EP3038788A1 - Procédé et système laser servant à usiner une pièce au moyen d'un faisceau laser pulsé - Google Patents

Procédé et système laser servant à usiner une pièce au moyen d'un faisceau laser pulsé

Info

Publication number
EP3038788A1
EP3038788A1 EP14747577.6A EP14747577A EP3038788A1 EP 3038788 A1 EP3038788 A1 EP 3038788A1 EP 14747577 A EP14747577 A EP 14747577A EP 3038788 A1 EP3038788 A1 EP 3038788A1
Authority
EP
European Patent Office
Prior art keywords
laser
spectral phase
workpiece
pulse
laser pulses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14747577.6A
Other languages
German (de)
English (en)
Inventor
Jan Kaster
Florian Sotier
Fred-Walter Deeg
Stephan Geiger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rofin Baasel Lasertech GmbH and Co KG
Original Assignee
Rofin Baasel Lasertech GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rofin Baasel Lasertech GmbH and Co KG filed Critical Rofin Baasel Lasertech GmbH and Co KG
Publication of EP3038788A1 publication Critical patent/EP3038788A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material

Definitions

  • the invention relates to a method and a laser arrangement for processing a workpiece with a pulsed laser beam.
  • Reflected radiation components can be additionally modulated by the density fluctuations excited in this way. This leads to a laterally varying absorption and to a laterally varying phase front. Accordingly, can the laser radiation has a lateral interference pattern. This effect takes place when using laser pulses with a pulse duration, which is less than 20ps, even when the laser beam is continuously guided over the surface to be processed, as this shifts at usual or currently technically feasible feed speeds at best by a distance, the is significantly smaller than the wavelength of the laser ⁇ beam. From M. Zukamoto et al. , Journal of Physics: Conference Series 59 (2007), pp. 666-669, it is also known that this phenomenon can be more pronounced and adversely affect the surface quality when several of these highly coherent laser pulses in short local and temporal Ab - overlay, as in surface structuring,
  • the invention is therefore based on the object of specifying a procedural ⁇ ren for machining a workpiece with a pulsed laser beam, with which the occurrence of such microstructures either largely prevented or influenced according to the desired process result.
  • the invention is based on the object of specifying a laser arrangement operated according to this method.
  • the stated object is achieved according to the invention with a method having the features of claim 1.
  • the lateral distribution of the spectral phase during the machining of the workpiece within the period of a laser pulse and / or at least between two at least partially on the workpiece overlapping laser pulses varies nonlinearly.
  • the lateral distribution of the spectral phase during the period of a single laser pulse or the lateral distribution of the spectral phase present in temporally successive laser pulses at least partially overlapping on the workpiece is additionally or exclusively changed, so that indeed takes place within a single laser pulse is no variation of the lateral distribution, but it is ensured that does not have all used for processing and superimposed on the workpiece the laser pulses have the same lateral distri ⁇ averaging the spectral phase. In the latter case, it is also not absolutely necessary for all laser pulses which at least partially overlap one another to differ with regard to their lateral distribution of the spectral phase.
  • two or more at least partially overlapping laser pulses may have the same lateral distribution of the spectral phase, if the machining process is such that a plurality of laser pulses overlap at least partially, as for example Percussion drilling is the case.
  • the invention is based on the consideration that the lateral distribution of the spectral phase or the Phasenspekt ⁇ rum of ultrashort laser pulses, the coherence of the incident with the reflected laser beams or laser beam components within a pulse and thus the appearance and shape of the microstructures or Nano-Ripples influenced. Accordingly spreader ⁇ accordingly can already by a variation of the spectral phase within the pulse or time duration of a laser pulse off the measure of occurrence and the shape of such nano-Ripples remarkable ⁇ be enced.
