EP3055869B1 - Kompakte, vorkonfektionierbare überspannungsvorrichtung - Google Patents

Kompakte, vorkonfektionierbare überspannungsvorrichtung Download PDF

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Publication number
EP3055869B1
EP3055869B1 EP14747018.1A EP14747018A EP3055869B1 EP 3055869 B1 EP3055869 B1 EP 3055869B1 EP 14747018 A EP14747018 A EP 14747018A EP 3055869 B1 EP3055869 B1 EP 3055869B1
Authority
EP
European Patent Office
Prior art keywords
protection device
overvoltage protection
circuit board
laminated
separating slide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP14747018.1A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3055869A1 (de
Inventor
Georg Wittmann
Edmund ZÄUNER
Thomas Gottschalk
Manuel Scharf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dehn SE and Co KG
Original Assignee
Dehn and Soehne GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dehn and Soehne GmbH and Co KG filed Critical Dehn and Soehne GmbH and Co KG
Publication of EP3055869A1 publication Critical patent/EP3055869A1/de
Application granted granted Critical
Publication of EP3055869B1 publication Critical patent/EP3055869B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors
    • H01C7/126—Means for protecting against excessive pressure or for disconnecting in case of failure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T1/00—Details of spark gaps
    • H01T1/14—Means structurally associated with spark gap for protecting it against overload or for disconnecting it in case of failure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • H01H2037/762—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit using a spring for opening the circuit when the fusible element melts

