EP3053704A4 - Poliervorrichtung, verarbeitungsverfahren für ein polierelement, verfahren zur modifikation des polierelements, formverarbeitendes schneidwerkzeug und oberflächenmodifikationswerkzeug - Google Patents

Poliervorrichtung, verarbeitungsverfahren für ein polierelement, verfahren zur modifikation des polierelements, formverarbeitendes schneidwerkzeug und oberflächenmodifikationswerkzeug Download PDF

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Publication number
EP3053704A4
EP3053704A4 EP14851154.6A EP14851154A EP3053704A4 EP 3053704 A4 EP3053704 A4 EP 3053704A4 EP 14851154 A EP14851154 A EP 14851154A EP 3053704 A4 EP3053704 A4 EP 3053704A4
Authority
EP
European Patent Office
Prior art keywords
polishing
polishing member
tool
modification
cutting tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14851154.6A
Other languages
English (en)
French (fr)
Other versions
EP3053704A1 (de
Inventor
Hitoshi Morinaga
Hiroshi Asano
Shingo OTSUKI
Kazusei Tamai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of EP3053704A1 publication Critical patent/EP3053704A1/de
Publication of EP3053704A4 publication Critical patent/EP3053704A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/07—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels by means of forming tools having a shape complementary to that to be produced, e.g. blocks, profile rolls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/08—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding non-circular cross-sections, e.g. shafts of elliptical or polygonal cross-section
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
EP14851154.6A 2013-10-04 2014-10-02 Poliervorrichtung, verarbeitungsverfahren für ein polierelement, verfahren zur modifikation des polierelements, formverarbeitendes schneidwerkzeug und oberflächenmodifikationswerkzeug Withdrawn EP3053704A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013209601 2013-10-04
PCT/JP2014/076359 WO2015050185A1 (ja) 2013-10-04 2014-10-02 研磨装置、研磨部材の加工方法、研磨部材の修正方法、形状加工用切削工具及び表面修正用工具

Publications (2)

Publication Number Publication Date
EP3053704A1 EP3053704A1 (de) 2016-08-10
EP3053704A4 true EP3053704A4 (de) 2017-07-19

Family

ID=52778772

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14851154.6A Withdrawn EP3053704A4 (de) 2013-10-04 2014-10-02 Poliervorrichtung, verarbeitungsverfahren für ein polierelement, verfahren zur modifikation des polierelements, formverarbeitendes schneidwerkzeug und oberflächenmodifikationswerkzeug

Country Status (7)

Country Link
US (1) US20160236322A1 (de)
EP (1) EP3053704A4 (de)
JP (2) JPWO2015050185A1 (de)
KR (1) KR20160067107A (de)
CN (1) CN105636743B (de)
TW (1) TWI689378B (de)
WO (1) WO2015050185A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6884015B2 (ja) * 2017-03-22 2021-06-09 株式会社荏原製作所 基板の研磨装置および研磨方法
US11685013B2 (en) 2018-01-24 2023-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad for chemical mechanical planarization

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1082418A (en) * 1966-07-22 1967-09-06 Toolmasters Ltd Improvements relating to grinding wheels