  • a non-linear variation of the lateral distribution of the spectral phase takes place at least between at least partially overlap ⁇ , chronologically successive laser pulses, in particular in so-called multi-pass method of Zuka- moto et al. described and caused by cumulative effects expression of unwanted structures largely avoided.
  • high-quality removal results can be achieved with surface properties which are optimally adapted to the respective requirements, for example large or small roughness, depending on the application.
  • Such an adjustment can be made, for example, by varying the pulse energy or by selecting the optical media which are nonlinear in the beam path and interacting with the laser beam in order to produce the desired surface quality for the respective intended application given correspondingly predetermined process parameters.
  • such adjustment can also be made by introducing optical components into the beam path with which the lateral distribution of the non-linear spectral phase can be selectively controlled within a laser pulse or between successive laser pulses, for example by widening or narrowing the laser beam in front of a non-linear the laser beam interacting optical medium and / or use of a lateral, ie across to
  • Beam axis adjustable arranged optical medium with laterally varying nonlinear refractive index Beam axis adjustable arranged optical medium with laterally varying nonlinear refractive index.
  • nano-ripples can be reduced in particular when the variation of the lateral distribution of the spectral phase takes place by varying the lateral distribution of the B-integral.
  • the B integral or the B integral value is by relationship where z is the distance traveled by the laser beam along the beam axis (center axis), I is the peak intensity of the laser beam as a function of the distance traveled along the beam axis z and the lateral distance r from the beam axis z, and ri2 is the Kerr coefficient or nonlinear
  • the B-integral value at a lateral point r of the laser beam after propagation of the laser pulse through an optical medium along a distance z is proportional to the distance traveled and the respective peak intensity present.
  • the B integral is therefore a measure of the nonlinear interaction of a laser pulse with an opti ⁇ 's medium and is a measure of the accumulated Doublepha- senmodulation. Since the pulse duration and pulse shape at one point of the beam cross section depends on the spectral phase present there, a laterally varying B integral corresponds to a pulse duration and pulse shape varying over the beam cross section.
  • 6,141,362 basically known to take measures to achieve a minimum, as constant as possible B integral over the entire beam cross-section. This happens because in the beam path of the laser, a semiconductor material is attached, which has a negative nonlinear refractive ⁇ index and thus generates a negative B integral, with which the positive B integral generated by a laser amplifier arranged in the beam path is compensated ,
  • the invention takes a different approach in that they had selectively adjusts the B integral to values which are different over the beam cross-section relative zuei ⁇ Nander to influence in this way, the coherence of the incident and reflected laser beams and to reduce the surface texture contrast by averaging over many radiations with radially and temporally varying B integral.
  • the spectral phase of the laser pulses is adjusted such that the B-integral of the laser pulse when striking the workpiece transversely to the beam axis varies when using a laser beam whose laser pulses have a Pulse ⁇ he smaller than 20ps , ie, is not constant and assumes values between -50 and + 50 degrees, whereby B-integral values between -20 and + 20 are set at pulse durations less than 10ps, and B-integral values between -5 and + 5 at pulse durations less than 2ps.
  • Distributions of the spectral phase of all laser pulses from each other can distinguish, that each laser pulse may have a different lateral distribution of the spectral phase.
  • each track can be generated with laser pulses that have the same lateral distribution of the spectral phase within this track.
  • this ⁇ A position of the spectral phase is performed by expanding or narrowing of the laser beam in front of at least one in the beam path angeord ⁇ Neten nonlinearly interacting with the laser beam optimum see medium.
  • the object is achieved with the features of claim 10. Due to the presence of means, in particular a controllable beam-shaping device, for varying the lateral distribution of the spectral phase of the laser pulses, it is possible to control the machining process with respect to each to optimize specific requirements.
