temperature water input operation, the on-offvalve 15 is closed, and thus a low pressure refrigerant having flowed out of anevaporator 6 flows through thelow pressure portion 82 in the high/lowpressure heat exchanger 8 rather than the high/low pressure heatexchanger bypass passage 14. Such a high temperature water input operation in thisembodiment 2 is similar to the high temperature water input operation inembodiment 1. - With this
embodiment 2, in addition to similar advantages as inembodiment 1, the following advantages can be obtained. In the low temperature water input operation in thisembodiment 2, the on-offvalve 15 is opened, and thus most of the low pressure refrigerant having flowed out of theevaporator 6 flows through the high/low pressure heatexchanger bypass passage 14 having lower flow path resistance than the high/lowpressure heat exchanger 8. Thus, in the low temperature water input operation in thisembodiment 2, heat exchange in the high/lowpressure heat exchanger 8 can be inhibited as compared to inembodiment 1. Thus, in the low temperature water input operation, the high pressure refrigerant having flowed out of thesecond condenser 4 is inhibited from being cooled in the high/lowpressure heat exchanger 8, thereby increasing enthalpy of refrigerant at an inlet of theevaporator 6. Thus, an amount of refrigerant in theevaporator 6 can be reduced in the low temperature water input operation, thereby reducing an amount refrigerant required in a refrigerant circuit in the low temperature water input operation. Thus, as compared to inembodiment 1, an amount of refrigerant sealed in the refrigerant circuit can be reduced to reduce a surplus of the refrigerant in the high temperature water input operation. - In this
embodiment 2, the on-offvalve 15 is closed so as to prevent the refrigerant from flowing in the high temperature water input operation, but a small amount of refrigerant may flow through the on-offvalve 15 in the high temperature water input operation. Specifically, an opening of the on-offvalve 15 in the high temperature water input operation may be smaller than an opening of the on-offvalve 15 in the low temperature water input operation. - Instead of the high/low pressure heat
exchanger bypass passage 14 and the on-offvalve 15 described above, a high/low pressure heat exchanger bypass passage that bypasses thehigh pressure portion 81 in the high/lowpressure heat exchanger 8 and an on-off valve that opens/closes the high/low pressure heat exchanger bypass passage may be provided and controlled as described above. Also in that case, similar advantages as described above can be obtained. - Next, with reference to
Figures 16 to 19 ,embodiment 3 of the present invention will be described. Differences fromembodiment 1 described above will be mainly described, and like or corresponding components are denoted by like reference numerals and descriptions thereof will be omitted. -
Figure 16 is a configuration diagram of a refrigeration cycle device according toembodiment 3 of the present invention. As compared to therefrigeration cycle device 1A ofembodiment 1, arefrigeration cycle device 1C of thisembodiment 3 shown inFigure 16 includes a secondcondenser bypass passage 16 and abypass valve 17 rather than the secondcondenser bypass passage 10 and the flowpath switching valve 11. The secondcondenser bypass passage 16 bypasses arefrigerant flow path 41 in asecond condenser 4. One end of the secondcondenser bypass passage 16 is connected to a refrigerant pipe betweenrefrigerant flow paths 31 infirst condensers refrigerant flow path 41 in thesecond condenser 4. The other end of the secondcondenser bypass passage 16 is connected to a refrigerant pipe between anexpansion valve 5 and anevaporator 6. Thebypass valve 17 is provided in a middle of the secondcondenser bypass passage 16 and opens/closes the secondcondenser bypass passage 16. Ahigh pressure portion 81 in a high/lowpressure heat exchanger 8 is connected to a middle of the secondcondenser bypass passage 16 upstream of thebypass valve 17. Thebypass valve 17 also functions as a pressure reducing device for reducing pressure of and expanding a high pressure refrigerant. Thebypass valve 17 preferably has a changeable opening. An entry heatmedium temperature sensor 13 is provided in a middle of aheat medium path 9 between awater inlet 91 and thesecond condenser 4. - In this
