EP3056296A1 - Mélange pour liant pour sable de fonderie - Google Patents
Mélange pour liant pour sable de fonderie Download PDFInfo
- Publication number
- EP3056296A1 EP3056296A1 EP16154978.7A EP16154978A EP3056296A1 EP 3056296 A1 EP3056296 A1 EP 3056296A1 EP 16154978 A EP16154978 A EP 16154978A EP 3056296 A1 EP3056296 A1 EP 3056296A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- weight
- parts
- mixture
- alkyl ester
- phosphate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 title claims abstract description 65
- 239000011230 binding agent Substances 0.000 title claims abstract description 37
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 121
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 claims abstract description 105
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 26
- 230000002378 acidificating effect Effects 0.000 claims abstract description 24
- 125000005907 alkyl ester group Chemical group 0.000 claims abstract description 21
- 239000004576 sand Substances 0.000 claims abstract description 21
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 claims abstract description 15
- 150000003839 salts Chemical class 0.000 claims abstract description 12
- 239000003054 catalyst Substances 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 11
- JYFHYPJRHGVZDY-UHFFFAOYSA-N Dibutyl phosphate Chemical compound CCCCOP(O)(=O)OCCCC JYFHYPJRHGVZDY-UHFFFAOYSA-N 0.000 claims description 9
- BVXOPEOQUQWRHQ-UHFFFAOYSA-N dibutyl phosphite Chemical compound CCCCOP([O-])OCCCC BVXOPEOQUQWRHQ-UHFFFAOYSA-N 0.000 claims description 9
- -1 even more preferably Chemical compound 0.000 claims description 9
- 239000011819 refractory material Substances 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 7
- 239000012084 conversion product Substances 0.000 claims description 6
- SEGLCEQVOFDUPX-UHFFFAOYSA-N di-(2-ethylhexyl)phosphoric acid Chemical compound CCCCC(CC)COP(O)(=O)OCC(CC)CCCC SEGLCEQVOFDUPX-UHFFFAOYSA-N 0.000 claims description 6
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims description 5
- UFFAFBPZFGAMJJ-UHFFFAOYSA-N (2-methoxy-4,6-dimethylphenyl)boronic acid Chemical compound COC1=CC(C)=CC(C)=C1B(O)O UFFAFBPZFGAMJJ-UHFFFAOYSA-N 0.000 claims description 3
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 claims description 3
- KKUKTXOBAWVSHC-UHFFFAOYSA-N Dimethylphosphate Chemical compound COP(O)(=O)OC KKUKTXOBAWVSHC-UHFFFAOYSA-N 0.000 claims description 3
- 150000005690 diesters Chemical class 0.000 claims description 3
- LXCYSACZTOKNNS-UHFFFAOYSA-N diethoxy(oxo)phosphanium Chemical compound CCO[P+](=O)OCC LXCYSACZTOKNNS-UHFFFAOYSA-N 0.000 claims description 3
- UCQFCFPECQILOL-UHFFFAOYSA-N diethyl hydrogen phosphate Chemical compound CCOP(O)(=O)OCC UCQFCFPECQILOL-UHFFFAOYSA-N 0.000 claims description 3
- CZHYKKAKFWLGJO-UHFFFAOYSA-N dimethyl phosphite Chemical compound COP([O-])OC CZHYKKAKFWLGJO-UHFFFAOYSA-N 0.000 claims description 3
- QVKQJEWZVQFGIY-UHFFFAOYSA-N dipropyl hydrogen phosphate Chemical compound CCCOP(O)(=O)OCCC QVKQJEWZVQFGIY-UHFFFAOYSA-N 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 23
- 239000007849 furan resin Substances 0.000 abstract description 8
- 239000000377 silicon dioxide Substances 0.000 abstract description 3
- 229920003002 synthetic resin Polymers 0.000 abstract description 2
- 239000000057 synthetic resin Substances 0.000 abstract description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 27
- 239000002994 raw material Substances 0.000 description 27
- 239000011347 resin Substances 0.000 description 26
- 229920005989 resin Polymers 0.000 description 26
- 238000010992 reflux Methods 0.000 description 19
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 18
- 239000007864 aqueous solution Substances 0.000 description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- 235000011007 phosphoric acid Nutrition 0.000 description 11
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- 239000004202 carbamide Substances 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 8
