EP2896873A1 - Lampe - Google Patents

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Publication number
EP2896873A1
EP2896873A1 EP14183423.4A EP14183423A EP2896873A1 EP 2896873 A1 EP2896873 A1 EP 2896873A1 EP 14183423 A EP14183423 A EP 14183423A EP 2896873 A1 EP2896873 A1 EP 2896873A1
Authority
EP
European Patent Office
Prior art keywords
board
end side
hole
lamp
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14183423.4A
Other languages
German (de)
English (en)
Inventor
Takeshi Hisayasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
Toshiba Lighting and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Publication of EP2896873A1 publication Critical patent/EP2896873A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
    • F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • Exemplary embodiments described herein relate generally to a lamp.
  • a lamp that makes use of light emission of a semiconductor such as a light-emitting diode is used for, for example, lighting and display.
  • the lamp includes semiconductor light-emitting elements, a lighting circuit that supplies electric power to the semiconductor light-emitting elements, and a member that houses the semiconductor light-emitting elements and the lighting circuit.
  • the lamp of this type has long life compared with a lamp such as a bulb in the past.
  • the lamp sometimes reaches the end of the life when the lighting circuit reaches the end of the life earlier than the semiconductor light-emitting elements.
  • the life of the lighting circuit depends on the temperature of a circuit member of the lighting circuit during lighting. Therefore, it is desired that the temperature of the lighting circuit during the lighting is low.
  • an embodiment provides a lamp capable of reducing the temperature of a lighting circuit.
  • the lamp in the embodiment includes: a hollow case opened on one end side; a board having a through-hole in the center and provided on the one end side of the case; a plurality of semiconductor light-emitting elements provided on one end side of the board and in a circumferential shape to extend along the through-hole; a lighting circuit including a circuit board and circuit components including a heat generating component mounted on the circuit board, the lighting circuit being provided inside the case such that the heat generating component is located in an area of the through-hole when the case is viewed from the one end side; and a power-supply section provided on the other end side of the case.
  • a first embodiment is explained with reference to FIG. 1 to FIGS. 3A and 3B .
  • FIG. 1 is a diagram for explaining a lamp in the first embodiment.
  • FIG. 2 is a diagram for explaining the external appearance of the lamp.
  • FIGS. 3A and 3B are diagrams for explaining a state in which the lamp is viewed from one end side of a case.
  • the lamp in this embodiment is an LED lamp used for lighting and display.
  • the lamp includes a thermal radiator 1, a thermal radiation plate 2, a board 3 (substrate), LEDs 4, a globe 5, a resin case 6 (an insulating case), a lighting circuit 7, a cap 81, and an insulating ring 82.
  • a direction in which the globe 5 is located viewed from the cap 81 is referred to as one end side and a direction in which the cap 81 is located viewed from the globe 5 is referred to as the other end side.
  • the thermal radiator 1 is a hollow case made of a material excellent in heat conductivity such as aluminum, ceramics, or resin and having an opening on the one end side.
  • a flat board attaching section 11 is formed around the opening on the one end side of the thermal radiator 1.
  • a peripheral wall 12 projecting in one end direction is formed around the board attaching section 11.
  • a ring-like projecting wall 13 projecting in an inner space direction is formed on the peripheral wall 12.
  • a ring-like groove 14 is formed between the projecting wall 13 and the board attaching section 11.
  • four cutouts 15 are formed at 90-degree intervals. The cutouts 15 are connected to the ring-like groove 14.
  • boss sections 16 projecting in the center direction from the inner wall of the thermal radiator 1 are formed at 120-degree intervals.
  • the boss sections 16 and a surface on the one end side of the board attaching section 11 are formed in a same plane. Screw holes 17 are formed on the one end side of the boss sections 11.
  • the thermal radiation plate 2 is a thin plate made of a material excellent in heat conductivity such as aluminum.
  • a through-hole is formed in the center of the thermal radiation plate 2.
  • four projecting sections 21 projecting in the center direction are formed at 90-degree intervals. Screw holes (not shown in the figure) are formed in the projecting sections 21.
  • screw holes are formed in outer positions corresponding to the screw holes 17 of the thermal radiator 1.
  • the thermal radiation plate 2 is heat-conductively attached to the board attaching section 11 by screwing screws 22 into the screw holes.
  • the board 3 is a thin plate made of a material excellent in heat conductivity such as aluminum or ceramics.
  • a through-hole is formed in the center of the board 3.
  • four projecting sections 31 projecting in the center direction are formed at 90-degree intervals like the projecting sections 21 of the thermal radiation plate 2.
  • cutouts (not shown in the figure) for inserting screws are formed to correspond to the screw holes of the projecting sections 21 of the thermal radiation plate 2.
  • the board 3 is heat-conductively attached to the thermal radiation plate 2 by screwing screws 32 into the cutouts and the screw holes.
  • a connector receiving section 33 is provided on the one end side of the board 3.
  • the through-holes of the board 3 and the thermal radiation plate 2 are, for example, the same diameter and are communicate with the thermal radiator 1, which is the hollow case.
  • the LED 4 is a semiconductor light-emitting element called light-emitting diode.
  • the LED 4 is a light-emitting diode formed by mounting a light-emitting chip, which emits blue light, in a package of resin or the like and covering the light-emitting chip with a yellow phosphor layer.
  • twenty-seven LEDs 4 are mounted in a circumferential shape along the through-hole at substantially equal intervals on the one end side of the board 3.
  • the board 3, LEDs 4, wires (not shown) and connector receiving section 33 constitutes a light-emitting module.