embodiment 3, out of a total flow of the refrigerant having passed through thefirst condensers condenser bypass passage 16 rather than thesecond condenser 4 is referred to as a "bypass percentage". In thisembodiment 3, theexpansion valve 5 and thebypass valve 17 correspond to a flow path controlling element that can vary a bypass rate that is a flow rate of the refrigerant flowing through the secondcondenser bypass passage 16. The flow rate of high pressure refrigerant flowing through thehigh pressure portion 81 in the high/lowpressure heat exchanger 8 increases with increasing bypass rate, thereby increasing a heat exchange rate in the high/lowpressure heat exchanger 8. Also, in thisembodiment 3, all of water having flowed in from thewater inlet 91 flows through thesecond condenser 4 both in a low temperature water input operation and in a high temperature water input operation. - The
refrigeration cycle device 1C performs the low temperature water input operation when a feed-water temperature is lower than a reference temperature α, and performs the high temperature water input operation when the feed-water temperature is higher than the reference temperature α. The reference temperature α is 50°C as inembodiment 1. Thecontrol device 50 controls operations of theexpansion valve 5 and thebypass valve 17 so that a bypass rate in the high temperature water input operation is larger than a bypass rate in the low temperature water input operation. This increases the heat exchange rate in the high/lowpressure heat exchanger 8 in the high temperature water input operation. In thisembodiment 3, the bypass percentage in the low temperature water input operation is 0%, and the bypass percentage in the high temperature water input operation is 100% for description. -
Figure 16 shows the low temperature water input operation of therefrigeration cycle device 1C of thisembodiment 3. When the low temperature water input operation is performed, thecontrol device 50 closes thebypass valve 17 to an opening that prevents the refrigerant from flowing. This causes all of refrigerant having passed through thefirst condensers second condenser 4 and theexpansion valve 5 to theevaporator 6. As such, in the low temperature water input operation in thisembodiment 3, the refrigerant does not flow through thehigh pressure portion 81 in the high/lowpressure heat exchanger 8, and thus heat exchange is not performed in the high/lowpressure heat exchanger 8. -
Figure 17 is a P-h diagram of the low temperature water input operation of therefrigeration cycle device 1C of thisembodiment 3. As shown inFigure 17 , in the low temperature water input operation, a low pressure refrigerant gas is compressed by thecompressor 2 from a point G3 to a point A3 into a high pressure refrigerant gas. The high pressure refrigerant gas is cooled in thefirst condensers second condenser 4 into a supercooled liquid. Specifically, the high pressure refrigerant is changed from the point B3 to a point C3 in thesecond condenser 4. The high pressure refrigerant having flowed out of thesecond condenser 4 does not flow through the high/lowpressure heat exchanger 8, but is expanded to a point E3 and reduced in pressure by theexpansion valve 5 into a low pressure refrigerant in the gas-liquid two-phase state. The low pressure refrigerant in the gas-liquid two-phase state absorbs heat in theevaporator 6 from the point E3 to a point G3 so as to evaporate. The low pressure refrigerant having flowed out of theevaporator 6 passes through alow pressure portion 82 in the high/lowpressure heat exchanger 8, but heat exchange is not performed in the high/lowpressure heat exchanger 8, thereby causing no change in enthalpy. The low pressure refrigerant having passed through thelow pressure portion 82 in the high/lowpressure heat exchanger 8 and anaccumulator 7 is sucked into acompressor 2. -
Figure 18 shows the high temperature water input operation of therefrigeration cycle device 1C of thisembodiment 3. As shown inFigure 18 , when the high temperature water input operation is performed, thecontrol device 50 opens thebypass valve 17, and closes theexpansion valve 5 to an opening that prevents the refrigerant from flowing. Thus, all of refrigerant having passed through thefirst condensers condenser bypass passage 16 and the high/lowpressure heat exchanger 8 rather than thesecond condenser 4. The high pressure refrigerant having passed through thehigh pressure portion 81 in the high/lowpressure heat exchanger 8 is expanded and reduced in pressure by thebypass valve 17, and flows toward theevaporator 6. In the high temperature water input operation, water flows through thesecond condenser 4, while the refrigerant does not flow through thesecond condenser 4, and thus the water is not changed in temperature in thesecond condenser 4. Also, in the high temperature water input operation, the refrigerant flows through thehigh pressure portion 81 in the high/lowpressure heat exchanger 8, and thus heat exchange is performed in the high/lowpressure heat exchanger 8. -
