EP2912534A1 - Ordonnancement modal de charges de travail dans un système multi-processeur hétérogène sur une puce - Google Patents

Ordonnancement modal de charges de travail dans un système multi-processeur hétérogène sur une puce

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Publication number
EP2912534A1
EP2912534A1 EP13776616.8A EP13776616A EP2912534A1 EP 2912534 A1 EP2912534 A1 EP 2912534A1 EP 13776616 A EP13776616 A EP 13776616A EP 2912534 A1 EP2912534 A1 EP 2912534A1
Authority
EP
European Patent Office
Prior art keywords
mode
hpp
decision condition
recognized
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13776616.8A
Other languages
German (de)
English (en)
Inventor
Alex K. Tu
Thomas A. MORISON
Hee-Jun Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of EP2912534A1 publication Critical patent/EP2912534A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234—Power saving characterised by the action undertaken
    • G06F1/329—Power saving characterised by the action undertaken by task scheduling
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234—Power saving characterised by the action undertaken
    • G06F1/3293—Power saving characterised by the action undertaken by switching to a less power-consuming processor, e.g. sub-CPU
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/50—Reducing energy consumption in communication networks in wire-line communication networks, e.g. low power modes or reduced link rate

Definitions

  • PCDs Portable computing devices
  • PDAs portable digital assistants
  • game consoles portable game consoles
  • palmtop computers portable electronic devices
  • PCDs typically do not have active cooling devices, like fans, which are often found in larger computing devices such as laptop and desktop computers. Consequently, thermal energy generation is often managed in a PCD through the application of various thermal management techniques that may include wilting or shutting down electronics at the expense of processing performance. Thermal management techniques are employed within a PCD in an effort to seek a balance between mitigating thermal energy generation and impacting the quality of service (“QoS") provided by the PCD. When excessive thermal energy generation is not a concern, however, the QoS may be maximized by running processing components within the PCD at a maximum frequency rating.
  • QoS quality of service
  • Various embodiments of methods and systems for mode -based workload reallocation in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different performance capabilities or strengths, and because more than one of the processing components may be capable of processing a given block of code, mode-based reallocation systems and methodologies can be leveraged to optimize quality of service (“QoS”) by allocating workloads in real time, or near real time, to the processing components most capable of processing the block of code in a manner that meets the performance goals of an operational mode.
  • QoS quality of service
  • One such method involves determining the performance capabilities of each of a
  • the performance capabilities may include the maximum processing frequency and the quiescent supply current exhibited by each processing component.
  • HPP high performance processing
  • PS power saving
  • Indicators of one or more mode-decision conditions in the PCD are monitored. Based on the recognized presence of any one or more of the mode-decision conditions, an operational mode associated with certain performance goals of the PCD is determined. For instance, an indication that a battery charger has been plugged into the PCD, thereby providing an essentially unlimited power source, may trigger a HPP operational mode having an associated performance goal of processing workloads at the fastest speed possible. Similarly, an indication that a battery capacity has fallen below a predetermined threshold, thereby creating a risk that the PCD may lose its power source, may trigger a PS operational mode having an associated performance goal of processing workloads with the least amount of power expenditure.
  • an active workload of the processing components may be reallocated across the processing components based on the individual performance capabilities of each. In this way, those processing components that are best positioned to process the workload in a manner that satisfies the performance goals of the operational mode are prioritized for allocation of the workload.
  • FIG. 1 is a graph illustrating the processing capacities and leakage rates associated with exemplary cores 0, 1, 2 and 3 in a given quad core chipset of a portable computing device ("PCD").
  • PCD portable computing device
  • FIG. 2 is a chart illustrating exemplary conditions or triggers that may dictate an operational mode of a PCD.
  • FIG. 3 is a functional block diagram illustrating an embodiment of an on-chip system for mode-based workload reallocation in a heterogeneous, multi-core PCD.
  • FIG. 4 is a functional block diagram of an exemplary, non-limiting aspect of a PCD in the form of a wireless telephone for implementing methods and systems for mode-based workload reallocation.
  • FIG. 5A is a functional block diagram illustrating an exemplary spatial arrangement of hardware for the chip illustrated in FIG. 4.
  • FIG. 5B is a schematic diagram illustrating an exemplary software architecture of the
  • PCD of FIG. 4 for supporting mode-based workload reallocation.
  • FIG. 6 is a logical flowchart illustrating an embodiment of a method for mode-based workload reallocation across heterogeneous processing components in the PCD of FIG.
  • FIG. 7 is a logical flowchart illustrating an embodiment of a mode-based workload reallocation sub-routine.
  • an “application” may also include files having executable content, such as: object code, scripts, byte code, markup language files, and patches.
  • an “application” referred to herein may also include files that are not executable in nature, such as documents that may need to be opened or other data files that need to be accessed.
  • a component may be, but is not limited to being, a process running on a processor, a processor, an object, an executable, a thread of execution, a program, and/or a computer.
  • an application running on a computing device and the computing device may be a component.
  • One or more components may reside within a process and/or thread of execution, and a component may be localized on one computer and/or distributed between two or more computers. In addition, these components may execute from various computer readable media having various data structures stored thereon. The components may communicate by way of local and/or remote processes such as in accordance with a signal having one or more data packets (e.g., data from one component interacting with another component in a local system, distributed system, and/or across a network such as the Internet with other systems by way of the signal).