- 229930040373 Paraformaldehyde Natural products 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 8
- 229920002866 paraformaldehyde Polymers 0.000 description 8
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 150000007513 acids Chemical class 0.000 description 6
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 238000009833 condensation Methods 0.000 description 6
- 230000005494 condensation Effects 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 6
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 4
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
- 229940015043 glyoxal Drugs 0.000 description 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 4
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- KHUXNRRPPZOJPT-UHFFFAOYSA-N phenoxy radical Chemical group O=C1C=C[CH]C=C1 KHUXNRRPPZOJPT-UHFFFAOYSA-N 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000001117 sulphuric acid Substances 0.000 description 3
- 235000011149 sulphuric acid Nutrition 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- KJPRLNWUNMBNBZ-QPJJXVBHSA-N (E)-cinnamaldehyde Chemical compound O=C\C=C\C1=CC=CC=C1 KJPRLNWUNMBNBZ-QPJJXVBHSA-N 0.000 description 2
- ZZXDRXVIRVJQBT-UHFFFAOYSA-N 2,3-dimethylbenzenesulfonic acid Chemical compound CC1=CC=CC(S(O)(=O)=O)=C1C ZZXDRXVIRVJQBT-UHFFFAOYSA-N 0.000 description 2
- IULJSGIJJZZUMF-UHFFFAOYSA-N 2-hydroxybenzenesulfonic acid Chemical compound OC1=CC=CC=C1S(O)(=O)=O IULJSGIJJZZUMF-UHFFFAOYSA-N 0.000 description 2
- CVLHGLWXLDOELD-UHFFFAOYSA-N 4-(Propan-2-yl)benzenesulfonic acid Chemical compound CC(C)C1=CC=C(S(O)(=O)=O)C=C1 CVLHGLWXLDOELD-UHFFFAOYSA-N 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 235000019445 benzyl alcohol Nutrition 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- KJPRLNWUNMBNBZ-UHFFFAOYSA-N cinnamic aldehyde Natural products O=CC=CC1=CC=CC=C1 KJPRLNWUNMBNBZ-UHFFFAOYSA-N 0.000 description 2
- 229940117916 cinnamic aldehyde Drugs 0.000 description 2
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 description 2
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- 239000004310 lactic acid Substances 0.000 description 2
- 235000014655 lactic acid Nutrition 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 229940100630 metacresol Drugs 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 2
- LJKDOMVGKKPJBH-UHFFFAOYSA-N 2-ethylhexyl dihydrogen phosphate Chemical compound CCCCC(CC)COP(O)(O)=O LJKDOMVGKKPJBH-UHFFFAOYSA-N 0.000 description 1
- IIDJRNMFWXDHID-UHFFFAOYSA-N Risedronic acid Chemical compound OP(=O)(O)C(P(O)(O)=O)(O)CC1=CC=CN=C1 IIDJRNMFWXDHID-UHFFFAOYSA-N 0.000 description 1
- 241001125843 Trichiuridae Species 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 125000000853 cresyl group Chemical group C1(=CC=C(C=C1)C)* 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005058 metal casting Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C1/00—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds
- B22C1/16—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents
- B22C1/20—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents
Definitions
- the present invention relates to synthetic resin-based systems, such as furan resins, to be used, in combination with suitable curing agents, as binders in mixtures with silica sand or other granular masses, for the production of foundry moulds and cores.
- the aforesaid foundry binder systems normally consist of two or more components which are mixed with sand or other granular masses in order to subsequently produce the shapes or cores into which or around which the molten metal will be poured.
- furan no-bake binder systems such as, for example, those described in pages 30-34 of the publication " No-bake cores and molds", published in 1980 by the American Foundrymen's Society , and incorporated herein for reference.
- binder systems consist of two liquids (furan resin and acidic curing agent) which, when added to the sand, produce, with no heating needed, cores and moulds which are suitable for the production of ferrous and non-ferrous metal castings.