Figure 19 is a P-h diagram of the low temperature water input operation of therefrigeration cycle device 1C of thisembodiment 3. As shown inFigure 19 , in the high temperature water input operation, the low pressure refrigerant gas is compressed by thecompressor 2 from a point G4 to a point A4 into a high pressure refrigerant gas. The high pressure refrigerant gas is cooled in thefirst condensers first condensers evaporator 6 and thus cooled in the high/lowpressure heat exchanger 8, and further condenses. Specifically, the high pressure refrigerant is changed from the point B4 to a point D4 in the high/lowpressure heat exchanger 8.Figure 19 shows a case where the high pressure refrigerant at an outlet of the high/low pressure heat exchanger 8 (point D4) is a supercooled liquid, but the high pressure refrigerant at an outlet of the high/lowpressure heat exchanger 8 may be in a gas-liquid two-phase state or be a saturation liquid. The high pressure refrigerant having flowed out of the high/lowpressure heat exchanger 8 is expanded to a point E4 and reduced in pressure by thebypass valve 17 into a low pressure refrigerant in the gas-liquid two-phase state. The low pressure refrigerant in the gas-liquid two-phase state absorbs heat in theevaporator 6 from the point E4 to a point F4 so as to evaporate. The low pressure refrigerant is also in the gas-liquid two-phase state at the outlet of the evaporator 6 (point F4). The low pressure refrigerant in the gas-liquid two-phase state having flowed out of theevaporator 6 is subjected to heat exchange with the high pressure refrigerant in the high/lowpressure heat exchanger 8 and thus heated from the point F4 to the point G4, and further evaporates. The low pressure refrigerant having flowed out of theevaporator 6 is sucked through theaccumulator 7 into thecompressor 2. - With the
refrigeration cycle device 1C of thisembodiment 3, similar advantages as inembodiment 1 can be obtained. Specifically, according to thisembodiment 3, the heat exchange rate in the high/lowpressure heat exchanger 8 can be increased in the high temperature water input operation, thereby increasing the redundant refrigerant stored in theevaporator 6, and allowing the redundant refrigerant in a refrigerant circuit produced in the high temperature water input operation to be efficiently stored in theevaporator 6. - Also, in this
embodiment 3, the heat exchange in the high/lowpressure heat exchanger 8 can be inhibited in the low temperature water input operation. Thus, in the low temperature water input operation, the high pressure refrigerant having been subjected to heat exchange with water is inhibited from being cooled in the high/lowpressure heat exchanger 8, thereby increasing enthalpy of the refrigerant at an inlet of theevaporator 6. Thus, an amount of refrigerant in theevaporator 6 can be reduced in the low temperature water input operation, thereby reducing an amount of refrigerant required in a refrigerant circuit in the low temperature water input operation. Thus, as compared to inembodiment 1, an amount of refrigerant sealed in the refrigerant circuit can be reduced to reduce a surplus of the refrigerant in the high temperature water input operation. - Also, in this
embodiment 3, the refrigerant does not flow through thesecond condenser 4 in the high temperature water input operation, and thus a part where the refrigerant temperature is lower than the feed-water temperature can be reliably inhibited from being created in thesecond condenser 4. This can reliably inhibit the refrigerant from drawing heat from water, and thus reliably inhibiting a reduction in efficiency of therefrigeration cycle device 1C heating the water. Also, in the high temperature water input operation, the refrigerant in the gas-liquid two-phase state or a gas state having passed through thefirst condensers second condenser 4 having a small sectional area of the refrigerant flow path, thereby avoiding a temperature reduction of the refrigerant in thesecond condenser 4 due to pressure loss. - Also, in this
embodiment 3, the refrigerant does not flow through thesecond condenser 4 in the high temperature water input operation, thereby further reducing the pressure loss of the refrigerant as compared to inembodiment 1. This can more reliably inhibit an increase in condensation pressure in thefirst condensers - In the low temperature water input operation in this