  • a signal having one or more data packets (e.g., data from one component interacting with another component in a local system, distributed system, and/or across a network such as the Internet with other systems by way of the signal).
  • CPU central processing unit
  • DSP digital signal processor
  • chips chips and chipsset
  • CPU central processing unit
  • DSP digital signal processor
  • chips chips and chipsset
  • thermo and “thermal energy” may be used in association with a device or component capable of generating or dissipating energy that can be measured in units of "temperature.” Consequently, it will further be understood that the term “temperature,” with reference to some standard value, envisions any measurement that may be indicative of the relative warmth, or absence of heat, of a “thermal energy” generating device or component. For example, the "temperature” of two components is the same when the two components are in “thermal” equilibrium.
  • processing component may be, but is not limited to, a central processing unit, a graphical processing unit, a core, a main core, a sub-core, a processing area, a hardware engine, etc. or any component residing within, or external to, an integrated circuit within a portable computing device.
  • thermo load thermal load
  • thermal distribution thermo distribution
  • thermal signature thermo processing load
  • thermo mitigation technique(s), thermal policies
  • thermal management thermal management measure(s)
  • DMIPS represents the number of Dhrystone iterations required to process a given number of millions of instructions per second.
  • the term is used as a general unit of measure to indicate relative levels of processor performance in the exemplary embodiments and will not be construed to suggest that any given embodiment falling within the scope of this disclosure must, or must not, include a processor having any specific Dhrystone rating.
  • allocation and “reallocation” are generally used interchangeably. Use of the term “allocation” is not limited to an initial allocation and, as such, inherently includes a reallocation.
  • PCD portable computing device
  • 3G third generation
  • 4G fourth generation
  • a PCD may be a cellular telephone, a satellite telephone, a pager, a PDA, a smartphone, a navigation device, a smartbook or reader, a media player, a combination of the aforementioned devices, a laptop computer with a wireless connection, among others.
  • performance is generally used to reference the efficiency of one processing component compared to another and, as such, may be quantified in various units depending on the context of its use. For example, a high capacity core may exhibit better performance than a low capacity core when the context is the speed in MHz at which the cores can process a given workload. Similarly, a low capacity core may exhibit better performance than a high capacity core when the context is the quiescent supply currents ("IDDq”), i.e. the power consumption in mA, associated with the cores when processing a given workload.
  • IDDq quiescent supply currents
  • heterogeneous processing component(s) can be accomplished by leveraging the diverse performance characteristics of the individual processing engines that are available for workload allocation.
  • diverse performance characteristics of various processing engines that may be included in a heterogeneous processing component one of ordinary skill in the art will recognize that performance differences may be attributable to any number of reasons including, but not limited to, differing levels of silicon, design variations, etc.
  • the performance characteristics associated with any given processing component may vary in relation with the operating temperature of that processing component, the power supplied to that processing component, etc.
  • an exemplary heterogeneous multi-core processor which may include a number of different processing cores generally ranging in performance capacities from low to high (notably, one of ordinary skill in the art will recognize that an exemplary heterogeneous multi-processor system on a chip ("SoC") which may include a number of different processing components, each containing one or more cores, may also be considered).
  • SoC system on a chip
  • a low capacity to medium capacity processing core within the heterogeneous processor will exhibit a lower power leakage rate at a given workload capacity, and consequently a lower rate of thermal energy generation, than a processing core having a relatively high performance capacity.
  • the higher capacity core may be capable of processing a given number of DMIPs in a shorter amount of time than a lower capacity core. For these reasons, one of ordinary skill in the art will recognize that a high capacity core may be more desirable for a workload allocation when the PCD is in a "high performance" mode whereas a low capacity core, with its lower current leakage rating, may be more desirable for a workload allocation when the PCD is in a "power saving" mode.
  • a mode-based workload reallocation algorithm can be leveraged to reallocate workloads to the processing core or cores which offer the best performance in the context of the given mode. For example, certain conditions in a PCD may dictate that the PCD is in a high performance mode where performance is measured in units of processing speed. Consequently, by recognizing that the PCD is in a high performance mode, a mode- based workload reallocation algorithm may dictate that workloads be processed by those certain cores in the heterogeneous processor that exhibit the highest processing speeds.
  • a mode- based workload reallocation algorithm may dictate that workloads be processed by those certain cores in the heterogeneous processor that exhibit the lowest IDDq rating.
  • a particular block of code may be processed by either of a central processing unit (“CPU”) or a graphical processing unit (“GPU") within an exemplary PCD.
  • CPU central processing unit
  • GPU graphical processing unit
  • an exemplary embodiment may select which of the processing components will be assigned the task of processing the block of code based on the recognition of conditions within the PCD associated with a given mode. That is, based on the operational mode of the PCD, the processor best equipped to efficiently process the block of code is assigned the workload.
  • subsequent processor selections for reallocation of subsequent workloads may be made in real time, or near real time, as the operational mode of the PCD changes.
  • a modal allocation manager (“MAM”) module may leverage performance characteristics associated with individual cores in a heterogeneous processor to optimize QoS by selecting processing cores based on the performance priorities associated with operational modes of the PCD.
  • FIG. 1 is a graph illustrating the processing capacities and leakage rates associated with exemplary cores 0, 1, 2 and 3 in a given quad core chipset of a PCD.