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JPS47636Y1 (de) * 1966-07-12 1972-01-11
US3526058A (en) * 1967-06-28 1970-09-01 Litton Industries Inc Diamond roller dresser
US4010583A (en) * 1974-05-28 1977-03-08 Engelhard Minerals & Chemicals Corporation Fixed-super-abrasive tool and method of manufacture thereof
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US4555873A (en) * 1981-03-30 1985-12-03 Energy-Adaptive Grinding, Inc. Method and apparatus for wheel conditioning in a grinding machine
JPS6090674A (ja) * 1983-10-22 1985-05-21 Yasumasa Nakamura 研麿用スポンジホイ−ル
JPS60143646U (ja) * 1984-03-02 1985-09-24 豊田工機株式会社 研削装置
JPH01289671A (ja) * 1988-05-11 1989-11-21 Boarheath Theodore サンディングホイール
JP2559650B2 (ja) * 1991-11-27 1996-12-04 信越半導体株式会社 ウエーハ面取部研磨装置
JP2921250B2 (ja) * 1992-02-28 1999-07-19 信越半導体株式会社 ウエーハ面取部の鏡面研磨方法及び装置
JPH06170720A (ja) * 1992-12-02 1994-06-21 Speedfam Co Ltd 定盤のドレッシング装置
US5624306A (en) * 1993-11-23 1997-04-29 Visser Irrevocable Trust 1992-1 Stacked sanding wheel for radical profiles
JPH08206953A (ja) * 1994-11-28 1996-08-13 Canon Inc 研削・研磨方法及び研削・研磨用工具及びその製造方法
US5938507A (en) * 1995-10-27 1999-08-17 Applied Materials, Inc. Linear conditioner apparatus for a chemical mechanical polishing system
EP0875339A4 (de) * 1995-12-06 2001-01-10 Idemitsu Kosan Co Verfahren zum einebnen von dünnschichtigem material und nach diesem verfahren hergestelltes dünnschichtiges material
JP3676030B2 (ja) * 1997-04-10 2005-07-27 株式会社東芝 研磨パッドのドレッシング方法及び半導体装置の製造方法
JP3187353B2 (ja) 1997-10-01 2001-07-11 株式会社エスプリジャパン 自動車等の乗り物の空調装置の清掃方法および清掃装置
JPH11188590A (ja) 1997-12-22 1999-07-13 Speedfam Co Ltd エッジポリッシング装置
DE69903547T2 (de) * 1998-06-25 2003-07-10 Unova Uk Ltd Verfahren und vorrichtung zum abfasen von halbleiterscheiben
US6783428B1 (en) * 1999-01-18 2004-08-31 Nsk Ltd. Method for forming grooves on workpiece and for dressing a grindstone used in the groove formation
JP2001121391A (ja) * 1999-10-28 2001-05-08 Canon Inc 研磨皿の合わせ方法
US6630059B1 (en) * 2000-01-14 2003-10-07 Nutool, Inc. Workpeice proximity plating apparatus
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JP2005340732A (ja) * 2004-05-31 2005-12-08 Disco Abrasive Syst Ltd ウェーハ清浄化装置
JP2007088143A (ja) * 2005-09-21 2007-04-05 Elpida Memory Inc エッジ研磨装置
JP4742845B2 (ja) * 2005-12-15 2011-08-10 信越半導体株式会社 半導体ウエーハの面取り部の加工方法及び砥石の溝形状の修正方法
JP2010173016A (ja) * 2009-01-29 2010-08-12 Mitsubishi Materials Corp 半導体研磨布用コンディショナー、半導体研磨布用コンディショナーの製造方法及び半導体研磨装置
JP2010182813A (ja) * 2009-02-04 2010-08-19 Noritake Super Abrasive Co Ltd Ｃｍｐパッドコンディショナー
CN201380419Y (zh) * 2009-03-02 2010-01-13 湖北新火炬科技股份有限公司 金刚滚轮磨削砂轮用于磨削轮毂总成内滚道的装置
JP5405887B2 (ja) * 2009-04-27 2014-02-05 ルネサスエレクトロニクス株式会社 研磨装置及び研磨方法
CN201728564U (zh) * 2010-07-28 2011-02-02 许昌义 角磨机可帖轮与不干胶砂纸

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1082418A (en) * 1966-07-22 1967-09-06 Toolmasters Ltd Improvements relating to grinding wheels

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2015050185A1 *

Also Published As

Publication number Publication date
US20160236322A1 (en) 2016-08-18
TWI689378B (zh) 2020-04-01
JP2017185623A (ja) 2017-10-12
WO2015050185A1 (ja) 2015-04-09
CN105636743A (zh) 2016-06-01
CN105636743B (zh) 2021-01-08
KR20160067107A (ko) 2016-06-13
TW201536479A (zh) 2015-10-01
EP3053704A1 (de) 2016-08-10
JPWO2015050185A1 (ja) 2017-03-09
JP6474861B2 (ja) 2019-02-27

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