embodiment 3, the refrigerant bypass percentage is 0% and the total flow of the refrigerant flows through thesecond condenser 4, thereby increasing an output hot water temperature. However, in the present invention, the refrigerant bypass percentage does not need to be always 0% in the low temperature water input operation, but a small portion out of the total flow of the refrigerant may be passed through the secondcondenser bypass passage 16. In the high temperature water input operation in thisembodiment 3, the refrigerant bypass percentage is 100% and the total flow of the refrigerant flows through the secondcondenser bypass passage 16, thereby reliably reducing the pressure loss of the refrigerant. However, in the present invention, the refrigerant bypass percentage does not need to be always 100% in the high temperature water input operation, but a small portion out of the total flow of the refrigerant may be passed through thesecond condenser 4. - Next, with reference to
Figures 20 to 22 ,embodiment 4 of the present invention will be described. Differences fromembodiment 3 described above will be mainly described, and like or corresponding components are denoted by like reference numerals and descriptions thereof will be omitted. -
Figure 20 is a configuration diagram of a refrigeration cycle device according toembodiment 4 of the present invention. As shown inFigure 20 , a configuration of arefrigeration cycle device 1D of thisembodiment 4 is the same as inembodiment 3, and descriptions thereof will be omitted. -
Figure 21 is a flowchart showing a control operation of therefrigeration cycle device 1D of thisembodiment 4. In step S11 inFigure 21 , thecontrol device 50 compares a feed-water temperature detected by an entry heatmedium temperature sensor 13 with a previously set first reference temperature β. In thisembodiment 4, the first reference temperature β is 30°C. If the feed-water temperature is not higher than the first reference temperature β in step S11, thecontrol device 50 moves to step S12. In step S12, therefrigeration cycle device 1D performs a low temperature water input operation. This low temperature water input operation is the same as the low temperature water input operation in embodiment 3 (Figure 16 ). Specifically, in step S12, thecontrol device 50 opens anexpansion valve 5 and closes abypass valve 17 to an opening that prevents refrigerant from flowing. - If the feed-water temperature is higher than the first reference temperature β in step S11, the
control device 50 moves to step S13. In step S13, thecontrol device 50 compares the feed-water temperature with a previously set second reference temperature γ. In thisembodiment 4, the second reference temperature γ is 50°C. If the feed-water temperature is not lower than the second reference temperature γ in step S13, thecontrol device 50 moves to step S14. In step S14, therefrigeration cycle device 1D performs a high temperature water input operation. This high temperature water input operation is the same as the high temperature water input operation in embodiment 3 (Figure 18 ). Specifically, in step S14, thecontrol device 50 opens thebypass valve 17 and closes theexpansion valve 5 to an opening that prevents refrigerant from flowing. - If the feed-water temperature is lower than the second reference temperature γ in step S13, that is, if the feed-water temperature is between the first reference temperature β and the second reference temperature γ, the
control device 50 moves to step S15. In step S15, therefrigeration cycle device 1D performs a middle temperature water input operation. -
Figure 20 shows the middle temperature water input operation of therefrigeration cycle device 1D of thisembodiment 4. In the middle temperature water input operation, thecontrol device 50 controls the openings of theexpansion valve 5 and thebypass valve 17 so that refrigerant having passed throughfirst condensers second condenser 4 and a secondcondenser bypass passage 16. -
Figure 22 shows a relationship between the feed-water temperature and a bypass percentage in the middle temperature water input operation of therefrigeration cycle device 1D of thisembodiment 4. As shown inFigure 22 , in the middle temperature water input operation, thecontrol device 50 controls the openings of theexpansion valve 5 and thebypass valve 17 so that the bypass percentage continuously increases with increasing feed-water temperature. -
- In
Figure 12 , the first reference temperature β is desirably approximately a water temperature at a position where dryness of the refrigerant in thesecond condenser 4 is zero, that is, a water temperature at a position where the refrigerant is between a gas-liquid two-phase zone and a supercooled zone. In the example inFigure 12 , the water temperature at the position where dryness of the refrigerant is zero is about 30°C. Thus, in thisembodiment 4, the first reference temperature β is 30°C. - When a total flow of the refrigerant flows through the