  • Core 0 represents the core having the highest processing capacity (Core 0 max freq.) and, as such, would be the most desirable core for workload allocation when the PCD is in a "high performance" mode.
  • core 3 represents the core having the lowest current leakage rating (Core 3 leakage) and, as such, would be the most desirable core for workload allocation when the PCD is in a "power saving" mode.
  • the cores may reside within any processing engine capable of processing a given block of code including, but not limited to, a CPU, GPU, DSP, programmable array, etc.
  • each of the cores exhibits unique
  • Core 0 is capable of processing workloads at a relatively high processing speed (Core 0 max freq.), yet it also has a relatively high IDDq (Core 0 leakage).
  • Core 1 is capable of processing workloads at a speed higher than cores 2 and 3 but is not nearly as fast as Core 0. Thus, Core 1 is the second most efficient of the cores in terms of processing speed.
  • the IDDq rating of Core 1 (Core 1 leakage) also makes it the second most efficient of the cores in terms of leakage rate.
  • Core 2 exhibits a relatively slow processing speed (Core 2 max freq.) and a relatively high IDDq rating (exceeded only by that of Core 1)
  • Core 3 exhibits the slowest processing speed of the cores, but advantageously also consumes the least amount of power of all the cores (Core 3 leakage).
  • the core-to-core variations in maximum processing frequencies and quiescent leakage rates can be leveraged by a MAM module to select processing components best positioned to efficiently process a given block of code when the PCD is in a given operational mode. For example, when the PCD is in a power saving mode, a MAM module may allocate or reallocate workloads first to Core 3, then to Core 1, then to Core 2 and finally to Core 0 so that current leakage is minimized. Similarly, when the PCD is in a high performance mode, a MAM module may allocate or reallocate workloads first to Core 0, then to Core 1, then to Core 2 and finally to Core 3 as needed in order to maximize the speed at which the workloads are processed.
  • FIG. 2 is a chart illustrating exemplary conditions or triggers that may dictate an
  • a MAM module may determine the operational mode and subsequently allocate or reallocate workloads to processing cores based on the performance goals associated with the given operational mode.
  • connection of a battery charger to the PCD may trigger a MAM module to designate the operational mode as a high performance processing ("HPP") mode.
  • HPP high performance processing
  • workloads may be allocated to those one or more processing components having the highest processing frequencies, such as core 0 of FIG. 1.
  • recognition that battery capacity is low in the PCD may cause the MAM module to designate the operational mode as a power saving ("PS") mode. Consequently, because the performance goals associated with a power saving mode includes conserving power, workloads may be reallocated away from high frequency cores to lower frequency cores that exhibit more efficient power consumption characteristics, such as core 3 of FIG. 1.
  • PS power saving
  • a MAM module may recognize the presence of multiple mode-decision conditions. To the extent that the recognized conditions point to different operational modes, certain embodiments may prioritize or otherwise reconcile the conditions in order to determine the best operational mode. For example, suppose that a user of a PCD preset the mode to an HPP mode and also plugged in the battery charger, but at the same time a thermal policy manager (“TPM") module is actively engaged in application of thermal mitigation measures. In such a scenario, a MAM module may prioritize the ongoing thermal mitigation over the user setting and charger availability, thereby determining that the operational mode should be a PS mode.
  • TPM thermal policy manager
  • a HPP mode-decision conditions outlined in the FIG. 2 graph are not offered as an exhaustive list of the triggers that may be used to point a MAM module to a HPP mode and, as such, one of ordinary skill in the art will recognize that other triggers or conditions within a PCD may be used to indicate that workloads should be allocated or reallocated to processing components with high frequency processing capabilities.
  • HPP mode-decision conditions may be associated with scenarios that require more processing capacity in order to optimize QoS and/or scenarios where power availability is abundant.
  • FIG. 2 Other exemplary mode-decision conditions illustrated in FIG. 2 as possible triggers for a PS mode include recognition of a battery capacity below a certain threshold (e.g., ⁇ 10% remaining), a user setting to a PS mode, application of one or more thermal mitigation techniques, detection of a relatively high on-chip temperature reading, low processing capacity use case (e.g., wake-up from standby mode, OS background tasks, workload requires less than the maximum frequency associated with the slowest processing component, all cores are running at a relatively low frequency to process the active workload, etc.).
  • a certain threshold e.g., ⁇ 10% remaining
  • a user setting to a PS mode e.g., ⁇ 10% remaining
  • application of one or more thermal mitigation techniques e.g., detection of a relatively high on-chip temperature reading
  • low processing capacity use case e.g., wake-up from standby mode, OS background tasks, workload requires less than the maximum frequency associated with the slowest processing component, all cores are running at a relatively low frequency to process
  • FIG. 3 is a functional block diagram illustrating an embodiment of an on-chip system
  • the workload reallocation across the processing components 222, 224, 226, 228 may be based on determination of an operational mode.
  • a modal allocation manager (“MAM") module 207 may cause workloads to be reallocated among the various processing components 222, 224, 226, 228 such that the performance goals associated with a given operational mode are achieved.
  • the processing component(s) 110 is depicted as a group of heterogeneous processing engines 222, 224, 226, 228 for illustrative purposes only and may represent a single processing component having multiple, heterogeneous cores 222, 224, 226, 228 or multiple, heterogeneous processors 222, 224, 226, 228, each of which may or may not comprise multiple cores and/or sub- cores.
