JP2010014374A - Heat pump type heating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat pump type heating device can reduce pressure loss of fluid to be heated in a supercooling part. <P>SOLUTION: The heat pump type heating device 1 for heating fluid to be heated by a refrigerant is provided with a refrigerant circuit 10 for passing the refrigerant and a heated fluid circuit 20 for passing the fluid to be heated. The refrigerant circuit 10 is formed by sequentially and annularly interconnecting a compressor 2 for compressing the refrigerant, a condensation part 3 for condensing the refrigerant by heat exchange with the fluid to be heated, the supercooling part 4 for supercooling the refrigerant by further heat exchange with the fluid to be heated, an expansion valve 5 for decompressing the refrigerant and an evaporator 6 for evaporating the refrigerant. The heated fluid circuit 20 is provided with the supercooling part 4 for performing heat exchange between the fluid to be heated and the refrigerant, a condensation part 3 for further performing heat exchange between the fluid to be heated sent from the supercooling part 4 with the refrigerant, and a bypass flow passage 26 for making at least part of the fluid to be heated to be sent to the supercooling part 4 bypass the supercooling part 4 and flow to the condensation part 3. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a heat pump heating apparatus that heats a fluid to be heated using a refrigeration cycle.

2. Description of the Related Art Conventionally, there is a heat pump heating device that uses a refrigeration cycle to heat a refrigerant, heats a fluid to be heated (mainly water is used) with the high-temperature refrigerant, and uses the heated fluid to be heated or heated. Various proposals have been made. As this type of heat pump heating device, for example, in Patent Document 1, in order to efficiently perform heat exchange between the refrigerant and the fluid to be heated, a plate-type heat exchanger is provided with a condensing unit and a supercooling unit based on the state of the refrigerant. A heat pump heating device divided into parts is disclosed.
JP 2005-106385 A

  By the way, in the condensing part, since the refrigerant flows in a gas state therein, it is necessary to increase the number of plates as compared with the supercooling part in which the refrigerant flows in a liquid state. In general, the amount of heat until the refrigerant that has become high-temperature gas discharged from the compressor becomes a condensate in the condensing unit (hereinafter referred to as the condensing unit calorie) About 3 to 5 times the amount of heat of the supercooling section). Therefore, since the exchange heat amount of the refrigerant and the fluid to be heated in the condensing part is about 3 to 5 times the exchange heat amount in the supercooling part, the heat transfer area of the condensing part is about 3 to 3 times the heat transfer area of the supercooling part. 5 times required. That is, the heat transfer area of the supercooling part needs to be about 1/3 to 1/5 of the heat transfer area of the condensing part. As a result, the cross-sectional areas of the refrigerant and the heated fluid in the supercooling part are It is necessary to set the flow path cross-sectional area of the condensing part and the fluid to be heated to about 1/3 to 1/5. However, since the flow rate and flow rate of the fluid to be heated are set by the flow rate and flow rate in the condensing unit, the flow rate and flow rate of the condensing unit are only about 1/3 to 1/5 of the cross-sectional area of the condensing unit. There is a problem in that the pressure loss increases in the cooling section, and as a result, the flow rate of the heated fluid flowing through the whole decreases.

  Then, this invention makes it a subject to provide the heat pump heating apparatus which can reduce the pressure loss of the to-be-heated fluid in a supercooling part.

  A heat pump heating device according to the present invention is made to solve the above-described problem, and is a heat pump heating device that heats a fluid to be heated by a refrigerant, a refrigerant circuit in which the refrigerant flows, A compressor for compressing, a condensing unit for exchanging heat with the heated fluid to condense the refrigerant, a supercooling unit for exchanging heat with the heated fluid to subcool the refrigerant, an expansion valve for decompressing the refrigerant, and evaporating the refrigerant A refrigerant circuit in which an evaporator is sequentially connected in an annular manner, and a heated fluid circuit in which a fluid to be heated flows inside, the supercooling unit that exchanges heat between the heated fluid and the refrigerant, and is sent from the supercooling unit The condensing unit for further exchanging heat of the heated fluid with the refrigerant, and the adding unit having a bypass flow path for allowing at least a part of the heated fluid sent to the supercooling unit to bypass the supercooling unit and to flow to the condensing unit It includes a fluid circuit.