second condenser 4, at constant pressure, an average flow speed of the refrigerant in thesecond condenser 4 increases and refrigerant pressure loss in thesecond condenser 4 increases with increasing feed-water temperature. In thisembodiment 4, when the feed-water temperature is between the first reference temperature β (30°C) and the second reference temperature γ (50°C), the middle temperature water input operation for causing a portion of the refrigerant to flow through the secondcondenser bypass passage 16 can be performed to reduce the flow rate of the refrigerant flowing through thesecond condenser 4 and reduce pressure loss. Thus, according to thisembodiment 4, when the feed-water temperature is between 30°C and 50°C, refrigerant pressure loss can be advantageously more reduced than in theembodiment 3. - In the middle temperature water input operation, the following expression is satisfied;
first condensers second condenser 4, and Δh is an overall refrigerant enthalpy difference in thefirst condensers second condenser 4. - In this
embodiment 4, when the feed-water temperature is between the first reference temperature β and the second reference temperature γ, the overall refrigerant enthalpy difference of thefirst condensers second condenser 4 is Δh calculated by the above expression. On the other hand, if the total flow of the refrigerant flows through the secondcondenser bypass passage 16 when the feed-water temperature is not lower than the first reference temperature β, the overall refrigerant enthalpy difference of thefirst condensers second condenser 4 is Δh1. As such, according to thisembodiment 4, the refrigerant enthalpy difference can be more increased than in a case where the total flow of the refrigerant flows through the secondcondenser bypass passage 16 when the feed-water temperature is not lower than the first reference temperature β, thereby further increasing COP. - In this
embodiment 4, when the feed-water temperature is between the first reference temperature β and the second reference temperature γ, the bypass percentage of the refrigerant can be increased with increasing feed-water temperature to increase the heat exchange rate in the high/lowpressure heat exchanger 8. Thus, the enthalpy at the inlet of theevaporator 6 can be more reduced than inembodiment 3, thereby allowing a larger amount of the redundant refrigerant to be stored in theevaporator 6. - Further, according to this
embodiment 4, the middle temperature water input operation is performed between the low temperature water input operation and the high temperature water input operation, thereby allowing smooth transition between the operations. In thisembodiment 4, the openings of theexpansion valve 5 and thebypass valve 17 are controlled so that the bypass percentage continuously increases with increasing feed-water temperature in the middle temperature water input operation, but in the present invention, the openings of theexpansion valve 5 and thebypass valve 17 may be controlled so that the bypass percentage increases in a stepwise fashion with increasing feed-water temperature in the middle temperature water input operation. - Next, with reference to
Figures 23 and24 ,embodiment 5 of the present invention will be described. Differences fromembodiment -
Figure 23 is a configuration diagram of a refrigeration cycle device according toembodiment 5 of the present invention. As shown inFigure 23 , as compared to the configurations inembodiments embodiment 5, aliquid receiver 18 for storing a refrigerant liquid is provided in a middle of a secondcondenser bypass passage 16 between ahigh pressure portion 81 in a high/lowpressure heat exchanger 8 and abypass valve 17. Other than that, the configuration is the same as inembodiments embodiment 5 may be the same as inembodiment 3 or as inembodiment 4. -
Figure 23 shows a middle temperature water input operation for distributing a high pressure refrigerant having passed throughfirst condensers second condenser 4 and a secondcondenser bypass passage 16.Figure 24 is a P-h diagram of the middle temperature water input operation of the refrigeration cycle device IE of thisembodiment 5. As shown inFigure 24 , in the middle temperature water input operation in thisembodiment 5, a low pressure refrigerant gas is compressed by acompressor 2 from a point G5 to a point A5 into a high pressure refrigerant gas. The high pressure refrigerant gas is cooled in thefirst condensers first condensers second condenser 4 into a supercooled liquid. The high pressure refrigerant is