EP3053704A4 - Dispositif de polissage, procédé de traitement d'élément de polissage, procédé de modification d'élément de polissage, outil de coupe de traitement de forme, et outil de modification de surface - Google Patents
Dispositif de polissage, procédé de traitement d'élément de polissage, procédé de modification d'élément de polissage, outil de coupe de traitement de forme, et outil de modification de surface Download PDFInfo
- Publication number
- EP3053704A4 EP3053704A4 EP14851154.6A EP14851154A EP3053704A4 EP 3053704 A4 EP3053704 A4 EP 3053704A4 EP 14851154 A EP14851154 A EP 14851154A EP 3053704 A4 EP3053704 A4 EP 3053704A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- polishing
- polishing member
- tool
- modification
- cutting tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
- B24B53/07—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels by means of forming tools having a shape complementary to that to be produced, e.g. blocks, profile rolls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/08—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding non-circular cross-sections, e.g. shafts of elliptical or polygonal cross-section
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013209601 | 2013-10-04 | ||
PCT/JP2014/076359 WO2015050185A1 (fr) | 2013-10-04 | 2014-10-02 | Dispositif de polissage, procédé de traitement d'élément de polissage, procédé de modification d'élément de polissage, outil de coupe de traitement de forme, et outil de modification de surface |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3053704A1 EP3053704A1 (fr) | 2016-08-10 |
EP3053704A4 true EP3053704A4 (fr) | 2017-07-19 |
Family
ID=52778772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14851154.6A Withdrawn EP3053704A4 (fr) | 2013-10-04 | 2014-10-02 | Dispositif de polissage, procédé de traitement d'élément de polissage, procédé de modification d'élément de polissage, outil de coupe de traitement de forme, et outil de modification de surface |
Country Status (7)
Country | Link |
---|---|
US (1) | US20160236322A1 (fr) |
EP (1) | EP3053704A4 (fr) |
JP (2) | JPWO2015050185A1 (fr) |
KR (1) | KR20160067107A (fr) |
CN (1) | CN105636743B (fr) |
TW (1) | TWI689378B (fr) |
WO (1) | WO2015050185A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6884015B2 (ja) * | 2017-03-22 | 2021-06-09 | 株式会社荏原製作所 | 基板の研磨装置および研磨方法 |
US11685013B2 (en) | 2018-01-24 | 2023-06-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad for chemical mechanical planarization |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1082418A (en) * | 1966-07-22 | 1967-09-06 | Toolmasters Ltd | Improvements relating to grinding wheels |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS47636Y1 (fr) * | 1966-07-12 | 1972-01-11 | ||
US3526058A (en) * | 1967-06-28 | 1970-09-01 | Litton Industries Inc | Diamond roller dresser |
US4010583A (en) * | 1974-05-28 | 1977-03-08 | Engelhard Minerals & Chemicals Corporation | Fixed-super-abrasive tool and method of manufacture thereof |
FR2327847A1 (fr) * | 1975-10-15 | 1977-05-13 | Monsanto Co | Galet pour profiler par ecrasement une meule de rectification |
US4182082A (en) * | 1978-01-19 | 1980-01-08 | Ernst Winter & Sohn (Gmbh & Co.) | Method for the profiling of grinding wheels and apparatus therefor |
US4555873A (en) * | 1981-03-30 | 1985-12-03 | Energy-Adaptive Grinding, Inc. | Method and apparatus for wheel conditioning in a grinding machine |
JPS6090674A (ja) * | 1983-10-22 | 1985-05-21 | Yasumasa Nakamura | 研麿用スポンジホイ−ル |
JPS60143646U (ja) * | 1984-03-02 | 1985-09-24 | 豊田工機株式会社 | 研削装置 |
JPH01289671A (ja) * | 1988-05-11 | 1989-11-21 | Boarheath Theodore | サンディングホイール |
JP2559650B2 (ja) * | 1991-11-27 | 1996-12-04 | 信越半導体株式会社 | ウエーハ面取部研磨装置 |
JP2921250B2 (ja) * | 1992-02-28 | 1999-07-19 | 信越半導体株式会社 | ウエーハ面取部の鏡面研磨方法及び装置 |
JPH06170720A (ja) * | 1992-12-02 | 1994-06-21 | Speedfam Co Ltd | 定盤のドレッシング装置 |
US5624306A (en) * | 1993-11-23 | 1997-04-29 | Visser Irrevocable Trust 1992-1 | Stacked sanding wheel for radical profiles |