  • the reference to processing engines 222, 224, 226 and 228 herein as "cores" will be understood as exemplary in nature and will not limit the scope of the disclosure.
  • the on-chip system may monitor temperature sensors 157, for example, which are
  • monitor module 114 which is in communication with a thermal policy manager (“TPM”) module 101 and a modal allocation manager (“MAM”) module 207.
  • TPM thermal policy manager
  • MAM modal allocation manager
  • temperature measurements may represent conditions upon which a mode decision may be made by a MAM module 207.
  • the monitor module 114 may also monitor other components or conditions within a PCD that may be used as triggers for switching from one operational mode to another.
  • the TPM module 101 may receive temperature measurements from the monitor module
  • the thermal management policies applied by the TPM module 101 may manage thermal energy generation by reallocation of workloads from one processing component to another, wilting or variation of processor clock speeds, etc. Notably, through application of thermal management policies, the TPM module 101 may reduce or alleviate excessive generation of thermal energy at the cost of QoS.
  • the module 101 may essentially "trump" workload reallocations driven by the MAM module 207.
  • the MAM module 207 may prioritize the ongoing thermal mitigation over the user setting and charger availability, thereby determining that the operational mode should be a PS mode instead of the HPP mode associated with the triggers.
  • other embodiments of a MAM module 207 may simply defer workload allocation to the TPM module 101 regardless of the mode-decision conditions.
  • the monitor module 114 recognizes the conditions and transmits data indicating the conditions to the MAM module 207.
  • the presence of one or more of the various mode-decision conditions may trigger the MAM module 207 to reference a core characteristics ("CC") data store 24 to query performance characteristics for one or more of the cores 222, 224, 226, 228.
  • the MAM module 207 may select the core 222, 224, 226, 228 best equipped at the time of query to efficiently process a given block of code according to the performance goals of an operational mode associated with the recognized mode- decision conditions. For example, if the performance goal of a PS mode is to minimize current leakage, then the MAM module 207 would allocate the block of code to the particular core 222, 224, 226, 228 queried to have the most efficient IDDq rating.
  • the MAM module 207 would allocate the block of code to the particular available core 222, 224, 226, 228 queried to have the highest processing frequency.
  • the workload will be allocated to the combination of available processors most capable of meeting the performance goals of the particular operational mode.
  • the content of the CC data store 24 may be
  • performance characteristics including maximum operating frequencies and IDDq leakage rates may be measured for each of the processing components 222, 224, 226, 228 "at the factory" and stored in CC data store 24. From the data, the MAM module 207 may determine which of the cores 222, 224, 226, 228 are best equipped to process a given workload according to the performance goals of a given operational mode.
  • the CC data store 24 may exist in hardware and/or software form depending on the particular embodiment. Moreover, a CC data store 24 in hardware may be fused inside silicon whereas a CC data store 24 in software form may be stored in firmware, as would be understood by one of ordinary skill in the art.
  • FIG. 4 is a functional block diagram of an exemplary, non-limiting aspect of a PCD 100 in the form of a wireless telephone for implementing methods and systems for mode- based workload reallocation.
  • the PCD 100 includes an on-chip system 102 that includes a heterogeneous multi-core central processing unit ("CPU") 110 and an analog signal processor 126 that are coupled together.
  • the CPU 110 may comprise a zeroth core 222, a first core 224, and an Nth core 230 as understood by one of ordinary skill in the art.
  • a digital signal processor (“DSP") may also be employed as understood by one of ordinary skill in the art.
  • each of the cores 222, 224, 230 may process workloads at different maximum voltage frequencies and exhibit different IDDq leakage rates.
  • the TPM module(s) 101 may be responsible for monitoring and applying thermal policies that include one or more thermal mitigation techniques. Application of the thermal mitigation techniques may help a PCD 100 manage thermal conditions and/or thermal loads and avoid experiencing adverse thermal conditions, such as, for example, reaching critical temperatures, while maintaining a high level of functionality.
  • the modal allocation manager (“MAM") module(s) 207 may receive the same or similar temperature data as the TPM module(s) 101, as well as other condition indicators, and leverage the data to define an operational mode. Based on the operational mode, the MAM module(s) 207 may allocate or reallocate workloads according to performance characteristics associated with individual cores 222, 224, 230. In this way, the MAM module(s) 207 may cause workloads to be processed by those one or more cores which are most capable of processing the workload in a manner that meets the performance goals associated with the given operational mode.
  • FIG. 4 also shows that the PCD 100 may include a monitor module 114.
  • the monitor module 114 communicates with multiple operational sensors (e.g., thermal sensors 157) and components distributed throughout the on-chip system 102 and with the CPU 110 of the PCD 100 as well as with the TPM module 101 and/or MAM module 207.
  • the monitor module 114 may also communicate with and/or monitor off-chip components such as, but not limited to, power supply 188, touchscreen 132, RF switch 170, etc.
  • the MAM module 207 may work with the monitor module 114 to identify mode-decision conditions that may trigger a switch of operational modes and affect workload allocation and/or reallocation.
  • a display controller 128 and a touch screen controller 130 are coupled to the CPU 110.