changed from the point B5 to a point D5 in thesecond condenser 4. The high pressure refrigerant having flowed out of thesecond condenser 4 is expanded and reduced in pressure by theexpansion valve 5 into a low pressure refrigerant in a gas-liquid two-phase state. The other part of the high pressure refrigerant having flowed out of thefirst condensers evaporator 6 and thus cooled into a saturation liquid in the high/lowpressure heat exchanger 8. The high pressure refrigerant is changed from the point B5 to a point C5 in the high/lowpressure heat exchanger 8. The refrigerant liquid having flowed out of the high/lowpressure heat exchanger 8 is stored in theliquid receiver 18. The refrigerant liquid having flowed out of theliquid receiver 18 is expanded and reduced in pressure by thebypass valve 17 into a low pressure refrigerant in a gas-liquid two-phase state. The low pressure refrigerant having passed through theexpansion valve 5 and the low pressure refrigerant having passed through thebypass valve 17 merge and flow into theevaporator 6. The low pressure refrigerant absorbs heat in theevaporator 6 from the point E5 to a point F5 so as to evaporate. Also at an outlet of the evaporator 6 (point F5), the low pressure refrigerant is in the gas-liquid two-phase state. The low pressure refrigerant in the gas-liquid two-phase state having flowed out of theevaporator 6 is subjected to heat exchange with the high pressure refrigerant in the high/lowpressure heat exchanger 8, heated from the point F5 to the point G5, and further evaporates. The low pressure refrigerant having flowed out of theevaporator 6 is sucked through theaccumulator 7 into thecompressor 2. - According to this
embodiment 5, similar advantages as inembodiment embodiment 5, theliquid receiver 18 is provided to allow a larger amount of the redundant refrigerant to be stored in the high temperature water input operation or the middle temperature water input operation, thereby more reliably inhibiting an excessive increase in high pressure side refrigerant pressure and liquid compression by thecompressor 2. If theliquid receiver 18 is provided as in thisembodiment 5, theaccumulator 7 does not need to store the redundant refrigerant. -
- 1A, 1B, 1C
- refrigeration cycle device
- 2
- compressor
- 3A, 3B
- first condenser
- 4
- second condenser
- 5
- expansion valve
- 6
- evaporator
- 7
- evaporator
- 8
- high/low pressure heat exchanger
- 9
- heat medium path
- 10
- second condenser bypass passage
- 11
- flow path switching valve
- 12
- blower
- 13
- entry heat medium temperature sensor
- 16
- second condenser bypass passage
- 17
- bypass valve
- 18
- liquid receiver
- 20
- tank unit
- 21
- hot water storage tank
- 22
- water pump
- 23, 24
- water channel
- 25
- water supply pipe
- 26
- hot water supplying mixing valve
- 27
- hot water pipe
- 28
- water supply branch pipe
- 29
- hot water supply pipe
- 30
- reheating heat exchanger
- 31
- refrigerant flow path
- 32
- heat medium flow path
- 41
- refrigerant flow path
- 42
- heat medium flow path
- 50
- control device
- 50a
- processor
- 50b
- memory
- 60
- heat exchanger
- 61
- twisted pipe
- 61a, 61b, 61c
- groove
- 62, 63, 64
- refrigerant heat transfer pipe
- 91
- water inlet
- 92
- water outlet
Claims (10)
- A refrigeration cycle device (1C; 1D; 1E) comprising:a compressor (2) configured to compress refrigerant;a first condenser (3A, 3B) including a refrigerant flow path (31) and a heat medium flow path (32), the first condenser (3A, 3B) being configured to condense the refrigerant compressed by the compressor (2);a second condenser (4) including a refrigerant flow path (41) and a heat medium flow path (42), the second condenser (4) being configured to further condense the refrigerant having passed through the first condenser (3A, 3 B);an expansion valve (5);an evaporator (6) configured to evaporate the refrigerant;a high/low pressure heat exchanger (8) including a high pressure portion (81) and a low pressure portion (82), the high/low pressure heat exchanger (8) being configured to exchange heat between a high pressure refrigerant after heat exchange with a heat medium of a heat medium path (9) and a low pressure refrigerant having passed through the evaporator (6);an entry heat medium temperature sensor (13) provided in a middle of the heat medium path (9) between an inlet (91) and the second condenser (4);a second condenser bypass passage (16) configured to bypass the refrigerant flow path (41) in the second condenser (4);a flow path controlling element (5, 17) capable of varying a bypass rate that is a flow rate of the refrigerant flowing through the second condenser bypass passage (16); andcontrol means (50),the flow path controlling element (5, 17) including the expansion valve (5) and a bypass valve (17),the bypass valve (17) being provided in a middle of the second condenser bypass passage (16),one end of the second condenser bypass passage (16) being connected to a refrigerant pipe between the refrigerant flow path (31) in the first condenser (3A, 3B) and the refrigerant flow path (41) in the second condenser (4),the refrigeration cycle device (1C; 1D; 1E) being characterized in that the refrigeration cycle device (1C; 1D; 1E) further comprises the heat medium path (9) configured to allow a liquid heat medium subjected to heat exchange with the refrigerant to pass through the second condenser (4) and the first condenser (3A, 3B) in this order;the control means (50) is configured to control an operation of the flow path controlling element (5, 17) so that the bypass rate becomes, when an entry heat medium temperature that is a temperature of the heat medium before heat exchange with the refrigerant is higher than a reference temperature, larger than in a case where the entry heat medium temperature is lower than the reference temperature, so as to increase a heat exchange rate in the high/low pressure heat exchanger (8),the other end of the second condenser bypass passage (16) is connected to a refrigerant pipe between the expansion valve (5) and the evaporator (6),and the high pressure portion (81) in the high/low pressure heat exchanger (8) is connected to a middle of the second condenser bypass passage (16).
- The refrigeration cycle device (1C; 1D; 1E) according to claim 1, wherein a sectional area of the refrigerant flow path (41) in the second condenser (4) is smaller than a sectional area of the refrigerant flow path (31) in the first condenser (3A, 3B).
- The refrigeration cycle device (1C; 1D; 1E) according to claim 1 or 2, further comprising evaporator heat exchange rate variable means (12) capable of varying a heat exchange rate in the evaporator (6),
wherein the control means (50) is configured to control an operation of the evaporator heat exchange rate variable means (12) so that the heat exchange rate in the evaporator (6) is, when the entry heat medium temperature is higher than the reference temperature, lower than in a case where the entry heat medium temperature is lower than the reference temperature. - The refrigeration cycle device (1C; 1D; 1E) according to any one of claims 1 to 3, wherein when the entry heat medium temperature is higher than the reference temperature, redundant refrigerant in a refrigerant circuit is stored in the evaporator (6).
- The refrigeration cycle device (1C; 1D; 1E) according to any one of claims 1 to 4, further comprising an accumulator (7) between the evaporator (6) and the compressor (2),
wherein when the entry heat medium temperature is higher than the reference temperature, redundant refrigerant in a refrigerant circuit is stored in the accumulator (7). - The refrigeration cycle device (1E) according to claim 1, further comprising a liquid receiver (18) in a middle of the second condenser bypass passage (16) downstream of the high pressure portion (81) in the high/low pressure heat exchanger (8),
wherein when the entry heat medium temperature is higher than the reference temperature, redundant refrigerant in a refrigerant circuit is stored in the liquid receiver (18). - The refrigeration cycle device (1C; 1D; 1E) according to claim 1, wherein out of a total flow of the refrigerant, a percentage of the refrigerant flowing through the second condenser bypass passage (16) is a bypass percentage, and
the control means (50) is configured to cause the bypass percentage to be 0% when the entry heat medium temperature is lower than the reference temperature. - The refrigeration cycle device (1C; 1D; 1E) according to claim 1, wherein out of a total flow of the refrigerant, a percentage of the refrigerant flowing through the second condenser bypass passage (16) is a bypass percentage, and
the control means (50) is configured to cause the bypass percentage to be 100% when the entry heat medium temperature is higher than the reference temperature. - The refrigeration cycle device (1C; 1D; 1E) according to any one of claims 1 to 8, wherein the refrigerant flow path (31) in the first condenser (3A, 3B) is ramified into a plurality of paths, and
a ratio of the number of the refrigerant flow paths (31) in the first condenser (3A, 3B) to the number of the refrigerant flow path(s) (41) in the second condenser (4) is 1.5 to 2.5. - The refrigeration cycle device (1C; 1D; 1E) according to any one of claims 1 to 9, wherein the refrigerant is R32, or the refrigerant mainly contains R32.