  According to the above configuration, since at least a part of the heated fluid has the bypass flow path so as to bypass the supercooling portion, the flow rate of the heated fluid flowing to the supercooling portion is reduced and the The pressure loss of the fluid to be heated can be reduced, and consequently the decrease in the flow rate of the fluid to be heated flowing through the entire fluid to be heated circuit can be reduced.

  Although the said heat pump heating apparatus can take a various structure, the said condensation part and a supercooling part can be comprised as a plate-type heat exchanger, for example.

  The heated fluid circuit preferably further includes a flow rate adjusting device for adjusting the flow rate of the heated fluid flowing to the subcooling section. According to this configuration, the pressure loss of the heated fluid in the supercooling portion can be further reduced by adjusting the flow rate adjusting device to adjust the flow rate of the heated fluid flowing to the supercooling portion, and thus It can suppress more that the flow volume of the to-be-heated fluid which flows the whole to-be-heated fluid circuit reduces.

  The heated fluid circuit includes a heated fluid temperature sensor that measures the temperature of the heated fluid at the outlet of the supercooling unit, and a control device that controls the flow rate adjusting device based on the measured value of the heated fluid temperature sensor; It is preferable to further have. According to this configuration, if the temperature of the heated fluid measured by the heated fluid temperature sensor is lower than the predetermined temperature, the flow rate adjustment device is adjusted to reduce the flow rate of the heated fluid flowing to the subcooling section, and Conversely, if the temperature of the fluid to be heated is higher than a predetermined temperature, the flow rate of the fluid to be heated flowing to the subcooling part is adjusted, for example, by adjusting the flow rate adjusting device to increase the flow rate of the fluid to be heated flowing to the supercooling part. Can be adjusted more appropriately.

  The refrigerant circuit further includes a refrigerant temperature sensor that measures the temperature of the refrigerant that leaves the condensing unit and is sent to the supercooling unit, and the control device includes a measurement value of the heated fluid temperature sensor and a refrigerant temperature sensor. It is preferable that the flow control device is controlled based on the measured value. According to this configuration, the difference between the temperature of the refrigerant leaving the condensing unit and being sent to the supercooling unit and the temperature of the heated fluid at the subcooling unit outlet is calculated, and this temperature difference is larger than the predetermined temperature difference. If the temperature difference is smaller than a predetermined temperature difference, the flow regulator is adjusted to flow to the subcooling section. It is possible to more appropriately adjust the flow rate of the heated fluid that flows to the supercooling unit, such as increasing the flow rate of the heated fluid.

  ADVANTAGE OF THE INVENTION According to this invention, the heat pump heating apparatus which can reduce the pressure loss of the to-be-heated fluid in a supercooling part can be provided.

  Hereinafter, an embodiment of a heat pump heating apparatus according to the present invention will be described with reference to the drawings. 1 is a block diagram showing the entire heat pump heating apparatus, FIG. 2 is a perspective view of a condensing part, FIG. 3 is a cross-sectional view taken along line AA in FIG. 2, and FIG. 4 is a cross-sectional view taken along line BB in FIG. 5 is a perspective view of the supercooling section, FIG. 6 is a sectional view taken along line AA in FIG. 5, and FIG. 7 is a sectional view taken along line BB in FIG.