- the furan resin is substantially constituted of furfuryl alcohol varyingly condensed with formaldehyde, and - if necessary - modified with ureic, melamine, and phenolic resins and various additives.
- the condensation reaction normally takes place in the presence of an acidic catalyst, such as, for example, acetic acid.
- an acidic catalyst such as, for example, acetic acid.
- Furan resins used in the no-bake systems are described, for example, in pages B320-6 to B320-15 of the publication " Manuel des sables à prise chimique", published by the Centre Technique des Industries de la Fonderie in 1993 , incorporated herein for reference. Furan resins are also described in US2343972 , US4634723 , and US 5459183 , incorporated herein for reference.
- the acidic curing agent has the function of creating the strongly acidic environment (usually below pHl) needed to cause the sand/resin mixture to cure.
- the acidic curing agent usually consists of a hydroalcoholic or aqueous solution of one or more sulphonic acids, if necessary, mixed with other organic or inorganic acids.
- sulphonic acids are benzenesulphonic acid, toluenesulphonic acid, xylene sulphonic acid, cumene sulphonic acid, phenolsulphonic acid, and methanesulphonic acid, or mixtures thereof.
- toluenesulphonic acid is by far the most used.
- the curing agent consists of orthophosphoric acid, either alone or mixed with sulphonic acids.
- Orthophosphoric acid brings drawbacks related to the formation - as a result of the casting heat - of non-volatile compounds, which accumulate in the sand and lower the refractoriness during subsequent reuse.
- Another component of the inorganic curing agents is sulphuric acid, which is almost always present in sulphonic acids in small amounts, as the residue of the sulphonation process.
- sulphuric acid is intentionally added to curing agents to increase the strength thereof. Sulphuric acid, however, is an often undesired component for both environmental reasons (unpleasant odours) and for reasons of quality in relation to highly critical castings.
- Patent application WO 2012/080454A1 relates to a low-emission cold-curing resin for the foundry industry with a furfuryl alcohol content of below 25%, a formaldehyde conversion product content of 40% or above, and an assumed free formaldehyde content of below 0.5%, which uses an organic acid with a pKa of 2.5 or above, and/or the salts thereof, as an acidic catalyst for condensation.
- the aforesaid alkyl esters of phosphorous acid and/or phosphoric acid may have a pKa below 2.5. They are preferably C 1 -C 8 alkyl esters, even more preferably diesters, such as dimethyl phosphate, diethyl phosphate, dipropyl phosphate, dibutyl phosphate, bis(2-ethylhexyl) phosphate, dimethyl phosphite, diethyl phosphite, dipropyl phosphite and dibutyl phosphite; particularly preferred esters have proved to be dibutyl phosphite, dibutyl phosphate, and bis(2-ethylhexyl) phosphate.
- diesters such as dimethyl phosphate, diethyl phosphate, dipropyl phosphate, dibutyl phosphate, bis(2-ethylhexyl) phosphate, dimethyl phosphite
- one aim of the present invention consists, therefore, of the use of at least one alkyl ester of phosphorous acid and/or phosphoric acid and/or a salt thereof as an acidic catalyst for the manufacture of foundry binder mixtures, for example those of the 'no-bake' type.
- a further aim of the invention also consists of a mixture usable as a foundry binder, for example of the no-bake type, containing:
- Formaldehyde conversion products is understood as the products resulting from the condensation between formaldehyde and furfuryl alcohol and, optionally, components other than furfuryl alcohol and/or products deriving from the condensation between formaldehyde and one or more compounds other than furfuryl alcohol.
- the aforesaid compounds other than furfuryl alcohol can be: urea, melamine, phenol or derivatives thereof; the phenol derivatives are preferably C 6 -C 25 organic compounds containing at least one phenolic radical or at least one benzene radical with two, three or four hydroxyl groups, such as diphenols (for example resorcinol), alkylphenols (for example ortho-cresol, meta-cresol and/or para-cresol), bisphenols (such as 4,4'-isopropylidenediphenol).