Definitions

  • the invention relates to a compact, ready-to-use overvoltage protection device based on varistor with thermal separation unit, consisting of a two-sided laminated circuit board with fürheft ists Scheme, wherein the at least one varistor connected to a first side of the laminated circuit board, in particular soldered and continue on the second side of the laminated circuit board provided with the plated-through area in operative connection separating slide, according to claim 1.
  • the local varistor unit is disconnected from the external circuit by a disconnect contact along a linear displacement axis by means of springs arranged in parallel under corresponding overload conditions.
  • the production of the thermal separation point by soldering is possible in this solution of the prior art only in the built-in module.
  • the mass of the overvoltage limiting component must be uniformly heated to provide safe and instantaneous isolation.
  • connection plate On the back of the circuit board, a special connection plate is firmly bonded to the plated-through holes with low-temperature solder.
  • the connection plate has an M-shape and can be two separation modes realize.
  • tapers of the cross section should occur in the event of a short circuit, a melting.
  • a pure thermal separation is possible when the melting temperature of the low-temperature solder is exceeded.
  • the M-shaped configuration of the connection plate leads to very long conduction paths with corresponding inductances and a resulting disadvantageous influence on surge current events. In the region of the plated-through holes, mixing of the solder, which serves to fix the varistor, and the solder of the separating device, which has negative consequences for the separation properties.
  • an overvoltage protection device with thermal cutting device in which a metal oxide varistor is provided on both sides with contact plates. On a first side is located on the contact plate, a connection bracket, which is materially connected there by means of low-temperature solder. In the case of reaching the melting temperature of the low-temperature solder, an insulating plate, which is biased by springs, pushes between the contact point and connecting bracket, so that a separation can be realized.
  • the design of the local connection parts is very expensive.
  • the realized overvoltage protection device has only a low surge current capability. Also in this solution, the execution of the solder connection of the thermal separation point is possible only in the built-in module. An inexpensive prefabrication with speaking electrical functional test is therefore not possible or very difficult.
  • the overvoltage protection device to be created should moreover ensure that the shock-current-resistant connection, which forms the separation point in the event of an overload, does not act on permanent forces during the normal operating time, which can lead to a deteriorated long-term behavior.
  • the invention is based on a compact varistor-based overvoltage protection device with thermal cut-off unit which can be prefabricated in accordance with the task.
  • the overvoltage protection device consists of a two-sided laminated printed circuit board with für Arichans Kunststoff. These may be conventional copper clad circuit boards on an insulating substrate, e.g. Epoxy material act.
  • the at least one varistor is preferably connected to a first side of the laminated printed circuit board by large-area soldering. Furthermore, on the second side of the laminated printed circuit board, a separating slide operatively connected to the plated-through area is provided.
  • the plated-through holes are realized as known from the prior art, so-called VIAs. According to the invention, a first contact area, which is connected to the plated-through area, and a second contact area, which is remote therefrom via a separation distance, are formed on the second side of the laminated printed circuit board.
  • the shut-off valve bridges both contact surfaces and releases the separation distance in case of overload, i. the bridging of the contact surfaces is canceled by movement of the Abtrennschiebers.
  • the Abtrennschieber of a laminated printed circuit board material wherein the contact surface bridging the conductive region of the printed circuit board material of the Abtrennschiebers has a first and a second soldering portion with befindlichem therebetween Stromengstelle.
  • the Stromengstelle can be formed by the fact that the surface of the printed circuit board Kupferkasch michis is reduced with the result that in case of overload, the remaining surface area is destroyed by appropriate heat development.
  • the separation slide can be formed in a preferred embodiment as a pan or rotary valve.
  • the movement of the pivot or rotary slide takes place here in the plane of the circuit board, which receives the at least one varistor element.
  • the second contact surface is connected to a surface section for fastening, in particular soldering, an electrical connection element.
  • This element can e.g. be a conductive contact angle, which leads to corresponding external terminals of a surge protection plug-in part.
  • the first side of the laminated circuit board has a substantially corresponding to the varistor surface laminated portion for the desired full-surface connection and for optimum heat transfer.
  • the via region is integrated in this laminated portion.
  • the through-contacting region hangs therewith, as already mentioned, together, but covered in the operating case, the corresponding contact surface of the Abtrennschieber preferably only the actual contact surface, but not the fürress michs Scheme.
  • the contact area and the via area are preferably separated by solder resist, which prevents mixing of different solder types. It is therefore readily possible here to connect the contact surface area with the separation slide via a solder which has a correspondingly optimized melting temperature tailored to the separation case. This melting temperature is usually lower than the melting temperature of the solder connecting the varistor to the first side of the circuit board.
  • the soldering of the separating slide with the corresponding contact surfaces can be carried out with a solder which has a lower melting temperature.
  • the base material of the circuit board and the Abtrennschiebers may consist of a plastic, hard paper, but also of a ceramic.
  • a printed circuit board material based on epoxy resin is preferably used.
  • a soldering pad surface is preferably provided on the second side of the laminated printed circuit board outside the range of movement of the Abtrennschiebers, which serves to secure a releasing when heating lock button or a blocking pill.
  • the lock button or the blocking pill may also consist of a copper-clad circuit board material and is firmly bonded to the soldering pad.
  • the melting temperature of the bonding solder is chosen to be lower than the melting temperature of the solder, which serves to connect the Abtrennschiebers with the corresponding contact surfaces on the second side of the circuit board in this case.
  • the compact surge protection device summarized above can be inserted into a housing of a plug-in part of the overvoltage protection device and is electrically connected to terminal contacts located there, in particular terminal plug contacts.