  As shown in FIG. 1, the heat pump heating device 1 includes a refrigerant circuit 10 in which a refrigerant circulates and a heated fluid circuit 20 in which water (a heated fluid) flows. In the refrigerant circuit 10, the compressor 2, the condensing unit 3, the supercooling unit 4, the expansion valve 5, and the evaporator 6 are annularly connected in this order. On the other hand, in the heated fluid circuit 20, the hot water storage tank 7, the circulation pump 8, the flow rate adjusting device 9, the supercooling unit 4, and the condensing unit 3 are connected in this order. In addition, although the condensation part 3 and the supercooling part 4 are shared by the refrigerant circuit 10 and the to-be-heated fluid circuit 20, the flow path through which the refrigerant formed in the condensation part 3 and the supercooling part 4 flows, and the flow through which water flows The roads are independent of each other.

  Next, each apparatus which comprises the heat pump heating apparatus 1 is demonstrated. First, each device installed in the refrigerant circuit 10 will be described. The compressor 2 is driven by a driving device (not shown), compresses the sucked refrigerant inside to a high pressure / high temperature, and discharges it to the condensing unit 3.

  As shown in FIG. 2, the condensing unit 3 is formed as a so-called plate heat exchanger in which a plurality of heat transfer plates are stacked. As the condensing unit 3 configured as the plate heat exchanger, a known plate heat exchanger can be used. Specifically, a plurality of heat transfer plates are stacked and flow between adjacent heat transfer plates. A channel is formed and water flows from the bottom to the top (see FIG. 3), and the coolant flows from the top to the bottom (see FIG. 4), thereby allowing the coolant and water to alternately flow in the flow path. The refrigerant and water exchange heat through the heat transfer plates. In this agglomeration part 3, water is heated by condensing the refrigerant in a high-temperature gas state. As shown in FIGS. 2 and 4, in the condensing unit 3, the outlet of the refrigerant is narrower than the inlet of the refrigerant.

  As shown in FIG. 5, the supercooling unit 4 is also formed as a so-called plate heat exchanger in which a plurality of plates are stacked, similarly to the condensing unit 3. Note that the amount of heat exchanged between the refrigerant and water in the supercooling unit 4 is usually about 1/3 to 1/5 of the amount of heat exchanged in the condensing unit 3 when the heat transfer area is the same. The number of heat transfer plates of the plate heat exchanger constituting the heat exchanger plate is about 1/3 to 1/5 of the number of heat transfer plates of the plate heat exchanger constituting the condensing unit 3. In this supercooling section 4, water flows from the lower side to the upper side (see FIG. 6), and the refrigerant flows from the upper side to the lower side (see FIG. 7), thereby allowing the refrigerant and water to flow alternately facing each other. Water is heated by exchanging heat between the refrigerant and water via the heat transfer plate, and by supercooling the refrigerant condensed in the condensing unit 3 into a liquid. In the supercooling unit 4, the refrigerant inlet and outlet pipes have substantially the same thickness as the refrigerant outlet pipe of the condensing unit 3.

  The expansion valve 5 is a valve that rapidly reduces the pressure of the refrigerant to lower the temperature and pressure. Further, the evaporator 6 is installed outdoors, and exchanges heat between the refrigerant flowing through the inside and the outside air, evaporates the refrigerant and sends it to the compressor 2.

  The heated fluid circuit 20 includes a hot water storage tank 7 for storing water (hot water) heated by the condensing unit 3 and the supercooling unit 4. Below the hot water storage tank 7, a water supply pipe 21 for supplying water from a water supply source (not shown) to the lower part of the hot water storage tank 7 and a supply pipe for supplying water stored in the lower part of the hot water storage tank 7 to the supercooling unit 4. 22 is connected. Further, in the upper part of the hot water storage tank 7, there is a return pipe 23 for returning the water (hot water) heated in the condensing unit 3 and the supercooling unit 4 to the upper part of the hot water storage tank 7, and a high temperature stored in the upper part of the hot water storage tank 7. A hot water supply pipe 24 for supplying hot water is connected. In addition, the heated fluid circuit 20 is configured so that the connecting pipe 25 connects the water flow path of the condensing unit 3 and the water flow path of the supercooling unit 4 so that the water flowing through the supercooling unit 4 is sent to the condensing unit 3. It is connected. A bypass pipe (bypass flow path) 26 branched from the supply pipe 22 and connected to the connecting pipe 25 is installed so that a part of the water flowing through the supply pipe 22 bypasses the supercooling unit 4. (See FIG. 5). The supply pipe 22 is provided with a circulation pump 8 for sending water to the supercooling unit 4 and the condensing unit 3, and the flow rate of water sent to the supercooling unit 4 downstream from the branch point of the bypass pipe 26. A flow rate adjusting device 9 for adjusting is installed. In this embodiment, the flow rate adjusting device 9 is configured as a valve that can adjust the flow rate of water flowing to the subcooling unit 4 by adjusting the opening degree.

