EP3016154A4 - Dispositif led - Google Patents

Dispositif led

Info

Publication number
EP3016154A4
EP3016154A4 EP14817164.8A EP14817164A EP3016154A4 EP 3016154 A4 EP3016154 A4 EP 3016154A4 EP 14817164 A EP14817164 A EP 14817164A EP 3016154 A4 EP3016154 A4 EP 3016154A4
Authority
EP
European Patent Office
Prior art keywords
led device
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP14817164.8A
Other languages
German (de)
English (en)
Other versions
EP3016154B1 (fr
EP3016154A1 (fr
Inventor
Isao Miyashita
Taku Kumasaka
Keita Watanabe
Kosuke Tsuchiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Holdings Co Ltd, Citizen Electronics Co Ltd filed Critical Citizen Holdings Co Ltd
Publication of EP3016154A1 publication Critical patent/EP3016154A1/fr
Publication of EP3016154A4 publication Critical patent/EP3016154A4/fr
Application granted granted Critical
Publication of EP3016154B1 publication Critical patent/EP3016154B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/387—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
EP14817164.8A 2013-06-28 2014-06-23 Dispositif del Active EP3016154B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013136338 2013-06-28
JP2013173114 2013-08-23
PCT/JP2014/066540 WO2014208495A1 (fr) 2013-06-28 2014-06-23 Dispositif led

Publications (3)

Publication Number Publication Date
EP3016154A1 EP3016154A1 (fr) 2016-05-04
EP3016154A4 true EP3016154A4 (fr) 2016-12-14
EP3016154B1 EP3016154B1 (fr) 2020-08-05

Family

ID=52141830

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14817164.8A Active EP3016154B1 (fr) 2013-06-28 2014-06-23 Dispositif del

Country Status (5)

Country Link
US (1) US10170674B2 (fr)
EP (1) EP3016154B1 (fr)
JP (1) JP5693800B1 (fr)
CN (1) CN105359284B (fr)
WO (1) WO2014208495A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5693800B1 (ja) * 2013-06-28 2015-04-01 シチズンホールディングス株式会社 Ｌｅｄ装置
TWI575785B (zh) 2014-10-30 2017-03-21 新世紀光電股份有限公司 發光裝置
US11677052B2 (en) 2018-06-08 2023-06-13 Nikkiso Co., Ltd. Semiconductor light-emitting device
TWI684835B (zh) * 2018-12-25 2020-02-11 同泰電子科技股份有限公司 具有高反射率的基板結構及其製作方法
JP6852822B2 (ja) * 2019-05-30 2021-03-31 日亜化学工業株式会社 発光モジュール及びその製造方法
US11681090B2 (en) 2019-05-30 2023-06-20 Nichia Corporation Light emitting module and method of manufacturing same
JP2021136306A (ja) * 2020-02-26 2021-09-13 富士フイルムビジネスイノベーション株式会社 発光装置、光学装置及び情報処理装置
JP7497578B2 (ja) 2020-02-26 2024-06-11 富士フイルムビジネスイノベーション株式会社 発光装置、光学装置及び情報処理装置
WO2022061770A1 (fr) * 2020-09-25 2022-03-31 京东方科技集团股份有限公司 Carte de circuit imprimé flexible, barre lumineuse, module de rétroéclairage et dispositif d'affichage à cristaux liquides

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080277677A1 (en) * 2007-05-09 2008-11-13 Foxsemicon Integrated Technology, Inc. Light emitting diode assembly and light emitting diode display device
EP2477245A2 (fr) * 2011-01-13 2012-07-18 Samsung LED Co., Ltd. Boîtier de diode électroluminescente