  • a touch screen display 132 external to the on-chip system 102 is coupled to the display controller 128 and the touch screen controller 130.
  • PCD 100 may further include a video decoder 134, e.g., a phase-alternating line (“PAL”) decoder, a sequential educational memoire (“SECAM”) decoder, a national television system(s) committee (“NTSC”) decoder or any other type of video decoder 134.
  • the video decoder 134 is coupled to the multi-core central processing unit (“CPU") 110.
  • a video amplifier 136 is coupled to the video decoder 134 and the touch screen display 132.
  • a video port 138 is coupled to the video amplifier 136.
  • a universal serial bus (“USB”) controller 140 is coupled to the CPU 110.
  • USB port 142 is coupled to the USB controller 140.
  • a memory 112 and a subscriber identity module (SIM) card 146 may also be coupled to the CPU 110.
  • SIM subscriber identity module
  • a digital camera 148 may be coupled to the CPU 110.
  • the digital camera 148 is a charge-coupled device (“CCD”) camera or a complementary metal-oxide semiconductor (“CMOS”) camera.
  • CCD charge-coupled device
  • CMOS complementary metal-oxide semiconductor
  • a stereo audio CODEC 150 may be coupled to the analog signal processor 126.
  • an audio amplifier 152 may be coupled to the stereo audio CODEC 150.
  • a first stereo speaker 154 and a second stereo speaker 156 are coupled to the audio amplifier 152.
  • FIG. 4 shows that a microphone amplifier 158 may be also coupled to the stereo audio CODEC 150.
  • a microphone 160 may be coupled to the microphone amplifier 158.
  • a frequency modulation ("FM") radio tuner 162 may be coupled to the stereo audio CODEC 150.
  • an FM antenna 164 is coupled to the FM radio tuner 162.
  • stereo headphones 166 may be coupled to the stereo audio CODEC 150.
  • FIG. 4 further indicates that a radio frequency (“RF") transceiver 168 may be coupled to the analog signal processor 126.
  • An RF switch 170 may be coupled to the RF transceiver 168 and an RF antenna 172.
  • a keypad 174 may be coupled to the analog signal processor 126.
  • a mono headset with a microphone 176 may be coupled to the analog signal processor 126.
  • a vibrator device 178 may be coupled to the analog signal processor 126.
  • FIG. 4 also shows that a power supply 188, for example a battery, is coupled to the on-chip system 102 via a power management integrated circuit ("PMIC") 180.
  • the power supply 188 includes a rechargeable DC battery or a DC power supply that is derived from an alternating current (“AC”) to DC transformer that is connected to an AC power source.
  • AC alternating current
  • the CPU 110 may also be coupled to one or more internal, on-chip thermal sensors
  • the on-chip thermal sensors 157 A, 157B may comprise one or more proportional to absolute temperature (“PTAT”) temperature sensors that are based on vertical PNP structure and are usually dedicated to complementary metal oxide semiconductor (“CMOS”) very large-scale integration (“VLSI”) circuits.
  • CMOS complementary metal oxide semiconductor
  • VLSI very large-scale integration
  • the off-chip thermal sensors 157C may comprise one or more thermistors.
  • the thermal sensors 157 may produce a voltage drop that is converted to digital signals with an analog-to-digital converter (“ADC”) controller 103 (See FIG. 5A).
  • ADC analog-to-digital converter
  • other types of thermal sensors 157 may be employed without departing from the scope of the invention.
  • thermal sensors 157 in addition to being controlled and monitored by an ADC
  • controller 103 may also be controlled and monitored by one or more TPM module(s)
  • the TPM module(s) 101, monitor module(s) 114 and/or MAM module(s) 207 may comprise software which is executed by the CPU 110. However, the TPM module(s) 101, monitor module(s) 114 and/or MAM module(s) 207 may also be formed from hardware and/or firmware without departing from the scope of the invention.
  • the TPM module(s) 101 may be responsible for monitoring and applying thermal policies that include one or more thermal mitigation techniques that may help a PCD 100 avoid critical temperatures while maintaining a high level of functionality.
  • the MAM module(s) 207 may be responsible for querying processor performance characteristics and, based on recognition of an operational mode, assigning blocks of code to processors most capable of efficiently processing the code.
  • the touch screen display 132, the video port 138, the USB port 142, the camera 148, the first stereo speaker 154, the second stereo speaker 156, the microphone 160, the FM antenna 164, the stereo headphones 166, the RF switch 170, the RF antenna 172, the keypad 174, the mono headset 176, the vibrator 178, thermal sensors 157C, PMIC 180 and the power supply 188 are external to the on-chip system
  • the monitor module 114 may also receive one or more indications or signals from one or more of these external devices by way of the analog signal processor 126 and the CPU 110 to aid in the real time management of the resources operable on the PCD 100.
  • one or more of the method steps described herein may be implemented by executable instructions and parameters stored in the memory 112 that form the one or more TPM module(s) 101 and and/or MAM module(s) 207. These instructions that form the TPM module(s) 101 and and/or MAM module(s) 207 may be executed by the CPU 110, the analog signal processor 126, the GPU 182, or another processor, in addition to the ADC controller 103 to perform the methods described herein. Further, the processors 110, 126, the memory 112, the instructions stored therein, or a combination thereof may serve as a means for performing one or more of the method steps described herein.