  Operation | movement of the heat pump heating apparatus 1 comprised as mentioned above is demonstrated.

  First, the refrigerant flowing in the refrigerant circuit 10 will be mainly described. The refrigerant compressed into the high-temperature and high-pressure gas by the compressor 2 is sent to the condensing unit 3. In the condensing unit 3, the refrigerant flowing through the refrigerant flow path heats the heated medium by exchanging heat with the heated medium flowing through the heated fluid flow path, and the refrigerant itself is condensed and liquefied to be supercooled. Sent to part 4. In the supercooling unit 4, the refrigerant flowing through the refrigerant flow path further heat-exchanges with the water flowing through the heated fluid flow path to heat the water, and the refrigerant itself is supercooled and sent to the expansion valve 5. . The refrigerant sent to the expansion valve 5 is depressurized to a low temperature and low pressure, and then evaporated by exchanging heat with the outside air by the evaporator 6 and sent to the compressor 2 again. Water is heated by repeating the above cycle.

  Next, description will be made mainly on water flowing through the heated fluid circuit 20. First, the water stored in the lower part of the hot water storage tank 7 from the water supply source (not shown) is sent to the supercooling unit 4 through the supply pipe 22. Since the bypass pipe 26 is branched from the supply pipe 22, not all the water is sent to the supercooling unit 4, but a part of the water is sent directly to the condensing unit 3 through the bypass pipe 26. . The flow rate of water flowing to the supercooling unit 4 is adjusted by adjusting the opening degree of the flow rate adjusting device 9. The water flowing through the supercooling unit 4 is heated by exchanging heat with the refrigerant flowing through the supercooling unit 4. Then, the water heated through the supercooling unit 4 and the water not heated through the bypass pipe 26 join together at the connecting pipe 25 and are sent to the condensing unit 3. In the condensing unit 3, water is heated by exchanging heat with the refrigerant flowing through the refrigerant flow path of the condensing unit 3. Thus, the water heated by the condensing part 3 and the supercooling part 4 flows into the upper part of the hot water storage tank 7 through the return pipe 23, and is stored hot water gradually from the top. The water (hot water) heated by the condensing unit 3 and the supercooling unit 4 and stored in the upper portion of the hot water storage tank 7 is used for a bath, a heating appliance, and the like through the hot water supply pipe 24.

  As described above, according to the present embodiment, not all the water is allowed to flow to the supercooling unit 4, but a part of the water can be bypassed through the bypass pipe 26. The pressure loss of water can be reduced.

As mentioned above, although embodiment of this invention was described, this invention is not limited to these, A various change is possible unless it deviates from the meaning of this invention. For example, as shown in FIG. 8, the heated fluid temperature sensor 11 is installed in the connecting pipe 25 upstream from the point where it joins the bypass pipe 26 so as to measure the water temperature at the outlet of the supercooling section 4. At the same time, the refrigerant temperature sensor 12 may be installed at the inlet of the cooling unit 4 of the refrigerant circuit 10 so as to measure the temperature of the refrigerant sent to the supercooling unit 4. And the control apparatus 13 which adjusts the opening degree of the flow control apparatus 9 based on the measured value measured by these to-be-heated fluid temperature sensors 11 and the refrigerant | coolant temperature sensor 12 is installed. By configuring in this way, for example, the temperature difference T _r -T _w between the heated fluid temperature T _w measured by the heated fluid temperature sensor 11 and the refrigerant temperature _Tr measured by the refrigerant temperature sensor 12 is a set temperature difference. It is possible to adjust the flow rate of water sent to the supercooling unit 4 by adjusting the flow rate adjusting device 9 so as to be around ΔT.