  • a spring-biased bracket is arranged, which is on the one hand with the Abtrennschieber and on the other hand with a status display in operative connection.
  • the status indicator may be formed, for example, as a sliding surface which moves within a viewing window of the housing and releases different color coding sections. In a proper state, for example, the recognition of a green section in the viewing window. In the case of prior damage, e.g. a yellow section is released. In the case of thermal overload, a red area becomes visible.
  • the spring-biased bracket has in a preferred embodiment of the invention, a stop which bears against the lock button. After thermally induced release of the lock button or the blocking pill from the Lötstütztician® then the spring-loaded bracket is the power side connected to the Abtrennschieber.
  • the locking button or the blocking pill moves in accordance with thermally induced loosening in this regard provided in the interior of the housing receiving surface.
  • the status indicator performs a motion that releases the aforementioned yellow portion, so that it can be seen during normal maintenance or inspection that the overvoltage protection device was subject to a thermal load or previous damage.
  • a recess for the leading reception of a club-like end pointing away from the contact surfaces of the separating slide is provided educated.
  • the blocking button or barrier pill is connected to the solder pad surface with a solder melting at a first temperature and the separator gate is connected to a solder melting at a second temperature with the contact surfaces, the first melting temperature being lower than the second temperature.
  • the described housing for receiving the prefabricated overvoltage protection device preferably has a conventional flat rectangular or square shape with a housing bottom, from the underside terminal contacts extending, which engage in corresponding recesses of a base part.
  • a recess which is penetrated by a pin which is part of the spring-biased bracket. This pin is in a preferred embodiment with a remote display in conjunction and operates them.
  • a front and back side representation apparent embodiment has the first side of the circuit board 1 (back) has a large surface area 2 for soldering the active element of the overvoltage protection device, such as a varistor (see Fig. 3 ).
  • This via region 3 connects to the second side of the laminated circuit board 1 (front side).
  • the second side of the laminated printed circuit board 1 has a first contact surface 4 connected to the plated-through region 3. About a separation distance 5, a second contact surface 6 is formed.
  • the Indian Fig. 2 shown separating slide 7 bridges the contact surfaces 4 and 6 and are in the overload case, the separation distance 5, which is free of a conductive surface, free.
  • the second contact surface 6 is very large area and thus current-carrying connected to the area 8, for soldering, for example, an electrical connection angle 9, such as in the Fig. 6 and 7 can be seen, this connection angle 9 is connected to a plug contact 10.
  • the Abtrennschieber 7 of a laminated printed circuit board material is traceable, there is also the Abtrennschieber 7 of a laminated printed circuit board material.
  • the conductive area of the circuit board material of the separation slide 7 bridging the contact areas comprises a first and a second soldering section 12 with a flow throat 13 therebetween.
  • the separation slide has a cone-side end 14 with a shape compatible with a corresponding recess 15 in the interior of the housing 16 of the plug-in part is.
  • the Fig. 3 shows the first side of the copper-clad circuit board 1 soldered there varistor 16, on the recognizable surface of a contact plate 17 with terminal lug 18 is also arranged by soldering.
  • the plan view of the second side of the laminated circuit board 1 according to Fig. 4 shows the state of Abtrennschiebers 7 in the usual case of operation.
  • the plated-through area 3 on this side of the printed circuit board 1 is free or separated by solder mask from the contact surface 4, ie not integrated into the soldering between the separating slide 7 and the corresponding contact surface on the printed circuit board 1.
  • the arrow representation symbolizes the direction in which a later explained bracket ( Fig. 8 to 10 ) Brings forces to act to move the Abtrennschieber 7 in case of overload on the separation point 6 in a corresponding Abtrennschreib.
  • Fig. 5 shows again in comparison the state of operation case (left) and separation case (right).
  • the thermal separation can be realized, on the one hand, by the fact that the varistor heats up so much due to overload or due to aging that a corresponding low-temperature solder melts and the movement of the separating slide releases. Also, in the case of short circuit, the constriction 13 can heat up so far that a melting occurs and the separating device is triggered.
  • the lock button or the blocking pill 21 likewise consists of a copper-clad printed circuit board material and is connected in a material-bonded manner to the soldering support 20.
  • a receiving space 23 is provided inside the housing 16, which offers the possibility of receiving the blocking button or blocking pill 21 when the connecting solder melts.
  • the spring-biased bracket 30 Decisive for the movement of the Abtrennschiebers 7 is the spring-biased bracket 30, which is subject to a pivot point 31, which is present as a fixed point in the housing 16, a pivotable mounting.
  • a leg-like extension 32 of the bracket 30 receives a spring 33 and is supported on the inner side of the housing bottom 34 from.
  • the spring-biased bracket 30 is also still in operative connection with a status indicator 35th
  • the status display 35 may show a lateral movement in the illustrations of FIGS. 8 to 10 from left to right and release different fields, which may be different in color, release. As a result, it is always recognizable via an unillustrated viewing window of the housing whether the actual overvoltage protection device located inside the housing is functional, a case of previous damage has occurred or a failure has occurred.
  • the spring-biased bracket 30 has a stop 36 which rests against the locking button or the blocking pill 21.
  • the blocking button or blocking pill 21 is connected to the corresponding soldering pad surface 20 with solder melting at a first temperature and the separating slide 7 is connected to a solder melting at a second temperature with the corresponding contact surfaces, the first temperature being lower than the second temperature.
  • the spring force can be selected to be high enough to overcome existing frictional forces between the opposing surfaces of the Abtrennschiebers 7 and the copper-clad circuit board 1 and quickly and safely bring about the separation state, without this higher force is permanently on the functionally essential solder joint effect.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Fuses (AREA)
  • Thermistors And Varistors (AREA)
EP14747018.1A 2013-10-08 2014-08-01 Kompakte, vorkonfektionierbare überspannungsvorrichtung Not-in-force EP3055869B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013016653 2013-10-08
DE201310021936 DE102013021936B3 (de) 2013-10-08 2013-12-20 Kompakte, vorkonfektionierbare Überspannungsschutzvorrichtung
PCT/EP2014/066597 WO2015051934A1 (de) 2013-10-08 2014-08-01 Kompakte, vorkonfektionierbare überspannungsvorrichtung