JPH08206953A (ja) * | 1994-11-28 | 1996-08-13 | Canon Inc | 研削・研磨方法及び研削・研磨用工具及びその製造方法 |
US5938507A (en) * | 1995-10-27 | 1999-08-17 | Applied Materials, Inc. | Linear conditioner apparatus for a chemical mechanical polishing system |
EP0875339A4 (fr) * | 1995-12-06 | 2001-01-10 | Idemitsu Kosan Co | Procede de lissage des surfaces de materiau en feuille, et procede de fabrication dudit materiau selon ledit procede |
JP3676030B2 (ja) * | 1997-04-10 | 2005-07-27 | 株式会社東芝 | 研磨パッドのドレッシング方法及び半導体装置の製造方法 |
JP3187353B2 (ja) | 1997-10-01 | 2001-07-11 | 株式会社エスプリジャパン | 自動車等の乗り物の空調装置の清掃方法および清掃装置 |
JPH11188590A (ja) | 1997-12-22 | 1999-07-13 | Speedfam Co Ltd | エッジポリッシング装置 |
CN1138612C (zh) * | 1998-06-25 | 2004-02-18 | 尤诺瓦英国有限公司 | 抛光晶片边缘的方法和设备 |
US6783428B1 (en) * | 1999-01-18 | 2004-08-31 | Nsk Ltd. | Method for forming grooves on workpiece and for dressing a grindstone used in the groove formation |
JP2001121391A (ja) * | 1999-10-28 | 2001-05-08 | Canon Inc | 研磨皿の合わせ方法 |
US6630059B1 (en) * | 2000-01-14 | 2003-10-07 | Nutool, Inc. | Workpeice proximity plating apparatus |
JP2003048164A (ja) * | 2001-08-07 | 2003-02-18 | Disco Abrasive Syst Ltd | 研磨ホイール |
JP3534115B1 (ja) * | 2003-04-02 | 2004-06-07 | 住友電気工業株式会社 | エッジ研磨した窒化物半導体基板とエッジ研磨したGaN自立基板及び窒化物半導体基板のエッジ加工方法 |
JP2005340732A (ja) * | 2004-05-31 | 2005-12-08 | Disco Abrasive Syst Ltd | ウェーハ清浄化装置 |
JP2007088143A (ja) * | 2005-09-21 | 2007-04-05 | Elpida Memory Inc | エッジ研磨装置 |
JP4742845B2 (ja) * | 2005-12-15 | 2011-08-10 | 信越半導体株式会社 | 半導体ウエーハの面取り部の加工方法及び砥石の溝形状の修正方法 |
JP2010173016A (ja) * | 2009-01-29 | 2010-08-12 | Mitsubishi Materials Corp | 半導体研磨布用コンディショナー、半導体研磨布用コンディショナーの製造方法及び半導体研磨装置 |
JP2010182813A (ja) * | 2009-02-04 | 2010-08-19 | Noritake Super Abrasive Co Ltd | Cmpパッドコンディショナー |
CN201380419Y (zh) * | 2009-03-02 | 2010-01-13 | 湖北新火炬科技股份有限公司 | 金刚滚轮磨削砂轮用于磨削轮毂总成内滚道的装置 |
JP5405887B2 (ja) * | 2009-04-27 | 2014-02-05 | ルネサスエレクトロニクス株式会社 | 研磨装置及び研磨方法 |
CN201728564U (zh) * | 2010-07-28 | 2011-02-02 | 许昌义 | 角磨机可帖轮与不干胶砂纸 |
-
2014
- 2014-10-02 EP EP14851154.6A patent/EP3053704A4/fr not_active Withdrawn
- 2014-10-02 CN CN201480054332.6A patent/CN105636743B/zh active Active
- 2014-10-02 US US15/026,096 patent/US20160236322A1/en not_active Abandoned
- 2014-10-02 WO PCT/JP2014/076359 patent/WO2015050185A1/fr active Application Filing
- 2014-10-02 TW TW103134422A patent/TWI689378B/zh active
- 2014-10-02 KR KR1020167008527A patent/KR20160067107A/ko not_active Application Discontinuation
- 2014-10-02 JP JP2015540533A patent/JPWO2015050185A1/ja active Pending
-
2017
- 2017-07-03 JP JP2017130253A patent/JP6474861B2/ja active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1082418A (en) * | 1966-07-22 | 1967-09-06 | Toolmasters Ltd | Improvements relating to grinding wheels |
Non-Patent Citations (1)
Title |
---|
See also references of WO2015050185A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP6474861B2 (ja) | 2019-02-27 |
KR20160067107A (ko) | 2016-06-13 |
JPWO2015050185A1 (ja) | 2017-03-09 |
CN105636743B (zh) | 2021-01-08 |
JP2017185623A (ja) | 2017-10-12 |
TW201536479A (zh) | 2015-10-01 |
WO2015050185A1 (fr) | 2015-04-09 |
US20160236322A1 (en) | 2016-08-18 |
CN105636743A (zh) | 2016-06-01 |
TWI689378B (zh) | 2020-04-01 |
EP3053704A1 (fr) | 2016-08-10 |
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Legal Events
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 20160331 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
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AX | Request for extension of the european patent |
Extension state: BA ME |
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DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20170621 |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: B24B 9/06 20060101ALI20170614BHEP Ipc: B24B 19/08 20060101ALI20170614BHEP Ipc: B24B 53/07 20060101AFI20170614BHEP Ipc: B24B 53/02 20120101ALI20170614BHEP |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
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18W | Application withdrawn |
Effective date: 20180626 |