- diphenols for example resorcinol
- alkylphenols for example ortho-cresol, meta-cresol and/or para-cresol
- bisphenols such as 4,4'-isopropylidenediphenol
- the said mixture has a water content no greater than 20% by weight and, preferably, no greater than 15% by weight.
- the mixture has the following composition by weight:
- the one alkyl ester of phosphorous acid aaid/or phosphoric acid and/or a salt thereof is present in the mixture in quantities ranging from between 0.1% and 5.0% by weight, and preferably between 0.3% and 2.0% by weight, with respect to the weight of the mixture.
- the alkyl ester of phosphorous acid and/or phosphoric acid may be chosen from dibutyl phosphite, dibutyl phosphate and bis(2-ethylhexyl phosphate).
- the mixture may contain further components, such as, for example:
- a further aim of the present invention consists of a process for the production of the aforesaid mixture usable as a foundry binder, wherein a mixture containing:
- formaldehyde is used in the form of paraformaldehyde, in particular paraformaldehyde with a 89-91% by-weight content of formaldehyde.
- the mixture thus obtained is then cooled to a temperature ranging from 55 to 65°C and subjected to a further treatment to lower the free formaldehyde content to a value below 0.5%.
- a phenolic compound preferably chosen from among C 6 -C 25 organic compounds containing at least one phenolic radical or at least one benzene radical with two, three or four hydroxyl groups, such as diphenols (for example resorcinol), alkylphenols (for example cresoles or xylenols), bisphenols (such as 4,4'-isopropylidenediphenol).
- the mixture Upon reaching a free formaldehyde content below 0.5% by weight, the mixture is cooled to below 35°C, additivised with compounds able to increase adhesion between the binder system and the grains of sand, such as - for example - silanes, preferably including 3-aminopropyl triethoxy silane, 3-(Diethoxymethyl-silyl)propylamine), 3-glycidoxypropyltrimethoxysilane and any additives capable of reducing viscosity (for example, ethanol or benzyl alcohol) or the reactivity of the sand/resin/curing agent mixture (for example glycols).
- silanes preferably including 3-aminopropyl triethoxy silane, 3-(Diethoxymethyl-silyl)propylamine), 3-glycidoxypropyltrimethoxysilane and any additives capable of reducing viscosity (for example, ethanol or benzyl alcohol) or the reactivity of the
- a further aim of the present invention consists of a foundry binder system, preferably of the no-bake type, comprising or consisting of a binder mixture compliant with the description set out above and an acidic curing agent.
- the acidic curing agent may be an aqueous or hydroalcoholic solution with a pH below 2, preferably below 1, at ambient temperature.
- the aforesaid solution may contain one or more sulphonic acids, such as - for example - benzenesulphonic acid, toluenesulphonic acid, xylene sulphonic acid, cumene sulphonic acid, phenolsulphonic acid, methanesulphonic acid, if necessary, mixed with other organic or inorganic acids.
- the aforesaid solution may also contain orthophosphoric acid, either alone or mixed with sulphonic acids.
- the binder system may be composed of 0.2-0.8 parts by weight acidic curing agent and 0.6-1.5 parts by weight binder mixture, preferably from 0.3-0.6 parts by weight acidic curing agent and 0.7-1.2 parts by weight binder mixture.
- the cores and/or moulds according to the present invention may be composed of 0.2-0.8 parts by weight acidic curing agent, 0.6-1.5 parts by weight binder mixture, and 80-120 parts by weight sand and/or other refractory material; preferably, such cores and/or moulds contain 100 parts by weight sand and/or other refractory material, 0.3-0.6 parts by weight acidic curing agent, and 0.7-1.2 parts by weight binder mixture.
- One aim of the present invention also consists of the procedure for the production of foundry cores and/or moulds, wherein an acidic curing agent is mixed with sand and/or another refractory material, at ambient temperature, and with a binder mixture compliant with the description set out above.
- an acidic curing agent is mixed with sand and/or another refractory material, at ambient temperature, and with a binder mixture compliant with the description set out above.