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JPS6352422A (ja) * 1986-08-22 1988-03-05 Hitachi Tobu Semiconductor Ltd 電子装置およびそのチツプならびにその基板
JP2005191097A (ja) 2003-12-24 2005-07-14 Kawaguchiko Seimitsu Co Ltd 半導体パッケージ
US9070850B2 (en) * 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US20070080360A1 (en) * 2005-10-06 2007-04-12 Url Mirsky Microelectronic interconnect substrate and packaging techniques
JP5212532B2 (ja) * 2005-10-31 2013-06-19 豊田合成株式会社 発光装置の製造方法
JP4940883B2 (ja) 2005-10-31 2012-05-30 豊田合成株式会社 発光装置
US7928462B2 (en) * 2006-02-16 2011-04-19 Lg Electronics Inc. Light emitting device having vertical structure, package thereof and method for manufacturing the same
US8436371B2 (en) * 2007-05-24 2013-05-07 Cree, Inc. Microscale optoelectronic device packages
US9172012B2 (en) * 2007-10-31 2015-10-27 Cree, Inc. Multi-chip light emitter packages and related methods
JP5558665B2 (ja) 2007-11-27 2014-07-23 パナソニック株式会社 発光装置
JP5345363B2 (ja) * 2008-06-24 2013-11-20 シャープ株式会社 発光装置
WO2011083923A2 (fr) * 2010-01-07 2011-07-14 Seoul Opto Device Co., Ltd. Diodes électroluminescentes comportant des pastilles d'électrodes
CN103222073B (zh) * 2010-08-03 2017-03-29 财团法人工业技术研究院 发光二极管芯片、发光二极管封装结构、及用以形成上述的方法
US8519426B2 (en) * 2010-08-09 2013-08-27 Lg Innotek Co., Ltd. Light emitting device and lighting system having the same
DE102010034924A1 (de) * 2010-08-20 2012-02-23 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
US9240524B2 (en) * 2012-03-05 2016-01-19 Seoul Viosys Co., Ltd. Light-emitting device and method of manufacturing the same
JP5989388B2 (ja) * 2012-04-19 2016-09-07 新光電気工業株式会社 パッケージ及びパッケージの製造方法
US20130328074A1 (en) * 2012-06-11 2013-12-12 Cree, Inc. Led package with multiple element light source and encapsulant having planar surfaces
US9859484B2 (en) * 2012-10-24 2018-01-02 Sharp Kabushiki Kaisha Light emitting apparatus
CN202996902U (zh) * 2012-11-21 2013-06-12 深圳市斯迈得光电子有限公司 一种安全可靠的led灯珠
KR20140094752A (ko) * 2013-01-22 2014-07-31 삼성전자주식회사 전자소자 패키지 및 이에 사용되는 패키지 기판
DE102013104840A1 (de) * 2013-05-10 2014-11-13 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung von strahlungsemittierenden Halbleiterbauelementen
JP5693800B1 (ja) * 2013-06-28 2015-04-01 シチズンホールディングス株式会社 Ｌｅｄ装置
GB201400264D0 (en) 2014-01-08 2014-02-26 Element Six Ltd Synthetic diamond optical mirrors
KR20160023011A (ko) * 2014-08-20 2016-03-03 삼성전자주식회사 발광소자 패키지
EP2988341B1 (fr) * 2014-08-22 2017-04-05 LG Innotek Co., Ltd. Conditionnement de dispositif électroluminescent

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080277677A1 (en) * 2007-05-09 2008-11-13 Foxsemicon Integrated Technology, Inc. Light emitting diode assembly and light emitting diode display device
EP2477245A2 (fr) * 2011-01-13 2012-07-18 Samsung LED Co., Ltd. Boîtier de diode électroluminescente

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014208495A1 *

Also Published As

Publication number Publication date
EP3016154B1 (fr) 2020-08-05
EP3016154A1 (fr) 2016-05-04
JP5693800B1 (ja) 2015-04-01
CN105359284B (zh) 2019-05-14
JPWO2014208495A1 (ja) 2017-02-23
US20160197253A1 (en) 2016-07-07
WO2014208495A1 (fr) 2014-12-31
US10170674B2 (en) 2019-01-01
CN105359284A (zh) 2016-02-24

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