  • the globe 5 is a transparent or milky-white translucent cover mainly made of polycarbonate.
  • the globe 5 has a spherical shape and is joined in a maximum diameter section thereof. Specifically, a semispherical top section 51 and a diameter-expanded base section 52 are integrated by ultrasonic welding.
  • a semispherical top section 51 and a diameter-expanded base section 52 are integrated by ultrasonic welding.
  • four protrusions 53 having width slightly smaller than the cutouts 15 of the thermal radiator 1 are formed at 90-degree intervals.
  • the insulating case 6 is a case made of a material excellent in electric insulation and having heat conductivity lower than heat conductivity of metal such as polybutylene terephthalate.
  • the insulating case 6 includes a main body section 61 and a projecting section 62.
  • the main body section 61 includes three concave sections 63 on the inner space side thereof at 120-degree intervals.
  • the concave sections 63 correspond to the boss sections 16. That is, the concave sections 63 fit in the boss sections 16, whereby the main body section 61 is arranged in the inner space of the thermal radiator 1.
  • opposed walls 64 are formed in the inner space side thereof. A pair of opposed walls 64 is formed.
  • a line connecting spaces between the opposed walls 64 deviates from the center of the main body section 61.
  • the projecting section 62 is formed on the other end side of the main body section 61 and arranged to project to the outside from the opening on the other end side of the thermal radiator 1.
  • a spiral protrusion 65 is formed in an outer surface portion projecting from the thermal radiator 1.
  • the lighting circuit 7 is a circuit for supplying desired electric power to the light-emitting module of the LEDs 4 and is housed on the inside of the insulating case 6.
  • the lighting circuit 7 includes a circuit board 71 in which a predetermined metal wire is provided on a board having electric insulation such as epoxy, circuit components 72 mounted on the circuit board 71, and a connector 73 connected to the connector receiving section 33.
  • the circuit components 72 include a heat generating component 721 such as a switching element such as a transformer or an FET and a non-heat generating component 722 such as a capacitor that generates relatively little heat compared with the heat generating component 721.
  • the circuit board 71 is held by the pair of opposed walls 64 of the insulating case 6, whereby the lighting circuit 7 is arranged on the inside of the insulating case 6 such that a surface thereof on which the circuit components 72 are mounted extends along a lamp axis.
  • the heat generating component 721 is located in the area of the through-hole of the board 3 when the thermal radiator 1 is viewed from the one end side.
  • the cap 81 is a power-supply section mounted on a socket of a device.
  • the cap 81 is provided at the other end of the lamp and electrically connected to the lighting circuit 7.
  • the cap 81 includes a spiral section, which is a spiral metal portion formed on the side surface of the cap 81, an eyelet, which is a metal portion formed on the bottom surface of the cap 81, and an insulating section (not shown in the figure), which is a portion provided between the spiral section and the eyelet and electrically insulating the spiral section and the eyelet from each other.
  • the insulating ring 82 is a ring-like member made of a member having insulation.
  • the insulating ring 82 is provided in the outer circumferential section of the projecting section 62 of the insulating case 6 to be located between the thermal radiator 1 and the cap 81.
  • the alternating-current power when alternating-current power is supplied to the cap 81 by an external power supply, the alternating-current power is rectified and DC-DC converted by the lighting circuit 7.
  • Direct-current power is supplied to the LEDs 4.
  • the LEDs 4 are lit by the supply of the direct-current power. According to the lighting, the LEDs 4 and the lighting circuit 7 generate heat.
  • the heat generated by the LEDs 4 is conducted to the thermal radiator 1 via the board 3 and the thermal radiation plate 2 and radiated. However, since the through-holes are provided in the centers of the thermal radiation plate 2 and the board 3, the heat is conducted only in the outer side direction and is not conducted in the center direction.
  • the heat generating component 721 of the lighting circuit 7 is located in the area of the through-hole of the board 3 when the thermal radiator 1 is viewed from the one end side, the heat of the LEDs 4 is not conducted to the heat generating component 721 via the board 3 and the heat radiation plate 2. A temperature rise of the heat generating component 721 can be suppressed. Further, since the temperature in the space in the globe 5 is relatively low even during the lighting, the heat generating component 721 can be cooled via the through-holes. Therefore, the temperature of the lighting circuit 7 during the lighting drops and the life of the lighting circuit 7 can be extended.
  • FIGS. 4A to 4C are diagrams for explaining a difference between the temperature of the lighting circuit of the lamp in the embodiment and the temperature of a lighting circuit of a lamp in the past.
  • FIG. 4A is a lamp in the past (a past example 1) in which the board 3 mounted with the LEDs 4 is arranged in the center of the thermal radiation plate 2 without a through-hole.
  • FIG. 4B is a lamp in the past (a past example 2) in which the board 3 mounted with the LEDs 4 in a circumferential shape is arranged on the thermal radiation plate 2 without a through-hole.
  • FIG. 4C is a lamp (an example) in this embodiment.
  • the temperature of the lighting circuit 7 during the lighting is indicated by the density of dots. Higher density means higher temperature.
  • the width W of the circuit board 71 is 45.6 mm.
  • the size L of the through-hole of the board 3 in FIG. 4C is 43 mm.
  • the temperature of the lighting circuit 7 during the lighting is generally low.
  • the temperature at an LED side point A on the lighting circuit 7 was -0.5°C in the past example 2 and was not greatly different from the temperature in the lamp of the past example 1.
  • the temperature at a cap side point B on the lighting circuit 7 was -0.2°C in the past example 2 and was not greatly different from the temperature in the lamp of the past example 1.