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PCT/JP2013/078217 WO2015056334A1 (en) | 2013-10-17 | 2013-10-17 | Refrigeration cycle device |
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EP3059519A1 EP3059519A1 (en) | 2016-08-24 |
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JP5999273B2 (en) * | 2013-10-17 | 2016-09-28 | 三菱電機株式会社 | Refrigeration cycle equipment |
JP2017110852A (en) * | 2015-12-16 | 2017-06-22 | 株式会社コロナ | Heat pump device |
JP6144396B1 (en) * | 2016-09-14 | 2017-06-07 | 伸和コントロールズ株式会社 | Liquid temperature control device and temperature control system |
JP2018194200A (en) * | 2017-05-15 | 2018-12-06 | パナソニックIpマネジメント株式会社 | Refrigeration cycle device and liquid circulation device provided with the same |
CN111180364A (en) * | 2020-01-02 | 2020-05-19 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | Wet etching device and silicon wafer production system |
CN114992918B (en) * | 2022-04-29 | 2024-04-05 | 昆明理工大学 | Photovoltaic-thermal integrated solar-driven curing barn-freezer coupling system |
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JPH03148565A (en) * | 1989-11-02 | 1991-06-25 | Toshiba Corp | Heat pump device |
JP3702724B2 (en) | 1999-09-08 | 2005-10-05 | 三菱電機株式会社 | Heat pump system and heat pump system installation method |
JP2002089958A (en) | 2000-09-20 | 2002-03-27 | Toshiba Kyaria Kk | Heat pump type hot water supply system |
JP3475293B2 (en) | 2001-04-11 | 2003-12-08 | 西淀空調機株式会社 | Heat pump water heater |
JP3564687B2 (en) * | 2001-09-28 | 2004-09-15 | 関西電力株式会社 | Hot water supply device |
JP4731806B2 (en) * | 2003-12-01 | 2011-07-27 | パナソニック株式会社 | Refrigeration cycle apparatus and control method thereof |
JP4455518B2 (en) | 2006-03-01 | 2010-04-21 | シャープ株式会社 | Heat pump water heater |
JP5128267B2 (en) * | 2007-12-26 | 2013-01-23 | 東芝キヤリア株式会社 | Heat pump type water heater |
JP4807367B2 (en) | 2008-03-13 | 2011-11-02 | 三菱電機株式会社 | Heat pump water heater |
JP2010014374A (en) | 2008-07-07 | 2010-01-21 | Kansai Electric Power Co Inc:The | Heat pump type heating device |
JP5470374B2 (en) * | 2009-04-13 | 2014-04-16 | パナソニック株式会社 | Heat pump heating system |
JP2011085284A (en) * | 2009-10-14 | 2011-04-28 | Panasonic Corp | Heat pump type heating device |
JP5330988B2 (en) * | 2009-12-29 | 2013-10-30 | 日立アプライアンス株式会社 | Heat pump water heater |
JP5857197B2 (en) | 2011-08-22 | 2016-02-10 | パナソニックIpマネジメント株式会社 | Double-pipe heat exchanger and heat pump hot water generator equipped with the same |
JP5944135B2 (en) * | 2011-10-17 | 2016-07-05 | サンデンホールディングス株式会社 | Air conditioner for vehicles |
KR101942526B1 (en) * | 2012-01-31 | 2019-01-25 | 엘지전자 주식회사 | Refrigerator |
JP5999273B2 (en) * | 2013-10-17 | 2016-09-28 | 三菱電機株式会社 | Refrigeration cycle equipment |
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JP5999274B2 (en) | 2016-09-28 |
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