  • FIG. 5A is a functional block diagram illustrating an exemplary spatial arrangement of hardware for the chip 102 illustrated in FIG. 4.
  • the applications CPU 110 is positioned on the far left side region of the chip 102 while the modem CPU 168, 126 is positioned on a far right side region of the chip 102.
  • the applications CPU 110 may comprise a heterogeneous multi-core processor that includes a zeroth core 222, a first core 224, and an Nth core 230.
  • the applications CPU 110 may be executing a TPM module 101A and/or MAM module(s) 207 A (when embodied in software) or it may include a TPM module 101 A and/or MAM module(s) 207 A (when embodied in hardware).
  • the application CPU 110 is further illustrated to include operating system (“O/S”) module 208 and a monitor module 114.
  • O/S operating system
  • the applications CPU 110 may be coupled to one or more phase locked loops ("PLLs”) 209A, 209B, which are positioned adjacent to the applications CPU 110 and in the left side region of the chip 102. Adjacent to the PLLs 209A, 209B and below the applications CPU 110 may comprise an analog-to-digital (“ADC") controller 103 that may include its own thermal policy manager 10 IB and/or MAM module(s) 207B that works in conjunction with the main modules 101A, 207A of the applications CPU 110.
  • the thermal policy manager 101B of the ADC controller 103 may be responsible for monitoring and tracking multiple thermal sensors 157 that may be provided "on-chip” 102 and "off-chip” 102.
  • the on-chip or internal thermal sensors 157 A may be positioned at various locations.
  • a first internal thermal sensor 157A1 may be positioned in a top center region of the chip 102 between the applications CPU 110 and the modem CPU 168,126 and adjacent to internal memory 112.
  • a second internal thermal sensor 157A2 may be positioned below the modem CPU 168, 126 on a right side region of the chip 102. This second internal thermal sensor 157A2 may also be positioned between an advanced reduced instruction set computer ("RISC”) instruction set machine
  • RISC advanced reduced instruction set computer
  • ARM 177 and a first graphics processor 135A.
  • a digital-to-analog controller (“DAC”) 173 may be positioned between the second internal thermal sensor 157A2 and the modem CPU 168, 126.
  • a third internal thermal sensor 157 A3 may be positioned between a second graphics processor 135B and a third graphics processor 135C in a far right region of the chip
  • a fourth internal thermal sensor 157A4 may be positioned in a far right region of the chip 102 and beneath a fourth graphics processor 135D.
  • a fifth internal thermal sensor 157A5 may be positioned in a far left region of the chip 102 and adjacent to the PLLs 209 and ADC controller 103.
  • One or more external thermal sensors 157C may also be coupled to the ADC controller
  • the first external thermal sensor 157C1 may be positioned off-chip and adjacent to a top right quadrant of the chip 102 that may include the modem CPU 168, 126, the ARM 177, and DAC 173.
  • a second external thermal sensor 157C2 may be positioned off-chip and adjacent to a lower right quadrant of the chip 102 that may include the third and fourth graphics processors 135C, 135D.
  • FIG. 5A illustrates one exemplary spatial arrangement and how the main TPM and MAM modules 101 A, 207 A and ADC controller 103 with its TPM and MAM modules 10 IB, 207B may recognize thermal conditions that are a function of the exemplary spatial arrangement illustrated in FIG. 5A, determine an operational mode and allocate workloads to manage thermal conditions and/or meet performance goals associated with the operational mode.
  • FIG. 5B is a schematic diagram illustrating an exemplary software architecture 200 of the PCD 100 of FIG. 4 and FIG. 5 A for supporting mode-based workload reallocation. Any number of algorithms may form or be part of a mode-based workload reallocation methodology that may be applied by the MAM module 207 when certain mode-decision conditions in the PCD 100 are recognized.
  • the CPU or digital signal processor 110 is coupled to the memory 112 via a bus 211.
  • the CPU 110 is a multiple-core, heterogeneous processor having N core processors. That is, the CPU 110 includes a first core 222, a second core 224, and an ⁇ ⁇ core 230. As is known to one of ordinary skill in the art, each of the first core 222, the second core 224 and the N core 230 are available for supporting a dedicated application or program and, as part of a
  • heterogeneous core may exhibit different maximum processing frequencies and different IDDq current leakage levels.
  • one or more applications or programs can be distributed for processing across two or more of the available heterogeneous cores.
  • the CPU 110 may receive commands from the TPM module(s) 101 and/or MAM module(s) 207 that may comprise software and/or hardware. If embodied as software, the TPM module 101 and/or MAM module 207 comprises instructions that are executed by the CPU 110 that issues commands to other application programs being executed by the CPU 110 and other processors.
  • the first core 222, the second core 224 through to the Nth core 230 of the CPU 110 may be integrated on a single integrated circuit die, or they may be integrated or coupled on separate dies in a multiple-circuit package.
  • Designers may couple the first core 222, the second core 224 through to the ⁇ ⁇ core 230 via one or more shared caches and they may implement message or instruction passing via network topologies such as bus, ring, mesh and crossbar topologies.
  • Bus 211 may include multiple communication paths via one or more wired or wireless connections, as is known in the art.