  • a temperature difference of the lighting circuit 7 when size L of the through-holes of the thermal radiation plate 2 and the board 3 and width W of the circuit board 71 are changed is explained with reference to FIG. 5 .
  • the temperature difference is the difference as compared with the temperatures at points A and B in the lamp shown in FIG. 4B in which through-holes are not formed in the thermal radiation plate 2 and the board 3.
  • L/W is desirably equal to or smaller than 1.4.
  • the through-hole is formed in the center of the board 3.
  • the plurality of semiconductor light-emitting elements are provided on the one end side of the board 3 and in the circumferential shape to extend along the through-hole, namely, in the circumferential shape around the through-hole.
  • the lighting circuit 7 including the circuit board 71 and the circuit components 72 including the heat generating component 721 mounted on the circuit board 71 is provided inside the thermal radiator 1 such that the heat generating component 721 is located in the area of the through-hole when the thermal radiator 1 is viewed from the one end side. Consequently, it is possible to suppress a temperature rise of the lighting circuit 7, in particular, the heat generating component 721.
  • the effect can be further improved by setting L/W to be equal to or larger than 0.6. Note that this effect can also be obtained if the thermal radiation plate 2 having the same through-hole is interposed between the thermal radiator 1 and the board 3 or the thermal radiation plate 2 is omitted and the board 3 is directly attached to the board attaching section 11 of the thermal radiator 1 by screws or the like.
  • FIG. 6 is a diagram for explaining a lamp in a second embodiment of the present invention.
  • Components in the second embodiment same as the components in the first embodiment are denoted by the same reference numerals and signs and explanation of the components is omitted.
  • a cover member 9 is provided in the through-hole of the board 3.
  • the cover member 9 is a member made of resin having heat conductivity lower than the heat conductivity of the thermal radiation plate 2 and the board 3, for example, heat conductivity equal to or lower than 0.5 W/mK.
  • the cover member 9 desirably has high reflectivity. Consequently, whereas a loss of light could occur if the thermal radiation plate 2 and the board 3 are hollow, it is possible to reflect the light on the cover member 9 and improve efficiency of use of the light. Further, it is possible to suppress, even if the lamp is used with the cap 81 faced up, foreign matters from dropping to the globe 5 from the lighting circuit 7 portion to hinder light emission.
  • the cover member 9 includes attaching sections 91 and a convex section 92.
  • the attaching sections 91 are portions including screw holes and screwed by the screws 32 together with the screw holes of the projecting sections 21 of the thermal radiation plate 2 and the projecting sections 31 of the board 3.
  • the convex section 92 is a portion projecting in the direction of the cap 81 from the attaching sections 91.
  • a flat portion, which is the bottom of the convex section 92, is located near the one end side of the lighting circuit 7 through the through-holes of the thermal radiation plate 2 and the board 3. In this shape, since a relatively low-temperature atmosphere in the globe 5 is easily conducted to the lighting circuit 7 by the convex section 92. Therefore, as in the first embodiment, it is possible to suppress a temperature rise of the lighting circuit 7.
  • FIGS. 7A to 7C are diagrams for explaining a temperature change of the lighting circuit when the shape of the cover member 9 is changed in the lamp in the second embodiment.
  • the cover member 9 having a flat shape is used.
  • the cover member 9 projecting in the direction of the globe 5 is used.
  • the cover member 9 projecting in the direction of the cap 81 is used.
  • the temperature of the lighting circuit decreases compared with FIGS. 7A and 7B .
  • the temperature at an LED side point A on the lighting circuit 7 was +5°C in FIG. 7A , +4.7°C in FIG. 7B , and +1.8°C in FIG. 7C and the temperature at a cap side point B was +2.7°C in FIG. 7A , +2.7°C in FIG. 7B , and +1.7°C in FIG. 7C . That is, with the shape shown in FIG. 7C , it is possible to suppress a temperature rise of the lighting circuit 7 to the same degree as in the first embodiment.
  • a distance D between the convex section 92 and the circuit board 71 is set to be equal to or smaller than 3 mm and, optimally, set to allow the convex section 92 and the circuit board 71 to come into contact with each other, it is possible to reduce the temperature of the lighting circuit 7.
  • the cover member 9 for example, polycarbonate having thickness of 1 mm was used.
  • the cover member 9 since the cover member 9 is provided in the through-hole of the board 3, it is possible to improve efficiency of use of light. Further, it is possible to suppress adhesion of foreign matters to the globe 5. It is desirable the cover member 9 has heat conductivity lower than the board 3 and/or thermal radiation plate 2.
  • the convex section 92 is provided in the cover member 9.
  • the convex section 92 is projected in the direction of the cap 81 and located near the lighting circuit 7. Therefore, in addition to the effects explained above, it is possible to suppress a temperature rise of the lighting circuit 7 to the same degree as in the first embodiment. It is possible to further suppress the temperature rise by setting the distance D between the convex section 92 and the circuit board 71 to be equal to or smaller than 3 mm.
  • the shape of the through-holes of the board 3 and the thermal radiation plate 2 is not limited to a circular shape and may be a polygonal shape.
  • Silicone resin may be filled in all or a part of the inside of the insulating case 6 in which the lighting circuit 7 is arranged. Consequently, it is possible to further suppress the temperature rise of the lighting circuit 7. As shown in FIG. 8 , silicone resin 74 is filled on the inside of the projecting section 62 of the insulating case 6. Consequently, it is possible to expect a temperature reduction effect of about 5°C compared with a temperature reduction effect attained when the silicone resin is not filled.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP14183423.4A 2014-01-17 2014-09-03 Lampe Withdrawn EP2896873A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014006376A JP2015135744A (ja) 2014-01-17 2014-01-17 ランプ