Publications (2)

Publication Number Publication Date
EP3055869A1 EP3055869A1 (de) 2016-08-17
EP3055869B1 true EP3055869B1 (de) 2019-02-20

Family

ID=52389071

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14747018.1A Not-in-force EP3055869B1 (de) 2013-10-08 2014-08-01 Kompakte, vorkonfektionierbare überspannungsvorrichtung

Country Status (5)

Country Link
EP (1) EP3055869B1 (ja)
JP (1) JP2016536783A (ja)
CN (1) CN105580092B (ja)
DE (1) DE102013021936B3 (ja)
WO (1) WO2015051934A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4216237A3 (en) * 2022-01-24 2023-09-13 Raycap IP Development LTD Surge protective device modules and assemblies

Families Citing this family (11)

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Publication number Priority date Publication date Assignee Title
US10319545B2 (en) 2016-11-30 2019-06-11 Iskra Za{hacek over (s)}{hacek over (c)}ite d.o.o. Surge protective device modules and DIN rail device systems including same
US10707678B2 (en) 2016-12-23 2020-07-07 Ripd Research And Ip Development Ltd. Overvoltage protection device including multiple varistor wafers
US10447026B2 (en) 2016-12-23 2019-10-15 Ripd Ip Development Ltd Devices for active overvoltage protection
US10340110B2 (en) 2017-05-12 2019-07-02 Raycap IP Development Ltd Surge protective device modules including integral thermal disconnect mechanisms and methods including same
US10685767B2 (en) 2017-09-14 2020-06-16 Raycap IP Development Ltd Surge protective device modules and systems including same
DE202018106960U1 (de) * 2018-02-27 2019-01-03 Dehn + Söhne Gmbh + Co. Kg Überspannungsschutzanordnung, bestehend aus einer in einem isolierenden Gehäuse befindlichen Hörnerfunkenstrecke
US11223200B2 (en) 2018-07-26 2022-01-11 Ripd Ip Development Ltd Surge protective devices, circuits, modules and systems including same
JP7119257B2 (ja) * 2019-03-15 2022-08-17 三菱マテリアル株式会社 避雷器
US11862967B2 (en) 2021-09-13 2024-01-02 Raycap, S.A. Surge protective device assembly modules
US11723145B2 (en) 2021-09-20 2023-08-08 Raycap IP Development Ltd PCB-mountable surge protective device modules and SPD circuit systems and methods including same
US11990745B2 (en) 2022-01-12 2024-05-21 Raycap IP Development Ltd Methods and systems for remote monitoring of surge protective devices

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Also Published As

Publication number Publication date
EP3055869A1 (de) 2016-08-17
JP2016536783A (ja) 2016-11-24
CN105580092A (zh) 2016-05-11
WO2015051934A1 (de) 2015-04-16
DE102013021936B3 (de) 2015-02-12
CN105580092B (zh) 2019-03-12

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