  • the means for non-linear variation comprise an optical medium which is adjustably arranged transversely to the beam axis and has a laterally varying non-linear Refractive index, optical components, which are formed for widening or narrowing of the laser beam in front of a non-linear interacting with the laser medium, a entspre ⁇ accordingly formed control unit for controlling the pulse energy or the peak intensity and / or optical media, the non-linear refractive index transverse to the beam axis Example ⁇ varies by doping. It is understood that according to alternative embodiments, combinations of the above-mentioned means are provided.
  • a laser arrangement comprises a laser beam source 2 for generating a pulsed laser beam L which consists of a chronological sequence of ultrashort laser pulses.
  • a pulsed laser beam L which consists of a chronological sequence of ultrashort laser pulses.
  • laser pulses are widened in a Strecker (stretcher) 4 in the time domain, so that by such an increase of the pulse duration the maximum intensity in the Laser pulse is reduced.
  • This straightener 4 may be a free-jet grating arrangement or an arrangement constructed from other dispersive optical elements.
  • the temporally stretched laser pulse in this way is amplified in a laser amplifier 6.
  • the amplified laser pulse is then compressed again in an optical compressor 8 in the time domain, to produce in this way a laser pulse with a pulse duration which is less than 20ps, preferably less than lOps and in particular less than 2ps.
  • the laser pulse generated in this way is fed to a focusing, beam-shaping and deflecting unit 10, which is symbolically illustrated by a lens in the figure.
  • the focused in this way laser pulse impinges on a workpiece 12 and causes there with a low heat input material removed by evaporation of the material without a searchess ⁇ values melting zone is formed.
  • the extent of this mecanicali ⁇ -linear modulation of the spectral phase depends on the present in the laser pulse peak intensity decreases and can be accordingly ⁇ Speaking influenced by variation of this peak intensity.
  • a control unit 14 is provided for controlling the pump sources 16, 18 used for optically pumping the laser beam source 2 and the laser amplifier 6, and a pulse picker 20 arranged in front of the laser amplifier 6 and, in general, the arm 4.
  • a variation of the beam cross section in the amplifier medium is also possible in principle.
  • the variation and adjustment of the pulse energy and thus the peak intensity is generally carried out by Steue ⁇ tion of the pump power of the amplifier 6 associated pumping source 18 and by controlling the Pulspickers 20.
  • the focusing beam forming and deflection unit 10 may be additionally controlled such that as the overlap of the incident on dersel ⁇ ben place laser pulses can be varied.
  • optical media 22, 24 are arranged with different non-linear refractive indices.
  • the optical medium 22 has a negative nonlinear refractive index
  • the optical medium 24 has a positive nonlinear refractive index.
  • the optical media 22, 24 can also be arranged directly behind one another and form a structural unit. In this case, both optical media 22, 24 are arranged in the propagation direction of the laser beam, either before the straightener 4 or after the amplifier 6 or after the compressor 8.
  • a beam shaping device 30 which is controllable by the control unit 14 is variable
  • Beam shaping in particular beam expansion or beam narrowing arranged, with which also the peak intensity of the laser pulse can be varied.
  • the device 30 may also be additionally arranged between the optical media 22, 24.
  • Beam shaping device 30 and optical media 22, 24 can also form a structural unit, which can be arranged either in front of the straightener 4 or after the amplifier 6. With such an arrangement, the non-linear spectral phase can be varied without the need for replacement of optical components.
  • Variation of the non-linear spectral phase with constant structure is also the use of an optical medium possible whose nonlinear refractive index ri2 transverse to
  • Beam axis (center axis of the laser beam L), for example by doping, streaks or the composition of an optical element of many segments varies.
  • the lateral B-integral distribution can be dynamically modulated.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Lasers (AREA)