  • the bus 211 may have additional elements, which are omitted for simplicity, such as controllers, buffers (caches), drivers, repeaters, and receivers, to enable communications. Further, the bus 211 may include address, control, and/or data connections to enable appropriate communications among the
  • startup logic 250 management logic 260
  • modal workload allocation interface logic 270 applications in application store 280 and portions of the file system 290 may be stored on any computer-readable medium for use by or in connection with any computer-related system or method.
  • a computer-readable medium is an electronic, magnetic, optical, or other physical device or means that can contain or store a computer program and data for use by or in connection with a computer-related system or method.
  • the various logic elements and data stores may be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device, such as a computer-based system, processor-containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions.
  • a "computer- readable medium" can be any means that can store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device.
  • the computer-readable medium can be, for example but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, device, or propagation medium. More specific examples (a non-exhaustive list) of the computer-readable medium would include the following: an electrical connection (electronic) having one or more wires, a portable computer diskette (magnetic), a random-access memory (RAM) (electronic), a read-only memory (ROM) (electronic), an erasable programmable read-only memory (EPROM, EEPROM, or Flash memory) (electronic), an optical fiber (optical), and a portable compact disc read-only memory (CDROM) (optical).
  • an electrical connection having one or more wires
  • a portable computer diskette magnetic
  • RAM random-access memory
  • ROM read-only memory
  • EPROM erasable programmable read-only memory
  • EPROM erasable programmable read-only memory
  • CDROM portable compact disc read-only memory
  • the computer-readable medium could even be paper or another suitable medium upon which the program is printed, as the program can be electronically captured, for instance via optical scanning of the paper or other medium, then compiled, interpreted or otherwise processed in a suitable manner if necessary, and then stored in a computer memory.
  • startup logic 250 management logic 260 and perhaps the modal workload allocation interface logic 270 are
  • the various logic may be implemented with any or a combination of the following technologies, which are each well known in the art: a discrete logic circuit(s) having logic gates for implementing logic functions upon data signals, an application specific integrated circuit (ASIC) having appropriate
  • PGA programmable gate array
  • FPGA field programmable gate array
  • the memory 112 is a non- volatile data storage device such as a flash memory or a solid- state memory device. Although depicted as a single device, the memory 112 may be a distributed memory device with separate data stores coupled to the digital signal processor 110 (or additional processor cores).
  • the startup logic 250 includes one or more executable instructions for selectively identifying, loading, and executing a select program for determining operational modes and selecting one or more of the available cores such as the first core 222, the second core 224 through to the ⁇ ⁇ core 230 for workload allocation based on the operational mode.
  • the management logic 260 includes one or more executable instructions for terminating a mode-based workload allocation program, as well as selectively identifying, loading, and executing a more suitable replacement programs.
  • the management logic 260 is arranged to perform these functions at run time or while the PCD 100 is powered and in use by an operator of the device.
  • a replacement program can be found in the program store 296 of the embedded file system 290.
  • the replacement program when executed by one or more of the core processors in the digital signal processor, may operate in accordance with one or more signals provided by the TPM module 101, MAM module 207 and monitor module 114.
  • the modules 114 may provide one or more indicators of events, processes, applications, resource status conditions, elapsed time, temperature, etc in response to control signals originating from the TPM 101 or MAM module 207.
  • the interface logic 270 includes one or more executable instructions for presenting, managing and interacting with external inputs to observe, configure, or otherwise update information stored in the embedded file system 290.
  • the interface logic 270 may operate in conjunction with manufacturer inputs received via the USB port 142. These inputs may include one or more programs to be deleted from or added to the program store 296. Alternatively, the inputs may include edits or changes to one or more of the programs in the program store 296. Moreover, the inputs may identify one or more changes to, or entire replacements of one or both of the startup logic 250 and the management logic 260. By way of example, the inputs may include a change to the management logic 260 that instructs the MAM module 207 to recognize an operational mode as a HPP mode when the video codec 134 is active.
  • the interface logic 270 enables a manufacturer to controllably configure and adjust an end user's experience under defined operating conditions on the PCD 100.
  • the memory 112 is a flash memory
  • one or more of the startup logic 250, the management logic 260, the interface logic 270, the application programs in the application store 280 or information in the embedded file system 290 can be edited, replaced, or otherwise modified.
  • the interface logic 270 may permit an end user or operator of the PCD 100 to search, locate, modify or replace the startup logic 250, the management logic 260, applications in the application store 280 and information in the embedded file system 290.
  • the operator may use the resulting interface to make changes that will be implemented upon the next startup of the PCD 100. Alternatively, the operator may use the resulting interface to make changes that are implemented during run time.
  • the embedded file system 290 includes a hierarchically arranged core characteristic data store 24.
  • the file system 290 may include a reserved section of its total file system capacity for the storage of information associated with the performance characteristics of the various cores 222, 224, 226, 228.
  • FIG. 6 is a logical flowchart illustrating an embodiment of a method 600 for mode- based workload reallocation across heterogeneous processing components in a PCD 100.
  • the performance characteristics of each individual processing component such as cores 222, 224, 226, 228, is characterized at block 605 and stored in CC data store 24.
  • the various processing components in a multi-core, heterogeneous SoC are unique their individual performance characteristics. That is, certain processing components may exhibit higher processing frequencies than other processing components within the same SoC. Moreover, certain other processing components may exhibit lower power leakage rates than other processing components.