The refrigerant temperature sensor 12 may be omitted and only the heated fluid temperature sensor 11 may be used. In this case, reduce the amount of water flowing by adjusting the lower if opening of the flow regulating device 9 than the heated fluid temperature T _w is the set temperature T measured by the heated fluid temperature sensor 11 to the supercooling part 4, On the contrary, if the temperature is higher than the set temperature T, the amount of water flowing to the supercooling unit 4 is increased by adjusting the opening degree of the flow control device 9.

  Moreover, in the said embodiment, although the flow volume adjusting device 9 is installed, this can be abbreviate | omitted. In this case, the flow rate of the heated fluid flowing to the supercooling unit 4 can be adjusted by adjusting the flow path cross-sectional area of the bypass pipe 26.

  In addition, a liquid receiver can be installed between the condensing unit 3 and the supercooling unit 4 of the refrigerant circuit 10.

It is a lineblock diagram showing an embodiment of a heat pump heating device concerning the present invention. It is a perspective view which shows the condensation part 3 which concerns on this embodiment. It is the sectional view on the AA line of FIG. FIG. 3 is a sectional view taken along line B-B in FIG. 2. It is a perspective view which shows the supercooling part 4 and the bypass pipe 26 which concern on this embodiment. It is the sectional view on the AA line of FIG. FIG. 6 is a sectional view taken along line B-B in FIG. 5. It is a block diagram which shows another embodiment of the heat pump heating apparatus which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Heat pump heating apparatus 2 Compressor 3 Condensing part 4 Supercooling part 5 Expansion valve 6 Evaporator 9 Flow control apparatus 10 Refrigerant circuit 20 Heated fluid circuit 26 Bypass pipe (bypass flow path)
11 Heated fluid temperature sensor 12 Refrigerant temperature sensor 13 Control device

Claims (5)

A heat pump heating device that heats a fluid to be heated with a refrigerant,
A refrigerant circuit in which a refrigerant flows, a compressor that compresses the refrigerant, a condensing unit that condenses the refrigerant by exchanging heat with the heated fluid, and a supercooling unit that supercools the refrigerant by exchanging heat with the heated fluid A refrigerant circuit in which an expansion valve for decompressing the refrigerant and an evaporator for evaporating the refrigerant are sequentially connected in an annular manner;
A heated fluid circuit in which a fluid to be heated flows, the supercooling unit for exchanging heat of the heated fluid with a refrigerant, and the condensing unit for further exchanging heat of the heated fluid sent from the supercooling unit with the refrigerant And a heated fluid circuit having a bypass flow path that bypasses the supercooled portion and flows to the condensing portion at least part of the heated fluid sent to the supercooled portion;
A heat pump heating device.   The heat pump heating device according to claim 1, wherein the condensing unit and the supercooling unit are plate heat exchangers.   The heat pump heating device according to claim 1 or 2, wherein the heated fluid circuit further includes a flow rate adjusting device that adjusts a flow rate of the heated fluid flowing to the supercooling unit.   The heated fluid circuit includes a heated fluid temperature sensor that measures the temperature of the heated fluid at an outlet of the supercooling unit, and a control device that controls the flow rate adjusting device based on a measurement value of the heated fluid temperature sensor. The heat pump heating device according to claim 3, further comprising: The refrigerant circuit further includes a refrigerant temperature sensor that measures the temperature of the refrigerant that leaves the condensing unit and is sent to the supercooling unit,
The heat pump heating device according to claim 4, wherein the control device controls the flow rate adjusting device based on a measured value of the heated fluid temperature sensor and a measured value of the refrigerant temperature sensor.

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