Abstract

L'invention concerne un procédé et un système laser servant à usiner une pièce (12) au moyen d'un faisceau laser pulsé (L). Pendant l'usinage, on fait varier de manière non linéaire la distribution latérale de la phase spectrale à l'intérieur de la durée d'une impulsion laser et/ou au moins entre deux impulsions laser qui se chevauchent au moins en partie sur la pièce (12).
EP14747577.6A 2013-08-30 2014-07-29 Procédé et système laser servant à usiner une pièce au moyen d'un faisceau laser pulsé Withdrawn EP3038788A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013109479.1A DE102013109479B3 (de) 2013-08-30 2013-08-30 Verfahren und Laseranordnung zum Bearbeiten eines Werkstücks mit einem gepulsten Laserstrahl
PCT/EP2014/066270 WO2015028232A1 (fr) 2013-08-30 2014-07-29 Procédé et système laser servant à usiner une pièce au moyen d'un faisceau laser pulsé

Publications (1)

Publication Number Publication Date
EP3038788A1 true EP3038788A1 (fr) 2016-07-06

Family

ID=51266298

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14747577.6A Withdrawn EP3038788A1 (fr) 2013-08-30 2014-07-29 Procédé et système laser servant à usiner une pièce au moyen d'un faisceau laser pulsé

Country Status (8)

Country Link
US (1) US20160228986A1 (fr)
EP (1) EP3038788A1 (fr)
JP (1) JP2016530103A (fr)
KR (1) KR20160048880A (fr)
CN (1) CN105555464B (fr)
DE (1) DE102013109479B3 (fr)
TW (1) TW201513958A (fr)
WO (1) WO2015028232A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107968307A (zh) * 2017-12-28 2018-04-27 北京工业大学 补偿正b积分相移的装置与方法

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DE3339318C2 (de) * 1983-10-29 1995-05-24 Trumpf Gmbh & Co Laser-Bearbeitungsmaschine
US5317577A (en) * 1991-01-25 1994-05-31 Hamamatsu Photonics K.K. Optical wavelength shifter using nonlinear refractive medium disposed interiorly of laser resonator
JP3772395B2 (ja) * 1996-05-14 2006-05-10 スズキ株式会社 レーザ溶接方法
US6141362A (en) * 1998-06-05 2000-10-31 The United States Of America As Represented By The United States Department Of Energy Reduction of B-integral accumulation in lasers
JP4233741B2 (ja) * 2000-09-27 2009-03-04 三菱重工業株式会社 太陽電池モジュール及びその製造方法
DE10203198B4 (de) * 2002-01-21 2009-06-10 Carl Zeiss Meditec Ag Verfahren zur Materialbearbeitung mit Laserimpulsen großer spektraler Bandbreite und Vorrichtung zur Durchführung des Verfahrens
US7405114B2 (en) * 2002-10-16 2008-07-29 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and method of manufacturing semiconductor device
JP2004154813A (ja) * 2002-11-06 2004-06-03 National Institute Of Advanced Industrial & Technology レーザ加工方法および装置
DE10333770A1 (de) * 2003-07-22 2005-02-17 Carl Zeiss Meditec Ag Verfahren zur Materialbearbeitung mit Laserimpulsen grosser spektraler Bandbreite und Vorrichtung zur Durchführung des Verfahrens
US20080310465A1 (en) * 2007-06-14 2008-12-18 Martin Achtenhagen Method and Laser Device for Stabilized Frequency Doubling
JP5056839B2 (ja) * 2009-12-25 2012-10-24 三星ダイヤモンド工業株式会社 被加工物の加工方法および被加工物の分割方法
US8951889B2 (en) * 2010-04-16 2015-02-10 Qmc Co., Ltd. Laser processing method and laser processing apparatus
JP2012135807A (ja) * 2010-12-27 2012-07-19 Omron Corp レーザ加工装置およびレーザ加工方法
EP2756562A4 (fr) * 2011-09-14 2015-06-17 Fianium Inc Procédés et appareil ayant trait aux lasers à fibre à impulsions à picosecondes
US20140245608A1 (en) * 2011-10-07 2014-09-04 Canon Kabushiki Kaisha Method and apparatus for laser-beam processing and method for manufacturing ink jet head

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Also Published As

Publication number Publication date
CN105555464A (zh) 2016-05-04
JP2016530103A (ja) 2016-09-29
WO2015028232A1 (fr) 2015-03-05
TW201513958A (zh) 2015-04-16
KR20160048880A (ko) 2016-05-04
US20160228986A1 (en) 2016-08-11
DE102013109479B3 (de) 2014-09-18
CN105555464B (zh) 2017-05-10

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