  • a MAM module 207 running and
  • the cores may be ranked at block 610 and identified for their individual performance strengths. For instance, referring back to FIGs. 1 and 3, core 226 may be identified as the core with the fastest processing frequency, such as core 0 of FIG. 1. Similarly, core 222 may be identified as the core with the lowest leakage rate, such as core 3 of FIG. 1. In this way, each of the cores may be ranked relative to its peers in terms of performance characteristics.
  • the MAM module 207 in conjunction with the monitor module 114 tracks the active workload allocation across the heterogeneous cores 222, 224, 226, 228.
  • the monitor module 114 polls the various mode-decision conditions such as, but not limited to, the conditions outlined in FIG. 2. Based on the polling of the mode- decision conditions at block 620, the recognized conditions are reconciled by the monitor module 114 and/or the MAM module 207 based on priority. Subsequently, at decision block 630, the reconciled mode-decision conditions are leveraged to determine an operational mode for the PCD 110.
  • the operational mode may trigger the MAM module 207 to reallocate workloads across the heterogeneous cores 222, 224, 226, 228 at sub-routine 635.
  • the reallocation of workloads by the MAM module 207 is based on the rankings of performance characteristics determined at blocks 605 and 610. After workload reallocation, the process returns to block 615 and the active workload is monitored until a subsequent reallocation is necessitated by a change in the active workload or a change in the operational mode.
  • the mode-based workload reallocation sub-routine 635 begins after decision block 630. If decision block 630 determines that PCD 110 is in a high performance processing mode, then the "HPP" branch is followed. If, however, the decision block 630 determines that PCD 110 is in a power saving mode, then the "PS" branch is followed.
  • the sub-routine 635 moves to block 640.
  • the cores determined at blocks 605 and 610 to exhibit the highest processing frequency capabilities are identified. For example, briefly referring back to the FIG. 1 illustration, the rank order of the cores by highest processing frequency performance would be cores 0 and 1 followed by cores 2 and then 3.
  • the active workloads on the processing cores 222, 224, 226, 228 are reallocated per directions from the MAM module 207 such that the cores with the highest maximum processing frequencies are assigned the workload tasks. The process returns to block 615 of FIG. 6.
  • the sub-routine 635 moves to block 650.
  • the cores determined at blocks 605 and 610 to exhibit the lowest power leakage characteristics are identified. For example, briefly referring back to the FIG. 1 illustration, the rank order of the cores by lowest power leakage performance would be cores 3 and 1 followed by cores 2 and then 0.
  • the active workloads on the processing cores 222, 224, 226, 228 are reallocated per directions from the MAM module 207 such that the cores with the lowest power leakage are assigned the workload tasks. The process returns to block 615 of FIG. 6.
  • the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions may be stored on or transmitted as one or more instructions or code on a computer-readable medium.
  • Computer-readable media include both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another.
  • a storage media may be any available media that may be accessed by a computer.
  • such computer-readable media may comprise RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that may be used to carry or store desired program code in the form of instructions or data structures and that may be accessed by a computer.
  • any connection is properly termed a computer-readable medium.
  • the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, digital subscriber line ("DSL"), or wireless technologies such as infrared, radio, and microwave
  • coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium.
  • Disk and disc includes compact disc (“CD”), laser disc, optical disc, digital versatile disc (“DVD”), floppy disk and blu-ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers.
  • CD compact disc
  • DVD digital versatile disc
  • floppy disk floppy disk
  • blu-ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers.

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Abstract

Divers modes de réalisation de procédés et systèmes de réaffectation en fonction du mode de charges de travail dans un dispositif informatique portable (" PCD ") qui contient un système multi-processeur hétérogène sur une puce ("SoC"), sont divulgués. Du fait que les composants de traitement individuels dans un système multiprocesseur hétérogène SoC, peuvent présenter des puissances ou des capacités de rendement différentes, et que plus d'un des composants de traitement peut être capables de traiter un bloc de code donné, les systèmes et méthodologies de réaffectation en fonction du mode peuvent être exploités pour optimiser la qualité de service ("QoS") par l'affection de charges de travail en temps réel, ou pratiquement en temps réel, aux composants de traitement les plus aptes à traiter le bloc de code d'une manière qui satisfasse les objectifs de performance d'un mode de fonctionnement. Les modes opérationnels peuvent être déterminés par la reconnaissance d'une ou de plusieurs conditions de décision de mode dans le PCD.
EP13776616.8A 2012-10-23 2013-09-24 Ordonnancement modal de charges de travail dans un système multi-processeur hétérogène sur une puce Withdrawn EP2912534A1 (fr)

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US13/658,229 US8996902B2 (en) 2012-10-23 2012-10-23 Modal workload scheduling in a heterogeneous multi-processor system on a chip
PCT/US2013/061334 WO2014065970A1 (fr) 2012-10-23 2013-09-24 Ordonnancement modal de charges de travail dans un système multi-processeur hétérogène sur une puce

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MA38014B1 (fr) 2016-09-30
ECSP15020377A (es) 2015-12-31
SA515360318B1 (ar) 2016-10-31
US8996902B2 (en) 2015-03-31
MA38014A1 (fr) 2016-01-29
CN104737094B (zh) 2017-04-05
WO2014065970A1 (fr) 2014-05-01
US20140115363A1 (en) 2014-04-24
AP2015008392A0 (en) 2015-04-30
CN104737094A (zh) 2015-06-24

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