- 80-120 parts by weight sand are mixed with 0.2-0.8 parts by weight said acidic curing agent and with 0.6-1.5 parts by weight binder mixture; still more preferably, approximately 100 parts by weight sand and/or other refractory material are mixed 0.3-0.6 parts by weight acidic curing agent and 0.7-1.2 parts by weight binder mixture.
- the aims of the present invention also include the foundry cores and/or moulds obtainable according to the said procedure.
- 'ambient temperature' is understood as a temperature ranging approximately from 0 ° to + 40 °C, preferably from +15 to + 30 °C, depending on the season and the geographic position (latitude, altitude, etc.) of the foundry.
- the free formaldehyde content was determined using the AN006.6 method, which is annexed hereto, and based on the reaction of formaldehyde with sodium sulphite. This method is taken from the text by Walker, J. Frederic, Formaldehyde, Third Edition, Robert E. Krieger Publishing Corporation and the EN ISO 11402:2004 method, incorporated herein for reference.
- Example 1 Resin NS-1A (not compliant with the invention).
- the two resins were used as the basis for the synthesis of the resins according to the invention.
- the catalyst was changed [(raw material e)] and - where necessary - the type and amount of the raw material d) was adjusted to maintain the pH during condensation at a value above 4.2, as was the quantity of water c), in order to maintain the reflux temperature at 120-125°C.
- the processing instructions remain unchanged.
- composition of the mixtures :
- standard + GF + bars were prepared with a 5 cm 2 rupture section.
- the bending strength of the aforesaid bars was measured after 3, 5, and 24 hours of stay at a temperature of 18-19°C from the time the mixture is unloaded from the mixer using a BENET device (COE model).
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Mold Materials And Core Materials (AREA)
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ITMI20150206 | 2015-02-13 |
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EP16154978.7A Withdrawn EP3056296A1 (fr) | 2015-02-13 | 2016-02-10 | Mélange pour liant pour sable de fonderie |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3085724A1 (fr) * | 2015-04-24 | 2016-10-26 | Cavenaghi SPA | Système de liant de fonderie avec une faible teneur en formaldéhyde et son procédé d'obtention |
CN116274851A (zh) * | 2022-12-15 | 2023-06-23 | 江苏华岗材料科技发展有限公司 | 一种铸造用粘合剂及制备方法 |
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JPS57139443A (en) * | 1981-02-20 | 1982-08-28 | Hitachi Ltd | Molding method for mold |
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EP0540837A1 (fr) * | 1991-11-07 | 1993-05-12 | Bakelite AG | Liant modifié avec de la lignine |
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WO2012080454A1 (fr) | 2010-12-16 | 2012-06-21 | Hüttenes-Albertus Chemische Werke GmbH | Liant durcissant à froid à faibles émissions pour l'industrie de la fonderie |
DE102012201971A1 (de) * | 2012-02-09 | 2013-08-14 | Hüttenes-Albertus Chemische Werke GmbH | Cold-Box-Bindemittelsysteme und Mischungen zur Verwendung als Additive für solche Bindemittelsysteme |
CN103113547B (zh) * | 2013-03-06 | 2014-11-05 | 苏州兴业材料科技股份有限公司 | 改性铸造用呋喃树脂的制备方法 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3085724A1 (fr) * | 2015-04-24 | 2016-10-26 | Cavenaghi SPA | Système de liant de fonderie avec une faible teneur en formaldéhyde et son procédé d'obtention |
EP3085724B1 (fr) | 2015-04-24 | 2019-06-05 | Cavenaghi SPA | Système de liant de fonderie avec une faible teneur en formaldéhyde et son procédé d'obtention |
EP3530685A1 (fr) * | 2015-04-24 | 2019-08-28 | Cavenaghi SPA | Système de liant de fonderie avec une faible teneur en formaldéhyde et son procédé d'obtention |
CN116274851A (zh) * | 2022-12-15 | 2023-06-23 | 江苏华岗材料科技发展有限公司 | 一种铸造用粘合剂及制备方法 |
CN116274851B (zh) * | 2022-12-15 | 2023-10-20 | 江苏华岗材料科技发展有限公司 | 一种铸造用粘合剂及制备方法 |
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