Publications (1)

Publication Number Publication Date
EP2896873A1 true EP2896873A1 (fr) 2015-07-22

Family

ID=51453692

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14183423.4A Withdrawn EP2896873A1 (fr) 2014-01-17 2014-09-03 Lampe

Country Status (3)

Country Link
EP (1) EP2896873A1 (fr)
JP (1) JP2015135744A (fr)
CN (1) CN204227114U (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120025706A1 (en) * 2010-07-27 2012-02-02 Cirocomm Technology Corp. Led lamp with replaceable light unit
DE102011005597A1 (de) * 2011-03-16 2012-09-20 Osram Ag Leuchtvorrichtung
US8282250B1 (en) * 2011-06-09 2012-10-09 Elumigen Llc Solid state lighting device using heat channels in a housing
US20120287632A1 (en) * 2011-01-25 2012-11-15 Kenji Takahashi Lamp light source

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120025706A1 (en) * 2010-07-27 2012-02-02 Cirocomm Technology Corp. Led lamp with replaceable light unit
US20120287632A1 (en) * 2011-01-25 2012-11-15 Kenji Takahashi Lamp light source
DE102011005597A1 (de) * 2011-03-16 2012-09-20 Osram Ag Leuchtvorrichtung
US8282250B1 (en) * 2011-06-09 2012-10-09 Elumigen Llc Solid state lighting device using heat channels in a housing

Also Published As

Publication number Publication date
CN204227114U (zh) 2015-03-25
JP2015135744A (ja) 2015-07-27

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